Adsorption device and wafer mass transfer equipment

Abstract

Embodiments of the present invention disclose a suction device and wafer mass transfer equipment, relating to the field of Micro-LED wafer mass transfer technology. The suction device and wafer mass transfer equipment include a negative pressure device, a connector, and a suction plate. The suction plate includes a suction region and a transfer region, the suction region surrounding the transfer region. The suction region includes multiple suction holes and an air path, with the multiple suction holes disposed in the air path. The connector is respectively connected to the air path and the negative pressure device. This achieves suction force while avoiding interference with the laser oscillator crystal, enabling better performance in Micro-LED wafer mass transfer.

Description

Technical Field

[0001] The present invention relates to the field of Micro-LED wafer mass transfer technology, and in particular to an adsorption device and wafer mass transfer equipment. Background Art

[0002] Micro-LED technology is a new generation of display technology, and mass transfer technology is a key component of Micro-LED manufacturing. Micro-LED mass transfer technology involves transferring thousands of Micro-LEDs from a carrier workpiece to a target workpiece. With the further development of LED display technology, LED chip size is shrinking, with existing Micro-LED sizes reaching the μm level. Before mass transfer, the Micro-LED workpiece must undergo loading, adsorption, alignment, and laser galvanometer processing. Adsorption is particularly critical, as existing adsorption methods can interfere with the laser oscillator crystal. Securing adsorption while avoiding interference with the laser oscillator crystal presents a significant challenge. Summary of the Invention

[0003] The technical problem to be solved by the embodiments of the present invention is how to achieve adsorption force through a simple and low-cost structure while avoiding interference with the laser oscillator crystal.

[0004] To solve the above problems, embodiments of the present invention disclose an adsorption device and wafer mass transfer equipment. While achieving adsorption force, it avoids interfering with the laser oscillator crystal, thereby better achieving the effect of Micro-LED wafer mass transfer.

[0005] On the one hand, the present invention provides an adsorption device, which includes a negative pressure device, a connector and an adsorption plate; the adsorption plate includes an adsorption area and a transfer area, and the adsorption area is distributed around the transfer area; the adsorption area includes a plurality of adsorption holes and an air path, and the plurality of adsorption holes are arranged in the air path; the connector is respectively connected to the air path and the negative pressure device.

[0006] Its further technical solution is that the adsorption plate includes a positioning hole, the positioning hole is arranged on one side of the transfer area, the gas path includes a main gas path, a first branch gas path, a connecting gas path and a second branch gas path, one end of the main gas path is connected to the joint, and the other end of the main gas path is connected to the first branch gas path, the connecting gas path is respectively connected to the first branch gas path and the second branch gas path, and the first branch gas path and the second branch gas path are respectively located on both sides of the positioning hole.

[0007] A further technical solution is that there are multiple first branch gas paths, and the multiple first branch gas paths are all connected to the main gas path and the connecting gas path.

[0008] A further technical solution is that there are multiple second branch gas paths, and multiple first branch gas paths are all connected to the connecting gas path.

[0009] A further technical solution is that the plurality of adsorption holes are arranged at intervals and are respectively provided in the two first branch air paths and the two second branch air paths.

[0010] A further technical solution is that the adsorption plate also includes an equipment installation area, and the equipment installation area is arranged outside the adsorption area.

[0011] A further technical solution is that the equipment installation area includes a plurality of fixing holes and a plurality of equipment holes, and the plurality of fixing holes and the plurality of equipment holes all pass through the adsorption plate.

[0012] A further technical solution is that the negative pressure device is a vacuum pump.

[0013] A further technical solution is that the connector is a pneumatic quick connector.

[0014] On the other hand, the present invention provides a mass wafer transfer device, which includes the adsorption device described above.

[0015] Compared with the prior art, the embodiments of the present invention can achieve the following technical effects:

[0016] By designing the adsorption area to be distributed around the transfer area, the adsorption force is achieved while avoiding interference with the laser oscillator crystal, which can better achieve the mass transfer effect of Micro-LED wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic structural diagram of an adsorption device and wafer mass transfer equipment provided in an embodiment of the present invention.

[0019] Reference numerals

[0020] Adsorption plate 1, connector 2, negative pressure device 3, adsorption area 11, transfer area 12, adsorption hole 111, air path 112, main air path 1121, first branch air path 1122, connecting air path 1123, second branch air path 1124, installation area 13, fixing hole 131, equipment hole 132, positioning hole 14. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments. Similar component numbers in the drawings represent similar components. Obviously, the embodiments described below are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0023] It should also be understood that the terms used in this description of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0024] Example 1

[0025] See also Figure 1 The embodiment of the present invention provides an adsorption device. The adsorption device includes a negative pressure device 3, a joint 2 and an adsorption plate 1. The components are described in detail as follows:

[0026] In this embodiment, the adsorption plate 1 includes an adsorption area 11 and a transfer area 12, and the adsorption area 11 is distributed around the transfer area 12; the adsorption area 11 includes a plurality of adsorption holes 111 and an air path 112, and the plurality of adsorption holes 111 are arranged in the air path 112; the connector 2 is respectively connected to the air path 112 and the negative pressure device 3.

[0027] Specifically, the adsorption plate 1 is provided with an adsorption area 11 and a transfer area 12. The adsorption area 11 is provided inside the adsorption plate 1. The adsorption area 11 is composed of an air path 112 and a plurality of adsorption holes 111. The adsorption holes 111 pass through the air path 112 and the adsorption plate 1, so that one side of the adsorption plate 1 is connected to the air path 112. The transfer area 12 is an operation area for mass transfer of wafers. Micro molds (prefabricated) are picked up from the transfer area 12 with very high spatial precision and direction; these micro chips are moved to a predetermined position while maintaining the relative spatial position and direction of the micro chips; then, while maintaining the new relative position and direction, the micro chips are selectively distributed at the new position. The negative pressure device 3 is connected to the connector 2, the air path 112, and the adsorption holes 111 in sequence. The operation of the negative pressure device 3 causes the air pressure in the air path 112 to change, so that the adsorption holes 111 generate a huge adsorption force, thereby giving one side of the adsorption plate 1 adsorption force, which can firmly adsorb the wafer.

[0028] The working process of the adsorption device is as follows:

[0029] The operation of the negative pressure device 3 causes the air pressure in the air path 112 to change, so that the adsorption hole 111 generates a huge adsorption force. The wafer is placed on the side of the adsorption plate 1 with the adsorption hole 111, and the adsorption force of the adsorption hole 111 firmly sucks the wafer around. The predetermined position in the middle of the wafer corresponds to the transfer area 12. The adsorption hole 111 does not affect the work of mass transfer of wafers.

[0030] By designing the adsorption area 11 to be distributed around the transfer area 12, the adsorption force is achieved while reserving the transfer area 12 to avoid interference with the laser oscillator crystal, which can better achieve the mass transfer effect of Micro-LED wafers.

[0031] Continue to see Figure 1 In this embodiment, the adsorption plate 1 includes a positioning hole 14, which is provided on one side of the transfer area 12. The gas path 112 includes a main gas path 1121, a first branch gas path 1122, a connecting gas path 1123 and a second branch gas path 1124. One end of the main gas path 1121 is connected to the connector 2, and the other end of the main gas path 1121 is connected to the first branch gas path 1122. The connecting gas path 1123 is respectively connected to the first branch gas path 1122 and the second branch gas path 1124. The first branch gas path 1122 and the second branch gas path 1124 are respectively located on both sides of the positioning hole 14.

[0032] Specifically, the positioning hole 14 is used to limit the wafer so that the predetermined position in the middle of the wafer is convenient for corresponding to the transfer area 12 to perform mass transfer of wafers. The main gas path 1121 is used to connect the connector 2, which is the main trunk that causes the air pressure of the gas path 112 to change. The connecting gas path 1123 bypasses the adsorption hole 111 and is used to connect the first branch gas path 1122 and the second branch gas path 1124. The first branch gas path 1122 and the second branch gas path 1124 are used to surround the transfer area 12, and the layout bypasses the positioning hole 14. At the same time, the first branch gas path 1122 and the second branch gas path 1124 are provided with adsorption holes 111 to adsorb wafers. The arrangement of the fixed gas path 112 can clearly divide each area, and the transfer area 12 is reserved to avoid interfering with the laser oscillator crystal. The adsorption hole 111 can be designed to be centrally symmetrical with the center of the transfer area 12 to avoid the imbalance of adsorption force affecting the mass transfer of wafers.

[0033] Furthermore, there are multiple first branch gas paths 1122 , and all of the multiple first branch gas paths 1122 are connected to the main gas path 1121 and the connecting gas path 1123 .

[0034] At the same time, there are multiple second branch gas paths 1124 , and multiple first branch gas paths 1122 are all connected to the connecting gas path 1123 .

[0035] Specifically, the number of the first branch gas path 1122 and the second branch gas path 1124 can be designed according to actual needs. The function of the first branch gas path 1122 and the second branch gas path 1124 is to surround the transfer area 12 and avoid the positioning hole 14, so as to provide an adsorption hole 111 so that the adsorption hole 111 is connected to the connector 2. Therefore, those skilled in the art can flexibly adjust the number and positional relationship of the first branch gas path 1122 and the second branch gas path 1124, which will not exceed the protection scope of the present invention.

[0036] Furthermore, the plurality of adsorption holes 111 are arranged at intervals and are respectively provided in the two first branch gas paths 1122 and the two second branch gas paths 1124 .

[0037] Specifically, in order to ensure that the wafer is subjected to more uniform force, the first branch gas path 1122 and the second branch gas path 1124 are provided with a plurality of adsorption holes 111 arranged at intervals, covering the adsorption area 11 as much as possible to ensure that the periphery of the wafer can be firmly adsorbed.

[0038] Furthermore, the adsorption plate 1 further includes a device installation area 13 , and the device installation area 13 is arranged outside the adsorption area 11 .

[0039] Specifically, the adsorption plate 1 is provided with a device installation area 13, and the device installation area 13 is used to install devices such as laser ranging devices, and the devices can be installed according to actual needs.

[0040] Furthermore, the device installation area 13 includes a plurality of fixing holes 131 and a plurality of device holes 132 , and the plurality of fixing holes 131 and the plurality of device holes 132 all pass through the adsorption plate 1 .

[0041] Specifically, the equipment hole 132 is used to install a laser distance measuring device, and the fixing hole 131 is used to install a bolt, so that the adsorption plate 1 can be fixed on certain devices, for example, on a turning device of a wafer mass transfer device.

[0042] Furthermore, the negative pressure device 3 is a vacuum pump.

[0043] Specifically, a vacuum pump refers to a device or equipment that uses mechanical, physical, chemical or physicochemical methods to evacuate the container to create a vacuum.

[0044] Furthermore, the connector 2 is a pneumatic quick connector.

[0045] Specifically, a pneumatic quick connector is a quick connector mainly used for air piping and pneumatic tools. It can connect or disconnect pipes without tools. When the connector 2 is not connected, that is, when the ring of the parent body is moved to the other end, the stainless steel ball automatically rolls outward, and the child body is disconnected due to the action of the common valve spring force of the parent body and the child body. The valves of the child body and the parent body are closed respectively, instantly blocking the flow of fluid.

[0046] Example 2

[0047] The present invention also provides a mass wafer transfer device, which includes the adsorption device provided in the above embodiment.

[0048] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0049] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0051] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0052] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0053] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0054] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, to the extent such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to encompass such changes and modifications.

[0055] The above description is a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. An adsorption device, characterized in that: The invention comprises a negative pressure device, a connector and an adsorption plate; the adsorption plate comprises an adsorption area and a transfer area, the adsorption area being distributed around the transfer area; the adsorption area comprises a plurality of adsorption holes and an air path, the plurality of adsorption holes being provided in the air path; the connector is connected to the air path and the negative pressure device respectively; The adsorption plate includes a positioning hole, which is provided on one side of the transfer area. The gas path includes a main gas path, a first branch gas path, a connecting gas path, and a second branch gas path. One end of the main gas path is connected to the joint, and the other end of the main gas path is connected to the first branch gas path. The connecting gas path is respectively connected to the first branch gas path and the second branch gas path. The first branch gas path and the second branch gas path are respectively located on both sides of the positioning hole; The adsorption plate also includes an equipment installation area, which is located outside the adsorption area; the equipment installation area is used to install a laser ranging device; the equipment installation area includes a plurality of fixing holes and a plurality of equipment holes, and the plurality of fixing holes and the plurality of equipment holes all pass through the adsorption plate.

2. The adsorption device according to claim 1, characterized in that There are multiple first branch gas paths, and all of the first branch gas paths are connected to the main gas path and the connecting gas path.

3. The adsorption device according to claim 2, characterized in that: There are multiple second branch gas paths, and all of the multiple first branch gas paths are connected to the connecting gas path.

4. The adsorption device according to claim 3, characterized in that The plurality of adsorption holes are arranged at intervals and respectively disposed in the two first branch air passages and the two second branch air passages.

5. The adsorption device according to claim 1, characterized in that The negative pressure device is a vacuum pump.

6. The adsorption device according to claim 1, characterized in that The joint is a pneumatic quick joint.

7. A wafer mass transfer device, characterized in that: The invention comprises the adsorption device according to any one of claims 1 to 6.

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