Method for manufacturing an electronic device

Abstract

The present invention discloses a method for manufacturing an electronic device, including providing a plurality of electronic units, wherein each electronic unit has a chip and at least one bonding terminal. Via the at least one bonding terminal, the plurality of electronic units are bonded to a substrate, and an adhesive material is applied to a space between the chip and the substrate.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an electronic device, and particularly to a method for manufacturing an electronic device by applying an adhesive material to the space between a chip and a substrate. Background Art

[0002] With the development of technology and usage requirements, electronic devices made of microelectronic units have gradually become popular in daily life. In order to increase the qualified rate of electronic devices, it is one of the important issues for manufacturers to develop electronic devices with greater firmness between microelectronic units and substrates. Summary of the Invention

[0003] In view of this, in order to increase the qualified rate of electronic devices and facilitate the innovation of electronic devices. For example, there can be an improved firmness method between microelectronic units and substrates.

[0004] Some embodiments of the present invention provide a method for manufacturing an electronic device. First, a substrate is provided, and then an electronic unit is provided. The electronic unit has a chip and at least one bonding terminal. The electronic unit is bonded to the substrate via the at least one bonding terminal. Then, an adhesive material is applied to the space between the chip and the substrate.

[0005] According to the method for manufacturing an electronic device of the embodiment of the present invention, by applying an adhesive material to the space between the chip and the substrate, the firmness between the microelectronic unit and the substrate can be improved. In this way, the quality of the microelectronic unit in the electronic device can be improved, which is conducive to the technological progress and innovation of the electronic device. Brief Description of the Drawings

[0006] Figures 1 to 4 is a schematic flowchart of the first embodiment of the method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device.

[0007] Figure 3A is corresponding to the method for manufacturing an electronic device according to the present invention Figure 3 of the schematic flowchart, which shows a schematic cross-sectional view of the electronic device.

[0008] Figures 5 to 8 is a schematic flowchart of the second embodiment of the method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device.

[0009] Figures 9 to 10 is a schematic flowchart of the third embodiment of the method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device.

[0010] Figures 11 to 12It is a schematic flowchart of a fourth embodiment of a method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device.

[0011] Figure 13 It is a schematic flowchart of a fifth embodiment of a method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device.

[0012] Description of reference numerals: 100A - electronic device; 100B - electronic device; 100C - electronic device; 101A - electronic device; 101B - electronic device; 101C - electronic device; 110 - substrate; 111 - bonding pad; 112 - bonding pad; 113 - bonding pad; 114 - bonding pad; 115 - bonding pad; 116 - bonding pad; 121 - electronic unit; 121A - bonding terminal; 121B - bonding terminal; 121C - chip; 121S - space; 121T - top surface; 122 - electronic unit; 122A - bonding terminal; 122B - bonding terminal; 122C - chip; 122S - space; 122T - top surface; 123 - electronic unit; 123A - bonding terminal; 123B - bonding terminal; 123C - chip; 123S - space; 123T - top surface; 130 - adhesive material; 130A - adhesive material; 130S - top surface; 131 - sheet; 135A - part; 135B - part; 135C - part; 135D - part; 135E - part; 135F - part; 135G - part; 135H - part; 135I - part; 140 - inkjet machine station; 141 - nozzle; 151 - pixel defining layer; 151S - top surface; 152 - pixel defining layer; 152S - top surface; 153 - pixel defining layer; 153S - top surface; 154 - pixel defining layer; 154S - top surface; 160 - optical substrate; 161A - light conversion layer; 161B - light conversion layer; 161C - light conversion layer; 162A - color filter layer; 162B - color filter layer; 162C - color filter layer; 163 - barrier layer. Detailed Description of the Invention

[0013] The content of the present invention will be described in detail below in conjunction with specific embodiments and the accompanying drawings. And in order to make the content of the present invention clearer and easier to understand, the following accompanying drawings may be simplified schematic diagrams, and the elements therein may not be drawn to scale. Moreover, the number and size of each element in the drawings are only for illustration and are not intended to limit the scope of the present invention.

[0014] Throughout the specification and the appended claims of the present invention, certain terms are used to refer to specific elements. Those skilled in the art should understand that electronic device manufacturers may use different names to refer to the same element, and this document does not intend to distinguish elements that have the same function but different names. When the terms "comprise", "include" and / or "have" are used in this specification, they specify the presence of the stated features, regions, steps, operations and / or elements, but do not preclude the presence or addition of one or more other features, regions, steps, operations, elements and / or their combinations.

[0015] When an element such as a layer or region is referred to as being "on" or extending "onto" another element (or a variant thereof), it can be directly on the other element or directly extend onto the other element, or there can also be intervening elements between the two. On the other hand, when an element is said to be "directly on" another element (or a variant thereof) or "directly" extend "onto" another element, there are no intervening elements between the two. Also, when an element is referred to as being "coupled" to another element (or a variant thereof), it can be directly connected to the other element or indirectly connected (e.g., electrically connected) to the other element through one or more elements.

[0016] The terms "about", "equal to", "equivalent to" or "the same as", "substantially" or "approximately" are generally interpreted as being within 20% of the given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of the given value or range.

[0017] The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify elements, and do not themselves imply or represent that the element (or elements) has any previous ordinal number, nor do they represent the order of one element with respect to another element or the order in the manufacturing method. The use of these ordinal numbers is only to clearly distinguish an element with a certain name from another element with the same name. The terms used in the claims and the specification do not have to be the same. Accordingly, the first component in the specification may be the second component in the claim.

[0018] It should be noted that the technical solutions provided in different embodiments hereinafter can be replaced, combined or used in a mixed manner to form another embodiment without violating the spirit of the present invention.

[0019] Figures 1 to 4FIG. 0 is a schematic flowchart of a first embodiment of a method for manufacturing an electronic device according to the present invention, showing a schematic cross-sectional view of the electronic device. The electronic device of the present invention may include a display device, a backlight device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-emitting display device or a self-emitting display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device. The sensing device may be a sensing device for sensing capacitance, light, heat, or ultrasonic waves, but is not limited thereto. The electronic unit may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light-emitting diode or a photodiode. The light-emitting diode may include, for example, an organic light-emitting diode (OLED), a mini light-emitting diode (mini LED), a micro light-emitting diode (micro LED), or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any permutation and combination of the foregoing, but is not limited thereto. Hereinafter, the display device will be used as the electronic device to illustrate the present invention, but the present invention is not limited thereto.

[0020] First, as Figure 1 shown, a substrate 110 is provided. The substrate 110 may be a transparent or opaque organic material or an inorganic material, and may also be a rigid material or a flexible material. The substrate may include, for example, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other known suitable materials, or a combination of the foregoing, but the present invention is not limited thereto. The substrate 110 may also be a rigid material, such as glass, sapphire, ceramic, or plastic, or any suitable material. Depending on the needs, the substrate 110 may include various components for the electronic device, such as wires (not shown), polysilicon (not shown), bonding pads 111, 112, 113, 114, 115, 116, a source electrode (not shown), a drain electrode (not shown), a common electrode (not shown), a pixel defining layer (not shown), or a limitation layer (not shown), but the present invention is not limited thereto.

[0021] Next, a plurality of electronic units are provided, such as electronic unit 121, electronic unit 122, and electronic unit 123. Figure 1It is shown that there are three electronic units on the substrate 110, but the present invention is not limited thereto. Each electronic unit may have a chip and at least one bonding terminal. For example, the electronic unit 121 may have a chip 121C and at least one bonding terminal. Figure 1 Taking the illustration that an electronic unit 121 has two bonding terminals (bonding terminal 121A and bonding terminal 121B) as an example, but not limited thereto. Similarly, the electronic unit 122 may have a chip 122C and two bonding terminals 122A / bonding terminal 122B, and the electronic unit 123 may have a chip 123C and two bonding terminals 123A / bonding terminal 123B, but the present invention is not limited thereto.

[0022] Each of the multiple electronic units can be bonded to the substrate 110 via the bonding terminals it has. For example, the electronic unit 121 can be bonded to the corresponding bonding pads 111 / bonding pad 112 of the substrate 110 via the bonding terminal 121A / bonding terminal 121B respectively; the electronic unit 122 can be bonded to the bonding pads 113 / bonding pad 114 of the substrate 110 via the bonding terminal 122A / bonding terminal 122B respectively; the electronic unit 123 can be bonded to the bonding pads 115 / bonding pad 116 of the substrate 110 via the bonding terminal 123A / bonding terminal 123B respectively, but the present invention is not limited thereto. The electronic unit can be physically and electrically connected to the bonding pads of the substrate 110 via the bonding terminals. In some embodiments, the bonding terminals of each electronic unit and the bonding pads of the substrate 110 can be bonded together by solder, but the present invention is not limited thereto. Or, in some embodiments, the bonding terminals of each electronic unit and the bonding pads of the substrate 110 can be directly bonded together by a metal diffusion method (such as Cu-Cu bonding), but the present invention is not limited thereto.

[0023] As Figure 1In the substrate structure shown, there may be a space between each chip (such as chip 121C of electronic unit 121, chip 122C of electronic unit 122, or chip 123C of electronic unit 123) and the substrate 110 respectively. For example, the space 121S between chip 121C and substrate 110, the space 122S between chip 122C and substrate 110, or the space 123S between chip 123C and substrate 110, but the present invention is not limited thereto. In some embodiments, the space between the chip of the electronic unit and the substrate may be small. For example, the distance between the chip of the electronic unit and the substrate may be approximately the sum of the heights (thicknesses) of the bonding pads and the bonding terminals, and this distance may be less than or equal to 3 micrometers (≤3 μm), but the present invention is not limited thereto. In the prior art, if the space between the chip of the electronic unit and the substrate is relatively small, it may affect the caulking property of the adhesive material. If the caulking property of the adhesive material is poor, it may be disadvantageous to the firmness between the electronic unit and the substrate. The present invention provides a method that can improve the firmness between the electronic unit and the substrate, which will be further described hereinafter.

[0024] According to the present invention, each electronic unit may include (but is not limited to) a micro light-emitting diode, for example. Each micro light-emitting diode can be used to define a sub-pixel or be regarded as a sub-pixel respectively, and generate light of a predetermined wavelength. For example, each electronic unit may correspond to one of a red pixel, a green pixel, a blue pixel, a white pixel, or other colors or wavelengths or combinations thereof, but the present invention is not limited thereto. Figure 1 It is shown that electronic unit 121 may be one of a red pixel, a green pixel, a blue pixel, a white pixel, electronic unit 122 may be one of a red pixel, a green pixel, a blue pixel, a white pixel, and electronic unit 123 may be one of a red pixel, a green pixel, a blue pixel, a white pixel, but the present invention is not limited thereto.

[0025] After bonding the electronic unit to the substrate 110, an adhesive material can be applied to each of the spaces located between each chip and the substrate 110. Figure 1Illustrated is that the liquid adhesive material 130 can be applied by an inkjet printing method, but the present invention is not limited thereto. In a variant embodiment, the method of applying the liquid adhesive material 130 may further include coating, screen printing, or other suitable known processes, and the above processes can be applied to other embodiments of the present invention for applying the adhesive material 130, which will not be elaborated hereinafter. The method proposed by the present invention is conducive to increasing the ability of the adhesive material 130 to fill gaps, and thus is conducive to the firmness between each electronic unit and the substrate 110. The adhesive material 130 can be a resin with a high light transmittance. For example, the light transmittance of the adhesive material 130 can be greater than or equal to 95% (light transmittance ≥ 95%), but the present invention is not limited thereto. In other words, the transmittance of the adhesive material 130 for light with a wavelength of 380 nm to 780 nm is greater than or equal to 95%. Or, the transmittance of the adhesive material 130 for light with a wavelength of 550 nm is greater than or equal to 95%. The material of the adhesive material 130 can be an acrylic-based, siloxane-based, silicon-based, or epoxy resin-based material, but the present invention is not limited thereto. The adhesive material 130 can have a suitable viscosity at room temperature. For example, the range is between 1 cP and 500 cP, the range can be between 1 cP and 100 cP, or the range can be between 1 cP and 50 cP, but the present invention is not limited thereto. The viscosity of the adhesive material 130 can change after being heated. For example, the viscosity of the adhesive material 130 can be adjusted by heating, such as adjusted to be between 8 cP and 12 cP. By adjusting the viscosity of the adhesive material 130, the size of the nozzle 141 of the inkjet machine 140 can be coordinated to appropriately apply the adhesive material 130 into each space located between each chip and the substrate 110. The droplet size of the droplet-shaped adhesive material 130 can be less than or equal to 30 microns (≤ 30 μm).

[0026] Since the adhesive material 130 can be a liquid with a suitable viscosity, after the adhesive material 130 is applied by the inkjet printing method, the droplet-shaped adhesive material 130 can slowly fill into the spaces 121S, 122S, and 123S through natural capillary action or gravity. For example, the adhesive material 130 can fill the spaces 121S, 122S, and 123S. In addition, the adhesive material 130 can also fill into the gaps between the electronic units 121, 122, and 123, or the adhesive material 130 may also remain on the top surface of the electronic unit. For example, the adhesive material 130 may remain on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. When the adhesive material 130 fills into the gaps between adjacent electronic units, the top surface of the electronic unit may be higher than the top surface 130S of the adhesive material 130 (shown in Figure 2 ). Figure 2Illustrated is that after applying the adhesive material by an inkjet printing method, the adhesive material 130 fills the space between the chip and the substrate 110, fills the gaps between the electronic units, and may also remain on the top surface of the electronic units. For example, it remains on Figure 2 the top surface 121T of the electronic unit 121 in Figure 2 . If necessary, the droplet-shaped adhesive material 130 can also be assisted by an externally applied vacuum or pressure to promote the filling of the adhesive material 130 into the space and gaps.

[0027] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. Figure 3 Illustrated is that after applying sufficient adhesive material by an inkjet printing method, the adhesive material fills the space between the chip and the substrate 110, fills the gaps between the electronic units, covers the top surface of the electronic units, and can be regarded as a packaging structure. For example, the amount of the adhesive material 130 applied by the nozzle 141 of the inkjet machine 140 shown in Figure 1 can be controlled so that the adhesive material 130 can fill the spaces 121S, 122S, and 123S, can fill the gaps between the electronic units 121, 122, and 123, and further cover the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. In some embodiments, the top surface 130S of the adhesive material 130 can be higher than the top surface of the electronic unit. Since the top surface of the electronic unit is generally regarded as the light-emitting surface, in order to reduce the light loss caused by the adhesive material 130 covering the top surface, it is preferable to select an adhesive material with a light transmittance greater than or equal to 95% in this embodiment, but this is not a limitation. If a smaller amount of the adhesive material is applied by the inkjet printing method, it corresponds to the Figure 2 embodiment shown.

[0028] In some embodiments, if the adhesive material 130 covers the top surface of the electronic unit, a post process step may be performed if necessary. Figure 4Illustrates the structure after performing post - process steps. The top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, resulting in a coplanar structure. The post - process steps as required can be a surface leveling method. Post - process steps as required can be performed, such as chemical etching, mechanical grinding, or plasma treatment, to lower the top surface 130S of the adhesive material 130, such that the top surface 130S of the adhesive material 130 is substantially (or essentially) close to the top surface of the electronic unit, or such that the top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, resulting in a coplanar structure, and exposing the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123.

[0029] In some embodiments, a curing step of the adhesive material 130 can also be continued. Appropriate curing steps can be carried out with reference to the curing conditions of various adhesive material 130 materials, such as light exposure, heating, or a combination of both, such that the cured adhesive material 130 can fix the electronic unit on the substrate to enhance the bonding strength between the electronic unit and the substrate. Figure 2 Illustrates that the electronic device 100A includes a cured adhesive material 130, and the top surface 130S can be lower than the top surface of the electronic unit. Figure 3 Illustrates that the electronic device 100B includes a cured adhesive material 130, and the top surface 130S can be higher than the top surface of the electronic unit. Figure 4 Illustrates that the electronic device 100C includes a cured adhesive material 130, and the top surface 130S and the top surface of the electronic unit can together form a coplanar structure.

[0030] Figure 3A is a schematic flow chart corresponding to the method of manufacturing an electronic device according to the present invention Figure 3 and illustrates a schematic cross - sectional view of the electronic device. Further, after the curing step of the adhesive material 130, another adhesive material 130A, such as an optical clear resin (OCR), can be selectively used to bond the electronic device 100B to another optical substrate 160. This optical substrate 160 can include a color conversion layer, a color filter, and a bank 163, but the present invention is not limited thereto. Figure 3AThe illustrated light conversion layer may include a light conversion layer 161A, a light conversion layer 161B, and a light conversion layer 161C, and the color filter layer may include a color filter layer 162A, a color filter layer 162B, and a color filter layer 162C, but the present invention is not limited thereto. The light conversion layer 161A and the color filter layer 162A may correspond to the electronic unit 121, the light conversion layer 161B and the color filter layer 162B may correspond to the electronic unit 122, and the light conversion layer 161C and the color filter layer 162C may correspond to the electronic unit 123. When the electronic unit 121, the electronic unit 122, and the electronic unit 123 are all blue pixels that emit blue light, the light conversion layer may convert the blue light into green light or red light through the light conversion particles located therein, such as quantum dot particles (QD particles), but the present invention is not limited thereto.

[0031] Figures 5 to 8 FIG. is a schematic flow chart of a second embodiment of a method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device. In the second embodiment of the method for manufacturing an electronic device according to the present invention, a pixel definition layer (PDL) may be further included between adjacent electronic units.

[0032] First, as Figure 5As shown, a substrate 110 is provided. The substrate 110 may include bonding pads 111, 112, 113, 114, 115, and 116. The substrate 110 may be a transparent or opaque organic material or an inorganic material, or the substrate 110 may be a rigid material or a flexible material. Details of the substrate 110 can be referred to the relevant content of the first embodiment, so they will not be elaborated here. Secondly, a plurality of electronic units are provided, such as electronic units 121, 122, and 123. Each electronic unit may have a chip and at least one bonding terminal. For example, the electronic unit 121 may have a chip 121C and two bonding terminals 121A / 121B, the electronic unit 122 may have a chip 122C and two bonding terminals 122A / 122B, and the electronic unit 123 may have a chip 123C and two bonding terminals 123A / 123B, but the present invention is not limited thereto. Each of the plurality of electronic units may be bonded to the substrate 110 via its bonding terminals. For example, the electronic unit 121 may be bonded to the bonding pads 111 and 112 of the substrate 110 via the bonding terminals 121A and 121B respectively; the electronic unit 122 may be bonded to the bonding pads 113 / 114 of the substrate 110 via the bonding terminals 122A / 122B respectively; the electronic unit 123 may be bonded to the bonding pads 115 / 116 of the substrate 110 via the bonding terminals 123A / 123B respectively. There may be a space between each chip and the substrate 110, such as the space 121S between the chip 121C and the substrate 110, the space 122S between the chip 122C and the substrate 110, or the space 123S between the chip 123C and the substrate 110, but the present invention is not limited thereto. Details of the electronic unit can be referred to the relevant content described in the first embodiment, so they will not be elaborated here.

[0033] A pixel defining layer may be further included between adjacent electronic units. For example, the pixel defining layer 151 may be located on one side of the electronic unit 121; the pixel defining layer 152 may be located between the electronic unit 121 and the electronic unit 122; the pixel defining layer 153 may be located between the electronic unit 122 and the electronic unit 123; the pixel defining layer 154 may be located beside the electronic unit 123. Each pixel defining layer, such as the pixel defining layer 151, the pixel defining layer 152, the pixel defining layer 153, the pixel defining layer 154, may include various organic or inorganic materials. The pixel defining layer may be a transparent pixel defining layer if no pigment particles are added. Conversely, the pixel defining layer may be a colored pixel defining layer if pigment particles are added, such as a white pixel defining layer or a gray pixel defining layer. Each pixel defining layer may be located on the substrate 110 and may also be in direct contact with the substrate 110, but the present invention is not limited thereto. The top surface of the pixel defining layer may not be lower than the top surface of the electronic unit. For example, the top surface 151S of the pixel defining layer 151, the top surface 152S of the pixel defining layer 152, the top surface 153S of the pixel defining layer 153, the top surface 154S of the pixel defining layer 154, may not be lower than the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123, but the present invention is not limited thereto. The pixel defining layer may be used for light shielding to reduce the possibility that the light mixing between adjacent electronic units affects the image quality of the electronic device. The pixel defining layer may also be used for reflection to improve the light utilization efficiency of the electronic unit. In some embodiments, the gap between the pixel defining layer and the adjacent electronic unit may not be large, such as less than 10 micrometers (<10 μm), but the present invention is not limited thereto. A relatively small gap between the pixel defining layer and the adjacent electronic unit may affect the ability of the adhesive material to fill the gap. If the gap filling ability of the adhesive material is poor, it may be disadvantageous to the firmness between the electronic unit and the substrate.

[0034] Then, an adhesive material 130 may be applied to each space and gap located between each chip, the pixel defining layer, and the substrate 110. Figure 5Illustrated is that a liquid adhesive material can be applied by an inkjet printing method, but the present invention is not limited thereto. The method proposed by the present invention is conducive to increasing the ability of the adhesive material to fill gaps, and thus is conducive to the firmness between the microelectronic unit and the substrate. The adhesive material 130 can be a resin with a high light transmittance. For example, the light transmittance of the adhesive material 130 can be greater than or equal to 95% (light transmittance ≥ 95%), but the present invention is not limited thereto. The material of the adhesive material 130 can be an acrylic-based, siloxane-based, silicon-based or epoxy resin-based material, but the present invention is not limited thereto. The adhesive material 130 can have a suitable viscosity at room temperature. For example, the range can be between 1 cP and 500 cP, the range can be between 1 cP and 100 cP, or the range can be between 1 cP and 50 cP, but the present invention is not limited thereto. The viscosity of the adhesive material 130 can change after being heated. For example, the viscosity of the adhesive material 130 can be adjusted by heating, such as adjusted between 8 cP and 12 cP. Adjusting the viscosity of the adhesive material 130 can cooperate with the size of the nozzle 141 of the inkjet machine 140 to appropriately apply the adhesive material 130 to each space and gap between each chip, pixel defining layer and the substrate 110. The size of the droplet-shaped adhesive material 130 can be less than or equal to 30 micrometers (≤30 μm).

[0035] Since the adhesive material 130 can be a liquid with a suitable viscosity, after the adhesive material 130 is applied by the inkjet printing method, the adhesive material 130 can slowly fill into the spaces 121S, 122S and 123S through natural capillary action or gravity. For example, the adhesive material 130 can fill the spaces 121S, 122S and 123S. In addition, the adhesive material 130 can also fill into the gaps between the electronic unit and the pixel defining layer, or the adhesive material 130 may remain on the top surface of the electronic unit. For example, the adhesive material 130 may remain on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122 or the top surface 123T of the electronic unit 123. The adhesive material 130 may also remain on the top surface of the pixel defining layer. For example, the adhesive material 130 may remain on the top surface 151S of the pixel defining layer 151, the top surface 152S of the pixel defining layer 152, the top surface 153S of the pixel defining layer 153 or the top surface 154S of the pixel defining layer 154. In some embodiments, the top surface of the electronic unit can be higher than the top surface 130S of the adhesive material 130. Figure 6Illustrated is the application of an adhesive material by an inkjet printing method. The adhesive material 130 fills the space, fills the gap between the electronic unit and the pixel defining layer, and the adhesive material 130 also remains on the top surface 121T of the electronic unit and on the top surface 152S of the pixel defining layer. However, the present invention is not limited thereto. If necessary, the droplet-shaped adhesive material 130 can also be assisted by an additional vacuum or pressure to promote the filling of the space and the gap by the adhesive material 130.

[0036] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. Figure 7 Illustrated is the application of a sufficient amount of adhesive material by an inkjet printing method. The adhesive material fills the space, fills the gap between the electronic unit and the pixel defining layer, and also covers the top surface of the electronic unit, and can be regarded as a packaging structure. For example, the amount of the adhesive material 130 applied by the nozzle 141 of the inkjet machine 140 can be controlled so that the adhesive material 130 can fill the spaces 121S, 122S, and 123S, can fill the gap between the electronic unit and the pixel defining layer, and further cover the top surfaces 121T of the electronic unit 121, the top surfaces 122T of the electronic unit 122, and the top surfaces 123T of the electronic unit 123. The adhesive material 130 can also cover the top surface 151S of the pixel defining layer 151, the top surface 152S of the pixel defining layer 152, the top surface 153S of the pixel defining layer 153, or the top surface 154S of the pixel defining layer 154. After the adhesive material 130 fills the gap, the top surface 130S of the adhesive material 130 can be higher than the top surface of the electronic unit or higher than the top surface of the pixel defining layer 153. Since the top surface of the electronic unit is generally regarded as the light-emitting surface, in order to reduce the light loss caused by the adhesive material 130 covering the top surface, it is preferable to select an adhesive material with a light transmittance greater than or equal to 95% in this embodiment, but it is not limited thereto. If a smaller amount of the adhesive material is applied by the inkjet printing method, it corresponds to Figure 6 the illustrated embodiment. If necessary, the droplet-shaped adhesive material 130 can also be assisted by an additional vacuum or pressure to promote the filling of the space and the gap by the adhesive material 130.

[0037] In some embodiments, if the adhesive material 130 covers the top surface of the electronic unit, post-process steps can also be performed if necessary. Figure 8Shows the structure after performing post - process steps. The top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, resulting in a coplanar structure. The post - process steps as required can be a surface - flattening method. Post - process steps as required can be performed, such as chemical etching, mechanical grinding, or plasma treatment, to lower the top surface 130S of the adhesive material 130 so that the top surface 130S of the adhesive material 130 is substantially (or essentially) close to the top surface of the electronic unit, or so that the top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, resulting in a coplanar structure, and exposing the top surface 121T of the electronic unit 121, exposing the top surface 122T of the electronic unit 122, or exposing the top surface 123T of the electronic unit 123. In some embodiments, the top surface 151S of the pixel - defining layer 151, the top surface 152S of the pixel - defining layer 152, the top surface 153S of the pixel - defining layer 153, or the top surface 154S of the pixel - defining layer 154 can also be exposed.

[0038] In some embodiments, a curing step of the adhesive material 130 can also be continued. Appropriate curing steps can be performed with reference to the curing conditions of various adhesive material 130 materials, such as light exposure, heating, or a combination of both, so that the cured adhesive material 130 can fix the electronic unit on the substrate to enhance the bonding strength between the electronic unit and the substrate. Figure 6 Shows the electronic device 101A including the cured adhesive material 130, and the top surface 130S can be lower than the top surface of the electronic unit. Figure 7 Shows the electronic device 101B including the cured adhesive material 130, and the top surface 130S can be higher than the top surface of the electronic unit. Figure 8 Shows the electronic device 101C including the cured adhesive material 130, and the top surface 130S and the top surface of the electronic unit can together form a coplanar structure.

[0039] Figures 9 to 10 Is a schematic flow chart of the third embodiment of the method for manufacturing an electronic device according to the present invention, which shows a schematic cross - sectional view of the electronic device. In the third embodiment of the method for manufacturing an electronic device according to the present invention, the way of applying the adhesive material can be to use a sheet of solid adhesive material.

[0040] Figure 9It is illustrated that an adhesive material can be applied by using a sheet of a solid adhesive material, but the present invention is not limited thereto. The method proposed by the present invention is conducive to increasing the ability of the adhesive material to fill gaps, and thus is conducive to improving the firmness between the electronic unit and the substrate. For example, a solid adhesive material is provided, and a sheet of the solid adhesive material is attached to a plurality of electronic units. The sheet 131 can be an optically clear adhesive, such as an optically clear adhesive OCA (Optically Clear Adhesive), but is not limited thereto. The light transmittance of the sheet 131 can be greater than or equal to 95% (light transmittance ≥ 95%), but the present invention is not limited thereto. In some embodiments, the thickness of the sheet 131 can be less than or equal to 10 micrometers (≤ 10 μm). The sheet 131 can be a solid sheet at room temperature, but the present invention is not limited thereto. After being heated, the sheet 131 can be softened and generate an appropriate viscosity, and the sheet 131 is converted from a solid state to a liquid state. For example, the solid sheet 131 is softened into a liquid adhesive material 130 via a heating step, and the viscosity of the adhesive material 130 is adjusted, such as between 8 cP and 12 cP.

[0041] Since the adhesive material 130 can be a liquid with an appropriate viscosity, after the sheet 131 is softened into the liquid adhesive material 130, the adhesive material 130 can flow into the space between the chip and the substrate. For example, the adhesive material 130 can slowly fill and fill the spaces 121S, 122S, and 123S through natural capillary action or gravity. In addition, the adhesive material 130 can also fill the gaps between the electronic units 121, 122, and 123, or the adhesive material 130 may remain on the top surface of the electronic unit. For example, the adhesive material 130 may remain on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. The top surface of the electronic unit can be higher than the top surface 130S of the adhesive material 130, as Figure 2 illustrated.

[0042] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. As Figure 3As shown, the adhesive material 130 fills the space, fills the gaps between the electronic units, and also covers the top surfaces of the electronic units. For example, the amount of the adhesive material 130 can be controlled such that the adhesive material 130 can fill the spaces 121S, 122S, and 123S, can fill the gaps between the electronic units 121, 122, and 123, and further covers the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. After the adhesive material 130 fills the space and the gaps, the top surface 130S of the adhesive material 130 can be higher than the top surfaces of the electronic units. If necessary, the liquid adhesive material 130 can also be assisted by an externally applied vacuum or pressure to facilitate the filling of the space and the gaps by the adhesive material 130.

[0043] In another embodiment of the present invention, if the adhesive material 130 covers the top surface of the electronic unit, a post-process step can be performed if necessary. Figure 4 As shown in the post-process step, the top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, forming a coplanar structure. The post-process step that may be required can be a surface leveling method. For details of the post-process step, reference can be made to Figure 4 the content described above, so it will not be repeated here.

[0044] In some embodiments, a curing step of the adhesive material 130 can also be continued. Appropriate curing steps can be carried out with reference to the curing conditions of various adhesive material 130 materials, such as light irradiation, heating, or a combination of both, so that the cured adhesive material 130 can fix the electronic unit on the substrate to enhance the bonding strength between the electronic unit and the substrate. Please refer to Figure 2 、 Figure 3 or Figure 4 the content described above, so it will not be repeated here.

[0045] Figures 11 to 12 is a schematic flowchart of the fourth embodiment of the method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device. In the fourth embodiment of the method for manufacturing an electronic device according to the present invention, the adhesive material can be applied in the form of a sheet of solid adhesive material on a substrate including a pixel defining layer.

[0046] Figure 11It is shown that the adhesive material can be applied by using a sheet of solid adhesive material, but the present invention is not limited thereto. The method proposed by the present invention is conducive to increasing the ability of the adhesive material to fill gaps, and thus is conducive to improving the firmness between the electronic unit and the substrate. For example, a solid adhesive material is provided, and a sheet of the solid adhesive material is attached to a plurality of electronic units. The sheet 131 can be an optical adhesive, such as optical adhesive OCA. For details of the sheet 131, please refer to the foregoing content and will not be elaborated herein.

[0047] Since the adhesive material 130 can be a liquid with appropriate viscosity, after the sheet 131 is softened into a liquid adhesive material 130, the adhesive material 130 can flow into the space between the chip and the substrate. For example, the adhesive material 130 can slowly fill the spaces 121S, 122S, and 123S through natural capillary action or gravity and can also fill the above spaces. In addition, the adhesive material 130 can also fill the gaps between the electronic unit and the pixel defining layer, or the adhesive material 130 may remain on the top surface of the electronic unit. For example, the adhesive material 130 may remain on the top surface 121T of the electronic unit 121, the top surface 122T of the electronic unit 122, or the top surface 123T of the electronic unit 123. The adhesive material 130 may also remain on the top surface of the pixel defining layer. For example, the adhesive material 130 may remain on the top surface 151S of the pixel defining layer 151, the top surface 152S of the pixel defining layer 152, the top surface 153S of the pixel defining layer 153, or the top surface 154S of the pixel defining layer 154. When the adhesive material 130 fills the gap between adjacent electronic units, the top surface of the electronic unit can be higher than the top surface 130S of the adhesive material 130, as shown in Figure 2 shown.

[0048] In some embodiments, the adhesive material 130 may further cover the top surface of the electronic unit. As shown in Figure 7 shown, the adhesive material fills the space, fills the gaps between the electronic units, and also covers the top surface of the electronic unit. In some embodiments, if the adhesive material 130 covers the top surface of the electronic unit, a post-process step may be performed as needed. Figure 8 Shown is that after the post-process step is performed, the top surface 130S of the adhesive material 130 is flush with the top surface of the electronic unit, forming a coplanar structure. The post-process step that may be performed as needed can be a surface leveling method. For details of the post-process step, please refer to Figure 8 the foregoing content and will not be elaborated herein.

[0049] In some embodiments, the curing step of the adhesive material 130 can be further carried out. Appropriate curing steps can be carried out with reference to the curing conditions of various adhesive material 130 materials, such as light irradiation, heating, or a combination of both, so that the cured adhesive material 130 can fix the electronic unit on the substrate to enhance the bonding strength between the electronic unit and the substrate. Please refer to Figure 6 , Figure 7 or Figure 8 the content described above, so it will not be elaborated here.

[0050] Figure 13 is a schematic flowchart of the fifth embodiment of the method for manufacturing an electronic device according to the present invention, which shows a schematic cross-sectional view of the electronic device. In the fifth embodiment of the method for manufacturing an electronic device according to the present invention, the adhesive material can be applied in the form of a sheet of solid adhesive material or a liquid adhesive material can be applied.

[0051] After the adhesive material 130 is applied, the adhesive material 130 can slowly fill the spaces 121S, 122S, and 123S. For example, the adhesive material 130 can fill the spaces 121S, 122S, and 123S. In addition, the adhesive material 130 can also fill the gaps between the electronic unit and the pixel defining layer. For example, the adhesive material 130 may fill the gap between the pixel defining layer 152 and the electronic unit 121, the adhesive material 130 may fill the gap between the pixel defining layer 152 and the electronic unit 122, the adhesive material 130 may fill the gap between the pixel defining layer 153 and the electronic unit 122, the adhesive material 130 may fill the gap between the pixel defining layer 153 and the electronic unit 123, and the adhesive material 130 may fill the gap between the pixel defining layer 154 and the electronic unit 123.

[0052] Next, the adhesive material 130 can be cured. Different from the aforementioned method of curing the adhesive material 130, in this embodiment, the adhesive material 130 can be cured from the other side of the substrate 110 (the side opposite to the electronic unit). The method of locally curing the adhesive material 130 can be to use a laser to focus on certain parts of the adhesive material 130, or to use a locally curing device to locally cure certain parts of the adhesive material 130. For example, a laser can be used to focus on parts 135A, 135B, 135C, 135D, 135E, 135F, 135G, 135H, and 135I of the adhesive material 130, so that these parts of the adhesive material 130 are cured, but the remaining parts of the adhesive material 130 are not cured or are incompletely cured, resulting in selective curing of the adhesive material 130 that is different from the aforementioned method of curing the adhesive material 130.

[0053] After selectively curing the adhesive material 130, the uncured or incompletely cured adhesive material 130 can be removed. The method of removing the uncured adhesive material 130 can be to wash the selectively cured adhesive material 130 as a whole, or to soak the selectively cured adhesive material 130 with a solvent, but the present invention is not limited thereto.

[0054] After removing the uncured adhesive material 130, the electronic device of this embodiment can be obtained. The electronic device of this embodiment includes a locally cured adhesive material portion. Such a locally cured adhesive material portion, such as portion 135A, portion 135B, portion 135C, portion 135D, portion 135E, portion 135F, portion 135G, portion 135H, portion 135I, can be selectively located in space 121S, can be selectively located in space 122S, or can be selectively located in space 123S, but the present invention is not limited thereto. In addition, such a locally cured adhesive material portion can also be selectively located in the gap between the electronic unit and the pixel defining layer, such as selectively located in the gap between the pixel defining layer 152 and the electronic unit 121, selectively located in the gap between the pixel defining layer 152 and the electronic unit 122, selectively located in the gap between the pixel defining layer 153 and the electronic unit 122, selectively located in the gap between the pixel defining layer 153 and the electronic unit 123, or selectively located in the gap between the pixel defining layer 154 and the electronic unit 123, but the present invention is not limited thereto. The electronic device of this embodiment, compared with Figure 2 the illustrated electronic device 100A or Figure 6 the illustrated electronic device 101A, is different in that although the top surface 130S of the cured adhesive material 130 can be lower than the top surface of the electronic unit, there can be no adhesive material 130 remaining on the top surface of the electronic unit or the adhesive material 130 will not remain on the top surface of the pixel defining layer.

[0055] According to the method for manufacturing an electronic device of an embodiment of the present invention, by applying an adhesive material to the space between the chip and the substrate, even if the distance between the chip and the substrate of the electronic unit may be less than or equal to 3 microns, or the gap between the pixel defining layer and the adjacent electronic unit may be less than 10 microns, an electronic device with enhanced bonding strength for fixing the electronic unit on the substrate can still be obtained. Such an electronic device can also be directly regarded as a packaging structure. In this way, the quality of the microelectronic unit in the electronic device can be improved, which is conducive to the technological progress and innovation of the electronic device.

[0056] The above are only embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for manufacturing an electronic device, characterized in that, Comprising: Providing a substrate; Providing a plurality of electronic units, each of the plurality of electronic units having a chip and at least one bonding terminal; Bonding each of the plurality of electronic units to the substrate via the at least one bonding terminal; And Applying an adhesive material into a space between the chip and the substrate and into a gap between two adjacent ones of the plurality of electronic units, wherein the adhesive material is applied in such a manner that: Attaching a sheet of the solid adhesive material onto the plurality of electronic units; and Converting the sheet from a solid state to a liquid state so as to flow into the space between the chip and the substrate.

2. The method for manufacturing an electronic device according to claim 1, characterized in that, Applying the adhesive material by an inkjet printing method.

3. The method for manufacturing an electronic device according to claim 1, characterized in that, The viscosity range of the adhesive material is from 8 cP to 12 cP.

4. The method for manufacturing an electronic device according to claim 1, characterized in that, Comprising a heating step to convert the sheet of the adhesive material from the solid state to the liquid state.

5. The method for manufacturing an electronic device according to claim 1, characterized in that, The thickness of the sheet is less than 10 microns.

6. A method for manufacturing an electronic device, characterized in that, Comprising: Providing a substrate, the substrate comprising a pixel defining layer; Providing an electronic unit, the electronic unit having a chip and at least one bonding terminal; Bonding the electronic unit to the substrate via the at least one bonding terminal such that the electronic unit is located beside the pixel defining layer; And Applying an adhesive material into a space between the chip and the substrate and into a gap between the electronic unit and the pixel defining layer, wherein the adhesive material is applied in such a manner that: Attaching a sheet of the solid adhesive material onto the electronic unit; and Converting the sheet from a solid state to a liquid state so as to flow into the space between the chip and the substrate.

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