A chip-wrapped ultra-high contrast lamp bead

Abstract

The present invention belongs to the technical field of LED lamp beads, and in particular to a chip-encapsulated ultra-high contrast lamp bead, comprising a substrate, a chip welded on the upper surface of the substrate, black glue coated on the surface of the substrate, a protective film coated on the surface of the chip, and packaging glue dripped on the upper surface of the substrate. The present invention uses transparent colorless glue for packaging, sprays black glue on the substrate after the material completes the solid crystal welding wire, and then the black glue fills the entire plate with its own fluidity. Because the front surface of the chip is higher and covered with a transparent protective film of primary silicon dioxide and the surface tension of the glue is adjusted, the glue will not flow excessively into the front surface of the chip when flowing and filling, thereby ensuring the luminescence of the chip. The present invention realizes the ultra-high contrast and appearance consistency of the display lamp bead, while effectively improving the brightness of the lamp bead and reducing the cost.

Description

Technical Field

[0001] The invention belongs to the technical field of LED lamp beads, and in particular relates to a chip-wrapped ultra-high contrast lamp bead. Background Art

[0002] LED stands for semiconductor light emitting diode, which is a light-emitting device made of semiconductor materials that directly converts electrical energy into light energy and electrical signals into light signals. It is characterized by low power consumption, high brightness, bright colors, vibration resistance, long life (80,000-100,000 hours of normal light emission), cold light source, etc. It is a true "green lighting". In the field of LED direct display, LED lamp beads act as a pixel point, and the higher the contrast, the higher the display performance can be achieved. At present, the direct display lamp beads use frosted surface and black colloid to improve the contrast.

[0003] Because LED lamp beads are used as light-emitting points, frosted surfaces and black colloid will cause serious loss of brightness of the lamp beads, resulting in the need to invest in high-cost high-power chips to achieve the target brightness of the finished product. The increase in melanin in the glue will also cause inconsistent colors of lamp beads in different batches due to fluctuations in the amount of black paste added. Secondly, the lamp bead sheet will produce different degrees of oxidation during the production process, resulting in differences in surface color. The black colloid cannot completely cover the color difference of the sheet. After the lamp beads are formed, the reflection of the base color of the sheet will also cause color difference. Summary of the invention

[0004] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a chip-coated ultra-high contrast lamp bead to solve the color difference problem of the lamp bead caused by the color difference of the material plate and the difference in the glue ink color. Secondly, after the plate is fully covered with black glue, the contrast of the lamp bead is significantly improved, and the brightness loss of the lamp bead is small, which can achieve higher brightness and lower cost.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a chip-encapsulated ultra-high contrast lamp bead, comprising a substrate, a chip welded on the upper surface of the substrate, black glue coated on the surface of the substrate, a protective film coated on the surface of the chip, and packaging glue dripped on the upper surface of the substrate.

[0006] As a preferred technical solution for chip-encapsulated ultra-high contrast lamp beads of the present invention, the tension of the black glue needs to be adjusted. After repeated tests, the black glue has a certain fluidity while not climbing onto the surface of the chip due to excessive fluidity.

[0007] As a preferred technical solution for the chip-encapsulated ultra-high contrast lamp beads of the present invention, the protective film is a transparent silica molding component.

[0008] As a preferred technical solution for the chip-encapsulated ultra-high contrast lamp beads of the present invention, the protective film is coated on the front surface of the chip, and the silicon dioxide protective film and the black glue are mutually exclusive.

[0009] As a preferred technical solution for the chip-encapsulated ultra-high contrast lamp beads of the present invention, the packaging glue is a transparent component and completely encapsulates the entire upper end component of the substrate.

[0010] As a preferred technical solution for a chip-encapsulated ultra-high contrast lamp bead of the present invention, the specific method is as follows:

[0011] The first step is to adjust the surface tension of the black glue. Secondly, a layer of silicon dioxide protective film is coated on the front surface of the chip to have a certain repulsive effect with the black glue to further prevent the black glue from climbing onto the front surface of the chip.

[0012] The second step is to spray black glue around the chip. The black glue gradually flows and fills the entire substrate with its own fluidity, leaving only the front surface of the chip exposed. The chip substrate is completely covered with black glue.

[0013] The third step is to use transparent packaging glue to encapsulate after spraying.

[0014] As a preferred technical solution for the chip-encapsulated ultra-high contrast lamp beads of the present invention, the black glue is applied to avoid contact with the front surface of the chip.

[0015] As a preferred technical solution for chip-encapsulated ultra-high contrast lamp beads of the present invention, the tension of the black glue is adjusted to have a certain fluidity while not climbing onto the surface of the chip due to excessive fluidity.

[0016] Compared with the prior art, the beneficial effects of the present invention are: the present invention uses transparent colorless glue for packaging, sprays black glue on the substrate after the material completes the die bonding wire, and then the black glue fills the entire plate with its own fluidity. Because the front surface of the chip is higher and covered with a transparent silica protective film and the surface tension of the glue is adjusted, the glue will not flow excessively into the front surface of the chip during the flow filling, thereby ensuring the luminescence of the chip. The present invention achieves ultra-high contrast and appearance consistency of the display lamp beads, while effectively improving the brightness of the lamp beads and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 It is a schematic diagram of the structure before packaging of the present invention;

[0019] Figure 2 For the present invention Figure 1 Schematic diagram of the structure when applying black glue;

[0020] Figure 3 It is a schematic structural diagram of a partial cross section of the package after side view of the present invention;

[0021] In the picture: 1. Substrate; 2. Chip; 3. Black glue; 4. Protective film; 5. Packaging glue. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Example

[0024] See also Figure 1-3 The present invention provides the following technical solutions: a chip-encapsulated ultra-high contrast lamp bead, comprising a substrate 1, a chip 2 is welded on the upper surface of the substrate 1, a black glue 3 is coated on the surface of the substrate 1, a protective film 4 is coated on the surface of the chip 2, and a packaging glue 5 is dripped on the upper surface of the substrate 1. In this embodiment, the ultra-high contrast and appearance consistency of the display lamp bead are achieved, while the brightness of the lamp bead is effectively improved and the cost is reduced.

[0025] Specifically, the tension of the black glue 3 needs to be adjusted. After repeated tests, the black glue 3 has a certain fluidity while not climbing onto the surface of the chip 2 due to excessive fluidity. This embodiment ensures that the black glue 3 will not affect the luminous effect of the chip 2 during coating and flow.

[0026] Specifically, the protective film 4 is a transparent silicon dioxide molded component. In this embodiment, the transparent silicon dioxide protective film 4 can effectively prevent the black glue 3 from adhering to the front surface of the chip 2, thereby improving the packaging accuracy and the packaging efficiency.

[0027] Specifically, the protective film 4 is coated on the front surface of the chip 2, and the silicon dioxide protective film 4 and the black glue 3 are mutually exclusive. In this embodiment, the black glue 3 is further prevented from climbing onto the front surface of the chip 2 to affect its light-emitting effect.

[0028] Specifically, the encapsulation glue 5 is a transparent component and completely encapsulates the entire upper component of the substrate 1. In this embodiment, the transparent encapsulation glue 5 is used for encapsulation, and the black colloid 3 is no longer used. Therefore, the light output rate of the material reaches more than 90%, which is far higher than the traditional 50% light output rate; the product has the advantages of high brightness and low cost while avoiding the color difference problem that may be caused by the black colloid 3.

[0029] Specifically, a chip-encapsulated ultra-high contrast lamp bead, the specific method is as follows:

[0030] In the first step, the surface tension of the black glue (3) is adjusted. Next, a layer of silicon dioxide protective film (4) is coated on the front surface of the chip (2) to have a certain repulsive effect with the black glue (3) to further prevent the black glue (3) from climbing onto the front surface of the chip (2);

[0031] In the second step, the black glue (3) is sprayed around the chip (2). The black glue (3) gradually flows and fills the entire substrate (1) due to its own fluidity, leaving only the front surface of the chip (2) exposed. The substrate (1) of the chip (2) is completely covered by the black glue (3).

[0032] The third step is to use transparent encapsulation glue (5) to encapsulate after spraying.

[0033] Specifically, when applying the black glue (3), avoid contact with the front surface of the chip (2).

[0034] Specifically, the tension of the black glue (3) is adjusted so that it has a certain fluidity but does not crawl onto the surface of the chip (2) due to excessive fluidity.

[0035] Working principle and use process of the present invention: The present invention is a lamp bead that uses black glue 3 to cover the side of the light-emitting chip 2 and the substrate 1 carrying the chip 2 to achieve ultra-high contrast and high consistency. The specific method is as follows:

[0036] The first step is to adjust the surface tension of the black glue 3. After repeated tests, the black glue 3 has a certain fluidity but will not crawl onto the surface of the chip 2 due to excessive fluidity. Secondly, a layer of silicon dioxide protective film 4 is coated on the front surface of the chip 2 to have a certain repulsive effect with the black glue 3 to further prevent the black glue 3 from crawling onto the front surface of the chip 2.

[0037] In the second step, the black glue 3 is sprayed around the chip 2. The black glue 3 gradually flows and fills the entire substrate 1 by virtue of its own fluidity, leaving only the front surface of the chip 2 exposed (as shown in the attached figure). Figure 2 ), so the substrate 1 of the lamp bead is completely covered by the black glue 3, which completely solves the color difference problem caused by the color difference and oxidation of the substrate 1 itself.

[0038] The third step is to use transparent encapsulation glue 5 to encapsulate after spraying, and no longer use black colloid 3. Therefore, the light output rate of the material reaches more than 90%, far exceeding the traditional 50% light output rate; the product has the advantages of high brightness and low cost while avoiding the color difference problem that may be caused by black colloid 3.

[0039] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip-encapsulated ultra-high contrast lamp bead, characterized in that: The method comprises a substrate (1), a chip (2) is welded on the upper surface of the substrate (1), a black glue (3) is coated on the surface of the substrate (1), a protective film (4) is coated on the surface of the chip (2), and a packaging glue (5) is dripped on the upper surface of the substrate (1), and the method adopts the following steps: In the first step, the surface tension of the black glue (3) is adjusted, and then a protective film (4) is coated on the front surface of the chip (2). The protective film (4) has a repelling effect on the black glue (3) and can prevent the black glue (3) from climbing onto the front surface of the chip (2); The second step is to spray the black glue (3) around the chip (2). When applying the black glue (3), avoid contact with the front surface of the chip (2). The black glue (3) gradually flows and fills the entire substrate (1) with its own fluidity, leaving only the front surface of the chip (2). The substrate (1) of the chip (2) is completely covered by the black glue (3). The third step is to use packaging glue (5) to package after spraying.

2. The chip-encapsulated ultra-high contrast lamp bead according to claim 1, characterized in that: The tension of the black glue (3) is adjusted so that it has a certain fluidity but does not crawl onto the surface of the chip (2) due to excessive fluidity.

3. The chip-encapsulated ultra-high contrast lamp bead according to claim 1, characterized in that: The protective film (4) is a transparent silicon dioxide molded component.

4. The chip-encapsulated ultra-high contrast lamp bead according to claim 1, characterized in that: The packaging glue (5) is a transparent component and completely packages the entire upper component of the substrate (1).

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