Thin film circuit side patterning method, thin film circuit batch preparation method and system

Abstract

The present invention provides a thin-film circuit side patterning method, a thin-film circuit batch preparation method and a system, wherein the thin-film circuit side patterning method comprises: coating a nano-metal particle-organic coating on a laser-induced mother board, and air-drying the nano-metal particle-organic coating; placing the side of the laser-induced mother board coated with the air-dried nano-metal particle-organic coating close to the side of the substrate; using a laser to irradiate the side of the substrate with the laser-induced mother board according to a preset side circuit pattern, so that the nano-metal particles in the nano-metal particle-organic coating at the laser irradiation point are solidified on the side of the substrate to form a side circuit pattern; and removing the laser-induced mother board after laser irradiation. The present invention avoids the liquid nano-metal particle-organic coating directly contacting the substrate to contaminate the front circuit pattern and the back circuit pattern.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film circuit preparation, and in particular to a thin film circuit side patterning method, a thin film circuit batch preparation method and a system. Background Art

[0002] Thin Film Circuits (TFC) are electronic components made by using a thin film deposition process combined with photolithography and etching processes on alumina, aluminum nitride, microcrystalline glass, sapphire, quartz glass, ferrite, and microwave ceramic substrates to produce capacitors, resistors, inductors, microstrip lines, etc. Since thin film circuits are often used in microwave frequency bands, thin film circuits are also called microwave integrated circuits (MIC). Commonly used thin film circuits can only arrange circuit graphics on the front and back sides of the substrate. With the development of three-dimensional electronic component technology (Three-dimensional molded interconnect device or electronic assemblies, 3D-MID), thin film circuits are required to arrange circuit graphics not only on the front and back surfaces, but also on the sides, and the front, back, and side circuit graphics form electrical interconnections. Figure 1 As shown, the side width is equal to the thickness of the thin film circuit substrate, which is much smaller than the front and back dimensions. Therefore, it is much more difficult to prepare circuit patterns on the side than on the front and back.

[0003] The commonly used method for preparing side-patterned thin film circuits is photolithography-etching. This method first prepares circuit patterns on the front and back of the thin film circuit substrate through the process of photolithography-etching, then cuts the ceramic substrate into strips to expose the side that needs to be patterned, then deposits a metal film on the side, and then applies photoresist to the side, exposes and etches the side to achieve the patterning of the side. Patent CN102280407.A uses this method to prepare a side-patterned thin film circuit. This method has two major technical defects: first, no matter what kind of thin film deposition process is used, when the metal film is deposited on the side, a small amount of metal film will be deposited on the surface of the prepared front and back circuits, causing pollution of the front and back patterns; second, due to the small size of the side, the process of applying photoresist to the side is inconvenient to operate, and the uniformity of the side photoresist is poor, so it is not easy to mass produce, and it is also difficult to obtain a high-quality side circuit pattern.

[0004] Another commonly used method for side patterning is the "laser direct writing" method. This method first prepares circuit patterns on the front and back sides of the thin film circuit substrate, then cuts the ceramic substrate into strips to expose the side that needs to be patterned, then applies a coating containing metal particles on the side (the coating is generally a mixture of nano-metal particles and organic matter), and then uses a laser to irradiate the area on the side where the circuit needs to be formed. After the laser irradiation is completed, the laser-irradiated sample is cleaned in a certain organic solvent. In the area irradiated by the laser, the organic matter in the coating volatilizes, and the remaining nano-metal particles are solidified on the side under the action of the laser and cannot be washed away by the organic solvent; the coating in the unirradiated area dissolves in the organic solvent, and the nano-metal particles are also washed away together. This method utilizes the high precision of laser irradiation to improve the quality of the circuit pattern, but this method still requires the coating of the coating containing metal particles on the side of the substrate, and the coating process will still cause pollution to the front and back circuit patterns. Summary of the invention

[0005] The purpose of the present invention is to provide a thin film circuit side patterning method, a thin film circuit batch preparation method and system, which can prepare circuit patterns on the side of a substrate while reducing contamination of the front and back circuit patterns of a thin film circuit substrate.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] A thin film circuit side patterning method, comprising:

[0008] coating a nano-metal particle-organic coating on a laser-induced mother plate, and air-drying the nano-metal particle-organic coating;

[0009] The side of the laser-induced matrix coated with the air-dried nano-metal particles-organic coating is closely attached to the side of the substrate;

[0010] Using laser to irradiate the side of the substrate with the laser-induced mother board attached according to the preset side circuit pattern, so that the nano-metal particles in the nano-metal particle-organic coating at the laser irradiation point are solidified on the side of the substrate to form the side circuit pattern;

[0011] Remove the laser-induced master plate after laser irradiation.

[0012] Optionally, before coating the nano-metal particle-organic coating on the laser-induced mother plate and air-drying the nano-metal particle-organic coating, the method further includes:

[0013] A metal coating is coated on the laser induced mother board, and the metal coating is air-dried.

[0014] Optionally, the metal coating is molybdenum or chromium.

[0015] Optionally, the laser induced mother board is a polyethylene terephthalate plastic board.

[0016] Optionally, the metal in the nano metal particle-organic coating is silver or copper.

[0017] Optionally, the organic matter in the nano-metal particle-organic coating is one of polyvinyl alcohol, polyvinyl butyral or polyvinyl chloride.

[0018] A method for batch preparing thin film circuits, comprising:

[0019] According to the preset front circuit pattern, a front circuit pattern array is prepared on the upper surface of the substrate by using metal film deposition, photolithography and etching technology;

[0020] According to the preset back circuit pattern, a back circuit pattern array is prepared on the lower surface of the substrate by using metal film deposition, photolithography and etching technology; the positions of the plurality of back circuit patterns in the back circuit pattern array correspond one to one with the plurality of front circuit patterns in the front circuit pattern array;

[0021] Cutting the substrate having the front circuit pattern array and the back circuit pattern array according to the number of rows of the front circuit pattern array to obtain a plurality of sub-substrates;

[0022] Determine any sub-substrate as the current sub-substrate;

[0023] By using the above-mentioned thin film circuit side patterning method, a plurality of side circuit patterns are simultaneously prepared on the cut side of the current sub-substrate; the positions of the plurality of processed side circuit patterns correspond one-to-one to the positions of the plurality of front circuit patterns on the upper surface of the current sub-substrate; the cut side is a cut surface formed by cutting the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the rows of the front circuit pattern array;

[0024] The current sub-substrate prepared with a plurality of side circuit patterns is cut according to the number of columns of the front circuit pattern array to obtain a plurality of thin film circuits.

[0025] A thin film circuit batch preparation system, comprising:

[0026] A front circuit pattern array preparation module is used to prepare a front circuit pattern array on the upper surface of the substrate by using metal film deposition, photolithography and etching technology according to a preset front circuit pattern;

[0027] A back circuit pattern array preparation module is used to prepare a back circuit pattern array on the lower surface of the substrate according to a preset back circuit pattern by using metal film deposition, photolithography and etching technology; the positions of the plurality of back circuit patterns in the back circuit pattern array correspond one-to-one to the plurality of front circuit patterns in the front circuit pattern array;

[0028] A first cutting module is used to cut the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the number of rows of the front circuit pattern array to obtain a plurality of sub-substrates;

[0029] A current sub-substrate determination module, used to determine any sub-substrate as the current sub-substrate;

[0030] A side circuit pattern array preparation module, used to prepare a plurality of side circuit patterns on the cut side of the current sub-substrate simultaneously by using the above-mentioned thin film circuit side patterning method; the positions of the plurality of processed side circuit patterns correspond one to one with the positions of the plurality of front circuit patterns on the upper surface of the current sub-substrate; the cut side is a cutting surface formed by cutting the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the rows of the front circuit pattern array;

[0031] The second cutting module is used to cut the current sub-substrate prepared with multiple side circuit patterns according to the number of columns of the front circuit pattern array to obtain multiple thin film circuits.

[0032] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0033] The present invention provides a thin film circuit side patterning method, a thin film circuit batch preparation method and a system, wherein the thin film circuit side patterning method comprises: coating a nano metal particle-organic coating on a laser induced mother board and air drying the nano metal particle-organic coating; placing the side of the laser induced mother board coated with the air-dried nano metal particle-organic coating close to the side of the substrate; using a laser to irradiate the side of the substrate with the laser induced mother board according to a preset side circuit pattern, so that the nano metal particles in the nano metal particle-organic coating at the laser irradiation point are solidified on the side of the substrate to form a side circuit pattern; and removing the laser induced mother board after laser irradiation. The present invention coats a nano metal particle-organic coating on a laser induced mother board and air dries it, and uses a laser to solidify the nano metal particles in the nano metal particle-organic coating at the laser irradiation point on the side of the substrate to form a side circuit pattern; and avoids the liquid nano metal particle-organic coating directly contacting the substrate to contaminate the front circuit pattern and the back circuit pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0035] Figure 1 It is a schematic diagram of a side patterned thin film circuit in the background technology of the present invention;

[0036] Figure 2 This is a flow chart of a method for patterning the side of a thin film circuit in Embodiment 1 of the present invention;

[0037] Figure 3 This is a flow chart of a method for batch manufacturing of thin film circuits in Embodiment 2 of the present invention;

[0038] Figure 4 This is a schematic diagram of laser induced deposition in Example 2 of the present invention. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The purpose of the present invention is to provide a thin film circuit side patterning method, a thin film circuit batch preparation method and system, which can prepare circuit patterns on the side of a substrate while reducing contamination of the front and back circuit patterns of a thin film circuit substrate.

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Embodiment 1

[0043] like Figure 2 This embodiment provides a thin film circuit side patterning method, comprising:

[0044] Step 201: coating a nano-metal particle-organic coating on a laser-induced mother board, and air-drying the nano-metal particle-organic coating;

[0045] Step 202: placing the surface of the laser-induced matrix coated with the air-dried nano-metal particles-organic coating in close contact with the side surface of the substrate;

[0046] Step 203: using a laser to irradiate the side surface of the substrate with the laser-induced mother board attached thereto according to a preset side surface circuit pattern, so that the nano-metal particles in the nano-metal particle-organic coating at the laser irradiation location are solidified on the side surface of the substrate to form a side surface circuit pattern;

[0047] Step 204: removing the laser-induced mother board after laser irradiation.

[0048] Before step 201:, the method further includes:

[0049] A metal coating is coated on the laser induced mother board, and the metal coating is air-dried.

[0050] Specifically, the metal coating is molybdenum (Mo) or chromium (Cr).

[0051] Specifically, the laser-induced mother board is a polyethylene terephthalate plastic (PET) board.

[0052] Specifically, the metal in the nano metal particle-organic coating is silver or copper.

[0053] The organic matter in the nano-metal particle-organic coating is one of polyvinyl alcohol (PVA), polyvinyl butyral (PVB) or polyvinyl chloride (PVC).

[0054] Embodiment 2

[0055] like Figure 3 This embodiment provides a method for batch manufacturing of thin film circuits, comprising:

[0056] Step 301: preparing a front circuit pattern array on the upper surface of the substrate by using metal film deposition, photolithography and etching technology according to a preset front circuit pattern;

[0057] Step 302: According to the preset back circuit pattern, a back circuit pattern array is prepared on the lower surface of the substrate by using metal film deposition, photolithography and etching technology; the positions of the plurality of back circuit patterns in the back circuit pattern array correspond one to one with the plurality of front circuit patterns in the front circuit pattern array;

[0058] Step 303: cutting the substrate having the front circuit pattern array and the back circuit pattern array according to the number of rows of the front circuit pattern array to obtain a plurality of sub-substrates;

[0059] Step 304: Determine any sub-substrate as the current sub-substrate;

[0060] Step 305: using the thin film circuit side patterning method described in Example 1, a plurality of side circuit patterns are simultaneously prepared on the cut side of the current sub-substrate; the positions of the plurality of processed side circuit patterns correspond one-to-one to the positions of the plurality of front circuit patterns on the upper surface of the current sub-substrate; the cut side is a cut surface formed by cutting the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the rows of the front circuit pattern array;

[0061] Step 306: cutting the current sub-substrate prepared with a plurality of side circuit patterns according to the number of columns of the front circuit pattern array to obtain a plurality of thin film circuits.

[0062] In view of the shortcomings of the commonly used side patterning thin film circuit manufacturing methods, the present invention has developed a "laser induced deposition" method for preparing side patterns to overcome the shortcomings of the above two methods. Figure 4 The main technical points of the present invention are to first coat an organic coating containing nano-metal particles on the surface of the organic film, and then closely attach the organic film to the ceramic substrate (the surface containing the nano-metal coating is in contact with the ceramic substrate), and then irradiate the surface of the organic film with a laser. Under the action of the laser, the nano-metal particles are transferred and solidified on the ceramic substrate to form a circuit pattern. In order to improve the efficiency of laser irradiation, a metal film with a higher thermal effect, such as a Mo or Cr film, can be first deposited on the surface of the organic film.

[0063] The method for manufacturing a side patterned thin film circuit of the present invention is as follows:

[0064] Step 1: Prepare circuit patterns on the front and back of the circuit substrate through metal film deposition, photolithography, etching and other technologies.

[0065] Step 2: Cut the thin film circuit substrate obtained in the first step into strips to expose the side that needs to be patterned.

[0066] Step 3: Select PET film as the laser-induced matrix material and deposit metal films such as Mo or Cr on the PET film.

[0067] Step 4: coating the surface of the metal such as Mo or Cr of the PET film in step 3 with a coating composed of nano-metal particles and organic matter.

[0068] Step 5: Lay the coated surface of the PET film in step 4 together with the ceramic side.

[0069] Step 6: Use laser to irradiate the PET film. In the area irradiated by the laser, the nano-metal particles are transferred to the side of the substrate and solidified on the side of the ceramic under the action of the laser. In the area not irradiated by the laser, no metal particles are transferred and no circuit pattern is formed.

[0070] Step 7: Remove the PET film from the side and cut it into thin film circuit products with side patterning according to size specifications.

[0071] Embodiment 3

[0072] This embodiment provides a thin film circuit batch preparation system, including:

[0073] A front circuit pattern array preparation module is used to prepare a front circuit pattern array on the upper surface of the substrate by using metal film deposition, photolithography and etching technology according to a preset front circuit pattern;

[0074] A back circuit pattern array preparation module is used to prepare a back circuit pattern array on the lower surface of the substrate according to a preset back circuit pattern by using metal film deposition, photolithography and etching technology; the positions of the multiple back circuit patterns in the back circuit pattern array correspond one to one with the multiple front circuit patterns in the front circuit pattern array;

[0075] A first cutting module is used to cut the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the number of rows of the front circuit pattern array to obtain a plurality of sub-substrates;

[0076] A current sub-substrate determination module, used to determine any sub-substrate as the current sub-substrate;

[0077] A side circuit pattern array preparation module, used to prepare multiple side circuit patterns on the cut side of the current sub-substrate simultaneously by using the thin film circuit side patterning method described in the first embodiment; the positions of the multiple processed side circuit patterns correspond to the positions of the multiple front circuit patterns on the upper surface of the current sub-substrate one by one; the cut side is a cut surface formed by cutting the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the rows of the front circuit pattern array;

[0078] The second cutting module is used to cut the current sub-substrate prepared with multiple side circuit patterns according to the number of columns of the front circuit pattern array to obtain multiple thin film circuits.

[0079] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0080] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A method for patterning the side of a thin film circuit, characterized in that: The thin film circuit side patterning method comprises: A metal coating is coated on the laser-induced mother plate, and the metal coating is air-dried; the metal coating is molybdenum or chromium; the laser-induced mother plate is a polyethylene terephthalate plastic plate; A nano-metal particle-organic coating is coated on a laser-induced mother plate, and the nano-metal particle-organic coating is air-dried; the metal in the nano-metal particle-organic coating is silver or copper; the organic matter in the nano-metal particle-organic coating is one of polyvinyl alcohol, polyvinyl butyral ester or polyvinyl chloride; The side of the laser-induced matrix coated with the air-dried nano-metal particles-organic coating is closely attached to the side of the substrate; Using laser to irradiate the side of the substrate with the laser-induced mother board attached according to the preset side circuit pattern, so that the nano-metal particles in the nano-metal particle-organic coating at the laser irradiation point are solidified on the side of the substrate to form the side circuit pattern; Remove the laser-induced master plate after laser irradiation.

2. A method for batch preparation of thin film circuits, characterized in that: The thin film circuit batch preparation method comprises: According to the preset front circuit pattern, a front circuit pattern array is prepared on the upper surface of the substrate by using metal film deposition, photolithography and etching technology; According to the preset back circuit pattern, a back circuit pattern array is prepared on the lower surface of the substrate by using metal film deposition, photolithography and etching technology; the positions of the plurality of back circuit patterns in the back circuit pattern array correspond one to one with the plurality of front circuit patterns in the front circuit pattern array; Cutting the substrate having the front circuit pattern array and the back circuit pattern array according to the number of rows of the front circuit pattern array to obtain a plurality of sub-substrates; Determine any sub-substrate as the current sub-substrate; Using the thin film circuit side patterning method as claimed in claim 1, a plurality of side circuit patterns are simultaneously prepared on the cut side of the current sub-substrate; the positions of the plurality of side circuit patterns correspond one-to-one to the positions of the plurality of front circuit patterns on the upper surface of the current sub-substrate; the cut side is a cut surface formed by cutting the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the rows of the front circuit pattern array; The current sub-substrate prepared with a plurality of side circuit patterns is cut according to the number of columns of the front circuit pattern array to obtain a plurality of thin film circuits.

3. A thin film circuit batch preparation system, characterized in that: The thin film circuit batch preparation system comprises: A front circuit pattern array preparation module is used to prepare a front circuit pattern array on the upper surface of the substrate by using metal film deposition, photolithography and etching technology according to a preset front circuit pattern; A back circuit pattern array preparation module is used to prepare a back circuit pattern array on the lower surface of the substrate according to a preset back circuit pattern by using metal film deposition, photolithography and etching technology; the positions of the plurality of back circuit patterns in the back circuit pattern array correspond one-to-one to the plurality of front circuit patterns in the front circuit pattern array; A first cutting module is used to cut the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the number of rows of the front circuit pattern array to obtain a plurality of sub-substrates; A current sub-substrate determination module, used to determine any sub-substrate as the current sub-substrate; A side circuit pattern array preparation module, used to prepare a plurality of side circuit patterns on the cut side of the current sub-substrate simultaneously by using the thin film circuit side patterning method according to claim 1; the positions of the plurality of side circuit patterns correspond one-to-one to the positions of the plurality of front circuit patterns on the upper surface of the current sub-substrate; the cut side is a cutting surface formed by cutting the substrate prepared with the front circuit pattern array and the back circuit pattern array according to the rows of the front circuit pattern array; The second cutting module is used to cut the current sub-substrate prepared with multiple side circuit patterns according to the number of columns of the front circuit pattern array to obtain multiple thin film circuits.

Images