Substrate conveyance device

Abstract

A substrate transfer device capable of reducing adhesion of dust to a substrate is provided. A substrate transfer device (1) according to an embodiment includes: a transfer arm (2) for transferring a substrate; a support post (32) fixedly erected on a base (31); an upper link (33) having one end supporting the transfer arm (2) and rotatably coupled to the support post (32) and raising and lowering the transfer arm (2) as it rotates; a lower link (34) rotatably coupled to a position below the coupling portion of the upper link (33) in the support post (32) about an axis parallel to the axis of rotation of the upper link (33); a connecting link (35) rotatably coupled to the upper link (33) and the lower link (34) in such a manner that the upper link (33) rotates as the lower link (34) rotates; and a drive unit (4) that rotates the lower link (34).

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate transfer device. BACKGROUND

[0002] A substrate processing apparatus is an apparatus that processes a substrate such as a wafer or a liquid crystal substrate in a manufacturing step of a semiconductor or a liquid crystal panel. The processing of the substrate includes various processes such as etching for forming a circuit, resist stripping, cleaning, drying, and the like. In such a substrate processing apparatus, there are cases where a plurality of substrates are processed at a time, but there are also cases where the substrates are processed one by one from the viewpoint of uniformity or reproducibility of the processing of each substrate. The processing of the substrates one by one as described above is referred to as piece-by-piece processing.

[0003] In addition, in order to avoid dust from adhering to the substrates, a plurality of substrates are housed in a sealed cassette, and the substrates are transferred between the substrate processing apparatuses. As the cassette, for example, there is a Front-Opening Unified Pods (FOUP).

[0004] In a substrate processing apparatus that performs piece-by-piece processing, since the substrates are processed one by one in one chamber, the processing efficiency is low as compared with the case where the substrates are processed at a time. Therefore, a plurality of chambers that perform each processing step are arranged in the substrate processing apparatus in the horizontal direction, and the processing in each chamber is performed simultaneously or consecutively to improve the work efficiency.

[0005] Therefore, in the substrate processing apparatus described above, a substrate transfer device that transfers the substrates between the cassette and the chamber is necessary. The substrate transfer device takes out the substrates one by one from the cassette transferred from the previous step and transfers them into the chamber, and houses the substrates processed in the chamber into the cassette.

[0006] Further, a buffer unit that temporarily places the substrates is provided in the substrate processing apparatus described above. Also, a substrate transfer device for the cassette (for transfer) that transfers the substrates between the cassette and the buffer unit and a substrate transfer device for the chamber (for transfer) that transfers the substrates between the delivery table and the chamber are separated, and thus the work efficiency is improved.

[0007] That is, the substrate transfer device for the cassette has a transfer robot including two arms, and takes out the substrates one by one from the cassette using one of the arms while loading the processed substrates into the cassette using the other arm. Then, the transfer robot moves to the buffer unit, receives the processed substrates from the buffer unit using the other arm while placing the unprocessed substrates in the buffer unit using one of the arms.

[0008] A substrate transfer device for a chamber has a transfer robot including two arms, receives an unprocessed substrate from a buffer area with one arm, and places a processed substrate in the buffer area with the other arm. Then, the transfer robot moves to the chamber, carries out the processed substrate from the chamber with the other arm, and carries in an unprocessed substrate into the chamber with one arm.

[0009] Further, as a method for improving the productivity of a substrate processing apparatus, a configuration is adopted in which chambers are stacked vertically to increase the number of chambers without expanding the footprint, i.e., the occupied area, of the apparatus. In such a substrate processing apparatus, a substrate transfer device for the chambers is required to have a mechanism for moving the two arms in the horizontal direction and a mechanism for moving them in the vertical direction.

[0010] As a substrate transfer device including a mechanism for moving in the vertical direction, the device shown in Patent Document 1 is proposed. The substrate transfer device is a pull rod type device in which the entire device is vertically extended and contracted by vertically moving a superposed cylindrical container in the axial direction.

[0011] [Related Art Documents]

[0012] [Patent Documents]

[0013] [Patent Document 1] Japanese Patent Laid-Open No. 11-87461 SUMMARY

[0014] [Problems to be Solved by the Invention]

[0015] In order to prevent the adhesion of dust to a substrate and the like, the inside of a chamber of a substrate processing apparatus is managed to improve the yield by strict environmental management. Therefore, the transfer chamber of the substrate processing apparatus is configured as a dust-free chamber in which exhaust is performed at a position lower than the height of substrate transfer by a downward flow from the top. However, the operation of various mechanisms in the transfer chamber of the substrate processing apparatus can cause turbulence in the air flow. If the air flow is turbulent, there is a possibility that dust that is exhausted to the ground side in a stable downward flow will fly upward and adhere to a substrate. Although the turbulent air flow will recover over time, waiting for it to become stable can cause a reduction in the processing speed. Therefore, it is preferable to suppress the turbulence of the air flow in the transfer chamber of the substrate processing apparatus to a minimum.

[0016] However, in the case of a puller type substrate transfer device, for example, if the movement of the cylindrical containers causes the entire body to expand and contract, the volume inside the containers greatly changes. Thus, the cylindrical containers function as pistons, and each time the containers move up and down, air is sucked in and discharged from the gap between the containers. That is, when the entire body contracts, air is ejected from the inside, and when the entire body expands, air flows into the inside. Thus, if the arms are raised and lowered, the air flow inside the substrate processing device greatly becomes turbulent, causing dust to adhere to the substrate. Also, the volume occupied by the cylindrical containers inside the substrate processing device increases, so turbulence of the air flow easily occurs in the horizontal direction or the vertical direction.

[0017] The present application has been achieved in order to solve the problems described above, and has an object to provide a substrate transfer device that can suppress turbulence of air flow and reduce adhesion of dust to a substrate.

[0018] [Technical Means for Solving the Problems]

[0019] The present application includes: a transfer arm for transferring a substrate; a support column that is erected at a fixed angle with respect to a base; an upper link that supports one end of the transfer arm so as to be rotatable with respect to the support column and raises and lowers the transfer arm as it rotates; a lower link that is rotatable with respect to the support column at a position below the position at which the upper link is connected to the support column; a connection link that is rotatable with respect to the upper link and the lower link so that the upper link rotates as the lower link rotates; and a drive unit that rotates the lower link.

[0020] [Effects of the Invention]

[0021] According to the present application, a substrate transfer device that can suppress turbulence of air flow and reduce adhesion of dust to a substrate can be obtained. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a plan view showing the overall structure of a substrate processing device of a substrate transfer device to which the embodiment is applied.

[0023] Figure 2 is a perspective view of the substrate transfer device of the embodiment when the transfer arm is in a lowered end state.

[0024] Figure 3 is a perspective view of the substrate transfer device of the embodiment when the transfer arm is in a raised end state.

[0025] Figure 4 is a side view of the substrate transfer device of the embodiment when the transfer arm is in a lowered end state.

[0026] Figure 5is a side view of the substrate transfer device of the embodiment and the case where the transfer arm is in the raised end.

[0027] Figure 6 (A) of FIG. 1 is Figure 6 (C) of FIG. 1 is Figure 3 is a cross-sectional view taken at the α surface, β surface, γ surface of

[0028] Figure 7 (A) of FIG. 1 is Figure 7 (D) of FIG. 1 is an explanatory view showing the action of the holding arm.

[0029] Figure 8 is a front view showing the transfer-in, transfer-out action of the substrate with respect to the chamber.

[0030] Figure 9 is a plan view showing the transfer-in, transfer-out action of the substrate with respect to the chamber.

[0031] Figure 10 is a plan view showing an example of the rotary arm.

[0032] Figure 11 is a plan view showing the case where the substrate transfer device is provided in two rows.

[0033] [Explanation of symbols]

[0034] 1, T: substrate transfer device

[0035] 2: transfer arm

[0036] 3: lifting link

[0037] 4: drive section

[0038] 21: work table

[0039] 22: upper arm

[0040] 23: lower arm

[0041] 24: arm base

[0042] 24a: lifting shaft

[0043] 25: drive arm

[0044] 26: connecting section

[0045] 27: holding arm

[0046] 27a: movable pressure plate

[0047] 27b: beam section

[0048] 27c: fixed pressure plate

[0049] 31: base

[0050] 32: support

[0051] 33: upper link

[0052] 33a: auxiliary link

[0053] 34: lower link

[0054] 35: connecting link

[0055] 36: weight

[0056] 37: exhaust port

[0057] 38: outer cylinder

[0058] 38a, 39a: air hole

[0059] 38b: bearing

[0060] 39: inner cylinder

[0061] 41: linear motion mechanism

[0062] 41a: drive source

[0063] 41b, 51b: linear motion part

[0064] 42: conversion part

[0065] 42a: swing arm

[0066] 100: substrate processing apparatus

[0067] 110: processing chamber

[0068] 115b, 151b: moving base

[0069] 120: cassette mounting area

[0070] 121: opener

[0071] 130: first conveyance area

[0072] 131: buffer unit

[0073] 132: conveyance robot

[0074] 132a, 132b: arm

[0075] 133, 151: moving mechanism

[0076] 140: chamber arrangement area

[0077] 141: chamber

[0078] 141a: opening

[0079] 141b: placement table

[0080] 150: second conveyance area

[0081] 151a: straight rail

[0082] 160: auxiliary area

[0083] 161: liquid supply device

[0084] 162: control device

[0085] CA: cassette

[0086] W: substrate DETAILED DESCRIPTION

[0087] A substrate conveyance apparatus according to an embodiment and a substrate processing apparatus using the substrate conveyance apparatus will be described with reference to the drawings.

[0088] [Substrate processing apparatus]

[0089] First, the overall configuration of the substrate processing apparatus 100 using the substrate conveyance apparatus 1 according to the present embodiment will be described with reference to FIG. 1. Figure 1 and Figure 2 An outline of the substrate processing apparatus 100 using the substrate conveyance apparatus 1 according to the present embodiment will be described. Figure 1 FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus 100. Figure 2 FIG. 2 is a perspective view of the substrate conveyance apparatus 1. The substrate processing apparatus 100 includes chambers 141 that perform processing of a plurality of substrates W, and is a piece-by-piece processing apparatus that processes the plurality of substrates W, which have been housed in cassettes CA (FOUPs) and conveyed in the previous step, one by one in each of the chambers 141. The substrate W is, for example, a semiconductor wafer in a disc shape. As the processing, for example, etching, resist peeling, rinsing, cleaning, and the like are performed. However, the substrate W is not limited thereto, and various substrates W, such as a substrate W for a display device, are subjected to piece-by-piece processing.

[0090] The substrate processing apparatus 100 includes a cassette mounting area 120 including processing chambers 110 configured in a cuboid shape, a first conveyance area 130, a chamber arrangement area 140, a second conveyance area 150, and an auxiliary area 160.

[0091] Further, in the following description, the direction along the gravity will be set as the lower side, and the direction against the gravity will be set as the upper side. In the present embodiment, the substrate processing apparatus 100 is disposed with the horizontal floor surface of a factory or the like as the lower side. In addition, the cassette mounting area 120 side of the substrate processing apparatus 100 will be set as the front side, and the opposite side thereof will be set as the rear side. The horizontal direction of the left and right will be set as the width direction when viewed from the front side.

[0092] (Cassette mounting area)

[0093] The cassette mounting area 120 is an area in which a plurality of cassettes CA are arranged in a row along the width direction along the front surface of the processing chamber 110. The cassette CA is a housing that accommodates a plurality of substrates W in a state in which the substrates W are stacked at a specific interval in the horizontal direction. As the cassette CA, a general FOUP can be applied. An opener 121 that opens the door of each cassette CA is provided at the mounting position of each cassette CA of the cassette mounting area 120. The cassettes CA are carried into or out of the position of each opener 121 of the cassette mounting area 120 by a robot (not shown) that travels on the top.

[0094] (First conveyance area)

[0095] The first conveyance area 130 includes a buffer unit 131, a conveyance robot 132, and a moving mechanism 133, and is an area in which the conveyance robot 132 that moves by the moving mechanism 133 conveys the substrates W between the cassettes CA and the buffer unit 131. The first conveyance area 130 is provided at the rear of the cassette mounting area 120.

[0096] The buffer unit 131 is a stage that temporarily places the substrates W. Two buffer units 131 are provided at positions apart from each other in the left and right as viewed from the front. A plurality of substrates W in a state in which the substrates W are stacked at a specific interval in the horizontal direction are accommodated into the buffer unit 131, respectively.

[0097] The conveyance robot 132 is a two-arm structure that includes two arms 132a, 132b that hold one substrate W each. The arm 132a is positioned at the lower side in a state of holding the substrate W, and the arm 132b is positioned at the upper side in a state of holding the substrate W. The conveyance robot 132 is provided so as to be movable along the arrangement direction of the cassettes CA by the moving mechanism 133. As the moving mechanism 133, for example, a linear guide is used.

[0098] The arm 132a of the lower side of the conveyance robot 132 takes out an unprocessed substrate W from the cassette CA and turns around to move to the buffer unit 131 to accommodate the substrate W. In addition, the arm 132b of the upper side takes out a processed substrate W from the buffer unit 131 and turns around to move to the cassette CA to return the substrate W. The reason why the arm 132a of the lower side conveys the unprocessed substrate W and the arm 132b of the upper side conveys the processed substrate W is to prevent some components from reaching the processed substrate W and dust and the like from adhering thereto.

[0099] (Chamber arrangement area)

[0100] The chamber arrangement area 140 is an area in which a plurality of chambers 141 for performing various processes are arranged. Each chamber 141 includes an opening 141a opened and closed by a shutter, and a stage 141b on which a substrate W to be processed is placed. Further, the description of the structure required for processing in each chamber 141, such as a nozzle for supplying a processing liquid to the substrate W, is omitted. Each chamber 141 processes one piece of the substrate W placed on the stage 141b.

[0101] In addition, the chambers 141 are arranged in multiple numbers in the front-rear direction, and two rows are arranged in the width direction with an interval for the second transfer area 150 between the two rows. Further, as viewed from the front, two pieces are arranged in the upper and lower positions on the left side, and three pieces are arranged in the upper and lower positions on the right side (see FIG. 1). Each chamber 141 is arranged so that the opening 141a faces the second transfer area 150. Figure 8 ). Each chamber 141 is arranged so that the opening 141a faces the second transfer area 150.

[0102] (Second transfer area)

[0103] The second transfer area 150 is an area in which the substrate transfer device 1 of the present embodiment is arranged, and transfers the substrate W between the buffer unit 131 and the chambers 141, and between the chambers 141. The substrate transfer device 1 includes a transfer arm 2 of a double-arm structure including an upper arm 22 and a lower arm 23. The transfer arm 2 takes out the unprocessed substrate W from the buffer unit 131 by the upper arm 22, and takes in the processed substrate W into the buffer unit 131 by the lower arm 23. In addition, the transfer arm 2 takes out the processed substrate W from the chamber 141 by the lower arm 23, and takes in the unprocessed substrate W into the chamber 141 by the upper arm 22.

[0104] The substrate transfer device 1 is provided so as to be movable between the buffer unit 131 and the chambers 141 by a moving mechanism 151. The moving mechanism 151 is a linear guide including a straight rail 151a and a moving base 151b. The straight rail 151a is a guide rail provided to the bottom of the processing chamber 110 so as to extend in the front-rear direction. The moving base 151b supports the substrate transfer device 1, and is provided so as to be movable in the front-rear direction by the straight rail 151a.

[0105] (Attendant area)

[0106] The attendant area 160 is provided to the rear portion of the processing chamber 110. The attendant area 160 accommodates a liquid supply device 161 and a control device 162. The liquid supply device 161 supplies various processing liquids such as etching liquid, resist stripping liquid, rinsing liquid, cleaning liquid, and the like to the chambers 141. The control device 162 is a computer including an arithmetic device, a storage device, a signal transmitting and receiving device, an input and output device, and the like. The control device 162 controls each portion of the substrate processing device 100 by executing a substrate processing program or the like stored in the storage device.

[0107] Further, the inside of the processing chamber 110 of the substrate processing apparatus 100 described above is configured as a clean room. That is, although not shown, a fan filter unit (FFU) is provided at the top of the processing chamber 110. The FFU provides an ultra-low penetration air (ULPA) filter downstream of a fan, and causes the air purified by the ULPA filter to flow downward as a downdraft. A dedicated exhaust port for the first and second transfer areas 130 and 150 is provided at the bottom of the processing chamber 110. Thus, the gas in the processing chamber 110 is exhausted together with dust from the exhaust port at the bottom of the processing chamber 110. In addition, the first and second transfer areas 130 and 150 are maintained at a positive pressure compared to the outside.

[0108] Further, a downdraft caused by the FFU is also formed in the factory in which the processing chamber 110 is provided, and the factory is exhausted by an exhaust device provided on the ground via a grid provided on the ground.

[0109] [Substrate transfer apparatus]

[0110] Reference Figures 2 to 6 Details of the substrate transfer apparatus 1 of the present embodiment will be described. As shown in FIG. 1, the substrate transfer apparatus 1 includes a transfer arm 2, a lifting link 3, and a drive section 4. As described above, the transfer arm 2 performs exchange of the substrate W with the buffer unit 131 and exchange of the substrate W with the chamber 141. The lifting link 3 lifts and lowers the transfer arm 2 in accordance with the height of the chamber 141. The drive section 4 drives the lifting link 3. Details of each section will be described below. Figure 2

[0111] (Transfer arm)

[0112] The transfer arm 2 includes a table 21, an upper arm 22, a lower arm 23, and an arm base 24. The table 21 is a table configured such that the top surface thereof is in the horizontal direction. The top surface of the table 21 is sized to accommodate the substrate W in the horizontal direction within the outer edge thereof. For example, the width of the table 21 is equal to or slightly longer than the diameter of the substrate W. By slightly longer is meant a length within several cm from the outer edge of the substrate W. In addition, the table 21 is held by the lower arm 23 (wet arm described below) and functions as a water pan to prevent liquid from falling from the substrate W in the liquid-coated state to the moving mechanism 151.

[0113] ​Upper arm 22 and lower arm 23 are arms that hold the substrate W. Upper arm 22 and lower arm 23 share a common structure, including a drive arm 25, a connecting part 26, and a gripping arm 27. One end of the drive arm 25 is supported on the worktable 21 in a manner that allows it to rotate horizontally about a vertical axis. Details regarding the range of rotation, etc., will be described below. The drive arm 25 is driven to rotate by a motor (not shown). The connecting part 26 is connected to the other end of the drive arm 25 in a manner that allows it to rotate horizontally about a vertical axis.

[0114] The gripping arm 27 is mounted on the connecting portion 26 and is configured to rotate horizontally together with the connecting portion 26. The gripping arm 27 includes a movable pressure plate 27a, a beam portion 27b, and a fixed pressure plate 27c. The movable pressure plate 27a includes a pair of claws that separate from the edge of the substrate W. The movable pressure plate 27a is moved by a cylinder (not shown) in the direction in which the claws separate from the edge of the substrate W.

[0115] The beam portion 27b is a pair of rod-shaped members extending from the connecting portion 26 across the upper direction of the base plate W to the opposite side. The fixed pressure plate 27c is fixed to the front end of the beam portion 27b and includes a pair of claws that engage with the edge of the base plate W at a position facing the movable pressure plate 27a. The movable pressure plate 27a, by moving to the position where the claws engage with the edge of the base plate W, becomes a gripping position that holds the base plate W between the claws of the fixed pressure plate 27c (see reference). Figure 7 (C)). Furthermore, the movable pressure plate 27a becomes the release position for releasing the substrate W by moving to a position where the claw separates from the edge of the substrate W (see reference). Figure 7 (B)

[0116] In addition, as described above, the upper arm 22 and the lower arm 23 move between a receiving position in which the substrate W held by the gripping arm 27 is accommodated in the outer edge of the top surface of the worktable 21 and an interface position in which they are offset from the worktable 21 in the width direction to achieve interface with the outside.

[0117] That is, such as Figure 2 and Figure 3 As shown, the drive shafts of the drive arms 25 of the upper arm 22 and lower arm 23 are located at the front and rear ends of the worktable 21, and at the center in the width direction. Figure 3 As shown, when the length direction of the mutual drive arms 25 is in the front-back direction, the upper arm 22 and the lower arm 23 are arranged with a gap between them so as not to interfere with each other and overlap vertically. At this time, the drive arms 25 of the upper arm 22 and the lower arm 23 and the gripping arm 27 are all arranged vertically overlapping. Thus, the upper arm 22 and the lower arm 23 become the receiving position of the substrate W held by the gripping arm 27 within the outer edge of the worktable 21 when viewed from above.

[0118] Further, the upper arm 22 can function as an arm for carrying the processed substrate W, and the lower arm 23 can function as an arm for carrying the unprocessed substrate W. In addition, the upper arm 22 can function as a dry arm for carrying the substrate W in a surface-dried state, and the lower arm 23 can function as a wet arm for carrying the substrate W in a surface-liquid-covered state. That is, it is to prevent the liquid of the substrate W in the liquid-covered state after processing from dripping and adhering to the unprocessed substrate W.

[0119] Further, although not shown, a pulley coaxial with the drive shaft is fixed inside the drive arm 25, and a pulley coaxial with the link shaft is fixed inside the link portion 26. A timing belt is stretched between these pulleys. Therefore, if the drive arm 25 in the housed position is rotated, the rotation is transmitted to the link portion 26 via the timing belt, so that the holding arm 27 is rotated together with the link portion 26. Thus, as shown in FIG. 1, the drive arm 25 and the holding arm 27 are spread in the width direction in such a manner as to eliminate the overlap with each other, and extend in a straight line, becoming a transfer position at which the substrate W is transferred to the outside while being deviated inward from the outer edge of the table 21. Figure 2

[0120] Further, the upper arm 22 and the lower arm 23 of the present embodiment can be extended in the left direction or the right direction as viewed from the front by the rotation of the drive arm 25 as described above, and include the transfer position (see FIG. 1) in both the left and right directions. That is, the upper arm 22 and the lower arm 23 have a rotation range of 180° at the maximum with the axis of the drive arm 25 as the center. Figure 8 Figure 9

[0121] The arm stand 24 is a member that supports the table 21 from below. A lifting mechanism that lifts the upper arm 22 and the lower arm 23 integrally is provided in the arm stand 24. That is, the upper end of a lifting shaft 24a that can be moved in the vertical direction is fixed to the arm stand 24, and the lifting shaft 24a is moved in the vertical direction by the lifting mechanism, so that the upper arm 22 and the lower arm 23, and the table 21 are lifted.

[0122] The lifting of the arm stand 24 is necessary for the lowering when the substrate W is placed on the holding arm 27 in the buffer unit 131 or the chamber 141, and the raising when the substrate W is lifted. Although not shown, the lifting mechanism can use a pneumatic cylinder, a gear mechanism, a ball screw mechanism, or the like.

[0123] Further, the operation between the housed position and the transfer position of the upper arm 22 and the lower arm 23, the operation between the release position and the holding position of the holding arm 27, and the lifting operation of the arm stand 24 are controlled by the control device 162.

[0124] (Lifting link)

[0125] ​​​The lifting link 3 includes a base 31, a support column 32, an upper link 33, a lower link 34, and a connecting link 35. The base 31 is a member that supports the entire substrate conveyance device 1. The base 31 is fixed to the moving base 151b or is integrally formed with the moving base 115b. The support column 32 is a member that is erected at a fixed angle with respect to the base 31. The support column 32 of the present embodiment is an angular columnar member that is erected at a predetermined specific angle. In the present embodiment, the angle is an angle in which the upper end is tilted slightly rearward.

[0126] The upper link 33 supports the conveyance arm 2 at one end, is coupled to the support column 32 in a rotatable manner, and lifts and lowers the conveyance arm 2 as it rotates. The axis of rotation of the upper link 33 is the width direction (see FIG. 2). Figure 4 Figure 5 The upper link 33 is a plate-like long member that is thinner in the width direction than in the front-rear direction. The front end of the upper link 33 is coupled to the rear end of the arm base 24 of the conveyance arm 2 in a rotatable manner. The upper link 33 extends rearward beyond the coupling portion with the support column 32.

[0127] In addition, an auxiliary link 33a is provided above the upper link 33 in a manner parallel to the upper link 33. The auxiliary link 33a is a plate-like long member that is thinner in the width direction than in the front-rear direction. The front end of the auxiliary link 33a is coupled to the rear end of the arm base 24 in a rotatable manner, and the rear end is coupled to the support column 32 in a rotatable manner.

[0128] The front end of the lower link 34 is coupled to the support column 32 below the coupling portion with the upper link 33 in a manner rotatable about an axis parallel to the axis of rotation of the upper link 33. The lower link 34 is a plate-like long member that is thinner in the width direction than in the front-rear direction. The lower link 34 is parallel to the upper link 33.

[0129] The connecting link 35 is coupled to the rear ends of the upper link 33 and the lower link 34 in a rotatable manner in a manner that rotates as the lower link 34 rotates. The connecting link 35 is a plate-like long member that is thinner in the width direction than in the front-rear direction.

[0130] The support column 32, the upper link 33, the lower link 34, and the connecting link 35 constitute a four-link chain in which the support column 32 is a stationary link, the upper link 33 is a driven link, the lower link 34 is a prime mover link, and the connecting link 35 is an intermediate link. In the present embodiment, the four-link chain including the support column 32, the upper link 33, the lower link 34, and the connecting link 35 is a parallel link in which the distances between the facing axes are equal and parallel. Furthermore, the support column 32, the upper link 33, the auxiliary link 33a, and the arm base 24 also constitute a parallel link.

[0131] In the following description, as Figure 4 and​Figure 5 As shown, the axis of the lower link 34 of the driving link and the joint portion of the support 32 is set as axis A, and the axis of the upper link 33 of the driven link and the joint portion of the support 32 is set as axis B. Further, the axis of the lower link 34 of the driving link and the joint portion of the connecting link 35 is set as axis C, and the axis of the upper link 33 of the driven link and the joint portion of the connecting link 35 is set as axis D. Further, the axis of the support 32 and the joint portion of the auxiliary link 33a is set as axis E, the axis of the upper link 33 and the joint portion of the arm base 24 is set as axis F, and the axis of the auxiliary link 33a and the joint portion of the arm base 24 is set as axis G. Note that these axes A to G indicate the center of rotation and do not indicate members. The detailed structure of the joint portions will be described later.

[0132] As shown in FIG. 6, the lower link 34 rotates around axis A, and the connecting link 35 lifts while rotating around axis C, so that axis D lifts. Thus, the upper link 33 rotates around axis B, and the carrying arm 2 lifts. For example, as shown in FIG. 6, when the lower link 34 rotates clockwise, the carrying arm 2 lifts as shown in FIG. 7. Figure 4 Figure 5 As shown in FIG. 6, the lower link 34 rotates around axis A, and the connecting link 35 lifts while rotating around axis C, so that axis D lifts. Thus, the upper link 33 rotates around axis B, and the carrying arm 2 lifts. For example, as shown in FIG. 6, when the lower link 34 rotates clockwise, the carrying arm 2 lifts as shown in FIG. 7. Figure 4 Figure 5 As shown in FIG. 6, the lower link 34 rotates around axis A, and the connecting link 35 lifts while rotating around axis C, so that axis D lifts. Thus, the upper link 33 rotates around axis B, and the carrying arm 2 lifts. For example, as shown in FIG. 6, when the lower link 34 rotates clockwise, the carrying arm 2 lifts as shown in FIG. 7. Figure 5 Figure 4 As shown in FIG. 6, the lower link 34 rotates around axis A, and the connecting link 35 lifts while rotating around axis C, so that axis D lifts. Thus, the upper link 33 rotates around axis B, and the carrying arm 2 lifts. For example, as shown in FIG. 6, when the lower link 34 rotates clockwise, the carrying arm 2 lifts as shown in FIG. 7.

[0133] Even if the angle is changed by the rotation of the upper link 33, the angle of the section between axis F and axis G and the angle of the section between axis B and axis E are maintained in parallel with each other without changing. Thus, the angle of the carrying arm 2 is maintained in a state in which the top surface of the table 21 is horizontal. Thus, even if the height of the carrying arm 2 is changed, the substrate W held by the upper arm 22 and the lower arm 23 and carried can be always maintained horizontal.

[0134] Further, a weight 36 is provided to the connecting link 35. The weight 36 is preferably selected in a manner to match the carrying arm 2 with axis B as a fulcrum. Thus, the force required at the start of movement from one moving end to the other moving end can be reduced.

[0135] Further, as shown in cross-sectional views of the α, β, and γ of FIG. 6 as a cutting plane, (A) of FIG. 7, (B) of FIG. 8, and (C) of FIG. 9, the inside of the lifting link 3 is communicated in a manner that gas can flow therethrough. Further, an exhaust port 37 is provided to the lifting link 3 to exhaust gas from the drive section 4 side, i.e., the lower side. Figure 3 Figure 6 Figure 6 Figure 6

[0136] ​​​​​​​More specifically, the support column 32, upper link 33, lower link 34, connecting link 35, and auxiliary link 33a are hollow square tubes. Furthermore, the connecting portion used to connect these square tubes to achieve rotation around axes A to G is constructed by placing a bearing 38b in the hollow outer tube 38 fixed to one of the connected objects, allowing the hollow inner tube 39 fixed to the other of the connected objects to pass through. Multiple vent holes 38a and 39a are formed in each outer tube 38 and inner tube 39, communicating with the interiors of the support column 32, upper link 33, lower link 34, connecting link 35, and auxiliary link 33a. Additionally, the gaps between each square tube and the connecting portions of the outer tube 38 and inner tube 39 form a labyrinth structure that uses steps or grooves to bend the path, and it communicates with the outside.

[0137] The exhaust port 37 is connected to the interior of the support column 32 and is located below the shaft B in the support column 32. Although not shown, an exhaust device for venting exhaust is connected to the exhaust port 37 via a flexible tube.

[0138] (Drive Department)

[0139] like Figure 2 , Figure 4 and Figure 5 As shown, the drive unit 4 includes a linear motion mechanism 41 and a conversion unit 42. The linear motion mechanism 41 is a mechanism including a linear motion section 41b, which is driven by a drive source 41a and moves linearly back and forth in a direction orthogonal to the rotation axis of the upper link 33 and the lower link 34. Furthermore, the drive unit 4 is positioned lower than the opening of the chamber 141 where the substrate W is processed (see reference). Figure 8 ).

[0140] The linear motion mechanism 41 in this embodiment is a linear guide fixed to the base 31. That is, the linear motion mechanism 41 comprises a motor (actually a drive source 41a), a ball screw, a nut, a guide rail, and a slider. The ball screw and guide rail are arranged along the front-rear direction, and the nut is screwed onto the helical shaft. A slider is fixed to the nut. By using a servo motor to rotate the helical shaft, the slider moves along the guide rail extending in the front-rear direction, moving linearly in the front-rear direction. The slider is the linear motion part 41b. Furthermore, the servo motor transmits the rotation of the shaft (axis with the front-rear direction as its axis) to the ball screw via a belt.

[0141] Furthermore, as described above, the force required for the linear motion unit 41b to start from the moving end can be reduced by the weight 36 provided on the connecting link 35, thus requiring a lower output from the motor. Therefore, the drive source 41a can be miniaturized, while dust generation can be reduced.

[0142] like Figure 4As shown, the drive source 41a is disposed in the pair of moving ends of the linear motion section 41b on the side away from the carrying arm 2, i.e., the rear end side. In addition, in the case where the moving end of the carrying arm 2 is on the lower side, the linear motion section 41b is on the moving end on the side away from the carrying arm 2, i.e., the rear end. Further, the drive source 41a is disposed on the side of the setting surface of the linear motion mechanism 41, i.e., the lower side.

[0143] The conversion section 42 connects the linear motion section 41b with the lower link 34, and converts the movement of the linear motion section 41b to the rotation of the lower link 34. The conversion section 42 of the present embodiment is an L-shaped swing arm 42a (see FIG. 2). The lower end of the swing arm 42a is connected to the linear motion section 41b in a rotatable manner, and the upper end is connected to the connecting section of the support column 32 and the lower link 34 across the linear motion mechanism 41. The lower end of the swing arm 42a is disposed in a manner that it rotates around the axis A in accordance with the linear movement of the linear motion section 41b. Figure 2 ). The lower end of the swing arm 42a is connected to the linear motion section 41b in a rotatable manner, and the upper end is connected to the connecting section of the support column 32 and the lower link 34 across the linear motion mechanism 41. The lower end of the swing arm 42a is disposed in a manner that it rotates around the axis A in accordance with the linear movement of the linear motion section 41b.

[0144] However, the swing arm 42a is disposed in a manner that it is stretched and contracted in the radial direction of the rotation in the connecting section with the linear motion section 41b with respect to the linear motion section 41b. Therefore, it is possible to realize the linear movement of the linear motion section 41b in a straight line, and the rotation of the swing arm 42a. Further, it is also possible to have a structure in which the swing arm 42a is not stretched and contracted, and the axis in the connecting section of the swing arm 42a and the linear motion section 41b moves in the vertical direction of the swing arm 42a. Thus, the distance from the connecting section of the swing arm 42a and the linear motion section 41b to the axis A is longer as it is closer to the pair of moving ends of the linear motion section 41b, and shorter as it is closer to the center of the pair of moving ends. That is, the rotation radius is longer as it is closer to the moving end of the linear motion section 41b, and shorter as it is closer to the center.

[0145] By the linear motion mechanism 41 as above, as shown in FIG. 3, if the linear motion section 41b is moved to the rear end, the carrying arm 2 is lowered. As shown in FIG. 4, if the linear motion section 41b is moved to the front end, the carrying arm 2 is raised. Therefore, by moving the linear motion section 41b to either of the front end and the rear end, it is possible to determine the height of the carrying arm 2. Figure 4 Figure 5 Therefore, by moving the linear motion section 41b to either of the front end and the rear end, it is possible to determine the height of the carrying arm 2.

[0146] Further, the start, stop, speed, timing of the operation, etc. of the drive source of the drive section 4 is controlled by the control device 162. That is, the height and the raising / lowering speed of the carrying arm 2 is controlled by the control device 162.

[0147] [Operation]

[0148] The operation of the substrate processing device 100 and the substrate carrying device 1 as above will be described.

[0149] (Raising / lowering operation of the carrying arm) ​

[0150] First, the following describes the operation of raising and lowering the transfer arm 2 in order to match the heights of the upper arm 22 and the lower arm 23 to the height of the opening of the chamber 141. As shown in FIG. 6, when the transfer arm 2 is at the lowermost end, the linear motion section 41b is at the rear end. Figure 4

[0151] From this state, if the drive source 41a is operated to move the linear motion section 41b forward, the swing arm 42a rotates forward, thereby causing the lower link 34 to rotate about the shaft A and drop down. Then, the connecting link 35 coupled to the lower link 34 via the shaft C drops down, and the shaft D at the rear end of the upper link 33 drops down, so the upper link 33 rotates about the shaft B, and the transfer arm 2 at the front end of the upper link 33 rises. After the linear motion section 41b reaches the front end, the transfer arm 2 comes to the upper moving end as shown in FIG. 7. Figure 5

[0152] Subsequently, if the drive source 41a is operated in the reverse direction to move the linear motion section 41b rearward, the swing arm 42a rotates rearward, and the lower link 34 rotates about the shaft A and stands up, so the connecting link 35 coupled to the lower link 34 via the shaft C rises. Then, the shaft D at the rear end of the upper link 33 rises together with the connecting link 35, so the upper link 33 rotates about the shaft B, and the transfer arm 2 at the front end of the upper link 33 drops down. After the linear motion section 41b reaches the rear end, the transfer arm 2 comes to the lower moving end as shown in FIG. 8. Figure 4

[0153] During movement of the transfer arm 2 between the upper and lower moving ends, the upper surface of the table 21 and the upper arm 22 and the lower arm 23 are maintained in a horizontal state by the parallel links including the auxiliary link 33a. In addition, as described above, when the linear motion section 41b approaches the front and rear moving ends, the rotation of the conversion section 42 is delayed, so the speed of the rising and dropping is reduced. Therefore, when aligned with the opening of the chamber 141, the speed is reduced even without adjusting the speed, so the movement is slow at a speed suitable for the position alignment.

[0154] (Exhaust operation)

[0155] ​​​During the lifting and lowering operation as described above, the exhaust is performed by the exhaust device connected to the exhaust port 37. That is, the air inside the strut 32, the upper link 33, the lower link 34, the connecting link 35, the auxiliary link 33a, the outer cylinder 38, and the inner cylinder 39, which are communicated via the air holes 38a and 39a, is exhausted from the lower exhaust port 37. Thus, the dust generated from the operation portion does not flow into the inside of the substrate processing device 100, but is exhausted to the outside. The air inside the substrate processing device 100 flows in the plurality of linking portions via the minute gaps that become a labyrinth structure, and thus there is no case where the air is sucked from one large opening, and the turbulence of the air flow is also small.

[0156] (Handover operation of substrate)

[0157] Next, the operation of the substrate transfer device 1 to hand over the substrate W between the buffer unit 131 and the chamber 141 will be described. First, as described in the substrate processing device 100, the unprocessed substrate W taken out from the cassette CA by the transfer robot 132 is housed in the buffer unit 131. In addition, the lower arm 23 of the substrate transfer device 1 holds the processed substrate W in the chamber 141.

[0158] As shown in Figure 1 , the substrate transfer device 1 moves forward by the moving mechanism 151, and the transfer arm 2 comes beside the buffer unit 131. The height of the lower arm 23 is matched to the height of the buffer unit 131 that houses the unprocessed substrate W by the drive section 4. The lower arm 23 is changed from the housing position to the handover position, and as shown in Figure 7 (A), the holding arm 27 is moved above the unprocessed substrate W of the buffer unit 131.

[0159] The holding arm 27, in which the movable pressing plate 27a is set to the release position, is lowered by the lifting shaft 24a, and as shown in Figure 7 (B), the substrate W enters between the movable pressing plate 27a and the fixed pressing plate 27c. In the state, as shown in Figure 7 (C), the movable pressing plate 27a is moved to the holding position, and thus the edge portion of the substrate W is held by the claws of the movable pressing plate 27a and the fixed pressing plate 27c. Then, as shown in Figure 7 (D), after the lifting shaft 24a is raised, the lower arm 23 is returned to the housing position.

[0160] In addition, the height of the upper arm 22 is matched to the empty position of the buffer unit 131 by the drive section 4. Then, the upper arm 22 is changed from the housing position to the handover position, and thus as shown in Figure 7 (D), the processed substrate W held by the upper arm 22 is moved to the empty position of the buffer unit 131. As shown in Figure 7 (C), the lifting shaft 24a is lowered, and the holding arm 27 is lowered, and as shown inFigure 7 As shown in (B), the movable pressure plate 27a is set to the release position, thereby releasing the substrate W. Then, as... Figure 7 As shown in (A), after the lifting shaft 24a rises, the upper arm 22 returns to the receiving position.

[0161] Then, as Figure 8 and Figure 9 As shown, the substrate conveying device 1 moves rearward via the moving mechanism 151, and the conveying arm 2 reaches the side of the chamber 141 to be processed. Figure 8 As shown, the height of the upper arm 22 is matched with the opening 141a of the chamber 141 by the drive unit 4, and as... Figure 9 As shown, the upper arm 22 changes from the receiving position to the engaging position, thereby inserting the gripping arm 27 into the chamber 141 through the opening 141a. Furthermore, Figure 8 This indicates the complete state of inserting the gripping arm 27 into both the upper and lower chambers 141, but in reality, up to two gripping arms 27 can be inserted simultaneously. Thus, as... Figure 7 As shown in (A), the gripping arm 27 moves above the processed substrate W. Then, as... Figure 7 (B) Figure 7 As shown in (D), after the gripping arm 27 of the gripping base plate W rises, the upper arm 22 returns to the receiving position.

[0162] Additionally, the drive unit 4 aligns the height of the lower arm 23 with the position of the opening 141a of the chamber 141. Then, the lower arm 23 changes from the receiving position to the engaging position, thereby... Figure 7 As shown in (D), the untreated substrate W held by the lower arm 23 is moved into the chamber 141. Thereafter, as... Figure 7 (C)~ Figure 7 As shown in (A), the gripping arm 27 descends, setting the movable pressure plate 27a to the release position. Thus, after the substrate W is placed on the mounting stage 141b, the gripping arm 27 rises, and the lower arm 23 returns to the receiving position.

[0163] Furthermore, after the substrate W that has finished processing is removed from chamber 141, the substrate transport device 1 can transport it to other chambers 141 for further processing. For example, it can perform a washing process in one chamber 141 and a drying process in another chamber 141. In this case, the upper arm 22 can be used as the dry arm and the lower arm 23 as the wet arm. For example, the liquid-coated substrate W can be transported to the drying chamber 141 using the lower arm 23 as the wet arm, and the substrate W that has finished drying can be transported using the upper arm 22 as the dry arm. Furthermore, since the upper arm 22 and the lower arm 23 have intersection positions in the left and right directions, the substrate transport device 1 can also remove the substrate W that has finished processing from one chamber 141 and transport it to another chamber 141 facing each other, thereby performing processing sequentially.

[0164] [Effects]

[0165] (1) The substrate conveyance apparatus 1 of the present embodiment includes: a conveyance arm 2 for conveying a substrate; a support column 32 which is erected at a fixed angle with respect to a base 31; an upper link 33 which supports one end of the conveyance arm 2 and is connected to the support column 32 in a rotatable manner, and which raises and lowers the conveyance arm 2 as it rotates; a lower link 34 which is connected to a position in the support column 32 which is lower than the connection position of the upper link 33 in a rotatable manner about an axis which is parallel to the axis of rotation of the upper link 33; a connecting link 35 which is connected to the upper link 33 and the lower link 34 in a rotatable manner in such a manner that the upper link 33 rotates as the lower link 34 rotates; and a drive unit 4 which rotates the lower link 34.

[0166] The drive unit 4 is a source of dust generation, but in the present embodiment, the drive unit 4 is disposed below, and the moving portion which raises and lowers the conveyance arm 2 is only the mechanism of the four links which are disposed above. Therefore, unlike the pull rod type substrate conveyance apparatus, suction and exhaust are not generated from the gaps between the cylindrical containers each time the conveyance arm 2 is raised and lowered. Therefore, the adhesion of dust to the substrate W due to turbulence of the airflow can be reduced. For example, as described above, by providing each link as a plate-shaped member which is thinner in the width direction than in the front-rear direction, turbulence of the airflow due to rotation can be further suppressed.

[0167] In addition, the drive unit 4 which raises and lowers the conveyance arm 2 is only one below, and therefore, compared to the case where a motor which is a source of dust generation is provided for each axis of rotation, the generation of dust can also be reduced. That is, in the case where a motor is provided for each axis of rotation, the number of motors increases, which results in an increase in the amount of dust generation. In addition, if a motor is also present in the vicinity of the substrate W or the opening 141a of the chamber 141, the likelihood of dust adhering to the substrate W increases. Furthermore, since the weight of the motor is large, in order to have the rigidity to support the motor which is disposed above, the main body portion must be made very thick, and the motor which is disposed below must use a motor which has a larger output and is heavier. Therefore, the amount of dust generation also increases. In the present embodiment, the number of drive sources 41a can also be reduced, and the required output is small, so the generation of dust can be suppressed.

[0168] Further, since the axes of rotation of the upper links 33 and the lower links 34 are four-link chains that are parallel to each other, the space required in the width direction can be reduced. For example, in the case of a substrate transport device of the pull rod type, the size of the cylindrical container on which the double arms are mounted occupies the space from the top to the bottom. In addition, in the case where a motor is provided for each axis of rotation, as described above, the main body must be made thicker, and the motor below must be made larger, so the space required overall is increased. In the present embodiment, the four-link chain can be formed using the elongated members that form the links, so the space required can be reduced. For example, as described above, by making each link a plate-shaped member that is thinner in the width direction than in the front-rear direction, the space required in the width direction can be reduced.

[0169] (2) The drive unit 4 includes a linear motion mechanism 41 including a linear motion portion 41b that is driven by a drive source 41a to move back and forth in a straight line in the horizontal direction orthogonal to the axes of rotation of the upper links 33 and the lower links 34, and a conversion portion 42 that connects the linear motion portion 41b to the lower links 34 and converts the movement of the linear motion portion 41b to rotation of the lower links 34.

[0170] As described above, since the drive source 41a, which is the source of dust generation, is disposed below, and the linear motion portion 41b moves in the horizontal direction, dust is not easily generated toward the top. Therefore, the adhesion of dust to the substrate W can be reduced. The dust generated by the movement of the linear motion portion 41b is also in the horizontal direction below, so the influence on the top can be suppressed. In addition, by making the direction of movement of the linear motion portion 41b orthogonal to the axes of the upper links 33 and the lower links 34, the space in the width direction parallel to the axes can be reduced. Further, by controlling only the position of the linear motion portion 41b on the straight line, the height of the transport arm 2 can be adjusted, so control becomes easier.

[0171] (3) The drive source 41a is disposed at the moving end of the pair of moving ends of the linear motion portion 41b that is farther from the transport arm 2. Although the drive source 41a is the largest source of dust generation, since it is located farther from the transport arm 2, the adhesion of dust to the substrate W can be reduced.

[0172] (4) In the case where the transport arm 2 is at the moving end below, the linear motion portion 41b is at the moving end farther from the transport arm 2. Therefore, the transport arm 2 is not easily affected by the dust generated by the movement of the linear motion portion 41b, and the adhesion of dust to the substrate W can be reduced.

[0173] (5) The inside of the lifting link 3, which is configured by the pillar 32, the upper link 33, the lower link 34, the connecting link 35, and the connecting portions of these, is in communication with each other in a manner that gas can flow therethrough, and includes an exhaust port for exhausting the inside of the lifting link 3 from the drive section 4 side. Thus, dust generated from the movable portions in the lifting link 3 can be exhausted from the inside, and thus the adhesion of dust to the substrate W can be reduced.

[0174] (6) The drive section 4 is disposed at a position lower than the opening of the chamber 141 in which the substrate W is processed. Thus, the adhesion of dust to the substrate W that is carried in and carried out with respect to the chamber 141 can be reduced.

[0175] (7) The drive section 4 drives the linear motion section 41b by a single drive source 41a. Thus, the number of causes of dust generation can be reduced by suppressing the number of drive sources 41a for lifting the transfer arm 2, and thus the adhesion of dust to the substrate W can be reduced.

[0176] (8) The transfer arm 2 includes a pair of upper arms 22 and lower arms 23 that are disposed so as to be able to rotate in the horizontal direction and are housed to a position in which the upper arms 22 and the lower arms 23 overlap each other. Thus, the space in the width direction of the transfer arm 2 can be reduced, and the generation of dust caused by turbulence of air flow when the transfer arm 2 is lifted can be suppressed. In addition, the width of the transfer arm 2 is the space in which the substrate W is accommodated, and thus the transfer space in the arrangement direction of the chambers 141 for moving the substrate transfer device 1 can be narrowed.

[0177] For example, in the present embodiment, by enabling the upper arms 22 and the lower arms 23 to move by 180°, the width of the second transfer area 150 can be narrowed without providing a space in which the mounting portions of the upper arms 22 and the lower arms 23 are to be rotated in the horizontal direction, as shown by d1. On the other hand, in the case of the substrate transfer device T of the double-arm structure shown in d2, the entire portion in which the double arms are mounted must be rotated when the substrate W is exchanged between the facing chambers 141. Thus, as shown by d2, the width of the second transfer area 150 is increased. Figure 9 Figure 10

[0178] (Other Embodiments)

[0179] The present application is not limited to the above-described embodiments, and includes the following other embodiments. In addition, the present application includes all combinations of the above-described embodiments and the following other embodiments, or any one of these combinations. Furthermore, various omissions, substitutions, and modifications can be made to these embodiments within the scope of the present application, and the deformations thereof are included in the present application.

[0180] ​​For example, as described above, the space in the width direction of the second conveyance area 150 can be reduced, and thus, as shown in FIG. 4, even if two rows of substrate conveyance devices 1 are arranged in the second conveyance area 150, the increase in the width shown by d3 can be reduced. In this case, each row of substrate conveyance devices 1 performs handover of the substrate W between the chambers 141 of adjacent rows. Figure 11

[0181] Further, the linear motion mechanism 41 can also be configured by a linear motor. That is, the drive source 41a can be a linear motor, and the linear motion portion 41b can be a slider that moves linearly by the linear motor. Thus, the sliding portion can be reduced, and thus, the generation of dust can be further reduced. Further, by also performing exhaust on the movable portion of the conveyance arm 2, the outflow of dust into the substrate processing device 100 can be prevented. Furthermore, the conveyance arm 2 is not limited to the above-described configuration as long as it is a structure that can hold, release, and convey the substrate W. The number of arms can be one or a plurality.​

Claims

1. A substrate conveyance device characterized by comprising: comprises: a transfer arm for transferring a substrate; a support pillar erected at a fixed angle with respect to a base; an upper link having one end supporting the transfer arm, being coupled to the support pillar in a rotatable manner, and raising and lowering the transfer arm as it rotates; a lower link coupled to the support pillar at a position lower than the coupling position of the upper link in a rotatable manner about an axis parallel to the axis of rotation of the upper link; a connecting link having a first rotation axis coupled to the upper link and a second rotation axis coupled to the lower link, the first and second rotation axes rotating and rising and falling as the lower link rotates, thereby rotating the upper link; and a drive unit rotating the lower link, the upper link rotates about a third rotation axis with respect to the support pillar, the upper link rotates about a fourth rotation axis with respect to the transfer arm, the third rotation axis is located between the fourth rotation axis and the first rotation axis.

2. The substrate transfer device according to claim 1, wherein: the drive unit includes: a linear motion mechanism including a linear motion unit driven by a drive source, moving linearly back and forth in a direction orthogonal to the axes of rotation of the upper link and the lower link; and a conversion unit connecting the linear motion unit to the lower link, converting the movement of the linear motion unit to the rotation of the lower link.

3. The substrate transfer device according to claim 2, wherein: the drive source is disposed at a moving end farther from the transfer arm among a pair of moving ends of the linear motion unit.

4. The substrate transfer device according to claim 2 or 3, wherein: when the transfer arm is at a lower moving end, the linear motion unit is at a moving end farther from the transfer arm.

5. The substrate transfer device according to claim 2 or 3, wherein: the drive unit drives the linear motion unit by a single drive source.

6. The substrate transfer device according to any one of claims 1 to 3, wherein: the inside of a lifting link including the support pillar, the upper link, the lower link, the connecting link, and the coupling portions of these is in communication with each other in a manner allowing gas to flow therethrough, an exhaust port for exhausting the inside of the lifting link from the drive unit side is included.

7. The substrate transfer device according to any one of claims 1 to 3, wherein: the drive unit is disposed at a position lower than an opening of a chamber in which a substrate is processed.

8. The substrate transfer device according to any one of claims 1 to 3, wherein: the transfer arm includes: a pair of upper and lower arms disposed in a rotatable manner in a horizontal direction, and housed in a position in which the upper and lower arms overlap each other. ​

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