Antenna package and image display device

Abstract

According to an embodiment of the present invention, an antenna package and an image display device are provided. The antenna package includes an antenna device having an antenna pattern and a connector electrically connected to the antenna pattern. The connector includes an insulator having a dielectric constant of 2 to 3.5 and a loss tangent of 0.0015 to 0.007 measured at 10 GHz by a resonance method; and a conductive connection structure isolated by the insulator and electrically connected to the antenna pattern.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2020-0123649 filed on September 24, 2021, with the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and an intermediate structure, and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi-Fi and Bluetooth are combined with image display devices such as smartphones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] According to the development of mobile communication technology, an antenna capable of achieving communication in, for example, a high frequency band or an ultra-high frequency band is required in a display device.

[0006] However, if the driving frequency of the antenna increases, the signal loss may also increase. In addition, as the length of the transmission path increases, the signal loss may further increase.

[0007] In order to connect the antenna to the main board of the image display device, a connection intermediate structure such as a flexible printed circuit board or a connector may be added. In this case, the connection intermediate structure may cause signal loss.

[0008] In addition, the radiation characteristics of the antenna may be affected by the dielectric properties of the connecting intermediate structure, so a suitable dielectric structure is required to achieve high-frequency or ultra-high-frequency radiation characteristics.

[0009] For example, Korean Patent Application Publication No. 2013-0095451 discloses an antenna integrated with a display panel but does not teach effective circuit connections. Summary of the Invention

[0010] According to one aspect of the present invention, an antenna package having improved radiation characteristics and signal efficiency is provided.

[0011] According to one aspect of the present invention, there is provided an image display device including an antenna package having improved radiation characteristics and signal efficiency.

[0012] (1) An antenna package comprising: an antenna device including an antenna pattern; and a connector electrically connected to the antenna pattern, wherein the connector comprises: an insulator having a dielectric constant (Dk) of 2 to 3.5 and a loss tangent (Df) of 0.0015 to 0.007 measured at 10 GHz by a resonance method; and a conductive connection structure isolated by the insulator and electrically connected to the antenna pattern.

[0013] (2) The antenna package according to (1) above, wherein the dielectric constant of the insulator is 2.0 to 3.3, and the loss tangent is 0.0015 to 0.0048.

[0014] (3) The antenna package according to (1) above, wherein the insulator has at least one of a liquid crystal polymer (LCP) structure, a polyphenylene sulfide (PPS) structure, and a modified polyimide (MPI) structure.

[0015] (4) The antenna package according to (1) above further includes: a first circuit board bonded to the antenna pattern, the first circuit board including signal wiring extending between the antenna pattern and the connector; and a second circuit board coupled to the first circuit board via the connector, the second circuit board having an antenna driver integrated circuit chip mounted thereon.

[0016] (5) The antenna package according to (4) above, wherein the connector includes a first connector mounted on the first circuit board and a second connector mounted on the second circuit board.

[0017] (6) The antenna package according to (5) above, wherein the first connector is a plug connector and the second connector is a receptacle connector.

[0018] (7) An antenna package according to (5) above, wherein the first connector includes a first insulator and the second connector includes a second insulator, wherein each of the first insulator and the second insulator has a dielectric constant (Dk) of 2 to 3.5 and a loss tangent (Df) of 0.0015 to 0.007 measured by a resonance method at 10 GHz.

[0019] (8) The antenna package according to (4) above, wherein the connector includes a slot coupled to an end portion of the first circuit board, and the second circuit board includes an antenna connection port coupled to the connector.

[0020] (9) The antenna package according to (4) above, wherein the first circuit board is a flexible printed circuit board (FPCB) and the second circuit board is a rigid printed circuit board.

[0021] (10) The antenna package according to (4) above, wherein the first circuit board includes a first portion joined to the antenna pattern and a second portion having a width smaller than the first portion, and the connector is combined with the second portion.

[0022] (11) An antenna package according to (4) above, wherein the antenna pattern includes a plurality of antenna patterns arranged in an array, and the signal wiring of the first circuit board includes a plurality of signal wirings each of which is electrically connected to each of the plurality of antenna patterns.

[0023] (12) The antenna package according to (11) above, wherein the conductive connection structure of the connector includes a plurality of conductive connection structures electrically connected to each of the plurality of signal wirings.

[0024] (13) The antenna package according to (11) above, wherein the antenna pattern includes a first antenna pattern and a second antenna pattern having different sizes.

[0025] (14) The antenna package according to (13) above, wherein the first antenna pattern and the second antenna pattern have different resonance frequencies.

[0026] (15) The antenna package according to (13) above, wherein the antenna device further includes an antenna dielectric layer on which the antenna pattern is provided, and the first antenna pattern and the second antenna pattern are alternately and repeatedly arranged on the antenna dielectric layer along a width direction.

[0027] (16) An antenna package according to (13) above, wherein the antenna device further includes an antenna dielectric layer on which the antenna pattern is arranged, and the antenna device includes a first radiation group formed by first antenna patterns adjacent to each other in the width direction on the antenna dielectric layer, and a second radiation group formed by second antenna patterns adjacent to each other in the width direction on the antenna dielectric layer.

[0028] (17) An image display device includes: a display panel; and the antenna package according to the above embodiment provided on the display panel.

[0029] (18) The image display device according to (17) above further includes: a main board arranged below the display panel; and an antenna driving integrated circuit chip mounted on the main board, wherein the antenna package is bent below the display panel and coupled to the main board via a connector, thereby being electrically connected to the antenna driving integrated circuit chip.

[0030] According to an exemplary embodiment of the present invention, a first circuit board attached to an antenna device and a second circuit board on which an antenna driver integrated circuit chip is mounted can be electrically connected to each other via a connector. Consequently, the bonding or gluing process for connecting the first and second circuit boards can be omitted, and a stable circuit board connection can be easily achieved.

[0031] According to exemplary embodiments, a dielectric material having a predetermined range of dielectric constant (Dk) and loss tangent (Df) can be used as an insulating structure included in a connector. Therefore, signal loss occurring in the connector can be suppressed in high-frequency or ultra-high-frequency communications.

[0032] In an exemplary embodiment, the first circuit board may include a main substrate portion and a connector connection portion having a width smaller than that of the main substrate portion. The main substrate portion may provide antenna connection stability and sufficient space for arranging circuit wiring, while the connector connection portion may provide improved connectivity and flexibility with the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

[0034] Figure 2 is a schematic diagram illustrating a connector included in an antenna package according to an exemplary embodiment.

[0035] Figure 3 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

[0036] Figure 4 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0037] Figure 5 and Figure 6 are respectively a schematic cross-sectional view and a top plan view illustrating an image display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0038] According to an exemplary embodiment of the present invention, there is provided an antenna package including a connection structure of an antenna device and a connector. According to an exemplary embodiment of the present invention, there is also provided an image display device including the antenna package.

[0039] However, those skilled in the art will appreciate that these embodiments described with reference to the accompanying drawings are provided to further understand the spirit of the present invention and do not limit the subject matter disclosed in the detailed description and the appended claims.

[0040] Figure 1 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

[0041] Reference Figure 1, the antenna package may include the antenna device 100 , the first circuit board 200 , and the connector 300 . The antenna package may further include a second circuit board 350 connected to the first circuit board 200 through the connector 300 .

[0042] The antenna device 100 may include an antenna dielectric layer 110 and antenna units 120 and 130 disposed on the antenna dielectric layer 110 .

[0043] The antenna dielectric layer 110 may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, cycloolefin or polyolefin having a norbornene structure, and ethylene-propylene copolymer; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. These resins may be used alone or in combination of two or more.

[0044] In some embodiments, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be included in the antenna dielectric layer 110. In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, etc.

[0045] In some embodiments, the dielectric constant of the antenna dielectric layer 110 can be adjusted to a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, thereby failing to achieve desired high or ultra-high frequency driving.

[0046] Antenna elements 120 and 130 may be formed on the top surface of antenna dielectric layer 110. For example, a plurality of antenna elements 120 and 130 may be arranged in an array along the width direction of antenna dielectric layer 110 or antenna package to form a horizontal row of antenna elements.

[0047] In some embodiments, the antenna units 120 and 130 may include a first antenna unit 120 and a second antenna unit 130 , and the first antenna unit 120 and the second antenna unit 130 may have different resonant frequencies.

[0048] The first antenna unit 120 may include a first radiation pattern 122 and a first transmission line 124. The second antenna unit 130 may include a second radiation pattern 132 and a second transmission line 134. The radiation patterns 122 and 132 may have, for example, a polygonal flat plate shape, and the first transmission line 124 and the second transmission line 134 may extend from the sides of the first radiation pattern 122 and the second radiation pattern 132, respectively. The transmission lines 124 and 134 may be formed as a single member substantially integral with the radiation patterns 122 and 132, respectively.

[0049] The first and second antenna patterns 120 and 130 may further include first and second signal pads 126 and 136, respectively. The first and second signal pads 126 and 136 may be connected to one end of the first and second transmission lines 124 and 134, respectively.

[0050] In one embodiment, the signal pads 126 and 136 may be provided as a substantially unitary member with the transmission lines 124 and 134 , respectively, and end portions of the transmission lines 124 and 134 may serve as the signal pads 126 and 136 .

[0051] In some embodiments, the ground pads 128 and 138 may be disposed around the signal pads 126 and 136. For example, a pair of first ground pads 128 may be disposed facing each other with the first signal pad 126 interposed therebetween. A pair of second ground pads 138 may be disposed facing each other with the second signal pad 136 interposed therebetween. The ground pads 128 and 138 may be electrically and physically separated from the transmission lines 124 and 134 and the signal pads 126 and 136.

[0052] In an exemplary embodiment, the first antenna unit 120 and the second antenna unit 130 may have different sizes. In one embodiment, the area of the first radiation pattern 122 included in the first antenna unit 120 may be larger than the area of the second radiation pattern 132 included in the second antenna unit 130. In one embodiment, the length of the first transmission line 124 included in the first antenna unit 120 may be larger than the length of the second transmission line 134 included in the second antenna unit 130.

[0053] As described above, the first antenna unit 120 and the second antenna unit 130 may have different resonant frequencies. In an exemplary embodiment, the resonant frequency of the first antenna unit 120 may be lower than the resonant frequency of the second antenna unit 130. In one non-limiting example, the resonant frequency of the first antenna unit 120 may be approximately 20 GHz to 30 GHz (e.g., approximately 20 GHz to approximately 30 GHz), and the resonant frequency of the second antenna unit 130 may be approximately 30 GHz to 40 GHz.

[0054] like Figure 1 As shown, the first antenna unit 120 and the second antenna unit 130 having different sizes and / or resonant frequencies can be repeatedly and alternately arranged in a horizontal direction, for example. Therefore, the radiation coverage uniformity over the entire area of the antenna device 100 can be improved.

[0055] Antenna elements 120 and 130 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. These may be used alone or in combination.

[0056] In one embodiment, the antenna elements 120 and 130 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy) to provide low resistance. In one embodiment, the antenna elements 120 and 130 may include copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) in consideration of low resistance and a fine line width pattern.

[0057] In some embodiments, the antenna elements 120 and 130 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx), and the like.

[0058] In some embodiments, antenna units 120 and 130 may include a multilayer structure of a transparent conductive oxide layer and a metal layer. For example, antenna units 120 and 130 may include a double-layer structure of a transparent conductive oxide layer and a metal layer, or a triple-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer. In this case, the metal layer can improve flexibility, and the low resistance of the metal layer can also increase signal transmission speed. The transparent conductive oxide layer can also improve corrosion resistance and transparency.

[0059] In some embodiments, the radiation patterns 122 and 132 and the transmission lines 124 and 134 may include a mesh pattern structure to improve light transmittance. In this case, a dummy mesh electrode (not shown) may be formed around the radiation patterns 122 and 132 and the transmission lines 124 and 134.

[0060] The signal pads 126 and 136 and the ground pads 128 and 138 may have a solid pattern formed of the above-mentioned metal or alloy in consideration of reducing feeding resistance, noise absorption efficiency, and improving horizontal radiation characteristics.

[0061] In one embodiment, the radiation patterns 122 and 132 may have a mesh pattern structure, and the transmission lines 124 and 134 , the signal pads 126 and 136 , and the ground pads 128 and 138 may be formed as solid metal patterns.

[0062] In this case, the radiation patterns 122 and 132 may be disposed in a display area of the image display device, and the transmission lines 124 and 134 , the signal pads 126 and 136 , and the ground pads 128 and 138 may be disposed in a non-display area or a bezel area of the image display device.

[0063] In one embodiment, at least some portions of the transmission lines 124 and 134 may include a solid metal pattern and may be disposed in a non-display region or a bezel region of the image display device.

[0064] The first circuit board 200 may include a core layer 210 and signal wirings 220 formed on a surface of the core layer 210. For example, the first circuit board 200 may be a flexible printed circuit board (FPCB).

[0065] In some embodiments, the antenna dielectric layer 110 may be used as the circuit board 200. In this case, the circuit board 200 (e.g., the core layer 210 of the circuit board 200) may be provided as a substantially integral member with the antenna dielectric layer 110. In addition, the signal wiring 220 to be described later may be directly connected to the transmission lines 124 and 134, and the pads 126, 128, 136, and 138 may be omitted.

[0066] The core layer 210 may include, for example, a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. The core layer 210 may include an internal insulating layer included in the circuit board 200 .

[0067] The signal wiring 220 may be used as a feeder, for example. The signal wiring 220 may be arranged on one surface of the core layer 210 (for example, a surface facing the antenna patterns 120 and 130).

[0068] For example, the circuit board 200 may further include a cover film formed on the one surface of the core layer 210 and covering the signal wiring 220 .

[0069] The signal wiring 220 may be connected or bonded to the signal pads 126 and 136 of the antenna patterns 120 and 130. For example, one end of the signal wiring 220 may be exposed by partially removing the cover film of the circuit board 200. The exposed end of the signal wiring 220 may be bonded to the signal pads 126 and 136.

[0070] For example, a conductive bonding structure such as an anisotropic conductive film (ACF) may be attached to the signal pads 126 and 136, and then a bonding region (BR) may be positioned on the conductive bonding structure. Thereafter, the bonding region BR of the circuit board 200 may be attached to the antenna device 100 through a heating / pressing process, so that the signal wiring 220 may be electrically connected to each of the signal pads 126 and 136.

[0071] like Figure 1 As shown, the signal wiring 220 can be independently connected or bonded to each of the signal pads 126 and 128 of the antenna units 120 and 130. In this case, the feed and control signals can be independently supplied from the antenna driver integrated circuit (IC) chip 360 to each of the antenna units 120 and 130.

[0072] In some embodiments, a predetermined number of first antenna units 120 and second antenna units 130 may be coupled via a signal wiring 220 .

[0073] In some embodiments, the circuit board 200 or the core layer 210 may include a first portion 213 and a second portion 215 having different widths, and the width of the second portion 215 may be smaller than the width of the first portion 213 .

[0074] The first portion 213 may be provided as, for example, a main substrate portion of the circuit board 200 . One end portion of the first portion 213 may include a bonding region BR, and the signal wiring 220 may extend from the bonding region BR to the second portion 215 on the first portion 213 .

[0075] The signal wiring 220 may include a bent portion on the first portion 213 (eg, Figure 4 ). Therefore, the signal wiring 210 may extend at a smaller pitch or a higher wiring density on the second portion 215 having a relatively narrow width compared to the width of the first portion 213.

[0076] The second portion 215 may be configured as a connector connection portion. For example, the second portion 215 may be bent toward the rear surface of the image display device to be electrically connected to the second circuit board 350. Thus, the circuit connection of the signal wiring 220 may be easily achieved using the second portion 215 having a reduced width.

[0077] Furthermore, the first portion 213 having a larger width can improve bonding stability with the antenna device 100. If the antenna units 120 and 130 of the antenna device 100 are arranged in an array, the first portion 213 can provide sufficient distribution space for the signal wiring 220.

[0078] In an exemplary embodiment, the first circuit board 200 and the second circuit board 350 may be electrically connected to each other through the connector 300 .

[0079] In some embodiments, the connector 300 may be used as a board-to-board (B2B) connector and may include a first connector 310 and a second connector 320 .

[0080] The first connector 310 may be mounted on the second portion 215 of the first circuit board 210 by surface mounting technology (SMT) to be electrically connected to an end portion of the signal wiring 220 .

[0081] The second circuit board 350 may be, for example, a main board or a rigid printed circuit board of an image display device. For example, the second circuit board 350 may include a resin (e.g., epoxy resin) layer impregnated with an inorganic material (e.g., prepreg) such as glass fiber as a base insulating layer, and may include circuit wiring distributed on the surface and inside of the base insulating layer.

[0082] The antenna driver IC chip 360 may be mounted on the second circuit board 350. As described above, the second connector 320 may be mounted on the second circuit board 350 using, for example, surface mount technology (SMT). For example, the second connector 320 may be electrically connected to the antenna driver IC chip 360 via a connection wiring 365 included in the second circuit board 350.

[0083] like Figure 1 As shown by the arrow, the first connector 310 mounted on the first circuit board 200 and the second connector 320 mounted on the second circuit board 350 can be coupled to each other. For example, the first connector 310 can be configured as a plug connector, and the second connector 320 can be configured as a receptacle connector.

[0084] Therefore, the first circuit board 200 and the second circuit board 350 can be connected through the connector 300, and the antenna driver IC chip 360 can be electrically connected to the antenna units 120 and 130. Therefore, feed / control signals (e.g., phase, beam tilt signals, etc.) can be provided from the antenna driver IC chip 360 to the antenna units 120 and 130. In addition, an intermediate structure of the first circuit board 200-connector 300-second circuit board 350 can be formed.

[0085] As described above, the first circuit board 200 and the second circuit board 350 may be electrically coupled to each other using the connector 300. Therefore, the first circuit board 200 and the second circuit board 350 may be easily connected to each other using the connector 300 without an additional bonding process or heating / pressing process.

[0086] Therefore, dielectric loss due to thermal damage to the substrate and resistance increase due to damage to wiring caused by the heating / pressing process can be prevented to suppress signal loss in the antenna units 120 and 130 .

[0087] Furthermore, the second portion 215 of the first circuit board 200 on which the first connector 310 is mounted can be bent to couple the first connector 310 to the second connector 320 , thereby easily achieving connection with the second circuit board 350 disposed at the rear of the image display device.

[0088] The circuit device 370 and the control device 380 may be mounted on the second circuit board 350 together with the antenna driver IC chip 360. The circuit device 370 may include, for example, capacitors such as multilayer ceramic capacitors (MLCCs), inductors, resistors, etc. The control device 380 may include, for example, a touch sensor driver IC chip, an application processor (AP) chip, etc.

[0089] Figure 2 is a schematic diagram illustrating a connector included in an antenna package according to an exemplary embodiment.

[0090] Reference Figure 2 As described above, the connector 300 may include a first connector 310 and a second connector 320. The first connector 310 and the second connector 320 may be coupled to each other in a male-female thread form or a plug connector form.

[0091] The connector 300 may include an insulator and a conductive connection structure. The first connector 310 may include a first insulator 312 and a first conductive connection structure 315 , and the second connector 320 may include a second insulator 322 and a second conductive connection structure 325 .

[0092] Insulators 312 and 322 may serve as a base or body of connector 300 and may provide an insulating barrier between conductive connection structures 315 and 325. Conductive connection structures 315 and 325 may include Figure 2 The terminal leads are shown protruding outside of the insulators 312 and 322 and the connection pattern is located between the insulation barriers provided by the insulators 312 and 322.

[0093] The terminal leads included in the first connector 310 may be connected to the signal wiring 220 formed on the first circuit board 310 by fusing, soldering, etc., and the terminal leads included in the second connector 320 may be connected to the connection wiring 365 included in the second circuit board 350 by fusing, soldering, etc. Since the first connector 310 may be combined with the second connector 320, the connection patterns may be connected to each other so as to contact each other.

[0094] In an exemplary embodiment, the insulators 312 and 322 may include an insulating material having a dielectric constant (Dk) in the range of 2 to 3.5 and a loss tangent (Df, or dielectric loss) in the range of 0.0015 to 0.007.

[0095] Within the above range, signal loss and gain reduction in the connector 300 can be suppressed in a communication band corresponding to high frequencies or ultrahigh frequencies, for example, above 20 GHz, and sufficient radiation characteristics from the antenna units 120 and 130 can be achieved.

[0096] For example, if the dielectric constant of the insulators 312 and 322 exceeds 3.5 and the loss tangent exceeds 0.007, the signal loss due to the intervention of the connector 300 may be excessively increased, and the reference signal may be lost. Figure 1 The described antenna package structure may not provide adequate communication characteristics at 3G, 4G, 5G or higher frequency bands.

[0097] For example, if the dielectric constant of the insulators 312 and 322 is less than 2 and the loss tangent is less than 0.0015, the mechanical and thermal stability of the connector 300 may deteriorate, and the overall circuit connection reliability of the antenna package may be reduced.

[0098] In a preferred embodiment, the dielectric constant of the insulators 312 and 322 may be 2.0 to 3.3, and the loss tangent may be 0.0015 to 0.0048. More preferably, the dielectric constant of the insulators 312 and 322 may be 2.0 to 2.9, and the loss tangent may be 0.0015 to 0.003.

[0099] The dielectric constant and loss tangent can be values measured at a resonant frequency of 10 GHz using a resonance method. For example, the dielectric constant and loss tangent can be converted from the S21 value and Q value (quality factor) extracted by placing an insulator between a pair of electrodes of a resonator and applying electromagnetic waves through the electrodes.

[0100] In some embodiments, the insulators 312 and 322 may have a liquid crystal polymer (LCP) structure, a polyphenylene sulfide (PPS) structure, and / or a modified polyimide (MPI) structure.

[0101] For example, the insulators 312 and 322 may have at least one LCP structure among structural units represented by the following Chemical Formulas 1 to 4.

[0102] [Chemical Formula 1]

[0103]

[0104] [Chemical Formula 2]

[0105]

[0106] [Chemical Formula 3]

[0107]

[0108] [Chemical Formula 4]

[0109]

[0110] The PPS structure may include a polyphenylene sulfide backbone -(Ar-S-)- (wherein Ar represents a phenylene group). The phenylene group (-Ar-) may include, for example, p-phenylene, m-phenylene, o-phenylene, a substituted phenylene group (e.g., an alkylphenylene group having a substituent such as a C1-C5 alkyl group, an arylphenyl group having a substituent such as a phenyl group, etc.), a diphenylene sulfone group, a biphenylene group, a diphenylene ether group, a diphenylene carbonyl group, and the like.

[0111] The LCP structure and the PPS structure can each include multiple aromatic units in their molecular structures, thereby having increased mechanical and structural stability. In addition, the aromatic units can be rotationally bonded, thereby reducing the deviation of local dielectric polarization.

[0112] Therefore, the insulators 312 and 322 including the LCP and / or PPS structure according to example embodiments may have significantly lower dielectric constants and loss tangent values.

[0113] Furthermore, the dielectric constant and loss tangent values within the above ranges can be obtained by using modified MPI having low dielectric properties.

[0114] Figure 3 1 is a schematic top plan view showing an antenna package according to an exemplary embodiment. Figure 1 A detailed description of those elements and materials that are substantially the same or similar as those described.

[0115] Reference Figure 3 , the connector 300 can be configured as a board-to-film (B2F) connector. For example, the connector 300 can include an insulator 305, and the insulator 305 can include a slot 303, into which the end of the second portion 215 of the first circuit board 210 is inserted.

[0116] A connection terminal 225 formed at an end of the signal wiring 220 may be provided on an end of the second portion 215 , and the connection terminal 225 may be inserted into the socket 303 of the connector 305 to be electrically connected to each connection plug 307 .

[0117] The connection plugs 307 of the connector 305 may be isolated from each other by the insulator 305 and may be electrically connected to the antenna driving IC chip 360 through the antenna connection port 320 included in the second circuit board 350 .

[0118] The insulator 305 may include a dielectric material having the above-mentioned dielectric constant and loss tangent ranges, and may preferably include an LCP structure, a PPS structure, and / or an MPI.

[0119] Figure 4 1 is a schematic top plan view showing an antenna package according to some exemplary embodiments. Figures 1 to 3 A detailed description of those elements and structures that are substantially the same or similar as those described.

[0120] Reference Figure 4 , the first antenna units 120 included in the antenna device 100 may be disposed adjacent to each other, and the second antenna units 130 may be disposed adjacent to each other.

[0121] For example, a plurality of first antenna units 120 may be arranged adjacent to each other in a horizontal row direction to form a first radiation group. In addition, a plurality of second antenna units 130 may be arranged adjacent to each other in a horizontal row direction to form a second radiation group. The first radiation group and the second radiation group may be separated by a predetermined distance and may be adjacent to each other in a horizontal row direction.

[0122] Therefore, antenna elements having the same resonance frequency can be arranged adjacent to each other in the row direction, thereby enhancing or increasing the radiation gain within a limited area.

[0123] As reference Figures 1 to 4 As described above, the antenna device 100 may include antenna units having different sizes and different resonant frequencies. In some embodiments, the antenna device 100 may include antenna units in an array having the same size and the same resonant frequency.

[0124] Figure 5 and Figure 6 1 and 2 are schematic cross-sectional views and top plan views respectively showing an image display device according to an exemplary embodiment. Figure 6 The second circuit board 350 is omitted in the figure.

[0125] Reference Figure 5 and Figure 6 , the image display device 400 can be implemented in the form of a smart phone, for example, Figure 6The front or window surface of the image display device 400 is shown. The front of the image display device 400 may include a display area 410 and a peripheral area 420. The peripheral area 420 may correspond to, for example, a light shielding portion or a frame portion of the image display device.

[0126] The antenna device 100 included in the antenna package may be disposed toward the front of the image display device 400. For example, the antenna package may be disposed on the display panel 405. In one embodiment, the radiation patterns 122 and 132 may be at least partially disposed in the display region 410.

[0127] In this case, the radiation patterns 122 and 132 may include a mesh pattern structure, and a reduction in transmittance due to the radiation patterns 122 and 132 may be prevented. The pads 126, 128, 136, and 138 included in the antenna units 120 and 130 may be formed of a solid metal pattern and may be provided in the peripheral area 420 to prevent image quality from being deteriorated.

[0128] In some embodiments, the first circuit board 200 can be bent using the second portion 215 and can be disposed on the rear of the image display device 400 and can extend to a second circuit board 350 (e.g., a main board) on which the antenna driving IC chip 360 can be mounted.

[0129] The first circuit board 200 and the second circuit board 350 may be interconnected through connectors 310 and 320 to implement feeding and driving control from the antenna driving IC chip 360 to the antenna device 100 .

[0130] As described above, circuit connection by bending can be stably provided using the connector 300 , and a high frequency or ultra-high frequency antenna can be effectively applied to the image display device 400 using the configuration of the insulator included in the connector.

[0131] Hereinafter, preferred embodiments are presented to more particularly describe the present invention. However, the following examples are provided merely to illustrate the present invention, and those skilled in the relevant art will readily appreciate that various substitutions and modifications may be made within the scope and spirit of the present invention. Such substitutions and modifications are appropriately encompassed by the appended claims.

[0132] Experimental example

[0133] A sample of an insulator (30 mm × 50 mm, thickness: 0.95 mm) containing material for a connector was placed between opposing electrodes of a resonator (SPDR (separated-pillar dielectric resonator), QWED), and a 10 GHz electromagnetic wave was introduced for resonance (the detailed shape and size of the resonator and the measurement standard are described in detail at https: / / www.qwed.com.pl / resonators_spdr.html).

[0134] In addition, a sample substrate (thickness: 50 μm, length: 40 mm) including an insulator material and a transmission line formed thereon was prepared, and the S parameter (S21, see the equation below) value was extracted using a network analyzer (Anritsu MS46522B network analyzer). The dielectric constant (Dk) and loss tangent (Df) of the insulator were converted from the extracted values.

[0135] [Equation 1]

[0136] S21 (dB) = 10 × Log (output power / input power)

[0137] The experimental results are shown in Table 1. Commercially available LCP, PPS and MPI resin products having different chemical compositions were purchased and used as materials for the insulation.

[0138] The evaluation criteria are as follows.

[0139] ◎: S21: 0dB to -2.5dB

[0140] ○: S21: -2.5dB or less and -3dB or more

[0141] ×: S21: -3dB or less

[0142] [Table 1]

[0143]

[0144]

[0145] Referring to Table 1, in the examples in which the dielectric constant of the insulator is adjusted to be within the range of 2 to 3.5 and the loss tangent is adjusted to be within the range of 0.0015 to 0.007, an improved S21 value of -3.0 dB or more is obtained.

Claims

1. An antenna package, characterized in that: It includes: an antenna device comprising an antenna pattern; a connector electrically connected to the antenna pattern; a first circuit board bonded to the antenna pattern, the first circuit board including signal wiring extending between the antenna pattern and the connector; as well as A second circuit board coupled to the first circuit board via the connector, wherein the second circuit board is provided with an antenna driving integrated circuit chip and a control device. The connector includes a first connector mounted on the first circuit board and a second connector mounted on the second circuit board together with the antenna drive integrated circuit chip and the control device, and the connector includes: An insulator having a dielectric constant of 2 to 3.5 and a loss tangent of 0.0015 to 0.007 as measured by a resonance method at 10 GHz; and A conductive connection structure is isolated by the insulator and electrically connected to the antenna pattern.

2. The antenna package according to claim 1, wherein: The dielectric constant of the insulator is 2.0 to 3.3, and the loss tangent is 0.0015 to 0.0048.

3. The antenna package according to claim 1, wherein: The insulator has at least one of a liquid crystal polymer structure, a polyphenylene sulfide structure, and a modified polyimide structure.

4. The antenna package according to claim 1, wherein: The first connector is a plug connector and the second connector is a receptacle connector.

5. The antenna package according to claim 1, wherein: The first connector includes a first insulator and the second connector includes a second insulator, Each of the first insulator and the second insulator has a dielectric constant of 2 to 3.5 and a loss tangent of 0.0015 to 0.007 measured at 10 GHz by a resonance method.

6. The antenna package according to claim 1, wherein: The connector includes a socket coupled to an end portion of the first circuit board, and The second circuit board includes an antenna connection port coupled to the connector.

7. The antenna package according to claim 1, wherein: The first circuit board is a flexible printed circuit board and the second circuit board is a rigid printed circuit board.

8. The antenna package according to claim 1, wherein: The first circuit board includes a first portion joined to the antenna pattern and a second portion having a width smaller than that of the first portion, and The connector is coupled to the second portion.

9. The antenna package according to claim 1, wherein: The antenna pattern includes a plurality of antenna patterns arranged in an array, and The signal wiring of the first circuit board includes a plurality of signal wirings each of which is electrically connected to each of the plurality of antenna patterns.

10. The antenna package according to claim 9, wherein: The conductive connection structure of the connector includes a plurality of conductive connection structures electrically connected to each of the plurality of signal wirings.

11. The antenna package according to claim 9, wherein: The antenna pattern includes a first antenna pattern and a second antenna pattern having different sizes.

12. The antenna package according to claim 11, wherein: The first antenna pattern and the second antenna pattern have different resonance frequencies.

13. The antenna package according to claim 11, wherein: The antenna device further includes an antenna dielectric layer on which the antenna pattern is disposed, and The first antenna pattern and the second antenna pattern are alternately and repeatedly arranged on the antenna dielectric layer along a width direction.

14. The antenna package according to claim 11, wherein: The antenna device further includes an antenna dielectric layer on which the antenna pattern is disposed, and The antenna device includes a first radiation group formed by the first antenna patterns adjacent to each other in a width direction on the antenna dielectric layer, and a second radiation group formed by the second antenna patterns adjacent to each other in the width direction on the antenna dielectric layer.

15. An image display device, characterized in that: It includes: Display panel; as well as The antenna package according to claim 1 is provided on the display panel.

16. The image display device according to claim 15, wherein It also includes: a mainboard disposed below the display panel; and The antenna driver integrated circuit chip is mounted on the mainboard. The antenna package is bent below the display panel and coupled to the mainboard via the connector, thereby being electrically connected to the antenna driver integrated circuit chip.

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