Multilayer ceramic electronic component and method for manufacturing the same

Abstract

The present disclosure provides a multilayer ceramic electronic component and a method for manufacturing a multilayer ceramic electronic component. The multilayer ceramic electronic component includes: a ceramic body, the ceramic body including a laminate, a first edge portion and a second edge portion, the laminate including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in a third direction, and the laminate including a dielectric layer and a first inner electrode and a second inner electrode stacked in the third direction, the dielectric layer being interposed between the first inner electrode and the second inner electrode; a first connecting portion and a second connecting portion. The first connecting portion includes a first lead electrode connected to the first inner electrode and the second connecting portion includes a second lead electrode connected to the second inner electrode.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0122208 filed on September 22, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multilayer ceramic electronic component. Background Art

[0003] Electronic components using ceramic materials (such as capacitors, inductors, piezoelectric elements, varistors, thermistors, etc.) include a ceramic body formed of ceramic material, internal electrodes formed in the ceramic body, and external electrodes mounted on the surface of the ceramic body to be connected to the internal electrodes.

[0004] As a method of forming the external electrodes, there is a method of applying a paste for external electrodes containing a conductive metal to a ceramic body that has already undergone a sintering process, and then sintering the ceramic body. Alternatively, there is a method of preparing a paste for external electrodes containing a conductive metal and a matrix resin, applying the paste to both end surfaces of the sintered ceramic body, and curing the ceramic body.

[0005] However, when forming the external electrodes by such a method, a process of sintering or curing the sintered ceramic body is required to form the external electrodes. As a result, there may be a problem of reduced productivity due to the complexity of the process steps.

[0006] Furthermore, the recent trend toward miniaturization of electronic products is also driving demands for multilayer ceramic electronic components to be smaller and have higher capacitance. However, thinning the external electrodes of multilayer ceramic electronic components to achieve this miniaturization and higher capacitance poses a problem, which makes it easier for external moisture, etc., to penetrate.

[0007] In particular, when forming a plating layer on an external electrode for board mounting, etc., defects may be caused in the electrode terminal and the internal structure of the main body due to penetration of the plating solution during the plating process. This has the problem of reduced reliability of the final product, especially the degradation of characteristics and failure during high-temperature / high-voltage operation. Summary of the Invention

[0008] An aspect of the present disclosure may provide a multilayer ceramic electronic component having excellent moisture-proof reliability.

[0009] Another aspect of the present disclosure may provide a multilayer ceramic electronic component that may simplify a production process.

[0010] Another aspect of the present disclosure may provide a multilayer ceramic electronic component that can be miniaturized.

[0011] According to one aspect of the present disclosure, a multilayer ceramic electronic component may include: a ceramic body including a laminate, a first edge portion, and a second edge portion; the laminate including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; the laminate including a dielectric layer and first and second internal electrodes stacked in the third direction, the dielectric layer interposed between the first and second internal electrodes; the first edge portion disposed on the third surface of the laminate, and the second edge portion disposed on the fourth surface of the laminate; a first connecting portion disposed on the first surface of the laminate; and a second connecting portion disposed on the second surface of the laminate. The first connecting portion may include a first lead electrode connected to the first internal electrode and a first ceramic layer disposed on the first lead electrode; and the second connecting portion may include a second lead electrode connected to the second internal electrode and a second ceramic layer disposed on the second lead electrode. The first lead electrode may be led to one surface of the first connecting portion in the third direction, and the second lead electrode may be led to one surface of the second connecting portion in the third direction.

[0012] According to another aspect of the present disclosure, a multilayer ceramic electronic component may include: a ceramic body including a laminate, a first edge portion, and a second edge portion; the laminate including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; the laminate including a dielectric layer and first and second internal electrodes stacked in the second direction, the dielectric layer interposed between the first and second internal electrodes, the first edge portion disposed on the fifth surface of the laminate, and the second edge portion disposed on the sixth surface of the laminate; a first connecting portion disposed on the first surface of the laminate; and a second connecting portion disposed on the second surface of the laminate. The first connecting portion may include a first lead electrode connected to the first internal electrode and a first ceramic layer disposed on the first lead electrode, and the second connecting portion may include a second lead electrode connected to the second internal electrode and a second ceramic layer disposed on the second lead electrode. The first lead electrode may be led to one surface of the first connecting portion in the third direction, and the second lead electrode may be led to one surface of the second connecting portion in the third direction.

[0013] According to another aspect of the present disclosure, a multilayer ceramic electronic component may include: a ceramic body including a laminate having a first internal electrode and a second internal electrode stacked therebetween, with a dielectric layer interposed therebetween; a first connecting portion including a first lead electrode connected to the first internal electrode and a first ceramic layer covering the first lead electrode and in contact with the ceramic body; and a second connecting portion including a second lead electrode connected to the second internal electrode and a second ceramic layer covering the second lead electrode and in contact with the ceramic body. One end of the first lead electrode may be led to one surface of the first connecting portion, and one end of the second lead electrode may be led to one surface of the second connecting portion.

[0014] According to another aspect of the present disclosure, a method for manufacturing a multilayer ceramic electronic component may include: forming a body including a laminate having a first inner conductive paste layer and a second inner conductive paste layer, the inner ceramic paste layer being interposed between the first inner conductive paste layer and the second inner conductive paste layer; forming a first conductive paste layer and a first ceramic paste layer covering the first conductive paste layer and in contact with the body on one surface of the body; forming a second conductive paste layer and a second ceramic paste layer covering the second conductive paste layer and in contact with the body on another surface of the body; and simultaneously sintering the body, the first conductive paste layer, the first ceramic paste layer, the second ceramic paste layer, and the second ceramic paste layer. A first lead electrode may be connected to the first inner electrode, the first lead electrode being formed by sintering using the first conductive paste layer, the first inner electrode being formed by sintering using the first inner conductive paste layer. A second lead electrode may be connected to the second inner electrode, the second lead electrode being formed by sintering using the second conductive paste layer, the second inner electrode being formed by sintering using the second inner conductive paste layer. An end portion of the first lead electrode may be exposed from the first ceramic layer, the first ceramic layer being formed by sintering using the first ceramic paste layer. An end portion of the second lead-out electrode may be exposed from a second ceramic layer formed using the second ceramic paste layer through sintering. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a schematic perspective view showing a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure;

[0017] Figure 2 It is along Figure 1 A cross-sectional view taken along line II';

[0018] Figure 3 It shows Figure 1 A schematic perspective view of a ceramic body;

[0019] Figure 4 It shows Figure 3 A schematic perspective view of a stacked body;

[0020] Figure 5 yes Figure 3 Front view when viewed in the X direction;

[0021] Figure 6 It shows Figure 1 a diagram of the interior of the first connecting portion;

[0022] Figure 7A yes Figure 2 An enlarged view of region A;

[0023] Figure 7B 、 Figure 8A 、 Figure 8B and Figure 9 It shows Figure 7A Schematic diagram of a variant form of;

[0024] Figure 10 is a schematic perspective view showing a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;

[0025] Figure 11 It is along Figure 10 A cross-sectional view taken along line II-II';

[0026] Figure 12 It shows Figure 10 a diagram of the interior of the first connecting portion;

[0027] Figure 13A yes Figure 11 An enlarged view of region B;

[0028] Figure 13B 、 Figure 14A 、 Figure 14B and Figure 15 It shows Figure 13A Schematic diagram of a variant form of;

[0029] Figure 16 is a schematic perspective view showing a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;

[0030] Figure 17 It is along Figure 16 A cross-sectional view taken along line III-III';

[0031] Figure 18 It shows Figure 16 A schematic perspective view of a ceramic body;

[0032] Figure 19 It shows Figure 18 A schematic perspective view of a stacked body;

[0033] Figure 20 It shows Figure 16 a diagram of the interior of the first connecting portion;

[0034] Figure 21A yes Figure 17 An enlarged view of region C;

[0035] Figure 21B 、 Figure 22A 、 Figure 22B and Figure 23 It shows Figure 21A Schematic diagram of a variant form of;

[0036] Figure 24 is a schematic perspective view showing a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;

[0037] Figure 25 It is along Figure 24 A cross-sectional view taken along line IV-IV';

[0038] Figure 26 It shows Figure 24 a diagram of the interior of the first connecting portion;

[0039] Figure 27A yes Figure 25 An enlarged view of region D;

[0040] Figure 27B 、 Figure 28A 、 Figure 28B and Figure 29 It shows Figure 27A Schematic diagram of a variant form of;

[0041] Figure 30 is a schematic perspective view showing a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;

[0042] Figure 31 It is along Figure 30 A cross-sectional view taken along line V-V';

[0043] Figure 32 It shows Figure 30 A schematic perspective view of a ceramic body;

[0044] Figure 33 It shows Figure 32 A schematic perspective view of a stacked body;

[0045] Figure 34 It shows Figure 30a diagram of the interior of the first connecting portion;

[0046] Figure 35A yes Figure 31 An enlarged view of region E;

[0047] Figure 35B 、 Figure 36A 、 Figure 36B and Figure 37 It shows Figure 35A Schematic diagram of a variant form of;

[0048] Figure 38 is a schematic perspective view showing a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;

[0049] Figure 39 It is along Figure 38 A cross-sectional view taken along line VI-VI';

[0050] Figure 40 It shows Figure 38 a diagram of the interior of the first connecting portion;

[0051] Figure 41A yes Figure 39 An enlarged view of region F;

[0052] Figure 41B 、 Figure 42A 、 Figure 42B and Figure 43 It shows Figure 41A Schematic diagram of a variant form of;

[0053] Figure 44 is a schematic perspective view showing a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;

[0054] Figure 45 It is along Figure 44 A cross-sectional view taken along line VII-VII';

[0055] Figure 46 It shows Figure 44 A schematic perspective view of a ceramic body;

[0056] Figure 47 It shows Figure 46 A schematic perspective view of a stacked body;

[0057] Figure 48 It shows Figure 44 a diagram of the interior of the first connecting portion;

[0058] Figure 49A yes Figure 45 An enlarged view of region G;

[0059] Figure 49B 、 Figure 50A 、 Figure 50B and Figure 51 It shows Figure 49A Schematic diagram of a variant form of;

[0060] Figure 52 is a schematic perspective view showing a multilayer ceramic electronic component according to another exemplary embodiment of the present disclosure;

[0061] Figure 53 It is along Figure 52 A cross-sectional view taken along line VIII-VIII';

[0062] Figure 54 It shows Figure 52 a diagram of the interior of the first connecting portion;

[0063] Figure 55A yes Figure 53 An enlarged view of region H;

[0064] Figure 55B 、 Figure 56A 、 Figure 56B and Figure 57 It shows Figure 55A ; and

[0065] Figure 58 is a graph measuring moisture absorption rates of multilayer ceramic electronic components according to exemplary embodiments and comparative examples of the present disclosure. DETAILED DESCRIPTION

[0066] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be understood that the techniques described in this specification are not limited to specific exemplary embodiments, but include various modifications, equivalents, and / or alternatives according to the exemplary embodiments of the present disclosure. Similar components will be represented by similar reference numerals throughout the drawings.

[0067] In addition, in the drawings, in order to clearly describe the present disclosure, parts irrelevant to the description will be omitted, the thicknesses of several layers and regions will be exaggerated for clarity, and components having the same functions within the scope of the same concept will be denoted by the same reference numerals.

[0068] In this specification, the expressions “having”, “may have”, “including”, “may include”, etc. indicate the existence of corresponding features (e.g., numerical values, functions, operations, components such as parts, etc.), and do not exclude the existence of additional features.

[0069] In this specification, expressions such as "A and / or B", "at least one of A and B", "one or more of A and B", etc. may include all possible combinations of the items listed together. For example, "A and / or B", "at least one of A and B", or "one or more of A and B" may mean all of the following: (1) the case where at least one A is included, (2) the case where at least one B is included, or (3) the case where both at least one A and at least one B are included.

[0070] In the drawings, the X direction refers to a first direction, L direction or length direction, the Y direction refers to a second direction, W direction or width direction, and the Z direction refers to a third direction, T direction or thickness direction.

[0071] The present disclosure relates to a multilayer ceramic electronic component 100 . Figures 1 to 9 is a schematic diagram illustrating a multilayer ceramic electronic component 100 according to an exemplary embodiment of the present disclosure. Figures 1 to 9 The multilayer ceramic electronic component 100 according to the present disclosure may include a ceramic body 110, a first connection portion 141, and a second connection portion 142. The ceramic body 110 includes a laminate 120, a first edge portion 131, and a second edge portion 132. The laminate 120 includes a first surface S1 and a second surface S2 opposite to each other in a first direction (X direction), a third surface S3 and a fourth surface S4 opposite to each other in a second direction (Y direction), and a fifth surface S5 and a sixth surface S6 opposite to each other in a third direction (Z direction), and includes a dielectric layer 111 and first and second internal electrodes 121 and 122 stacked in the third direction (Z direction), with the dielectric layer 111 interposed between the first and second internal electrodes 121 and 122. The first edge portion 131 is provided on the third surface S3 of the laminate 120, and the second edge portion 132 is provided on the fourth surface S4 of the laminate 120. The first connection portion 141 is provided on the first surface S1 of the stacked body 120 and the second connection portion 142 is provided on the second surface S2 of the stacked body 120 .

[0072] In this case, the first connection portion 141 may include a first extraction electrode 141a connected to the first internal electrode 121 and a first ceramic layer 141b disposed on the first extraction electrode 141a. The second connection portion 142 may include a second extraction electrode 142a connected to the second internal electrode 122 and a second ceramic layer 142b disposed on the second extraction electrode 142a. Furthermore, the first extraction electrode 141a and the second extraction electrode 142a may be respectively extended to any one surface of the first connection portion 141 and the second connection portion 142 in the third direction (Z direction). The surface to which the first extraction electrode 141a and the second extraction electrode 142a are extended may be the fifth surface S5 or the sixth surface S6 of the stacked body 120.

[0073] That is, the multilayer ceramic electronic component 100 according to the present exemplary embodiment may have a structure in which electrodes are led out to only any one of the six outer surfaces in the third direction (Z direction). In addition, when observing the multilayer ceramic electronic component 100 according to the present exemplary embodiment, the multilayer ceramic electronic component 100 may have a structure in which no electrodes are led out from the five surfaces, and only the ceramic is observed, and an electrode is led out from only one surface in the third direction (Z direction).

[0074] Reference Figure 2 , the first lead electrode 141a and the second lead electrode 142a may be guided through a surface (sixth surface S6) of the stack 120 in the third direction (Z direction), and may be arranged to be spaced apart from each other, with the ceramic body 110 interposed between the first lead electrode 141a and the second lead electrode 142a. Conventional multilayer ceramic electronic components use a structure in which an external electrode connected to an internal electrode is arranged to cover the head surface of the ceramic body. In this case, there are problems such as the occurrence of a gap between the ceramic body and the external electrode, or moisture penetration between the ceramic body and the external electrode. According to exemplary embodiments in the present disclosure, by significantly reducing the electrodes exposed to the outside, moisture penetration from the outside can be effectively prevented, and thus excellent moisture-proof reliability can be achieved.

[0075] In addition, with the prior art, internal stress may remain due to the difference in shrinkage behavior between the external electrodes and the ceramic body. As a result, there may be a problem of reduced mechanical strength of the electronic component itself. In the multilayer ceramic electronic component according to the present disclosure, the mechanical strength of the component itself can be improved by simultaneously sintering the ceramic body and electrodes through a single sintering process as described below without forming separate external electrodes. In addition, since separate external electrodes are not provided, the component itself can be miniaturized.

[0076] The first connection portion 141 of the multilayer ceramic electronic component 100 according to the present disclosure may include a first extraction electrode 141a and a first ceramic layer 141b. In addition, the second connection portion 142 may include a second extraction electrode 142a and a second ceramic layer 142b.

[0077] In an example of the present disclosure, the first ceramic layer 141b of the multilayer ceramic electronic component 100 may be provided to cover at least a portion of the first extraction electrode 141a, and the second ceramic layer 142b may be provided to cover at least a portion of the second extraction electrode 142a. The provision of the ceramic layer to cover at least a portion of the extraction electrode may mean that the ceramic layer is provided on at least a portion of the opposing surfaces of the first extraction electrode 141a and the second extraction electrode 142a (provided on the stacked body 120 of the multilayer ceramic electronic component 100 according to the present disclosure) in the first direction (X direction), and may mean that at least a portion of the first extraction electrode 141a and the second extraction electrode 142a and the ceramic layer are provided in contact with each other.

[0078] In another example, the first ceramic layer 141b of the multilayer ceramic electronic component 100 may be arranged to cover the first extraction electrode 141a, and the second ceramic layer 142b may be arranged to cover the second extraction electrode 142a. The ceramic layer being arranged to cover the extraction electrode may indicate a state in which, when the multilayer ceramic electronic component 100 according to the present disclosure is observed from a first direction (X direction), only the ceramic layer is visible, and the extraction electrode is hidden by the ceramic layer and is not visible. That is, the first ceramic layer 141b may be arranged to not expose the first extraction electrode 141a in the first direction, and the second ceramic layer 142b may be arranged to not expose the second extraction electrode 142a in the first direction (X direction). In this way, when the first ceramic layer 141b is arranged to cover the first extraction electrode 141a and the second ceramic layer 142b is arranged to cover the second extraction electrode 142a, the area of ​​the extraction electrode exposed to the outside can be reduced, thereby significantly reducing the external moisture penetration path.

[0079] In addition, the first ceramic layer 141b of the multilayer ceramic electronic component 100 according to the exemplary embodiment of the present disclosure may be provided to cover the first surface S1 of the laminate 120, and the second ceramic layer 142b may be provided to cover the second surface S2 of the laminate 120. Therefore, the first extraction electrode 141a may be provided to contact the first surface S1 of the laminate 120, and the first ceramic layer 141b may be provided to cover the first extraction electrode 141a. Furthermore, the second extraction electrode 142a may be provided to contact the second surface S2 of the laminate 120, and the second ceramic layer 142b may be provided to cover the second extraction electrode 142a. That is, the first extraction electrode 141a may be provided on the first surface S1 of the laminate 120 and may be provided to be connected to the first internal electrode 121, and the second extraction electrode 142a may be provided on the second surface S2 of the laminate 120 and may be provided to be connected to the second internal electrode 122.

[0080] In an exemplary embodiment of the present disclosure, the maximum value of the width of the first lead electrode 141a and / or the second lead electrode 142a of the multilayer ceramic electronic component 100 in the second direction (Y direction) may be less than the maximum value of the width of the ceramic body 110 in the second direction (Y direction). Figure 6 FIG. Figure 6 is a schematic cross-sectional view showing a first connection portion 141 according to an exemplary embodiment of the present disclosure. In the present specification, Figure 6 the description of the first connection portion 141 may also be equally applicable to the second connection portion 142. Referring to Figure 1 and Figure 6 , the maximum value W2 of the width of the first lead electrode 141a of the first connection portion 141 and / or the second lead electrode 142a of the second connection portion 142 in the second direction (Y direction) may be less than the maximum value W1 of the width of the ceramic body 110 in the second direction (Y direction). That is, the relationship of W2 < W1 may be satisfied. When the maximum value of the width of the first lead electrode 141a and / or the second lead electrode 142a in the second direction (Y direction) is less than the maximum value of the width of the ceramic body 110 in the second direction (Y direction), the first lead electrode 141a and / or the second lead electrode 142a may not be exposed in the second direction (Y direction) of the multilayer ceramic electronic component 100 according to the present disclosure, thereby further improving the moisture resistance.

[0081] At this time, as described above, when the first ceramic layer 141b is provided to cover the first lead electrode 141a and the second ceramic layer 142b is provided to cover the second lead electrode 142a, the width of the first ceramic layer 141b and / or the second ceramic layer 142b in the second direction (Y direction) may be equal to the maximum value W1 of the width of the ceramic body 110 in the second direction (Y direction). That is, the first ceramic layer 141b and the second ceramic layer 142b may be provided on the opposite surfaces of the ceramic body 110 in the first direction, and may be provided to cover at least the entire width direction of the ceramic body 110.

[0082] In an example, the maximum value of the height of the first lead electrode 141a and / or the second lead electrode 142a according to the present disclosure in the third direction (Z direction) may be less than the maximum value of the height of the ceramic body 110 in the third direction (Z direction). Referring to Figure 1 and Figure 6, the maximum value H2 of the height of the first lead electrode 141a of the first connection portion 141 and / or the second lead electrode 142a of the second connection portion 142 in the third direction (Z direction) can be smaller than the maximum value H1 of the height of the ceramic body 110 in the third direction (Z direction). That is to say, the relationship of H2 < H1 can be satisfied. When the maximum value of the height of the first lead electrode 141a and / or the second lead electrode 142a in the third direction (Z direction) is smaller than the maximum value of the height of the ceramic body 110 in the third direction (Z direction), the possibility of moisture penetration can be reduced by exposing only the first lead electrode 141a and / or the second lead electrode 142a to one surface of the multilayer ceramic electronic component 100 according to the present disclosure in the third direction (Z direction).

[0083] When the first ceramic layer 141b is provided to cover the first lead electrode 141a and the second ceramic layer 142b is provided to cover the second lead electrode 142a as described above, the height of the first ceramic layer 141b and / or the second ceramic layer 142b in the third direction (Z direction) can be equal to the maximum value H1 of the height of the ceramic body 110 in the third direction (Z direction). That is to say, the first ceramic layer 141b and the second ceramic layer 142b can be provided on opposite surfaces of the ceramic body 110 in the first direction, and can be provided to cover at least the entire thickness direction of the ceramic body 110.

[0084] In addition, in the examples of the present disclosure, when the first ceramic layer 141b is provided to cover the first lead electrode 141a and the second ceramic layer 142b is provided to cover the second lead electrode 142a, the first ceramic layer 141b and the second ceramic layer 142b can be provided to cover opposite surfaces of the ceramic body 110 in the first direction (X direction).

[0085] In an exemplary embodiment of the present disclosure, the ceramic body 110 of the multilayer ceramic electronic component 100 according to the present disclosure can include a laminate 120, a first edge portion 131, and a second edge portion 132.

[0086] The shape of the ceramic body 110 is not particularly limited, but can be a hexahedron shape or a shape similar to a hexahedron shape, as shown. Although the ceramic body 110 does not have a completely straight hexahedron shape due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the sintering process, the ceramic body 110 can substantially have a hexahedron shape. If necessary, the ceramic body 110 can be rounded so that its edges are not angled. The rounding process can be, for example, barrel polishing, etc., but is not limited thereto.

[0087] The dielectric layer 111, the first internal electrode 121, and the second internal electrode 122 may be alternately stacked in the laminate 120 of the multilayer ceramic electronic component 100 according to the present disclosure. The dielectric layer 111, the first internal electrode 121, and the second internal electrode 122 may be stacked in the third direction (Z direction). The plurality of dielectric layers 111 forming the laminate 120 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other so that the boundaries therebetween are not easily distinguished without using a scanning electron microscope (SEM).

[0088] According to the exemplary embodiments of the present disclosure, the raw material of the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or a material composed of (Ba 1-x Ca x )(Ti 1-y (Zr,Sn,Hf) y )O3 (here, 0≤x≤1 and 0≤y≤0.5). In addition, according to the purpose of the present disclosure, the material of the dielectric layer 111 can be prepared by adding various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. to powder such as barium titanate (BaTiO3) powder.

[0089] The dielectric layer 111 can be formed by adding additives to a slurry including the above materials as needed, coating the slurry on a carrier film, and then drying the slurry to prepare a plurality of ceramic sheets. The ceramic sheets can be formed by forming the slurry into a sheet shape having a thickness of several micrometers using a doctor blade method, but are not limited thereto.

[0090] The first and second internal electrodes 121 and 122 may be stacked such that end surfaces thereof are respectively exposed to opposite ends of the ceramic body 110. Specifically, the first and second internal electrodes 121 and 122 may be respectively exposed to opposite surfaces of the ceramic body 110 in a first direction (X direction), the first internal electrode 121 may be exposed to the first surface S1 of the ceramic body 110, and the second internal electrode 122 may be exposed to the second surface S2 of the ceramic body 110.

[0091] The material of each of the first and second internal electrodes 121 and 122 is not particularly limited, but may be a conductive paste including one or more conductive metals such as silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0092] The laminate 120 may be formed by alternately stacking ceramic green sheets having the first internal electrodes 121 printed thereon and ceramic green sheets having the second internal electrodes 122 printed thereon on the dielectric layer 111 in the third direction (Z direction). The first and second internal electrodes 121 and 122 may be printed by screen printing, gravure printing, or the like, but are not limited thereto.

[0093] The first edge portion 131 and the second edge portion 132 may include a ceramic material, such as a barium titanate (BaTiO3)-based ceramic material. The first edge portion 131 and the second edge portion 132 may be formed by applying a slurry including a ceramic material in the second direction (Y direction) of the stacked body 120, or by attaching a single dielectric layer or two or more dielectric layers in the second direction (Y direction). The first edge portion 131 and the second edge portion 132 may be used to prevent damage to the internal electrodes due to physical or chemical stress.

[0094] In a multilayer ceramic electronic component according to an exemplary embodiment of the present disclosure, first connection portion 141 and second connection portion 142 may be respectively provided on opposing surfaces of ceramic body 110 in a first direction (X direction). First connection portion 141 and second connection portion 142 may have sizes and areas corresponding to opposing surfaces of ceramic body 110 in the first direction (X direction). As described above, first connection portion 141 may be provided to cover the first surface of laminated body 120, and second connection portion 142 may be provided to cover the second surface of laminated body 120.

[0095] The first connection portion 141 may include a first extraction electrode 141a, and the second connection portion 142 may include a second extraction electrode 142a. The first extraction electrode 141a may be connected to the first internal electrode 121, and the second extraction electrode 142a may be connected to the second internal electrode 122. The material of each of the first extraction electrode 141a and the second extraction electrode 142a is not particularly limited, but may be a conductive paste including one or more conductive metals such as silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0096] In this case, desired characteristics can be achieved by adjusting the conductive metal composition included in the first and second lead electrodes 141a and 142a. For example, when the first and second lead electrodes 141a and 142a include the same metal composition as the first and second internal electrodes 121 and 122, the connectivity between each lead electrode and each internal electrode can be improved. In addition, in order to adjust the shrinkage rate during sintering or adjust the internal stress after sintering, the first and second lead electrodes 141a and 142a may include a different composition from the first and second internal electrodes 121 and 122 as needed.

[0097] The first connection portion 141 may include a first ceramic layer 141b, and the second connection portion 142 may include a second ceramic layer 142b. The first ceramic layer 141b and the second ceramic layer 142b may include a ceramic material such as a barium titanate (BaTiO3)-based ceramic material. The barium titanate (BaTiO3)-based ceramic material may be made of, for example, (BaTiO3). 1-x Ca x )(Ti 1-y (Zr,Sn,Hf) y )O3 (here, 0≤x≤1 and 0≤y≤0.5).

[0098] In this case, the first ceramic layer 141b and / or the second ceramic layer 142b may include a ceramic composition that is the same as or different from the composition of the dielectric layer 111 of the stacked body 120 in order to achieve desired characteristics. For example, when the first ceramic layer 141b and the second ceramic layer 142b include the same ceramic composition as the ceramic composition of the dielectric layer of the stacked body 120, similar sintering behavior may be exhibited, thereby reducing internal stress in the finished component.

[0099] In another example of the present disclosure, the first ceramic layer 141b and / or the second ceramic layer 142b of the first connection portion 141 and / or the second connection portion 142 of the multilayer ceramic electronic component 100 according to the present disclosure may include a ceramic component having a composition different from that of the dielectric layer 111 of the laminate 120. The first lead electrode 141a of the first connection portion 141 and the second lead electrode 142a of the second connection portion 142 may be connected to the first internal electrode 121 and the second internal electrode 122, respectively. On the other hand, the first ceramic layer 141b of the first connection portion 141 and the second ceramic layer 142b of the second connection portion 142 do not contribute to the formation of capacitance and are sufficient to perform the function of blocking external physical or chemical stress. Therefore, by adjusting the composition of the first ceramic layer 141b and / or the second ceramic layer 142b, the density and average grain size of the grains can be adjusted, thereby more effectively preventing moisture penetration. When the first ceramic layer 141b and / or the second ceramic layer 142b include a ceramic component having a composition different from that of the dielectric layer 111 of the laminate 120, whether components such as Na, Li, B, and / or Mg are included and their contents may be adjusted, but this is merely an example and not limited thereto. According to an example, the first edge portion 131 and the second edge portion 132 may be in contact with the first ceramic layer 141b and the second ceramic layer 142b.

[0100] The method of manufacturing the multilayer ceramic electronic component according to the present disclosure is not particularly limited, but the multilayer ceramic electronic component can be manufactured by, for example, forming the first edge portion 131 on the third surface S3 of the laminate 120, forming the second edge portion 132 on the fourth surface S4, and then forming the first connection portion 141 and the second connection portion 142. The first connection portion 141 and the second connection portion 142 can be manufactured by applying and drying a conductive paste on opposing surfaces of the ceramic body 110 in the first direction (X direction) to form the first extraction electrode 141a and the second extraction electrode 142a, applying and drying a ceramic paste for forming the first ceramic layer 141b and the second ceramic layer 142b on the dried conductive paste, and then sintering the ceramic paste, or by transferring a ceramic sheet for forming the first ceramic layer 141b and the second ceramic layer 142b onto the dried conductive paste and then sintering the ceramic sheet. Alternatively, the first connection portion 141 and the second connection portion 142 may be manufactured by printing the lead electrodes on a ceramic sheet, then attaching the lead electrodes to opposing surfaces of the ceramic body 110 in the first direction (X direction), and sintering the lead electrodes. As described above, the multilayer ceramic electronic component 100 according to the present disclosure can be manufactured through a single sintering process after forming the first connection portion 141 and the second connection portion 142 on the ceramic body 110. Since a sintering process for forming separate external electrodes is not required, the process can be simplified.

[0101] According to a variation of the present disclosure, the first connection portion 141 of the multilayer ceramic electronic component 100 of the present disclosure may include a first auxiliary electrode 141c disposed in contact with the first extraction electrode 141a', and the second connection portion 142 may include a second auxiliary electrode disposed in contact with the second extraction electrode. In this case, the first auxiliary electrode 141c may be extracted together with the first extraction electrode 141a', and the second auxiliary electrode may be extracted together with the second extraction electrode. Figure 7B 1 is an enlarged view showing the first connection portion 141 of the present modification. Figure 7B The content shown can be applied to the second connection portion 142 in the same manner. Figure 7B , the first auxiliary electrode 141c may be arranged to contact the first extraction electrode 141a', and the first ceramic layer 141b' may be arranged to cover the first extraction electrode 141a' and the first auxiliary electrode 141c. Figure 7B When the auxiliary electrode shown in FIG. 1 is provided, the electrical characteristics can be improved by increasing the contact area with the outer plating layer (to be described later) by utilizing the size of the auxiliary electrode.

[0102] The method of forming the auxiliary electrode is not particularly limited, but the auxiliary electrode can be formed by forming a step on the lower side of the first ceramic layer 141b and the second ceramic layer 142b and applying the extraction electrode paste to the step. In addition, an example of the method of forming the auxiliary electrode may include a method of forming the auxiliary electrode by printing the first ceramic layer 141b and the second ceramic layer 142b in a two-layer structure, applying and drying a conductive paste on one layer of each of the first ceramic layer 141b and the second ceramic layer 142b, and attaching the first ceramic layer 141b and the second ceramic layer 142b to a stacked body, but is not limited thereto.

[0103] According to another variation of the present disclosure, the multilayer ceramic electronic component 100 of the present disclosure may include a first terminal electrode 151a connected to the first extraction electrode 141a and a second terminal electrode connected to the second extraction electrode 142a. In this case, the first terminal electrode 151a and the second terminal electrode may be arranged to be spaced apart from each other on the surface from which the first extraction electrode 141a and the second extraction electrode 142a are extracted. Figure 8A 1 is an enlarged view showing the first connection portion 141 of the present modification. Figure 8A The contents shown in FIG. 1 and FIG. 2 are also applicable to the second connection portion 142. Figure 8A , a first terminal electrode 151a connected to the first lead-out electrode 141a may be provided, and an outer plating layer to be described later may be provided on the first terminal electrode 151a. Figure 8A When the terminal electrodes are provided as shown in , the outer plating layer and the like can be formed in a large size, and therefore, excellent adhesion can be obtained when mounting the substrate.

[0104] The terminal electrodes may be formed, for example, by coating terminal electrode paste on the lead portions of the first lead electrode 141a and the second lead electrode 142a, or by coating terminal electrode paste or powder on the first lead electrode 141a and the second lead electrode 142a of the ceramic body 110 that has been sintered and sintering the terminal electrode paste or powder by a method such as induction heating, but is not limited thereto.

[0105] According to another variation of the present disclosure, the first connection portion 141 of the multilayer ceramic electronic component 100 of the present disclosure may include a first auxiliary electrode 141c disposed in contact with the first extraction electrode 141a', and the second connection portion 142 may include a second auxiliary electrode disposed in contact with the second extraction electrode. The multilayer ceramic electronic component 100 of the present disclosure may include a first terminal electrode 151a connected to the first extraction electrode 141a' and a second terminal electrode connected to the second extraction electrode. In this case, the first terminal electrode 151a and the second terminal electrode may be disposed spaced apart from each other on the surface from which the first extraction electrode 141a' and the second extraction electrode are extracted. Figure 8B 1 is an enlarged view showing the first connection portion 141 of the present modification. Figure 8B The contents shown in FIG. 1 can be applied to the second connection portion 142 in the same manner. Figure 8B , the first connection portion 141 may include a first auxiliary electrode 141c disposed in contact with the first extraction electrode 141a', and the first extraction electrode 141a' and the first auxiliary electrode 141c may be led to the same surface of the multilayer ceramic electronic component 100. In addition, the first terminal electrode 151a may be disposed to cover the first extraction electrode 141a' and the first auxiliary electrode 141c. When the auxiliary electrode and the terminal electrode are as shown Figure 8B When provided together as shown in , electrical characteristics can be improved and board mountability can be improved.

[0106] In an example, the multilayer ceramic electronic component 100 according to the present disclosure may include a first plating layer 151 (or 151 b ) disposed on the first extraction electrode 141 a and a second plating layer 152 disposed on the second extraction electrode 142 a . Figure 1 、 Figure 2 and Figures 7A to 8B The multilayer ceramic electronic component 100 according to this example is shown. In the multilayer ceramic electronic component 100 according to the above example, the first connection portion 141 and the second connection portion 142 may have the same structure to be symmetrical with each other. Figure 1 、 Figure 2 and Figures 7A to 8B, the first plating layer 151 (or 151b) may be provided on the first extraction electrode 141a. In this case, when the first auxiliary electrode 141c and / or the first terminal electrode 151a are formed, the first plating layer 151 (or 151b) may be provided to cover the first extraction electrode 141a, the first auxiliary electrode 141c and / or the first terminal electrode 151a. The plating layer may include one or more selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof, but is not limited thereto. The plating layer may be formed as a single layer or multiple layers and may be formed by sputtering or electroplating, but is not limited thereto.

[0107] In a modified form of the present disclosure, the multilayer ceramic electronic component 100 according to the present disclosure may expose at least portions of the first lead electrode 141a' and the second lead electrode in a first direction (X direction), and may include a first connecting electrode 141d configured to cover the first lead electrode 141a' and the first ceramic layer 141b' and a second connecting electrode configured to cover the second lead electrode and the second ceramic layer. Figure 9 1 is a diagram showing the first connection portion 141 of the present modification. Figure 9 The content shown can be applied to the second connection portion 142 in the same manner. Figure 9 , a portion of the first ceramic layer 141b' may be removed, and the first extraction electrode 141a may be exposed in the first direction (X direction) to the position where the first ceramic layer 141b' is removed. The first connection electrode 141d of this modified form may be provided to cover both the exposed first extraction electrode 141a' and the first ceramic layer 141b' from which a portion of the area is removed. When the connection portion has a Figure 9 In the illustrated shape, the multilayer ceramic electronic component 100 according to the present disclosure may be applied to a structure mounted through a side surface.

[0108] The first connection electrode 141d and the second connection electrode may be formed before or after sintering the ceramic body 110. Examples of methods for forming the connection electrodes before sintering the ceramic body 110 include, for example, a method of partially forming the first and second ceramic layers and the first and second connection electrodes 141d and 141d on the first and second lead electrodes 141a' and 141b', and then sintering the first and second ceramic layers, but are not limited thereto. Additionally, examples of methods for forming the connection electrodes after sintering the ceramic body 110 include, but are not limited to, a method of naturally removing some areas of the first and second ceramic layers using a high-carbon adhesive during the sintering process and then forming the connection electrodes on the exposed lead electrodes.

[0109] According to another exemplary embodiment of the present disclosure, the first and second lead electrodes 241 a and 242 a of the multilayer ceramic electronic component 200 of the present disclosure may be led out to opposite surfaces of the ceramic body 210 in the third direction (Z direction). Figures 10 to 15 is a schematic diagram illustrating a multilayer ceramic electronic component 200 according to this exemplary embodiment. Figures 10 to 15 In the multilayer ceramic electronic component 200 according to this exemplary embodiment, the first connection portion 241 and the second connection portion 242 may be disposed on opposing surfaces of the laminate (including the dielectric layer 211, the first internal electrode 221, and the second internal electrode 222) in a first direction (X direction), wherein the first edge portion 231 and the second edge portion 232 are disposed on opposing surfaces of the laminate in a second direction (Y direction). Here, the first connection portion 241 may include a first lead electrode 241a and a first ceramic layer 241b, and the second connection portion 242 may include a second lead electrode 242a and a second ceramic layer 242b, and the first lead electrode 241a and the second lead electrode 242a may be respectively led to opposing surfaces of the laminate in a third direction (Z direction). That is, the multilayer ceramic electronic component 200 according to this exemplary embodiment may have a structure in which lead electrodes of the same polarity are respectively led to two locations (i.e., the lead electrodes are led to a total of four locations).

[0110] In this exemplary embodiment, the maximum width W4 of the first lead electrode 241a and / or the second lead electrode 242a of the multilayer ceramic electronic component 200 in the second direction (Y direction) may be smaller than the maximum width W3 of the ceramic body 210 in the second direction (Y direction).

[0111] In an example, the maximum value H4 of the height of the first extraction electrode 241a and the second extraction electrode 242a in the third direction (Z direction) of the multilayer ceramic electronic component 200 according to the present disclosure may be equal to the maximum value H3 of the height of the ceramic body 210 in the third direction (Z direction). In this specification, the meaning of the same specific length, width and / or height is based on the premise of including an error range. Here, the error range may mean that |H4-H3| / H3 or |H4-H3| / H4 is, for example, 3% or less, 2% or less, or 1% or less, but is not limited thereto. The descriptions of the maximum value W4 of the width of the first lead electrode 241a and / or the second lead electrode 242a in the second direction (Y direction), the maximum value W3 of the width of the ceramic body 210 in the second direction (Y direction), the maximum value H4 of the height of the first lead electrode 241a and the second lead electrode 242a in the third direction (Z direction), the maximum value H3 of the height of the ceramic body 210 in the third direction (Z direction), and the height and width of the first ceramic layer 241b and the second ceramic layer 242b in the third direction (Z direction) and the second direction (Y direction) are the same as the above descriptions and will therefore be omitted.

[0112] The modifications described above are also applicable to the present exemplary embodiment. Figures 13B to 15 2 is a schematic diagram showing a modified form of the first connection portion 241 . Figures 13B to 15 The shape and structure of the first connection portion 241 shown in FIG. 24 can be similarly applied to all the connection portions arranged at four positions of this exemplary embodiment. Figures 13B to 15 According to the present modification, the first connection portion 241 of the multilayer ceramic electronic component 200 may include a first auxiliary electrode 241c provided in contact with the first extraction electrode 241a', and the second connection portion 242 may include a second auxiliary electrode provided in contact with the second extraction electrode.

[0113] According to another modification, the multilayer ceramic electronic component 200 of the present disclosure may include a first terminal electrode 251 a connected to the first lead-out electrode 241 a and a second terminal electrode connected to the second lead-out electrode.

[0114] According to another variation of the present disclosure, the first connection portion 241 of the multilayer ceramic electronic component 200 of the present disclosure may include a first auxiliary electrode 241c disposed in contact with the first extraction electrode 241a', and the second connection portion may include a second auxiliary electrode disposed in contact with the second extraction electrode. The multilayer ceramic electronic component 200 of the present disclosure may include a first terminal electrode 251a connected to the first extraction electrode 241a' and a second terminal electrode connected to the second extraction electrode. In this case, the first terminal electrode 251a and the second terminal electrode may be disposed spaced apart from each other on the surface from which the first extraction electrode 241a' and the second extraction electrode are extracted.

[0115] In another variant form of the present disclosure, the multilayer ceramic electronic component 200 of the present disclosure may expose at least a portion of the first lead electrode 241a' and the second lead electrode in the first direction (X direction), and may include a first connecting electrode 241d configured to cover the first lead electrode 241a' and the first ceramic layer 241b', and a second connecting electrode configured to cover the second lead electrode and the second ceramic layer.

[0116] In addition, the multilayer ceramic electronic component 200 according to the present disclosure may include plating layers 251 (or 251b), 252, 253, and 254, respectively, disposed on each extraction electrode. The description of the extraction electrode, ceramic layer, auxiliary electrode, terminal electrode, plating layer, and connection electrode is the same as that described above and will be omitted.

[0117] In one example, the multilayer ceramic electronic component 100 according to the present disclosure may have a length in a first direction (X direction) greater than a width in a second direction (Y direction). Figures 1 to 15 Multilayer ceramic electronic components 100 and 200 based on the structure of this example are shown. This example structure is a structure where the length in the first direction (X direction) is greater than the width in the second direction (Y direction), and corresponds to a structure where electrodes connected to the outside are provided at both ends in the first direction (X direction), i.e., a so-called MLCC structure. When the multilayer ceramic electronic component according to the present disclosure has this structure, the capacity can be significantly increased while improving moisture resistance reliability.

[0118] In another example, the multilayer ceramic electronic component 300 according to the present disclosure may have a length in the first direction (X direction) smaller than a width in the second direction (Y direction). Figures 16 to 23 is a diagram showing a multilayer ceramic electronic component 300 according to this example. Figures 16 to 23 The multilayer ceramic electronic component 300 of this example may have a structure in which the length in the first direction (X direction) is shorter than the width in the second direction (Y direction). This form is a structure in which the distance between electrodes connected to the outside is relatively short, and corresponds to a so-called LICC structure. When the multilayer ceramic electronic component according to the present disclosure has the above structure, a chip with excellent moisture resistance reliability and low ESL can be realized.

[0119] In this example, the maximum value W6 of the width of the first extraction electrode 341a and / or the second extraction electrode 342a of the multilayer ceramic electronic component 300 in the second direction (Y direction) may be smaller than the maximum value W5 of the width of the ceramic body 310 in the second direction (Y direction). The first connection portion 341 and the second connection portion 342 are provided on opposing surfaces of the laminate 320 (including the dielectric layer 311 and the first and second internal electrodes 321 and 322) in the first direction (X direction), and the first edge portion 331 and the second edge portion 332 are provided on opposing surfaces of the laminate 320 in the second direction (Y direction).

[0120] In one example, the maximum value H6 of the height of the first extraction electrode 341a and / or the second extraction electrode 342a in the third direction (Z direction) according to the present disclosure may be less than the maximum value H5 of the height of the ceramic body 310 in the third direction (Z direction). When the maximum value H6 of the height of the first extraction electrode 341a and / or the second extraction electrode 342a in the third direction (Z direction) is less than the maximum value H5 of the height of the ceramic body 310 in the third direction (Z direction), the possibility of moisture penetration can be reduced by exposing the first extraction electrode 341a and / or the second extraction electrode 342a to only one surface of the multilayer ceramic electronic component 300 in the third direction (Z direction) according to the present disclosure.

[0121] The descriptions of the maximum value W6 of the width of the first lead electrode 341a and / or the second lead electrode 342a in the second direction (Y direction), the maximum value W5 of the width of the ceramic body 310 in the second direction (Y direction), the maximum value H6 of the height of the first lead electrode 341a and the second lead electrode 342a in the third direction (Z direction), the maximum value H5 of the height of the ceramic body 310 in the third direction (Z direction), and the height of the first ceramic layer 341b and the second ceramic layer 342b in the third direction (Z direction) and the width in the second direction (Y direction) are the same as the above descriptions and will be omitted.

[0122] In the above-described example, the multilayer ceramic electronic component 300 of the present disclosure may include the first terminal electrode 351 a connected to the first lead-out electrode 341 a and the second terminal electrode connected to the second lead-out electrode 342 a .

[0123] According to a variation of the example, the first connection portion 341 of the multilayer ceramic electronic component 300 of the present disclosure may include a first auxiliary electrode 341c disposed in contact with the first extraction electrode 341a', and the second connection portion may include a second auxiliary electrode disposed in contact with the second extraction electrode. The multilayer ceramic electronic component 300 of the present disclosure may include a first terminal electrode 351a connected to the first extraction electrode 341a and a second terminal electrode connected to the second extraction electrode 342a. In this case, the first terminal electrode 351a and the second terminal electrode may be disposed so as to be spaced apart from each other on the surface from which the first extraction electrode 341a and the second extraction electrode 342a are extracted.

[0124] In another variation of the example, the multilayer ceramic electronic component 300 of the present disclosure may expose at least a portion of the first lead electrode 341a' and the second lead electrode in the first direction (X direction), and may include a first connecting electrode 341d configured to cover the first lead electrode 341a' and the first ceramic layer 341b', and a second connecting electrode configured to cover the second lead electrode and the second ceramic layer.

[0125] In addition, the multilayer ceramic electronic component 300 according to the present disclosure may include a plating layer (labeled 351, 352 and 351b in the drawings) provided on each extraction electrode, respectively. The description of the extraction electrode, ceramic layer, auxiliary electrode, terminal electrode, plating layer and connection electrode is the same as that described above and will therefore be omitted.

[0126] In another variation of this example, the first and second lead electrodes 441 a and 442 a of the multilayer ceramic electronic component 400 of the present disclosure may be led out to opposite surfaces of the ceramic body 410 in the third direction (Z direction). Figures 24 to 29 is a schematic diagram showing a multilayer ceramic electronic component 400 according to this example. Figures 24 to 29 In the multilayer ceramic electronic component 400 according to this exemplary embodiment, the first connection portion 441 and the second connection portion 442 may be provided on opposing surfaces of the ceramic body 410 in a first direction (X direction), wherein the first edge portion 431 and the second edge portion 432 are provided on opposing surfaces of the laminate (including the dielectric layer 411, the first internal electrode 421 and the second internal electrode 422) in a second direction (Y direction). Here, the first connection portion 441 may include a first lead electrode 441a and a first ceramic layer 441b, and the second connection portion 442 may include a second lead electrode 442a and a second ceramic layer 442b. The first lead electrode 441a and the second lead electrode 442a may be respectively led to opposing surfaces of the ceramic body 410 in a third direction (Z direction).

[0127] In this example, the maximum width W8 of the first lead electrode 441a and / or the second lead electrode 442a of the multilayer ceramic electronic component 400 in the second direction (Y direction) may be smaller than the maximum width W7 of the ceramic body 410 in the second direction (Y direction).

[0128] In one example, the maximum value H8 of the height of the first lead electrode 441a and the second lead electrode 442a in the third direction (Z direction) of the multilayer ceramic electronic component 400 according to the present disclosure may be equal to the maximum value H7 of the height of the ceramic body 410 in the third direction (Z direction). The description of the maximum value W8 of the width of the first lead electrode 441a and / or the second lead electrode 442a in the second direction (Y direction), the maximum value W7 of the width of the ceramic body 410 in the second direction (Y direction), the maximum value H8 of the height of the first lead electrode 441a and the second lead electrode 442a in the third direction (Z direction), the maximum value H7 of the height of the ceramic body 410 in the third direction (Z direction), and the height of the first ceramic layer 441b and the second ceramic layer 442b in the third direction (Z direction) and the width in the second direction (Y direction) are the same as the above description and will be omitted.

[0129] The above-described modifications are also applicable to the present exemplary embodiment. Figures 27B to 29 4 is a schematic diagram showing a modified form of the first connection portion 441 . Figures 27B to 29 The shape and structure of the first connection portion 441 shown in FIG. 4 can be similarly applied to all the connection portions arranged at four positions of this exemplary embodiment. Figures 27B to 29 According to the present modified form, the first connection portion 441 of the multilayer ceramic electronic component 400 may include a first auxiliary electrode 441c arranged to contact the first lead electrode 441a', or may include a first terminal electrode 451a connected to the first lead electrode 441a, or may include the first auxiliary electrode 441c and the first terminal electrode 451a together.

[0130] In addition, the multilayer ceramic electronic component 400 may expose at least a portion of the first lead electrode 441a' and the second lead electrode in the first direction (X direction), and may include a first connecting electrode 441d configured to cover the first lead electrode 441a' and the first ceramic layer 441b' and a second connecting electrode configured to cover the second lead electrode and the second ceramic layer.

[0131] In addition, the multilayer ceramic electronic component 400 according to the present disclosure may include plating layers 451 (or 451b), 452, 453, and 454 respectively provided on each extraction electrode. The description of the extraction electrode, ceramic layer, auxiliary electrode, terminal electrode, plating layer, and connection electrode is the same as that described above and will be omitted.

[0132] According to another exemplary embodiment in the present disclosure, a multilayer ceramic electronic component 500 according to the present disclosure may have first and second internal electrodes 521 and 522 stacked in the second direction (Y direction). Figures 30 to 37 is a diagram illustrating a multilayer ceramic electronic component 500 according to this exemplary embodiment. Figures 30 to 37 , the first edge portion 531 and the second edge portion 532 may be respectively arranged on opposite surfaces of the laminate 520 of the multilayer ceramic electronic component 500 of this example in the third direction (Z direction), and in the laminate 520, the dielectric layer 511 and the first and second internal electrodes 521 and 522 may be stacked sequentially in the second direction (Y direction). The first connection portion 541 and the second connection portion 542 may be respectively arranged on opposite surfaces of the ceramic body 510 in the first direction (X direction). The first connection portion 541 may include a first lead-out electrode 541a and a first ceramic layer 541b, and the second connection portion 542 may include a second lead-out electrode 542a and a second ceramic layer 542b. In this case, the first lead-out electrode 541a and the second lead-out electrode 542a may be led to any one surface of the ceramic body 510 in the third direction (Z direction).

[0133] In this exemplary embodiment, the maximum width W10 of the first lead electrode 541a and / or the second lead electrode 542a of the multilayer ceramic electronic component 500 in the second direction (Y direction) may be smaller than the maximum width W9 of the ceramic body 510 in the second direction (Y direction).

[0134] In one example, the maximum value H10 of the height of the first extraction electrode 541a and / or the second extraction electrode 542a in the third direction (Z direction) according to the present disclosure may be less than the maximum value H9 of the height of the ceramic body 510 in the third direction (Z direction). When the maximum value H10 of the height of the first extraction electrode 541a and / or the second extraction electrode 542a in the third direction (Z direction) is less than the maximum value H9 of the height of the ceramic body 510 in the third direction (Z direction), the possibility of moisture penetration can be reduced by exposing the first extraction electrode 541a and / or the second extraction electrode 542a to only one surface of the multilayer ceramic electronic component 500 in the third direction (Z direction) according to the present disclosure.

[0135] The descriptions of the maximum value W10 of the width of the first lead electrode 541a and / or the second lead electrode 542a in the second direction (Y direction), the maximum value W9 of the width of the ceramic body 510 in the second direction (Y direction), the maximum value H10 of the height of the first lead electrode 541a and the second lead electrode 542a in the third direction (Z direction), the maximum value H9 of the height of the ceramic body 510 in the third direction (Z direction), and the height of the first ceramic layer 541b and the second ceramic layer 542b in the third direction (Z direction) and the width in the second direction (Y direction) are the same as the above descriptions and will therefore be omitted.

[0136] The above-described modifications are also applicable to the present exemplary embodiment. Figures 35B to 37 5 is a schematic diagram showing a modified form of the first connection portion 541 . Figures 35B to 37 The shape and structure of the first connection portion 541 shown in FIG can also be applied to the second connection portion 542. Figures 35B to 37 According to the present variation, the first connection portion 541 of the multilayer ceramic electronic component 500 may include a first auxiliary electrode 541c arranged to contact the first lead electrode 541a', or may include a first terminal electrode 551a connected to the first lead electrode 541a, or may include the first auxiliary electrode 541c and the first terminal electrode 551a together.

[0137] In addition, the multilayer ceramic electronic component 500 may expose at least a portion of the first lead electrode 541a' and the second lead electrode in the first direction (X direction), and may include a first connecting electrode 541d configured to cover the first lead electrode 541a' and the first ceramic layer 541b' and a second connecting electrode configured to cover the second lead electrode and the second ceramic layer.

[0138] In addition, the multilayer ceramic electronic component 500 according to the present disclosure may include plating layers 551, 552, and 551b respectively provided on each extraction electrode. The description of the extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, plating layers, and connection electrodes is the same as the above description and will be omitted.

[0139] In another modification of this example, the first and second lead electrodes 641 a and 642 a of the multilayer ceramic electronic component 600 of the present disclosure may be led out to opposite surfaces of the ceramic body 610 in the third direction (Z direction). Figures 38 to 43 is a schematic diagram showing a multilayer ceramic electronic component 600 according to this example. Figures 38 to 43In the multilayer ceramic electronic component 600 according to this exemplary embodiment, the first connection portion 641 and the second connection portion 642 may be provided on opposing surfaces of the laminate 620 in the first direction (X direction), while the first edge portion 631 and the second edge portion 632 are provided on opposing surfaces of the laminate (including the dielectric layer 611, the first internal electrode 621, and the second internal electrode 622) in the third direction (Z direction). Here, the first connection portion 641 may include a first extraction electrode 641a and a first ceramic layer 641b, and the second connection portion 642 may include a second extraction electrode 642a and a second ceramic layer 642b. The first extraction electrode 641a and the second extraction electrode 642a may be respectively extended to opposing surfaces of the laminate 620 in the third direction (Z direction).

[0140] In this example, the maximum width W12 of the first lead electrode 641a and / or the second lead electrode 642a of the multilayer ceramic electronic component 600 in the second direction (Y direction) may be smaller than the maximum width W11 of the ceramic body 610 in the second direction (Y direction).

[0141] In an example, the maximum value H12 of the height of the first extraction electrode 641a and the second extraction electrode 642a in the third direction (Z direction) of the multilayer ceramic electronic component 600 according to the present disclosure may be equal to the maximum value H11 of the height of the ceramic body 610 in the third direction (Z direction). In this specification, the meaning of the same specific length, width, and / or height is based on the premise of including an error range. Here, the error range may represent |H12-H11| / H12 or |H12-H11| / H11 of, for example, 3% or less, 2% or less, or 1% or less, but is not limited thereto. The descriptions of the maximum value W12 of the width of the first lead electrode 641a and / or the second lead electrode 642a in the second direction (Y direction), the maximum value W11 of the width of the ceramic body 610 in the second direction (Y direction), the maximum value H12 of the height of the first lead electrode 641a and the second lead electrode 642a in the third direction (Z direction), the maximum value H11 of the height of the ceramic body 610 in the third direction (Z direction), and the height of the first ceramic layer 641b and the second ceramic layer 642b in the third direction (Z direction) and the width in the second direction (Y direction) are the same as the above descriptions and will therefore be omitted.

[0142] The above-described modifications are also applicable to the present exemplary embodiment. Figures 41B to 43 is a schematic diagram showing a modified form of the first connection portion 641 . Figures 41B to 43 The shape and structure of the first connection portion 641 shown can be similarly applied to all the connection portions arranged at four positions of this exemplary embodiment. Figures 41B to 43According to the present modified form, the first connection portion 641 of the multilayer ceramic electronic component 600 may include a first auxiliary electrode 641c arranged to contact the first extraction electrode 641a', or may include a first terminal electrode 651a connected to the first extraction electrode 641a, or may include the first auxiliary electrode 641c and the first terminal electrode 651a together.

[0143] In addition, the multilayer ceramic electronic component 600 may expose at least a portion of the first extraction electrode 641a' and the second extraction electrode in the first direction (X direction), and may include a first connection electrode 641d provided to cover the first extraction electrode 641a' and the first ceramic layer 641b', and a second connection electrode provided to cover the second extraction electrode and the second ceramic layer. In addition, the multilayer ceramic electronic component 600 according to the present disclosure may include plating layers 651 (or 651b), 652, 653, and 654 provided on each extraction electrode, respectively. The description of the extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, plating layers, and connection electrodes is the same as that described above and will be omitted.

[0144] In one example, the multilayer ceramic electronic component 600 according to the present disclosure may have a length in a first direction (X direction) greater than a width in a second direction (Y direction). Figures 30 to 43 Multilayer ceramic electronic components 500 and 600 based on the structure of this example are shown. The structure of the example is a structure in which the length in the first direction (X direction) is greater than the width in the second direction (Y direction), and corresponds to a structure in which electrodes connected to the outside are provided at both ends in the first direction (X direction), that is, a so-called MLCC structure.

[0145] In another example, the multilayer ceramic electronic component 700 according to the present disclosure may have a length in the first direction (X direction) smaller than a width in the second direction (Y direction). Figures 44 to 51 is a diagram showing a multilayer ceramic electronic component 700 according to this example. Figures 44 to 51 The multilayer ceramic electronic component 700 of this example may have a structure in which the length in the first direction (X direction) is smaller than the width in the second direction (Y direction). This form is a structure in which the distance between electrodes connected to the outside is relatively short, and corresponds to a so-called LICC structure.

[0146] In this example, the maximum value W14 of the width of the first extraction electrode 741a and / or the second extraction electrode 742a of the multilayer ceramic electronic component 700 in the second direction (Y direction) may be smaller than the maximum value W13 of the width of the ceramic body 710 in the second direction (Y direction). The first connection portion 741 and the second connection portion 742 may be provided on opposing surfaces of the laminate 720 (including the dielectric layer 711 and the first and second internal electrodes 721 and 722) in the first direction (X direction), and the first edge portion 731 and the second edge portion 732 may be provided on opposing surfaces of the laminate 720 in the third direction (Z direction).

[0147] In one example, the maximum value H14 of the height of the first extraction electrode 741a and / or the second extraction electrode 742a in the third direction (Z direction) according to the present disclosure may be less than the maximum value H13 of the height of the ceramic body 710 in the third direction (Z direction). When the maximum value H14 of the height of the first extraction electrode 741a and / or the second extraction electrode 742a in the third direction (Z direction) is less than the maximum value H13 of the height of the ceramic body 710 in the third direction (Z direction), the possibility of moisture penetration can be reduced by exposing the first extraction electrode 741a and / or the second extraction electrode 742a to only one surface of the multilayer ceramic electronic component 700 in the third direction (Z direction) according to the present disclosure.

[0148] The descriptions of the maximum value W14 of the width of the first lead electrode 741a and / or the second lead electrode 742a in the second direction (Y direction), the maximum value W13 of the width of the ceramic body 710 in the second direction (Y direction), the maximum value H14 of the height of the first lead electrode 741a and the second lead electrode 742a in the third direction (Z direction), the maximum value H13 of the height of the ceramic body 710 in the third direction (Z direction), and the height of the first ceramic layer 741b and the second ceramic layer 742b in the third direction (Z direction) and the width in the second direction (Y direction) are the same as the above descriptions and will therefore be omitted.

[0149] In the above-described example, the multilayer ceramic electronic component 700 of the present disclosure may include the first terminal electrode 751 a connected to the first lead-out electrode 741 a and the second terminal electrode connected to the second lead-out electrode 742 a .

[0150] According to a modified embodiment, the first connection portion 741 of the multilayer ceramic electronic component 700 of the present disclosure may include a first auxiliary electrode 741c disposed in contact with the first extraction electrode 741a', and the second connection portion may include a second auxiliary electrode disposed in contact with the second extraction electrode. The multilayer ceramic electronic component 700 of the present disclosure may include a first terminal electrode 751a connected to the first extraction electrode 741a and a second terminal electrode connected to the second extraction electrode 742a. ​​In this case, the first terminal electrode 751a and the second terminal electrode may be disposed so as to be spaced apart from each other on the surface from which the first extraction electrode 741a and the second extraction electrode 742a are extracted.

[0151] In another variation of the example, the multilayer ceramic electronic component 700 of the present disclosure may expose at least a portion of the first lead electrode 741a' and the second lead electrode in a first direction (X direction), and may include a first connecting electrode 741d configured to cover the first lead electrode 741a' and the first ceramic layer 741b', and a second connecting electrode configured to cover the second lead electrode and the second ceramic layer.

[0152] In addition, the multilayer ceramic electronic component 700 according to the present disclosure may include plating layers 751, 752, and 751b respectively disposed on each extraction electrode. Descriptions of the extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, and plating layers are the same as above and thus will be omitted.

[0153] In another variation of this example, the first and second lead electrodes 841 a and 842 a of the multilayer ceramic electronic component 800 of the present disclosure may be led out to opposite surfaces of the ceramic body 810 in the third direction (Z direction). Figures 52 to 57 is a schematic diagram showing a multilayer ceramic electronic component 800 according to this example. Figures 52 to 57 In the multilayer ceramic electronic component 800 according to this exemplary embodiment, the first connection portion 841 and the second connection portion 842 may be provided on opposing surfaces of the ceramic body 810 in the first direction (X direction), wherein the first edge portion 831 and the second edge portion 832 are provided on opposing surfaces of the laminate (including the dielectric layer 811, the first internal electrode 821 and the second internal electrode 822) in the third direction (Z direction). Here, the first connection portion 841 may include a first extraction electrode 841a and a first ceramic layer 841b, and the second connection portion 842 may include a second extraction electrode 842a and a second ceramic layer 842b, and the first extraction electrode 841a and the second extraction electrode 842a may be respectively extended to opposing surfaces of the ceramic body 810 in the third direction (Z direction).

[0154] In this example, the maximum width W16 of the first lead electrode 841a and / or the second lead electrode 842a of the multilayer ceramic electronic component 800 in the second direction (Y direction) may be smaller than the maximum width W15 of the ceramic body 810 in the second direction (Y direction).

[0155] In one example, the maximum value H16 of the height of the first extraction electrode 841a and the second extraction electrode 842a in the third direction (Z direction) of the multilayer ceramic electronic component 800 according to the present disclosure may be equal to the maximum value H15 of the height of the ceramic body 810 in the third direction (Z direction). In this specification, the meaning of the same specific length, width and / or height is based on the premise of including an error range. Here, the error range may mean |H16-H15| / H16 or |H16-H15| / H15 is, for example, 3% or less, 2% or less, or 1% or less, but is not limited thereto. The descriptions of the maximum value W16 of the width of the first lead electrode 841a and / or the second lead electrode 842a in the second direction (Y direction), the maximum value W15 of the width of the ceramic body 810 in the second direction (Y direction), the maximum value H16 of the height of the first lead electrode 841a and the second lead electrode 842a in the third direction (Z direction), the maximum value H15 of the height of the ceramic body 810 in the third direction (Z direction), and the height of the first ceramic layer 841b and the second ceramic layer 842b in the third direction (Z direction) and the width in the second direction (Y direction) are the same as the above descriptions and will therefore be omitted.

[0156] The above-described modifications are also applicable to the present exemplary embodiment. Figures 55B to 57 841 is a schematic diagram showing a modified form of the first connection portion 841 . Figures 55B to 57 The shape and structure of the first connection portion 841 shown in FIG. 8 can be similarly applied to all the connection portions arranged at four positions of this exemplary embodiment. Figures 55B to 57 According to the present variation, the first connection portion 841 of the multilayer ceramic electronic component 800 may include a first auxiliary electrode 841c arranged to contact the first lead electrode 841a', or may include a first terminal electrode 851a connected to the first lead electrode 841a, or may include the first auxiliary electrode 841c and the first terminal electrode 851a together.

[0157] In addition, the multilayer ceramic electronic component 800 may expose at least a portion of the first extraction electrode 841a' and the second extraction electrode in the first direction (X direction), and may include a first connection electrode 841d provided to cover the first extraction electrode 841a' and the first ceramic layer 841b', and a second connection electrode provided to cover the second extraction electrode and the second ceramic layer. In addition, the multilayer ceramic electronic component 800 according to the present disclosure may include plating layers 851 (or 851b), 852, 853, and 854 provided on each extraction electrode, respectively. The description of the extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, and plating layers is the same as that described above and will therefore be omitted.

[0158] Figure 58 The results of testing the moisture resistance of a multilayer ceramic electronic component according to the present disclosure and a component having a conventional MLCC structure are shown. The moisture resistance was evaluated by measuring the weight change rate as the moisture absorption rate after 300 minutes or more in an environment at a temperature of 85°C and a relative humidity of 85%. In the comparative example, a mass-produced sample with a size of 1005 manufactured by Samsung Electro-Mechanics Co., Ltd. was used, in which an external electrode was formed on the surface of the ceramic body in the length direction (temperature characteristics X7R and capacitance 220.0nF), and in the exemplary embodiment, a prototype sheet manufactured in the following manner was used: a first connection portion and a second connection portion were formed on the ceramic body of the 1005 size sample without forming an external electrode and the ceramic body was sintered once.

[0159] Reference Figure 58 The component of the comparative example (indicated by the arrow on the right) exhibited a moisture absorption rate of 0.013 wt %, but it can be seen that the multilayer ceramic electronic component according to the present disclosure (indicated by the arrow on the left) exhibited a moisture absorption rate of 0.004 wt %, and the moisture absorption rate was reduced to 1 / 3 or less. As a result, it can be seen that the moisture resistance of the multilayer ceramic electronic component according to the present disclosure is greatly improved.

[0160] As described above, according to exemplary embodiments in the present disclosure, a multilayer ceramic electronic component having excellent moisture-proof reliability may be provided.

[0161] Furthermore, a multilayer ceramic electronic component capable of improving process efficiency by simplifying the production process can be provided.

[0162] Furthermore, a multilayer ceramic electronic component can be provided that allows miniaturization of the product.

[0163] However, various beneficial advantages and effects of the present disclosure are not limited to the above-mentioned contents and can be more easily understood in the course of describing exemplary embodiments in the present disclosure.

[0164] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that changes and modifications may be made without departing from the scope of the present invention as defined by the appended claims.

Claims

1. A multilayer ceramic electronic component comprising: A ceramic main body comprising a laminated body, a first edge portion, and a second edge portion, the laminated body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, the laminated body including a dielectric layer and a first and a second internal electrode stacked in the third direction, the dielectric layer being interposed between the first and the second internal electrodes, the first edge portion being disposed on the third surface of the laminated body, and the second edge portion being disposed on the fourth surface of the laminated body; a first connecting portion, disposed on the first surface of the stack; as well as a second connecting portion provided on the second surface of the stacked body, The first connection portion includes a first lead-out electrode connected to the first internal electrode and a first ceramic layer provided on the first lead-out electrode. The second connection portion includes a second lead-out electrode connected to the second internal electrode and a second ceramic layer provided on the second lead-out electrode, and The first lead-out electrode is led to a surface of the first connecting portion in the third direction and is coplanar with a surface of the ceramic body in the third direction, and the second lead-out electrode is led to a surface of the second connecting portion in the third direction and is coplanar with a surface of the ceramic body in the third direction.

2. The multilayer ceramic electronic component according to claim 1, wherein The first ceramic layer covers at least a portion of the first lead-out electrode, and The second ceramic layer covers at least a portion of the second lead-out electrode.

3. The multilayer ceramic electronic component according to claim 1, wherein The first ceramic layer covers the first lead-out electrode, and The second ceramic layer covers the second lead-out electrode.

4. The multilayer ceramic electronic component according to claim 1, wherein A maximum width of the first lead electrode and / or the second lead electrode in the second direction is smaller than a maximum width of the ceramic body in the second direction.

5. The multilayer ceramic electronic component according to claim 2, wherein A maximum width of the first lead electrode and / or the second lead electrode in the second direction is smaller than a maximum width of the ceramic body in the second direction.

6. The multilayer ceramic electronic component according to claim 1, wherein A maximum height of the first lead electrode and / or the second lead electrode in the third direction is smaller than a maximum height of the ceramic body in the third direction.

7. The multilayer ceramic electronic component according to claim 5, wherein A maximum height of the first lead electrode and / or the second lead electrode in the third direction is smaller than a maximum height of the ceramic body in the third direction.

8. The multilayer ceramic electronic component according to claim 1, wherein The first and second internal electrodes include one or more conductive metals selected from the group consisting of silver, palladium, gold, platinum, nickel, copper, tin, tungsten, titanium, and alloys thereof.

9. The multilayer ceramic electronic component according to claim 1, wherein The first extraction electrode and the second extraction electrode include one or more conductive metals selected from the group consisting of silver, palladium, gold, platinum, nickel, copper, tin, tungsten, titanium, and alloys thereof.

10. The multilayer ceramic electronic component according to claim 1, wherein The first internal electrode, the second internal electrode, the first lead electrode, and the second lead electrode include one or more conductive metals selected from the group consisting of silver, palladium, gold, platinum, nickel, copper, tin, tungsten, titanium, and alloys thereof.

11. The multilayer ceramic electronic component according to claim 1, wherein The first ceramic layer and / or the second ceramic layer comprises (Ba 1-x Ca x )(Ti 1-y (Zr,Sn,Hf) y )The component represented by O3, 0≤x≤1 and 0≤y≤0.

5.

12. The multilayer ceramic electronic component according to claim 1, wherein The first connection portion includes a first auxiliary electrode arranged to contact the first extraction electrode. The second connection portion includes a second auxiliary electrode arranged to contact the second extraction electrode. The first auxiliary electrode is led out together with the first lead-out electrode, and The second auxiliary electrode is led out together with the second lead-out electrode.

13. The multilayer ceramic electronic component according to claim 1, further comprising a first terminal electrode connected to the first lead-out electrode and a second terminal electrode connected to the second lead-out electrode, in, The first terminal electrode and the second terminal electrode are disposed spaced apart from each other on a surface of the ceramic body from which the first lead-out electrode and the second lead-out electrode are led out.

14. The multilayer ceramic electronic component according to claim 12, further comprising a first terminal electrode connected to the first lead electrode and the first auxiliary electrode, and a second terminal electrode connected to the second lead electrode and the second auxiliary electrode. in, The first terminal electrode and the second terminal electrode are provided to be spaced apart from each other on a surface from which the first lead-out electrode and the second lead-out electrode are led out.

15. The multilayer ceramic electronic component according to claim 7, further comprising a first terminal electrode connected to the first lead-out electrode and a second terminal electrode connected to the second lead-out electrode. in, The first terminal electrode and the second terminal electrode are provided to be spaced apart from each other on a surface from which the first lead-out electrode and the second lead-out electrode are led out.

16. The multilayer ceramic electronic component according to claim 1, further comprising: a first plating layer, disposed on the first lead-out electrode; as well as The second plating layer is arranged on the second lead-out electrode.

17. The multilayer ceramic electronic component according to claim 15, further comprising: a first plating layer, disposed on the first terminal electrode; as well as The second plating layer is provided on the second terminal electrode.

18. The multilayer ceramic electronic component according to claim 1, further comprising: a first connecting electrode, configured to cover the first lead-out electrode and the first ceramic layer; as well as a second connecting electrode, configured to cover the second lead electrode and the second ceramic layer; And at least a portion of the first lead electrode and the second lead electrode are exposed from the first ceramic layer and the second ceramic layer, respectively, in the first direction.

19. The multilayer ceramic electronic component according to claim 1, wherein The first lead-out electrode and the second lead-out electrode are led out to opposite surfaces of the ceramic body in the third direction.

20. The multilayer ceramic electronic component according to claim 19, wherein The maximum heights of the first lead-out electrode and the second lead-out electrode in the third direction are equal to the maximum height of the ceramic body in the third direction.

21. The multilayer ceramic electronic component according to claim 1, wherein The multilayer ceramic electronic component has a length in the first direction greater than a width in the second direction.

22. The multilayer ceramic electronic component according to claim 1, wherein The length of the multilayer ceramic electronic component in the first direction is smaller than the width in the second direction.

23. A multilayer ceramic electronic component comprising: a ceramic main body including a laminated body, a first edge portion, and a second edge portion, the laminated body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, the laminated body including a dielectric layer and a first and a second internal electrode stacked in the second direction, the dielectric layer being interposed between the first and the second internal electrodes, the first edge portion being provided on the fifth surface of the laminated body, and the second edge portion being provided on the sixth surface of the laminated body; a first connecting portion, disposed on the first surface of the stack; as well as a second connecting portion provided on the second surface of the stacked body, The first connection portion includes a first lead-out electrode connected to the first internal electrode and a first ceramic layer provided on the first lead-out electrode. The second connection portion includes a second lead-out electrode connected to the second internal electrode and a second ceramic layer provided on the second lead-out electrode, and The first lead-out electrode is led out to one surface of the first connection portion in the third direction and the first lead-out electrode is coplanar with one surface of the ceramic body in the third direction, and The second lead-out electrode is led out to one surface of the second connection portion in the third direction and is coplanar with one surface of the ceramic body in the third direction.

24. The multilayer ceramic electronic component according to claim 23, wherein A maximum width of the first lead electrode and / or the second lead electrode in the second direction is smaller than a maximum width of the ceramic body in the second direction.

25. The multilayer ceramic electronic component according to claim 23, wherein The maximum height of the first lead electrode and / or the second lead electrode in the third direction is less than or equal to the maximum height of the ceramic body in the third direction.

26. The multilayer ceramic electronic component according to claim 23, wherein The multilayer ceramic electronic component has a length in the first direction greater than a width in the second direction.

27. The multilayer ceramic electronic component according to claim 23, wherein The length of the multilayer ceramic electronic component in the first direction is smaller than the width in the second direction.

28. A multilayer ceramic electronic component comprising: a ceramic body including a laminate having a first internal electrode and a second internal electrode stacked therebetween, with a dielectric layer interposed therebetween; a first connection portion including a first lead-out electrode connected to the first internal electrode and a first ceramic layer covering the first lead-out electrode and contacting the ceramic body; as well as a second connection portion including a second lead electrode connected to the second internal electrode and a second ceramic layer covering the second lead electrode and contacting the ceramic body; One end of the first lead-out electrode is led to a surface of the first connecting portion and is coplanar with a surface of the ceramic body, and one end of the second lead-out electrode is led to a surface of the second connecting portion and is coplanar with a surface of the ceramic body.

29. The multilayer ceramic electronic component according to claim 28, wherein the ceramic body further comprises a first edge portion and a second edge portion respectively provided on opposite surfaces of the laminated body, and The first edge portion and the second edge portion include a ceramic material.

30. The multilayer ceramic electronic component according to claim 29, wherein The first edge portion and the second edge portion are in contact with the first ceramic layer and the second ceramic layer. 31 . The multilayer ceramic electronic component of claim 28 , further comprising a first terminal electrode connected to the one end of the first lead-out electrode and a second terminal electrode connected to the one end of the second lead-out electrode.

32. The multilayer ceramic electronic component according to claim 28, wherein The other end of the first lead-out electrode is led out to the other surface of the first connection portion, and the other end of the second lead-out electrode is led out to the other surface of the second connection portion.

33. The multilayer ceramic electronic component according to claim 28, wherein Of the one end of the first lead-out electrode and the other end of the first lead-out electrode opposite to the one end of the first lead-out electrode, the one end of the first lead-out electrode is the only end led out to the first connection portion, and Of the one end of the second lead-out electrode and the other end of the second lead-out electrode opposite to the one end of the second lead-out electrode, the one end of the second lead-out electrode is the only end led out to the second connection portion.

34. The multilayer ceramic electronic component according to claim 28, wherein The first lead-out electrode covers only a portion of a surface of the ceramic body, and the second lead-out electrode covers only a portion of another surface of the ceramic body.

35. A method of manufacturing a multilayer ceramic electronic component, the method comprising: forming a body including a laminate having a first inner conductive paste layer and a second inner conductive paste layer, an inner ceramic paste layer interposed between the first inner conductive paste layer and the second inner conductive paste layer; forming a first conductive paste layer on one surface of the body and a first ceramic paste layer covering the first conductive paste layer and in contact with the body; forming a second conductive paste layer on the other surface of the body and a second ceramic paste layer covering the second conductive paste layer and in contact with the body; as well as Simultaneously sintering the main body, the first conductive paste layer, the first ceramic paste layer, the second conductive paste layer, and the second ceramic paste layer, The first lead electrode is connected to the first internal electrode, the first lead electrode is formed by sintering using the first conductive paste layer, and the first internal electrode is formed by sintering using the first internal conductive paste layer. A second lead electrode is connected to a second internal electrode, the second lead electrode is formed using the second conductive paste layer by sintering, the second internal electrode is formed using the second internal conductive paste layer by sintering, and The end portion of the first lead-out electrode is exposed from the first ceramic layer and the exposed portion of the first lead-out electrode is coplanar with one surface of the main body, the first ceramic layer is formed by sintering using the first ceramic paste layer, and the end portion of the second lead-out electrode is exposed from the second ceramic layer and the exposed portion of the second lead-out electrode is coplanar with one surface of the main body, the second ceramic layer is formed by sintering using the second ceramic paste layer.

36. The method according to claim 35, wherein The step of forming the main body further includes forming a first edge paste portion and a second edge paste portion on opposite surfaces of the laminate, respectively, and The first edge paste portion and the second edge paste portion are sintered simultaneously with the first conductive paste layer, the first ceramic paste layer, the second conductive paste layer, and the second ceramic paste layer. 37 . The method according to claim 35 , further comprising forming a first terminal electrode connected to an end portion of the first lead-out electrode and a second terminal electrode connected to an end portion of the second lead-out electrode.

38. The method of claim 35, wherein: The first lead-out electrode covers only a portion of a surface of a ceramic body formed using the body by sintering, and The second lead-out electrode covers only a portion of the other surface of the ceramic body.

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