Heat dissipation sealing structure of axial flux motor controller

Abstract

The present invention provides a heat dissipation sealing structure of an axial flux motor controller, comprising a housing, the housing comprising a bearing plate and a cover, and a receiving cavity defined between the bearing plate and the cover, the bearing plate being provided with an external waterway in a manner away from the receiving cavity; and a waterway cover plate, the waterway cover plate being externally provided and connected to the bearing plate to close the waterway. The bearing plate is used to carry components such as IGBT modules and thin film capacitors, so that the heat generated by them is directly transferred through the bearing plate, and directly dissipated through the waterway external to the bearing plate, which not only improves the heat dissipation performance, but also effectively prevents the cooling medium in the waterway from directly contacting the components, thereby causing leakage of the cooling medium, and short circuit of the components, effectively improving the sealing and waterproof performance, and rationally utilizing the spatial layout, so that the overall structure is more compact, achieving advantages such as lightweight and small volume, and reducing the need for occupying installation space.

Description

Technical Field

[0001] The invention relates to the field of axial flux motors, and in particular to a heat dissipation sealing structure of an axial flux motor controller. Background Art

[0002] Axial flux motors are also called disc motors. Compared with traditional radial motors, axial flux motors have the advantages of small axial size, high torque density, high power density and high efficiency. They are widely used in electric vehicles, general industry and household appliances. As a controller for controlling the motor, the quality and performance of the controller are directly related to the use of the motor and the whole. The controller integrates high-power IGBT modules and film capacitors. As the power density of the controller increases, the heat loss of IGBT modules and film capacitors also increases. Once the temperature is too high, it will directly affect the use effect and life of the controller. Therefore, the cooling of the controller is very important.

[0003] At present, the heat dissipation of the controller mainly adopts water cooling, that is, the heat generated by the controller is taken away by circulating coolant to achieve the purpose of heat dissipation. It can be seen that the controller integrates the cover, heat dissipation structure, high-power IGBT module and film capacitor, etc., which makes the overall volume of the controller larger, thus limiting the installation space of the controller. In addition, the sealing of the coolant must be considered to prevent the coolant leakage from causing the controller short circuit and other phenomena, and even requires the cover to have a strong supporting strength to ensure the reliable operation of the controller. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a heat dissipation sealing structure of an axial flux motor controller which effectively improves the supporting strength of the shell and achieves the advantages of sealing and small volume.

[0005] The present invention provides a heat dissipation sealing structure of an axial flux motor controller, comprising:

[0006] A housing, the housing comprising a bearing plate and a cover, and a receiving cavity defined between the bearing plate and the cover, the bearing plate being provided with an external water channel in a manner of facing away from the receiving cavity;

[0007] A waterway cover plate is externally arranged and connected to the bearing plate to close the waterway.

[0008] As a preferred embodiment, the supporting plate has an inner connecting surface and an outer molding surface opposite to each other, the inner connecting surface is divided into an IGBT connection area and a capacitor connection area, the outer molding surface is recessed toward the inner connecting surface to form the water channel, and the water channel includes an IGBT water channel area opposite to the IGBT connection area, and a capacitor water channel area opposite to the capacitor connection area.

[0009] As a preferred embodiment, the IGBT water channel area includes at least one honeycomb water channel portion, and the capacitor water channel area includes an S-shaped water channel portion, and the S-shaped water channel portion is connected to the honeycomb water channel portion so that the cooling medium passes from the honeycomb water channel portion to the S-shaped water channel portion.

[0010] As a preferred embodiment, the bottom wall of the honeycomb water channel portion protrudes upward to form a plurality of evenly arranged diverter columns, and the water channel cover plate is provided with a cover plate boss that cooperates with the honeycomb water channel portion so that the diverter columns are fixed to the bottom wall of the honeycomb water channel portion and between the cover plate bosses.

[0011] As a preferred embodiment, the middle of the cover bulges upward in a manner away from the accommodating cavity to form a middle convex portion, and side inclined portions are arranged on both sides of the middle convex portion.

[0012] As a preferred embodiment, each of the side inclined portions protrudes upward to form at least one side convex portion.

[0013] As a preferred embodiment, it also includes a wiring cover plate, on which a wiring slot is provided, and the wiring cover plate is installed in the wiring slot through an anti-foolproof component.

[0014] As a preferred embodiment, the cover shell includes a side panel connected between the supporting plate and the cover, and a side panel glue injection space for filling sealant is provided on one side of the side panel connected to the cover, and the side panel glue injection space is continuous and arranged around the accommodating cavity so that the cover is bonded and fixed to the side panel.

[0015] As a preferred embodiment, the waterway has a waterway bottom wall and waterway side walls connecting both sides of the waterway bottom wall, and a side wall glue injection space is provided on the side of the waterway side wall facing the waterway cover plate so that the waterway cover plate can be bonded and fixed to the supporting plate.

[0016] As a preferred embodiment, the water channel cover plate and / or the side plate are externally provided with reinforcing ribs and heat dissipating ribs.

[0017] Compared with the prior art, this technical solution has the following advantages:

[0018] The carrier plate is used to carry components such as IGBT modules and thin film capacitors, so that the heat generated by them is directly transferred through the carrier plate, and the heat is directly dissipated through the water channel outside the carrier plate, which not only improves the heat dissipation performance, but also effectively prevents the cooling medium in the water channel from directly contacting the components, thereby causing leakage of the cooling medium and short circuit of the components, effectively improving the sealing and waterproof performance, and reasonably utilizing the space layout to make the overall structure more compact, achieve advantages such as lightweight and small volume, and reduce the demand for occupying installation space. In addition, the external water channel is easy to manage and maintain, and the water channel includes the honeycomb water channel portion opposite to the IGBT module, and its bottom wall protrudes upward to form a plurality of diversion columns to divert the cooling medium, improve the turbulence of the cooling medium, increase the fluidity of the water and the uniformity of cooling, thereby improving the heat dissipation capacity. The side plate and the cover, as well as the carrier plate and the water channel cover plate can be filled with sealant to achieve advantages such as waterproof sealing. And the side plate and the water channel cover plate are externally provided with reinforcing ribs to improve the structural strength and rigidity, prevent deformation, thereby enhancing the support strength and extending the service life.

[0019] The present invention is further described below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the combination of the waterway, the bearing plate and the side plate of the present invention;

[0021] Figure 2 It is a structural schematic diagram of the combination of the load-bearing plate and the side plate of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of the cover according to the present invention;

[0023] Figure 4 It is a front view of the waterway cover plate of the present invention;

[0024] Figure 5 It is a rear view of the waterway cover plate of the present invention;

[0025] Figure 6 It is a front view of the wiring cover plate of the present invention;

[0026] Figure 7 It is a rear view of the wiring cover plate of the present invention. DETAILED DESCRIPTION

[0027] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0028] like Figures 1 to 5 As shown, the heat dissipation sealing structure of the axial flux motor controller includes:

[0029] A housing 100, the housing 100 comprising a carrier plate 110 and a cover 120, and a receiving cavity 130 defined between the carrier plate 110 and the cover 120, the carrier plate 110 being provided with an external water channel 140 in a manner of facing away from the receiving cavity 130;

[0030] A waterway cover plate 200 is externally disposed and connected to the supporting plate 110 to close the waterway 140 .

[0031] The carrier plate 110 is used to carry components such as IGBT modules and thin film capacitors, so that the heat generated by them is directly transferred through the carrier plate 110 and directly dissipated through the water channel 140 outside the carrier plate 110, which not only improves the heat dissipation performance, but also effectively prevents the cooling medium in the water channel 140 from directly contacting the components, thereby causing cooling medium leakage and component short circuit, effectively improves the sealing and waterproof performance, and reasonably utilizes the space layout to make the overall structure more compact, achieve advantages such as lightweight and small size, and reduce the need for occupying installation space. In addition, the external water channel 140 is easy to manage and maintain.

[0032] like Figure 1 and Figure 2 As shown, the carrier plate 110 has an inner connecting surface 1101 and an outer molding surface 1102 opposite to each other, the inner connecting surface 1101 is divided into an IGBT connecting area 11011 and a capacitor connecting area 11012, the outer molding surface 1102 is recessed toward the inner connecting surface 1101 to form the water channel 140, and the water channel 140 includes an IGBT water channel area 141 opposite to the IGBT connecting area 11011, and a capacitor water channel area 142 opposite to the capacitor connecting area 11012.

[0033] The inner connection surface 1101 is disposed toward the accommodating cavity 130, and the outer molding surface 1102 is disposed away from the accommodating cavity 130. The IGBT connection area 11011 and the capacitor connection area 11012 are molded side by side on the inner connection surface 1101. Figure 2, the IGBT module can be fixed to the IGBT connection area 11011 by bolts, that is, the IGBT connection area 11011 is provided with a plurality of threaded holes, so that bolts can pass through the IGBT module and be screwed into the threaded holes, so as to realize the fixing of the IGBT module to the IGBT connection area 11011. Similarly, the thin film capacitor can also be fixed to the capacitor connection area 11012 by bolts.

[0034] The housing 100 is cast, and the IGBT connection area 11011 and the capacitor connection area 11012 are formed by precision milling after the housing 100 is cast, so as to ensure that the gap between the IGBT module and the IGBT connection area 11011 is less than 100 μm, so that the heat of the IGBT module is directly transferred to the water channel 140 through the carrier plate 110, and the heat is taken away by the water channel 140, so as to maximize the convective heat transfer and improve the heat dissipation performance. Preferably, a heat conductive layer can be provided between the IGBT module and the IGBT connection area 11011, and the heat conductive layer can be a thermal conductive silicone grease coating layer to further improve the heat dissipation effect.

[0035] The water channel 140 is placed on the outer molding surface 1102 relative to the inner connecting surface 1101, and the water channel 140 is recessed toward the inner connecting surface 1101, wherein the water channel 140 does not penetrate the inner connecting surface 1101, so that the carrier plate 110 separates the original component and the cooling medium, and simultaneously realizes heat transfer between the two. The distance between the inner connecting surface 1101 and the bottom wall of the water channel is maintained at about 3 mm, and the water channel 140 includes the IGBT water channel area 141 and the capacitor water channel area 142, and the corresponding water channel structure is designed for the IGBT module and the thin film capacitor, so as to have a better heat dissipation effect.

[0036] like Figure 1 As shown, the IGBT water channel area 141 includes at least one honeycomb water channel portion 1411, and the capacitor water channel area 142 includes an S-shaped water channel portion 1421. The S-shaped water channel portion 1421 is connected to the honeycomb water channel portion 1411 to allow the cooling medium to pass from the honeycomb water channel portion 1411 to the S-shaped water channel portion 1421.

[0037] The heat generated by the IGBT module when working is higher than the heat generated by the thin film capacitor. Therefore, the cooling medium first passes through the honeycomb water channel portion 1411 and then passes through the S-shaped water channel portion 1421. The flow direction of the cooling medium is reasonably planned to ensure good heat dissipation effect while reducing heat loss.

[0038] The number of the honeycomb water channel parts 1411 is the same as that of the IGBT module, and the shapes of the two are the same, both are rectangular, thereby increasing the contact area between the two and improving the heat dissipation capacity. Figure 1 The number of the honeycomb water channel sections 1411 is three, and the three honeycomb water channel sections 1411 are connected in series in sequence and arranged compactly side by side, wherein the width of the sub-water channel 143 connected in series with two adjacent honeycomb water channel sections 1411 is smaller than the width of the honeycomb water channel section 1411, and the bottom wall of the honeycomb water channel section 1411 protrudes upward to form a plurality of diversion columns 1412 to divert the cooling medium, thereby improving the turbulence of the cooling medium, increasing the fluidity of the water and the uniformity of cooling, and at the same time extending the flow of the cooling medium in the honeycomb water channel section 1411, and increasing the heat exchange time between the cold zone medium and the IGBT module.

[0039] Preferably, the plurality of diverter columns 1412 are arranged in multiple rows along the length of the honeycomb waterway portion 1411, and the diverter columns 1412 in two adjacent rows are staggered, while ensuring that the spacing between two adjacent diverter columns 1412 is consistent, achieving uniform distribution and preventing local energy loss caused by changes in hydraulic cross-sections. The diverter columns 1412 are hexagonal, and each diverter column 1412 has an edge facing the water inlet direction of the honeycomb waterway portion 1411.

[0040] Continue to refer Figure 1 The S-shaped water channel portion 1421 is arranged in a compact manner in a horizontal direction, a vertical direction, or between the horizontal direction and the vertical direction, so as to pave the capacitor water channel area 142, thereby increasing the contact area between the S-shaped water channel portion 1421 and the film capacitor and improving the heat dissipation performance. The width of the S-shaped water channel portion 1421 is smaller than the width of the honeycomb water channel portion 1411, and a diversion structure can also be added to the S-shaped water channel portion 1421 to further enhance the heat dissipation effect.

[0041] The water inlet and the water outlet of the water channel 140 may be arranged on the same side, specifically located at the side of the honeycomb water channel portion 1411 away from the S-shaped water channel portion 1421 , for easy access to pipelines and management.

[0042] like Figure 1 and Figure 4 As shown, the water channel cover plate 200 is provided with a cover plate boss 210 which cooperates with the honeycomb water channel portion 1411 so that the diverter column 1412 is fixed to the bottom wall of the honeycomb water channel portion 1411 and between the cover plate boss 210 .

[0043] The number of the cover plate bosses 210 is consistent with that of the honeycomb water channel portion 1411, and the shapes of the two are consistent, both of which are rectangular. The height of the cover plate bosses 210 can be 7.5 mm, and each of the cover plate bosses 210 is embedded in the honeycomb water channel portion 1411, so that the diverter column 1412 is fixed to the bottom wall of the honeycomb water channel portion 1411 and between the cover plate bosses 210, which not only achieves better sealing of the water channel 140, but also enhances the stability of the diverter column 1412, ensuring that the diverter column 1412 performs effective convection heat exchange on the cooling, so that the IGBT module cools down faster.

[0044] like Figure 3 As shown, the middle of the cover 120 bulges upward in a manner away from the accommodating cavity 130 to form a middle convex portion 121, and side oblique portions 122 are arranged on both sides of the middle convex portion 121. The height of the middle convex portion 121 is slightly lower, which not only improves the strength of the cover 120, but also improves the aesthetics. Preferably, each of the side oblique portions 122 bulges upward to form at least one side convex portion 123. In one embodiment, each of the side oblique portions 122 is provided with two side convex portions 123, and the two side convex portions 123 are arranged at intervals along the length direction of the cover 120, which ensures the strength of the side oblique portions 122, thereby improving the strength and stability of the cover 120 as a whole.

[0045] refer to Figure 2 and Figure 3 The middle convex portion 121 is directly opposite to the IGBT connection area 11011 and the capacitor connection area 11012. The center of the middle convex portion 121 has a covering concave surface 1211, which can be used to place a nameplate.

[0046] like Figure 3 , Figure 6 and Figure 7 As shown, the heat dissipation sealing structure of the axial flux motor controller further includes a wiring cover plate 300 , the cover plate 120 is provided with a wiring slot 124 , and the wiring cover plate 300 is installed in the wiring slot 124 through an anti-mock component 310 .

[0047] Specifically, the wiring slot 124 is located on one side of the cover 120 in the length direction, and a fool-proofing groove 1241 adapted to the fool-proofing piece 310 is provided in the wiring slot 124. The fool-proofing piece 310 is protruding and formed on the wiring cover 300. The fool-proofing piece 310 and the fool-proofing groove 1241 have the same shape and are both square. The cooperation of the two realizes the fool-proofing effect of installation.

[0048] More specifically, the wiring cover plate 300 can be fixed to the cover 120 by bolts, referring to Figure 3 , Figure 6 and Figure 7 A plurality of wiring slot connecting parts 1242 are arranged around the wiring slot 124, the wiring slot connecting parts 1242 are formed on the cover 120, and threaded holes for screwing bolts are opened on the wiring slot connecting parts 1242, and wiring cover plate through holes 320 opposite to the wiring slot connecting parts 1242 are opened around the wiring cover plate 300, and bolts are used to connect the opposite wiring slot connecting parts 1242 and the wiring cover plate through holes 320 to fix the wiring cover plate 300 on the wiring slot 124 of the cover 120.

[0049] Continue to refer Figure 6 The outer center of the wiring cover plate 300 has a cover plate concave surface 330 for pasting the product serial code.

[0050] refer to Figure 2 and Figure 3 The inner connection surface 1101 is also provided with two grooves 111 for preliminary positioning of the wiring block, the grooves 111 and the capacitor connection area 11012 are located on both sides of the IGBT connection area 11011, and the grooves 111 are directly opposite to the wiring grooves 124 of the cover 120. The installation space of the accommodating cavity 130 is reasonably planned to enable a compact installation arrangement in the accommodating cavity 130 and reduce the overall volume.

[0051] like Figures 1 to 3 As shown, the cover shell includes a side panel 150 connected between the supporting plate 110 and the cover 120, and a side panel injection space 151 for filling sealant is provided on one side of the side panel 150 connected to the cover 120, and the side panel injection space 151 is continuous and arranged around the accommodating cavity 130 so that the cover 120 is bonded and fixed to the side panel 150.

[0052] The side plate 150 and the carrier plate 110 can be connected as one piece, and the side plate 150 can be detachably connected to the cover 120 to form the accommodation cavity 130 defined between the carrier plate 110 and the cover 120 and formed around the side plate 150, so as to facilitate the installation of the IGBT module and thin film capacitor and other components in the accommodation cavity 130, as well as disassembly and maintenance. The side plate 150 and the cover 120 can be fixed by bolts, specifically, the edge of the cover 120 is provided with a plurality of cover connecting parts 125, and the edge of the side plate 150 is provided with a plurality of side plate connecting parts 152, and the side plate connecting parts 152 are located on the side of the side plate 150 close to the cover 120, so that the opposite cover connecting parts 125 and the side plate connecting parts 152 are abutted, and are tied by bolts to achieve the fixing of the side plate 150 and the cover 120.

[0053] In addition, the cover 120 and the side panel 150 are bonded by sealant to improve the sealing between the cover 120 and the side panel 150. Specifically, a side panel injection space 151 for filling with sealant is provided on the side of the side panel 150 connected to the cover 120. The side panel injection space 151 is continuous and arranged around the accommodating cavity 130, specifically, it is located between the inner wall of the side panel 150 and the side panel connecting portion 152, so that sealant is provided around the accommodating cavity 130 and between the cover 120, thereby enhancing the sealing and meeting the IP67 and IP68 dustproof and waterproof standard levels.

[0054] like Figure 1 and Figure 2 As shown, a plurality of mounting feet 155 are respectively provided on both sides of the side plate 150 for fixing the controller. The mounting feet 155 may be L-shaped and thickened to improve the structure and connection strength.

[0055] like Figure 1 and Figure 4 As shown, the bearing plate 110 and the waterway cover plate 200 can also be sealed and fixed by bolts and sealant. Specifically, a plurality of bearing plate threaded holes 11021 are provided on the outer molding surface 1102 of the bearing plate 110, and the plurality of bearing plate threaded holes 11021 surround the waterway 140. The waterway cover plate 200 is provided with cover plate through holes 220 opposite to the bearing plate threaded holes 11021. Bolts are used to connect the bearing plate threaded holes 11021 and the cover plate through holes 220 opposite to each other, so as to achieve the fixing of the bearing plate 110 and the waterway cover plate 200.

[0056] Furthermore, the water channel 140 has a water channel bottom wall 1401 and water channel side walls 1402 connecting the two sides of the water channel bottom wall 1401, and a side wall glue injection space 1403 is provided on the side of the water channel side wall 1402 facing the water channel cover plate 200, so that the water channel cover plate 200 is bonded and fixed to the carrier plate 110. The side wall glue injection space 1403 can be presented on the water channel side wall 1402 in the form of a chamfer, wherein the chamfer angle can be about 30°, and the side wall glue injection space 1403 is continuously presented on the water channel side wall 1402 of the water channel 140, so that the surrounding of the water channel 140 and the water channel cover plate 200 are coated with sealant, effectively preventing the cooling medium from leaking, thereby improving the sealing performance.

[0057] Furthermore, the bearing plate 110 and the waterway cover plate 200 can be positioned and installed by positioning pins to improve the installation progress. Figure 1The carrier plate 110 is provided with two carrier plate positioning holes 11022 fixed by the positioning pins, and the two carrier plate positioning holes 11022 are arranged diagonally on the carrier plate 110 .

[0058] like Figure 1 , Figure 2 and Figure 5 As shown, the water channel cover plate 200 and / or the side plate 150 are provided with external reinforcing ribs to improve the structural strength and prevent deformation, thereby enhancing the supporting strength and extending the service life.

[0059] refer to Figure 1 A plurality of side panel reinforcing ribs 153 are disposed on the outer side of the side panel 150 . The side panel reinforcing ribs 153 are vertically and spaced apart to enhance the strength of the side panel 150 .

[0060] refer to Figure 4 and Figure 5 , a plurality of waterway cover plate reinforcement ribs 230 are arranged alternately on the side of the waterway cover plate 200 away from the cover plate boss 210, so as to improve the strength and rigidity of the waterway cover plate 200, improve the sealing ability of the waterway cover plate 200 to the waterway 140, and prevent the deformation of the waterway cover plate from causing leakage of the cooling medium. Preferably, a plurality of through holes are arranged on the waterway cover plate 200, including the cover plate through holes 220, positioning holes, etc., and a waterway cover plate reinforcement rib 230 is connected between two adjacent through holes to increase the strength and rigidity of the waterway cover plate 200.

[0061] The external side plate reinforcement ribs 153 and the water channel cover plate reinforcement ribs 230 can directly lead the heat to the outside, and play a certain heat dissipation function. Of course, the heat dissipation ribs 154 can be directly arranged on the outside of the side plate 150 to achieve the heat transfer value of the components in the accommodating cavity 130 to the outside. The heat dissipation ribs 154 are arranged relative to the IGBT connection area 11011. Figure 2 Since the IGBT module installed on the IGBT connection area 11011 generates the highest amount of heat, the heat is directly transferred to the outside through the relatively arranged heat dissipation ribs 154, and cooperates with the water channel 140 to further improve the heat dissipation capacity. The heat dissipation ribs 154 may be in a tic-tac-toe shape.

[0062] The bearing plate 110 and the cover 120 can be formed by high pressure casting process, which can improve production efficiency, improve flatness and surface roughness, and ensure dimensional accuracy. Specifically, they can be cast by ADC12 aluminum alloy material. Similarly, the waterway cover plate 200 and the wiring cover plate 300 can also be cast by ADC12 aluminum alloy material, which can ensure uniform wall thickness, small volume, light weight, and save production material costs.

[0063] like Figures 1 to 5 As shown, the bearing plate 110, the cover 120, the side plate 150, the water channel cover plate 200 and the wiring cover plate 300 are all rectangular, but are not limited thereto. Rounded corner transitions may also be used, for example, the four corners of the rectangular side plate 150 are rounded, which can extend the service life of the casting mold and save the cost of the casting mold.

[0064] In summary, the carrier plate 110 is used to carry components such as IGBT modules and thin film capacitors, so that the heat generated by them is directly transferred through the carrier plate 110, and the heat is directly dissipated through the water channel 140 outside the carrier plate 110, which not only improves the heat dissipation performance, but also effectively prevents the cooling medium in the water channel 140 from directly contacting the components, thereby causing leakage of the cooling medium and short circuit of the components, effectively improving the sealing and waterproof performance, and reasonably utilizing the spatial layout, so that the overall structure is more compact, achieving advantages such as lightweight and small volume, and reducing the demand for occupying installation space. In addition, the external water channel 140 is easy to manage and maintain, and the water channel includes the honeycomb water channel portion 1411 opposite to the IGBT module, and its bottom wall protrudes upward to form a plurality of diverter columns 1412 to divert the cooling medium, improve the turbulence of the cooling medium, increase the fluidity of the water and the uniformity of cooling, thereby improving the heat dissipation capacity. The side plate 150 and the cover 120, as well as the carrier plate 110 and the water channel cover plate 200 can be filled with sealant to achieve advantages such as waterproof sealing. The side panels 150 and the waterway cover plate 200 are provided with external reinforcing ribs to improve the structural strength and rigidity and prevent deformation, thereby enhancing the supporting strength and extending the service life.

[0065] The embodiments described above are only used to illustrate the technical ideas and features of the present invention, and their purpose is to enable technicians in this field to understand the contents of the present invention and implement them accordingly. The patent scope of the present invention cannot be limited only by this embodiment, that is, any equivalent changes or modifications made according to the spirit disclosed by the present invention still fall within the patent scope of the present invention.

Claims

1. A heat dissipation sealing structure of an axial flux motor controller, characterized in that: include: A housing (100), the housing (100) comprising a carrying plate (110) and a cover (120), and a receiving cavity (130) defined between the carrying plate (110) and the cover (120), the carrying plate (110) being provided with an external water channel (140) in a manner facing away from the receiving cavity (130); a waterway cover plate (200), the waterway cover plate (200) being externally disposed and connected to the carrying plate (110) to close the waterway (140); The water channel (140) has a water channel bottom wall (1401) and water channel side walls (1402) connected to both sides of the water channel bottom wall (1401); the water channel side wall (1402) is provided with a chamfer on one side facing the water channel cover plate (200); when the water channel cover plate (200) abuts against the outer molding surface (1102) of the bearing plate (110), a side wall glue injection space (1403) is formed between the chamfer and the water channel cover plate (200); and the side wall glue injection space (1403) is communicated with the interior of the water channel (140); The water channel (140) comprises an IGBT water channel area (141) opposite to the IGBT connection area (11011); the water channel cover plate (200) is provided with a cover plate boss (210) matched with the IGBT water channel area (141); two ends of the diversion column (1412) in the IGBT water channel area (141) respectively abut against the cover plate boss (210) and the bottom wall of the IGBT water channel area (141); The middle of the cover (120) protrudes upward in a manner away from the accommodating cavity (130) to form a middle convex portion (121), and side inclined portions (122) are arranged on both sides of the middle convex portion (121), and each of the side inclined portions (122) protrudes upward to form at least one side convex portion (123).

2. The heat dissipation sealing structure of the axial flux motor controller according to claim 1, characterized in that: The carrier plate (110) has an inner connecting surface (1101) and an outer molding surface (1102) opposite to each other, the inner connecting surface (1101) being divided into an IGBT connecting area (11011) and a capacitor connecting area (11012), the outer molding surface (1102) being recessed toward the inner connecting surface (1101) to form the water channel (140), and the water channel (140) further comprises a capacitor water channel area (142) opposite to the capacitor connecting area (11012).

3. The heat dissipation sealing structure of the axial flux motor controller according to claim 2, characterized in that: The IGBT water channel area (141) includes at least one honeycomb water channel portion (1411), and the capacitor water channel area (142) includes an S-shaped water channel portion (1421), and the S-shaped water channel portion (1421) is connected to the honeycomb water channel portion (1411) so that the cooling medium passes from the honeycomb water channel portion (1411) to the S-shaped water channel portion (1421).

4. The heat dissipation sealing structure of the axial flux motor controller according to claim 3, characterized in that: The bottom wall of the honeycomb water channel portion (1411) protrudes upward to form a plurality of evenly arranged diverter columns (1412), and the cover plate boss (210) of the water channel cover plate (200) cooperates with the honeycomb water channel portion (1411) so that the diverter columns (1412) are fixed between the bottom wall of the honeycomb water channel portion (1411) and the cover plate boss (210).

5. The heat dissipation sealing structure of the axial flux motor controller according to claim 1, characterized in that: It also includes a wiring cover plate (300), the cover plate (120) is provided with a wiring slot (124), and the wiring cover plate (300) is installed in the wiring slot (124) through an anti-mute component (310).

6. The heat dissipation sealing structure of the axial flux motor controller according to claim 1, characterized in that: The cover shell comprises a side plate (150) connected between the bearing plate (110) and the cover (120); a side plate glue injection space (151) for filling with sealant is provided on one side of the side plate (150) connected to the cover (120); the side plate glue injection space (151) is continuous and arranged around the accommodating cavity (130) so that the cover (120) is bonded and fixed to the side plate (150).

7. The heat dissipation sealing structure of the axial flux motor controller according to claim 6, characterized in that: The water channel cover plate (200) and / or the side plate (150) are externally provided with reinforcing ribs and heat dissipation ribs (154).

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