Automatic glue removal and stripping machine

Abstract

The present invention discloses an automatic debonding and stripping machine, comprising a frame; a wafer carrier for placing a wafer cassette; a spray debonding and stripping device mounted on the frame for spraying debonding on the upper and lower surfaces of the wafer; an immersion debonding and stripping device mounted on the frame for immersing the wafer in a stripping solution for debonding; a cleaning device mounted on the frame for cleaning the upper and lower surfaces of the wafer; and a wafer transfer arm mounted on the frame for transferring the wafers. The wafer carrier, spray debonding and stripping device, immersion debonding and stripping device, and cleaning device are respectively located on the periphery of the wafer transfer arm. The automatic debonding and stripping machine can realize immersion debonding, spray debonding, and cleaning of the wafer, thereby improving debonding efficiency and debonding effect.

Description

Technical Field

[0001] The invention relates to an automatic glue removing and stripping machine, which is a device used for removing and stripping photoresist and metal layers on a wafer. Background Art

[0002] In the field of semiconductor technology, it is necessary to generate a metal layer on the surface of a wafer. The current common practice is to first generate a layer of photoresist on the wafer, then etch it to form linear grooves. Then, a metal layer is formed on the photoresist surface and within the wafer linear grooves by metal ion evaporation. Finally, the useless photoresist and metal layers are removed through a stripping and stripping process, while retaining the metal within the linear grooves. The current stripping and stripping device mounts the wafer on a rotating wafer holder, which is located in a cleaning chamber. Then, a deflecting nozzle sprays a stripping liquid on the surface of the wafer. After the spraying and stripping is completed, the wafer is transferred to a cleaning device for cleaning using a wafer transfer arm. However, the current stripping and stripping device has the following disadvantages: 1. The stripping and stripping is not thorough when the spraying method is used alone, and the spraying and stripping time is long. 2. The current spraying process is long, thus requiring a large amount of stripping liquid, which easily results in waste of the stripping liquid. 3. During the current spraying process, the stripping liquid will splash to various places in the cleaning chamber, causing corrosion to other internal parts. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an automatic debonding and stripping machine, which can realize immersion debonding, spray debonding and cleaning of wafers, thereby improving the debonding efficiency and debonding effect.

[0004] In order to solve the above technical problems, the technical solution of the present invention is: an automatic degumming and stripping machine, comprising a frame; a wafer carrier for placing a wafer box; a spray degumming and stripping device installed on the frame, for spraying degumming on the upper and lower surfaces of the wafer; an immersion degumming and stripping device installed on the frame, for immersing the wafer in a stripping liquid for degumming; a cleaning device installed on the frame, for cleaning the upper and lower surfaces of the wafer; a wafer transfer arm installed on the frame, for transferring wafers, and the wafer carrier, the spray degumming and stripping device, the immersion degumming and stripping device and the cleaning device are respectively located on the periphery of the wafer transfer arm.

[0005] As a preferred solution, the immersion degumming and stripping device includes a immersion machine base, a immersion chamber is provided on the immersion machine base, and an operation window for facilitating the entry and exit of a wafer transfer arm is provided on the immersion machine base, a immersion base is provided on the outside of the immersion chamber, a immersion lifting seat is vertically lifted and lowered on the immersion base, and the immersion lifting seat is driven by a first lifting power device. The immersion lifting seat is provided with a immersion mounting seat, and the immersion mounting seat is provided with a immersion mounting plate above the immersion chamber, and a suspension adjustment device for hanging and adjusting the angle of a flower basket is installed on the immersion mounting plate, and the lower end of the suspension adjustment device extends into the immersion chamber to suspend the flower basket in the immersion chamber, and the immersion chamber is provided with a liquid inlet pipe connected to a stripping liquid supply system, and a heating device for heating the stripping liquid is provided in the immersion chamber, and a warehouse door is movably installed at the operation window on the immersion chamber, and the immersion chamber is provided with an opening and closing power device for driving the warehouse door to be closed or opened. When in use, first use the liquid inlet pipe to pass the stripping liquid into the immersion chamber, use the heating device to heat it, so that the temperature of the stripping liquid meets the requirements of the degumming process, and use the wafer transfer arm to send the wafer from the operation window to the flower basket. At this time, the flower basket suspended by the suspension adjustment device is in a horizontal state, which is convenient for the entry of the wafer. Every time a wafer is placed in the wafer slot on the flower basket, the lifting seat moves down the height of the wafer slot so that the empty wafer slot is aligned with the operation window. When all the wafer slots are placed, the suspension adjustment device tilts the flower basket, and then the flower basket is driven by the first lifting power device to immerse it in the stripping chamber. When stripping the wafer in the stripping solution, the wafers will all tilt toward one side due to the tilt of the basket. When entering the stripping solution, the position of the wafers may change due to the influence of buoyancy, but due to the tilt of the wafers, they will still tend to the same side under the action of gravity and eventually lean on the side wall of the basket. At the same time, the tilt of the wafer during stripping can better facilitate the contact between the stripping solution and the adhesive layer, especially the photoresist on the wafer will accelerate separation and falling off due to the tilt. After being lifted out of the stripping solution, the suspension adjustment device can adjust the angle to make it horizontal, thereby facilitating the removal of the wafer.

[0006] As a preferred solution, the suspension adjustment device includes a first suspension rod and a second parallel suspension rod, the upper end of the first suspension rod is fixed on the immersion mounting plate, the lower end of the first suspension rod is hinged to one side of the upper end of the flower basket, the second suspension rod is axially slidably installed on the immersion mounting plate and driven by an axial power device, and the lower end of the second suspension rod is hinged to the other side of the upper end of the flower basket.

[0007] As a preferred solution, the axial power device includes a rodless electric cylinder fixed on an immersion mounting plate, the sliding direction of the sliding part of the rodless electric cylinder is vertical, the power end of the rodless electric cylinder is connected to the upper end of the second suspension rod through an immersion connecting seat, the immersion connecting seat includes an L-shaped immersion connecting plate, one plate portion of the immersion connecting plate is fixed to the sliding part of the rodless electric cylinder by bolts, and the lower end of the other plate portion of the immersion connecting plate is connected to an immersion connecting sleeve by bolts, and a cylindrical nut is threaded on the immersion connecting sleeve, and the upper end of the second suspension rod is configured as a ball head, and a spherical inner hole is provided on the cylindrical nut for convenient connection of the ball head, and the ball head is installed in the spherical inner hole of the cylindrical nut, and the second suspension rod can be better driven by the ball head and the spherical inner hole. The cooperation of the ball head and the spherical inner hole can facilitate better and more stable lifting and lowering of the second suspension rod, and the second suspension rod can move smoothly even if there are some assembly errors.

[0008] As a preferred solution, a mounting groove is provided on the immersion mounting plate, and the rodless electric cylinder is fixed on an L-shaped electric cylinder support. The electric cylinder support is fixed in the mounting groove by a fixing bolt. A horizontal mounting strip hole is provided on the electric cylinder support, and the horizontal mounting strip hole extends toward the first suspension rod. The fixing bolt is constrained in the horizontal mounting strip hole. The immersion mounting plate is provided with an avoidance hole for facilitating the lifting and lowering of the connecting seat. With the above structure, the installation position of the rodless electric cylinder can be adjusted, thereby facilitating connection with the second suspension rod.

[0009] As a preferred solution, the spray degumming and stripping device includes an outer cavity, a stripping cavity is installed in the outer cavity, a wafer holder for clamping the wafer is rotatably installed in the stripping cavity, and the wafer holder is driven by a rotating power device. The stripping cavity includes an outer fixed ring, an inner fixed ring and a movable cover, the wafer holder is located in the inner fixed ring, the outer fixed ring and the inner fixed ring are fixed to the bottom of the outer cavity, the movable cover is lifted and installed on the outer cavity and is located between the outer fixed ring and the inner fixed ring, a spray window is provided at the upper end of the movable cover, and the movable cover is driven by a second lifting power device, when the movable cover is at the lower dead point, the wafer holder is exposed from the spray window, and a first lifting swing arm and a second lifting swing arm are provided on the outer side of the stripping cavity in the outer cavity, the first lifting swing arm and the second lifting swing arm The ends of the lifting swing arms are respectively equipped with normal pressure nozzles and high pressure nozzles. The stripping chamber is also equipped with a lower nozzle for spraying the bottom surface of the wafer. The lower nozzle, normal pressure nozzle and high pressure nozzle are respectively connected to the stripping liquid supply system. The bottom of the outer cavity is located on the outside of the stripping chamber and is provided with an external drain port. The bottom of the outer cavity is located between the outer fixed ring and the inner fixed ring and is provided with an intermediate drain port. The bottom of the outer cavity is located in the inner fixed ring and is provided with an internal drain port. The external drain port, the intermediate drain port and the internal drain port are all connected to the waste liquid collection system pipeline. The outer cavity is also provided with an exhaust port and a feed port. A feed port sealing device is installed at the feed port. The exhaust port is connected to the exhaust system. The spray debonding and stripping device can better debond and strip, reduce the consumption of stripping liquid, and also reduce the splashing of stripping liquid.

[0010] As a preferred solution, the movable cover comprises a cover body, the spray window is located in the middle of the upper end of the cover body, and the cover body is mounted on the outer cavity via a lifting structure. The lower end of the cover body is provided with an annular groove, and the inner retaining ring is located within the annular groove. This movable cover has a reasonable structure, and the annular groove further protects the inner retaining ring, thus forming a double protective barrier, further preventing the stripping liquid from splashing outside the cleaning chamber.

[0011] As a preferred solution, the lifting structure includes several lifting links, the upper ends of the lifting links extend into the annular groove and are fixed to the cover body, the lower ends of the lifting links slide through the inner fixed ring and the bottom of the outer cavity, the lower ends of the lifting links are connected to the second lifting power device, and an outer cover shell is also provided on the outside of the cover body, an annular space is formed between the outer cover shell and the cover body, the lower end of the outer cover shell is between the outer fixed ring and the inner fixed ring, and the lower end of the outer cover shell is lower than the lower end of the cover body. The lifting structure is relatively easy to install and saves internal space, and the use of the outer cover shell can further improve the protection capability.

[0012] As a preferred solution, the number of the intermediate drain ports and the inner drain ports are both multiple and arranged in a circle, and the bottom of the outer cavity is respectively provided with an intermediate ring groove and an inner ring groove corresponding to the positions of the intermediate drain port and the inner drain port. In this way, the stripping liquid can be collected by using the intermediate ring groove and the inner ring groove, which is convenient for discharge from the intermediate drain port and the inner drain port.

[0013] As a preferred solution, the cleaning device has the same structure as the spray degumming and stripping device, the high-pressure nozzle and some lower nozzles of the cleaning device are connected to the pure water supply system, and the normal-pressure nozzle and the remaining lower nozzles of the cleaning device are connected to the nitrogen supply system.

[0014] After adopting the above technical solution, the effect of the present invention is as follows: the automatic debonding and stripping machine includes a frame; a wafer carrier for placing a wafer box; a spray debonding and stripping device installed on the frame, which is used to spray debonding on the upper and lower surfaces of the wafer; an immersion debonding and stripping device installed on the frame, which is used to immerse the wafer in a stripping liquid to remove the glue; a cleaning device installed on the frame, which is used to clean the upper and lower surfaces of the wafer; a wafer transfer arm installed on the frame, which is used to transfer the wafer, and the wafer carrier, the spray debonding and stripping device, the immersion debonding and stripping device and the cleaning device are respectively located on the periphery of the wafer transfer arm Therefore, the automatic debonding and stripping machine can transfer the wafer by using the wafer transfer robot, so as to send the wafer in the wafer box on the carrier into the immersion debonding and stripping device for immersion debonding, and then send it into the spray debonding and stripping device for spray debonding. After two debonding operations, the photoresist and useless metal layer on the surface of the wafer are better and more thoroughly removed, and because it is a continuous debonding, the debonding and stripping time can be saved. Finally, the debonded wafer is cleaned and then sent back to the wafer box. The automatic debonding and stripping machine improves the efficiency and effect of debonding through immersion debonding, spray debonding and cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below with reference to the accompanying drawings and examples.

[0016] Figure 1 It is a structural stereogram of an embodiment of the present invention;

[0017] Figure 2 It is a three-dimensional image with the rack hidden;

[0018] Figure 3 It is a partial perspective view of the immersion debonding and stripping device;

[0019] Figure 4 is a partial three-dimensional cross-sectional view of an immersion debonding and stripping device;

[0020] Figure 5 It is a three-dimensional diagram of a spray debonding and stripping device;

[0021] Figure 6 It is a three-dimensional image of the spray debonding and stripping device hiding the upper cover of the outer cavity;

[0022] Figure 7 It is a top view of the outer cavity cover hidden;

[0023] Figure 8 yes Figure 7 Cross-sectional view at AA;

[0024] Figure 9 It is a three-dimensional diagram with the outer cavity cover and the movable cover hidden;

[0025] In the accompanying drawings: 1. Frame; 2. Immersion debonding and stripping device; 201. Immersion base; 202. Operation window; 203. Immersion base; 204. Immersion lift base; 205. Immersion mounting base; 206. Immersion mounting plate; 207. Flower basket; 208. Liquid inlet pipe; 209. Heating device; 210. Upper chamber; 211. Lower chamber; 212. Door; 213. Opening and closing power device; 214. Door frame; 215. Mounting groove; 216, first suspension rod; 217, second suspension rod; 218, rodless electric cylinder; 219, immersion connection seat; 220, immersion connection sleeve; 221, cylindrical screw sleeve; 222, mounting groove; 223, electric cylinder support; 224, horizontal mounting hole; 225, avoidance hole; 226, liquid level gauge; 227, temperature sensor; 3, wafer carrier; 4, spray degumming and stripping device; 401, outer cavity; 4011, feed port; 4012, upper Cover; 4013, exhaust port; 4014, middle ring groove; 4015, inner ring groove; 402, cleaning chamber; 4021, housing body; 4022, spray window; 4023, annular groove; 4024, outer housing; 4025, outer fixing ring; 4026, inner fixing ring; 403, wafer holder; 4031, mounting base; 4032, rotary power device; 4033, holder body; 404, second lifting arm; 405 , first lifting swing arm; 406, feed port sealing device; 4061, sealing plate; 4062, sealing cylinder; 407, external liquid discharge port; 408, angle adjustment mechanism; 4081, fixed bracket; 4082, adjustment bracket; 4083, adjustment bar hole; 409, lifting connecting rod; 410, first lifting power device; 411, middle liquid discharge port; 412, internal liquid discharge port; 5, cleaning device; 6, wafer box; 7, wafer transfer arm. DETAILED DESCRIPTION

[0026] The present invention is further described in detail below through specific examples.

[0027] like Figures 1 to 9 As shown, an automatic glue removing and stripping machine includes a frame 1; the frame 1 is a frame structure made of aluminum profiles.

[0028] The wafer stage 3 is used to place wafer boxes 6. Two wafer boxes 6 are placed on the wafer stage 3. One of the wafer boxes 6 is used to place wafers that have not been debonded and peeled, and the other wafer box 6 is used to place wafers that have been debonded.

[0029] The spraying degumming and stripping device 4 installed on the frame 1 is as follows: Figures 5 to 9 As shown, the spray debonding and stripping device 4 includes an outer cavity 401, the upper end of which is hinged with an openable and closable upper cover 4012, a stripping cavity is installed in the outer cavity 401, a wafer holder 403 for clamping a wafer is rotatably installed in the stripping cavity, and the wafer holder 403 is driven by a rotating power device 4032.

[0030] The wafer holder 403 includes a mounting base 4031 that is detachably fixed to the bottom of the outer cavity 401 and is located in the inner fixed ring 4026. The holder body 4033 is rotatably mounted on the mounting base 4031. The holder body 4033 is a conventional structure at present. A claw disk is provided on the holder body 4033 for convenient positioning of the wafer. The claw disk is composed of several support columns, each of which has a support step. The wafer is placed on the support step and positioned by the support column. When rotating, the wafer will be driven to rotate together. The rotating power device 4032 is fixed below the outer cavity 401. The power end of the rotating power device 4032 is fixed to the holder body 4033. The lower nozzle is mounted on the mounting base 4031 through an angle adjustment mechanism 408. The center of the spray window 4022 is concentric with the center of the claw disk. The rotating power device 4032 is a driving motor, and the output shaft of the driving motor is connected to the holder body 4033 to drive its rotation.

[0031] Among them, the angle adjustment mechanism 408 includes a fixed bracket 4081 fixed on the mounting base 4031 and tilted, an inclined adjustment bar hole 4083 is set on the fixed bracket 4081, and the extension direction of the adjustment bar hole 4083 has a radial sub-direction, and a locking bolt is installed in the adjustment bar hole 4083, and the locking bolt is connected to the adjustment bracket 4082. The lower nozzle is fixed on the adjustment bracket 4082, and the angle of the adjustment bracket 4082 can be changed by loosening the locking bolt, and the adjustment bracket 4082 can slide within the range of the adjustment bar hole 4083, which not only changes the angle of the lower nozzle, but also changes the position of the injection, thereby changing the injection pressure, so that the cleaning effect on the back of the wafer is also better.

[0032] The stripping chamber includes an outer fixing ring 4025, an inner fixing ring 4026 and a movable cover shell. The wafer holder 403 is located in the inner fixing ring 4026. The outer fixing ring 4025 and the inner fixing ring 4026 are fixed to the bottom of the outer cavity 401. The movable cover shell is lifted and installed on the outer cavity 401 and is located between the outer fixing ring 4025 and the inner fixing ring 4026. A spray window 4022 is provided at the upper end of the movable cover shell. The movable cover shell is driven by a second lifting power device. When the movable cover shell is at the lower dead point, the wafer holder 403 is exposed from the spray window 4022. The outer cavity 401 is provided with a first lifting swing arm 405 and a second lifting swing arm 404 on the outside of the stripping cavity. The ends of the first lifting swing arm 405 and the second lifting swing arm 404 are respectively installed with a normal pressure nozzle and a high pressure nozzle. The stripping cavity is also provided with a lower nozzle for spraying the bottom surface of the wafer. The lower nozzle, the normal pressure nozzle and the high pressure nozzle are respectively connected to the stripping liquid supply system. The bottom of the outer cavity 401 is provided with an external drain port 407 on the outside of the stripping cavity. The bottom of the outer cavity 401 is provided with an intermediate drain port 411 between the outer fixing ring 4025 and the inner fixing ring 4026. The bottom of the outer cavity 401 is provided with an inner fixing ring 4026. An internal drain port 412 is provided in 4026, and the external drain port 407, the middle drain port 411 and the internal drain port 412 are all connected to the waste liquid collection system pipeline. The external cavity 401 is also provided with an exhaust port 4013 and a feed port 4011. A feed port blocking device 406 is installed at the feed port 4011, and the feed port blocking device 406 includes a blocking plate 4061 slidably installed at the feed port 4011, and the blocking plate is driven by a blocking cylinder 4062. The exhaust port 4013 is connected to the exhaust system. The spray degumming and stripping device 4 can better remove glue and strip, reduce the consumption of stripping liquid, and also reduce the splashing of stripping liquid.

[0033] In this embodiment, the movable cover comprises a cover body 4021, with the spray window 4022 disposed in the middle of the upper end of the cover body 4021. The cover body 4021 is mounted on the outer chamber 401 via a lifting structure. An annular groove 4023 is disposed at the lower end of the cover body 4021, with the inner retaining ring 4026 positioned within the annular groove 4023. This movable cover has a rational structure, with the annular groove 4023 further protecting the inner retaining ring 4026, thus forming a double protective barrier to further prevent the stripping liquid from splashing out of the cleaning chamber 402. The lifting structure includes a plurality of lifting rods 409, the upper ends of which extend into the annular groove 4023 and are secured to the cover body 4021. A mounting ring is secured to the upper ends of the lifting rods 409, which is clipped or bolted into the annular groove 4023 to secure the lifting rods 409 to the cover body 4021.

[0034] The lower end of the lifting link 409 slides through the inner fixing ring 4026 and the bottom of the outer cavity 401. The lower end of the lifting link 409 is connected to the second lifting power device. The second lifting power device adopts a cylinder. The outside of the cover body 4021 is also provided with an outer cover shell 4024. An annular space is formed between the outer cover shell 4024 and the cover body 4021. The lower end of the outer cover shell 4024 is between the outer fixing ring 4025 and the inner fixing ring 4026. The lower end of the outer cover shell 4024 is lower than the lower end of the cover body 4021. The lifting structure is relatively easy to install and saves internal space. The use of the outer cover shell 4024 can further improve the protection capability. The number of the intermediate drain ports 411 and the inner drain ports 412 are both multiple and arranged in a circle. The bottom of the outer cavity 401 is respectively provided with an intermediate annular groove 4014 and an inner annular groove 4015 corresponding to the positions of the intermediate drain ports 411 and the inner drain ports 412. In this way, the intermediate annular groove 4014 and the inner annular groove 4015 can be used to collect the stripping liquid, making it convenient to discharge it from the intermediate drain ports 411 and the inner drain ports 412.

[0035] In this embodiment, the stripping liquid supply system includes a new liquid storage tank and a recovery liquid storage tank. The new liquid storage tank is connected to the high-pressure nozzle through the new liquid supply system, and the recovery liquid storage tank is connected to the lower nozzle and the normal-pressure nozzle through the recovery liquid supply system; the waste liquid collection system is connected to the recovery liquid storage tank through a recovery liquid replenishing pipeline, and a filter is provided on the recovery liquid replenishing pipeline. In this way, the recovery liquid can be used for spraying during normal-pressure spraying. The concentration of the recovered stripping liquid is relatively low, and the solid particles are removed after filtering through the filter. After spraying for a period of time, most of the photoresist is removed, and the metal lines on the surface of the wafer have been partially or completely exposed. At this time, the high-pressure new liquid is used for spraying and degumming, thereby reducing the consumption of stripping liquid while ensuring a good degumming and stripping effect.

[0036] like Figure 3 and Figure 4As shown, an immersion degumming and stripping device 2 installed on a frame 1 is used to immerse the wafer in a stripping liquid to remove the glue; the immersion degumming and stripping device 2 includes an immersion machine base 201, an immersion cavity is provided on the immersion machine base 201, an operation window 202 is provided on the immersion cavity to facilitate the wafer transfer arm 7 to enter and exit the material, an immersion base 203 is provided on the immersion machine base 201 outside the immersion cavity, an immersion lifting seat 204 is vertically lifted and installed on the immersion base 203, the immersion lifting seat 204 is driven by a first lifting power device 410, and an immersion mounting seat 205 is provided on the immersion lifting seat 204. The mounting seat 205 is provided with an immersion mounting plate 206 located above the immersion cavity, and the immersion mounting plate 206 is provided with a suspension adjustment device for hanging and adjusting the angle of the flower basket 207, and the lower end of the suspension adjustment device extends into the immersion cavity to suspend the flower basket 207 in the immersion cavity, and the immersion cavity is provided with a liquid inlet pipe 208 connected to the stripping liquid supply system, and the immersion cavity is provided with a heating device 209 for heating the stripping liquid, and the immersion cavity is provided with a compartment door 212 movably installed at the operation window 202, and the immersion cavity is provided with an opening and closing power device 213 for driving the compartment door 212 to close or open.

[0037] When in use, first use the liquid inlet pipe 208 to pass the stripping liquid into the immersion chamber, use the heating device 209 to heat it, so that the temperature of the stripping liquid meets the requirements of the degumming process, and use the wafer transfer arm 7 to send the wafer from the operation window 202 to the flower basket 207. At this time, the flower basket 207 suspended by the suspension adjustment device is in a horizontal state, which is convenient for the entry of the wafer. Every time a wafer is placed in the wafer placement slot on the flower basket 207, the lifting seat moves down by the height of the wafer placement slot so that the empty wafer placement slot is aligned with the operation window 202. When all the wafer placement slots are filled with wafers, the suspension adjustment device tilts the flower basket 207, and then the flower basket 207 is lifted by the first lifting device. The power device 410 drives the wafer to be immersed in the stripping liquid for debonding. Since the flower basket 207 is tilted, the wafers will all tilt toward one side. When entering the stripping liquid, the position of the wafer may change due to the influence of buoyancy, but since the wafer is tilted, it will still tend to the same side under the action of gravity, and finally lean on the side wall of the flower basket 207. At the same time, since the wafer is tilted during debonding, it can better facilitate the contact between the stripping liquid and the adhesive layer, especially the photoresist on the wafer will accelerate separation and falling off due to the tilt. After being lifted out of the stripping liquid, the suspension adjustment device can adjust the angle to make it horizontal, thereby facilitating the removal of the wafer.

[0038] like Figure 4As shown, the immersion chamber includes an upper chamber 210 and a lower chamber 211 fixed to each other, an operation window 202 is provided on the upper chamber 210, a liquid inlet pipe 208 and a heating device 209 are provided on the lower chamber 211, a chamber door 212 is movably installed at the operation window 202 on the upper chamber 210, an opening and closing power device 213 for driving the chamber door 212 to close or open is provided on the upper chamber 210, the operation window 202 is located on the side wall of the upper chamber 210, and the operation window 202 is located on the side wall of the upper chamber 210. A rectangular door frame 214 is fixed on the outer side of the opening of the window 202. The upper end of the door frame 214 is open. A mounting groove 215 is provided on the door frame 214. The warehouse door 212 is slidably installed in the mounting groove 215. The opening and closing power device 213 drives the warehouse door 212 to slide vertically in the mounting groove 215. An exhaust port is provided on the upper cavity 210, and the exhaust port is connected to the exhaust pipe. A liquid level meter 226 and a temperature sensor 227 are also provided on the lower cavity 211.

[0039] The suspension adjustment device includes a parallel first suspension rod 216 and a second suspension rod 217. The upper end of the first suspension rod 216 is fixed on the immersion mounting plate 206, and the lower end of the first suspension rod 216 is hinged to one side of the upper end of the flower basket 207. The second suspension rod 217 is axially slidably installed on the immersion mounting plate 206 and driven by an axial power device. The lower end of the second suspension rod 217 is hinged to the other side of the upper end of the flower basket 207.

[0040] Among them, the axial power device includes a rodless electric cylinder 218 fixed on the immersion mounting plate 206, the sliding direction of the sliding part of the rodless electric cylinder 218 is vertical, the power end of the rodless electric cylinder 218 is connected to the upper end of the second suspension rod 217 through the immersion connecting seat 219, the immersion connecting seat 219 includes an L-shaped immersion connecting plate, one plate portion of the immersion connecting plate is fixed to the sliding part of the rodless electric cylinder 218 by bolts, and the lower end of the other plate portion of the immersion connecting plate is connected to the immersion connecting sleeve by bolts. 220, the immersion connecting sleeve 220 is threadedly connected with a cylindrical nut 221, the upper end of the second suspension rod 217 is set to a ball head, and the cylindrical nut 221 is provided with a spherical inner hole for convenient connection of the ball head, and the ball head is installed in the spherical inner hole of the cylindrical nut 221. The ball head and the spherical inner hole can better drive the second suspension rod 217, and the cooperation of the ball head and the spherical inner hole can facilitate the better and more stable lifting and lowering of the second suspension rod 217, and even if there are some assembly errors, the second suspension rod 217 can move smoothly.

[0041] A mounting groove 222 is provided on the immersion mounting plate 206, and the rodless electric cylinder 218 is fixed on an L-shaped electric cylinder support 223. The electric cylinder support 223 is fixed in the mounting groove 222 by a fixing bolt. A horizontal mounting strip hole 224 is provided on the electric cylinder support 223. The horizontal mounting strip hole 224 extends toward the first suspension rod 216, and the fixing bolt is constrained in the horizontal mounting strip hole 224. The immersion mounting plate 206 is provided with an avoidance hole 225 for facilitating the lifting and lowering of the connecting seat. With the above structure, the installation position of the rodless electric cylinder 218 can be adjusted, thereby facilitating connection with the second suspension rod 217.

[0042] The cleaning device 5 installed on the frame 1 is used to clean the upper and lower surfaces of the wafer; the cleaning device 5 in this embodiment has the same structure as the spray degumming and stripping device 4, and the high-pressure nozzle and part of the lower nozzles of the cleaning device 5 are connected to the pure water supply system, and the normal-pressure nozzle and the remaining lower nozzles of the cleaning device 5 are connected to the nitrogen supply system. Therefore, the wafer after soaking degumming and spray degumming is sent to the cleaning device 5, and then the high-pressure nozzle and part of the lower nozzle are used for upper and lower spray cleaning. After the cleaning is completed, the normal-pressure nozzle and the remaining lower nozzle are used for nitrogen blowing to remove the moisture on the surface and complete the cleaning of the wafer.

[0043] A wafer transfer arm 7 mounted on the frame 1 is used to transfer wafers. The wafer stage 3, spray debonding and stripping device 4, immersion debonding and stripping device 2, and cleaning device 5 are respectively located on the periphery of the wafer transfer arm 7. The wafer transfer arm 7 is a conventional transfer arm in the semiconductor production industry. The transfer arm can deflect and rise and fall, and uses vacuum suction to absorb wafers and move them to a designated position.

[0044] The air circuit system, motor and other actuators, and lead screw and nut mechanism mentioned in this embodiment are all conventional technologies. The specific structures and principles of the cylinder, motor, and other transmission mechanisms, as well as other designs, are disclosed in detail in the "Mechanical Design Manual, Fifth Edition," the 28th edition, published in Beijing in April 2008. These are prior art and their structures are clear and concise. The SMC training material "Modern Practical Pneumatic Technology, 3rd Edition," published by the Machinery Industry Press on August 1, 2008, discloses in detail the vacuum components, gas circuits, and program control, indicating that the air circuit structure in this embodiment is also prior art and clear and concise. The book "Motor Drive and Speed ​​Regulation," published by the Chemical Industry Press on July 1, 2015, also provides detailed descriptions of motor control and travel switches. Therefore, the circuits and air circuit connections are clear. The above-described embodiments are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications and alterations to the technical solution of the present invention, without departing from the spirit of the present invention, should fall within the scope of protection defined by the claims.

Claims

1. An automatic adhesive stripping machine, characterized in that: include: frame; a wafer stage for placing wafer cassettes; The spray debonding and stripping device installed on the frame is used to spray debond the upper and lower surfaces of the wafer; An immersion debonding and stripping device installed on the frame is used to immerse the wafer in a stripping solution to remove the glue; A cleaning device mounted on the rack, used to clean the upper and lower surfaces of the wafer; The wafer transfer arm is mounted on the frame and is used to transfer wafers. The wafer carrier, the spray degumming and stripping device, the immersion degumming and stripping device and the cleaning device are respectively located on the periphery of the wafer transfer arm; the immersion degumming and stripping device includes a immersion machine base, a immersion chamber is provided on the immersion machine base, and an operation window is provided on the immersion chamber for facilitating the wafer transfer arm to load and unload materials. A immersion base is provided on the immersion machine base outside the immersion chamber, and a immersion lifting seat is vertically lifted and lowered on the immersion base, which is driven by a first lifting power device. A immersion mounting seat is provided on the immersion lifting seat, and the immersion mounting seat is provided with a immersion mounting plate located above the immersion chamber, and a suspension adjustment device for hanging and adjusting the angle of the flower basket is installed on the immersion mounting plate. The lower end of the suspension adjustment device extends into the immersion chamber to hang the flower basket in the immersion chamber, and the immersion chamber is provided with a liquid inlet pipe connected to the stripping liquid supply system, and a heating device for heating the stripping liquid is provided in the immersion chamber. A warehouse door is movably installed at the operation window on the immersion chamber, and a driving mechanism is provided on the immersion chamber. The opening and closing power device for closing or opening the warehouse door; the suspension adjustment device includes a parallel first suspension rod and a second suspension rod, the upper end of the first suspension rod is fixed on the immersion mounting plate, the lower end of the first suspension rod is hinged on one side of the upper end of the flower basket, the second suspension rod is axially slidably installed on the immersion mounting plate and driven by the axial power device, and the lower end of the second suspension rod is hinged on the other side of the upper end of the flower basket; the axial power device includes a rodless electric cylinder fixed on the immersion mounting plate, the sliding direction of the sliding part of the rodless electric cylinder is vertical, the power end of the rodless electric cylinder is connected to the upper end of the second suspension rod through an immersion connecting seat, the immersion connecting seat includes an L-shaped immersion connecting plate, one plate portion of the immersion connecting plate is fixed to the sliding part of the rodless electric cylinder by bolts, and the lower end of the other plate portion of the immersion connecting plate is connected to an immersion connecting sleeve by bolts, and a cylindrical nut is threaded on the immersion connecting sleeve, and the upper end of the second suspension rod is set as a ball head, and a spherical inner hole is provided on the cylindrical nut for convenient connection of the ball head, and the ball head is installed in the spherical inner hole of the cylindrical nut.

2. The automatic adhesive stripping machine according to claim 1, characterized in that: A mounting groove is provided on the immersion mounting plate, and the rodless electric cylinder is fixed on an L-shaped electric cylinder support. The electric cylinder support is fixed in the mounting groove by a fixing bolt. A horizontal mounting strip hole is provided on the electric cylinder support, and the horizontal mounting strip hole extends toward the first suspension rod. The fixing bolt is constrained in the horizontal mounting strip hole. An avoidance hole is provided on the immersion mounting plate to facilitate the lifting and lowering of the connecting seat.

3. The automatic adhesive stripping machine according to claim 2, characterized in that: The spray degumming and stripping device includes an outer cavity, a stripping cavity is installed in the outer cavity, a wafer holder for clamping wafers is rotatably installed in the stripping cavity, and the wafer holder is driven by a rotating power device. The stripping cavity includes an outer fixed ring, an inner fixed ring and a movable cover, the wafer holder is in the inner fixed ring, the outer fixed ring and the inner fixed ring are fixed to the bottom of the outer cavity, the movable cover is lifted and installed on the outer cavity and is between the outer fixed ring and the inner fixed ring, a spray window is provided at the upper end of the movable cover, and the movable cover is driven by a second lifting power device. When the movable cover is at the lower dead point, the wafer holder is exposed from the spray window, and a first lifting swing arm and a second lifting swing arm are provided on the outside of the stripping cavity in the outer cavity. A lowering arm, the ends of the first lifting arm and the second lifting arm are respectively equipped with a normal pressure nozzle and a high pressure nozzle, and the stripping chamber is also equipped with a lower nozzle for spraying the bottom surface of the wafer, and the lower nozzle, normal pressure nozzle and high pressure nozzle are respectively connected to the stripping liquid supply system, and the bottom of the outer cavity is located on the outside of the stripping chamber and is provided with an external drain port, and the bottom of the outer cavity is located between the outer fixed ring and the inner fixed ring and is provided with an intermediate drain port, and the bottom of the outer cavity is located in the inner fixed ring and is provided with an internal drain port, and the external drain port, the intermediate drain port and the internal drain port are all connected with the waste liquid collection system pipeline, and the outer cavity is also provided with an exhaust port and a feed port, and a feed port sealing device is installed at the feed port, and the exhaust port is connected to the exhaust system.

4. The automatic adhesive stripping machine according to claim 3, characterized in that: The movable cover includes a cover body, the spray window is arranged in the middle of the upper end of the cover body, the cover body is installed on the outer cavity through a lifting structure, the lower end of the cover body is provided with an annular groove, and the inner fixing ring is located in the annular groove.

5. The automatic adhesive stripping machine according to claim 4, characterized in that: The lifting structure includes a plurality of lifting links, the upper ends of the lifting links extend into the annular groove and are fixed to the cover body, the lower ends of the lifting links slide through the inner fixed ring and the bottom of the outer cavity, the lower ends of the lifting links are connected to the second lifting power device, and an outer cover shell is further provided on the outside of the cover body, an annular space is formed between the outer cover shell and the cover body, the lower end of the outer cover shell is between the outer fixed ring and the inner fixed ring, and the lower end of the outer cover shell is lower than the lower end of the cover body.

6. The automatic adhesive stripping machine according to claim 5, characterized in that: The number of the intermediate drain ports and the inner drain ports are both multiple and arranged in a circle, and the bottom of the outer cavity is respectively provided with an intermediate annular groove and an inner annular groove corresponding to the positions of the intermediate drain ports and the inner drain ports.

7. The automatic adhesive stripping machine according to claim 6, characterized in that: The cleaning device has the same structure as the spray degumming and stripping device. The high-pressure nozzle and some lower nozzles of the cleaning device are connected to the pure water supply system, and the normal-pressure nozzle and the remaining lower nozzles of the cleaning device are connected to the nitrogen supply system.

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