Package circuit structure and manufacturing method thereof

Abstract

A packaged circuit structure includes a shielding layer, an electronic component, a plurality of conductive pillars, a first insulating layer, a first circuit board, an antenna structure and a second circuit board. The shielding layer is provided with a groove. The electronic component is fixed in the groove. A plurality of conductive pillars are arranged on the shielding layer around the groove. The first insulating layer covers the shielding layer, the electronic component and the plurality of conductive pillars. The first circuit board is stacked on one side of the first insulating layer. The first circuit board includes a grounding wire, which is electrically connected to the plurality of conductive pillars. The antenna structure is stacked on a side of the first circuit board away from the first insulating layer, and is electrically connected to the electronic component through the first circuit board. The second circuit board is stacked on a side of the first insulating layer away from the first circuit board. The above-mentioned packaged circuit structure is conducive to avoiding electromagnetic interference and improving the heat dissipation effect. The present invention also provides a method for manufacturing a packaged circuit structure.

Description

Technical Field

[0001] The present invention relates to a packaging circuit structure and a manufacturing method thereof, and in particular to a packaging circuit structure with an antenna structure and a manufacturing method thereof. Background Art

[0002] In recent years, electronic products have been widely used in daily work and life, and light, thin and small electronic products are becoming more and more popular. As the main component of electronic products, the circuit structure occupies a large space of the electronic products, so the volume of the circuit structure affects the volume of the electronic products to a large extent. The large-volume circuit structure is bound to be difficult to meet the trend of light, thin, short and small electronic products.

[0003] Existing antenna packaging technologies (such as AoC and AiP) integrate antenna modules of different frequency bands with multiple RF chips / active components in a packaging structure, but how to avoid electromagnetic interference between RF ICs / active components has become an important issue that needs to be solved urgently. In addition, high-power components such as RF ICs / active components are embedded inside the circuit board. The large amount of heat generated when the components are operating needs to be dissipated in time to avoid component damage. Therefore, improving the heat dissipation effect of the circuit board is also an important issue that needs to be solved. Summary of the invention

[0004] In view of this, it is necessary to provide a method for manufacturing a packaging circuit structure that is beneficial to avoiding electromagnetic interference and improving heat dissipation effect.

[0005] A packaging circuit structure is also provided which is beneficial for avoiding electromagnetic interference and improving heat dissipation effect.

[0006] A method for manufacturing a packaged circuit structure, comprising the following steps:

[0007] providing a shielding layer;

[0008] A first insulating layer is pressed on one side of the shielding layer to form a plurality of conductive pillars, wherein the first insulating layer covers the shielding layer, one side of the shielding layer is exposed from the first insulating layer, and each conductive pillar passes through the first insulating layer and is electrically connected to the shielding layer;

[0009] forming a groove on the first insulating layer and the shielding layer, wherein the plurality of conductive pillars are arranged around the groove;

[0010] Providing an electronic component, and fixing the electronic component in the groove;

[0011] forming a first circuit board on the same side of the first insulating layer and the electronic component, the first circuit board comprising a grounding line, the grounding line being electrically connected to the plurality of conductive pillars; and

[0012] An antenna structure and a second circuit board are provided, and the antenna structure and the second circuit board are respectively pressed onto two opposite surfaces of the structure obtained in the previous step, the antenna structure is electrically connected to the electronic component through the first circuit board, and the second circuit board is electrically connected to the first circuit board.

[0013] A packaged circuit structure comprises a shielding layer, an electronic component, a plurality of conductive pillars, a first insulating layer, a first circuit board, an antenna structure and a second circuit board. The shielding layer is provided with a groove. The electronic component is fixed in the groove. A plurality of conductive pillars are arranged on the shielding layer around the groove. The first insulating layer covers the shielding layer, the electronic component and the plurality of conductive pillars, wherein a side of each conductive pillar away from the shielding layer and a side of the electronic component away from the shielding layer are both exposed from the first insulating layer, and a side of the shielding layer away from the electronic component is exposed from the first insulating layer. A first circuit board is stacked on one side of the first insulating layer and covers the plurality of conductive pillars and the electronic component. The first circuit board comprises a grounding wire, which is electrically connected to the plurality of conductive pillars. The antenna structure is stacked on one side of the first circuit board away from the first insulating layer and is electrically connected to the electronic component through the first circuit board. A second circuit board is stacked on one side of the first insulating layer away from the first circuit board, covers the shielding layer, and is electrically connected to the first circuit board.

[0014] In the packaged circuit structure of the present invention, the electronic component is fixed in the groove of the shielding layer, and a conductive column is provided on the shielding layer. The conductive column is grounded, which can effectively improve the heat dissipation effect of the packaged circuit structure while protecting the electronic component from electromagnetic interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A cross-sectional view of a metal layer provided in one embodiment of the present invention.

[0016] Figure 2 For Figure 1 The cross-sectional view is shown after an insulating layer is laminated onto one side of the metal layer.

[0017] Figure 3 For Figure 2 A cross-sectional view of an insulating layer after a plurality of through holes are formed is shown.

[0018] Figure 4 For Figure 3 A cross-sectional view of a conductive pillar formed in a through hole is shown.

[0019] Figure 5 For Figure 4 A cross-sectional view of the structure after a groove is formed.

[0020] Figure 6 To fix an electronic component to Figure 5 A cross-sectional view after the groove is shown.

[0021] Figure 7 For Figure 6 One side of the structure shown provides a cross-sectional view after a copper clad laminate.

[0022] Figure 8 For the Figure 7 The copper clad laminate shown is pressed onto Figure 6 A cross-sectional view of the structure shown.

[0023] Fig. 9 For Figure 8 A cross-sectional view of the structure after the first circuit layer is formed.

[0024] Fig.10 A cross-sectional view of a first metal layer and a dielectric layer formed on a protective layer according to an embodiment of the present invention.

[0025] Fig.11 For Fig.10 A cross-sectional view of a dielectric layer after a first conductive hole is formed is shown.

[0026] Fig.12 A cross-sectional view of a second metal layer and an insulating layer formed on one side of a carrier board provided in one embodiment of the present invention.

[0027] Fig.13 For Fig.12 A cross-sectional view after a second circuit layer is formed on the insulating layer is shown.

[0028] Fig.14 For the general Fig.11 and Fig.13 The structure shown is pressed into Fig. 9 A cross-sectional view of two opposing surfaces of the structure shown.

[0029] Fig.15 For Fig.14 A cross-sectional view of the structure after a heat sink is formed.

[0030] Fig.16 A cross-sectional view of a packaged circuit structure provided in one embodiment of the present invention.

[0031] Main component symbols

[0032] Shielding layer 10

[0033] Carrying plates 210, 230

[0034] Metal Layer 101

[0035] Through hole 11, 612

[0036] First insulating layer 20

[0037] Conductive column 23

[0038] Groove 12

[0039] Electronic components 30

[0040] Thermal conductive adhesive layer 32

[0041] Electrical connection terminal 31

[0042] First circuit board 40

[0043] Second insulating layer 42

[0044] First circuit layer 43

[0045] Ground wire 431

[0046] Copper clad laminate 47

[0047] Copper layer 45

[0048] Blind hole 471

[0049] Conductive holes 48, 80

[0050] Antenna structure 50

[0051] Second circuit board 60

[0052] Dielectric layer 51

[0053] Antenna 53

[0054] Insulation layer 61

[0055] Second circuit layer 63

[0056] Protective layer 52

[0057] First metal layer 54

[0058] Dielectric layer 51

[0059] First conductive via 512

[0060] The second metal layer 62

[0061] Second conductive via 614

[0062] Insulation layer 70

[0063] Heat sink 55

[0064] Connection pad 65

[0065] Solder mask 90

[0066] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0067] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0069] See also Figures 1 to 16 A method for manufacturing a packaged circuit structure according to an embodiment of the present invention comprises the following steps:

[0070] Step S1, see Figure 1 , providing a shielding layer 10.

[0071] In this embodiment, step S1 specifically includes: providing a carrier plate 210, forming a metal layer 101 on the carrier plate 210, and forming a plurality of through holes 11 on the metal layer 101 to divide the metal layer 101 into a plurality of shielding layers 10. A peeling layer (not shown) may be formed between the carrier plate 210 and the metal layer 101 to facilitate separation of the metal layer 101 from the carrier plate 210.

[0072] The material of the carrier plate 210 may be, but is not limited to, metal or glass. The material of the metal layer 101 may be, but is not limited to, copper, silver or alloys thereof.

[0073] Step S2, see Figures 2 to 4 A first insulating layer 20 is pressed onto one side of the shielding layer 10 to form a plurality of conductive pillars 23, wherein the first insulating layer 20 covers the shielding layer 10, one side of the shielding layer 10 is exposed from the first insulating layer 20, and each conductive pillar 23 passes through the first insulating layer 20 and is electrically connected to the shielding layer 10.

[0074] In this embodiment, the first insulating layer 20 fills the plurality of through holes 11 and covers the side of the shielding layer 10 away from the carrier board 210, so that the side of the shielding layer 10 in contact with the carrier board 210 can be exposed outside the first insulating layer 20. The material of the first insulating layer 20 can be, but is not limited to, one of polypropylene, polyimide, polyethylene terephthalate, and polyethylene naphthalate.

[0075] The conductive pillar 23 penetrates through two surfaces of the first insulating layer 20 that are in contact with and away from the shielding layer 10, and is electrically connected to the shielding layer 10. In this embodiment, the conductive pillar 23 is disposed adjacent to an edge of the shielding layer 10.

[0076] In this embodiment, step S2 specifically includes: pressing the first insulating layer 20 on the side of the metal layer 101 away from the carrier board 210; forming a plurality of through holes 21 on the first insulating layer 20, the through holes 21 penetrating the two surfaces of the first insulating layer 20 that are in contact with and away from the metal layer 101, and the shielding layer 10 is exposed from the through holes 21; filling the plurality of through holes 21 with conductive material to form the conductive pillars 23. The conductive material may be, but is not limited to, metal paste or metal powder.

[0077] Step S3, see Figure 5 A groove 12 is formed on the first insulating layer 20 and the shielding layer 10 , and the conductive column 23 is arranged around the groove 12 .

[0078] The groove 12 passes through the two surfaces of the first insulating layer 20 that are in contact with and away from the shielding layer 10 and the surface of the shielding layer 10 that is away from the carrier board 210. The groove 12 can be formed by, but not limited to, laser cutting, mechanical drilling, and the like.

[0079] Step S4, see Figure 6 , provide an electronic component 30 and fix the electronic component 30 in the groove 12.

[0080] In this embodiment, the electronic component 30 is fixed to the bottom of the groove 12 by a thermally conductive adhesive layer 32. The thermally conductive adhesive layer 32 is completely contained in the groove 12 located on the shielding layer 10. In other words, the thermally conductive adhesive layer 32 does not protrude from the groove 12 located on the shielding layer 10. Preferably, the thickness of the thermally conductive adhesive layer 32 is less than the depth of the groove 12 located on the shielding layer 10, and the electronic component 30 is partially contained in the groove 12 located on the shielding layer 10, which is conducive to thinning. In some embodiments, the electronic component 30 can also be fixed in the groove 12 by other means.

[0081] Preferably, the thermally conductive adhesive layer 32 is an adhesive material with good thermal conductivity, so as to accelerate the diffusion of heat of the electronic component 30 and facilitate heat dissipation.

[0082] In this embodiment, the electronic component 30 does not protrude from the groove 12. Preferably, the thickness of the electronic component 30 is smaller than the depth of the groove 12, so as to prevent the electronic component 30 from being crushed during the subsequent pressing process.

[0083] An electrical connection terminal 31 is disposed at one end of the electronic component 30 . In this embodiment, the electrical connection terminal 31 is located at a side of the electronic component 30 away from the bottom of the groove 12 .

[0084] Step S5, see Figures 7 to 9 A first circuit board 40 is formed on the same side of the first insulating layer 20 and the electronic component 30 to obtain an electronic component module.

[0085] The first circuit board 40 includes a stacked second insulating layer 42 and a first circuit layer 43. The second insulating layer 42 is filled in the groove 12 and covers the same side of the first insulating layer 20 and the electronic component 30. The second insulating layer 42 is connected to the first insulating layer 20. The first circuit layer 43 is located on the side of the second insulating layer 42 away from the first insulating layer 20, and is electrically connected to the conductive column 23 and the electronic component 30. The first circuit layer 43 includes a grounding wire 431, and the grounding wire 431 is electrically connected to the conductive column 23 to form an electromagnetic shielding structure for electromagnetically shielding the electronic component 30.

[0086] In this embodiment, step S5 specifically includes the following steps: providing a copper clad laminate 47, wherein the copper clad laminate 47 includes a stacked second insulating layer 42 and a copper layer 45; pressing the copper clad laminate 47 on the same side of the first insulating layer 20 and the electronic component 30, wherein the second insulating layer 42 is filled in the groove 12 and connected to the first insulating layer 20, so that the conductive pillar 23 and the electronic component 30 are buried in the first insulating layer 20 and the second insulating layer 42; forming a plurality of blind holes 471 on the pressed structure, wherein the conductive pillar 23 and the electrical connection terminal 31 are exposed from the plurality of blind holes 471; patterning the copper layer 45 to form the first circuit layer 43, and electroplating or filling the blind holes 471 with conductive material to form conductive holes 48, wherein the conductive pillar 23 and the electronic component 30 are electrically connected to the first circuit layer 43 through the conductive holes 48 respectively.

[0087] Step S6, see Figure 10-14, provide an antenna structure 50 and a second circuit board 60, and press the antenna structure 50 and the second circuit board 60 on opposite sides of the electronic component module obtained in step S5, so as to obtain a packaging structure 100.

[0088] The antenna structure 50 is arranged corresponding to the shielding layer 10, and includes a laminated dielectric layer 51 and an antenna 53. The dielectric layer 51 faces the first circuit layer 43. The antenna 53 is located on the side of the dielectric layer 51 away from the first circuit layer 43, and is electrically connected to the first circuit layer 43. The material of the dielectric layer 51 can be, but is not limited to, a material with a low dielectric constant, such as MPI (modified polyimide), LCP (liquid crystal polymer), PEEK (polyetheretherketone), etc.

[0089] The second circuit board 60 includes a stacked insulating layer 61 and a second circuit layer 63. The second circuit layer 63 faces the shielding layer 10, and the insulating layer 61 is located on a side of the second circuit layer 63 away from the shielding layer 10. In some embodiments, the second circuit board 60 further includes a plurality of connection pads 65, which are located on a side of the insulating layer 61 away from the second circuit layer 63 and are used to electrically connect other electronic components.

[0090] In some implementations, the antenna structure 50 and the second circuit board 60 are respectively fixed to one side of the structure obtained in step S5 through an insulating adhesive layer 70 .

[0091] In this embodiment, the step S6 of “providing an antenna structure 50 ” specifically includes the following steps S61 - S62 .

[0092] Step S61, see Fig.10 , provide a protective layer 52, form a first metal layer 54 on the protective layer 52, and laminate the dielectric layer 51 on the first metal layer 54. The dielectric layer 51 is located on a side of the first metal layer 54 away from the protective layer 52.

[0093] Step S62, see Fig.11 , forming a first conductive hole 512 on the dielectric layer 51, the first conductive hole 512 passes through the dielectric layer 51 and is electrically connected to the first metal layer 54, so as to obtain the antenna structure 50. In this embodiment, the first metal layer 54 is used as the antenna 53. In this embodiment, step S62 specifically includes forming a through hole (not shown) passing through the dielectric layer 51 on the dielectric layer 51, and filling the through hole with a conductive material to form the first conductive hole 512.

[0094] In this embodiment, the step S6 of “providing a second circuit board 60 ” specifically includes the following steps S63 - S64 .

[0095] Step S63, see Fig.12 , a carrier board 230 is provided, a second metal layer 62 and the insulating layer 61 are sequentially formed on one side of the carrier board 230, and a plurality of through holes 612 are formed on the insulating layer 61. The insulating layer 61 is located on the side of the second metal layer 62 away from the carrier board 230. In this embodiment, the insulating layer 61 is pressed onto the second metal layer 62.

[0096] Step S64, see Fig.13 , fill the plurality of through holes 612 to form a plurality of second conductive holes 614, and form the second circuit layer 63 on the side of the insulating layer 61 away from the second metal layer 62. The second circuit layer 63 is electrically connected to the second metal layer 62 through the plurality of second conductive holes 614.

[0097] In this embodiment, in step S6, "pressing the antenna structure 50 and the second circuit board 60 on opposite sides of the structure obtained in step S5" specifically includes the following steps S65-S67.

[0098] Step S65, see Fig.14 After an insulating adhesive layer 70 is pressed on the side of the first circuit layer 43 away from the second insulating layer 42, the antenna structure 50 is pressed on the first circuit layer 43, and the antenna structure 50 is fixed on the first circuit board 40 through the insulating adhesive layer 70. In this embodiment, the insulating adhesive layer 70 is filled in the gap in the first circuit layer 43, and the surface of the insulating adhesive layer 70 away from the second insulating layer 42 is flush with the surface of the first circuit layer 43 away from the second insulating layer 42. The first conductive hole 512 in the antenna structure 50 is electrically connected to the first circuit layer 43.

[0099] Step S66, see Fig.14 , remove the carrier board 210, and press an insulating adhesive layer 70 and the second circuit board 60 on the same side of the first insulating layer 20 and the shielding layer 10 in sequence. The second circuit board 60 is fixed on the first insulating layer 20 by an insulating adhesive layer 70. The second circuit layer 63 faces the first insulating layer 20.

[0100] In some embodiments, the method for manufacturing the packaged circuit structure may further include step S7, specifically:

[0101] Step S7, see Fig.15 , a blind hole (not shown) is opened on the structure obtained by pressing the antenna structure 50 and the second circuit board 60 together in step S5, and a heat dissipation material is filled in the blind hole to obtain a heat dissipation block 55.

[0102] The heat dissipation block 55 penetrates the insulating layer 61 and an insulating adhesive layer 70 of the second circuit board 60 along the thickness direction of the packaged circuit structure 100, and is connected to the shielding layer 10, thereby accelerating the diffusion of heat of the electronic component 30 and facilitating heat dissipation. Preferably, the position of the heat dissipation block 55 corresponds to the position of the electronic component 30. The number of the heat dissipation blocks 55 can be one or more, which can be set according to actual needs.

[0103] It is understandable that the method for manufacturing the packaged circuit structure further includes the following steps: opening a plurality of through holes (not shown) in the structure obtained by pressing the antenna structure 50 and the second circuit board 60 together in step S5, electroplating or filling the through holes with conductive material to form conductive holes 80, and patterning the second metal layer 62 of the second circuit board 60 to form the connection pads 65. The conductive holes 80 electrically connect the first circuit board 40 and the second circuit board 60.

[0104] In some embodiments, the method for manufacturing the packaged circuit structure further includes step S8, specifically:

[0105] Step S8, see Fig.16 , a solder mask layer 90 is formed on the surface of the above-mentioned packaging circuit structure 100.

[0106] In this embodiment, solder resist layers 90 are disposed on two opposite surfaces of the packaged circuit structure 100. One solder resist layer 90 covers the first circuit layer 43 and the dielectric layer 51, and the antenna 53 is exposed from the solder resist layer 90. Another solder resist layer 90 covers the insulating layer 61, and the connection pad 65 is exposed from the solder resist layer 90.

[0107] See also Fig.16In one embodiment of the present invention, a packaged circuit structure 100 is provided, comprising a shielding layer 10, an electronic component 30, a first insulating layer 20, a first circuit board 40, an antenna structure 50 and a second circuit board 60. The shielding layer 10 is provided with a groove 12, and a plurality of conductive pillars 23 surrounding the groove 12 are arranged on the shielding layer 10. The electronic component 30 is fixedly arranged in the groove 12. The first insulating layer 20 covers the shielding layer 10, the electronic component 30 and the plurality of conductive pillars 23, and the side of each conductive pillar 23 away from the shielding layer 10 and the side of the electronic component 30 away from the shielding layer 10 are exposed from the first insulating layer 20, and the side of the shielding layer 10 away from the electronic component 30 is exposed from the first insulating layer 20. The first circuit board 40 is stacked on one side of the first insulating layer 20 and covers the plurality of conductive pillars 23 and the electronic component 30. The first circuit board 40 includes a grounding wire 431, and the grounding wire 431 is electrically connected to the plurality of conductive pillars 23. The antenna structure 50 is stacked on a side of the first circuit board 40 away from the first insulating layer 20, and is electrically connected to the electronic component 30 through the first circuit board 40. The second circuit board 60 is stacked on a side of the first insulating layer 20 away from the first circuit board 40, covers the shielding layer 10, and is electrically connected to the first circuit board 40.

[0108] In this embodiment, the electronic component 30 is fixed to the bottom of the groove 12 through a thermally conductive adhesive layer 32. The thermally conductive adhesive layer 32 is completely contained in the groove 12 located on the shielding layer 10. In other words, the thermally conductive adhesive layer 32 does not protrude from the groove 12 located on the shielding layer 10. Preferably, the thickness of the thermally conductive adhesive layer 32 is less than the depth of the groove 12 located on the shielding layer 10, and the electronic component 30 is partially contained in the groove 12 located on the shielding layer 10, which is conducive to the thinning of the product. In some embodiments, the electronic component 30 can also be fixed in the groove 12 by other means.

[0109] Preferably, the thermally conductive adhesive layer 32 is an adhesive material with good thermal conductivity, so as to accelerate the diffusion of heat of the electronic component 30 and facilitate heat dissipation.

[0110] An electrical connection terminal 31 is disposed at one end of the electronic component 30 . In this embodiment, the electrical connection terminal 31 is located at a side of the electronic component 30 away from the bottom of the groove 12 .

[0111] The first circuit board 40 includes a stacked second insulating layer 42 and a first circuit layer 43. The second insulating layer 42 covers the same side of the first insulating layer 20 and the electronic component 30, so that the conductive pillar 23 and the electronic component 30 are buried in the first insulating layer 20 and the second insulating layer 42. The first circuit layer 43 is located on the side of the second insulating layer 42 away from the first insulating layer 20, and is electrically connected to the conductive pillar 23 and the electronic component 30. The first circuit layer 43 includes a grounding wire 431, and the grounding wire 431 is electrically connected to the conductive pillar 23 to form an electromagnetic shielding structure for electromagnetically shielding the electronic component 30.

[0112] The antenna structure 50 is arranged corresponding to the shielding layer 10, and includes a stacked dielectric layer 51 and an antenna 53. The dielectric layer 51 faces the first circuit layer 43. The antenna 53 is located on the side of the dielectric layer 51 away from the first circuit layer 43, and is electrically connected to the first circuit layer 43. The material of the dielectric layer 51 can be, but is not limited to, a material with a low dielectric constant, such as MPI, LCP, PEEK, etc. A first conductive hole 512 is formed on the dielectric layer 51, and the first conductive hole 512 electrically connects the antenna 53 and the first circuit layer 43.

[0113] The second circuit board 60 includes a stacked insulating layer 61 and a second circuit layer 63. The second circuit layer 63 faces the shielding layer 10, and the insulating layer 61 is located on a side of the second circuit layer 63 away from the shielding layer 10. In some embodiments, the second circuit board 60 further includes a plurality of connection pads 65, which are located on a side of the insulating layer 61 away from the second circuit layer 63 and are used to electrically connect other electronic components.

[0114] In some embodiments, the antenna structure 50 is fixed to the first circuit board 40 via an insulating adhesive layer 70 , and the second circuit board 60 is fixed to the first insulating layer 46 via an insulating adhesive layer 70 .

[0115] In some embodiments, the packaged circuit structure 100 further includes a heat sink 55. The heat sink 55 penetrates the insulating layer 61 and an insulating adhesive layer 70 of the second circuit board 60 along the thickness direction of the packaged circuit structure 100, and is connected to the side of the shielding layer 10 away from the groove 12, thereby accelerating the diffusion of heat of the electronic component 30 and facilitating heat dissipation. Preferably, the position of the heat sink 55 corresponds to the position of the electronic component 30. The number of the heat sink 55 can be one or more, which can be set according to actual needs.

[0116] In some embodiments, a solder mask layer 90 is formed on the surface of the packaged circuit structure 100 , and the connection pad 65 and the antenna 53 are exposed from the solder mask layer 90 .

[0117] In the packaged circuit structure 100 of the present invention, the electronic component 30 is fixed in the groove 12 of the shielding layer 10, and a conductive column 23 is provided on the shielding layer 10. The conductive column 23 is grounded, which can effectively improve the heat dissipation effect of the packaged circuit structure 100 while preventing the electronic component 30 from being subjected to electromagnetic interference. In addition, the electronic component 30 is fixed to the bottom of the groove 12 by a thermally conductive adhesive layer 32, which improves the positioning accuracy; and the thickness of the thermally conductive adhesive layer 32 does not exceed the depth of the groove 12, which is conducive to the thinning of the product. Furthermore, the heat dissipation block 55 can effectively improve the heat dissipation efficiency of the packaged circuit structure 100. In the manufacturing method of the packaged circuit structure of the present invention, the antenna structure 50, the second circuit board 60 and the electronic component module are manufactured separately, which can improve the processing efficiency.

[0118] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A method for manufacturing a packaged circuit structure, comprising the following steps: providing a shielding layer; A first insulating layer is pressed on one side of the shielding layer to form a plurality of conductive pillars, wherein the first insulating layer covers the shielding layer, one side of the shielding layer is exposed from the first insulating layer, and each conductive pillar passes through the first insulating layer and is electrically connected to the shielding layer; forming a groove on the first insulating layer and the shielding layer, wherein the plurality of conductive pillars are arranged around the groove; Providing an electronic component, and fixing the electronic component in the groove; forming a first circuit board on the same side of the first insulating layer and the electronic component, the first circuit board comprising a grounding line, the grounding line being electrically connected to the plurality of conductive pillars; and An antenna structure and a second circuit board are provided, and the antenna structure and the second circuit board are pressed onto the first circuit board and the first insulating layer respectively, the antenna structure is electrically connected to the electronic component through the first circuit board, and the second circuit board is electrically connected to the first circuit board.

2. The method for manufacturing a packaged circuit structure according to claim 1, characterized in that: After the step of "pressing the antenna structure and the second circuit board onto the first circuit board and the first insulating layer respectively", the method further includes: A blind hole is opened on the structure obtained by pressing, wherein the blind hole passes through the second circuit board, and the shielding layer is exposed from the blind hole; A heat dissipation material is filled in the blind hole to form a heat dissipation block, and the heat dissipation block is connected to a side of the shielding layer away from the groove.

3. The method for manufacturing a packaged circuit structure according to claim 1, characterized in that: The step of "forming a first circuit board on the same side of the first insulating layer and the electronic component" includes: Providing a copper-clad laminate, the copper-clad laminate comprising a stacked second insulating layer and a copper layer; The copper clad laminate is pressed onto the same side of the first insulating layer and the electronic component, the second insulating layer is filled into the groove and connected to the first insulating layer, so that the conductive pillar and the electronic component are buried in the first insulating layer and the second insulating layer; and The copper layer is patterned to form a first circuit layer.

4. The method for manufacturing a packaged circuit structure according to claim 1, characterized in that: The electronic component is fixed to the bottom of the groove through a thermal conductive adhesive layer, and the thickness of the thermal conductive adhesive layer does not exceed the depth of the groove.

5. The method for manufacturing a packaged circuit structure according to claim 1, wherein: The step of "providing an antenna structure and a second circuit board, and pressing the antenna structure and the second circuit board onto the first circuit board and the first insulating layer respectively" includes: Laminating a dielectric layer on the first metal layer, and forming a first conductive hole on the dielectric layer electrically connected to the first metal layer to obtain the antenna structure; Laminating an insulating layer on the second metal layer, forming a second conductive hole electrically connected to the second metal layer on the insulating layer, and forming a second circuit layer on a side of the insulating layer away from the second metal layer, so as to obtain the second circuit board; The antenna structure and the second circuit board are pressed onto the first circuit board and the first insulating layer respectively, wherein the dielectric layer faces the first circuit board, the first conductive hole is electrically connected to the first circuit board, and the second circuit layer faces the first insulating layer and covers the shielding layer.

6. The method for manufacturing a packaged circuit structure according to any one of claims 1 to 5, characterized in that: An electrical connection terminal is provided on the electronic component. The electrical connection terminal is located on a side of the electronic component away from the bottom of the groove. The electrical connection terminal is electrically connected to the antenna structure through the first circuit board.

7. A packaged circuit structure, comprising: A shielding layer, wherein the shielding layer is provided with a groove; an electronic component, fixed in the groove; A plurality of conductive pillars are disposed on the shielding layer surrounding the groove; A first insulating layer covers the shielding layer, the electronic component and the plurality of conductive pillars, wherein a side of each conductive pillar away from the shielding layer and a side of the electronic component away from the shielding layer are both exposed from the first insulating layer, and a side of the shielding layer away from the electronic component is exposed from the first insulating layer; A first circuit board, stacked on one side of the first insulating layer and covering the plurality of conductive pillars and the electronic components, wherein the first circuit board comprises a grounding wire, and the grounding wire is electrically connected to the plurality of conductive pillars; an antenna structure, stacked on a side of the first circuit board away from the first insulating layer and electrically connected to the electronic component through the first circuit board; and The second circuit board is stacked on a side of the first insulating layer away from the first circuit board, covers the shielding layer, and is electrically connected to the first circuit board.

8. The packaged circuit structure according to claim 7, characterized in that: The packaged circuit structure further includes a heat sink, which penetrates the second circuit board in a thickness direction of the packaged circuit structure and is connected to a side of the shielding layer away from the groove.

9. The packaged circuit structure according to claim 7, characterized in that: The electronic component is fixed to the bottom of the groove through a thermal conductive adhesive layer, and the thickness of the thermal conductive adhesive layer does not exceed the depth of the groove.

10. The packaged circuit structure according to any one of claims 7 to 9, characterized in that: An electrical connection terminal is provided on the electronic component. The electrical connection terminal is located on a side of the electronic component away from the bottom of the groove. The electrical connection terminal is electrically connected to the antenna structure through the first circuit board.

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