An OCXO

Abstract

The present invention discloses an OCXO, belonging to the technical field of OCXOs. In this OCXO, a housing and a conversion board form a receiving cavity for accommodating a temperature control component. The temperature control component is used to keep the temperature in the receiving cavity constant. A plurality of protrusions on the conversion board are used to support the temperature control component. A crystal is arranged in the area surrounded by the plurality of protrusions and the temperature control component, and the crystal is connected to the temperature control component. A first pad is provided on one side of the protrusion in contact with the temperature control component, and a second pad is provided on the other side. A through hole is vertically formed in the area of the protrusion that is neither the first pad nor the second pad, and a metal layer is electroplated on the inner wall of the through hole. The metal layer is electrically connected to the first pad and the second pad through a wire. Setting a wire between the metal layer and the first pad and the second pad can suddenly reduce the area of the heat conduction material, effectively increase the thermal resistance of the conversion board, reduce the heat loss in the receiving cavity, and further reduce the power required for the OCXO to ensure a constant temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of OCXO, and in particular to an OCXO. Background Art

[0002] As a temperature-controlled component with advantages such as high frequency, high frequency stability, and low phase noise, an OCXO (Oven Controlled Crystal Oscillator) is mainly used in equipment in fields such as mobile communication base stations, national defense, navigation, frequency counters, spectrum and network analyzers. To facilitate the application of OCXO in portable devices, OCXO is increasingly developing in the direction of light weight. Due to the working principle of internal temperature control of OCXO, in the actual application process, the thermostatic chamber must be isolated from the outside to increase the thermal resistance and improve the temperature control accuracy. Therefore, the OCXO temperature control component with heating needs to be first installed on the conversion board, and an isolation cavity is formed in cooperation with the housing, and then the OCXO is installed on the device through the conversion board.

[0003] In the existing conversion board, the conductive through holes directly connect the top pads and the bottom pads, resulting in a small thermal resistance of the conversion board, a fast heat dissipation in the OCXO, and a large power required for the OCXO to maintain a constant temperature.

[0004] Therefore, there is an urgent need to provide an OCXO to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide an OCXO, which solves the problem of small thermal resistance of the existing conversion board, reduces the heat loss of the OCXO, and further reduces the power required for the OCXO to maintain a constant temperature.

[0006] To achieve the above purpose, the following technical solutions are provided:

[0007] An OCXO, comprising:

[0008] A housing, with an opening on one side of the housing;

[0009] A conversion board, which covers the opening to form a receiving cavity;

[0010] A temperature control component for controlling the temperature in the receiving cavity to be constant; the conversion board is convexly provided with a plurality of protrusions in the vertical direction, and the plurality of protrusions are used to support the temperature control component; a first pad is provided on one side of the protrusion in contact with the temperature control component, and a second pad is provided on the other side; a through hole is opened in the vertical direction in the area of the protrusion other than the first pad and the second pad, and a metal layer is electroplated on the inner wall of the through hole, and the metal layer is electrically connected to the first pad and the second pad through a wire;

[0011] A crystal, connected to the temperature control component and disposed within the region enclosed by the plurality of protrusions and the temperature control component.

[0012] As an alternative embodiment of the above-mentioned OCXO, there are four protrusions, which are arranged at intervals along the circumferential direction of the conversion board, and each protrusion is disposed at a corner of the conversion board.

[0013] As an alternative embodiment of the above-mentioned OCXO, the first pad is located at one end of the protrusion along the first direction, and the through hole is located at the other end of the protrusion along the first direction.

[0014] As an alternative embodiment of the above-mentioned OCXO, the through hole is disposed on the side away from the temperature control component.

[0015] As an alternative embodiment of the above-mentioned OCXO, the centers of the through hole and the first pad are on the same straight line.

[0016] As an alternative embodiment of the above-mentioned OCXO, the centers of the first pad and the second pad are on the same straight line.

[0017] As an alternative embodiment of the above-mentioned OCXO, the first pad, the second pad and the metal layer are all made of copper material.

[0018] As an alternative embodiment of the above-mentioned OCXO, the conversion board is made of epoxy resin.

[0019] As an alternative embodiment of the above-mentioned OCXO, the temperature control component includes:

[0020] A temperature control board, disposed on the plurality of protrusions and electrically connected to the first pad;

[0021] A temperature sensor, disposed on the temperature control board for detecting the temperature within the accommodation cavity;

[0022] A heating element, disposed on the temperature control board for providing heat to the accommodation cavity;

[0023] The temperature sensor and the heating element are both electrically connected to the temperature control board, and the temperature control board controls the on and off of the heating element based on the temperature value fed back by the temperature sensor.

[0024] As an alternative embodiment of the above-mentioned OCXO, there are two heating elements, and the two heating elements are symmetrically arranged with respect to the temperature sensor.

[0025] Compared with the prior art, the beneficial effects of the present invention:

[0026] In an OCXO provided by the present invention, a housing and a conversion board form a receiving cavity for accommodating a temperature control component. The temperature control component is used to keep the temperature in the receiving cavity constant. A plurality of protrusions on the conversion board are used to support the temperature control component. A crystal is disposed in the area surrounded by the plurality of protrusions and the temperature control component, and the crystal is connected to the temperature control component. A first pad is provided on one side of the protrusion in contact with the temperature control component, and a second pad is provided on the other side. A through hole is vertically formed in the area of the protrusion other than the first pad and the second pad, and a metal layer is electroplated on the inner wall of the through hole. The metal layer is electrically connected to the first pad and the second pad through a wire. Arranging a wire between the metal layer and the first pad and the second pad can suddenly reduce the area of the heat conduction material, effectively increase the thermal resistance of the conversion board, reduce the heat loss in the receiving cavity, and further reduce the power required for the OCXO to ensure a constant temperature. Description of the Drawings

[0027] Figure 1 It is a schematic structural diagram of the OCXO in the embodiment of the present invention;

[0028] Figure 2 It is a top view of the conversion board in the embodiment of the present invention;

[0029] Figure 3 It is a right view of the conversion board in the embodiment of the present invention.

[0030] Reference Signs:

[0031] 1, housing; 2, conversion board; 3, temperature control component; 4, crystal;

[0032] 21, protrusion; 211, first pad; 212, second pad; 213, through hole; 214, wire;

[0033] 31, temperature control board; 32, temperature sensor; 33, heating element. Detailed Description of the Invention

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and illustrated herein can generally be arranged and designed in a variety of different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of the present invention.

[0036] It should be noted that like reference numerals and letters refer to like items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0038] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, the terms "set" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "under" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0040] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation on the present invention.

[0041] With the development of the times, the size of the OCXO is getting smaller and smaller, making it inconvenient to install with the device. Therefore, it is necessary to use a conversion board with a larger size to connect the small-sized OCXO to the device. However, the existing conversion board has a small thermal resistance, and the heat in the OCXO dissipates quickly, so the power required for the OCXO to maintain a constant temperature is relatively large. Therefore, as Figures 1 - 3 shown, this embodiment provides an OCXO to solve the above problems.

[0042] The OCXO includes a housing 1 and a conversion board 2. An opening is provided on one side of the housing 1, and the conversion board 2 covers the opening to form a receiving cavity. Optionally, arc chamfers are provided at the corners of each side wall of the housing 1 to prevent sharp edges from scratching the staff.

[0043] The OCXO further includes a temperature control component 3 for controlling the temperature in the receiving cavity to remain constant. The conversion board 2 is convexly provided with a plurality of protrusions 21 in the vertical direction (i.e., the X direction in the attached drawing), and the plurality of protrusions 21 are used to support the temperature control component 3.

[0044] The OCXO further includes a crystal 4, and the crystal 4 is connected to the temperature control component 3 and is arranged in the area surrounded by the plurality of protrusions 21 and the temperature control component 3.

[0045] A first pad 211 is provided on the side of the protrusion 21 in contact with the temperature control component 3, and a second pad 212 is provided on the other side. A through hole 213 is opened in the vertical direction in the area of the protrusion 21 other than the first pad 211 and the second pad 212. A metal layer is electroplated on the inner wall of the through hole 213, and the metal layer is electrically connected to the first pad 211 and the second pad 212 through a wire 214, so as to facilitate the electrical connection between the OCXO and the device. Moreover, arranging the wire 214 between the metal layer and the first pad 211 and the second pad 212 can suddenly reduce the heat conduction area, effectively increase the thermal resistance of the conversion board 2, reduce the heat loss in the receiving cavity, and further reduce the power required for the OCXO to maintain a constant temperature.

[0046] Among them, the temperature control component 3 includes a temperature control board 31, a temperature sensor 32, and a heating element 33. The temperature control board 31 is arranged on a plurality of protrusions 21 to form a region for accommodating the crystal 4. Moreover, the temperature control board 31 is electrically connected to the first pad 211, so as to facilitate the connection of the temperature control component 3 to the device through the conversion board 2. The temperature sensor 32 is arranged on the temperature control board 31 and is used to detect the temperature in the accommodation cavity. The heating element 33 is arranged on the temperature control board 31 and is used to provide heat to the accommodation cavity. Both the temperature sensor 32 and the heating element 33 are electrically connected to the temperature control board 31. The temperature control board 31 controls the on and off of the heating element 33 based on the temperature value feedback by the temperature sensor 32, so that the temperature in the accommodation cavity can be automatically adjusted. Further optionally, there are a plurality of heating elements 33. When the temperature in the accommodation cavity is lower than the set constant value, the plurality of heating elements 33 are turned on synchronously to improve the temperature control efficiency. However, if the number of heating elements 33 is too large, the temperature in the accommodation cavity will change too quickly and is extremely likely to exceed the set constant value. Therefore, in this embodiment, there are two heating elements 33. The two heating elements 33 are symmetrically arranged with respect to the temperature sensor 32, so that the temperature in the accommodation cavity is relatively uniform. Further, the heating element 33 can be a heating tube or a heating wire or other components with a heating function, and no limitation is made here.

[0047] Since the more the number of protrusions 21, the more the heat transfer paths of the OCXO. In order to reduce the heat loss in the accommodation cavity, it is necessary to minimize the number of protrusions 21 while ensuring the stability of the support of the protrusions 21 for the temperature control component 3. Therefore, in this embodiment, there are four protrusions 21, and the four protrusions 21 are arranged at intervals along the circumferential direction of the conversion board 2, and each protrusion 21 is arranged at the corner of the conversion board 2.

[0048] Optionally, the first pad 211 is located at one end of the protrusion 21 arranged along the first direction (i.e., the Y direction in the drawing), and the through hole 213 is located at the other end of the protrusion 21 arranged along the first direction. The above setting enables the first pad 211 and the through hole 213 to be respectively arranged at both ends of the protrusion 21, so as to extend the wire 214 connecting the first pad 211 and the through hole 213 as much as possible. Since the resistance is proportional to the length of the wire 214, the thermal resistance of the conversion board 2 is further increased.

[0049] Further optionally, the through hole 213 is arranged on the side far from the temperature control component 3 to reduce the heat dissipation in the accommodation cavity. If the through hole 213 is arranged on the side close to the temperature control component 3, the heat can directly be transferred from the temperature control component 3 to the outside through the through hole 213.

[0050] Further optionally, the centers of the through hole 213 and the first pad 211 are on the same straight line, so that the structure of the conversion board 2 is reasonable, the arrangement of the wire 214 is regular, and the aesthetics of the OCXO is improved.

[0051] Further optionally, the centers of the first pad 211 and the second pad 212 are on the same straight line, which not only makes the structure of the conversion board 2 reasonable, but also makes the lengths of the wire 214 connecting the first pad 211 and one end of the through hole 213 and the wire 214 connecting the second pad 212 and the other end of the through hole 213 equal, further improving the thermal resistance of the conversion board 2.

[0052] Further optionally, the first pad 211, the second pad 212 and the metal layer are all made of copper material to ensure the conduction of current between the first pad 211, the second pad 212 and the metal layer. The thermal conductivity of the copper material is close to 400 W / mK, indicating that the copper material has a good thermal conduction effect. Further optionally, the conversion board 2 is made of epoxy resin, and the conductivity of the epoxy resin is close to 2 W / mK, which is much smaller than the thermal conductivity of the copper material. When heat is transferred on the conversion board 2, most of the heat will be transferred to the outside through the copper material. Due to the huge gap in thermal conductivity between the two materials, the selection of the above two materials can further reduce the heat dissipation in the accommodation cavity while reducing the thermal conduction area at the connection between the first pad 211 and the through hole 213.

[0053] Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments only. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An OCXO, characterized in that, Comprising: A housing (1), one side of the housing (1) is provided with an opening; A conversion board (2), the conversion board (2) covers the opening to form a receiving cavity; A temperature control component (3) for controlling the temperature in the receiving cavity to remain constant; the conversion board (2) is convexly provided with a plurality of protrusions (21) in the vertical direction, and the plurality of protrusions (21) are used to support the temperature control component (3); a first solder pad (211) is provided on one side of the protrusion (21) in contact with the temperature control component (3), and a second solder pad (212) is provided on the other side; a through hole (213) is opened in the vertical direction in the area of the protrusion (21) other than the first solder pad (211) and the second solder pad (212), a metal layer is electroplated on the inner wall of the through hole (213), and the metal layer is electrically connected to the first solder pad (211) and the second solder pad (212) through a wire (214); the wire (214) can suddenly reduce the heat conduction area relative to the metal layer to increase the thermal resistance of the conversion board (2); A crystal (4), connected to the temperature control component (3) and disposed in the area surrounded by the plurality of protrusions (21) and the temperature control component (3).

2. The OCXO according to claim 1, wherein There are four protrusions (21), and the four protrusions (21) are arranged at intervals along the circumferential direction of the conversion board (2), and each protrusion (21) is disposed at the corner of the conversion board (2).

3. The OCXO according to claim 1, characterized in that, The first solder pad (211) is located at one end of the protrusion (21) arranged in the first direction, and the through hole (213) is located at the other end of the protrusion (21) arranged in the first direction.

4. The OCXO according to claim 3, characterized in that, The through hole (213) is disposed on the side away from the temperature control component (3).

5. The OCXO according to claim 1, characterized in that, The center of the through hole (213) and the center of the first solder pad (211) are on the same straight line.

6. The OCXO according to claim 1, wherein The centers of the first solder pad (211) and the second solder pad (212) are on the same straight line.

7. The OCXO according to claim 1, wherein The first solder pad (211), the second solder pad (212) and the metal layer are all made of copper material.

8. The OCXO according to claim 1, characterized in that, The conversion board (2) is made of epoxy resin.

9. The OCXO according to claim 1, wherein The temperature control component (3) includes: A temperature control board (31), disposed on the plurality of protrusions (21) and electrically connected to the first solder pad (211); A temperature sensor (32), disposed on the temperature control board (31) for detecting the temperature in the receiving cavity; A heating element (33), disposed on the temperature control board (31) for providing heat to the receiving cavity; The temperature sensor (32) and the heating element (33) are both electrically connected to the temperature control board (31), and the temperature control board (31) controls the opening and closing of the heating element (33) through the temperature value fed back by the temperature sensor (32).

10. The OCXO according to claim 9, characterized in that, There are two heating elements (33), and the two heating elements (33) are symmetrically arranged with respect to the temperature sensor (32).

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