A simulation method and system for the pressing and forming process of a printed circuit board

Abstract

The present invention provides a simulation method and system for the pressing and forming process of a printed circuit board, which includes obtaining the parametric data of the printed circuit board; determining the partitioning scheme of each wiring layer according to the obtained parametric data; identifying the characteristic information of each partition according to the partitioning scheme; establishing a three-dimensional geometric model of the printed circuit board with partition identification information according to the partitioning scheme; calculating the equivalent performance parameters of each partition according to the identified characteristic information; configuring the equivalent performance parameters calculated based on the characteristic information for each partition of the three-dimensional geometric model of the printed circuit board according to the partition identification information; configuring the boundary conditions and loads for simulation calculation, calling the resin curing deformation module of the printed circuit board for solution, and ending the simulation calculation according to the moment when the pressing ends in the pressing and forming process to obtain the simulation result; under the general hardware conditions of a computer, the present invention realizes high-precision and efficient automatic modeling and simulation analysis for the pressing and forming process of complex, large-size and multi-layer PCBs.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board manufacturing, and particularly relates to a simulation method and system for the pressing and forming process of a printed circuit board. Background Art

[0002] The statements in this part merely provide background technologies related to the present invention and do not necessarily constitute prior art.

[0003] Currently, with the increasing development of the integrated circuit design and manufacturing levels, the functions of printed circuit boards (PCBs) are becoming increasingly enhanced, and the number of stacked layers is increasing day by day. However, due to the different functions between layers and the different wiring diagrams for each layer, the spatial distributions of resin and copper in the PCB are asymmetric and non-uniform in the plane and thickness directions. Moreover, due to the significant differences in the mechanical, thermal, and chemical properties of these two materials, the asymmetric and non-uniform spatial distributions will cause different degrees of warping and deformation during the pressing and forming process of the PCB.

[0004] Especially in the aspect of chip packaging, the method of improving chip performance only by increasing the transistor density has encountered a bottleneck. More and more chip manufacturers have begun to package multiple chips together to achieve higher performance, making the packaging size of high-performance chips increasingly large. However, the increase in the chip packaging size has greatly increased the requirement for the flatness of the PCB. This is because when the warping degree of the PCB is the same, the larger the span, the greater the deflection. When the deflection reaches a certain level, it will cause welding failure problems such as the pillow effect during the BGA welding process, thus seriously affecting the reliability of the product. On the contrary, when the PCB deflection that can ensure the BGA welding reliability is certain, the larger the chip packaging size, the smaller the required warping and deformation degree of the PCB. Therefore, with the increasing size of chip packaging, the warping and deformation problems generated during the pressing and forming process of the PCB have gradually become a problem of particular concern and urgent need to be solved for manufacturing and application enterprises.

[0005] However, solving the problem of PCB warping and deformation through experimental methods has the problems of long cycle and high cost. Finite element simulation provides a low-cost and high-efficiency solution for PCB deformation control research. Since the copper wire distribution in the wiring layer of a printed circuit board is very complex and differs from the overall PCB by three to four orders of magnitude in terms of characteristic dimensions, with the current computing power of computer hardware, it is not yet feasible to perform finite element analysis by directly establishing a fine geometric model of the PCB. Therefore, researchers have tried to use the method of equivalent material zoning. Each wiring layer of the PCB is divided into several regions, and then the material properties of the regions are equivalently processed according to the characteristic information such as the arrangement and orientation of different materials within the regions. Since the characteristic information such as the copper content in different regions is different, it is necessary to calculate and assign material properties for each region. Therefore, although the method of zoning and equivalence can reduce the computational amount of finite element simulation and make it feasible for simulation analysis under the existing computer hardware conditions, when the PCB being studied has a large number of layers and a large size, the number of regions required for simulation analysis with a certain accuracy can reach tens of thousands to hundreds of thousands. Operations such as manually obtaining the characteristic information of each region one by one, calculating various equivalent performance parameters according to the characteristic information, establishing a three-dimensional geometric model with zoning information, and binding the material properties of each region one by one will be very cumbersome. Therefore, it is actually not feasible to manually model and perform simulation analysis on the PCB pressing and forming process. Summary of the Invention

[0006] To solve the deficiencies of the prior art, the present invention provides a simulation method and system for the pressing and forming process of a printed circuit board, which realizes high-precision and efficient automatic modeling and simulation analysis of the pressing and forming process of complex, large-size, and multi-layer PCBs under general computer hardware conditions.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] The first aspect of the present invention provides a simulation method for the pressing and forming process of a printed circuit board.

[0009] A simulation method for the pressing and forming process of a printed circuit board includes the following processes:

[0010] Obtain the parametric data of the printed circuit board;

[0011] Determine the zoning scheme of each wiring layer according to the obtained parametric data;

[0012] Identify the characteristic information of each partition according to the zoning scheme;

[0013] Establish a three-dimensional geometric model of the printed circuit board with partition identification information according to the zoning scheme;

[0014] Calculate the equivalent performance parameters of each partition according to the identified characteristic information;

[0015] According to the partition identification information, configure the equivalent performance parameters calculated based on the characteristic information for each partition of the three-dimensional geometric model of the printed circuit board;

[0016] Configure the boundary conditions and loads for simulation calculation, call the resin curing deformation module of the printed circuit board for solution, and end the simulation calculation according to the moment when the pressing and forming process ends to obtain the simulation results.

[0017] Furthermore, the parametric data of the printed circuit board includes: geometric profile, design of each wiring layer, and lamination method;

[0018] The geometric profile includes at least: the planar profile and thickness of the printed circuit board;

[0019] The design of each wiring layer includes at least: the distribution of the upper copper on the printed circuit board and the running direction of the copper wire;

[0020] The lamination method includes at least: the number, thickness, and material types of each layer of the wiring layer and the insulating layer.

[0021] Furthermore, the acquisition of the partition scheme includes: non-equal division of partitions based on the consistency of characteristic information within the region; or equal-size division of partitions based on the consistency of partition sizes.

[0022] Furthermore, the partition characteristic information includes at least: the spatial geometric position of the partition, the spatial distribution of the copper foil, and the local running direction of the copper wire.

[0023] Furthermore, the partition identification information includes at least: the spatial geometric position and number of the partition.

[0024] Furthermore, the equivalent performance parameters include: thermal, chemical, and mechanical performance parameters.

[0025] Furthermore, set the boundary conditions and loads for simulation calculation according to the pressing process of the printed circuit board;

[0026] The pressing process of the printed circuit board includes at least: the pressure and temperature received during the pressing and forming process:

[0027] The boundary conditions include heat transfer boundaries and mechanical boundaries.

[0028] Furthermore, the resin curing deformation module of the printed circuit board includes: a resin thermo-chemical reaction model, a temperature control equation, and a resin anisotropic viscoelastic constitutive equation.

[0029] Furthermore, according to the partition scheme, identify the characteristic information of each partition, including:

[0030] Value the wiring design Figure 2 such that copper foils are represented by first-color pixels and resins are represented by other-color pixels;

[0031] Output the proportion of first-color pixels in each partition of each wiring layer diagram and the direction of continuous lines composed of first-color pixels. Take the proportion of first-color pixels as the copper content and the direction of continuous lines composed of first-color pixels as the copper wire direction;

[0032] Mark the recognized copper content and copper wire direction data with the coordinate information of the partition center point and store them in the form of a data file.

[0033] Furthermore, according to the partition scheme, establish a three-dimensional geometric model of the printed circuit board with partition identification information, including:

[0034] Establish a geometric model of each wiring layer in finite element software;

[0035] Then cut each wiring layer according to the partition scheme determined by batch processing to obtain a geometric model with partitions;

[0036] Read the coordinate position information of the center point of each partition to mark a unique identification information for each partition. Establish geometric models of each insulating layer according to the printed circuit board stack-up scheme and assemble them with the wiring layer geometric model into a complete example printed circuit board geometric model according to the stack-up scheme;

[0037] Furthermore, the simulation results at least include: the spatial distribution of the temperature, degree of cure, and displacement of the printed circuit board at each moment during the hot pressing and forming process.

[0038] The second aspect of the present invention provides a simulation system for the pressing and forming process of a printed circuit board.

[0039] A simulation system for the pressing and forming process of a printed circuit board, including:

[0040] A data acquisition module configured to: acquire parameter data of the printed circuit board;

[0041] A partition scheme acquisition module configured to: determine the partition scheme of each wiring layer according to the acquired parameter data;

[0042] A feature information recognition module configured to: recognize the feature information of each partition according to the partition scheme;

[0043] A three-dimensional geometric model construction module configured to: establish a three-dimensional geometric model of the printed circuit board with partition identification information according to the partition scheme;

[0044] An equivalent performance parameter acquisition module configured to: calculate the equivalent performance parameters of each partition according to the recognized feature information;

[0045] A model parameter binding module, configured to: configure equivalent performance parameters calculated based on feature information for each partition of the three-dimensional geometric model of the printed circuit board according to the partition identification information;

[0046] A simulation module, configured to: configure boundary conditions and loads for simulation calculation, call the printed circuit board resin curing deformation module for solution, and end the simulation calculation according to the moment when the lamination molding process ends, so as to obtain simulation results.

[0047] The third aspect of the present invention provides a computer-readable storage medium, on which a program is stored, and when the program is executed by a processor, the steps in the simulation method of the printed circuit board lamination molding process described in the first aspect of the present invention are implemented.

[0048] The fourth aspect of the present invention provides an electronic device, including a memory, a processor, and a program stored on the memory and executable on the processor. When the processor executes the program, the steps in the simulation method of the printed circuit board lamination molding process described in the first aspect of the present invention are implemented.

[0049] Compared with the prior art, the beneficial effects of the present invention are:

[0050] 1. The PCB lamination molding modeling and simulation analysis method proposed by the present invention is applicable to the ever-emerging PCB wiring layers and structural designs, and has high convenience when replacing the modeling and analysis objects.

[0051] 2. The artificial intelligence algorithm applied in the present invention can avoid complicated manual operations during modeling, break through the limitation of the number of partitions by manual operations through the method of fully automated modeling, realize the free definition of the number of partitions, and provide an effective guarantee for high-precision analysis.

[0052] 3. The present invention applies an artificial intelligence algorithm, enabling the PCB material properties to have equivalent performance with the corresponding number of partitions in the geometric partitions and being able to complete automatic matching with the geometry.

[0053] 4. The PCB lamination molding modeling and simulation analysis method proposed by the present invention enables the modeling and simulation of the complex, large-scale, multi-layer PCB lamination molding process to have both calculation accuracy and calculation efficiency.

[0054] 5. The development environment of the technical solution proposed by the present invention can have multiple choices. It can be through commercial finite element simulation software, or finite element simulation software can be developed by oneself or the existing commercial software can be secondarily developed. It can be used for PCB designers to optimize wiring designs or PCB processing technicians to optimize processing processes, etc.

[0055] Advantages of additional aspects of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The accompanying drawings forming a part of this specification are used to provide a further understanding of the present invention. The schematic embodiments and descriptions thereof of the present invention are used to explain the present invention and do not unduly limit the present invention.

[0057] Figure 1 It is a schematic flow diagram of a simulation method for the pressing and forming process of a printed circuit board provided in Embodiment 1 of the present invention.

[0058] Figure 2 It is a design diagram of 8 wiring layers of a PCB provided in Embodiment 1 of the present invention.

[0059] Figure 3 It is a schematic diagram of a geometric model of a multi-layer PCB with equal-size partitions provided in Embodiment 1 of the present invention.

[0060] Figure 4 It is a schematic diagram of warping and deformation of an example PCB after the pressing and forming is completed provided in Embodiment 1 of the present invention.

[0061] Figure 5 It is a schematic diagram of partitioning by feature information provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0062] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0063] It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs.

[0064] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0065] Without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0066] Embodiment 1:

[0067] As Figure 1As shown in the figure, Embodiment 1 of the present invention provides a simulation method for the pressing and forming process of a printed circuit board, including: intelligent recognition and analysis of PCB wiring layer features, automatic 3D geometric modeling of PCB layer-by-layer and zone-by-zone, intelligent matching and updating of equivalent material properties of each zone of the PCB, integration of simulation analysis of curing deformation during PCB pressing and forming, etc. The present invention can perform high-precision and efficient automatic modeling and simulation analysis on the pressing and forming process of complex, large-size, multi-layer PCBs under general computer hardware conditions.

[0068] For a specific PCB, first preprocess its design file to obtain the PCB geometric contour, lamination scheme, and wiring design diagram of each wiring layer. Subsequently, automatically complete the determination of the zoning scheme, establishment of the geometric model, calculation and binding of equivalent performance parameters in a batch processing manner until the solver is submitted for solution and the required result data is directly output.

[0069] Specifically, this embodiment realizes the equal-size zoning modeling of the PCB and the simulation analysis of the pressing and forming process by means of finite element software and an intelligent script developed based on the Python language. This implementation method has the advantages of high efficiency and simplicity in implementation, and the disadvantage in simulation accuracy can also be effectively compensated by increasing the number of zones. The specific implementation process is as follows:

[0070] S1.1: Output the wiring diagram of each layer of the sample PCB from the PCB design software as a sufficiently clear bitmap format (such as.jpg,.png, etc.) image file, as Figure 2 shown.

[0071] S1.2: Analyze the wiring diagram of each layer of the sample PCB to determine an equal-size zoning scheme that meets the accuracy requirements and calculation efficiency, and apply a wiring diagram recognition script developed based on the Python language. During the operation of the script, call specific functions in the OpenCV computer vision library to Figure 2 threshold the wiring design values (using black pixels to represent copper foil and white pixels to represent resin. Other colors can also be used here as long as the copper foil and resin can be effectively distinguished), and output the proportion of black pixels in each partition of each layer of the wiring diagram and the direction of the continuous lines composed of black pixels. Take the proportion of black pixels as the copper content and the direction of the continuous lines composed of black pixels as the copper wire orientation. Subsequently, mark the recognized copper content and copper wire orientation data with the coordinate information of the partition center point and store them in the computer memory in the form of a data file.

[0072] S1.3: Establish the geometric model of each wiring layer in the finite element software, and then perform equal-size cutting on each wiring layer according to the partitioning scheme determined in S1.2 through batch processing to obtain a geometric model with partitions. Read the center point coordinate position information of each partition to mark unique identification information for each partition. At the same time, establish the geometric models of each insulating layer according to the PCB stack-up scheme and assemble them with the wiring layer geometric model into a complete example PCB geometric model according to the stack-up scheme, as Figure 3 shown, which is an example of a multi-layer PCB geometric model with equal-size partitions.

[0073] S1.4: Calculate the equivalent modulus, Poisson's ratio, density, specific heat capacity, thermal conductivity, coefficient of thermal expansion, and coefficient of chemical shrinkage according to the characteristic information of each partition, and store them in the computer memory in the form of a data file.

[0074] S1.5: Through batch processing, search for and bind the corresponding equivalent material properties in the equivalent material property data file in the finite element software by the identification information of each partition.

[0075] S1.6: Establish the corresponding boundary conditions and loads in the finite element software according to the actual production process conditions of the example PCB pressing and forming process.

[0076] S1.7: Call the resin curing deformation module and define the resin curing reaction kinetics model, viscoelastic constitutive model, etc.

[0077] S1.8: Solve in the finite element solver and output the simulation calculation results, as Figure 4 shown, which is a schematic diagram of the warping deformation of the example PCB after pressing and forming.

[0078] Example 2:

[0079] Embodiment 2 of the present invention provides a PCB pressing and forming modeling and simulation analysis method for partitioning considering the copper wire distribution and orientation characteristics of the wiring layer. In this embodiment, the finite element software and an intelligent script developed based on the Python language are used to realize the modeling and simulation analysis of the PCB partitioning according to the copper wire distribution and orientation characteristics of the wiring layer. This implementation method can fully consider the anisotropic material properties brought by the directional distribution of copper wires in each partition of the PCB, and has the advantage of high simulation accuracy, but the implementation process is relatively complex. The specific implementation process is similar to that of Embodiment 1, only the adopted partitioning scheme is different. Specifically, it includes the following processes:

[0080] S2.1: Output the wiring diagram of each layer of the example PCB from the PCB design software as a clear bitmap format (such as.jpg,.png, etc.) picture file.

[0081] S2.2: Analyze the wiring diagram of each layer of the example PCB, and determine a zoning scheme that meets the accuracy requirements and calculation efficiency based on the copper distribution characteristics and hole characteristics of the wiring layer. For example, Figure 5 As shown, areas A1, A2, and A3 are areas where copper wire bundles are directionally distributed, and areas B1 and B2 are pure resin areas.

[0082] S2.3: Apply the wiring diagram recognition script developed based on the Python language. During the operation of the script, call specific functions in the OpenCV computer vision library to threshold the wiring design Figure 2 (using black pixels to represent copper foil and white pixels to represent resin), and output the proportion of black pixels in each partition of each layer of the wiring diagram and the direction of the continuous lines composed of continuous black pixels. Take the proportion of black pixels as the copper content and the direction of the continuous lines composed of continuous black pixels as the copper wire direction. Subsequently, mark the recognized copper content and copper wire direction data with the coordinate information of the partition center point and store it in the computer memory in the form of a data file.

[0083] S2.4: Establish a geometric model of each wiring layer in the finite element software, and then cut each wiring layer according to the zoning scheme determined in S2.2 through batch processing to obtain a geometric model with partitions. Read the coordinate information of the center point of each partition to mark a unique identification information for each partition. At the same time, establish geometric models of each insulating layer according to the PCB stack-up scheme and assemble them with the wiring layer geometric model according to the stack-up scheme into a complete example PCB geometric model.

[0084] S2.5: Calculate the equivalent modulus, Poisson's ratio, density, specific heat capacity, thermal conductivity, thermal expansion coefficient, and chemical shrinkage coefficient of each partition according to its characteristic information, and store it in the computer memory in the form of a data file.

[0085] S2.6: Through batch processing, search and bind the corresponding equivalent material properties in the equivalent material property data file according to the identification information of each partition in the finite element.

[0086] S2.7: Establish corresponding boundary conditions and loads in the finite element software according to the actual production process conditions of the example PCB pressing and forming process.

[0087] S2.8: Call the resin curing deformation module to define the resin curing reaction kinetics model, viscoelastic constitutive model, etc.

[0088] S2.9: Solve in the finite element solver and output the simulation calculation results.

[0089] Example 3:

[0090] Embodiment 3 of the present invention provides a simulation system for the pressing and forming process of a printed circuit board, including:

[0091] A data acquisition module, configured to: acquire parametric data of the printed circuit board;

[0092] A partition scheme acquisition module, configured to: determine the partition scheme of each wiring layer according to the acquired parametric data;

[0093] A feature information recognition module, configured to: recognize the feature information of each partition according to the partition scheme;

[0094] A three-dimensional geometric model construction module, configured to: establish a three-dimensional geometric model of the printed circuit board with partition identification information according to the partition scheme;

[0095] An equivalent performance parameter acquisition module, configured to: calculate the equivalent performance parameters of each partition according to the recognized feature information;

[0096] A model parameter binding module, configured to: configure the equivalent performance parameters calculated based on the feature information for each partition of the three-dimensional geometric model of the printed circuit board according to the partition identification information;

[0097] A simulation module, configured to: configure the boundary conditions and loads for simulation calculation, call the resin curing deformation module of the printed circuit board for solution, and end the simulation calculation according to the moment when the pressing and forming process ends, so as to obtain the simulation result.

[0098] The working method of the system is the same as the simulation method for the pressing and forming process of the printed circuit board provided in Embodiment 1 or Embodiment 2, and will not be elaborated here.

[0099] Embodiment 4:

[0100] Embodiment 4 of the present invention provides a computer-readable storage medium, on which a program is stored, and when the program is executed by a processor, it implements the steps in the simulation method for the pressing and forming process of the printed circuit board as described in Embodiment 1 or Embodiment 2 of the present invention.

[0101] Embodiment 5:

[0102] Embodiment 5 of the present invention provides an electronic device, including a memory, a processor, and a program stored on the memory and executable on the processor. When the processor executes the program, it implements the steps in the simulation method for the pressing and forming process of the printed circuit board as described in Embodiment 1 or Embodiment 2 of the present invention.

[0103] Those skilled in the art should understand that the embodiments of the present invention can be provided as a method, a system, or a computer program product. Therefore, the present invention can take the form of a hardware embodiment, a software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present invention can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk memory and optical memory, etc.) that contain computer-usable program code.

[0104] The present invention is described with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present invention. It should be understood that each flow and / or block in the flowchart and / or block diagram, and the combination of flows and / or blocks in the flowchart and / or block diagram, can be realized by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to generate a machine, such that the instructions executed by the processor of the computer or other programmable data processing devices generate means for realizing the functions specified in one Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0105] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing devices to work in a specific manner, such that the instructions stored in the computer-readable memory generate a manufactured article including instruction means that realize the functions specified in one Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0106] These computer program instructions can also be loaded onto a computer or other programmable data processing devices, such that a series of operation steps are executed on the computer or other programmable devices to generate a computer-implemented process, and thus the instructions executed on the computer or other programmable devices provide steps for realizing the functions specified in one Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0107] Those of ordinary skill in the art can understand that all or part of the processes of implementing the above-described embodiment methods can be completed by instructing relevant hardware through a computer program. The program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the above-described method embodiments. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM), etc.

[0108] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A simulation method for the pressing and forming process of a printed circuit board, characterized in that: It includes the following processes: Obtain the parametric data of the printed circuit board; Determine the partitioning scheme for each wiring layer according to the obtained parametric data; Identify the characteristic information of each partition according to the partitioning scheme; Establish a three-dimensional geometric model of the printed circuit board with partition identification information according to the partitioning scheme; Calculate the equivalent performance parameters of each partition according to the identified characteristic information; Configure the equivalent performance parameters calculated based on the characteristic information for each partition of the three-dimensional geometric model of the printed circuit board according to the partition identification information; Configure the boundary conditions and loads for simulation calculation, call the resin curing deformation module of the printed circuit board for solution, and end the simulation calculation according to the moment when the lamination in the lamination forming process ends to obtain the simulation results.

2. The simulation method for the pressing and forming process of a printed circuit board according to claim 1, characterized in that: The parametric data of the printed circuit board includes: geometric profile, design of each wiring layer, and lamination method; The geometric profile includes at least: the planar profile and thickness of the printed circuit board; The design of each wiring layer includes at least: the distribution of copper on the printed circuit board and the running direction of copper wires; The lamination method includes at least: the number, thickness, and material types of each wiring layer and insulating layer; 3. The simulation method for the pressing and forming process of a printed circuit board according to claim 1, characterized in that: The acquisition of the partitioning scheme includes: non-equal partitioning based on the consistency of characteristic information within the region; or, equal-size partitioning based on the consistency of partition sizes.

4. The simulation method for the pressing and forming process of a printed circuit board according to claim 1, characterized in that: The partition characteristic information includes at least: the spatial geometric position of the partition, the spatial distribution of copper foil, and the local running direction of copper wires; Or, The partition identification information includes at least: the spatial geometric position and number of the partition; Or, The equivalent performance parameters include: thermal, chemical, and mechanical performance parameters.

5. The simulation method for the pressing and forming process of a printed circuit board according to claim 1, characterized in that: Set the boundary conditions and loads for simulation calculation according to the lamination process of the printed circuit board; The lamination process of the printed circuit board includes at least: the pressure and temperature during the lamination forming process; The boundary conditions include heat transfer boundaries and mechanical boundaries.

6. The simulation method for the pressing and forming process of a printed circuit board according to claim 1, characterized in that: The resin curing deformation module of the printed circuit board includes: a resin thermo-chemical reaction model, a temperature control equation, and a resin anisotropic viscoelastic constitutive equation.

7. The simulation method for the pressing and forming process of a printed circuit board according to claim 1, characterized in that: Identifying the characteristic information of each partition according to the partitioning scheme includes: Binarize the wiring design diagram, using the first color pixels to represent copper foil and other color pixels to represent resin; Output the proportion of the first color pixels in each partition of each wiring diagram layer and the direction of the continuous lines composed of the first color pixels. Use the proportion of the first color pixels as the copper content and the direction of the continuous lines composed of the first color pixels as the running direction of copper wires; Mark the identified copper content and copper wire running direction data with the coordinate information of the partition center point and store it in the form of a data file; Or, Establishing a three-dimensional geometric model of the printed circuit board with partition identification information according to the partitioning scheme includes: Establish a geometric model of each wiring layer in finite element software; Then cut each wiring layer according to the partitioning scheme determined by batch processing to obtain a geometric model with partitions; Read the coordinate position information of the center point of each partition to mark a unique identification information for each partition, establish geometric models of each insulating layer according to the printed circuit board lamination scheme, and assemble them with the wiring layer geometric model into a complete three-dimensional geometric model of the printed circuit board; Or, The simulation results shall at least include: the spatial distributions of the temperature, degree of curing, and displacement of the printed circuit board at various moments during the hot pressing process.

8. A simulation system for the pressing and forming process of a printed circuit board, characterized in that: It includes: A data acquisition module, configured to: acquire the parametric data of the printed circuit board; A partition scheme acquisition module, configured to: determine the partition scheme for each wiring layer according to the acquired parametric data; A feature information recognition module, configured to: recognize the feature information of each partition according to the partition scheme; A three-dimensional geometric model construction module, configured to: establish a three-dimensional geometric model of the printed circuit board with partition identification information according to the partition scheme; An equivalent performance parameter acquisition module, configured to: calculate the equivalent performance parameters of each partition according to the recognized feature information; A model parameter binding module, configured to: configure the equivalent performance parameters calculated based on the feature information for each partition of the three-dimensional geometric model of the printed circuit board according to the partition identification information; A simulation module, configured to: configure the boundary conditions and loads for the simulation calculation, call the resin curing deformation module of the printed circuit board for solution, and end the simulation calculation according to the moment when the pressing is completed in the press-forming process to obtain the simulation results.

9. A computer-readable storage medium, on which a program is stored, characterized in that, When the program is executed by the processor, it implements the steps in the simulation method for the press-forming process of the printed circuit board as described in any one of claims 1-7.

10. An electronic device, including a memory, a processor, and a program stored on the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the steps in the simulation method for the press-forming process of the printed circuit board as described in any one of claims 1-7.

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