Power module and heat dissipation system

Abstract

The present invention discloses a power module and a heat dissipation system. The power module includes a first circuit board, a second circuit board, at least one discrete device, and a package. The discrete device includes a wire bonding frame and a chip. The wire bonding frame is disposed between the first circuit board and the second circuit board. The wire bonding frame includes two end faces and a plurality of mounting side faces connected in sequence. The end faces and the mounting side faces are disposed at an angle. The two end faces are electrically connected to the first circuit board and the second circuit board respectively. The chip is disposed on the mounting side face. The package is potted between the first circuit board and the second circuit board. The discrete device is embedded in the package. A plurality of electrode plates are potted in the package. One end of the electrode plate is connected to the first circuit board or the second circuit board, and the other end extends outside the package. By providing the wire bonding frame, the wire bonding frame can support the first circuit board and the second circuit board, avoiding the circuit breakage of the first circuit board and the second circuit board caused by the pressure deformation of the first circuit board and the second circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and particularly to a power module and a heat dissipation system including the power module. Background Art

[0002] The power module composed of discrete devices has the characteristics of small volume, flexible and convenient use. With the development of semiconductors, the power of chips is getting larger and larger. For power modules, it is a difficult challenge to maintain the advantage of small volume and improve power density at the same time. Limited by the volume of the power module, the upper limit of its power density is foreseeable. In order to break through the ceiling problem of the power density of the power module, the research on ultra-high power power modules has been carried out.

[0003] In the prior art, the chips of the power module are directly attached to the substrate, and the substrate adopts a planar structure. Therefore, a large number of leads are required to connect the chips. In the process, chip mounting is carried out first, then leads are used, and then a shell with a relatively large hardness is used to package the components. In order to reduce the size of the shell, the shell is mostly set as a hollow structure. When the shell is squeezed, the middle area of the shell is prone to collapse, causing the breakage of chips or connection lines, resulting in damage to the module; if support columns are arranged inside the shell, the size of the module will increase, which is not conducive to improving the power density of the module. When the number of chips in the module is large, due to the large heat generation of the chips, when the module fails to dissipate heat in time, heat will accumulate in the module, causing the temperature of the chips to rise, and the high temperature will affect the operating efficiency of the chips, thereby affecting the performance of the module. Summary of the Invention

[0004] An object of an embodiment of the present invention is to provide a power module with a simple structure, high compressive performance and large power density.

[0005] Another object of an embodiment of the present invention is to provide a heat dissipation system with stable performance.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] In a first aspect, a power module is provided, including:

[0008] A first circuit board;

[0009] A second circuit board, the second circuit board and the first circuit board are opposite and spaced apart;

[0010] At least one discrete device, the discrete device includes a wire bonding frame and a chip, the wire bonding frame is disposed between the first circuit board and the second circuit board, the wire bonding frame includes two end faces and a plurality of mounting side faces connected in sequence, the end faces and the mounting side faces are disposed at an angle, the two end faces are respectively electrically connected to the first circuit board and the second circuit board, and the chip is disposed on the mounting side face;

[0011] A package body, the package body is potted between the first circuit board and the second circuit board, the discrete device is embedded in the package body, a plurality of electrode plates are potted in the package body, one end of the electrode plate is connected to the first circuit board or the second circuit board, and the other end of the electrode plate extends outside the package body.

[0012] As a preferred solution of the power module, the mounting side face is provided with a groove, and the chip is disposed in the groove.

[0013] As a preferred solution of the power module, the wire bonding frame includes a frame top and a frame bottom, the frame top is connected to the first circuit board, the frame bottom is connected to the second circuit board, the frame top is an integrated metal structure, the mounting side face is disposed on the frame top, the frame bottom includes at least one first electrode plate and at least one second electrode plate, the frame top, the first electrode plate and the second electrode plate are insulated from each other, a first electrode of the chip is electrically connected to the first electrode plate, a second electrode of the chip is electrically connected to the second electrode plate, and a third electrode of the chip is electrically connected to the frame top.

[0014] As a preferred solution of the power module, the frame bottom includes one first electrode plate and one second electrode plate, the first electrode plate and the second electrode plate are disposed at an angle, the first electrode plate and the second electrode plate partially overlap, and a first insulating plate is disposed between overlapping positions of the first electrode plate and the second electrode plate.

[0015] As a preferred solution of the power module, a first groove is provided on the first electrode plate, a second groove is provided on the second electrode plate, the first insulating plate is disposed in the second groove, the bottom of the second groove and the first insulating plate are both embedded in the first groove, and the lower surfaces of the first electrode plate and the second electrode plate are flush.

[0016] As a preferred solution of the power module, the frame bottom includes two first electrode plates and two second electrode plates, the two first electrode plates are arranged at intervals with a dislocation to form a vacancy, the second electrode plates are correspondingly disposed in the vacancies, and a second insulating plate is provided between the first electrode plate and the second electrode plate adjacent to the first electrode plate.

[0017] As a preferred embodiment of the power module, a notch is recessed on the lower surface of the top of the frame, the first electrode plate and the second electrode plate are disposed in the notch, the second insulating plate is disposed between the notch and the first and second electrode plates, and the lower surfaces of the first and second electrode plates are flush with the lower surface of the top of the frame.

[0018] As a preferred embodiment of the power module, the first circuit board has a first side away from the wire bonding frame, and the package extends to the first side such that the first side is partially exposed outside the package; and / or,

[0019] The second circuit board has a second side away from the wire bonding frame, and the package extends to the second side such that the second side is partially exposed outside the package.

[0020] In a second aspect, a heat dissipation system is provided, including the above-mentioned power module and a radiator, the radiator is disposed on the power module, and the radiator is connected to the first circuit board and the second circuit board.

[0021] As a preferred embodiment of the heat dissipation system, the radiator includes two heat dissipation components, the two heat dissipation components are respectively connected to the first circuit board and the second circuit board, a cavity is provided inside the heat dissipation component, a cooling medium flows in the cavity, the heat dissipation component is provided with at least two inlets and outlets communicating with the cavity, the inlets and outlets are used for the inflow and outflow of the cooling medium, at least one inlet and outlet of one of the heat dissipation components is communicated with at least one inlet and outlet of the other heat dissipation component, and the cooling medium flows in from one inlet and outlet of one heat dissipation component and flows out from one inlet and outlet of the other heat dissipation component.

[0022] As a preferred embodiment of the heat dissipation system, the heat dissipation component includes a heat dissipation body and a cover plate, the heat dissipation body has an opening, and the cover plate seals the opening to form the cavity. The heat dissipation component is provided with three inlets and outlets, two of the inlets and outlets are disposed on the heat dissipation body, one inlet and outlet is disposed on the cover plate, and the two inlets and outlets on the heat dissipation body of one heat dissipation component are respectively communicated with the two inlets and outlets on the heat dissipation body of the other heat dissipation component.

[0023] As a preferred embodiment of the heat dissipation system, a plurality of heat dissipation ridges are protrudingly provided on the inner wall of the heat dissipation body.

[0024] The beneficial effects of the present invention are as follows: By providing a wire bonding frame, the wire bonding frame can play a supporting role. When the first circuit board and the second circuit board are squeezed, the wire bonding frame can support the first circuit board and the second circuit board, preventing the first circuit board and the second circuit board from being deformed under pressure, which may cause the circuits on the first circuit board and the second circuit board to be open-circuited; the wire bonding frame is not easily deformed under pressure. That is to say, when an external force squeezes the power module, the wire bonding frame can protect the chip from being fractured under pressure, improving the compressive resistance of the wire bonding frame; by providing multiple mounting sides on a single wire bonding frame, each mounting side can be used to mount a chip, which can increase the density of chips in the power module, thereby increasing the power of the power module; it can be understood that the cost of the chip increases geometrically with the power of the chip. After increasing the arrangement density of chips in the power module in this embodiment, the power of a single chip can be appropriately reduced. That is, by increasing the number of chips to fill the power difference reduced by a single chip, the manufacturing cost of discrete devices can be greatly reduced; by providing the first circuit board and the second circuit board, and arranging the chips on the mounting sides of the wire bonding frame, the two-dimensional circuit structure is transformed into a three-dimensional circuit structure, making full use of the space in the vertical direction of the power module. This can not only reduce the overall size of the power module, but also facilitate the extraction of chip electrodes, simplify the circuit structure inside the power module, and contribute to reducing the manufacturing cost of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention will be further described in detail below with reference to the drawings and embodiments.

[0026] Figure 1 Schematic diagram of the power module according to an embodiment of the present invention.

[0027] Figure 2 Cross-sectional schematic diagram of the power module according to an embodiment of the present invention.

[0028] Figure 3 Exploded schematic diagram of the power module according to an embodiment of the present invention.

[0029] Figure 4 Schematic diagram of the wire bonding frame and chip according to Embodiment 1 of the present invention.

[0030] Figure 5 Schematic diagram of the wire bonding frame and chip according to Embodiment 2 of the present invention.

[0031] Figure 6 Exploded schematic diagram of the wire bonding frame according to Embodiment 2 of the present invention.

[0032] Figure 7 Schematic diagram of the wire bonding frame and chip according to Embodiment 3 of the present invention.

[0033] Figure 8Schematic diagram of the decomposition of the wire bonding frame according to Embodiment 3 of the present invention.

[0034] Figure 9 Schematic diagram of the heat dissipation system according to the embodiment of the present invention.

[0035] Figure 10 Schematic diagram of the decomposition of the heat dissipation system according to the embodiment of the present invention.

[0036] In the figure:

[0037] 1. Chip; 2. Package; 3. First circuit board; 31. First side; 4. Second circuit board; 41. Second side; 5. Wire bonding frame; 51. Frame top; 511. Mounting side; 512. Groove; 513. Notch; 52. Frame bottom; 521. First electrode plate; 5211. First groove; 522. Second electrode plate; 5221. Second groove; 6. Electrode piece; 7. First lead; 8. Second lead; 9. Heat dissipation part; 91. Heat dissipation body; 93. Inlet and outlet; 911. Heat dissipation rib; 92. Cover plate; 10. Solder; 11. Second insulating plate; 12. First insulating plate; 13. Third insulating plate. Detailed implementation manners

[0038] To make the technical problems solved by the present invention, the technical solutions adopted and the achieved technical effects clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0039] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to" and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0040] As Figures 1 to 3 shown, a power module provided by the present invention includes a first circuit board 3, a second circuit board 4, discrete devices and a package 2. The first circuit board 3 and the second circuit board 4 are opposite and spaced apart. At least one discrete device is provided. The discrete device includes a wire bonding frame 5 and a chip 1. The wire bonding frame 5 is arranged between the first circuit board 3 and the second circuit board 4. Refer to Figures 4 to 8, the wire bonding frame 5 includes two end faces and a plurality of mounting side faces 511 connected in sequence. Among them, the end faces and the mounting side faces 511 are arranged at an angle. The two end faces of the wire bonding frame 5 are electrically connected to the first circuit board 3 and the second circuit board 4 respectively. The chip 1 is fixed on the mounting side face 511. The encapsulation body 2 is potted between the first circuit board 3 and the second circuit board 4. The discrete device is embedded in the encapsulation body 2. A plurality of electrode plates 6 are potted in the encapsulation body 2. One end of the electrode plate 6 is connected to the first circuit board 3 or the second circuit board 4, and the other end of the electrode plate 6 extends outside the encapsulation body 2. By setting the wire bonding frame 5, the wire bonding frame 5 can play a supporting role. When the first circuit board 3 and the second circuit board 4 are squeezed, the wire bonding frame 5 can support the first circuit board 3 and the second circuit board 4, avoiding the circuit breakage of the first circuit board 3 and the second circuit board 4 caused by the compression deformation of the first circuit board 3 and the second circuit board 4; the wire bonding frame 5 is not easily deformed under pressure. That is to say, when the power module is squeezed by an external force, the wire bonding frame 5 can protect the chip 1, avoiding the chip 1 being broken under pressure, and improving the compressive capacity of the wire bonding frame 5; by setting a plurality of mounting side faces 511 on a single wire bonding frame 5, each mounting side face 511 can mount the chip 1, so that the density of the chips 1 in the power module can be increased, thereby increasing the power of the power module; it can be understood that the cost of the chip 1 will increase geometrically with the power of the chip 1. After increasing the arrangement density of the chips 1 in the power module in this embodiment, the power of a single chip 1 can be appropriately reduced, that is, by increasing the number of chips 1 to fill the power difference reduced by a single chip 1, which can greatly reduce the manufacturing cost of the discrete device; the chip 1 is arranged on the mounting side face 511 of the wire bonding frame 5, changing the two-dimensional circuit structure into a three-dimensional circuit structure, making full use of the space in the vertical direction of the power module, which can not only reduce the overall size of the power module, but also facilitate the extraction of the electrodes of the chip 1, simplify the circuit structure inside the power module, and contribute to reducing the manufacturing cost of the power module.

[0041] In this embodiment, four discrete devices are arranged in a single power module. The wire bonding frames 5 of the four discrete devices are arranged in a matrix. A single wire bonding frame 5 has a hexahedron structure. A single wire bonding frame 5 includes four mounting side faces 511. Each mounting side face 511 is provided with a chip 1. The four mounting side faces 511 are evenly distributed annularly along the central axis of the wire bonding frame 5. In other embodiments, the number of mounting side faces 511 on a single wire bonding frame 5 is not limited to four, and can also be two, three, five or even more. Through the annularly distributed mounting side faces 511, the circuit structures of the chips 1, the first circuit board 3 and the second circuit board 4 on the mounting side faces 511 can be made symmetrical, reducing the occurrence of signal delay of each chip 1 caused by different circuit structures, and improving the performance of the power module.

[0042] Specifically, the wire bonding frame 5 includes a frame top 51 and a frame bottom 52. The frame top 51 is connected to the first circuit board 3, and the frame bottom 52 is connected to the second circuit board 4. The frame top 51 is an integrated metal structure, and the mounting side 511 is provided on the frame top 51. The frame bottom 52 includes at least one first electrode plate 521 and at least one second electrode plate 522. The frame top 51, the first electrode plate 521, and the second electrode plate 522 are insulated from each other. The chip 1 includes a first electrode, a second electrode, and a third electrode. The first electrode of the chip 1 is electrically connected to the first electrode plate 521, the second electrode of the chip 1 is electrically connected to the second electrode plate 522, and the third electrode of the chip 1 is electrically connected to the frame top 51. In this embodiment, the number of electrodes of the chip 1 is three. Therefore, the circuit structures on the first circuit board 3 and the second circuit board 4 are different, so that the first circuit board 3 and the second circuit board 4 can meet the operation requirements of the chip 1. By setting the first electrode, the second electrode, and the third electrode of the chip 1 to be respectively connected to the first electrode plate 521, the second electrode plate 522, and the frame top 51, it is beneficial to the subsequent connection between the chip 1 and the external circuit; by setting the frame top 51, the third electrodes of all the chips 1 on the wire bonding frame 5 can be interconnected, realizing the sharing of electrodes between the chips 1; by setting the first electrode plate 521 and the second electrode plate 522, the sharing of electrodes between the chips 1 can also be realized, that is, the first electrodes of two adjacent chips 1 can be connected to the same first electrode plate 521, and the second electrodes of two adjacent chips 1 can be connected to the same second electrode plate 522, which helps to simplify the circuit structures on the first circuit board 3 and the second circuit board 4. Specifically, the first electrode of the chip 1 and the first electrode plate 521 can be electrically connected through a first lead 7, the second electrode of the chip 1 and the second electrode plate 522 can be electrically connected through a second lead 8, and the third electrode of the chip 1 is welded to the frame top 51.

[0043] In this embodiment, the frame top 51, the first electrode plate 521, and the second electrode plate 522 are all made of pure copper. In addition, the frame top 51, the first electrode plate 521, and the second electrode plate 522 can also be made of copper-zinc alloy or copper-aluminum alloy. The metal materials of the frame top 51, the first electrode plate 521, and the second electrode plate 522 are not limited to the above several materials, and only need to meet the requirements of conductivity and certain mechanical strength.

[0044] Referring to Figures 5 to 6 , in one embodiment, the frame bottom 52 includes one first electrode plate 521 and one second electrode plate 522. The first electrodes of the four chips 1 on the wire bonding frame 5 can share one first electrode plate 521, and the second electrodes of the four chips 1 on the wire bonding frame 5 can share one second electrode plate 522. This can further simplify the circuit structures on the first circuit board 3 and the second circuit board 4.

[0045] Specifically, the first electrode plate 521 and the second electrode plate 522 are arranged at an included angle, the first electrode plate 521 and the second electrode plate 522 partially overlap, and a first insulating plate 12 is arranged at the overlapping position between the first electrode plate 521 and the second electrode plate 522. By arranging the first electrode plate 521 and the second electrode plate 522 with partial overlap, it is convenient for the first electrode and the second electrode of the chip 1 on each mounting side 511 to be connected to the second circuit board 4 through the first electrode plate 521 and the second electrode plate 522, simplifying the circuit structure on the second circuit board 4.

[0046] Specifically, a first groove 5211 is arranged on the first electrode plate 521, a second groove 5221 is arranged on the second electrode plate 522, the first insulating plate 12 is arranged in the second groove 5221, and the bottom of the second groove 5221 and the first insulating plate 12 are both embedded in the first groove 5211, so that the lower surfaces of the first electrode plate 521 and the second electrode plate 522 are flush. By arranging the first groove 5211 and the second groove 5221, the local thickness of the first electrode plate 521 and the second electrode plate 522 can be reduced, thereby reducing the size of the wire bonding frame 5, and further reducing the size of the power module and providing the power density of the power module.

[0047] Referring to Figure 7 and Figure 8 In another embodiment, the bottom 52 of a single frame includes two first electrode plates 521 and two second electrode plates 522. The two first electrode plates 521 are arranged at a staggered interval to form a vacancy, and the two second electrode plates 522 are correspondingly arranged in the vacancy. A second insulating plate 11 is arranged between the first electrode plate 521 and the second electrode plate 522 adjacent to the first electrode plate 521. Specifically, by arranging the first electrode plate 521 and the second electrode plate 522 at a staggered interval, a first electrode plate 521 and a second electrode plate 522 form a cuboid structure. Therefore, a first electrode plate 521 and a second electrode plate 522 are shared between every two chips 1 on a single wire bonding frame 5, thereby reducing the connection difficulty between the chip electrodes and the first electrode plate 521 and the second electrode plate 522. The circuit structures on the first circuit board 3 and the second circuit board 4 can also be simplified.

[0048] Specifically, a notch 513 is recessed on the lower surface of the top of the frame 51. The first electrode plate 521 and the second electrode plate 522 are arranged in the notch 513. The second insulating plate 11 is arranged between the notch 513 and the first electrode plate 521 and the second electrode plate 522. The lower surfaces of the first electrode plate 521 and the second electrode plate 522 are flush with the lower surface of the top of the frame 51. By providing the notch 513 on the lower surface of the top of the frame 51, the notch 513 is used to accommodate the first electrode plate 521 and the second electrode plate 522, and the lower surfaces of the first electrode plate 521 and the second electrode plate 522 are flush with the lower surface of the top of the frame 51, so that the space occupied by the top of the frame 51, the first electrode plate 521 and the second electrode plate 522 in the vertical direction can be reduced. The height of the top of the frame 51 is the height of the wire bonding frame 5, so that the height of the wire bonding frame 5 can be reduced, thereby reducing the size of the power module. In this embodiment, there are two notches 513. The two first electrode plates 521 are respectively arranged in the two notches 513, and the two second electrode plates 522 are also respectively arranged in the two notches 513.

[0049] Specifically, a third insulating plate 13 is arranged between the top of the frame 51 and the bottom of the frame 52. By providing the third insulating plate 13, the spaced insulation installation between the top of the frame 51, the first electrode plate 521 and the second electrode plate 522 can be facilitated, thereby preventing electrical contact between the top of the frame 51, the first electrode plate 521 and the second electrode plate 522 and avoiding the short - circuit phenomenon of the chip 1.

[0050] In this embodiment, the first insulating plate 12 is made of aluminum nitride or silicon nitride material. The second insulating plate 11 and the third insulating plate 13 can also be made of aluminum nitride or silicon nitride material. The materials of the first insulating plate 12, the second insulating plate 11 and the third insulating plate 13 can be the same or different, and the materials of the first insulating plate 12, the second insulating plate 11 and the third insulating plate 13 can be selected according to actual needs.

[0051] Referring to Figures 5 to 8 , specifically, a groove 512 is arranged on the installation side surface 511 of the top of the frame 51. The chip 1 is arranged in the groove 512. In this embodiment, the first electrode of the chip 1 is connected to the first electrode plate 521 through the first lead 7, the second electrode of the chip 1 is connected to the second electrode plate 522 through the second lead 8, and the third electrode of the chip 1 is welded to the top of the frame 51. Arranging the chip 1 in the groove 512 can not only reduce the arc height of the first lead 7 and the second lead 8 connecting the electrodes of the chip 1 and the wire bonding frame 5, but also increase the heat dissipation area of the wire bonding frame 5, which helps to improve the heat dissipation capacity. Of course, referring to Figure 4 , the groove 512 may not be arranged on the installation side surface 511.

[0052] It should be noted that in this embodiment, the groove 512 is set as a rectangle, the length of the rectangle is greater than the length of the chip 1, and the width of the rectangle is greater than the width of the chip 1. When the chip 1 is arranged in the groove 512, there is a certain preset distance between each edge of the groove 512 and the chip 1, and this preset distance can be determined according to the actual process. On the one hand, it is easy to place the chip 1 because there is a certain preset distance between each edge of the groove 512 and the chip 1. On the other hand, setting a certain preset distance can form a larger heat dissipation gap, which is further beneficial to the heat dissipation of the chip 1.

[0053] Referring to Figures 1 to 3 , specifically, the first circuit board 3 has a first side 31 away from the wire bonding frame 5, and the package 2 extends to the first side 31 so that a part of the first side 31 is exposed outside the package 2. The second circuit board 4 has a second side 41 away from the wire bonding frame 5, and the package 2 extends to the second side 41 so that a part of the second side 41 is also exposed outside the package 2. By setting the package 2 to extend to the first side 31 and the second side 41, the package 2 can wrap the peripheries of the first circuit board 3 and the second circuit board 4, improving the connection strength between the first circuit board 3 and the second circuit board 4 and the package 2; setting a part of the first side 31 and the second side 41 to be exposed outside the package 2 can facilitate the heat dissipation of the circuit structures on the first circuit board 3 and the second circuit board 4, and the heat on the chip 1 can also be transferred to the first circuit board 3 and the second circuit board 4 through the wire bonding frame 5. That is to say, the first circuit board 3 and the second circuit board 4 can act as heat dissipation structures of the power module.

[0054] Specifically, under the electrical conduction of the wire bonding frame 5, the first circuit board 3 and the second circuit board 4, the first electrode, the second electrode and the third electrode of the chip 1 are respectively electrically connected to different electrode pieces 6. In this embodiment, six electrode pieces 6 are provided, two electrode pieces 6 are electrically connected to the first electrode, another two electrode pieces 6 are electrically connected to the second electrode, and the remaining two electrode pieces 6 are electrically connected to the third electrode. In other embodiments, the number of electrode pieces 6 can be selected according to the actual power of the chip 1. For example, the number of electrode pieces 6 can be three, nine, etc.

[0055] Referring to Figure 9 and Figure 10, specifically, the present invention further provides a heat dissipation system, which includes the above-mentioned power module and a radiator. The radiator is disposed on the power module and is connected to the first circuit board 3 and the second circuit board 4. By providing the radiator, the chips 1 and the circuit structure within the power module can be timely cooled, reducing the temperature of the power module and preventing the chips 1 or the circuit structure from being damaged due to high temperature, thus ensuring the operating performance of the power module; by providing the connection between the radiator and the first circuit board 3 and the second circuit board 4, the discrete devices can be cooled from both sides, further improving the heat dissipation effect of the control module and preventing the chips 1 from being damaged due to high temperature.

[0056] In this embodiment, the radiator is connected to the first side 31 of the first circuit board 3 and the second side 41 of the second circuit board 4. In this embodiment, both the first side 31 and the second side 41 are copper surfaces, and the first side 31 and the second side 41 are welded to the radiator through solder 10. At this time, the heat on the first circuit board 3 and the second circuit board 4 can be quickly conducted to the radiator and taken away from the power module by the radiator, preventing heat from accumulating within the power module and ensuring the operating performance of the power module.

[0057] Refer to Figure 9 and Figure 10 , specifically, the radiator includes two heat dissipation components 9. The two heat dissipation components 9 are respectively connected to the first side 31 of the first circuit board 3 and the second side 41 of the second circuit board 4. A cavity is provided inside the heat dissipation component 9, and a cooling medium flows inside the cavity. The heat dissipation component 9 is provided with at least two inlets and outlets 93 communicating with the cavity, and the inlets and outlets 93 are used for the inflow and outflow of the cooling medium. At least one inlet and outlet 93 of one heat dissipation component 9 communicates with at least one inlet and outlet 93 of the other heat dissipation component 9, and the cooling medium flows in from one inlet and outlet 93 of one heat dissipation component 9 and flows out from one inlet and outlet 93 of the other heat dissipation component 9. In this embodiment, two heat dissipation components 9 are provided, and the two heat dissipation components 9 are respectively connected to the first side 31 and the second side 41. At least one inlet and outlet 93 of one heat dissipation component 9 communicates with at least one inlet and outlet 93 of the other heat dissipation component 9, and the cooling medium can flow in from the inlet and outlet 93 of one heat dissipation component 9 and flow out from the inlet and outlet 93 of the other heat dissipation component 9, which can simplify the pipeline structure.

[0058] Specifically, the heat dissipation component 9 includes a heat dissipation body 91 and a cover plate 92. The heat dissipation body 91 has an opening, and the cover plate 92 is used to block the opening to form a cavity. In this embodiment, three inlets and outlets 93 are provided on a single heat dissipation component 9, two of which are provided on the heat dissipation body 91 and one is provided on the cover plate 92. The two inlets and outlets 93 on the heat dissipation body 91 of one heat dissipation component 9 are respectively communicated with the two inlets and outlets 93 on the heat dissipation body 91 of another heat dissipation component 9. By providing the heat dissipation body 91 and the cover plate 92 and forming the heat dissipation component 9 in a combined molding manner, the manufacturing difficulty of the heat dissipation component 9 can be reduced, which is beneficial to reducing the cost of the heat dissipation system. In this embodiment, the cooling medium flows into the cavity of the lower heat dissipation component 9 from the inlet and outlet 93 on the cover plate 92 of the heat dissipation component 9 located below the second circuit board 4, and then flows out from the two inlets and outlets 93 on the heat dissipation body 91 of the lower heat dissipation component 9 respectively. Since the two inlets and outlets 93 on the heat dissipation body 91 of the heat dissipation component 9 below the second circuit board 4 are respectively communicated with the two inlets and outlets 93 on the heat dissipation body 91 of the heat dissipation component 9 located above the first circuit board 3, the cooling medium can flow into the cavity of the upper heat dissipation component 9 from the two inlets and outlets 93 on the heat dissipation body 91 of the heat dissipation component 9 above the first circuit board 3 respectively, and gather in the cavity below the cover plate 92 of the heat dissipation component 9 above the first circuit board 3 and flow out from the inlet and outlet 93 on the cover plate 92.

[0059] Specifically, a plurality of heat dissipation ridges 911 are convexly provided on the inner wall of the heat dissipation body 91, and the heat dissipation ridges 911 are provided on the inner wall close to the chip 1. By providing the heat dissipation ridges 911, the contact area between the heat dissipation component 9 and the coolant can be increased, and the heat dissipation effect of the radiator on the chip 1, the first circuit board 3 and the second circuit board 4 can be enhanced. In this embodiment, the liquid cooling method is adopted to dissipate heat from the power module, that is, the cooling medium is coolant. In other embodiments, the air cooling method can also be used to cool down the power module. For example, cold air can be injected into the inlet of the heat dissipation component 9, and the cold air flows out from the outlet of the heat dissipation component 9 through the cavity, which can reduce the sealing requirement of the heat dissipation component 9 and avoid the occurrence of short circuits in the circuit structure caused by leakage of the heat dissipation component 9.

[0060] In the description of this article, it should be understood that the orientation or positional relationships such as "upper", "lower", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0061] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0062] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0063] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A power module, characterized in that, Comprising: A first circuit board; A second circuit board, the second circuit board being opposite to and spaced apart from the first circuit board; At least one discrete device, the discrete device comprising a wire bonding frame and a chip, the wire bonding frame being disposed between the first circuit board and the second circuit board, the wire bonding frame comprising two end faces and a plurality of mounting side faces connected in sequence, the end faces and the mounting side faces being disposed at an angle, the two end faces being electrically connected to the first circuit board and the second circuit board respectively, and the chip being disposed on the mounting side faces; A package body, the package body being potted between the first circuit board and the second circuit board, the discrete device being embedded in the package body, a plurality of electrode plates being potted in the package body, one end of the electrode plate being connected to the first circuit board or the second circuit board, and the other end of the electrode plate extending outside the package body.

2. The power module according to claim 1, characterized in that The mounting side faces are provided with grooves, and the chips are disposed in the grooves.

3. The power module according to claim 1, characterized in that, The wire bonding frame comprises a frame top and a frame bottom, the frame top being connected to the first circuit board, the frame bottom being connected to the second circuit board, the frame top being an integral metal structure, the mounting side faces being disposed on the frame top, the frame bottom comprising at least one first electrode plate and at least one second electrode plate, the frame top, the first electrode plate and the second electrode plate being insulated from each other, a first electrode of the chip being electrically connected to the first electrode plate, a second electrode of the chip being electrically connected to the second electrode plate, and a third electrode of the chip being electrically connected to the frame top.

4. The power module according to claim 3, characterized in that, The frame bottom comprises one first electrode plate and one second electrode plate, the first electrode plate and the second electrode plate being disposed at an angle, the first electrode plate and the second electrode plate partially overlapping, and a first insulating plate being disposed between the overlapping positions of the first electrode plate and the second electrode plate.

5. The power module according to claim 4, characterized in that, The first electrode plate is provided with a first groove, the second electrode plate is provided with a second groove, the first insulating plate is disposed in the second groove, the bottom of the second groove and the first insulating plate are both embedded in the first groove, and the lower surfaces of the first electrode plate and the second electrode plate are flush.

6. The power module according to claim 3, characterized in that The frame bottom comprises two first electrode plates and two second electrode plates, the two first electrode plates being spaced apart with a gap therebetween, the second electrode plates being disposed in the gaps in a one-to-one correspondence, and a second insulating plate being disposed between the first electrode plate and the second electrode plate adjacent to the first electrode plate.

7. The power module according to claim 6, characterized in that, The lower surface of the frame top is recessed with a notch, the first electrode plate and the second electrode plate are disposed in the notch, the second insulating plate is disposed between the notch and the first electrode plate and the second electrode plate, and the lower surfaces of the first electrode plate and the second electrode plate are flush with the lower surface of the frame top.

8. The power module according to claim 1, characterized in that, The first circuit board has a first side face away from the wire bonding frame, and the package body extends to the first side face so that the first side face is partially exposed outside the package body; and / or, The second circuit board has a second side facing away from the wire bonding frame, and the package extends to the second side such that the second side is partially exposed outside the package.

9. A heat dissipation system, characterized in that, A power module and a heat sink as claimed in any one of claims 1 - 8, wherein the heat sink is disposed on the power module and is connected to the first circuit board and the second circuit board.

10. The heat dissipation system according to claim 9, characterized in that, The heat sink includes two heat dissipation members, which are respectively connected to the first circuit board and the second circuit board. A cavity is provided inside the heat dissipation member, and a cooling medium flows in the cavity. At least two inlets and outlets communicating with the cavity are provided on the heat dissipation member, and the inlets and outlets are used for the inflow and outflow of the cooling medium. At least one of the inlets and outlets of one heat dissipation member communicates with at least one of the inlets and outlets of the other heat dissipation member, and the cooling medium flows in from one of the inlets and outlets of one heat dissipation member and flows out from one of the inlets and outlets of the other heat dissipation member.

11. The heat dissipation system according to claim 10, characterized in that, The heat dissipation member includes a heat dissipation body and a cover plate. An opening is provided on the heat dissipation body, and the cover plate seals the opening to form the cavity. Three inlets and outlets are provided on the heat dissipation member, two of which are provided on the heat dissipation body and one is provided on the cover plate. The two inlets and outlets on the heat dissipation body of one heat dissipation member respectively communicate with the two inlets and outlets on the heat dissipation body of the other heat dissipation member.

12. The heat dissipation system according to claim 11, wherein, A plurality of heat dissipation ridges are protrudingly provided on the inner wall of the heat dissipation body.

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