Apparatus, system, and method for attaching a cable assembly to an integrated circuit using a package stiffener

Abstract

A disclosed apparatus can include (1) an integrated circuit electrically coupled to a substrate, (2) a plurality of electrical contacts disposed on the substrate and electrically coupled to the integrated circuit via the substrate, (3) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (4) a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one cable. Various other apparatuses, systems, and methods are also disclosed.

Description

Technical Field

[0001] This disclosure relates to the field of circuit technology, and more specifically, to an apparatus, system, and method for attaching a cable assembly to an integrated circuit using a package reinforcement. Background Technology

[0002] Electronic components (such as integrated circuits) are typically soldered to substrates and / or circuit boards via a process called reflow soldering. For example, before the reflow process, solder paste is applied to contact pads on the circuit board, and then electronic components are placed on top of the solder paste, holding them in place on their corresponding contact pads. After the electronic components are in place, the substrate and / or circuit board can undergo a reflow process, which heats the solder paste to a specific temperature. This temperature must be high enough to melt the solder paste so that, once cooled, the solder forms a permanent connection between the electronic component and its corresponding contact pad.

[0003] Unfortunately, during the soldering process, the substrate and / or circuit board can pose and / or present significant challenges. For example, the reflow process may apply excessive heat, causing the substrate and / or circuit board to warp. This warping can cause the substrate and / or circuit board to bend, making it impossible to form a permanent connection between the connection terminals on certain electronic components within the integrated circuit and the corresponding contact pads on the substrate and / or circuit board. As a result, these electronic components within the integrated circuit may generally not be able to achieve full connectivity with the remaining components incorporated within the integrated circuit and / or other components arranged elsewhere in the corresponding system (e.g., on the substrate and / or circuit board). Without full connectivity, the integrated circuit may not function as intended, thus preventing the corresponding system from generally achieving its intended purpose.

[0004] Alternatively, even at room temperature, certain electrical components (such as integrated circuits and / or substrates) may warp to some extent. If the warping exceeds a certain limit, some connection terminals on the electrical component may become unable to connect to other terminals in the corresponding system. As a result, such electrical components may not be able to achieve complete connection with other electrical components. Without complete connection, these electrical components may not function as intended, thus preventing the corresponding system from achieving its intended purpose.

[0005] In some examples, application-specific integrated circuits (ASICs) can be electrically coupled to a substrate. In such examples, the substrate can also be electrically and / or physically coupled to a circuit board. Instead of running certain communication and / or electrical signals through a circuit board, some ASICs can benefit from having signal lines directly attached to the substrate (e.g., to prevent signal interference and / or simplify wiring on the circuit board). Such ASICs can be high-power and / or designed as capless packages that require reinforcement to control and / or mitigate warpage. To effectively mitigate this warpage, the reinforcement may need to be sized and positioned along the edge of the substrate. Since cable connectors often require and / or consume significant space, previous attempts to integrate such reinforcement and cable connectors onto the substrate without increasing the size of the substrate and / or package may prove impractical and / or infeasible. Unfortunately, increased substrate and / or package size generally can introduce certain drawbacks and / or disadvantages, such as increased material costs and / or additional space requirements within the corresponding system.

[0006] Therefore, this disclosure identifies and resolves the need for apparatus, systems, and methods for attaching cable assemblies to integrated circuits using package reinforcement. Summary of the Invention

[0007] As will be described in more detail below, this disclosure generally relates to apparatus, systems, and methods for attaching a cable assembly to an integrated circuit using a package reinforcement. In one example, an apparatus for accomplishing such a task may include: (1) an integrated circuit electrically coupled to a substrate; (2) a plurality of electrical contacts disposed on the substrate and electrically coupled to the integrated circuit via the substrate; (3) at least one cable assembly electrically coupled to the plurality of electrical contacts; and (4) a package reinforcement physically coupled to the substrate around the integrated circuit such that at least one cable assembly is accessible to at least one cable.

[0008] Similarly, a system for performing such a task may include: (1) a substrate electrically coupled to a circuit board, (2) an integrated circuit electrically coupled to the substrate, (3) a plurality of electrical contacts disposed on the substrate and electrically coupled to the integrated circuit via the substrate, (4) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (5) a package reinforcement physically coupled to the substrate around the integrated circuit such that at least one cable assembly is accessible to at least one cable.

[0009] One possible method may include: (1) providing a plurality of electrical contacts on a substrate, (2) electrically coupling an integrated circuit to the substrate such that the substrate provides electrical continuity between the plurality of electrical contacts and the integrated circuit, (3) electrically coupling at least one cable assembly to the plurality of electrical contacts, and (4) physically coupling a package reinforcement around the integrated circuit to the substrate such that the at least one cable assembly is accessible to at least one cable.

[0010] Based on the general principles described herein, features from any of the above embodiments can be combined with each other. A fuller understanding of these and other embodiments, features, and advantages will be gained by reading the following detailed description in conjunction with the accompanying drawings and claims. Attached Figure Description

[0011] The accompanying drawings illustrate several exemplary embodiments and are part of the specification. These drawings, together with the following description, illustrate and explain various principles of this disclosure.

[0012] Figure 1 This is an illustration of an exemplary component including an integrated circuit electrically coupled to a substrate;

[0013] Figure 2 This is another illustration of an exemplary component including an integrated circuit electrically coupled to a substrate;

[0014] Figure 3 This is an illustration of an exemplary package reinforcement;

[0015] Figure 4 This is another illustration of an exemplary package reinforcement;

[0016] Figure 5 This is a diagram of an exemplary intermediary layer;

[0017] Figure 6 This is another illustration of an exemplary intermediary layer;

[0018] Figure 7 This is an illustration of an exemplary device for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0019] Figure 8 This is an illustration of another exemplary device for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0020] Figure 9 This is another illustration of an exemplary device for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0021] Figure 10 This is an illustration of another exemplary device for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0022] Figure 11 This is another illustration of an exemplary device for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0023] Figure 12 This is an illustration of another exemplary package reinforcement;

[0024] Figure 13 This is another illustration of another exemplary package reinforcement;

[0025] Figure 14 This is an illustration of another exemplary intermediary layer;

[0026] Figure 15 This is another illustration of another exemplary intermediary layer;

[0027] Figure 16 This is an illustration of an exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0028] Figure 17 This is another illustration of an exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0029] Figure 18 This is another illustration of an exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0030] Figure 19 This is another illustration of an exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0031] Figure 20 This is an illustration of another exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0032] Figure 21 This is an illustration of another exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0033] Figure 22 This is an illustration of another exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0034] Figure 23 This is another illustration of an exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0035] Figure 24 This is another illustration of an exemplary system for attaching a cable assembly to an integrated circuit using a package reinforcement; and

[0036] Figure 25 This is a flowchart of an exemplary method for attaching a cable assembly to an integrated circuit using a package reinforcement.

[0037] Throughout the accompanying drawings, the same reference numerals and descriptions denote similar but not necessarily identical elements. While the exemplary embodiments described herein are readily adaptable to various modifications and alternatives, specific embodiments are illustrated by way of example in the drawings and will be described in detail herein. However, the exemplary embodiments described herein are not intended to be limited to the specific forms disclosed. Rather, this disclosure covers all modifications, equivalents, and alternatives falling within the scope of the appended claims. Detailed Implementation

[0038] This disclosure describes various apparatuses, systems, and methods for attaching cable assemblies to integrated circuits using package reinforcements. As will be explained in more detail below, embodiments of this disclosure enable efficient integration of package reinforcements and cable assemblies onto the substrate of the ASIC without increasing the size of the substrate and / or the overall package. Therefore, such embodiments can avoid and / or prevent the increased material costs and / or additional space requirements associated with increased substrate and / or package size. Additionally or alternatively, such embodiments can enable this integration without significant modifications to the current package design, thereby avoiding and / or preventing the increased costs associated with such design modifications.

[0039] The following will be referenced Figure 1-24 Detailed descriptions are provided of exemplary components, devices, systems, structures, and / or implementations for attaching cable assemblies to integrated circuits using package reinforcements. Additionally, with Figure 25 The corresponding discussion will provide a detailed description of an exemplary method for attaching a cable assembly to an integrated circuit using package reinforcement.

[0040] Figure 1 and 2 An exemplary component 100 is illustrated, including an exemplary integrated circuit 106 electrically coupled to an exemplary substrate 102. In some examples, the integrated circuit 106 may include and / or represent a die and / or chip on which one or more passive and / or active electronic components are implemented, set, etched, and / or deposited. In this example, the passive and / or active electronic components may co-form and / or serve as a capless ASIC and / or system-on-a-chip (SoC). Examples of such passive and / or active electronic components include, but are not limited to, transistors, diodes, resistors, capacitors, inductors, transducers, sensors, antennas, resonators, switches, optics, conductors, traces, wires, combinations of one or more of the foregoing, and / or any other suitable electronic components.

[0041] In one example, integrated circuit 106 may include and / or represent a small piece of semiconductor material. For example, integrated circuit 106 may include and / or represent a silicon wafer. In this example, integrated circuit 106 may include and / or contain one or more circuits composed of various passive and / or active components. These circuits may be etched into the semiconductor material.

[0042] Despite Figure 2 While shown as a single unit, integrated circuit 106 alternatively includes and / or represents multiple dies attached and / or soldered to substrate 102. In one example, all the multiple dies may be located and / or positioned near and / or toward the center and / or middle of substrate 102 to accommodate package reinforcement. In another example, the multiple dies may be stacked together (using, for example, "through-silicon via" technology) and then attached to substrate 206 as a stack. In yet another example, a silicon interposer may be attached to substrate 102 first, after which integrated circuit 106 and / or other components may be attached to the silicon interposer (in, for example, a "2.5D" package).

[0043] Integrated circuit 106 can have various shapes and / or sizes. In some examples, integrated circuit 106 can be formed into a square, rectangle, and / or cube. Other examples of shapes formed by integrated circuit 106 include, but are not limited to, ellipse, circle, one or more variations or combinations of the foregoing, and / or any other suitable shape.

[0044] Integrated circuit 106 can be sized in a specific manner for assembly within a specific electrical component of a computing device. Integrated circuit 106 may include and / or contain any of a variety of materials.

[0045] In some examples, substrate 102 may include and / or represent a die of a semiconductor material (such as silicon, germanium, and / or gallium arsenide). In other examples, substrate 102 may include and / or represent a die of an electrically insulating material (such as silicon dioxide, sapphire, alumina, polymer, and / or ceramic). Substrate 102 may include multiple layers of insulating material. Substrate 102 may also include conductive traces (e.g., copper) and / or through-silicon vias (TSVs) that route signals from one layer to another through connection terminals and / or leads.

[0046] The substrate 102 can have various shapes and / or sizes. In some examples, the substrate 102 can be formed into a square, rectangle, and / or cube. Other examples of shapes formed by the substrate 102 include, but are not limited to, ellipse, circle, one or more variations or combinations of the foregoing, and / or any other suitable shape. The substrate 102 can be sized in a specific manner for assembly within a specific electrical component of a computing device.

[0047] like Figure 1As shown, the exemplary component 100 may also include and / or incorporate a plurality of electrical contacts 104 that facilitate electrical coupling. In some examples, the electrical contacts 104 may be disposed on, along, and / or through the substrate 102. In one example, the electrical contacts 104 may include and / or represent a set of high-density planar grid array (LGA) pads. In another example, the electrical contacts 104 may include and / or represent a set of high-density ball grid array (BGA) pads.

[0048] In some examples, one or more electrical contacts in electrical contacts 104 may constitute and / or represent a side and / or end of a conductor extending through and / or across substrate 102 and / or into integrated circuit 106. Therefore, if a cable is communicatively coupled to electrical contacts 104, a signal carried by the cable can propagate via the conductor toward integrated circuit 106. Additionally or alternatively, if a cable is communicatively coupled to electrical contacts 104, a signal output from integrated circuit 106 can propagate via the conductor and / or cable toward another device (in...). Figure 1 and 2 (Not shown in the diagram) propagation. In such an example, electrical contact 104 can facilitate the transmission of input / output (I / O) signals exchanged with integrated circuit 106. In one embodiment, some electrical contacts 104 may constitute and / or represent extensions and / or extensions to the circuit board (in... Figure 1 and 2 (not necessarily shown in the diagram) One side and / or end of a conductor, the substrate 102 is electrically and / or physically coupled to the circuit board.

[0049] Electrical contacts 104 may pass through or span the substrate arrangement and / or configuration (in, for example, LGA or BGA configuration and / or format). In some examples, electrical contacts 104 may include and / or represent multiple conductors arranged in and / or across the substrate 102. In such examples, electrical contacts 104 may be spaced apart from each other on the substrate 102 by a distance and / or pitch (e.g., approximately 1 mm). In one example, each electrical contact may include and / or represent a single conductive element and / or unit that facilitates electrical continuity between a contact pad on an electrical component and a conductive trace on the substrate 102.

[0050] In some examples, each electrical contact may include and / or represent being combined to facilitate the interaction of integrated circuit 106 with another device (in... Figure 1 and 2An assembly of discrete conductive elements and / or components (not shown) that achieve electrical continuity between each other via a cable. Each electrical contact 104 may have any suitable shape and / or size. In some examples, the shape and / or profile of the electrical contact 104 may be designed to match and / or adapt to the layout of the cable. Additionally or alternatively, the shape and / or profile of the electrical contact 104 may be designed to account for and / or compensate for a certain degree of tolerance and / or variation.

[0051] Each electrical contact 104 can be sized in a specific manner to ensure that the integrated circuit 106 interacts with another device. Figure 1 and 2 Electrical continuity is achieved via a cable between the contacts (not shown). Each electrical contact 104 may include and / or represent any type or form of conductive material. In one example, each electrical contact 104 may include and / or represent copper wire, lead, pad, and / or structure. Examples of conductive materials include, but are not limited to, copper, steel, alloys, silver, nickel, aluminum, one or more variations or combinations thereof, and / or any other suitable type of conductive material.

[0052] like Figure 2 As shown, the exemplary component 100 may include and / or represent multiple sets of electrical components disposed on different edges of the substrate 102, disposed along different edges of the substrate 102, and / or disposed through different edges of the substrate 102. For example, a set of electrical contacts 104(1) may be disposed near a first edge of the substrate 102, and a set of electrical contacts 104(2) may be disposed near a second edge of the substrate 102. In this example, a set of electrical contacts 104(3) may be disposed near a third edge of the substrate 102, and a set of electrical contacts 104(4) may be disposed near a fourth edge of the substrate 102.

[0053] Figure 3 and 4 An exemplary package reinforcement 300 capable of physical coupling to substrate 102 is shown. In some examples, package reinforcement 300 may include and / or represent any type or form of physical material, structure, support, and / or support feature that secures, couples, and / or adheres to the substrate of the integrated circuit. In one example, package reinforcement 300 may include and / or represent a ring secured to the top surface of the substrate of the capless integrated circuit. In this example, package reinforcement 300 may at least partially surround and / or enclose the die of the capless integrated circuit.

[0054] The encapsulation reinforcement 300 may include and / or be formed of any suitable shape. In some examples, the encapsulation reinforcement 300 may be formed as a square, a circle, and / or a rectangle (e.g., a non-square rectangle). Other examples of shapes formed by the encapsulation reinforcement 300 include, but are not limited to, triangles, pentagons, hexagons, octagons, ellipses, rhombuses, parallelograms, combinations or variations of one or more of the above, and / or any other suitable shape.

[0055] Furthermore, the package reinforcement 300 can have any suitable size. In some examples, the package reinforcement 300 can be sized to provide a certain amount of stiffness to the substrate 102 to mitigate warping of the substrate 102. In one example, the package reinforcement 300 can surround and / or extend beyond the periphery of the package of the integrated circuit. In another example, the package reinforcement 300 can surround and / or extend beyond the contour of the die included on the integrated circuit.

[0056] The encapsulation reinforcement 300 may include and / or contain any variety of materials. Examples of such materials include, but are not limited to, plastics, ceramics, polymers, metals, composites, combinations or variations of one or more of the foregoing, and / or any other suitable materials.

[0057] In some examples, the package reinforcement 300 can be used as a base and / or pedestal to provide structural support, tension, strength, and / or integrity to the integrated circuit and / or its substrate. In one example, the package reinforcement 300 can be placed, positioned, secured, and / or coupled to the periphery of the substrate and / or integrated circuit before the reflow process that solders the bottom surface of the substrate to the circuit board. After placement, the package reinforcement 300 can provide structural support and / or strength to the integrated circuit and / or its substrate. By providing structural support to the integrated circuit and / or its substrate in this way, the package reinforcement 300 can prevent and / or prevent warping of the package and / or substrate of the integrated circuit during the reflow process.

[0058] like Figure 3 and 4 As shown, the package reinforcement 300 may include a set of boundaries sized to generally surround the integrated circuit. In one example, each boundary may include and / or represent a material designed for and / or intended to be placed above the periphery of the integrated circuit and / or its substrate. In this example, each boundary may also include and / or represent a material designed for and / or intended to extend beyond the periphery of the integrated circuit and / or its substrate to extend beyond the circuit board to which the integrated circuit is soldered.

[0059] In some examples, the boundaries can have different and / or varying lengths relative to each other. For example, the first set of parallel boundaries can have the same length as each other, and the second set of parallel boundaries can also have the same length as each other. However, in this example, the lengths of the first set of parallel boundaries can be different from the lengths of the second set of parallel boundaries.

[0060] In some examples, the encapsulation reinforcement 300 may include and / or incorporate at least a portion of an attachment mechanism for physical coupling to the substrate 102. For example, the encapsulation reinforcement 300 may include and / or form one or more holes 402 (through holes or non-through holes). In this example, each hole 402 may include and / or represent an opening for screws and / or bolts, which facilitates securing and / or pressing the encapsulation reinforcement 300 to or against the substrate 102. Alternatively, these openings may facilitate securing and / or pressing the encapsulation reinforcement 300 against a load frame (in Figure 3 and 4 (Not shown in the image). Other examples of such attachment mechanisms include, but are not limited to, fasteners, screws, pins, spring-loaded locking or clamping mechanisms, adhesives, bolts, latches, anchors, cable ties, straps, nuts, threads, one or more portions of the foregoing, combinations and / or variations of one or more of the foregoing, and / or any other suitable attachment mechanism.

[0061] In some examples, the package reinforcement 300 may include, represent, and / or be shaped as a window frame. In such examples, the window frame may be designed to be physically coupled along and / or close to the periphery of the substrate, such that there is a certain amount of buffer space between the window frame and the integrated circuit 106 on the substrate 102.

[0062] Figure 5 and 6 An exemplary interposer layer 500 is shown that facilitates the electrical coupling of one or more cable assemblies to electrical contacts 104 disposed on a substrate 102. Figure 5 and 6 As shown, an exemplary interposer 500 may include and / or represent a plurality of contact pins 502 placed and / or arranged to correspond to and / or engage with electrical contacts 104. In some examples, the contact pins 502 may be configured to pass through and / or span across the interposer 500 (e.g., in an LGA or BGA structure and / or design). In such examples, the contact pins 502 may include and / or represent a plurality of conductors incorporated into and / or arranged across the interposer 500.

[0063] In one example, contact pins 502 may be spaced apart from each other by a distance and / or pitch (e.g., approximately 1 mm) on the interposer layer 500. In this example, each contact pin may include and / or represent a single conductive element and / or unit that facilitates electrical continuity from one side of the interposer layer 500 to the other. Additionally or alternatively, each set of contact pins 502 may constitute and / or represent a signal pair substantially between the integrated circuit 106 and another component included in the corresponding system.

[0064] Figure 7 An exemplary device 700 is shown that uses a package reinforcement 300 to attach a cable assembly to an integrated circuit 106. Figure 7 As shown, the exemplary device 700 may include and / or represent an integrated circuit 106, a substrate 102, a package reinforcement 300, and / or interposers 500(1), 500(2), 500(3) and / or 500(4). In one example, interposers 500(1)-(4) may be electrically coupled to sets of electrical contacts 104(1)-(4) on the substrate 102, respectively.

[0065] In some examples, integrated circuit 106 may be electrically coupled to substrate 102. In such examples, electrical contacts 104 may be disposed on substrate 102 and / or may be electrically coupled to integrated circuit 106 via substrate 102, such that there is electrical continuity between electrical contacts 104 and integrated circuit 106. In one example, package reinforcement 300 may be physically coupled to substrate 102 around integrated circuit 106, such that one or more cable assemblies (in...) Figure 7 (Not necessarily shown in the image) It can still be electrically coupled to the electrical contact 104 disposed on the substrate 102.

[0066] like Figure 7 As shown, the encapsulation reinforcement 300 may include and / or form one or more recessed and / or sunken segments 704 that facilitate the placement of one or more cable assemblies. For example, each segment 704 may include and / or represent a middle portion of the boundary between two corners of the encapsulation reinforcement 300. In some examples, the encapsulation reinforcement 300 may also include and / or form elements capable of supporting a load frame and / or a heat sink (in... Figure 7 (Not necessarily shown) One or more raised and / or elevated segments 702. For example, each segment 702 may include and / or represent a corner of a boundary incorporated into the package reinforcement 300. In this example, the load frame and / or heat sink may be physically coupled and / or attached to the package reinforcement 300 at the segment 702.

[0067] Figure 8 and 9An exemplary device 800 is shown that uses a package reinforcement 300 to electrically couple cable assemblies 802(1), 802(2), 802(3) and / or 802(4) to an integrated circuit 106. In some examples, similar to Figure 7 The device 700, exemplary device 800 may include and / or represent integrated circuit 106, substrate 102, package reinforcement 300, and / or interposers 500(1), 500(2), 500(3) and / or 500(4). Figure 8 and 9 As shown, the device 800 may also include and / or represent cable assemblies 802(1)-(4) electrically coupled to the intermediate layers 500(1)-(4), respectively. Thus, the intermediate layers 500(1)-(4) may be electrically coupled between the respective sets of electrical contacts 104(1)-(4) and the cable assemblies 802(1)-(4).

[0068] In some examples, each of the cable assemblies 802(1)-(4) may include and / or represent an integrated connector 804 and a plurality of electrical pins 806. In such examples, the electrical pins 806 of each cable assembly may be positioned and / or arranged to interact with one of the interposers 500(1)-(4) and / or the cable (in Figure 8 and 9 (not shown) Corresponding to and / or mating with. In one example, electrical pins 806 may be integrated and / or grouped into individual units for use as cable assemblies. For example, integrated connector 804 may hold and / or maintain electrical pins 806 in the arrangement required to properly mate and / or couple the cable to one of the interposers 500(1)-(4).

[0069] In some examples, the package reinforcement 300 may be physically coupled along and / or near the periphery of the substrate 102, such that a buffer space exists between the package reinforcement 300 and the integrated circuit 106 on the substrate 102. In one example, the sets of electrical contacts 104(1)-(4) may be positioned within this buffer space between the package reinforcement 300 and the integrated circuit 106. As a result, the integrated connector 804 of each cable assembly may be located on at least a portion of this buffer space, and the electrical pins 806 of each cable assembly may extend parallel to the substrate 102 and / or extend outward from a portion of the buffer space toward the corresponding edge of the substrate 102.

[0070] Figure 10 and 11 An exemplary device 1000 is shown that electrically couples cable assemblies 802(1)-(4) to integrated circuit 106 using a package reinforcement 300. In some examples, similar to Figure 8The device 800, exemplary device 1000 may include and / or represent integrated circuit 106, substrate 102, package reinforcement 300, interposer 500 (1)-(4) and / or cable assembly 802 (1)-(4). Figure 10 and 11 As shown, the device 800 may also include and / or represent a load frame 1002 physically coupled to the encapsulation reinforcement 300. This physical coupling of the load frame 1002 to the encapsulation reinforcement 300 can effectively press the cable assemblies 802(1)-(4) against the interposer 500(1)-(4). In other words, the load frame 1002 can apply a force that presses the cable assemblies 802(1)-(4) against the interposer 500(1)-(4). By doing so, the load frame 1002 can strengthen and / or maintain the electrical coupling between the cable assemblies 802(1)-(4) and the interposer 500(1)-(4).

[0071] In some examples, the device 1000 may include and / or incorporate one or more attachment mechanisms 1004 for physically coupling the load frame 1002 to the encapsulation reinforcement 300. For example, attachment mechanisms 1004 may include and / or represent screws and / or bolts that facilitate securing and / or pressing the load frame 1002 to or against the encapsulation reinforcement 300. Other examples of attachment mechanisms 1004 include, but are not limited to, fasteners, screws, pins, spring-loaded locking mechanisms, adhesives, bolts, latches, anchors, cable ties, straps, nuts, threads, portions of one or more of the foregoing, combinations and / or variations of one or more of the foregoing, and / or any other suitable attachment mechanism.

[0072] Figure 12 and 13 An exemplary package reinforcement 1200 capable of physical coupling to substrate 102 is shown. In some examples, similar to Figure 3 and 4 The package reinforcement 300 and package reinforcement 1200 may include and / or represent any type or form of physical material, structure, and / or support feature that fastens, couples, and / or adheres to the substrate of the integrated circuit. In one example, package reinforcement 1200 may include and / or represent a ring secured to the top surface of the substrate of the capless integrated circuit. In this example, package reinforcement 1200 may at least partially surround and / or enclose the die of the capless integrated circuit.

[0073] In some examples, the encapsulation reinforcement 1200 may include, represent, and / or be shaped as a window frame having and / or forming at least one opening 1202. For example, and as... Figure 13As shown, the encapsulation reinforcement 1200 may include and / or form openings 1202(1), 1202(2), 1202(3), 1202(4), 1202(5), 1202(6), 1202(7) and / or 1202(8). In this example, openings 1202(1) and 1202(2) may be placed and / or positioned along a first boundary and / or side of the encapsulation reinforcement 1200, and openings 1202(3) and 1202(4) may be placed and / or positioned along a second boundary and / or side of the encapsulation reinforcement 1200. Additionally, openings 1202(5) and 1202(6) may be placed and / or positioned along a third boundary and / or side of the encapsulation reinforcement 1200, and openings 1202(7) and 1202(8) may be placed and / or positioned along a fourth boundary and / or side of the encapsulation reinforcement 1200. In some embodiments, openings 1202(1)-(8) may be placed and / or positioned along the fourth edge and / or side of the encapsulation reinforcement 1200 to align and / or match with electrical contacts 104 of different groups disposed on the substrate 102.

[0074] Figure 14 and 15 An exemplary interposer layer 1400 is shown that facilitates the electrical coupling of one or more cable assemblies to electrical contacts 104 disposed on a substrate 102. Figure 14 and 15 As shown, the exemplary interposer 1400 may include and / or represent a plurality of contact pins 1402 placed and / or arranged to correspond to and / or engage with electrical contacts 104. In some examples, the contact pins 1402 may be disposed through and / or across the interposer 1400 (e.g., in LGA or BGA structures and / or designs). In such examples, the contact pins 1402 may include and / or represent a plurality of conductors incorporated into and / or arranged across the interposer 1400.

[0075] In one example, contact pins 1402 may be spaced apart from each other by a distance and / or pitch (e.g., approximately 1 mm) on the interposer 1400. In this example, each contact pin may include and / or represent a single conductive element and / or unit that facilitates electrical continuity from one side of the interposer 1400 to the other. Additionally or alternatively, each set of contact pins 502 may constitute and / or represent a signal pair substantially between the integrated circuit 106 and another component included in the corresponding system.

[0076] Figure 16 and 17An exemplary system 1600 is shown that uses a package reinforcement 1200 to attach a cable assembly to an integrated circuit 106. In some examples, the exemplary system 1600 may include and / or represent the integrated circuit 106, a substrate 102, the package reinforcement 1200, and / or an interposer 1400(1), 1400(2), 1400(3), 1400(4), 1400(5), 1400(6), 1400(7), and / or 1400(8). In such an example, the interposers 1400(1)-(8) may be electrically coupled to different sets of electrical contacts on the substrate 102.

[0077] In some examples, integrated circuit 106 may be electrically coupled to substrate 102. In such examples, electrical contacts 104 may be disposed on substrate 102 and / or may be electrically coupled to integrated circuit 106 via substrate 102 such that there is electrical continuity between electrical contacts 104 and integrated circuit 106. In one example, package reinforcement 300 may be physically coupled to substrate 102 around integrated circuit 106, such that one or more cable assemblies (in...) Figure 7 (Not necessarily shown in the image) It can still be electrically coupled to the electrical contact 104 disposed on the substrate 102.

[0078] In some examples, substrate 102 can be electrically coupled to Figure 17 Circuit board 1710. In such an example, certain electrical signals can cross and / or pass through between substrate 102, integrated circuit 106 and / or circuit board 1710.

[0079] Figure 18 and 19 An exemplary system 1800 is shown in which cable assemblies 1802(1), 1802(2), 1802(3), 1802(4), 1802(5), 1802(6), 1802(7) and / or 1802(8) are electrically coupled to integrated circuit 106 using a package reinforcement 300. In some examples, similar to Figure 16 and 17 System 1600, exemplary system 1800 may include and / or represent integrated circuit 106, substrate 102, package reinforcement 1200 and / or interposer 1400 (1)-(8). Figure 18 and 19 As shown, system 1800 may also include and / or represent cable assemblies 1802(1)-(8) respectively electrically coupled to the interposers 1400(1)-(8). Therefore, the interposers 1400(1)-(4) may be electrically coupled between the corresponding sets of electrical contacts on the substrate 102 and the cable assemblies 1802(1)-(8).

[0080] In some examples, cable assemblies 1802(1)-(8) may each include and / or represent an integrated connector and multiple electrical pins. In such examples, the electrical pins of each cable assembly may be positioned and / or arranged to interact with one of the interposers 1400(1)-(8) and / or the cable (in... Figure 18 and 19 (Not necessarily shown) Corresponding and / or mating. In one example, electrical pins may be integrated and / or grouped into individual units for use as cable assemblies. For example, each integrated connector may hold and / or maintain the electrical pins in the arrangement required to properly mate and / or couple the cable to one of the interposers 1400(1)-(8).

[0081] In some examples, the encapsulation reinforcement 1200 may be physically coupled along and / or near the periphery of the substrate 102, such that the openings 1202(1)-(8) are aligned and / or matched with different sets of electrical contacts 104 disposed on the substrate 102. In one example, each set of electrical contacts 104 may be located below the openings 1202(1)-(8) formed by the encapsulation reinforcement 1200. As a result, the integrated connector of each cable assembly may be above the set of electrical contacts 104 within the corresponding opening formed by the encapsulation reinforcement 1200, and the electrical pins of each cable assembly may extend parallel to the substrate 102 and / or extend outward from the corresponding opening formed by the encapsulation reinforcement 1200 toward the corresponding edge of the substrate 102.

[0082] Figure 20 and 21 An exemplary system 2000 is shown in which cable assemblies 1802(1)-(8) are electrically coupled to integrated circuit 106 using package reinforcement 1200. In some examples, similar to Figure 18 and 19 System 1800, exemplary system 2000 may include and / or represent integrated circuit 106, substrate 102, package reinforcement 1200, interposer 1400(1)-(8) and / or cable assembly 1802(1)-(8). Figure 20 and 21 As shown, system 2000 may also include and / or represent a load frame 2002 physically coupled to encapsulation reinforcement 1200. This physical coupling of the load frame 2002 to encapsulation reinforcement 1200 can effectively press the cable assemblies 1802(1)-(8) against the interposer 1400(1)-(8). In other words, the load frame 2002 can apply a force that presses the cable assemblies 1802(1)-(8) against the interposer 1400(1)-(8). By doing so, the load frame 2002 can strengthen and / or maintain the electrical coupling formed between the cable assemblies 1802(1)-(8) and the interposer 1400(1)-(8).

[0083] Figure 22 , 23 Figures 24 and 24 illustrate an exemplary system 2200 in which cable assemblies 1802(1)-(8) are electrically coupled to integrated circuit 106 using package reinforcement 1200. In some examples, similar to... Figure 20 and 21 System 2000, exemplary system 2200 may include and / or represent integrated circuit 106, substrate 102, package reinforcement 1200, interposer 1400(1)-(8) and / or cable assembly 1802(1)-(8). Figure 22-24 As shown, system 2200 may also include and / or represent a load frame 2204 incorporated into heat sink 2202. In one example, heat sink 2202 may include and / or incorporate at least one spring-loaded attachment mechanism 2206. In this example, the spring-loaded attachment mechanism 2206 may facilitate securing and / or attaching heat sink 2202 to substrate 102 and / or circuit board (e.g., Figure 17 Circuit board 1710 in the middle.

[0084] In some examples, the spring-loaded attachment mechanism 2206 can provide and / or function as a shock absorber. Additionally or alternatively, the spring-loaded attachment mechanism 2206 can address and / or compensate for variations and / or tolerances specific to and / or inherent in the manufacturing or assembly process.

[0085] In some examples, the heat sink 2202 may be thermally coupled to the integrated circuit 106. In other words, the heat sink 2202 and the integrated circuit 106 may be mated together, thereby forming a thermal coupling that allows the heat sink 2202 to absorb and / or draw heat emitted and / or generated by the integrated circuit 106. In some examples, the heat sink 2202 may include any type or form of system, device, structure, and / or mechanism for conducting, transferring, absorbing, and / or dissipating heat. The heat sink may include and / or contain a variety of materials. Examples of such heat sink materials include, but are not limited to, copper, aluminum, diamond, alloys of one or more of the foregoing, combinations or variations of one or more of the foregoing, and / or any other suitable material.

[0086] Figure 25 This is a flowchart of an exemplary method 2500 for attaching a cable assembly to an integrated circuit using a package reinforcement. Method 2500 may include the step (2510) of forming a plurality of electrical contacts on a substrate. Step 2510 may be performed in various ways, including combinations thereof. Figure 1-24 Any method described. For example, a computing device manufacturer or subcontractor may manufacture the substrate. In this example, as part of the manufacturing process, the computing device manufacturer or subcontractor may arrange multiple electrical contacts on the substrate, across the substrate and / or through the substrate.

[0087] Method 2500 may further include the step (2520) of electrically coupling the integrated circuit to a substrate such that the substrate provides electrical continuity between a plurality of electrical contacts and the integrated circuit. Step 2520 may be performed in various ways, including combinations thereof. Figure 1-24 Any method described. For example, a computing device manufacturer or subcontractor may electrically couple an integrated circuit to a substrate such that the substrate provides electrical continuity between the integrated circuit and multiple electrical contacts. In one example, the computing device manufacturer or subcontractor may form and / or achieve this electrical coupling through soldering and / or reflow processes.

[0088] Method 2500 may further include the step (2530) of electrically coupling at least one cable assembly to a plurality of electrical contacts. Step 2530 may be performed in various ways, including combinations thereof. Figure 1-24 Any method described. For example, a computing device manufacturer or subcontractor may electrically couple a cable assembly to each set of electrical contacts disposed on a substrate. In one example, the computing device manufacturer or subcontractor may also place and / or provide an intermediary layer between each cable assembly and a set of electrical contacts.

[0089] Method 2500 may further include the step (2540) of physically coupling a package reinforcement around the integrated circuit to a substrate such that at least one cable assembly is accessible to at least one cable. Step 2540 may be performed in various ways, including combinations thereof. Figure 1-24 Any method described. For example, a computing device manufacturer or subcontractor may physically couple a package reinforcement around an integrated circuit to a substrate such that at least one cable assembly is accessible by at least one cable. In some examples, this physical coupling can be formed and / or achieved by a variety of different attachment methods, including adhesives, screws, and / or nut-bolt pairs.

[0090] While the foregoing disclosure has illustrated various embodiments using specific block diagrams, flowcharts, and examples, each block diagram component, flowchart step, operation, and / or component described and / or illustrated herein can be implemented individually and / or collectively using various hardware, software, or firmware (or any combination thereof). Furthermore, since many other architectures can be implemented to achieve the same functionality, any disclosure of components included in other components should be considered exemplary in nature.

[0091] The process parameters and sequence of steps described and / or illustrated herein are given by way of example only and may be changed as needed. For example, although the steps illustrated and / or described herein may be shown or discussed in a particular order, these steps do not necessarily need to be performed in the order illustrated or discussed. The various exemplary methods described and / or illustrated herein may also omit one or more of the steps described or illustrated herein, or include steps other than those disclosed.

[0092] The foregoing description has been provided to enable others skilled in the art to best utilize the various aspects of the exemplary embodiments disclosed herein. This exemplary description is not intended to be exhaustive or limited to any precise form disclosed. Many modifications and variations can be made without departing from the spirit and scope of this disclosure. In all respects, the embodiments disclosed herein should be considered illustrative rather than restrictive. Reference should be made to the appended claims and their equivalents in determining the scope of this disclosure.

[0093] Unless otherwise stated, the terms “connected to” and “coupled to” (and their derivatives) as used in the specification and claims shall be interpreted as allowing direct and indirect (i.e., via other elements or components) connections. Additionally, the terms “a” or “an” as used in the specification and claims shall be interpreted as meaning “at least one”. Finally, for ease of use, the terms “including” and “having” (and their derivatives) as used in the specification and claims are interchangeable with the word “comprising” and have the same meaning.

Claims

1. An apparatus comprising: an integrated circuit electrically coupled to a substrate; a plurality of electrical contacts disposed on the substrate and electrically coupled to the integrated circuit via the substrate; at least one cable assembly electrically coupled to the plurality of electrical contacts; a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one cable; at least one interposer electrically coupled between the plurality of electrical contacts and the at least one cable assembly; and a load frame physically coupled to the package stiffener such that the load frame presses the at least one cable assembly against the interposer.

2. The apparatus of claim 1, wherein the plurality of electrical contacts comprises at least one of: a set of high-density land grid array (LGA) pads; and a set of high-density ball grid array (BGA) pads.

3. The apparatus of claim 1, wherein: the substrate comprises a first edge, a second edge, a third edge, and a fourth edge; and the plurality of electrical contacts comprises: a first set of electrical contacts disposed proximate the first edge; a second set of electrical contacts disposed proximate the second edge; a third set of electrical contacts disposed proximate the third edge; and a fourth set of electrical contacts disposed proximate the fourth edge.

4. The apparatus of claim 1, further comprising: a circuit board electrically coupled to the substrate; and a heat sink into which the load frame is incorporated, the heat sink comprising at least one spring-loaded attachment mechanism that secures the heat sink to the substrate.

5. The apparatus of claim 1, wherein the cable assembly comprises: an integrated connector; and a plurality of electrical pins.

6. The apparatus of claim 5, wherein: the package stiffener comprises a window frame physically coupled along a perimeter of the substrate such that there is an amount of buffer space between the window frame and the integrated circuit above the substrate; and the plurality of electrical contacts are positioned within the amount of buffer space between the window frame and the integrated circuit such that: the integrated connector of the cable assembly is located over at least a portion of the buffer space; and the plurality of electrical pins extend parallel to the substrate and outward from the portion of buffer space toward an edge of the substrate.

7. The apparatus of claim 5, wherein: the package stiffener comprises a window frame that forms at least one opening; the plurality of electrical contacts are positioned below the at least one opening formed by the window frame such that: the integrated connector of the cable assembly is located over the plurality of electrical contacts within the opening formed by the window frame; and the plurality of electrical pins extend parallel to the substrate and outward from the opening formed by the window frame toward an edge of the substrate.

8. The apparatus of claim 1, wherein the package stiffener is sized to provide an amount of rigidity to the substrate to mitigate warping of the substrate.

9. A system comprising: a substrate electrically coupled to a circuit board; ​ ​ ​ ​ ​ an integrated circuit electrically coupled to the substrate; a plurality of electrical contacts disposed on the substrate and electrically coupled to the integrated circuit via the substrate; at least one cable assembly electrically coupled to the plurality of electrical contacts; a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable; at least one interposer electrically coupled between the plurality of electrical contacts and the at least one cable assembly; and a load frame physically coupled to the package stiffener such that the load frame presses the at least one cable assembly against the interposer.

10. The system of claim 9, wherein the plurality of electrical contacts comprises at least one of: a set of high-density land grid array (LGA) pads; and a set of high-density ball grid array (BGA) pads.

11. The system of claim 9, wherein: the substrate comprises a first edge, a second edge, a third edge, and a fourth edge; and the plurality of electrical contacts comprises: a first set of electrical contacts disposed proximate to the first edge; a second set of electrical contacts disposed proximate to the second edge; a third set of electrical contacts disposed proximate to the third edge; and a fourth set of electrical contacts disposed proximate to the fourth edge.

12. A method comprising: disposing a plurality of electrical contacts on a substrate; electrically coupling an integrated circuit to the substrate such that the substrate provides electrical continuity between the plurality of electrical contacts and the integrated circuit; electrically coupling at least one cable assembly to the plurality of electrical contacts; physically coupling a package stiffener to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable; electrically coupling at least one interposer between the plurality of electrical contacts and the at least one cable assembly; and physically coupling a load frame to the package stiffener such that the load frame presses the at least one cable assembly against the interposer. ​ ​

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