Lead frame composite, method for producing a plurality of components and component

Abstract

A wire frame composite (1) is proposed, comprising: a plurality of regularly arranged wire frames (5); the wire frames are respectively suitable for electrical contact components (10), including at least two wire frame elements (6, 7, 7A, 7B, 7C) spaced laterally apart by a recess (2), the wire frame elements being configured as electrical terminals of different polarities, and having at least one anchoring element (8), the anchoring element being suitable for a housing body (11) of the anchoring component (10); a plurality of connecting elements (3), the connecting elements respectively connecting two wire frame elements (6, 7, 7A, 7B, 7C) of adjacent wire frames (5) to each other, wherein the two connected wire frame elements (6, 7, 7A, 7B, 7C) are configured as terminals of different polarities. In addition, a method for manufacturing a plurality of components and a component are proposed.

Description

Technical Field

[0001] A lead frame assembly is proposed, which is particularly suitable for producing a plurality of components. Preferably, the components are optoelectronic components, for example radiation-emitting or radiation-detecting components. Background Art

[0002] For example, optoelectronic components are known which have a so-called QFN (Quad Flat NoLeads) package. Such components are characterized in that their electrical connections, which are formed by leadframe elements of a leadframe, do not protrude beyond the plastic sheath or the housing body, but are integrated flat into the surface of the housing body. In principle, the adhesion of the housing body to the leadframe elements is relatively poor, so that anchoring structures are provided on the leadframe elements.

[0003] An effective design of the anchoring structure usually results in a large space requirement, which in turn leads to large component dimensions. For example, in conventional components, semiconductor chips are mounted on non-thinned leadframe elements, that is to say on the solid material of the leadframe. Structures provided for anchoring, such as undercuts, are arranged outside the "footprint" of the semiconductor chip and result in relatively large lateral dimensions of the component.

[0004] Reducing the size of the component cannot be easily carried out here, because the known structures no longer function in a corresponding manner. In particular, when the lead frame assembly is cut, parts thereof are torn off from the plastic sheathing, because the remaining anchoring structures are no longer sufficiently effective. Summary of the invention

[0005] The object to be achieved in this context is to specify a lead frame assembly which allows a reduction in the size of the component. A further object to be achieved is to specify a method for producing a plurality of components and a component having a reduced component size.

[0006] Furthermore, the object is achieved by a lead frame assembly, a method for producing a plurality of components, and a component having the features of exemplary embodiments of the invention.

[0007] Advantageous developments of the lead frame assembly, of a method for producing a plurality of components, and of the components are the subject matter of exemplary embodiments of the invention.

[0008] According to at least one embodiment of the wire frame assembly, the wire frame assembly comprises a plurality of wire frames arranged regularly and a plurality of connecting elements between the wire frames. A regular arrangement here means a repetitive arrangement pattern. For example, the wire frames are arranged in rows and columns. Preferably, the wire frames are respectively suitable for electrical contact components and respectively have at least two wire frame elements spaced laterally apart by a recess, the wire frame elements being provided as electrical terminals of different polarities. In addition, the wire frames advantageously each have at least one anchoring element, which is suitable for the housing body of the anchoring component. In particular, the wire frame element is a thinned, flat region of the wire frame, wherein at least one anchoring element protrudes from the plane of the wire frame element in a columnar manner. At least one anchoring element may have an elliptical, in particular circular, shape at least partially in a top view of the upper side of the wire frame assembly. At least one anchoring element may be arranged at one of the wire frame elements of the wire frame.

[0009] Furthermore, the connecting element connects two lead frame elements, in particular directly adjacent lead frames, to one another, wherein the two connected lead frame elements are provided as terminals of different polarity. In other words, the lead frame element of the first lead frame, which is provided as an anode, and the lead frame element of the second lead frame, which is provided as a cathode, in particular directly adjacent, are connected to one another via the connecting element. Advantageously, the connecting element is also suitable as an anchoring element.

[0010] In a preferred embodiment, each lead frame element of a lead frame is connected to a single lead frame element of an immediately adjacent lead frame via exactly one connecting element, wherein the connected lead frame elements are provided as terminals of different polarity. The lead frames are thus short-circuited in the lead frame assembly.

[0011] According to at least one embodiment, the lead frames are arranged in rows and columns, wherein two preferably directly adjacent columns are rotated relative to each other so that in the case of two lead frames arranged next to each other in a row, the lead frame elements provided as terminals of different polarity are arranged directly next to each other. In particular, two directly adjacent columns are rotated 180° relative to each other.

[0012] Preferably, the electrical terminal of the first polarity, for example the lead frame element of the cathode, is the chip mounting region, and the electrical terminal of the second polarity, for example the lead frame element of the anode, is the connecting means region. In this case, at least one anchoring element can be arranged at the connecting means region. Advantageously, the anchoring element is provided for accommodating an electrical connecting means, for example a planar conductor (so-called "planar interconnect"). The anchoring element thus also fulfills the function of a connecting element in addition to the anchoring function, thereby increasing the integration density and being able to reduce the size of the component.

[0013] In an advantageous embodiment of the lead frame assembly, the lead frame has a plurality of anchoring elements, which are arranged at different lead frame elements. Anchoring elements can be arranged both at the electrical connection provided with the first polarity, for example, the lead frame element provided with the cathode, and also at the electrical connection provided with the second polarity, for example, the lead frame element provided with the anode.

[0014] According to at least one embodiment, at least one anchoring element extends transversely beyond the wire frame element into the recess. Here, "transversely" means at least one direction extending parallel to the main extension plane of the wire frame or in the main extension plane of the wire frame. Advantageously, in this design, the anchoring element can be filled at the bottom by the material of the housing body arranged in the recess and thus a better anchoring of the housing body in the wire frame can be achieved. For example, the anchoring element can have a concavely curved surface on its underside, so that a recess is formed, which can be filled with the material of the housing body. In particular, the detachment of the wire frame can be resisted in the vertical direction, that is, perpendicular to the main extension plane.

[0015] In an advantageous design, the cutouts that separate at least two wire frame elements laterally are formed in an elongated manner. This means, in particular, that the first transverse extension is smaller than the second transverse extension. Here, the first transverse extension is advantageously indicated along the columns of the wire frame, while the second transverse extension is indicated along the rows of the wire frame. Preferably, the cutouts of adjacent wire frames in a row are formed continuously in pairs, that is to say without interruption. The cutouts can be arranged staggered with respect to one another in a step-like manner. In particular, a "Z" shape is obtained here.

[0016] According to at least one embodiment, the wire frame assembly has a plurality of recesses, wherein at least one connecting element is arranged between each two adjacent recesses. Preferably, the recess completely penetrates the wire frame assembly in the vertical direction. In particular, the wire frame assembly has a plurality of first recesses arranged in a row, wherein at least one connecting element is arranged between each two adjacent first recesses in a row. In addition, the wire frame assembly can have second recesses arranged in a row, wherein at least one connecting element is arranged between each two adjacent second recesses in a row. The shape and size of the connecting element are determined here by the shape and size of the recess. The shape and size are selected in particular so that the connecting element is formed as small as possible and nevertheless ensures sufficient stability during processing. For example, the recess can be formed in a cross shape. Alternatively, the recess can be formed in a pentagonal shape or have other, in particular geometric shapes.

[0017] In a preferred design, the anchoring element and the connecting element correspond to each other in their lateral expansion, that is to say, they have at least approximately equal lateral expansion or area. This has a beneficial effect on the stability in the segmentation process. For example, the lateral expansion along two mutually perpendicular lateral directions can be between 50 μm and 200 μm, including boundary values, wherein the deviation of ± 10% is in the tolerance range. In addition, the anchoring element can have a height or vertical expansion, which corresponds to the thickness of the unthinned wire frame or wire frame assembly. The thickness or vertical expansion of the unthinned wire frame or wire frame assembly is in particular between 200 μm and 300 μm, including boundary values, wherein the deviation of ± 10% is in the tolerance range. When using a thinned semiconductor chip, the thickness can be smaller and between 50 μm and 200 μm, including boundary values, wherein the deviation of ± 10% is in the tolerance range.

[0018] It is also advantageous if the anchoring element is no further away from an imaginary connecting line connecting the recesses than the lead frame thickness, preferably half the lead frame thickness. This allows stresses in the vertical direction to be reduced during the separation process. The connecting line is in particular a separation line, such as a saw groove, during the separation process.

[0019] According to at least one embodiment of the method for producing a plurality of components, firstly a lead frame assembly as described further above is provided.

[0020] Preferably, when manufacturing the lead frame composite, a lead frame base body is provided. Advantageously, the lead frame base body is formed from an electrically conductive material, which also has good thermal conductivity. In particular, the lead frame base body is a metal base body without a lead frame structure. A suitable material for the lead frame base body is, for example, copper.

[0021] The lead frame base body is thinned locally, that is to say, the thickness of the lead frame base body is reduced, and the anchoring element is formed. In particular, the lead frame base body is thinned by an etching method, such as wet chemical etching. It is also conceivable that the lead frame base body is structured by embossing and punching.

[0022] The lead frame base body preferably has a thickness or vertical extension of between 200 μm and 300 μm or, when using thinned semiconductor chips, a thickness or vertical extension of between 50 μm and 200 μm, including limit values, wherein a deviation of ±10% is within the tolerance range. During thinning, the thickness of the lead frame base body is reduced by at least one third. Preferably, the lead frame base body is thinned in the region in which the lead frame elements are formed so that it corresponds to the height of the semiconductor chip to be mounted, so that the semiconductor chip does not substantially protrude above the upper side of the lead frame or the component in the finished component. The lead frame base body can also be thinned in the region in which the connecting elements are formed. The anchoring elements, however, are at least partially not thinned. Correspondingly, the anchoring elements can have a maximum height that is equal to the thickness of the unthinned lead frame base body.

[0023] Regularly arranged recesses are produced in the leadframe base body, wherein the connecting element and the leadframe are formed between the recesses. In particular, the recesses extend completely through the leadframe base body. The shape and size of the recesses depend in particular on the desired size of the component. For example, the recesses can be embodied in a cross shape and have a maximum lateral extension of between 100 μm and 500 μm.

[0024] The connecting element can be designed to be very narrow and, for example, reach a lateral extension of between 70 μm and 200 μm inclusive, wherein deviations of ±10% are within the tolerance range.

[0025] Furthermore, a recess is produced which divides the lead frame laterally, in particular separates the lead frame, so that the lead frame has a plurality of lead frame elements.

[0026] In an advantageous embodiment of the method for producing a wire frame assembly, first recesses arranged in columns are produced, wherein at least one connecting element is formed between each two adjacent first recesses in a column. In addition, second recesses arranged in rows are produced, wherein a connecting element is formed between each two adjacent second recesses in a row. In addition, a wire frame is formed between the intersections of two directly adjacent columns and rows. Preferably, the first and second recesses are formed identically in their shape and size. However, it is also possible that the first recess differs from the second recess in shape and / or size.

[0027] The cutouts and recesses can be produced by an etching method, in particular by wet-chemical etching.

[0028] According to at least one embodiment of the method for producing a plurality of components, after producing or providing the lead frame assembly, a semiconductor chip is mounted on the lead frame element of each lead frame. For example, the semiconductor chip can be fixed to the corresponding lead frame element by means of adhesive or solder.

[0029] Furthermore, after the assembly, a sheath can be produced, wherein the semiconductor chip and the lead frame assembly are partially embedded in the sheath. Preferably, the sheath is an injection molding compound applied by means of an injection molding method. Plastics, such as silicone or epoxy resin, are particularly suitable as basic materials for the sheath. Furthermore, the sheath can contain radiation-absorbing and / or reflective additional materials. In the finished component, the sheath forms the housing body of the component.

[0030] After the cover has been produced, it is separated into a plurality of components. In this case, the connecting elements are separated. In particular, the separation is carried out by means of a sawing process. Preferably, the separation is carried out along imaginary connecting lines, which extend between the recesses of a column and a row, respectively.

[0031] In a preferred embodiment of the method, the surfaces of the wire frame composite arranged at the upper side and the lower side remain uncovered by the covering. This can be achieved in particular in the following way: the upper side and the lower side of the wire frame composite are covered by the inner surface of the mold for manufacturing the covering during the production of the covering, and the inner surface is pressed onto the surfaces. Here, the anchoring element or its surface specially provided for the production of the covering can be used as an action surface for the force applied by the inner surface to the upper side and the lower side. In addition, the pressure generated here can prevent the wire frame composite from floating by the covering or the injection molding material, so that the wire frame composite remains at its arranged position.

[0032] The anchoring elements only partially embedded in the sheath or exposed at the top and bottom help to prevent parts of the lead frame assembly from being torn off the sheath during separation. Advantageously, the anchoring elements act vertically and laterally in all directions.

[0033] According to at least one embodiment of the component, the component comprises a lead frame and at least one semiconductor chip, which is arranged on the lead frame, and a housing body, in which the at least one semiconductor chip and the lead frame are at least partially embedded. Preferably, the lead frame comprises at least two lead frame elements which are laterally spaced apart from each other by a recess, and the lead frame elements are provided as electrical terminals of different polarities. In this case, the lead frame elements are preferably spatially separated and electrically insulated by the recess. In addition, the lead frame advantageously has at least one anchoring element, which is arranged at one of the lead frame elements. The semiconductor chip is particularly arranged on the lead frame element provided as an electrical terminal of a first polarity and is connected to the lead frame element provided as an electrical terminal of a second polarity by means of a connecting mechanism. In this case, the first main surface of the at least one semiconductor chip and the first main surface of the at least one anchoring element are respectively part of the first main surface of the component.

[0034] In particular, the first main surface of the component is flat. Correspondingly, the first main surface of the semiconductor chip and the first main surface of the anchoring element are also flat and are located in the same plane as the first main surface of the component. The first main surface of the semiconductor chip and the anchoring element are respectively arranged on their sides facing away from the lead frame element.

[0035] In a preferred embodiment, the first main surface of the semiconductor chip and the anchoring element is not covered by the housing body. In addition, the lead frame element is preferably not covered by the housing body at the second main surface or the underside of the component. As a result, the component is electrically connected at the underside and can thus be surface mounted. Particularly preferably, the lead frame element does not protrude from the housing body in the lateral direction. More preferably, the lead frame element is flush with the housing body at the side of the component.

[0036] According to at least one embodiment, the semiconductor chip is arranged on a chip mounting surface of the lead frame element, wherein the anchoring element and the chip mounting surface are arranged on the same side of the lead frame. In particular, the anchoring element projects beyond the chip mounting surface of the lead frame element.

[0037] Preferably, the connecting means is electrically connected to the lead frame element provided as an electrical terminal of the second polarity by means of the anchoring element. In particular, the connecting means is a planar electrical conductor, a so-called "planar interconnect", which runs flat on the housing body between the semiconductor chip and the anchoring element.

[0038] As already mentioned above, at least one anchoring element can extend laterally beyond the lead frame element into the recess. In particular, the anchoring element has a prismatic, cylindrical, truncated pyramidal or truncated cone-shaped shape. It is possible for the side surfaces that laterally delimit the anchoring element to extend straight in cross section or to be at least partially curved.

[0039] For example, the side surfaces may be concavely curved in cross section.

[0040] The semiconductor chip can be a radiation-emitting semiconductor chip, such as a light-emitting diode chip or a laser diode chip, or a radiation-detecting semiconductor chip, such as a photodiode or a phototransistor. In particular, the radiation-emitting semiconductor chip is suitable for emitting electromagnetic radiation in the visible, ultraviolet or infrared spectral range. Furthermore, the radiation-detecting semiconductor chip is preferably suitable for detecting electromagnetic radiation in the visible, ultraviolet or infrared spectral range. Furthermore, the semiconductor chip can be provided for detecting chemical agents, such as gases.

[0041] The component can have a plurality of semiconductor chips, so that it is a so-called "multi-chip" component. In this case, at least one of the semiconductor chips can be a radiation-emitting semiconductor chip and another semiconductor chip can be a radiation-detecting semiconductor chip. Such a component is particularly suitable for use as a reflection grating.

[0042] In an advantageous embodiment, the component has an integrated circuit (IC), which is suitable, in particular in a multi-chip component, for driving individual semiconductor chips. The semiconductor chips can be wired by planar electrical conductors or by a combination of planar electrical conductors and bonding wires.

[0043] The wire frame assembly and the method are particularly suitable for producing a plurality of components described herein. Features described in conjunction with the components can therefore also be used for the wire frame assembly and the method and vice versa. Furthermore, features described in conjunction with the wire frame assembly can also be used for the method and vice versa.

[0044] The component is particularly suitable for use in the automotive and multimedia sectors and in the field of general lighting. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Further advantages, advantageous embodiments and developments result from the exemplary embodiments described below in conjunction with the drawings.

[0046] The accompanying drawings show:

[0047] Figure 1 A schematic perspective view showing an intermediate stage of a lead frame assembly or a method for producing a plurality of components according to a first embodiment,

[0048] Figure 2 Shown in Figure 1 A portion of a wire frame assembly or an intermediate stage shown in FIG.

[0049] Figure 3 and 4 A schematic diagram schematically shows a recording of a portion of a lead frame assembly or an intermediate stage according to a first embodiment,

[0050] Figures 5 to 8 different views showing a lead frame according to a first embodiment or a detail of a lead frame assembly according to a first embodiment,

[0051] Fig. 9 shows a schematic perspective view of a component according to a first exemplary embodiment, which can be produced by means of a lead frame assembly or a method according to a first exemplary embodiment,

[0052] Figures 10 to 12 show different views of a component according to a second embodiment,

[0053] Fig.13 A schematic perspective view showing an intermediate stage of a lead frame assembly or a method for producing a plurality of components according to a third embodiment,

[0054] Fig.14 A schematic perspective view showing an intermediate stage of a lead frame assembly or a method for producing a plurality of components according to a fourth embodiment,

[0055] Fig.15 and 16 Different views of a detail of a lead frame or a lead frame assembly according to a fourth embodiment are shown,

[0056] Fig.17 A schematic perspective view of a component according to a fourth exemplary embodiment is shown, which can be produced by means of a lead frame assembly or a method according to a fourth exemplary embodiment. DETAILED DESCRIPTION

[0057] In the embodiments and drawings, identical, similar or identically functioning elements are each provided with the same reference numerals. The illustrated elements and their size relationships to one another are not necessarily to be regarded as being true to scale; rather, individual elements may be illustrated exaggeratedly for better visibility and / or better understanding.

[0058] exist Figures 1 to 8 In the first embodiment shown in FIG. 1 , the lead frame assembly 1 comprises a plurality of lead frames 5 and a plurality of connecting elements 3, which are arranged between the lead frames 5. The lead frames 5 are regularly arranged along columns A and rows B in the lead frame assembly 1. Each lead frame 5 comprises two lead frame elements 6, 7 which are laterally spaced apart from each other by a cutout 2 and which are provided as electrical terminals of different polarities. In addition, each lead frame 5 has two anchoring elements 8, which are respectively suitable for anchoring the sheath or the housing body.

[0059] The connecting element 3 connects two lead frame elements 6, 7 of adjacent lead frames 5 to each other, wherein the two connected lead frame elements 6, 7 are provided as terminals of different polarity. In particular, each lead frame element 6, 7 of a lead frame 5 is connected to a single lead frame element 6, 7 of the directly adjacent lead frame 5 via exactly one connecting element 3, wherein the connected lead frame elements 6, 7 are provided as terminals of different polarity. The lead frame 5 is thus short-circuited in the lead frame assembly 1.

[0060] Furthermore, in each case two directly adjacent columns A are rotated by 180° relative to one another in a plan view of the lead frame assembly 1 so that in the case of two adjacent lead frames 5 of a row B, lead frame elements 6 , 7 which are provided as terminals of different polarity are arranged directly adjacent to one another.

[0061] For example, an electrical terminal of the first polarity, such as lead frame element 6 serving as a cathode, is a chip mounting region, and an electrical terminal of the second polarity, such as lead frame element 7 serving as an anode, is a connection mechanism region.

[0062] Especially from Figure 2 It can be seen that the lead frame assembly 1 has a plurality of first recesses 4A arranged along a row A, wherein two connecting elements 3 are arranged between each two adjacent recesses 4A of a row A. In addition, the lead frame assembly 1 has a plurality of second recesses 4B arranged in a row B, wherein a connecting element 3 is arranged between each two adjacent second recesses 4B of a row B. The shape and size of the connecting element are determined by the shape and size of the recesses 4A, 4B. The shape and size are selected in particular so that the connecting element 3 is as small as possible and nevertheless ensures sufficient stability during processing. For example, the recesses 4A, 4B can be designed in a cross shape. The lateral extension a1, a2 thereof in two lateral directions L1, L2 extending perpendicularly to each other is preferably between 100 μm and 500 μm, respectively. In addition, the lateral extension a1, a2 of the connecting element 3 is preferably between 70 μm and 200 μm, including the limit values, wherein a deviation of ±10% is within the tolerance range.

[0063] Combination Figure 3 and 4 Let's discuss the cutout 2 in more detail. The lead frame elements 6, 7 of a lead frame 5 are each separated in a first transverse direction L1 by a cutout 2. The cutout 2 is elongated and has a shorter extension in the first transverse direction L1 than in the second transverse direction L2. For example, the shorter transverse extension a1 can be between 70 μm and 150 μm, while the longer transverse extension a2 is at least 100 μm, with a deviation of ±10% being within the tolerance range.

[0064] The cutouts 2 of directly adjacent lead frames 5 of a row B are formed continuously in pairs, ie without interruption. Here, the cutouts 2 are arranged offset to one another in a step-like manner, so that in particular a "Z" shape is obtained.

[0065] Combination Figures 5 to 8The lead frame 5 and its elements 6, 7 and 8 are discussed in detail. The lead frame elements 6, 7 are thinned, flat areas of the lead frame 5. For example, the lead frame elements 6, 7 can have a thickness or vertical extension d between 70 μm and 150 μm, inclusive, wherein a deviation of ±10% is within the tolerance range. Furthermore, the lead frame element 6 provided as the chip mounting area is designed at least approximately rectangular in a plan view of the lead frame 5 and has a first and a second lateral extension a1, a2, which are each between 300 μm and 500 μm, inclusive, wherein a deviation of ±10% is within the tolerance range. The lead frame element 7 provided as the connecting means area can also be designed at least approximately rectangular in a plan view of the lead frame 5 and have a first and a second lateral extension a1, a2, wherein the first lateral extension a1 is shorter than the second lateral extension a2. The first lateral extent a1 is between 70 μm and 150 μm, while the second lateral extent a2 can correspond to the second lateral extent of the further leadframe element 6 and is between 300 μm and 500 μm inclusive, wherein deviations of ±10% are within the tolerance range.

[0066] The anchoring elements 8 are arranged obliquely opposite one another in a top view of the lead frame 5. The anchoring elements extend cylindrically in each case from the lead frame elements 6, 7 in a vertical direction V and have an elliptical, in particular circular, configuration at least in regions in a top view of the upper side of the lead frame 5. Preferably, the lateral extensions a1, a2 of the anchoring elements 8 are each between 50 μm and 200 μm, inclusive of limit values, wherein deviations of ±10% are within the tolerance range. Furthermore, the anchoring elements 8 can have a height d or a vertical extension d which corresponds to the thickness of the unthinned lead frame 5 or lead frame assembly 1. This is in particular between 200 μm and 300 μm, inclusive of limit values, wherein deviations of ±10% are within the tolerance range.

[0067] In particular, the distance between the anchoring element 8 and the connecting line C of the connecting recess 4A is no greater than the thickness of the lead frame, preferably half the thickness of the lead frame (see Figure 1 ). As a result, the stress in the vertical direction V can be reduced during cutting. The connecting line C is particularly a separation line, such as a saw groove, in the separation process.

[0068] In addition, according to Figures 1 to 9 A first exemplary embodiment of a method for producing a plurality of components 100 may be explained in detail. First, a lead frame assembly 1 is provided or produced, wherein a lead frame base body is provided and thinned locally, in particular by etching, so that anchoring elements 8 are formed. Furthermore, regularly arranged recesses 4A, 4B are produced, wherein connecting elements 3 and lead frames 5 are formed between recesses 4A, 4B. Furthermore, recesses 2 are produced, which divide or separate the lead frame 5 laterally, so that the lead frame has a plurality of lead frame elements 6, 7.

[0069] Furthermore, a semiconductor chip 12 is mounted on the lead frame element 6 of each lead frame 5. Finally, a sheath 11 is produced in which the semiconductor chip 12 and the lead frame assembly 1 are partially embedded. Thereafter, the plurality of components 10 are separated, wherein the connecting elements 3 are separated.

[0070] The component 10 which can be produced in the manner described is Fig. 9 It is shown in FIG. 1 that the component has, in particular, a cuboid configuration.

[0071] The component 10 comprises a lead frame 5, which comprises two lead frame elements 6, 7 which are spaced apart laterally by a cutout 2 and which are provided as electrical connections of different polarities. The lead frame 5 also comprises two anchoring elements 8 which are arranged at different lead frame elements 6, 7. The component 10 comprises a semiconductor chip 12 which is mounted on the lead frame element 6 provided as an electrical connection of a first polarity and which is connected to the lead frame element 7 provided as an electrical connection of a second polarity by means of a connecting means 13 arranged at the anchoring elements 8.

[0072] The semiconductor chip 12 is, for example, a radiation-emitting semiconductor chip 12. In this case, the semiconductor chip 12 has a semiconductor body with an active region, which is suitable for generating radiation. In particular, the active region is a pn junction region. The active region can be formed as a layer or a layer sequence of a plurality of layers. For example, the active region emits electromagnetic radiation, for example in the visible, ultraviolet or infrared spectral range, when the component 10 is operated.

[0073] Materials based on nitride or phosphide compound semiconductors are preferably considered for the layers of the semiconductor body. "Based on nitride compound semiconductors" in this context means that at least one layer of the semiconductor body comprises a nitride III / V compound semiconductor material, preferably Al n Ga m In 1-n-m N, where 0≤n≤1, 0≤m≤1 and n+m≤1. Correspondingly, “based on a phosphide compound semiconductor” means that at least one layer of the semiconductor body comprises Al n Ga m In 1-n-m P, where 0≤n≤1, 0≤m≤1 and n+m≤1. In this case, the material does not necessarily have to have a mathematically exact composition according to the above formula. Rather, the material may have one or more dopants and additional components which do not substantially change the Al n Ga m In 1-n-m N or Al n Ga m In 1-n-mCharacteristic physical properties of P materials. For the sake of simplicity, however, the above formula only contains the main components of the crystal lattice (Al, Ga, In, N), even if these main components can be partially replaced by small amounts of other substances.

[0074] Furthermore, the component 10 has a housing body 11, in which the semiconductor chip 12 and the lead frame 5 are partially embedded. Here, the lead frame 5 and the semiconductor chip 12 are integrated flatly into the surface of the housing body 11, wherein the first main surface 12A of the semiconductor chip 12 and each first main surface 8A of the anchoring element 8 each form a part of the first main surface 10A of the component 10, and the lead frame elements 6, 7 are not covered by the housing body 11 at the second main surface 10B or the bottom side of the component 10. Furthermore, the lead frame elements 6, 7 do not protrude from the housing body 11 in the lateral directions L1, L2, but are flush with the housing body 11 at the side surface 10C of the component 10.

[0075] Furthermore, the housing body 11 is arranged in the recess 2 and in the region of the lead frame elements 6, 7 which is arranged laterally downstream of the anchoring element 8 and the semiconductor chip 12. The anchoring element 8 extends laterally beyond the lead frame elements 6, 7 into the recess 2 and is filled in at the bottom by the housing body 11. Figures 6 to 8 As can be seen in FIG. 1 , the anchoring elements 8 have a concavely curved surface 8B at their underside, so that a recess is formed in which the material of the housing body 11 accumulates. In addition, each side 8C that laterally delimits the anchoring element 8 can be concavely curved in a top view.

[0076] The connecting means 13 is a two-dimensional electrical line, a so-called “planar interconnect”, which runs flat on the housing body 11 between the semiconductor chip 12 and the anchoring element 8 .

[0077] The two leadframe elements 6, 7 are electrically insulated by means of the cutout 2. The component 10 can be electrically connected on the underside by means of the uncovered surfaces of the leadframe elements 6, 7 and can thus be surface-mounted.

[0078] In the case of a vertical extension of between 200 μm and 300 μm, inclusive, with a deviation of ±10% within the tolerance range, and a lateral extension a1 of between 600 μm and 1300 μm and a2 of between 300 μm and 500 μm, inclusive, with a deviation of ±10% within the tolerance range, the component 10 has a small component size and is nevertheless designed to be stable due to its anchoring element 8. In particular, the anchoring element 8 can prevent the housing body 11 from detaching.

[0079] Fig.10A second exemplary embodiment of a component 10 is shown in a plan view toward the first main surface 10A of the component 10 . Fig.11 In the top view shown in FIG. 1 , the housing body 11 is shown transparently so that the lead frame 5 can be seen. Fig.12 A schematic cross-sectional view of component 10 along line EF is shown.

[0080] As from Fig.10 and 11 As can be seen in FIG. 1 , the two anchoring elements 8 are arranged offset relative to each other in the second transverse direction L2 but not in the first transverse direction L1. Fig. 9 In the embodiment shown in FIG. 1 , the two lateral directions L1, L2 are arranged offset from each other. The arrangement according to the second embodiment can be simplified by the following manner: the region of the lead frame element 6 arranged on the anchoring element 8 is turned outward, while the region of the lead frame element 7 arranged opposite to the turned outward region is left open. Due to the large lateral spacing of the lead frame element 6 from the anchoring element 8, the chip mounting is less hindered by the anchoring element 8 and its uneven side surface 8C. For other design features, refer to the first embodiment.

[0081] exist Fig.13 In the third exemplary embodiment shown in FIG. 1 , the lead frame 5 has only one anchoring element 8. The anchoring element 8 is arranged on the lead frame element 7 provided as a connecting means region opposite the semiconductor chip 12. With regard to other configuration features, reference is made to the first exemplary embodiment.

[0082] In the case of a component based on the described exemplary embodiment, a small component size can also be achieved and sufficient stability can be achieved due to the anchoring element 8. In particular, the anchoring element can prevent the housing body from detaching.

[0083] exist Figures 14 to 17 In the fourth embodiment shown in FIG. 1 , the lead frame 5 has four lead frame elements 6, 7A, 7B, 7C, wherein the lead frame element 6 is provided as a chip mounting region and the lead frame elements 7A, 7B, 7C are provided as connecting mechanism regions. The lead frame elements 7A, 7B, 7C are rectangular in shape, while the lead frame element 6 is triangular in shape.

[0084] Arranged on the leadframe element 6 are first, second and third semiconductor chips 12, 22, 32, which are designed in particular to emit electromagnetic radiation of different wavelengths. For example, the first semiconductor chip 12 emits blue light during operation, the second semiconductor chip 22 emits green light during operation, and the third semiconductor chip 32 emits red light during operation. By mixing red, green and blue light, the component 10 produced (see Fig.17) can emit white light during operation. Alternatively, at least one of the semiconductor chips 12 , 22 , 32 can be a radiation-detecting semiconductor chip.

[0085] Lead frame element 6 serves as a common electrical terminal of a first polarity, while further lead frame elements 7A, 7B, 7C are each associated as further electrical terminals of a second polarity with semiconductor chips 12, 22, 32. Lead frame elements 6, 7A, 7B, 7C are laterally spaced apart or spatially separated by cutout 2.

[0086] The lead frames 5 are connected to each other in the lead frame assembly 1 via connecting elements 3. Two lead frame elements 6, 7A, 7B, 7C of adjacent lead frames 5 are connected to each other via a part of the connecting element 3, wherein the two connected lead frame elements 6, 7A, 7B, 7C are provided as terminals of different polarities.

[0087] An anchoring element 8 is provided at each lead frame element 6, 7A, 7B, 7C of each lead frame 5. The anchoring elements 8 provided at the lead frame elements 7A, 7B, 7C are provided in particular for accommodating the connecting means 13, while the anchoring elements 8 provided at the lead frame element 6 can be used during production as an action surface for forces applied from the inner surface of the injection mold to the upper and lower sides of the lead frame composite 1. The anchoring elements 8 can have a smaller lateral extension than the other anchoring elements.

[0088] The lead frame component 1 has first recesses 4A arranged in columns A and second recesses 4B arranged in rows B, which are formed in the same shape and size. The shape corresponds to a pentagon. The connecting wires connecting the recesses 4A of a column A and the connecting wires connecting the recesses 4B of a row B are used as separation lines in the singulation process.

[0089] The manufactured component 10 (see Fig.16 and 17 ) comprises a lead frame 5, which comprises four lead frame elements 6, 7A, 7B, 7C which are laterally spaced apart by a cutout 2. In addition, the lead frame 5 has four anchoring elements 8, which are arranged at different lead frame elements 6, 7A, 7B, 7C. The component 10 has a plurality of semiconductor chips 12, 22, 32, which are mounted on the lead frame element 6 provided as an electrical connection of a first polarity and are respectively connected to the lead frame elements 7A, 7B, 7C provided as electrical connections of a second polarity by means of connecting means 13.

[0090] Furthermore, the component 10 has a housing body 11, in which the semiconductor chips 12, 22, 32 and the lead frame 5 are partially embedded. In this case, the lead frame 5 and the semiconductor chips 12, 22, 32 are integrated flatly into the surface of the housing body 11, wherein each first main surface 12A, 22A, 32A of the semiconductor chips 12, 22, 32 and each first main surface 8A of the anchoring element 8 form a part of the first main surface 10A of the component 10, and the lead frame elements 6, 7A, 7B, 7C are not covered by the housing body 11 at the second main surface or the bottom side of the component 10. Furthermore, the lead frame elements 6, 7A, 7B, 7C do not protrude laterally from the housing body 11, but are flush with the housing body at the side surfaces of the component 10.

[0091] Lead frame elements 6, 7A, 7B, 7C are electrically insulated by means of cutouts 2. Component 10 can be electrically connected on the underside by means of uncovered surfaces of lead frame elements 6, 7A, 7B, 7C, wherein different semiconductor chips 12, 22, 32 are electrically controllable individually.

[0092] With regard to further design features, such as the shape and size of the anchoring element 8 or the dimensions of the lead frame elements 6 , 7A, 7B, 7C and the connecting element 3 , reference is additionally made to the first exemplary embodiment.

[0093] The invention is not restricted by the description based on the exemplary embodiments. Rather, the invention comprises any novel feature and any combination of features, which in particular includes any combination of features in the claims, even if the feature or the combination itself is not described in detail in the claims or exemplary embodiments.

[0094] This application claims the priority of German patent application 102019120523.9, the disclosure content of which is incorporated herein by reference.

[0095] List of reference numerals:

[0096] 1 Lead frame composite

[0097] 2 Leave space

[0098] 3 Connecting elements

[0099] 4 concavity

[0100] 4A first recess

[0101] 4B Second recess

[0102] 5 Wire frame

[0103] 6, 7, 7A, 7B, 7C lead frame components

[0104] 8 Anchoring elements

[0105] 8A First main surface

[0106] 8B Lower surface

[0107] 8C Side

[0108] 9. Covering

[0109] 10 Components

[0110] 10A First main surface

[0111] 10B Second main surface

[0112] 10C Side

[0113] 11 Shell body

[0114] 12, 22, 32 semiconductor chips

[0115] 12A, 22A, 32A first main surface

[0116] 13Connection mechanism

[0117] a1, a2 horizontal expansion

[0118] d Vertical expansion

[0119] Column A

[0120] Line B

[0121] C, D connecting wire

[0122] L1 First transverse direction

[0123] L2 Second lateral direction

[0124] V vertical direction

Claims

1. A wire frame composite (1), comprising: - a plurality of regularly arranged wire frames (5), the wire frames respectively - suitable for electrical contacting means (10), - comprises at least two lead frame elements (6, 7, 7A, 7B, 7C) which are laterally spaced apart by a cutout (2), said lead frame elements being provided as electrical terminals of different polarities, and - having at least one anchoring element (8) which is suitable for anchoring a housing body (11) of the component (10), wherein the lead frame element (6, 7, 7A, 7B, 7C) is a thinned, flat region of the lead frame (5), and the at least one anchoring element (8) projects in a cylindrical manner from a plane of the lead frame element (6, 7, 7A, 7B, 7C), wherein the at least one anchoring element (8) extends transversely beyond the lead frame element (6, 7, 7A, 7B, 7C) into the recess (2); - a plurality of connecting elements (3), each of which connects two lead frame elements (6, 7, 7A, 7B, 7C) of adjacent lead frames (5) to each other, wherein the two connected lead frame elements (6, 7, 7A, 7B, 7C) are provided as terminals of different polarities.

2. The wire frame composite (1) according to claim 1, The lead frames (5) are arranged in rows (B) and columns (A), and two adjacent columns (A) are rotated relative to each other, so that in the case of two lead frames (5) arranged side by side in a row (B), lead frame elements (6, 7, 7A, 7B, 7C) provided as terminals of different polarities are arranged directly side by side.

3. The wire frame composite (1) according to claim 1 or 2, The at least one anchoring element (8) is arranged on one of the lead frame elements (6, 7, 7A, 7B, 7C).

4. The wire frame composite (1) according to claim 1 or 2, The lead frame (5) comprises a plurality of anchoring elements (8) which are arranged on different lead frame elements (6, 7, 7A, 7B, 7C).

5. The wire frame composite (1) according to claim 1 or 2, The cutouts (2) of adjacent lead frames (5) in one row (B) are formed continuously in pairs.

6. The wire frame composite (1) according to claim 1 or 2, The cutouts (2) of two adjacent lead frames (5) in one row (B) are arranged offset from each other in a step-like manner.

7. The wire frame composite (1) according to claim 1 or 2, The lead frame element (6) provided as an electrical terminal of a first polarity is a chip mounting region and the lead frame element (7, 7A, 7B, 7C) provided as an electrical terminal of a second polarity is a connection mechanism region.

8. The wire frame composite (1) according to claim 1 or 2, The lead frame assembly comprises first recesses (4A) arranged in columns (A) and second recesses (4B) arranged in rows (B), wherein at least one connecting element (3) is arranged between each two adjacent first recesses (4A) in a column (A) and at least one connecting element (3) is arranged between each two adjacent second recesses (4B) in a row (B).

9. A method for manufacturing a plurality of components (10), comprising the following steps: - providing a lead frame assembly (1) according to any one of claims 1 to 8, - mounting a semiconductor chip (12) on the lead frame element (6) of each lead frame (5), - producing an encapsulation (9) in which the semiconductor chip (12) and the lead frame assembly (1) are partially embedded, - Division into a plurality of components (10), wherein the connecting elements (3) are separated.

10. The method according to claim 9, Surfaces of the lead frame assembly (1) which are arranged on the upper side and on the lower side remain uncovered by the casing (9).

11. A component (10), comprising: - a wire frame (5), the wire frame - comprises at least two lead frame elements (6, 7, 7A, 7B, 7C) which are laterally spaced apart by a cutout (2), said lead frame elements being provided as electrical terminals of different polarities, and - having at least one anchoring element (8), which is arranged on one of the lead frame elements (6, 7, 7A, 7B, 7C), wherein the at least one anchoring element (8) extends laterally beyond the lead frame element (6, 7, 7A, 7B, 7C) into the recess (2), at least one semiconductor chip (12, 22, 32) which is arranged on a lead frame element (6, 7, 7A, 7B, 7C) provided as an electrical terminal of a first polarity and is connected to a lead frame element (6, 7, 7A, 7B, 7C) provided as a second terminal of a second polarity by means of a connecting means (13), a housing body (11) in which the at least one semiconductor chip (12, 22, 32) and the lead frame (5) are at least partially embedded, wherein The first main surface (12A, 22A, 32A) of the at least one semiconductor chip (12, 22, 32) and the first main surface (8A) of the at least one anchoring element (8) respectively form a part of the first main surface (10A) of the component (10).

12. The component (10) according to claim 11, The lead frame element (6, 7, 7A, 7B, 7C) is not covered by the housing body (11) at the second main surface (10B) of the component (10).

13. A component (10) according to claim 11 or 12, The connecting mechanism (13) is electrically connected to the lead frame element (6, 7, 7A, 7B, 7C) provided as an electrical terminal of the second polarity by means of the anchoring element (8).

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