Display panel and manufacturing method thereof

Abstract

The present application discloses a display panel and a manufacturing method thereof, comprising: a first substrate, a first buffer layer and a first conductive layer; the first buffer layer is arranged on the first substrate; the first conductive layer is arranged between the first substrate and the first buffer layer, and the first conductive layer comprises a plurality of conductive parts arranged at intervals. The display panel provided by the present application can solve the problem that the reliability of the thin film transistor is reduced due to the polarization phenomenon generated by the first substrate, thereby affecting the display effect of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the same. Background Art

[0002] With the continuous development of display technology, flexible display technology has become one of the important trends, which can meet users' various requirements for display devices in terms of light weight, portability, low energy consumption, excellent image quality, and bendability. Among the various implementation methods of flexible display, organic light-emitting diode display devices have many advantages such as self-luminescence, low driving voltage, high luminous efficiency, short response time, high clarity and contrast, nearly 180° viewing angle, wide operating temperature range, flexible display and large-area full-color display, etc., and are recognized by the industry as the display device with the most development potential.

[0003] In the prior art, the flexible substrate of the flexible display panel is prone to polarization. The electric field generated by the polarized charges on the flexible substrate will reduce the reliability of the thin film transistor, which will cause the flexible display panel to produce image sticking, affecting the display effect of the flexible display panel. Taking organic light-emitting diodes as an example, since the flexible display panel is polarized and generates polarized charges, when the screen of the flexible display panel is switched, the polarized charges on the flexible substrate will cause image sticking on the flexible display panel, affecting the display effect of the flexible display panel and user experience. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a manufacturing method thereof to solve the problem that the reliability of a thin film transistor is reduced due to a polarization phenomenon generated on a first substrate, thereby affecting the display effect of the display panel.

[0005] On the one hand, an embodiment of the present application provides a display panel, comprising: a first substrate, a first buffer layer and a first conductive layer; the first buffer layer is arranged on the first substrate; the first conductive layer is arranged between the first substrate and the first buffer layer, and the first conductive layer includes a plurality of conductive parts arranged at intervals.

[0006] Optionally, in some embodiments of the present application, the cross-sectional shape of the conductive portion is triangular or trapezoidal.

[0007] Optionally, in some embodiments of the present application, the height of the conductive portion is 500 nanometers to 1 micrometer.

[0008] Optionally, in some embodiments of the present application, the material of the conductive part includes at least one of metal, indium tin oxide, conductive carbon material or organic conductive material.

[0009] Optionally, in some embodiments of the present application, the display panel further includes a second substrate and a second buffer layer, the second buffer layer is disposed on a side of the first substrate away from the first buffer layer, and the second substrate is disposed on a side of the second buffer layer away from the first substrate.

[0010] Optionally, in some embodiments of the present application, the display panel also includes a second conductive layer, which is arranged between the second substrate and the second buffer layer, and / or the display panel also includes a third conductive layer, which is arranged between the second buffer layer and the first substrate.

[0011] Optionally, in some embodiments of the present application, the second substrate is disposed on a side of the first buffer layer away from the first substrate, and the second buffer layer is disposed on a side of the second substrate away from the first substrate.

[0012] Optionally, in some embodiments of the present application, materials of the second buffer layer and the first buffer layer both include silicon oxide, silicon nitride, or a combination of the two.

[0013] On the other hand, the present application also provides a method for manufacturing a display panel, comprising the following steps: forming a first conductive layer on a first substrate, the first conductive layer comprising a plurality of conductive portions spaced apart; and forming a first buffer layer on the first conductive layer.

[0014] Optionally, in some embodiments of the present application, a first conductive layer is formed on the first substrate, and the first conductive layer includes a plurality of conductive portions spaced apart from each other; the step of forming a first buffer layer on the first conductive layer specifically includes: forming a second substrate on a side of the first substrate away from the first buffer layer; forming a second buffer layer between the second substrate and the first substrate; and sequentially forming a first insulating layer, an active layer, a second insulating layer, a gate metal layer, an auxiliary electrode layer, an interlayer dielectric layer, and a source / drain metal layer on the first buffer layer.

[0015] The embodiment of the present application provides a display panel and a manufacturing method thereof, wherein the display panel includes: a first substrate, a first buffer layer and a first conductive layer; the first buffer layer is arranged on the first substrate; the first conductive layer is arranged between the first substrate and the first buffer layer, and the first conductive layer includes a plurality of conductive parts arranged at intervals. The display panel provided by the present application is provided with a first conductive layer between the first substrate and the first buffer layer, wherein the first conductive layer includes a plurality of conductive parts arranged at intervals, such a design enables the first conductive layer to introduce movable charges on the interface of the flexible substrate into the conductive parts for rapid polarization, thereby improving the conductivity of the first conductive layer while shielding the polarized charges on the flexible substrate, and solving the problem that the reliability of the thin film transistor is reduced due to the polarization phenomenon of the flexible substrate, thereby affecting the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1a is a schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0018] Figure 1b The embodiment of this application provides Figure 1a A schematic diagram of a second structure of the first conductive layer;

[0019] Figure 2 is a first top view of the first conductive layer provided in an embodiment of the present application;

[0020] Figure 3a is a second top view of the first conductive layer provided in an embodiment of the present application;

[0021] Figure 3b is a third top view of the first conductive layer provided in an embodiment of the present application;

[0022] Figure 4a is a second structural schematic diagram of a display panel provided in an embodiment of the present application;

[0023] Figure 4b is a third structural schematic diagram of a display panel provided in an embodiment of the present application;

[0024] Figure 4c is a fourth structural schematic diagram of a display panel provided in an embodiment of the present application;

[0025] Figure 5is a fifth structural schematic diagram of a display panel provided in an embodiment of the present application;

[0026] Figure 6 It is a manufacturing flow chart of the display panel provided in the embodiment of the present application.

[0027] 001. Display panel, 10. First substrate, 20. First conductive layer / conductive part, 30. First buffer layer, 40. Second substrate, 50. Second buffer layer, 60. First insulating layer, 70. Thin film transistor, 71. Active layer, 72. Gate layer, 73. Auxiliary electrode layer, 74. Source and drain layer, 75. Via hole, 80. Second insulating layer, 90. Gate insulating layer, 100. Interlayer dielectric layer, 110. Second conductive layer, 120. Third conductive layer. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0029] The embodiment of the present application provides a display panel and a method for manufacturing the same, so as to solve the problem that the reliability of the thin film transistor is reduced due to the polarization phenomenon of the flexible substrate, thereby affecting the display effect of the display panel. The following are detailed descriptions. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments. In addition, in the description of the present application, the term "including" means "including but not limited to". The terms "first", "second", "third", etc. are used only as labels to distinguish different objects, rather than to describe a specific order.

[0030] The organic light-emitting device based on the existing flexible display panel includes a driving circuit for controlling the operation of the flexible display panel. When the flexible display panel is working, the charges in its driving circuit move to form a current. At the same time, the charges can also generate an electric field. The electric field can act on the flexible substrate of the flexible display panel to polarize the flexible substrate and generate polarized charges. The side of the flexible substrate close to the organic light-emitting device and the side away from the organic light-emitting device are polarized to produce charges of different electrical properties. When a large number of polarized charges are polarized on the flexible substrate, the electric field generated by the polarized charges on the flexible substrate will affect the charge distribution in the driving circuit, thereby causing the flexible display panel to produce image retention. The display panel proposed in the present application can solve the problem that the reliability of the organic light-emitting device of the existing flexible display panel is reduced due to the polarization phenomenon of its flexible substrate, thereby affecting the display effect of the display panel.

[0031] See also Figure 1a to Figure 2 , Figure 1a is a schematic diagram of a first structure of a display panel provided in an embodiment of the present application; Figure 1b The embodiment of this application provides Figure 1a A schematic diagram of a second structure of the first conductive layer;

[0032] Figure 2 is a first top view of the first conductive layer provided in an embodiment of the present application; Figure 1a As shown, an embodiment of the present application provides a display panel 001, comprising: a first substrate 10, a first buffer layer 30 and a first conductive layer 20; the first buffer layer 30 is arranged on the first substrate 10; the first conductive layer 20 is arranged between the first substrate 10 and the first buffer layer 30, and the first conductive layer 20 includes a plurality of conductive parts 20 arranged at intervals.

[0033] In an embodiment of the present application, the organic light-emitting device includes a thin film transistor 70 and a light-emitting structure (not shown in the figure), wherein the thin film transistor 70 includes an active layer 71, a gate layer 72, a gate insulating layer 90, an auxiliary electrode layer 73, an interlayer dielectric layer 100 and a source-drain electrode layer 74 arranged in a stacked manner, wherein the source-drain electrode layer 74 is electrically connected to the active layer 71 through a via 75. The gate layer 72 and the auxiliary electrode layer 73 are arranged correspondingly to form a storage capacitor. The design of the top gate structure is conducive to improving the reliability of the thin film transistor 70. The display panel also includes a first insulating layer 60 arranged on the side of the first buffer layer 30 away from the first conductive layer 20, and a second insulating layer 80 arranged between the active layer 71 and the gate layer 72.

[0034] It should be noted that the phenomenon of image retention and the like is caused by the polarization of the charges on the first substrate 10, and the charge polarization originates from the polarization effect of the electric field in the organic light-emitting device on the first substrate 10. Therefore, in order to avoid the phenomenon of image retention, the first conductive layer 20 needs to be arranged between the first substrate 10 and the organic light-emitting device. Preferably, the first conductive layer 20 is arranged between the first substrate 10 and the first buffer layer 30. Specifically, the first conductive layer 20 may also be located between the first buffer layer 30 and the first insulating layer 60. On the premise that the first conductive layer 20 is located between the first substrate 10 and the organic light-emitting device, the position of the first conductive layer 20 is not specifically limited in this embodiment. However, it should be noted that in order to ensure the normal operation of the display panel, the first conductive layer 20 needs to avoid contact with the conductive structure in the organic light-emitting device so as not to affect the normal operation of the display panel.

[0035] In the embodiments of the present application, Figure 1a and Figure 1b As shown, the cross-sectional shape of the conductive part 20 is a triangle or a trapezoid. Specifically, the cross-sectional shape refers to the cross-sectional shape of the conductive part 20 along the second direction Y perpendicular to the first direction X.

[0036] In the embodiment of the present application, the height of the conductive part 20 is 500 nanometers to 1 micron, that is, the thickness of the first conductive layer 20 is 500 nanometers to 1 micron. Such a thickness range is conducive to improving the shielding effect of the first conductive layer 20. Specifically, if the thickness of the first conductive layer 20 is too small, its electrostatic shielding ability will be reduced. If the thickness of the first conductive layer 20 is too large, for example, when it exceeds 1 μm, the difficulty of the preparation process of the first conductive layer 20 with excessive thickness increases, resulting in an increase in the overall preparation cost of the flexible display panel, and may affect the bending performance of the display panel. Those skilled in the art can reasonably set the thickness of the first conductive layer 20 according to actual needs, and the embodiment of the present application is not limited here.

[0037] In the embodiment of the present application, the first conductive layer 20 can be prepared by physical vapor deposition, chemical vapor deposition or coating, etc. Those skilled in the art can also select other possible methods to form the first conductive layer 20 as needed.

[0038] In the embodiments of the present application, Figure 2 As shown, the intervals between any two adjacent conductive parts 20 are equal. Specifically, the projection shape of the conductive part 20 on the first substrate 10 is square, rectangular, circular or triangular, that is, the shape of the bottom surface of the conductive part 20 is square, rectangular, circular or triangular, preferably, the shape of the bottom surface of the conductive part 20 is square.

[0039] In the embodiment of the present application, the material of the conductive part 20 includes at least one of metal, indium tin oxide, conductive carbon material or organic conductive material. Specifically, the material of the conductive part 20 can be amorphous silicon, molybdenum, aluminum-titanium alloy, copper or nanosilver. Among them, the conductivity of amorphous silicon will be significantly enhanced with the increase of temperature. Due to the certain heat generated by the flexible display panel during operation, the first conductive layer 20 composed of amorphous silicon has better conductivity. Molybdenum is a transition element metal with a resistivity of 5.2×-8 ohm·m at 0°C; the resistivity of aluminum-titanium alloy and copper at room temperature are 5.2×10 -8 Ohm meter and 1.7×10 -8 Ohm·meter; the resistivity of ordinary metal silver at room temperature is 1.6×10 -8 Ohm·meter; Silver nanomaterials are made of metallic silver in nanometer scale. The physical properties of silver nanomaterials are usually better than those of ordinary metallic silver. The resistivity of nanosilver particles is less than 1.6×10 -8 Ohm·meter, it can be seen that molybdenum, aluminum-titanium alloy, copper or nano-silver have good electrical conductivity.

[0040] In the embodiment of the present application, the display panel further includes a second substrate 40 and a second buffer layer 50, the second buffer layer 50 is arranged on the side of the first substrate 10 away from the first buffer layer 30, and the second substrate 40 is arranged on the side of the second buffer layer 50 away from the first substrate 10. Specifically, the first substrate 10 and the second substrate 40 are both flexible substrates, and the materials of the first substrate 10 and the second substrate 40 include organic materials such as polyimide and polyethylene terephthalate. The design of the double-layer buffer layer is conducive to preventing the corrosion of the display panel by external water and oxygen, and the setting of the double-layer flexible substrate can improve the reliability of the organic light-emitting device and improve the display efficiency of the display panel.

[0041] In an embodiment of the present application, the materials of the second buffer layer 50 and the first buffer layer 30 both include silicon oxide, silicon nitride, or a combination of the two. Specifically, the material of the first buffer layer 30 and the material of the second buffer layer 50 may be the same, for example, both are silicon oxide. The material of the first buffer layer 30 and the material of the second buffer layer 50 may also be different, for example, the first buffer layer 30 may be a silicon nitride material, and the second buffer layer 50 may be a silicon oxide material. Among them, silicon nitride can be used to block the corrosion of the display panel by external water and oxygen, and play a role in protecting the quality of the display panel. Silicon oxide has the function of heat preservation, which prevents the display panel from being damaged due to excessive temperature changes inside the display panel.

[0042] In the embodiment of the present application, a first conductive layer 20 is arranged between the first substrate 10 and the first buffer layer 30 of the display panel, wherein the first conductive layer 20 includes a plurality of conductive portions 20 arranged at intervals. Such a design enables the first conductive layer 20 to introduce movable charges on the interface of the flexible substrate into the conductive portion 20 for rapid polarization, thereby improving the conductivity of the first conductive layer 20 while shielding the polarized charges on the flexible substrate, so as to eliminate the image retention phenomenon of the display panel during the display process.

[0043] Specifically, the main functions of the first conductive layer 20 include two aspects: on the one hand, during the operation of the display panel, especially when staying on a certain screen for a long time, the first conductive layer 20 can shield the polarization effect of the organic light-emitting device on the first substrate 10, reduce the number of polarized charges on the first substrate 10, and the polarization degree of the charge on the first substrate 10 is weakened, so the polarization electric field generated by the first substrate 10 is weak, and the influence on the organic light-emitting device is reduced, thereby solving the image retention phenomenon of the display panel. On the other hand, the existence of the first conductive layer 20 can also shield the influence of the polarized charge on the first substrate 10 on the charge distribution in the organic light-emitting device. Therefore, the first conductive layer 20 can not only weaken the polarization effect of the current in the organic light-emitting device on the first substrate 10, but also eliminate the influence of the polarized charge on the first substrate 10 on the charge distribution in the organic light-emitting device, solving the problem that the reliability of the thin film transistor 70 is reduced due to the polarization phenomenon of the flexible substrate, thereby affecting the display effect of the display panel.

[0044] As a specific implementation of this application, please refer to Figure 3a and Figure 3b , Figure 3a is a second top view of the first conductive layer provided in an embodiment of the present application; Figure 3b is a third top view of the first conductive layer provided in the embodiment of the present application; 3a and Figure 3b As shown, the intervals between at least some of the conductive portions 20 are unequal.

[0045] In the embodiment of the present application, the bottom surface of the conductive portion 20 is in the shape of a square as an example. Figure 3a As shown, the interval d1 between any two adjacent conductive parts 20 in each row of conductive parts 20 arranged along the first direction X is equal, and any two adjacent rows of conductive parts 20 are staggered by a predetermined distance d2 in the first direction X, d2 is less than the interval d1 between any two adjacent microstructures in each row of conductive parts 20, that is, 0≤d2≤d1, wherein the interval d1 between any two adjacent conductive parts 20 in each row of conductive parts 20 is 500 nanometers to 800 nanometers. The spacing d3 between any two adjacent rows of conductive parts 20 in the first conductive layer 20 in the third direction Z is 500 nanometers to 800 nanometers.

[0046] In the embodiment of the present application, the bottom surface of the conductive portion 20 is in the shape of a square as an example. Figure 3b As shown, the interval d1 between any two adjacent conductive parts 20 in each row of conductive parts 20 arranged along the first direction X is equal, wherein the interval d1 between any two adjacent conductive parts 20 in each row of conductive parts 20 is 500 nanometers to 800 nanometers. The interval d3 between any two adjacent rows of conductive parts 20 in the first conductive layer 20 in the third direction Z is 400 nanometers to 600 nanometers.

[0047] It should be noted that the arrangement of the multiple conductive parts 20 in the first conductive layer 20 can also be a variety of other arrangements, and those skilled in the art can choose according to actual needs, and this application does not limit this.

[0048] The display panel provided in the present application is provided with a first conductive layer 20 between the first substrate 10 and the first buffer layer 30 of the display panel, wherein the first conductive layer 20 includes a plurality of conductive portions 20 arranged at intervals. Such a design enables the first conductive layer 20 to introduce movable charges on the interface of the flexible substrate into the conductive portions 20 for rapid polarization, thereby improving the conductivity of the first conductive layer 20 while shielding the polarized charges on the flexible substrate, so as to eliminate the image retention phenomenon of the display panel during the display process.

[0049] As a specific implementation of this application, please refer to Figures 4a to 4c , Figure 4a is a schematic diagram of a second structure of a display panel provided in an embodiment of the present application. Figure 4a As shown, the display panel 002 further includes a second conductive layer 110 , and the second conductive layer 110 is disposed between the second substrate 40 and the second buffer layer 50 .

[0050] As a specific implementation of this application, please refer to Figure 4b , Figure 4b is a third structural schematic diagram of a display panel provided in an embodiment of the present application. Figure 4b As shown, the display panel 003 further includes a third conductive layer 120 , and the third conductive layer 120 is disposed between the second buffer layer 50 and the first substrate 10 .

[0051] As a specific implementation of this application, please refer to Figure 4c , Figure 4c is a fourth structural schematic diagram of a display panel provided in an embodiment of the present application. Figure 4c As shown, the display panel 004 includes a second conductive layer 110 and a third conductive layer 120 , wherein the second conductive layer 110 is disposed between the second substrate 40 and the second buffer layer 50 ; and the third conductive layer 120 is disposed between the second buffer layer 50 and the first substrate 10 .

[0052] As a specific implementation of this application, please refer to Figure 5 , Figure 5 is a fifth structural diagram of a display panel provided in an embodiment of the present application. Figure 5 As shown, in the display panel 005 , the second substrate 40 is disposed on a side of the first buffer layer 30 away from the first substrate 10 , and the second buffer layer 50 is disposed on a side of the second substrate 40 away from the first substrate 10 .

[0053] On the other hand, see Figure 6 , Figure 6 4 is a flowchart of manufacturing a display panel provided in an embodiment of the present application. As shown in FIG4 , the present application also provides a method for manufacturing a display panel, comprising the following steps:

[0054] S10 , forming a first conductive layer 20 on the first substrate 10 , wherein the first conductive layer 20 includes a plurality of conductive portions 20 arranged at intervals.

[0055] In the embodiment of the present application, the steps of forming a first conductive layer 20 on a first substrate 10, wherein the first conductive layer 20 includes a plurality of conductive portions 20 disposed at intervals, specifically include: forming a second substrate 40 on a side of the first substrate 10 away from the first buffer layer 30; forming a second buffer layer 50 between the second substrate 40 and the first substrate 10; and forming a first conductive layer 20 on the first substrate 10, wherein the first conductive layer 20 includes a plurality of conductive portions 20 disposed at intervals.

[0056] In the embodiment of the present application, the first conductive layer 20 can be prepared by physical vapor deposition, chemical vapor deposition or coating. Physical vapor deposition is a commonly used method for preparing thin films. The prepared thin films have the advantages of high hardness, low friction coefficient, good wear resistance and chemical stability, and can be widely used in the preparation of display panels. When the thin film is prepared by chemical vapor deposition, the vapor of the gaseous reactant or liquid reactant containing the elements constituting the thin film and other gases required for the reaction are often introduced into the reaction chamber, and a chemical reaction occurs on the surface of the substrate to form a thin film. The thin film prepared by chemical vapor deposition has the advantages of low deposition temperature, easy control of the film composition, film thickness proportional to the deposition time, uniformity, good repeatability, and excellent step coverage. When the first conductive layer 20 is prepared by coating, it has the advantages of simple production process and uniform thickness of the first conductive layer 20. In addition, those skilled in the art can also choose other possible methods to form the first conductive layer 20 as needed, and this application is not limited here.

[0057] In the embodiment of the present application, the material of the conductive part 20 includes at least one of metal, indium tin oxide, conductive carbon material or organic conductive material. Specifically, the material of the conductive part 20 can be amorphous silicon, molybdenum, aluminum titanium alloy, copper or nano silver.

[0058] Specifically, the first substrate 10 and the second substrate 40 are both flexible substrates, and the materials of the first substrate 10 and the second substrate 40 include organic materials such as polyimide and polyethylene terephthalate. The design of the double-layer buffer layer is conducive to preventing the corrosion of the display panel by external water and oxygen. The setting of the double-layer flexible substrate can improve the reliability of the organic light-emitting device and improve the display efficiency of the display panel.

[0059] In an embodiment of the present application, the materials of the second buffer layer 50 and the first buffer layer 30 both include silicon oxide, silicon nitride, or a combination of the two. Specifically, the material of the first buffer layer 30 and the material of the second buffer layer 50 may be the same, for example, both are silicon oxide. The material of the first buffer layer 30 and the material of the second buffer layer 50 may also be different, for example, the first buffer layer 30 may be a silicon nitride material, and the second buffer layer 50 may be a silicon oxide material. Among them, silicon nitride can be used to block the corrosion of the display panel by external water and oxygen, and play a role in protecting the quality of the display panel. Silicon oxide has the function of heat preservation, which prevents the display panel from being damaged due to excessive temperature changes inside the display panel.

[0060] In the embodiment of the present application, the intervals between any two adjacent conductive parts 20 are equal. Specifically, the projection shape of the conductive part 20 on the first substrate 10 is a square, a rectangle, a circle or a triangle, that is, the shape of the bottom surface of the conductive part 20 is a square, a rectangle, a circle or a triangle, preferably, the shape of the bottom surface of the conductive part 20 is a square.

[0061] It should be noted that the image sticking phenomenon is caused by the polarization of the charges on the first substrate 10, and the charge polarization originates from the polarization effect of the electric field in the organic light-emitting device on the first substrate 10. Therefore, in order to avoid the image sticking phenomenon, the first conductive layer 20 needs to be arranged between the first substrate 10 and the organic light-emitting device. Preferably, the first conductive layer 20 is arranged between the first substrate 10 and the first buffer layer 30. Specifically, the first conductive layer 20 can also be located between the first buffer layer 30 and the first insulating layer 60. On the premise that the first conductive layer 20 is located between the first substrate 10 and the organic light-emitting device, the position of the first conductive layer 20 is not specifically limited in this embodiment. However, it should be noted that in order to ensure the normal operation of the display panel, the first conductive layer 20 needs to avoid contact with the conductive structure in the organic light-emitting device so as not to affect the normal operation of the display panel.

[0062] S20 , forming a first buffer layer 30 on the first conductive layer 20 .

[0063] In the embodiment of the present application, the step of forming the first buffer layer 30 on the first conductive layer 20 specifically includes: forming the first insulating layer 60, the active layer 71, the second insulating layer 80, the gate metal layer, the auxiliary electrode layer 73, the interlayer dielectric layer 100 and the source-drain metal layer on the first buffer layer 30 in sequence, wherein the source-drain layer 74 is electrically connected to the active layer 71 through the via 75; the gate layer 72 and the auxiliary electrode layer 73 are correspondingly arranged to form a storage capacitor. The design of the top gate structure is conducive to improving the reliability of the thin film transistor 70.

[0064] The embodiment of the present application provides a display panel and a manufacturing method thereof, wherein the display panel includes: a first substrate 10, a first buffer layer 30 and a first conductive layer 20; the first buffer layer 30 is disposed on the first substrate 10; the first conductive layer 20 is disposed between the first substrate 10 and the first buffer layer 30, and the first conductive layer 20 includes a plurality of conductive portions 20 disposed at intervals. The display panel provided by the present application is provided with a first conductive layer 20 between the first substrate 10 and the first buffer layer 30 of the display panel, wherein the first conductive layer 20 includes a plurality of conductive portions 20 disposed at intervals. Such a design enables the first conductive layer 20 to introduce movable charges on the interface of the flexible substrate into the conductive portion 20 for rapid polarization, thereby improving the conductivity of the first conductive layer 20 and shielding the polarized charges on the flexible substrate, so as to eliminate the image retention phenomenon of the display panel during the display process. Specifically, the main functions of the first conductive layer 20 include two aspects: on the one hand, during the operation of the display panel, especially when staying on a certain screen for a long time, the first conductive layer 20 can shield the polarization effect of the organic light-emitting device on the first substrate 10, reduce the number of polarized charges on the first substrate 10, and the polarization degree of the charge on the first substrate 10 is weakened, so the polarization electric field generated by the first substrate 10 is weak, and the influence on the organic light-emitting device is reduced, thereby solving the image retention phenomenon of the display panel. On the other hand, the existence of the first conductive layer 20 can also shield the influence of the polarized charge on the first substrate 10 on the charge distribution in the organic light-emitting device. Therefore, the first conductive layer 20 can not only weaken the polarization effect of the current in the organic light-emitting device on the first substrate 10, but also eliminate the influence of the polarized charge on the first substrate 10 on the charge distribution in the organic light-emitting device, solving the problem that the reliability of the thin film transistor 70 is reduced due to the polarization phenomenon of the flexible substrate, thereby affecting the display effect of the display panel.

[0065] The above is a detailed introduction to a display panel and a preparation method thereof provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: a first substrate; A first buffer layer, wherein the first buffer layer is disposed on the first substrate; A first conductive layer, the first conductive layer is disposed between the first substrate and the first buffer layer, and the first conductive layer includes a plurality of conductive portions disposed at intervals; The cross-sectional shape of the conductive portion is triangular or trapezoidal, and the first buffer layer covers surfaces of the plurality of conductive portions.

2. The display panel according to claim 1, characterized in that: The height of the conductive part is 500 nanometers to 1 micrometer.

3. The display panel according to claim 1, characterized in that: The material of the conductive part includes at least one of metal, indium tin oxide, conductive carbon material or organic conductive material.

4. The display panel according to claim 1, characterized in that: The display panel further includes a second substrate and a second buffer layer. The second buffer layer is disposed on a side of the first substrate away from the first buffer layer, and the second substrate is disposed on a side of the second buffer layer away from the first substrate.

5. The display panel according to claim 4, characterized in that: The display panel further includes a second conductive layer, which is disposed between the second substrate and the second buffer layer, and / or the display panel further includes a third conductive layer, which is disposed between the second buffer layer and the first substrate.

6. The display panel according to claim 4, characterized in that: The second substrate is disposed on a side of the first buffer layer away from the first substrate, and the second buffer layer is disposed on a side of the second substrate away from the first substrate.

7. The display panel according to claim 6, characterized in that: Materials of the second buffer layer and the first buffer layer both include silicon oxide, silicon nitride, or a combination of the two.

8. A method for manufacturing a display panel, characterized in that: The following steps are involved: forming a first conductive layer on a first substrate, wherein the first conductive layer comprises a plurality of conductive portions arranged at intervals, and the cross-sectional shape of the conductive portions is a triangle or a trapezoid; A first buffer layer is formed on the first conductive layer, and the first buffer layer covers surfaces of the plurality of conductive portions.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The step of forming a first conductive layer on the first substrate, wherein the first conductive layer includes a plurality of conductive portions arranged at intervals; and forming a first buffer layer on the first conductive layer specifically includes: forming a second substrate on a side of the first substrate away from the first buffer layer; forming a second buffer layer between the second substrate and the first substrate; and A first insulating layer, an active layer, a second insulating layer, a gate metal layer, an auxiliary electrode layer, an interlayer dielectric layer and a source-drain metal layer are sequentially formed on the first buffer layer.

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