Sealing resin sheet

Abstract

The sealing resin sheet is a sheet containing a thermosetting resin and used to seal a device. The sealing resin sheet further contains a layered silicate compound.

Description

Technical Field

[0001] The present invention relates to a sealing resin sheet, and more particularly, to a sealing resin sheet for sealing a device. Background Art

[0002] Conventionally, it is known to use a sealing sheet containing a thermosetting resin to seal semiconductor elements and electronic components mounted on a substrate by pressing, and then thermally cure the thermosetting resin to form a cured product from the sealing sheet (for example, see Patent Document 1 below).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-162909 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In recent years, as electronic devices have become more functional, the semiconductor elements and electronic components they have are also required to be miniaturized. Along with this, the resin (cured body) that protects the semiconductor elements and electronic components is also required to improve the dimensional accuracy during curing. Specifically, there is a demand to further reduce the amount of solidified body that enters from the side edge of the semiconductor element or electronic component into the space between the semiconductor element, electronic component and the substrate.

[0008] The present invention provides a sealing resin sheet capable of reducing the amount of a cured product entering between an element such as a semiconductor element or an electronic component and a substrate.

[0009] Means for solving problems

[0010] The present invention (1) includes a sealing resin sheet which contains a thermosetting resin and is used for sealing a device, and further contains a layered silicate compound.

[0011] The present invention (2) comprises the sealing resin sheet according to (1), wherein the layered silicate compound is smectite.

[0012] The present invention (3) comprises the sealing resin sheet according to (1) or (2), wherein the surface of the layered silicate compound is modified with an organic component.

[0013] The present invention (4) includes the sealing resin sheet according to any one of (1) to (3), further comprising 50% by mass or more and 90% by mass or less of an inorganic filler other than the layered silicate compound.

[0014] The present invention (5) includes the sealing resin sheet according to any one of (1) to (4), wherein the content of the layered silicate compound is 3% by mass or more and 10% by mass or less.

[0015] Effects of the Invention

[0016] The sealing resin sheet of the present invention contains a layered silicate compound. Therefore, when the sealing resin sheet is placed on a device and heated to form a cured body, the amount of the cured body penetrating between the device and the substrate can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] exist Figure 1 middle, Figure 1 A~ Figure 1 D is a cross-sectional view of a process of manufacturing an electronic component package by sealing a plurality of electronic components using one embodiment of the sealing resin sheet of the present invention, Figure 1 A is a step of preparing a sealing resin sheet. Figure 1 B is the process of preparing electronic components. Figure 1 C is a step of pressing the sealing resin sheet to form a sealing body, Figure 1 D is a step of heating the sealed body to form a solidified body.

[0018] exist Figure 2 middle, Figure 2 A~ Figure 2 D is to use Figure 1 A cross-sectional view of a process of manufacturing an electronic component package by sealing a plurality of electronic components with a sealing multilayer resin sheet including a sealing resin sheet A and a second sealing resin sheet, Figure 2 A is a process of preparing a multilayer resin sheet for sealing. Figure 2 B is the process of preparing electronic components. Figure 2 C is a step of pressing the sealing multilayer resin sheet to form a sealing body, Figure 2 D is a step of heating the sealed body to form a solidified body.

[0019] exist Figure 3 middle, Figure 3 A~ Figure 3 D is the method for measuring the solidified body penetration length Y in the embodiment. Figure 3 A is a step of preparing a multilayer resin sheet for sealing (step A), Figure 3 B is a process (step B) of preparing electronic components (dummy components), Figure 3 C is a step of pressing the sealing multilayer resin sheet to form a sealed body (step C). Figure 3 D is a step of heating the sealed body to form a cured body (step D). DETAILED DESCRIPTION

[0020] One embodiment of the sealing resin sheet of the present invention will be described.

[0021] The sealing resin sheet is a resin sheet for sealing an element, and has a substantially plate shape (film shape) extending in a plane direction perpendicular to the thickness direction.

[0022] The material of the sealing resin sheet contains a thermosetting resin and further contains a layered silicate compound. Specifically, the material of the sealing resin sheet is a thermosetting resin composition containing a thermosetting resin and a layered silicate compound.

[0023] Examples of the thermosetting resin include epoxy resins, silicone resins, urethane resins, polyimide resins, urea resins, melamine resins, and unsaturated polyester resins, etc. These may be used alone or in combination of two or more.

[0024] As the thermosetting resin, epoxy resin is preferably used. It should be noted that the epoxy resin is prepared as an epoxy resin composition containing a main agent, a curing agent and a curing accelerator.

[0025] As the main agent, for example, bifunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol A type epoxy resin, modified bisphenol F type epoxy resin, biphenyl type epoxy resin, for example, polyfunctional epoxy resins such as phenol novolac type epoxy resin, cresol novolac type epoxy resin, trihydroxyphenylmethane type epoxy resin, tetraphenol ethane type epoxy resin, dicyclopentadiene type epoxy resin, etc. can be enumerated. These main agents can be used alone or in combination of two or more. As the main agent, preferably bifunctional epoxy resins are enumerated, and more preferably bisphenol F type epoxy resins are enumerated.

[0026] The lower limit of the epoxy equivalent of the main agent is, for example, 10 g / eq., preferably 100 g / eq. The upper limit of the epoxy equivalent of the main agent is, for example, 300 g / eq., preferably 250 g / eq.

[0027] The lower limit of the softening point of the main agent is, for example, 50°C, preferably 70°C, more preferably 72°C, and further preferably 75°C. The upper limit of the softening point of the main agent is, for example, 130°C, preferably 110°C, and more preferably 90°C.

[0028] If the softening point of the main agent is above the above lower limit, Figure 1 In the step shown in C, the sealing resin sheet 1 can flow. Therefore, the Figure 1 The time of the process shown in C and the Figure 1 In the step shown in C, one surface of the sealing resin sheet 1 in the thickness direction is flat.

[0029] The lower limit of the ratio of the main agent in the thermosetting resin composition is, for example, 1% by mass, preferably 2% by mass. The upper limit of the ratio of the main agent in the thermosetting resin composition is, for example, 30% by mass, preferably 15% by mass. The lower limit of the ratio of the main agent in the epoxy resin composition is, for example, 30% by mass, preferably 50% by mass. The upper limit of the ratio of the main agent in the epoxy resin composition is, for example, 80% by mass, preferably 70% by mass.

[0030] The curing agent is a latent curing agent that cures the above-mentioned main agent by heating. As the curing agent, for example, phenolic resins such as phenol linear phenolic resins can be cited. If the curing agent is a phenolic resin, the cured bodies of the phenolic resin and the main agent all have high heat resistance and high chemical resistance. Therefore, the sealing reliability of the cured body is excellent.

[0031] The ratio of the curing agent is set so as to become the following equivalent ratio. Specifically, relative to 1 equivalent of the epoxy group in the main agent, the lower limit of the total of the hydroxyl groups in the phenolic resin is, for example, 0.7 equivalents, preferably 0.9 equivalents. Relative to 1 equivalent of the epoxy group in the main agent, the upper limit of the total of the hydroxyl groups in the phenolic resin is, for example, 1.5 equivalents, preferably 1.2 equivalents. Specifically, relative to 100 parts by mass of the main agent, the lower limit of the number of parts contained in the curing agent is, for example, 20 parts by mass, preferably 40 parts by mass. Relative to 100 parts by mass of the main agent, the upper limit of the number of parts contained in the curing agent is, for example, 80 parts by mass, preferably 60 parts by mass.

[0032] The curing accelerator is a catalyst (thermosetting catalyst) that promotes the curing of the main agent by heating. As the curing accelerator, for example, organic phosphorus compounds, imidazole compounds such as 2-phenyl-4,5-dihydroxymethylimidazole (2PHZ-PW) and the like can be cited. Preferably, imidazole compounds are cited. Relative to 100 parts by mass of the main agent, the lower limit of the number of parts of the curing accelerator is, for example, 0.05 parts by mass. Relative to 100 parts by mass of the main agent, the upper limit of the number of parts of the curing accelerator is, for example, 5 parts by mass.

[0033] The lower limit of the content of the thermosetting resin in the thermosetting resin composition (sealing resin sheet) is, for example, 5% by mass, preferably 15% by mass, more preferably 17% by mass, and further preferably 18% by mass. The upper limit of the content of the thermosetting resin in the thermosetting resin composition (sealing resin sheet) is, for example, 30% by mass, preferably 25% by mass, and more preferably 20% by mass.

[0034] The layered silicate compound is dispersed in the thermosetting resin (matrix) in the thermosetting resin composition (sealing resin sheet). In addition, the layered silicate compound is a flow regulator when forming a sealed body and a cured body (described later) from the sealing resin sheet. Specifically, it is a curing flow reducer that reduces the fluidity of the cured body when the sealing resin sheet is heated to form a cured body.

[0035] The layered silicate compound is, for example, a silicate having a structure (three-dimensional structure) in which layers extending two-dimensionally (in the plane direction) overlap in the thickness direction, and is called phyllosilicate.

[0036] Specifically, examples of the layered silicate compound include montmorillonite, beidellite, nontronite, saponite, hectorite, sauconite, stevensite and other smectites, kaolinite, halloysite, talc, mica, etc. As the layered silicate compound, from the viewpoint of improving the miscibility with the thermosetting resin, preferably montmorillonite is used, and more preferably montmorillonite is used.

[0037] The layered silicate compound may be an unmodified compound whose surface is not modified, or a modified compound whose surface is modified by an organic component. From the viewpoint of obtaining excellent affinity with the thermosetting resin, it is preferred that the surface of the layered silicate compound is modified by an organic component. Specifically, as the layered silicate compound, an organic montmorillonite whose surface is modified by an organic component can be cited, and an organic bentonite whose surface is modified by an organic component is further preferred.

[0038] Examples of the organic component include organic cations (onium ions) such as ammonium, imidazolium, pyridinium, and phosphonium.

[0039] Examples of ammonium include dimethyl distearyl ammonium, distearyl ammonium, octadecyl ammonium, hexyl ammonium, octylammonium, 2-hexyl ammonium, dodecyl ammonium, trioctylammonium, etc. Examples of imidazolium include methyl stearyl imidazolium, distearyl imidazolium, methyl hexyl imidazolium, dihexyl imidazolium, methyl octylimidazolium, dioctylimidazolium, methyl dodecyl imidazolium, didodecyl imidazolium, etc. Examples of pyridinium include stearyl pyridinium, hexyl pyridinium, octyl pyridinium, dodecyl pyridinium, etc. Examples of phosphonium include dimethyl distearyl phosphonium, distearyl phosphonium, octadecyl phosphonium, hexyl phosphonium, octyl phosphonium, 2-hexyl phosphonium, dodecyl phosphonium, trioctyl phosphonium, etc. The organic cation may be used alone or in combination of two or more. Preferably, ammonium is used, and more preferably, dimethyl distearyl ammonium is used.

[0040] As the organized layered silicate compound, preferably, an organized smectite whose surface is modified with ammonium is used, and more preferably, an organized bentonite whose surface is modified with dimethyldistearylammonium is used.

[0041] The lower limit of the average particle size of the layered silicate compound is, for example, 1 nm, preferably 5 nm, and more preferably 10 nm. The upper limit of the average particle size of the layered silicate compound is, for example, 100 μm, preferably 50 μm, and more preferably 10 μm. It should be noted that the average particle size of the layered silicate compound is obtained, for example, in the form of a D50 value (cumulative 50% median particle size) based on a particle size distribution obtained by a particle size distribution measurement method in a laser scattering method.

[0042] As the layered silicate compound, a commercially available product can be used. For example, as a commercially available product of an organized bentonite, the S-BEN series (manufactured by HOJUN CORPORATION) can be used.

[0043] The lower limit of the content ratio of the layered silicate compound in the thermosetting resin composition (sealing resin sheet) is, for example, 0.1% by mass, preferably 1% by mass, more preferably 2% by mass, further preferably 3% by mass, and particularly preferably 4% by mass. The upper limit of the content ratio of the layered silicate compound in the thermosetting resin composition (sealing resin sheet) is, for example, 25% by mass, preferably 10% by mass, more preferably 9% by mass, further preferably 7% by mass, and particularly preferably 6% by mass.

[0044] When the content ratio of the layered silicate compound is equal to or less than the upper limit, the layered silicate compound can be sufficiently dispersed in the sealing resin sheet, and a sealing resin sheet having uniform fluidity can be produced.

[0045] In addition, the thermosetting resin composition may further contain an inorganic filler other than the layered silicate compound.

[0046] As the inorganic filler, for example, silicate compounds other than layered silicate compounds such as orthosilicate, sorosilicate, inosilicate, for example, silicon compounds (silicic acid), silicon dioxide (silicic anhydride), silicon nitride, etc. (silicon compounds other than layered silicate compounds) and the like can be cited. In addition, as the inorganic filler, for example, aluminum oxide, aluminum nitride, boron nitride and the like can also be cited. These can be used alone or in combination of two or more. Preferably, silicon compounds other than layered silicate compounds are cited, and more preferably, silicon dioxide is cited.

[0047] The shape of the inorganic filler is not particularly limited, and examples thereof include a substantially spherical shape, a substantially plate shape, a substantially needle shape, and an irregular shape. Preferably, a substantially spherical shape is used.

[0048] The upper limit of the average value of the maximum length of the inorganic filler (if it is a roughly spherical shape, it is the average particle size. The same below.) is, for example, 50 μm, preferably 20 μm, and more preferably 10 μm. The lower limit of the average value of the maximum length of the inorganic filler is, for example, 0.1 μm, preferably 0.5 μm. It should be noted that the average particle size of the inorganic filler is, for example, based on the particle size distribution obtained by the particle size distribution measurement method in the laser scattering method, and is obtained in the form of D50 value (cumulative 50% median particle size).

[0049] Furthermore, the inorganic filler may include a first filler and a second filler having an average value of the maximum length smaller than the average value of the maximum length of the first filler.

[0050] The lower limit of the average value of the maximum length of the first filler is, for example, 1 μm, or preferably 3 μm. The upper limit of the average value of the maximum length of the first filler is, for example, 50 μm, or preferably 30 μm.

[0051] The upper limit of the average value of the maximum length of the second filler is, for example, 0.9 μm, or preferably 0.8 μm. The lower limit of the average value of the maximum length of the second filler is, for example, 0.01 μm, or preferably 0.1 μm.

[0052] The lower limit of the ratio of the average value of the maximum length of the first filler to the average value of the maximum length of the second filler is, for example, 2, preferably 5. The upper limit of the ratio of the average value of the maximum length of the first filler to the average value of the maximum length of the second filler is, for example, 50, preferably 20.

[0053] The materials of the first filler and the second filler may be the same or different.

[0054] Furthermore, the surface of the inorganic filler may be partially or entirely surface-treated with a silane coupling agent or the like.

[0055] The lower limit of the content ratio of the inorganic filler in the thermosetting resin composition (sealing resin sheet) is, for example, 50% by mass, preferably 55% by mass, more preferably 60% by mass, and further preferably 65% ​​by mass. The upper limit of the content ratio of the inorganic filler in the thermosetting resin composition (sealing resin sheet) is, for example, 90% by mass, preferably 85% by mass, more preferably 80% by mass, and further preferably 75% by mass.

[0056] If the content ratio of the inorganic filler is above the above lower limit, the linear expansion coefficient of the thermosetting resin composition is improved (reduced), and the reliability of the element can be ensured. In addition, if the content ratio of the inorganic filler is below the above upper limit, the thermosetting resin composition can be inhibited from becoming hard and brittle, and the operability can be inhibited from being reduced.

[0057] In particular, in this embodiment, when the content ratio of the inorganic filler in the thermosetting resin composition (sealing resin sheet) is in a high range of, for example, 50 mass % to 90 mass %, the content ratio of the layered silicate compound in the thermosetting resin composition (sealing resin sheet) is in a low range of, for example, 3 mass % to 6 mass %.

[0058] That is, in this embodiment, even if the content ratio of the inorganic filler is high and the content ratio of the layered silicate compound is low in the thermosetting resin composition (sealing resin sheet), when the sealed body is heated to form a cured body, the fluidity of the cured body can be effectively reduced. Thus, the amount of the cured body entering between the element and the substrate can be reduced.

[0059] If the content ratio and / or the number of parts of the inorganic filler is greater than the above lower limit, Figure 1 The sealing resin sheet 1 in the step shown in C can flow.

[0060] It should be noted that, relative to 100 parts by mass of the inorganic filler, the lower limit of the number of parts of the layered silicate compound contained is, for example, 1 part by mass, preferably 2 parts by mass, more preferably 3 parts by mass, and further preferably 5 parts by mass. Relative to 100 parts by mass of the inorganic filler, the upper limit of the number of parts of the layered silicate compound contained is, for example, 25 parts by mass, preferably 20 parts by mass, more preferably 15 parts by mass, and further preferably 10 parts by mass.

[0061] In the case where the inorganic filler includes the first filler and the second filler, the lower limit of the proportion of the first filler in the thermosetting resin composition (resin sheet for sealing) is, for example, 30% by mass, preferably 40% by mass in the thermosetting resin composition. The upper limit of the proportion of the first filler in the thermosetting resin composition (resin sheet for sealing) is, for example, 60% by mass, preferably 50% by mass in the thermosetting resin composition. With respect to 100 parts by mass of the first filler, the lower limit of the number of parts contained in the second filler is, for example, 30 parts by mass, preferably 40 parts by mass, and more preferably 50 parts by mass. With respect to 100 parts by mass of the first filler, the upper limit of the number of parts contained in the second filler is, for example, 70 parts by mass, preferably 60 parts by mass, and more preferably 55 parts by mass.

[0062] It should be noted that, for example, a thermoplastic resin, a pigment, a silane coupling agent, and other additives may be added to the thermosetting resin composition.

[0063] Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin (6-nylon, 6,6-nylon, etc.), phenoxy resin, acrylic resin, saturated polyester resin (PET, etc.), polyamide-imide resin, fluororesin, styrene-isobutylene-styrene block copolymer, etc. These thermoplastic resins may be used alone or in combination of two or more.

[0064] As the thermoplastic resin, from the viewpoint of improving dispersibility with the thermosetting resin, preferably, an acrylic resin is used.

[0065] Examples of the acrylic resin include carboxyl group-containing (meth)acrylate copolymers (preferably carboxyl group-containing acrylate copolymers) obtained by polymerizing monomer components including a (meth)acrylate alkyl ester having a linear or branched alkyl group and other monomers (copolymerizable monomers).

[0066] Examples of the alkyl group include alkyl groups having 1 to 6 carbon atoms, such as methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, tert-butyl group, isobutyl group, pentyl group and hexyl group.

[0067] Examples of other monomers include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.

[0068] The lower limit of the weight average molecular weight of the thermoplastic resin is, for example, 100,000, preferably 300,000. The upper limit of the weight average molecular weight of the thermoplastic resin is, for example, 1,000,000, preferably 900,000. It should be noted that the weight average molecular weight is measured by gel permeation chromatography (GPC) based on standard polystyrene conversion values.

[0069] The ratio (solid content ratio) of the thermoplastic resin is adjusted so as not to hinder the thermal curing of the thermosetting resin. Specifically, the lower limit of the ratio (solid content ratio) of the thermoplastic resin in the thermosetting resin composition is, for example, 1% by mass, preferably 2% by mass. The upper limit of the ratio (solid content ratio) of the thermoplastic resin in the thermosetting resin composition is, for example, 10% by mass, preferably 5% by mass.

[0070] It should be noted that the thermoplastic resin can be prepared by diluting it with an appropriate solvent.

[0071] As the pigment, for example, black pigments such as carbon black can be cited. The lower limit of the particle size of the pigment is, for example, 0.001 μm. The upper limit of the particle size of the pigment is, for example, 1 μm. The lower limit of the ratio of the pigment to the thermosetting resin composition is, for example, 0.1% by mass. The particle size of the pigment is the arithmetic mean diameter obtained by observing the pigment with an electron microscope. The upper limit of the ratio of the pigment to the thermosetting resin composition is, for example, 2% by mass.

[0072] As a silane coupling agent, for example, a silane coupling agent containing an epoxy group can be cited. As a silane coupling agent containing an epoxy group, for example, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, etc. 3-glycidoxydialkyldialkoxysilane, such as 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, etc. 3-glycidoxyalkyltrialkoxysilane. Preferably, 3-glycidoxyalkyltrialkoxysilane is cited. The lower limit of the content ratio of the silane coupling agent in the thermosetting resin composition is, for example, 0.1% by mass, preferably 1% by mass. The upper limit of the content ratio of the silane coupling agent in the thermosetting resin composition is, for example, 10% by mass, preferably 5% by mass.

[0073] In order to obtain the sealing resin sheet, the above components are mixed in the above ratios to prepare a thermosetting resin composition. The above components are preferably stirred sufficiently to uniformly disperse the layered silicate compound and the inorganic filler mixed as required in the thermosetting resin composition.

[0074] In addition, as required, a solvent (ketones such as methyl ethyl ketone, etc.) is further added to prepare a varnish. Then, the varnish is applied to a peeling sheet (not shown), and then dried by heating to produce a sealing resin sheet having a sheet shape. On the other hand, it is also possible to form a sealing resin sheet from a thermosetting resin composition by mixing and extruding without preparing a varnish.

[0075] It should be noted that the formed sealing resin sheet is in the B stage (semi-cured state), specifically, in the state before the C stage. That is, it is in the state before complete curing. The sealing resin sheet is formed into a B stage sheet from the A stage thermosetting resin composition by heating during the drying and heating during the extrusion kneading.

[0076] The lower limit of the thickness of the sealing resin sheet is, for example, 10 μm, preferably 25 μm, and more preferably 50 μm. The upper limit of the thickness of the sealing resin sheet is, for example, 3000 μm, preferably 1000 μm, more preferably 500 μm, and further preferably 300 μm.

[0077] Next, refer to Figure 1 A~ Figure 1D A method for manufacturing the electronic component package 51 by sealing an electronic component as an example of a component with a sealing resin sheet will be described.

[0078] In this method, if Figure 1 As shown in A, first, a sealing resin sheet 1 is prepared. The sealing resin sheet 1 has one surface and the other surface in the thickness direction which face each other in the thickness direction.

[0079] In addition, if Figure 1 As shown in B, the electronic component 21 is prepared.

[0080] The electronic element 21 includes an electronic component, and a plurality of electronic components 21 are mounted on a substrate 22, for example. The plurality of electronic components 21 and the substrate 22 are provided on a component mounting substrate 24 together with the bumps 23. That is, the component mounting substrate 24 includes the plurality of electronic components 21, the substrate 22, and the bumps 23.

[0081] The substrate 22 has a substantially flat plate shape extending in the plane direction. Terminals (not shown) electrically connected to electrodes (not shown) of the electronic element 21 are provided on one surface 25 in the thickness direction of the substrate 22 .

[0082] The plurality of electronic components 21 each have a roughly flat plate shape (chip shape) extending in the surface direction. The plurality of electronic components 21 are arranged at intervals from each other in the surface direction. The other surface 28 in the thickness direction of the plurality of electronic components 2 is parallel to the one surface 25 in the thickness direction of the substrate 22. Electrodes (not shown) are provided on the other surface 28 in the thickness direction of each of the plurality of electronic components 21. The electrodes of the electronic components 21 are electrically connected to the terminals of the substrate 22 via the bumps 23 described below. It should be noted that a gap (space) 26 may be present between the other surface 28 in the thickness direction of the electronic component 21 and the one surface 25 in the thickness direction of the substrate 22.

[0083] The lower limit of the interval (length in the thickness direction) between adjacent electronic components 21 is, for example, 50 μm, preferably 100 μm, and more preferably 200 μm. The upper limit of the interval between adjacent electronic components 21 is, for example, 10 mm, preferably 5 mm, and more preferably 1 mm. If the interval between adjacent electronic components 21 is below the above upper limit, more electronic components 21 can be mounted on the substrate 22, which can save space.

[0084] The bump 23 electrically connects the electrodes (not shown) of the plurality of electronic components 21 to the terminals of the substrate 22. The bump 23 is disposed between the electrodes of the electronic components 21 and the terminals of the substrate 22. Examples of the material of the bump 23 include solder, gold and other metals. The thickness of the bump 23 is equivalent to the thickness (height) of the gap 26. The thickness of the bump 23 is appropriately set according to the use and purpose of the component mounting substrate 24.

[0085] Next, if Figure 1 As shown in B, the sealing resin sheet 1 is disposed on the plurality of electronic components 21. Specifically, the other surface in the thickness direction of the sealing resin sheet 1 is brought into contact with one surface in the thickness direction of the plurality of electronic components 21.

[0086] Next, if Figure 1 As shown in C, the sealing resin sheet 1 and the device mounting substrate 24 are pressed. It is preferable to heat-press the sealing resin sheet 1 and the device mounting substrate 24.

[0087] For example, the sealing resin sheet 1 and the component mounting substrate 24 are pressed while being sandwiched in the thickness direction by a press machine 27 having two flat plates. The flat plates of the press machine 27 are provided with a heat source (not shown), for example.

[0088] The pressing conditions (pressure, time, temperature, etc.) are not particularly limited, and the conditions are selected so that the sealing resin sheet 1 can enter between the multiple electronic components 21 and the component mounting substrate 24 is not damaged. More specifically, the pressing conditions are set so that the sealing resin sheet 1 flows and enters between adjacent electronic components 21, can cover the peripheral side surfaces of each of the multiple electronic components 21, and contacts a surface 25 in the thickness direction of the substrate 22 that does not overlap with the electronic component 21 when viewed from above.

[0089] Specifically, the lower limit of the pressing pressure is, for example, 0.05 MPa, preferably 0.1 MPa. The upper limit of the pressing pressure is, for example, 10 MPa, preferably 5 MPa. The lower limit of the pressing time is, for example, 0.3 minutes, preferably 0.5 minutes. The upper limit of the pressing time is, for example, 10 minutes, preferably 5 minutes.

[0090] Specifically, the lower limit of the heating temperature is, for example, 40° C., or preferably 60° C. The upper limit of the heating temperature is, for example, 100° C., or preferably 95° C.

[0091] By pressing the sealing resin sheet 1, the sealing resin sheet 1 is plastically deformed in accordance with the outer shape of the electronic components 21. The other surface in the thickness direction of the sealing resin sheet 1 is deformed into a shape corresponding to one surface in the thickness direction and the peripheral side surface of the plurality of electronic components 21.

[0092] It should be noted that the sealing resin sheet 1 is plastically deformed while maintaining the B-stage.

[0093] Thus, the sealing resin sheet 1 covers the peripheral side surfaces of each of the plurality of electronic components 21 and is in contact with one surface 25 in the thickness direction of the substrate 22 that does not overlap with the electronic components 21 in a plan view.

[0094] Thus, the sealing body 31 that seals the electronic element 21 is formed (produced) by the sealing resin sheet 1. One surface of the sealing body 31 in the thickness direction is a flat surface.

[0095] At this time, the sealant 31 is allowed to slightly enter the gap (gap between the electronic component 21 and the substrate 22) 26. Specifically, the sealant 31 is allowed to have a sealant entry length X (refer to Figure 3 C).

[0096] Then, if Figure 1 As shown in D, the sealing body 31 is heated to form a solidified body 41 from the sealing body 31 .

[0097] Specifically, the sealed body 31 and the device mounting substrate 24 are taken out from the press machine 27 , and then, the sealed body 31 and the device mounting substrate 24 are heated under atmospheric pressure using a dryer.

[0098] The lower limit of the heating temperature (curing temperature) is, for example, 100° C., preferably 120° C. The upper limit of the heating temperature (curing temperature) is, for example, 200° C., preferably 180° C. The lower limit of the heating time is, for example, 10 minutes, preferably 30 minutes. The upper limit of the heating time is, for example, 180 minutes, preferably 120 minutes.

[0099] By heating the sealing body 31, a C-staged (completely cured) cured body 41 is formed from the sealing body 31. One surface of the cured body 41 in the thickness direction is an exposed surface.

[0100] It should be noted that it is acceptable to allow the edge of the sealing body 31 that slightly intrudes into the gap to further slightly intrude into the interior of the gap 26 to form the solidified body 41, but the extent of this is suppressed as small as possible. Specifically, the solidified body 41 is allowed to have a solidified body intrusion length Y (refer to Figure 3 D) minus the seal penetration length X to obtain the value (YX).

[0101] Furthermore, the sealing resin sheet 1 contains a layered silicate compound. Therefore, the sealing resin sheet 1 is placed on the electronic component 21, and the sealing resin sheet 1 (sealing body 31) is heated. Figure 1 As shown in D, when the solidified body 41 is formed, the amount of the solidified body 41 entering into the gap 26 between the electronic component 21 and the substrate 22 can be reduced.

[0102] In addition, the sealing resin sheet 1 further contains inorganic fillers other than the layered silicate compound at a high ratio of 50 mass % to 85 mass %. On the other hand, even if the content ratio of the layered silicate compound is set to a low ratio of 3 mass % to 6 mass %, the amount of entry of the solidified body 41 into the gap 26 can be effectively reduced.

[0103] Specifically, it is possible to reduce the seal entry length Y (see Figure 3 D).

[0104] In addition, if Figure 2 A~ Figure 2 As shown in D, the electronic element 21 can be sealed with the sealing multilayer resin sheet 11 including the sealing resin sheet 1 and the second sealing resin sheet 12 in this order on one side in the thickness direction, and then a cured body 41 can be formed.

[0105] The sealing multilayer resin sheet 11 includes a sealing resin sheet 1 and a second sealing resin sheet 12 disposed on the entire surface of one surface in the thickness direction thereof. Preferably, the sealing multilayer resin sheet 11 includes only the sealing resin sheet 1 and the second sealing resin sheet 12.

[0106] The material of the second sealing resin sheet 12 is the same as the material (thermosetting resin composition) of the sealing resin sheet 1 except that the layered silicate compound is not contained. The lower limit of the ratio of the thickness of the second sealing resin sheet 12 to the thickness of the sealing resin sheet 1 is, for example, 0.5, preferably 1, and more preferably 2. The upper limit of the ratio of the thickness of the second sealing resin sheet 12 to the thickness of the sealing resin sheet 1 is, for example, 10, and preferably 5.

[0107] Reference Figure 2 A~ Figure 2 D A method for manufacturing an electronic component cured body package 50 by sealing a plurality of electronic components 21 with a sealing multilayer resin sheet 11 and then forming a cured body 41 will be described.

[0108] like Figure 2 As shown in A, a sealing multilayer resin sheet 11 is prepared. Specifically, the sealing resin sheet 1 and the second sealing resin sheet 12 are bonded together.

[0109] like Figure 2 As shown in B, a plurality of electronic components 21 to be mounted on a substrate 22 are prepared.

[0110] Next, the sealing multilayer resin sheet 11 is disposed on the electronic element 21 so that the other surface in the thickness direction of the sealing resin sheet 1 is in contact with one surface in the thickness direction of the electronic element 21 .

[0111] like Figure 2As shown in C, thereafter, the sealing resin sheet 1 and the element mounting substrate 24 are pressed.

[0112] By pressing, the sealing resin sheet 1 flows and enters between adjacent electronic components 21. On the other hand, since the second sealing resin sheet 12 does not contain a layered silicate compound, its fluidity does not increase even when pressed and remains low, thereby preventing it from entering between adjacent electronic components 21.

[0113] Thus, the sealing multilayer resin sheet 11 is used to form the sealing body 31 that seals the plurality of electronic components 21 .

[0114] It should be noted that, if the sealing resin sheet 1 contains the inorganic filler in a ratio greater than the above lower limit, and the second sealing resin sheet 12 contains the inorganic filler in a ratio greater than the above lower limit, then the following Figure 2 In the pressing shown in C, the sealing resin sheet 1 and the second sealing resin sheet 12 can flow.

[0115] At this time, the sealing resin sheet 1 is in contact with the electronic element 21, and the second sealing resin sheet 12 is located on the opposite side of the electronic element 21 relative to the sealing resin sheet 1. That is, the edge of the sealing body 31 facing the gap 26 is formed by the sealing resin sheet 1. On the other hand, one surface of the sealing body 31 in the thickness direction is formed by the second sealing resin sheet 12.

[0116] Then, if Figure 2 As shown in D, the sealing body 31 is heated to form a solidified body 41 from the sealing body 31 .

[0117] Furthermore, since the sealing multilayer resin sheet 11 includes the sealing resin sheet 1 described above, the amount of penetration of the cured body 41 into the gap 26 can be reduced.

[0118] This sealing multilayer resin sheet 11 can also achieve the same effects as the sealing resin sheet 1 described above.

[0119] In particular, when the sealing resin sheet 1 and the second sealing resin sheet 12 contain a main component of an epoxy resin having a softening point of 50° C. or higher and 130° C. or lower, Figure 2 In the step C, the sealing resin sheet 1 and the second sealing resin sheet 12 can flow. Therefore, the time required for sealing can be shortened. Figure 2 The time of the process shown in C and the Figure 2 In the step shown in C, one surface of the second sealing resin sheet 12 in the thickness direction is flat.

[0120] Furthermore, if the sealing resin sheet 1 and the second sealing resin sheet 12 contain a main component of epoxy resin and a phenol resin as a curing agent, the cured body 41 has high heat resistance and high chemical resistance. Therefore, the cured body 41 has excellent sealing reliability.

[0121] It should be noted that in Figure 2 In the step shown in C, the second sealing resin sheet 12 is fluidized by the pressing force, and one surface in the thickness direction becomes flat. Figure 2 In the step C, in the sealing multilayer resin sheet 11, as described above, the sealing resin sheet 1 receives a pressing force together with the second sealing resin sheet 12, softens and flows, and deforms to follow the outer shape of the electronic component 21. Figure 2 In the step shown in C, the sealing resin sheet 1 is allowed to slightly enter the gap 26 .

[0122] And, in Figure 2 In the step D, the sealing resin sheet 1 is suppressed from flowing due to the decrease in complex viscosity η* accompanying the temperature increase, and excessive entry into the gap 26 is suppressed. That is, in the cured body 41 formed by curing the sealing multilayer resin sheet 11 including the sealing resin sheet 1, the cured body entry length Y can be reduced.

[0123] Modifications

[0124] In each of the following variations, the same reference numerals are used for the same components and processes as those in the above-mentioned embodiment, and detailed description thereof is omitted. In addition, each variation can have the same effect as that of an embodiment except for special description. In addition, an embodiment and its variations can be appropriately combined.

[0125] In one embodiment, the electronic element 21 is sealed with a single layer of the sealing resin sheet 1. However, although not shown in the figure, the electronic element 21 may be sealed with a plurality of (laminated sheets of) sealing resin sheets 1.

[0126] In addition, the second sealing resin sheet 12 in the sealing multilayer resin sheet 11 may be multilayered.

[0127] As an example of an element, an electronic element 21 is listed which is arranged with a gap 26 relative to a surface 25 in the thickness direction of a substrate 22, and is sealed with a sealing resin sheet 1. However, although not shown in the figure, for example, an electronic element 21 which is in contact with a surface 25 in the thickness direction of a substrate 22 can be listed, and it can be sealed with a sealing resin sheet 1.

[0128] Furthermore, although the electronic component 21 is cited as an example of the element, a semiconductor element may also be cited.

[0129] Example

[0130] Preparation example, comparative preparation example, embodiment and comparative example are shown below to further specifically illustrate the present invention. It should be noted that the present invention is not limited by any preparation example, comparative preparation example, embodiment and comparative example. In addition, the specific numerical values ​​such as the mixing ratio (containing ratio), physical property value, parameter used in the following description can be replaced by the upper limit (numerical value defined in the form of "below", "less than") or the lower limit (numerical value defined in the form of "above", "exceeding") of the mixing ratio (containing ratio), physical property value, parameter and the like corresponding to them recorded in the above-mentioned "specific embodiments".

[0131] The components used in the preparation examples and comparative preparation examples are shown below.

[0132] Layered silicate compound: S-BEN NX manufactured by HOJUN (organized bentonite with surface modified by dimethyl distearyl ammonium)

[0133] Main agent: YSLV-80XY manufactured by Nippon Steel Chemical Co., Ltd. (bisphenol F type epoxy resin, high molecular weight epoxy resin, epoxy equivalent 200g / eq. softening point 80°C)

[0134] Curing agent: LVR-8210DL manufactured by Qunrong Chemical Co., Ltd. (linear phenolic resin, latent curing agent, hydroxyl equivalent: 104 g / eq., softening point: 60°C)

[0135] Curing accelerator: 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole) manufactured by Shikoku Chemical Industry Co., Ltd.

[0136] Acrylic resin: HME-2006M manufactured by Negami Industries, carboxyl-containing acrylic acid ester copolymer (acrylic acid polymer), weight average molecular weight: 600,000, glass transition temperature (Tg): -35°C, methyl ethyl ketone solution with a solid content concentration of 20% by mass

[0137] Silane coupling agent: KBM-403 (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.

[0138] First filler: FB-8SM (spherical fused silica powder (inorganic filler), average particle size 7.0 μm)

[0139] Second filler: an inorganic filler obtained by surface-treating SC220G-SMJ (average particle size 0.5 μm) manufactured by Admatechs with 3-methacryloxypropyltrimethoxysilane (product name: KBM-503 manufactured by Shin-Etsu Chemical Co., Ltd.) Inorganic particles obtained by surface-treating 100 parts by mass of the inorganic filler with 1 part by mass of a silane coupling agent.

[0140] Carbon black: #20 manufactured by Mitsubishi Chemical Corporation, particle size 50 nm

[0141] Preparation Examples 1 to 6 and Comparative Preparation Example 1

[0142] A varnish of a thermosetting resin composition was prepared according to the formulation described in Table 1. The varnish was applied on the surface of a release sheet and then dried at 120° C. for 2 minutes to prepare a sealing resin sheet 1 having a thickness of 65 μm. The sealing resin sheet 1 was in the B-stage state.

[0143] Preparation Example 7

[0144] A varnish of a thermosetting resin composition was prepared according to the formulation described in Table 2. The varnish was applied to the surface of the release sheet and then dried at 120° C. for 2 minutes to prepare a second sealing resin sheet 12 having a thickness of 195 μm. The second sealing resin sheet 12 was B-stage.

[0145] Examples 1 to 6 and Comparative Example 1

[0146] The sealing resin sheet and the second sealing resin sheet were bonded together using the combination of the preparation examples shown in Table 3 to prepare a sealing multilayer resin sheet having a thickness of 260 μm.

[0147] evaluate

[0148] The following steps A to E are carried out, and the penetration length Y of the cured product is measured.

[0149] Step A: Figure 3 As shown in A, a sample sheet 61 having a length of 10 mm, a width of 10 mm, and a thickness of 260 μm was prepared from the sealing multilayer resin sheet 11 of each example and each comparative example.

[0150] Step B: Figure 3 As shown in B, a dummy element mounting substrate 74 is prepared in which a dummy element 71 having a length of 3 mm, a width of 3 mm, and a thickness of 200 μm is mounted on a glass substrate 72 via a bump 23 having a thickness of 20 μm.

[0151] Step C: Figure 3 As shown in FIG. 3 , the sample sheet 61 is used to seal the dummy component 71 in the dummy component mounting substrate 74 using a vacuum flat plate press at a temperature of 65° C., a pressure of 0.1 MPa, a vacuum degree of 1.6 kPa, and a pressing time of 1 minute, thereby forming a sealed body 31 using the sample sheet 61 .

[0152] Step D: Figure 3 As shown in D, the sealing body 31 is thermally cured by heating at 150° C. and atmospheric pressure for 1 hour, and a cured body 41 is formed from the sealing body 31 .

[0153] Step E: Figure 3As shown in the enlarged view of FIG. 4D , the solidified body penetration length Y of the solidified body 41 from the side edge 75 into the gap 26 between the dummy element 71 and the glass substrate 72 is measured with the side edge 75 of the dummy element 71 as a reference.

[0154] Then, the cured body penetration length Y was evaluated according to the following criteria.

[0155] ○: The cured body penetration length Y is 0 μm or more and 20 μm or less.

[0156] Δ: The cured body penetration length Y is more than 20 μm and not more than 30 μm, or less than 0 μm and not less than −5 μm.

[0157] ×: The cured body entry length Y exceeds 30 μm or is less than −5 μm.

[0158] It should be noted that in the evaluation, "negative" means that a space protruding outward from the side edge 75 of the dummy element 71 is formed (see Figure 2 D). The absolute value of "negative" corresponds to the protrusion length of the space.

[0159] [Table 1]

[0160]

[0161] [Table 2]

[0162]

[0163] [Table 3]

[0164]

[0165] It should be noted that the above invention is provided as an exemplary embodiment of the present invention, but this is merely an example and is not to be construed as limiting. Modifications of the present invention that are obvious to those skilled in the art are included in the technical solutions of the present application.

[0166] Industrial Applicability

[0167] The sealing resin sheet can be used for sealing of components.

[0168] Description of Reference Numerals

[0169] 1: Sealing resin sheet

Claims

1. A sealing resin sheet, characterized in that: It is a sealing resin sheet containing a thermosetting resin and used to seal a component. It further contains a layered silicate compound and an inorganic filler other than the layered silicate compound, The content ratio of the layered silicate compound in the sealing resin sheet is 1% by mass at the lower limit and 25% by mass at the upper limit. The content ratio of the inorganic filler in the sealing resin sheet is 50% by mass at the lower limit and 90% by mass at the upper limit. The lower limit of the average particle size of the layered silicate compound is 10 nm, and the upper limit is 10 μm. The inorganic filler comprises a first filler and a second filler, The lower limit of the average value of the maximum length of the first filler is 1 μm, and the upper limit is 50 μm. The upper limit of the average value of the maximum length of the second filler is 0.9 μm, and the lower limit is 0.01 μm. The lower limit of the amount of the second filler contained is 30 parts by mass and the upper limit is 70 parts by mass relative to 100 parts by mass of the first filler. In the sealing resin sheet, the upper limit of the content of the thermosetting resin is 30% by mass.

2. The sealing resin sheet according to claim 1, wherein The layered silicate compound is montmorillonite.

3. The sealing resin sheet according to claim 1, wherein The surface of the layered silicate compound is modified with an organic component.

4. The sealing resin sheet according to claim 2, wherein The surface of the layered silicate compound is modified with an organic component.

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