Wafer processing equipment

Abstract

The present invention provides a wafer processing apparatus. The wafer processing apparatus includes a front-end control device, a loading device, a connecting member, and a transfer device; the front-end control device is connected to the loading device through the connecting member, the transfer device is disposed on a side of the loading device away from the connecting member, at least one reaction chamber is arranged in the circumferential direction of the transfer device, the reaction chamber is used for processing wafers, the transfer device is used for conveying wafers, the loading device is used for temporarily storing wafers, and the connecting member is used for allowing wafers to pass through. The wafer processing apparatus of the present invention facilitates the conveyance of wafers among the loading device, the transfer device, the reaction chamber, and the front-end control device by providing the transfer device. At least one reaction chamber is arranged in the circumferential direction of the transfer device, which facilitates the processing of wafers. By providing the connecting member to adjust the space between the transfer device and the front-end control device, the maintenance of the front-end control device, the transfer device, and the loading device is facilitated, and the structure is simple, easy to implement and use.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wafer processing device. Background Art

[0002] Wafer transfer is an important part of semiconductor special equipment. During the chip processing, a series of processes will be carried out on the silicon wafer: absolute vacuum, chemical etching, high-energy plasma impact, intense ultraviolet radiation, etc. After hundreds of scattered processing steps, the silicon wafer will be polished into electronic devices such as CPUs, memory chips, and graphics processors. These processing processes have high environmental requirements, so most of the work is carried out in a sealed vacuum chamber, and the wafer is moved from one process chamber to another through a transfer system.

[0003] Generally, the wafer transfer system includes a transfer platform, a loading chamber installed on the transfer platform, a transfer chamber arranged in the transfer platform, etc., and process chambers are hung outside the transfer chamber. The existing wafer transfer system usually has two transfer platforms, which can be called the first-level transfer platform and the second-level transfer platform. The wafer is introduced into the first-level transfer chamber from the loading chamber, placed in the corresponding process module on the first-level transfer chamber according to the process sequence for processing, and then transferred to the second-level transfer chamber, placed in the corresponding process module on the second-level transfer chamber according to the process sequence for processing. After the process is completed, the wafer is transferred back to the loading chamber. However, restricted by the loading chamber, the space between the transfer platform and the front end is small, which cannot meet the maintenance requirements of the equipment. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer processing device, through the front-end control device, the loading device, the connecting piece and the transfer device, the space adjustment between the front-end control device and the transfer device can be realized to improve the problem of small space and inability to maintain.

[0005] To achieve the above purpose, the present invention provides a wafer processing device, including a front-end control device, a loading device, a connecting piece and a transfer device; the front-end control device is connected to the loading device through the connecting piece, the transfer device is arranged on the side of the loading device away from the connecting piece, at least one reaction chamber is arranged in the circumferential direction of the transfer device, the reaction chamber is used for processing the wafer, the transfer device is used for conveying the wafer, the loading device is used for temporarily storing the wafer, and the connecting piece is used for the wafer to pass through.

[0006] The beneficial effects of the wafer processing equipment of the present invention are as follows: By providing the front-end control device, it is convenient to load the wafer and to convey the wafer through external equipment. By providing the transfer device, it is convenient to transfer the wafer between the loading device, the transfer device, the reaction chamber and the front-end control device. At least one reaction chamber is arranged circumferentially on the transfer device, which is convenient for processing the wafer. By providing the connecting piece, it is convenient to adjust the space between the transfer device and the front-end control device, and thus it is convenient for maintaining the front-end control device, the transfer device and the loading device, and the structure is simple, easy to implement and use.

[0007] In a feasible solution, N transfer devices are provided, M loading devices are provided, and any two adjacent transfer devices are connected by the loading device, where N and M are positive integers. The beneficial effects are as follows: By providing multiple transfer devices and multiple loading devices, it is convenient to arrange multiple transfer devices in one processing equipment, so that enough reaction chambers can be set according to process requirements to meet the process requirements.

[0008] In a feasible solution, K connecting pieces are provided, and the connecting pieces are provided between any two adjacent transfer devices, where K is a positive integer. The beneficial effects are as follows: By providing the connecting pieces between any two adjacent transfer devices, it is convenient to increase the maintenance space between any two adjacent transfer devices and convenient for maintaining any one of the transfer devices.

[0009] In a feasible solution, a maintenance space is reserved on one side of the transfer device. The beneficial effects are as follows: On the premise of implementing multiple transfer devices in one processing equipment, reserving a maintenance space on one side of the transfer device is convenient for maintaining any one of the transfer devices.

[0010] In a feasible solution, the maintenance space is used to avoid the reaction chambers of the adjacent transfer devices. The beneficial effects are as follows: By using the maintenance space to avoid the adjacent transfer devices, it is convenient for arranging multiple transfer devices and convenient for maintaining any one of the transfer devices.

[0011] In a feasible solution, the transfer device is in a polygonal shape. The beneficial effects are as follows: Such a setting is convenient for arranging multiple transfer devices and convenient for installing the reaction chambers on the transfer device.

[0012] In a feasible solution, the safety distance between the reaction chamber on the transfer device and the front-end control device is La1; the length of the loading device is Lz1, the length of the connecting piece is Li1, the length of the reaction chamber is Lp1, and the included angle between the reaction chamber on the transfer device and the transfer device is The minimum distance between the reaction chamber of the transfer device and the front-end control device is Ls1; And Ls1 ≥ La1. The beneficial effect is that by setting the minimum distance Ls1 between the reaction chamber of the transfer device and the front-end control device to be greater than or equal to the safety distance La1, it is convenient for the setting of the transfer device and the front-end control device, and convenient for the setting of the reaction chamber.

[0013] In a feasible solution, the safety distance between any two adjacent reaction chambers on the transfer devices is La2; the length of the loading device is Lz2, the length of the connecting piece is Li2, the length of the reaction chamber is Lp2, and the included angle between the reaction chamber and the transfer device is The minimum distance between the reaction chambers of two adjacent transfer devices is Ls2; when the number of connecting pieces between any two adjacent transfer devices is 1; And Ls2 ≥ La2; when the number of connecting pieces between any two adjacent transfer devices is 2; And Ls2 ≥ La2. The beneficial effect is that by setting the minimum distance Ls2 between the reaction chambers of two adjacent transfer devices to be greater than or equal to the safety distance La2, it is convenient for the setting of any two adjacent transfer devices, and convenient for the setting of the reaction chambers on any two adjacent transfer devices.

[0014] In a feasible solution, the reaction chamber is provided with at least one wafer processing position. The beneficial effect is that by setting at least one wafer processing position in one reaction chamber, a group or multiple groups of wafers can be processed in one chamber, and the reaction chamber can be arranged according to needs, improving the processing efficiency.

[0015] In a feasible solution, it further includes several first valve devices; each of the first valve devices is respectively arranged between each reaction chamber and the transfer device, and each of the first valve devices is respectively used to control the opening and closing between each corresponding reaction chamber and the transfer device. The beneficial effect is that by setting the first valve devices, it is convenient to control the connection state between the transfer device and the reaction chamber, and reduce the mutual influence between the transfer device and the reaction chamber.

[0016] In a feasible solution, it further includes a first end cap; a first mounting portion and a second mounting portion are provided between the reaction chamber and the transfer device. The first valve device is disposed on the first mounting portion or the second mounting portion, and the first end cap is disposed on the second mounting portion or the first mounting portion where the first valve device is not provided. The first end cap is used to seal the second mounting portion or the first mounting portion. The beneficial effect is that: by providing the first mounting portion and the second mounting portion, it is convenient to adjust the installation position of the first valve device.

[0017] In a feasible solution, the first mounting portion is disposed on the side close to the transfer device, and the second mounting portion is disposed on the side close to the reaction chamber. The beneficial effect is that: on the one hand, it is convenient to arrange a preheating device between the reaction chamber and the transfer device; on the other hand, it is convenient to extend the service life of the first valve device.

[0018] In a feasible solution, it further includes a second end cap; a hollow portion is provided between the reaction chamber and the transfer device. The second end cap is disposed on the hollow portion. The second end cap is used to seal the hollow portion, and the second end cap is made of a transparent material. The beneficial effect is that: by providing the second end cap, it is convenient to observe the situation between the reaction chamber and the transfer device, and it is convenient to clean the position between the reaction chamber and the transfer device.

[0019] In a feasible solution, it further includes a second valve device; the second valve device is disposed between the transfer device and the loading device and between the front-end control device and the loading device. The second valve device is used to control the opening and closing between the transfer device and the loading device and between the front-end control device and the loading device. The beneficial effect is that: by providing the second valve device, it is convenient to control the communication state between the transfer device and the loading device and between the front-end control device and the loading device. At the same time, it is also convenient to adjust the vacuum or atmospheric state of the wafer at the loading device, which is convenient for the vacuum pumping process.

[0020] In a feasible solution, the shape of the transfer device is hexagonal. The beneficial effect is that: by setting the transfer device to be hexagonal, each side of the transfer device can be respectively connected to the front-end control device, the loading device, and / or at least one of the reaction chambers, which can improve the space utilization rate between the transfer device and the front-end control device.

[0021] In a feasible solution, the transmission device connected to the transmission device connected to the front-end control device is hexagonal. The beneficial effect is that by setting the transmission device connected to the transmission device connected to the front-end control device as hexagonal, it is convenient for the subsequent arrangement of the transmission device.

[0022] In a feasible solution, the reaction chamber is provided with a spraying component and / or a heating component. The spraying component is used for processing the wafer, and the heating component is used for heating the wafer. The beneficial effect is that by providing the spraying component and / or the heating component, the wafer can be heated or processed as needed, which is convenient to use.

[0023] In a feasible solution, the connecting piece is a telescopic piece. The beneficial effect is that by setting the connecting piece as a telescopic piece, it is convenient for the docking between the front-end control device, the loading device and the transmission device, and it is convenient to adjust the space size between the front-end control device and the transmission device and / or between the transmission devices.

[0024] In a feasible solution, the cross-section of the connecting piece is rectangular or trapezoidal. The beneficial effect is that such a setting is convenient for the transportation of the wafer in the connecting piece and reduces the occurrence rate of the situation where the wafer hits the wall of the connecting piece. Description of the Drawings

[0025] Figure 1 Structural schematic diagram of the wafer processing equipment in the first embodiment of the present invention;

[0026] Figure 2 Structural schematic diagram of the wafer processing equipment in the second embodiment of the present invention;

[0027] Figure 3 Structural schematic diagram of the wafer processing equipment in the third embodiment of the present invention;

[0028] Figure 4 Structural schematic diagram of the wafer processing equipment in the fourth embodiment of the present invention;

[0029] Figure 5 Structural schematic diagram of the wafer processing equipment in the fifth embodiment of the present invention;

[0030] Figure 6 is Figure 5 Enlarged structural schematic diagram at A in

[0031] Figure 7 is Figure 5 Enlarged structural schematic diagram at B in

[0032] Figure 8Schematic structural diagram of a wafer processing apparatus in the sixth embodiment of the present invention;

[0033] Figure 9 Partial schematic structural diagram of a reaction chamber in the first embodiment of the present invention;

[0034] Figure 10 Schematic structural diagram of a reaction chamber in another embodiment of the present invention;

[0035] Figure 11 Schematic structural diagram of a first valve device installed on a first mounting portion in an embodiment of the present invention;

[0036] Figure 12 Schematic structural diagram of a first valve device installed on a second mounting portion in an embodiment of the present invention;

[0037] Figure 13 Schematic structural diagram of a second end cap installed on a first mounting portion in an embodiment of the present invention.

[0038] Reference numerals in the figure:

[0039] 1. Front-end control device;

[0040] 2. Loading device;

[0041] 3. Connecting member;

[0042] 4. Transfer device; 401. Maintenance space; 402. Transfer channel;

[0043] 5. Reaction chamber; 501. Wafer processing position;

[0044] 6. First valve device; 601. Driver; 602. Gate plate; 603. Valve housing; 604. Adapter;

[0045] 7. First end cap; 701. First mounting portion; 702. Second mounting portion;

[0046] 8. Second end cap; 801. Hollow portion. Detailed implementation manners

[0047] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention. Apparently, the described embodiments are only a part rather than all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present invention pertains. As used herein, words such as "including" and the like are intended to mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items.

[0048] In view of the problems existing in the prior art, an embodiment of the present invention provides a wafer processing device.

[0049] Figure 1 It is a schematic structural diagram of the wafer processing device in the first embodiment of the present invention.

[0050] In some embodiments of the present invention, with reference to Figure 1 , the wafer processing device includes a front-end control device 1, a loading device 2, a connecting member 3, and a transfer device 4; the front-end control device 1 is connected to the loading device 2 through the connecting member 3, the transfer device 4 is disposed on a side of the loading device 2 away from the connecting member 3, at least one reaction chamber 5 is arranged circumferentially on the transfer device 4, the reaction chamber 5 is used for processing the wafer, the transfer device 4 is used for conveying the wafer, the loading device 2 is used for temporarily storing the wafer, and the connecting member 3 is used for allowing the wafer to pass through.

[0051] In some specific embodiments of the present invention, the front-end control device 1 is provided with a cassette, the cassette is used for carrying the wafer, and the cassette is also used for conveying between two or more of the front-end control devices 1. That is, the unprocessed wafer or the processed wafer can be taken and placed in the front-end control device 1. The transfer device 4 is connected to the front-end control device 1 through the loading device 2 and the connecting member 3, and the connecting member 3 is disposed between the loading device 2 and the front-end control device 1. The transfer device 4 is provided with a hollow interior, and the transfer mechanism of the transfer device 4 is disposed in the hollow portion. The reaction chamber 5 is disposed on the circumferential side of the transfer device 4, and the reaction chamber 5 is provided with at least one. Both the loading device 2 and the reaction chamber 5 communicate with the hollow portion. The transfer mechanism of the transfer device 4 of the transfer device 4 can convey the wafer between the transfer device 4 and the reaction chamber 5, between the transfer device 4 and the loading device 2, and between the loading device 2 and the front-end control device 1.

[0052] In some embodiments, the connecting member 3 is hollow, and the wafers conveyed by the conveying device 4 or the wafers in the front-end control device 1 can pass through the connecting member 3.

[0053] In use, the wafers in the front-end control device 1 are conveyed into the reaction chamber 5 for processing through the conveying mechanism of the conveying device 4, and after the processing is completed, the wafers are conveyed into the front-end control device 1 through the conveying mechanism of the conveying device 4 for external conveyance or storage.

[0054] It should be noted that since wafer processing needs to be carried out in a vacuum environment and the front-end control device 1 is in communication with the atmosphere, a second valve device (not shown in the figure) needs to be provided between the conveying device 4 and the loading device 2 and between the front-end control device 1 and the loading device 2 to control the communication state between the conveying device 4 and the loading device 2 and between the front-end control device 1 and the loading device 2, and a vacuum pumping mechanism is configured at the loading device 2 to perform a vacuum pumping operation.

[0055] Figure 11 Schematic diagram of the structure of the first valve device installed in the first installation part in the embodiment of the present invention.

[0056] In addition, referring to Figure 1 and Figure 11 , in order to avoid the mutual influence between the reaction chamber 5 and the hollow part of the conveying device 4, a first valve device 6 needs to be provided between each reaction chamber 5 and the conveying device 4 to control the on-off between the reaction chamber 5 and the conveying device 4.

[0057] Figure 2 Schematic diagram of the structure of the wafer processing equipment in the second embodiment of the present invention, Figure 3 Schematic diagram of the structure of the wafer processing equipment in the third embodiment of the present invention, Figure 4 Schematic diagram of the structure of the wafer processing equipment in the fourth embodiment of the present invention, Figure 5 Schematic diagram of the structure of the wafer processing equipment in the fifth embodiment of the present invention, Figure 8 Schematic diagram of the structure of the wafer processing equipment in the sixth embodiment of the present invention.

[0058] In some embodiments of the present invention, referring to Figures 1 to 5 and Figure 8 , the conveying device 4 is provided with N, and the loading device 2 is provided with M, and any two adjacent conveying devices 4 are connected through the loading device 2, and N and M are positive integers.

[0059] In some specific embodiments of the present invention, the number of the transfer devices 4 and the loading devices 2 is set to be plural, and the number of the transfer devices 4 and the loading devices 2 is not equal. Specifically, when one loading device 2 is provided between any adjacent transfer devices 4, due to the fact that there is also one loading device 2 between the transfer device 4 and the front-end control device 1, the number of the loading devices 2 is one more than the number of the transfer devices 4.

[0060] Setting the transfer devices 4 and the loading devices 2 to be plural can provide multiple transfer devices 4 on a wafer processing equipment. And because each transfer device 4 is provided with a reaction chamber 5, enough reaction chambers 5 can be provided to meet the process requirements of different complexities.

[0061] In some embodiments of the present invention, referring to Figures 1 to 5 and Figure 8 , the number of the connecting members 3 is set to be K, and the connecting members 3 are provided between any adjacent two transfer devices 4, where K is a positive integer.

[0062] In some specific embodiments of the present invention, when the connecting members 3 are provided between any adjacent transfer devices 4, that is, any adjacent connecting members 3 are connected through the loading device 2 and the connecting members 3, the distance between any adjacent transfer devices 4 can be increased, and the size of the maintenance space 401 between any adjacent transfer devices 4 can be ensured.

[0063] In some embodiments, when the number of the transfer devices 4 is one, only one connecting member 3 is provided, that is, the connecting member 3 is provided between the transfer device 4 and the front-end control device 1. In some other embodiments, when the number of the transfer devices 4 is two, the number of the connecting members 3 is set to be two or three, and the additional connecting members 3 are provided between the two transfer devices 4.

[0064] In some other embodiments, the connecting member 3 can be provided on one side or both sides of any one loading device 2. That is, the connecting member 3 can be provided on the loading device 2 between the transfer devices 4. In addition, when the connecting member 3 is provided on one side of the loading device 2, one side of the loading device 2 is connected to the transfer device 4 through the connecting member 3, and the other side of the loading device 2 is directly connected to the transfer device 4. When the connecting members 3 are provided on both sides of the loading device 2, both sides of the loading device 2 are connected to the transfer device 4 through the connecting members 3.

[0065] In some embodiments of the present invention, referring to Figures 1 to 5 and Figure 8, a maintenance space 401 is reserved on one side of the transmission device 4.

[0066] In some specific embodiments of the present invention, when multiple transmission devices 4 are provided, a space is reserved on the side of the transmission device 4 to facilitate the maintenance of the transmission device 4.

[0067] It should be noted that when only one transmission device 4 is provided, since the connecting member 3 is provided between the transmission device 4 and the front-end control device 1, the space around the connecting member 3 can provide the maintenance space 401. Therefore, when only one transmission device 4 is provided, the maintenance space 401 may or may not be reserved on the side of the transmission device 4.

[0068] In some embodiments of the present invention, refer to Figures 1 to 5 and Figure 8 , the maintenance space 401 is used to avoid the reaction chamber 5 of the adjacent transmission device 4.

[0069] In some specific embodiments of the present invention, the maintenance space 401 of the previous transmission device 4 is arranged on the side close to another adjacent transmission device 4, so as to be able to avoid the reaction chamber 5 of another or adjacent transmission device 4. This facilitates the arrangement of multiple transmission devices 4.

[0070] In some embodiments of the present invention, refer to Figures 1 to 5 and Figure 8 , the transmission device 4 is in the shape of a polygon.

[0071] In some specific embodiments of the present invention, the transmission device 4 is a regular polygon. Since the wafer needs to go through several process steps to be formed during processing, it is necessary to transport the wafer between different reaction chambers 5. Setting the transmission device 4 as a polygon facilitates the arrangement of the transmission device 4 and the rational use of space. Setting the transmission device 4 as a regular polygon facilitates the control of the rotation angle and the conveying speed during wafer transportation.

[0072] In some embodiments, the transmission device 4 may be in the shape of a quadrilateral, pentagon, heptagon, octagon or other shapes.

[0073] In some other embodiments, the transmission device 4 may also be set to an irregular shape.

[0074] Figure 6 For Figure 5 the enlarged structural schematic diagram at position A in

[0075] In some embodiments of the present invention, refer to Figures 1 to 6, the safety distance between the reaction chamber 5 on the transfer device 4 and the front-end control device 1 is La1; the length of the loading device 2 is Lz1, the length of the connecting member 3 is Li1, the length of the reaction chamber 5 is Lp1, and the included angle between the reaction chamber 5 on the transfer device 4 and the transfer device 4 is The minimum distance between the reaction chamber 5 of the transfer device 4 and the front-end control device 1 is Ls1; And Ls1 ≥ La1.

[0076] In some specific embodiments of the present invention, the safety distance La1 is an empirical value. For example, the safety distance La1 can be set to 50 cm. Usually, the front-end control device 1, the connecting member 3, the loading device 2, and the transfer device 4 are arranged on a straight line. The length direction of the loading device 2 refers to the direction in which the loading device 2 approaches the front-end control device 1, and the length direction of the connecting member 3 is the same as the length direction of the loading device 2. The length of the reaction chamber 5 refers to the direction perpendicular to the side surface of the transfer device 4 where it is located, and this reaction chamber 5 refers to the reaction chamber 5 that can be installed on the side surface of the transfer device 4 closest to the front-end control device 1 in theory, and this reaction chamber 5 is not arranged on the side surface of the transfer device 4 connected to the loading device 2. The included angle between the reaction chamber 5 and the transfer device 4 That is, the included angle between the nearest reaction chamber 5 in the above theory and the line where the wafer processing equipment is located. When the transfer device 4 is a regular polygon, the included angle ρ is the interior angle of the transfer device 4. Accordingly, it can be calculated that the minimum distance between the reaction chamber 5 of the transfer device 4 and the front-end control device 1 Setting the Ls1 to be greater than or equal to La1 can meet the usage or maintenance requirements between the transfer device 4 and the front-end control device 1.

[0077] Figure 7 is Figure 5 The enlarged structural schematic diagram at position B in

[0078] In some embodiments of the present invention, referring to Figures 1 to 7 , the safety distance between any two adjacent reaction chambers 5 on the transfer device 4 is La2; the length of the loading device 2 is Lz2, the length of the connecting member 3 is Li2, the length of the reaction chamber 5 is Lp2, and the included angle between the reaction chamber 5 and the transfer device 4 is The minimum distance between two adjacent reaction chambers 5 of the transfer device 4 is Ls2; when the number of connecting members 3 between any two adjacent transfer devices 4 is 1; and Ls2 ≥ La2; when the number of the connecting members 3 between any two adjacent transfer devices 4 is 2; and Ls2 ≥ La2.

[0079] In some specific embodiments of the present invention, the safety distance La2 is an empirical value. For example, the safety distance La2 can be set to 50 cm. The included angle between the reaction chamber 5 and the transfer device 4 is the included angle as described above Similarly, setting the safety distance Ls2 to be greater than or equal to La2 can meet the usage or maintenance requirements between any adjacent transfer devices 4.

[0080] In some embodiments, since the form of arranging three or more connecting members 3 is similar to the form of arranging two connecting members 3, it will not be elaborated here.

[0081] Figure 9 It is a partial structural schematic diagram of the reaction chamber in the first embodiment of the present invention, Figure 10 It is a structural schematic diagram of the reaction chamber in another embodiment of the present invention.

[0082] In some embodiments of the present invention, referring to Figures 1 to 10 , the reaction chamber 5 is provided with at least one wafer processing position 501.

[0083] In some specific embodiments of the present invention, the reaction chamber 5 is provided with one wafer processing position 501. In some other embodiments, the reaction chamber 5 is provided with two, three, four or more wafer processing positions 501.

[0084] Figure 12 It is a structural schematic diagram of the first valve device installed in the second installation part in the embodiment of the present invention, Figure 13 It is a structural schematic diagram of the second end cover installed in the first installation part in the embodiment of the present invention.

[0085] In some embodiments of the present invention, referring to Figures 1 to 13 , it further includes a first end cover 7; a first installation part 701 and a second installation part 702 are provided between the reaction chamber 5 and the transfer device 4, the first valve device 6 is disposed in the first installation part 701 or the second installation part 702, the first end cover 7 is disposed in the second installation part 702 or the first installation part 701 where the first valve device 6 is not disposed, and the first end cover 7 is used to seal the second installation part 702 or the first installation part 701. The first installation part 701 is disposed on the side close to the transfer device 4, and the second installation part 702 is disposed on the side close to the reaction chamber 5.

[0086] In some specific embodiments of the present invention, the first gate valve device 6 includes a driver 601 and a gate plate 602. A transmission channel 402 is provided between the reaction chamber 5 and the transmission device 4. The gate plate 602 is fixedly arranged on the driver 601. The driver 601 can drive the gate plate 602 to block the transmission channel 402. The first mounting portion 701 and the second mounting portion 702 are arranged on the transmission channel 402. The first mounting portion 701 is arranged on a side close to the transmission device 4, and the second mounting portion 702 is arranged on a side close to the reaction chamber 5. When in use, the first gate valve device 6 is arranged on the first mounting portion 701, and the first end cover 7 is covered on the second mounting portion 702. At this time, the first gate valve device 6 is closer to the transmission device 4. Alternatively, the first gate valve device 6 is arranged on the second mounting portion 702, and the first end cover 7 is covered on the first mounting portion 701. At this time, the first gate valve device 6 is closer to the reaction chamber 5.

[0087] In some embodiments, the first gate valve device 6 may be a valve-less gate valve and a valve-box gate valve. Generally, when the valve-less gate valve is disposed on the first mounting portion 701, the valve-box gate valve is disposed on the second mounting portion 702. The valve-less gate valve is disposed on the first mounting portion 701 so that the valve-less gate valve is farther from the reaction chamber 5, which can increase the service life of the valve plate. When the valve-box gate valve is disposed on the second mounting portion 702, a heating mechanism may be disposed on the valve-box gate valve to facilitate heating of the wafer in the reaction chamber 5.

[0088] It is worth noting that, compared with the first gate valve device 6, the gate valve with valve box further includes a valve housing 603, and the gate plate 602 is slidably disposed in the valve housing 603. In addition, when the gate valve with valve box gate valve is provided, the valve housing 603 can be directly docked with the transmission channel 402. At this time, the valve housing 603 is docked with the transmission channel 402, and is connected with the reaction chamber 5 and the transmission device 4, and at this time, the first end cover 7 is covered on the first mounting portion 701.

[0089] In some embodiments, when the valveless gate valve is installed, the first end cover 7 is covered on the second mounting portion 702. However, in order to facilitate the installation of the valve-box gate valve, an adapter 604 with a through hole can be provided on the second mounting portion 702 to replace the first end cover 7. That is, when the valveless gate valve is installed, the second mounting portion 702 is provided with the adapter 604; when the valve-box gate valve is installed, the first mounting portion 701 is covered by the first end cover 7.

[0090] In some embodiments of the present invention, reference Figures 1 to 13, further including a second end cap 8; there is a hollowed-out portion 801 between the reaction chamber 5 and the transfer device 4, the second end cap 8 is disposed in the hollowed-out portion 801, the second end cap 8 is used to block the hollowed-out portion 801, and the second end cap 8 is made of a transparent material.

[0091] In some specific embodiments of the present invention, the hollowed-out portion 801 is disposed in the transfer channel 402, the second end cap 8 is detachably disposed in the hollowed-out portion 801, and the second end cap 8 is made of a transparent material. The situation inside the transfer channel 402 can be observed through the second end cap 8, which is convenient for use.

[0092] In some embodiments of the present invention, referring to Figures 1 to 8 , the shape of the transfer device 4 is hexagonal.

[0093] In some specific embodiments of the present invention, the transfer device 4 connected to the front-end control device 1 is set to be hexagonal. During use, one side of the transfer device 4 is connected to the front-end control device 1, and three, four, or five reaction chambers 5 can be provided on the remaining five sides. When five reaction chambers 5 are provided, the transfer device 4 does not need to be connected to other transfer devices 4. When four reaction chambers 5 are provided, the side without the reaction chamber 5 can be used as the maintenance space 401. When three reaction chambers 5 are provided, one of the two sides without the reaction chamber 5 can be used as the maintenance space 401, and the other is connected to other transfer devices 4.

[0094] In some embodiments of the present invention, referring to Figures 1 to 8 , the transfer device 4 connected to the transfer device 4 connected to the front-end control device 1 is hexagonal.

[0095] In some specific embodiments of the present invention, the transfer device 4 directly connected to the front-end control device 1 is the first transfer device 4, and the transfer devices 4 indirectly connected to the front-end control device 1 are the second transfer device 4, the third transfer device 4, the fourth transfer device 4, and so on in sequence. The shape of the second transfer device 4 is hexagonal. Among the six sides of the transfer device 4, reaction chambers 5 are provided on three sides, one of the remaining three sides is communicated with the first transfer device 4 through a loading device 2, the other side is communicated with the third transfer device 4 through another loading device 2, and the side without the reaction chamber 5 and the loading device 2 is left vacant as the maintenance space 401.

[0096] In some embodiments, since the second transfer device 4 is only connected to the first transfer device 4, only one loading device 2 can be provided for the second transfer device 4. The second transfer device 4 is provided with one less loading device 2 than the first transfer device 4. Therefore, four reaction chambers 5 and one maintenance space 401 can be provided. In some other embodiments, since the second transfer device 4 is arranged on the outermost side of the wafer processing equipment, the maintenance space 401 may not be reserved on the side of the second transfer device 4, that is, five reaction chambers 5 can be provided for the second transfer device 4.

[0097] In some other embodiments, the maintenance space 401 of the first transfer device 4 is arranged on the side adjacent to the second transfer device 4, and at this time, the maintenance space 401 of the first transfer device 4 can avoid the reaction chamber 5 on the second transfer device 4; meanwhile, the maintenance space 401 of the second transfer device 4 is arranged on the side adjacent to the first transfer device 4, and at this time, the maintenance space 401 of the first transfer device 4 can avoid the reaction chamber 5 on the first transfer device 4.

[0098] In some embodiments of the present invention, referring to Figures 1 to 10 , the reaction chamber 5 is provided with a spraying component and / or a heating component. The spraying component is used for processing the wafer, and the heating component is used for heating the wafer.

[0099] In some specific embodiments of the present invention, the spraying component and the heating component can be arranged at the same wafer processing position 501. In some other embodiments, only the spraying component or the heating component can be arranged at a wafer processing position 501.

[0100] In some embodiments of the present invention, referring to Figures 1 to 5 , the connecting piece 3 is a telescopic piece.

[0101] In some specific embodiments of the present invention, the connecting piece 3 is a telescopic piece, which is convenient for adjusting the docking between the front-end control device 1 and the loading device 2. At the same time, setting the connecting piece 3 is also convenient for adjusting the maintenance space 401 between the front-end control device 1 and the loading device 2.

[0102] In some embodiments, when setting the connecting piece 3, the remaining space between the front-end control device 1 and the loading device 2 occupied by the connecting piece 3 can be used as the maintenance space 401. At this time, the maintenance space 401 may not be set again on the side of the transfer device 4.

[0103] In some embodiments of the present invention, referring to Figures 1 to 10 , the cross-section of the connecting piece 3 is rectangular or trapezoidal.

[0104] In some specific embodiments of the present invention, the cross-section of the connecting member 3 is rectangular. In some implementation categories, the cross-section of the connecting member 3 can be set as square, trapezoidal, elliptical or other shapes. In some other embodiments, the connecting member 3 can be set as a regular shape or an irregular shape.

[0105] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. A wafer processing device, characterized in that, it includes a front-end control device, a loading device, a connecting member, and a transfer device; the front-end control device is connected to the loading device through the connecting member, the transfer device is arranged on a side of the loading device away from the connecting member, at least one reaction chamber is arranged circumferentially on the transfer device, the reaction chamber is used for processing the wafer, the transfer device is used for conveying the wafer, the loading device is used for temporarily storing the wafer, and the connecting member is used for allowing the wafer to pass through; the safety distance between the reaction chamber on the transfer device and the front-end control device is La1; The length of the loading device is Lz1, the length of the connecting piece is Li1, the length of the reaction chamber is Lp1, and the angle between the reaction chamber on the transfer device and the transfer device is The minimum distance between the reaction chamber of the transfer device and the front-end control device is Ls1; and Ls1 ≥ La1; it further includes a plurality of first valve devices, each of the first valve devices is respectively arranged between each of the reaction chambers and the transfer device, and each of the first valve devices is respectively used for controlling the opening and closing between each corresponding reaction chamber and the transfer device; a first installation part and a second installation part are arranged between the reaction chamber and the transfer device, the first installation part is arranged on a side close to the transfer device, the second installation part is arranged on a side close to the reaction chamber, the first valve device includes a valve-less box valve and a valve box valve, when the valve-less box valve is arranged on the first installation part, the valve box valve is arranged on the second installation part.

2. The wafer processing device according to claim 1, characterized in that, the transfer device is set to N, the loading device is set to M, and any two adjacent transfer devices are connected through the loading device, where N and M are positive integers.

3. The wafer processing device according to claim 2, characterized in that, the connecting member is set to K, and the connecting member is arranged between any two adjacent transfer devices, where K is a positive integer.

4. The wafer processing device according to claim 2, characterized in that, a maintenance space is reserved on one side of the transfer device.

5. The wafer processing device according to claim 4, characterized in that, the maintenance space is used to avoid the reaction chamber of the adjacent transfer device.

6. The wafer processing device according to claim 1, characterized in that, the shape of the transfer device is a polygon.

7. The wafer processing device according to claim 3, characterized in that, the safety distance between the reaction chambers on any two adjacent transfer devices is La2; The length of the loading device is Lz2, the length of the connecting piece is Li2, the length of the reaction chamber is Lp2, and the included angle between the reaction chamber and the transfer device is The minimum distance between the reaction chambers of two adjacent transfer devices is Ls2; when the number of connecting members between any two adjacent transfer devices is 1; and Ls2 ≥ La2; when the number of connecting members between any two adjacent transfer devices is 2; and Ls2 ≥ La2.

8. The wafer processing device according to claim 1, characterized in that, the reaction chamber is provided with at least one wafer processing position.

9. The wafer processing device according to claim 1, characterized in that, it further includes a second end cap; a hollow part is arranged between the reaction chamber and the transfer device, the second end cap is arranged on the hollow part, the second end cap is used for blocking the hollow part, and the second end cap is made of a transparent material.

10. The wafer processing device according to claim 1, characterized in that, it further includes a second valve device; The second valve device is disposed between the transfer device and the loading device and between the front-end control device and the loading device, and the second valve device is used to control the opening and closing between the transfer device and the loading device and between the front-end control device and the loading device.

11. The wafer processing equipment according to claim 1, characterized in that, the transfer device is hexagonal in shape.

12. The wafer processing equipment according to claim 2, characterized in that, the transfer device connected to the transfer device connected to the front-end control device is hexagonal.

13. The wafer processing equipment according to any one of claims 1 to 12, characterized in that, the reaction chamber is provided with a spraying component and / or a heating component, the spraying component is used for processing the wafer, and the heating component is used for heating the wafer.

14. The wafer processing equipment according to any one of claims 1 to 12, characterized in that, the connecting member is a telescopic member.

15. The wafer processing equipment according to any one of claims 1 to 12, characterized in that, the cross-section of the connecting member is rectangular or trapezoidal.

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