Display panel and method for manufacturing the same

Abstract

An embodiment of the present application discloses a display panel and a manufacturing method thereof, in which a stress barrier layer is correspondingly provided in the corner area of the substrate. Among them, when chamfering the display panel, there is stress superposition between the substrate and the cover plate, and the stress will conduct in the up and down directions in the form of waves. Due to the presence of the stress barrier layer, the stress will be blocked and released at the stress barrier layer, preventing the stress from continuing to approach the inside of the display panel. Thus, it can effectively reduce the expansion of microcracks generated by the interaction between the dicing wheel and the display panel along the grinding direction, achieve the effect of avoiding the fracture phenomenon of the display panel, avoid the generation of cracks, and further improve the yield of the display panel.

Description

Technical Field

[0001] This application relates to the field of displays, and particularly to a display panel and a manufacturing method thereof. Background Art

[0002] Currently, with the increasing maturity of display technologies, organic light-emitting displays are becoming more and more common in daily life.

[0003] Among them, after the manufacturing process of the organic light-emitting display panel is completed, the organic light-emitting display panel will be sent for cutting, and edge chamfering will be performed after cutting. When chamfering, a certain pressure needs to be applied to the cutting wheel so that the cutting wheel grinds at the cross-section of the organic light-emitting display panel under the guidance of the tool holder; the cutting wheel has an extrusion effect on the glass, and a certain area of damage will be formed in the advancing direction of the cutting wheel, forming microcracks. And since the end of the microcrack is a place where stress is concentrated, the microcracks generated by the interaction between the cutting wheel and the organic light-emitting display panel will expand along the grinding direction; when the crack reaches a certain degree, it will cause the organic light-emitting display panel to break and produce cracks.

[0004] Therefore, how to prevent the organic light-emitting display panel from generating cracks during chamfering is a difficult problem that panel manufacturers need to overcome. Summary of the Invention

[0005] Embodiments of this application provide a display panel and a manufacturing method thereof to solve the technical problem that in the prior art, cracks are likely to occur in the organic light-emitting display panel during chamfering.

[0006] Embodiments of this application provide a driving method of a display device, a substrate, and the substrate has a corner area;

[0007] A cover plate, the cover plate is disposed opposite to the substrate,

[0008] An adhesive layer, the adhesive layer is disposed between the substrate and the cover plate;

[0009] A stress barrier layer, the stress barrier layer is disposed between the substrate and the cover plate and is correspondingly disposed in the corner area.

[0010] Optionally, in some embodiments of this application, the stress barrier layer is correspondingly disposed in one of the corner areas.

[0011] Optionally, in some embodiments of this application, the stress barrier layer is correspondingly disposed in two diagonally arranged corner areas.

[0012] Optionally, in some embodiments of this application, the stress barrier layer is correspondingly disposed in four corner areas.

[0013] Optionally, in some embodiments of the present application, the spacing distance between the stress barrier layer and the adhesive layer is from 0 mm to 2 mm.

[0014] Optionally, in some embodiments of the present application, the shape of the stress barrier point is dot-shaped or water droplet-shaped.

[0015] Optionally, in some embodiments of the present application, the material of the stress barrier point is an organic material.

[0016] Optionally, in some embodiments of the present application, the material of the stress barrier point is the same as the material of the array layer.

[0017] Optionally, in some embodiments of the present application, the display panel further includes an array layer, the array layer is disposed between the adhesive layer and the substrate, and the material of the stress barrier point is the same as the material of the array layer.

[0018] Correspondingly, an embodiment of the present application further provides a method for manufacturing a display panel, and the manufacturing method includes:

[0019] Providing a substrate and a cover plate, wherein the substrate has a corner area;

[0020] Forming an adhesive layer and a stress barrier layer on the substrate, and the stress barrier layer is correspondingly disposed in the corner area;

[0021] Pressing the substrate and the cover plate together to form the display panel, and the substrate and the cover plate are disposed opposite to each other.

[0022] An embodiment of the present application adopts a display panel and a method for manufacturing a display panel, and a stress barrier layer is correspondingly disposed in the corner area of the substrate. Among them, when chamfering the display panel, there is stress superposition between the substrate and the cover plate, and the stress will conduct in the up and down directions in the form of waves. Due to the existence of the stress barrier layer, the stress will be blocked and released at the stress barrier layer, preventing the stress from continuing to approach the inside of the display panel. Therefore, it can effectively reduce the expansion of microcracks generated by the interaction between the dicing wheel and the display panel along the grinding direction, achieve the effect of avoiding the fracture phenomenon of the display panel, avoid the generation of cracks, and thus improve the yield of the display panel. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0024] Figure 1The first structural schematic diagram of the display panel provided by the embodiment of the present application.

[0025] Figure 2 The second structural schematic diagram of the display panel provided by the embodiment of the present application.

[0026] Figure 3 The third structural schematic diagram of the display panel provided by the embodiment of the present application.

[0027] Figure 4 The fourth structural schematic diagram of the display panel provided by the embodiment of the present application.

[0028] Figure 5 The fifth structural schematic diagram of the display panel provided by the embodiment of the present application.

[0029] Figure 6 The sixth structural schematic diagram of the display panel provided by the embodiment of the present application.

[0030] Figure 7 The seventh structural schematic diagram of the display panel provided by the embodiment of the present application.

[0031] Figure 8 The flow schematic diagram of the manufacturing method of the display panel provided by the embodiment of the present application. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present application.

[0033] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "thickness", "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0034] In the description of the present application, it should be understood that the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" etc. may explicitly or implicitly include one or more of the described features, and therefore should not be construed as a limitation to the present application.

[0035] Embodiments of the present application provide a display panel and a manufacturing method thereof. The following will be described in detail respectively. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments.

[0036] Please refer to Figure 1 and Figure 2 , Figure 1 which is the first structural schematic diagram of the display panel provided by the embodiments of the present application, Figure 2 and Figure 1 is Figure 2 the second structural schematic diagram of the display panel provided by the embodiments of the present application. As shown in Figure 1 and Figure 2 , the display panel 10 provided by the embodiments of the present application includes a substrate 101, an adhesive layer 102, a stress barrier layer 103, and a cover plate 104. Among them, the substrate 101 has a corner area 101a. The adhesive layer 102 is disposed between the substrate 101 and the cover plate 104. The stress barrier layer 103 is disposed between the substrate 101 and the cover plate 104 and is correspondingly disposed in the corner area 101a. The cover plate 104 and the substrate 101 are disposed opposite to each other.

[0037] Among them, it should be noted that in the prior art, when chamfering the display panel, due to the extrusion between the cutting wheel and the glass, a certain area of damage will be formed in the advancing direction of the cutting wheel, forming microcracks. And since the end of the microcrack is a place where stress is concentrated, the microcracks generated by the interaction between the cutting wheel and the display panel will expand along the grinding direction; when the crack reaches a certain degree, it will cause the display panel to break and produce cracks.

[0038] Among them, in the embodiments of the present application, a stress barrier layer 103 is correspondingly disposed in the corner area 101a of the substrate 101. Among them, when chamfering the display panel 10, there is stress superposition between the substrate 101 and the cover plate 104, and the stress will be conducted in the up and down directions in the form of waves. Due to the presence of the stress barrier layer 103, the stress will be blocked and released at the stress barrier layer 103, preventing the stress from continuing to approach the inside of the display panel 10, so as to effectively reduce the expansion of the microcracks generated by the interaction between the cutting wheel and the display panel 10 along the grinding direction, achieving the effect of avoiding the fracture phenomenon of the display panel 10, avoiding the generation of cracks, and thereby improving the yield of the display panel 10.

[0039] Among them, the spacing distance L1 between the stress barrier layer 103 and the adhesive layer 102 is 0 mm to 2 mm. Specifically, the spacing distance L1 between the stress barrier layer 103 and the adhesive layer 102 is 0 mm, 0.2 mm, 0.4 mm, 0.7 mm, 1 mm, 1.5 mm, or 2 mm. The specific spacing distance L1 between the stress barrier layer 103 and the adhesive layer 102 is determined by the specific requirements of the display panel 10.

[0040] It should be noted that as long as the stress barrier layer 103 is correspondingly arranged in the corner area 101a of the substrate 101, it is possible to prevent the stress from continuing to approach the inside of the display panel 10, and reduce the effect that the microcracks generated by the interaction between the dicing wheel and the display panel 10 expand along the grinding direction. Therefore, the spacing distance L1 between the stress barrier layer 103 and the adhesive layer 102 can be set small enough.

[0041] In addition, the smaller the spacing distance L1 between the stress barrier layer 103 and the adhesive layer 102, the narrower the border of the display panel 10. Therefore, by limiting the spacing distance L1 between the stress barrier layer 103 and the adhesive layer 102 to 0 mm to 2 mm, it is possible to achieve a narrow border of the display panel 10 on the basis of avoiding the fracture phenomenon of the display panel 10.

[0042] Among them, the spacing L2 between the stress barrier layer 103 and the corresponding grinding boundary is 1 mm to 2 mm. Specifically, the spacing L2 between the stress barrier layer 103 and the corresponding grinding boundary is 1 mm, 1.1 mm, 1.2 mm, 1.4 mm, 1.6 mm or 2 mm. The specific spacing L2 between the stress barrier layer 103 and the corresponding grinding boundary is determined by the specific border requirements of the display panel 10.

[0043] Among them, it should be noted that in order to facilitate the stress barrier layer 103 to offset stress diffusion, therefore, the spacing L2 between the stress barrier layer 103 and the corresponding grinding boundary needs to be greater than or equal to 1 mm. In addition, in order to achieve a narrow border of the display panel 10, the spacing L2 between the stress barrier layer 103 and the corresponding grinding boundary needs to be less than or equal to 2 mm.

[0044] Therefore, by limiting the spacing L2 between the stress barrier layer 103 and the corresponding grinding boundary to 1 mm to 2 mm, it is possible to achieve a narrow border of the display panel 10 on the basis of avoiding the fracture phenomenon of the display panel 10.

[0045] Among them, the stress barrier layer 103 includes a first surface and a second surface arranged opposite to each other. The first surface is in contact with the adhesive layer 102, and the second surface is in contact with the cover plate 104.

[0046] Among them, it should be noted that when chamfering the display panel 10, there is stress superposition between the substrate 101 and the cover plate 104, and the stress will conduct in the up and down directions in the form of waves. Therefore, only when one surface of the stress barrier layer 103 is in contact with the substrate 101 and one surface is in contact with the cover plate 104, the stress will be blocked and released at the stress blocking point 103a, preventing the stress from continuing to approach the inside of the display panel 10, so as to achieve the effect of avoiding the fracture phenomenon of the display panel 10, avoiding the generation of cracks, and thus improving the yield of the display panel 10.

[0047] Among them, it should be noted that the encapsulation process of the display panel 10 is to press-fit the substrate 101 and the cover plate 104 to complete the encapsulation. Among them, when the stress barrier layer 103 is just formed, the stress barrier layer 103 does not contact the cover plate 104, or the stress barrier layer 103 does not contact the substrate 101. Only when the substrate 101 and the cover plate 104 are press-fitted, the stress barrier layer 103 not only contacts the substrate 101 but also contacts the cover plate 104, thereby preventing the height of the stress barrier layer 103 from being too high during the press-fitting process and causing poor press-fitting.

[0048] Among them, it should be noted that during the encapsulation process of the display panel 10, the cover plate 104 needs to be press-fitted with the substrate 101. By setting the adhesive layer 102, the adhesion between the cover plate 104 and other film layers can be improved, and the phenomenon of film layer peeling can be avoided, thereby improving the encapsulation effect of the display panel.

[0049] Please participate Figure 3 , Figure 3 is the third structural schematic diagram of the display panel provided by the embodiment of the present application. As Figure 6 shown, Figure 3 The difference between the shown display panel and Figure 1 the shown display panel is that: the display panel 10 further includes an array layer 105. Among them, the array layer 105 includes a light-shielding layer 1051, a buffer layer 1052, a thin-film transistor layer 1053, and a planarization layer 1054. The light-shielding layer 1051 is disposed on the substrate 101. The buffer layer 1052 is disposed on a surface of the light-shielding layer 1051 away from the substrate 101. The thin-film transistor layer 1053 is disposed on a surface of the buffer layer 1052 away from the light-shielding layer 1051. The planarization layer 1054 is disposed on a surface of the thin-film transistor layer 1053 away from the buffer layer 1052.

[0050] Among them, the material of the light-shielding layer 1051 is metal or metal alloy. Specifically, the material of the light-shielding layer 1051 is tantalum (Ta), tungsten (W), molybdenum (Mo), aluminum (Al), titanium (Ti), copper niobium (CuNb) alloy, etc., and can also be, for example, a stack of copper (Cu) and molybdenum (Mo), a stack of copper (Cu) and molybdenum titanium (MoTi) alloy, a stack of copper (Cu) and titanium (Ti), a stack of aluminum (Al) and molybdenum (Mo), and a stack of molybdenum (Mo) and tantalum (Ta), a stack of molybdenum (Mo) and tungsten (W), a stack of molybdenum (Mo)-aluminum (Al)-molybdenum (Mo), etc.

[0051] Among them, the materials of the buffer layer 1052 and the planarization layer 1054 can be selected from silicon dioxide, silicon oxynitride, and their stacks.

[0052] Among them, the thin-film transistor layer 1053 includes film layers such as an active layer, a source-drain layer, a gate layer, and a gate insulating layer. The array layer 105 may further include other film layers.

[0053] Among them, the material of the active layer can be low-temperature polysilicon. Specifically, the material of the active layer is indium gallium zinc oxide (IGZO), indium gallium zinc tin oxide (IGZTO), indium zinc oxide (IZO), gallium indium oxide (IGO), indium gallium tin oxide (IGTO), indium zinc tin oxide (IZTO), indium tin oxide (ITO), etc.

[0054] Among them, the materials of the gate layer and the source-drain layer are metal or metal alloy. Specifically, the materials of the gate layer and the source-drain layer are tantalum (Ta), tungsten (W), molybdenum (Mo), aluminum (Al), titanium (Ti), copper niobium (CuNb) alloy, etc., and can also be a stack of, for example, copper (Cu) and molybdenum (Mo), a stack of copper (Cu) and molybdenum titanium (MoTi) alloy, a stack of copper (Cu) and titanium (Ti), a stack of aluminum (Al) and molybdenum (Mo), and a stack of molybdenum (Mo) and tantalum (Ta), a stack of molybdenum (Mo) and tungsten (W), a stack of molybdenum (Mo)-aluminum (Al)-molybdenum (Mo), etc.

[0055] Among them, the material of the gate insulating layer can be selected from silicon dioxide, silicon oxynitride and their stacks.

[0056] Please refer to Figure 4 , Figure 4 which is the fourth structural schematic diagram of the display panel provided by the embodiment of the present application. As Figure 4 shown, the stress barrier layer 103 provided by the embodiment of the present application includes a plurality of stress barrier points 103a arranged at intervals.

[0057] Among them, the shape of the stress barrier point 103a is dot-shaped or water droplet-shaped. It should be noted that setting the shape of the stress barrier point 103a as dot-shaped or water droplet-shaped helps to improve the function of the stress barrier point 103a in blocking and releasing stress.

[0058] Among them, in the same stress barrier layer 103, the distance between two adjacent stress barrier points 103a is equal. It should be noted that the stress barrier points 103a are formed by photolithography and development process, inkjet printing process or nozzle spraying process. Therefore, when the distance between two adjacent stress barrier points 103a is equal, the process difficulty of forming the stress barrier points 103a by the above processes can be reduced, so as to achieve the effects of improving production efficiency and reducing costs.

[0059] Among them, in the same stress barrier layer 103, the distance between two adjacent stress barrier points 103a can also be different.

[0060] Among them, the number and size of the stress barrier points 103a can be the same or different.

[0061] Among them, the material of the stress barrier point 103a is the same as that of the array layer 105. It should be noted that the stress barrier layer 103 and the array layer 105 are arranged on the same layer. Therefore, when the material of the stress barrier point 103a is the same as that of the array layer 105, the stress barrier point 103a can be formed together with the manufacturing process of the array layer 105, so as to improve production efficiency and reduce costs. In addition, when the material of the stress barrier point 103a is the same as that of the array layer 105, the stress barrier layer 103 can be formed by the photolithography process.

[0062] Among them, the material of the stress barrier point 103a can also be an organic material. It should be noted that when the material of the stress barrier point 103a is an organic material, the stress barrier layer 103 cannot be formed by the photolithography process, and can only be formed by the inkjet printing process or the nozzle spraying process.

[0063] Please refer to Figure 5 , Figure 5 which is the fifth structural schematic diagram of the display panel provided by the embodiment of the present application. As Figure 5 shown, the stress barrier layer 103 provided by the embodiment of the present application is correspondingly arranged in one of the corner regions 101a.

[0064] Among them, the substrate 101 includes four corner regions 101a. It should be noted that only by correspondingly arranging the stress barrier layer 103 in one of the corner regions 101a can the effect of avoiding the fracture phenomenon of the display panel 10 be achieved.

[0065] Please refer to Figure 6 , Figure 6 which is the sixth structural schematic diagram of the display panel provided by the embodiment of the present application. Figure 6 The difference between the display panel shown in Figure 5 and the display panel shown in

[0066] is that the stress barrier layer 103 is correspondingly arranged in two diagonally arranged corner regions 101a.

[0067] It should be noted that by correspondingly arranging the stress barrier layer 103 in two diagonally arranged corner regions 101a, it can be ensured that the display panel 10 will not have a fracture phenomenon in the diagonal region where the two diagonally arranged corner regions 101a are located, so as to achieve the effect of avoiding cracks in the display panel 10 and improving the yield of the display panel 10.

[0067] Please refer to Figure 7 , Figure 7 which is the seventh structural schematic diagram of the display panel provided by the embodiment of the present application. Figure 7 The difference between the display panel shown in Figure 5 and the display panel shown in

[0068] It should be noted that chamfering treatment is required for all four corners of the display panel 10, and cracks may occur in the areas where the four corners of the display panel 10 are located. Therefore, stress blocking layers 103 are provided in the four corner areas 101a of the substrate 101, which can better avoid cracks in the display panel 10 and improve the yield of the display panel 10.

[0069] In the display panel provided by the embodiment of the present application, stress blocking layers are correspondingly provided in the corner areas of the substrate. Among them, when chamfering the display panel, there is stress superposition between the substrate and the cover plate, and the stress will conduct in the up and down directions in the form of waves. Due to the existence of the stress blocking layer, the stress will be blocked and released at the stress blocking layer, preventing the stress from continuing to approach the inside of the display panel, so as to effectively reduce the extension of microcracks generated by the interaction between the dicing wheel and the display panel along the grinding direction, achieving the effect of avoiding fracture of the display panel, avoiding the generation of cracks, and thus improving the yield of the display panel.

[0070] The embodiment of the present application also provides a manufacturing method of a display panel. Please refer to Figure 8 , Figure 8 is a schematic flow chart of the manufacturing method of the display panel provided by the embodiment of the present application. As Figure 8 shown, the manufacturing method of the display panel provided by the embodiment of the present application includes:

[0071] Step 101: Provide a substrate and a cover plate, wherein the substrate has a corner area.

[0072] Step 102: Form an adhesive layer and a stress blocking layer on the substrate, and the stress blocking layer is correspondingly provided in the corner area.

[0073] Step 103: Press the substrate and the cover plate together to form a display panel, and the substrate and the cover plate are arranged opposite to each other.

[0074] Among them, since the substrate and the cover plate need to be pressed together during the encapsulation process of the display panel. Therefore, the stress blocking layer can be provided on the substrate or on the cover plate, as long as after pressing, the stress blocking layer not only contacts the cover plate but also contacts the substrate.

[0075] Among them, when the stress blocking layer is provided on the cover plate, the stress blocking layer can only be formed by the photolithography process. When the stress blocking layer is provided on the substrate, the stress blocking layer can be formed by the photolithography process, the inkjet printing process, and the nozzle spraying process.

[0076] Among them, the above embodiments have described the display panel in detail. Therefore, in the embodiment of the present application, the display panel will not be elaborated too much.

[0077] In the method for manufacturing a display panel provided in the embodiment of the present application, a stress barrier layer is correspondingly disposed in the corner region of the substrate. Among them, when chamfering the display panel, there is stress superposition between the substrate and the cover plate, and the stress will conduct in the up and down directions in the form of waves. Due to the existence of the stress barrier layer, the stress will be blocked and released at the stress barrier layer, preventing the stress from continuing to approach the inside of the display panel, thereby effectively reducing the extension of microcracks generated by the interaction between the dicing wheel and the display panel along the grinding direction, achieving the effect of avoiding the fracture phenomenon of the display panel, avoiding the generation of cracks, and further improving the yield of the display panel.

[0078] The above has introduced in detail a display panel and a method for manufacturing a display panel provided in the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A display panel, characterized in that, Comprising: a substrate having a corner region; a cover plate disposed opposite to the substrate, an adhesive layer disposed between the substrate and the cover plate; a stress barrier layer disposed between the substrate and the cover plate and corresponding to the corner region; the stress barrier layer includes a first surface and a second surface disposed opposite to each other, the first surface is in contact with the substrate, and the second surface is in contact with the cover plate; the stress barrier layer includes a plurality of stress barrier points disposed at intervals, and the distance between two adjacent stress barrier points is equal; the shape of the stress barrier point is dot-shaped or water droplet-shaped.

2. The display panel according to claim 1, wherein the stress barrier layer is correspondingly disposed in one of the corner regions.

3. The display panel according to claim 1, wherein the stress barrier layer is correspondingly disposed in two diagonally disposed corner regions.

4. The display panel according to claim 1, wherein the stress barrier layer is correspondingly disposed in the four corner regions.

5. The display panel according to claim 1, wherein the spacing distance between the stress barrier layer and the adhesive layer is from 0 mm to 2 mm.

6. The display panel according to claim 1, wherein the material of the stress barrier point is an organic material.

7. The display panel according to claim 1, characterized in that, the display panel further includes an array layer disposed between the adhesive layer and the substrate, and the material of the stress barrier point is the same as that of the array layer.

8. A method for manufacturing a display panel, characterized in that, the manufacturing method includes: providing a substrate and a cover plate, wherein the substrate has a corner region; forming an adhesive layer and a stress barrier layer on the substrate, and the stress barrier layer is correspondingly disposed in the corner region; pressing the substrate and the cover plate to form the display panel, and the substrate and the cover plate are disposed opposite to each other; wherein the stress barrier layer includes a first surface and a second surface disposed opposite to each other, the first surface is in contact with the substrate, and the second surface is in contact with the cover plate; the stress barrier layer includes a plurality of stress barrier points disposed at intervals, and the distance between two adjacent stress barrier points is equal; the shape of the stress barrier point is dot-shaped or water droplet-shaped.

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