Tiled display

Abstract

A tiled display is disclosed. The tiled display includes a first display device and a second display device disposed adjacent to each other, each of the first display device and the second display device including a display area having a light emitting area and a seam between adjacent display areas in the display area. Each of the first display device and the second display device includes a first base portion in the display area, a first support layer on the first base portion in the display area and in the seam, a display layer on the first support layer in the display area and the seam, a second support layer on the display layer in the display area and the seam, and a second base portion on the second support layer in the display area. The first support layer of the second display device is disposed on the second support layer of the first display device in the seam.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0132508 filed on October 14, 2020, which is incorporated herein by reference for all purposes as if fully set forth herein. TECHNICAL FIELD

[0002] Embodiments / Implementations of the invention relate generally to a tiled display. BACKGROUND

[0003] With the development of modern information society, various demands for display devices are increasing. For example, various electronic devices such as smart phones, digital cameras, laptop computers, navigation devices, and smart TVs are employing display devices. The display device can be a flat panel display device such as a liquid crystal display device, a field emission display device, and an organic light emitting display device. Among these flat panel display devices, the light emitting display device includes a light emitting element capable of emitting light by itself, so that each of the pixels of the display panel can emit light by itself. Accordingly, the light emitting display device can display an image without using a backlight unit that supplies light to the display panel.

[0004] For a display device having a large screen, a large number of pixels are disposed on the screen, so that the defect rate of the light emitting element can increase, while the productivity or reliability can deteriorate. To overcome these problems, a tiled display can provide a large screen by connecting a plurality of display devices having a relatively small size. Because there is a non-display area or a bezel area between the plurality of display devices adjacent to each other, such a tiled display can include a boundary between the plurality of display devices, which is referred to as a seam. When a single image is displayed on a full screen, such a boundary between the display devices causes a visible seam, hindering a viewer from being immersed in the image, thereby causing a problem of providing a less realistic image to a user.

[0005] The above information disclosed in this BACKGROUND section is only for the understanding of the background of the inventive concepts, and, thus, it can contain information that does not constitute prior art. SUMMARY

[0006] Aspects of the disclosure provide a tiled display that eliminates a visible seam between a plurality of display devices in a manner that prevents a boundary or a non-display area between the display devices from being recognized, allowing a viewer to be immersed in a displayed image without being hindered by an ugly boundary between parts of the image.

[0007] It should be noted that aspects of the disclosure are not limited to the above-described aspects, and other aspects of the disclosure will be apparent to those skilled in the art from the following description.

[0008] According to an embodiment, a tiled display includes first and second display devices disposed adjacent to each other, each of the first and second display devices including a display area having a light emitting area and a seam between adjacent display areas in the display area. Each of the first and second display devices includes a first base portion in the display area, a first support layer on the first base portion in the display area and in the seam, a display layer on the first support layer in the display area and the seam, a second support layer on the display layer in the display area and the seam, and a second base portion on the second support layer in the display area. The first support layer of the second display device is disposed on the second support layer of the first display device in the seam.

[0009] The tiled display can further include an adhesive film attaching a lower surface of the first support layer of the second display device to an upper surface of the second support layer of the first display device in the seam.

[0010] A side surface of the first support layer and / or a side surface of the second support layer of the first display device can be in contact with a side surface of the first base portion of the second display device.

[0011] A side surface of the first support layer and / or a side surface of the second support layer of the second display device can be in contact with a side surface of the second base portion of the first display device.

[0012] The display layer can include a thin film transistor layer on the first support layer and including a plurality of thin film transistors, a light emitting element layer on the thin film transistor layer and including a plurality of light emitting elements, a wavelength conversion layer on the light emitting element layer and including wavelength conversion cells respectively corresponding to the light emitting areas, and a color filter layer on the wavelength conversion layer and including color filters respectively corresponding to the light emitting areas.

[0013] The display layer can further include a filler layer between the light emitting element layer and the wavelength conversion layer, and a sealing member in the seam and surrounding the filler layer in a plan view.

[0014] The sealing member of the first display device can face a side surface of the first base portion of the second display device. The sealing member of the second display device can face a side surface of the second base portion of the first display device.

[0015] The tiled display further includes a gate driver electrically connected to the plurality of thin film transistors in the display area.

[0016] Each of the first and second base portions can include a glass material. Each of the first and second support layers can include polyimide (PI).

[0017] A thickness of the first and / or second base portion can be greater than a thickness of the display layer.

[0018] According to an embodiment, the tiled display includes first and second display devices disposed adjacent to each other, each of the first and second display devices including a display area having a light emitting area and a seam between adjacent display areas in the display area. Each of the first and second display devices includes a first base portion in the display area, a first support layer on the first base portion in the display area and in the seam, a display layer on the first support layer in the display area and the seam, and a second base portion disposed on the display layer in the display area and the seam. The first support layer of the first display device is disposed on the second base portion of the second display device in the seam.

[0019] The tiled display can further include an adhesive film attaching a lower surface of the first support layer of the first display device to an upper surface of the second base portion of the second display device in the seam.

[0020] Each of the display layer of the first display device and the display layer of the second display device can be laminated with the adhesive film in the thickness direction in the seam.

[0021] A side surface of the first base portion of the first display device can be in contact with a side surface of the second base portion of the second display device.

[0022] According to an embodiment, the tiled display includes first and second display devices including first and second display areas having light emitting areas and a seam between the first and second display areas, respectively. The first display device includes a first base portion in the first display area, a first support layer on the first base portion in the first display area and in the seam, and a display layer on the first support layer in the first display area and the seam. The second display device includes a first base portion in the second display area and in the seam, a first support layer on the first base portion in the second display area and the seam, and a display layer on the first support layer in the second display area and the seam.

[0023] The first display device can further include a second support layer on the display layer in the first display area and the seam, and a second base portion on the second support layer in the first display area and the seam. The second display device can further include a second support layer on the display layer in the second display area and the seam, and a second base portion on the second support layer in the second display area.

[0024] The first support layer of the first display device can be disposed on the second support layer of the second display device in the seam.

[0025] The side surface of the first support layer and / or the side surface of the second support layer of the first display apparatus can be in contact with the side surface of the second base portion of the second display apparatus.

[0026] The side surface of the first support layer and / or the side surface of the second support layer of the second display apparatus can be in contact with the side surface of the first base portion of the first display apparatus.

[0027] The side surface of the first base portion of the first display apparatus can be in contact with the side surface of the first base portion of the second display apparatus. The side surface of the second base portion of the first display apparatus can be in contact with the side surface of the second base portion of the second display apparatus.

[0028] According to one or more embodiments, the non-display areas of the adjacent display apparatuses of the tiled display are overlaid with each other in the seams between the display areas, so that the space between the display apparatuses can be reduced. Accordingly, the tiled display can allow a viewer to be immersed into an image by eliminating the visible seams between the display apparatuses by means of preventing the boundaries or seams between the display apparatuses from being perceived by the viewer.

[0029] It should be noted that the effects of the present disclosure are not limited to those described above, and other effects of the present disclosure will be apparent to those skilled in the art from consideration of the description below.

[0030] Additional features of the inventive concept will be set forth in the description below, and in part will be apparent from the description, or can be learned by practice of the inventive concept.

[0031] It is to be understood that both the foregoing general description and the following detailed description are explanatory and interpretative and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF DRAWINGS

[0032] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the inventive concept.

[0033] Figure 1 is a plan view showing a tiled display according to an embodiment, which has been constructed in accordance with the principles of the present application.

[0034] Figure 2 is a sectional view taken along the line I-I' of Figure 1 .

[0035] Figure 3 is a sectional view taken along the line II-II' of Figure 1 .

[0036] Figure 4 is a sectional view taken along the line III-III' of Figure 1is another example of a cross-sectional view taken along line III-III' of

[0037] Figure 5 and Figure 6 are cross-sectional views illustrating a process of manufacturing a tiled display of Figure 4 .

[0038] Figure 7 is another example of a cross-sectional view taken along line III-III' of Figure 1 .

[0039] Figure 8 and Figure 9 are cross-sectional views illustrating a process of manufacturing a tiled display of Figure 7 .

[0040] Figure 10 is yet another example of a cross-sectional view taken along line III-III' of Figure 1 .

[0041] Figure 11 and Figure 12 are cross-sectional views illustrating a process of manufacturing a tiled display of Figure 10 .

[0042] Figure 13 is a plan view illustrating a tiled display according to another embodiment.

[0043] Figure 14 is an example of a cross-sectional view taken along line IV-IV' of Figure 13 .

[0044] Figure 15 is another example of a cross-sectional view taken along line IV-IV' of Figure 13 .

[0045] Figure 16 is yet another example of a cross-sectional view taken along line IV-IV' of Figure 13 . DETAILED DESCRIPTION

[0046] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable terms used to refer to a device or method employing one or more of the inventive concepts disclosed herein. However, it will be apparent to one skilled in the art that various embodiments can be practiced without these specific details; that in other instances, multiple particulars have been presented in a single representation where specific details are omitted in interest of clarity; and that the scope of the inventive concepts is defined by the appended claims and their equivalents. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the various embodiments. Furthermore, various embodiments can be different but need not be mutually exclusive. For example, specific shapes, configurations, and characteristics of one embodiment can be used or implemented in another embodiment without departing from the inventive concepts.

[0047] Unless otherwise indicated, embodiments shown are to be understood as providing features in which some variations of ways in which the inventive concepts can be practiced are provided in detail. Thus, unless otherwise indicated, features, components, modules, layers, films, panels, regions, and / or aspects, etc. (individually or collectively referred to as "elements") of various embodiments can be additionally combined, separated, interchanged, rearranged, and / or rearranged without departing from the inventive concepts.

[0048] The use of cross-hatching and / or shading in the drawings is generally provided to more particularly indicate only one of multiple identical or similar elements. As such, no preference or requirement is hereby made to any particular material, material property, dimension, ratio, commonality between illustrated elements, and / or any other characteristic, attribute, property, etc. of an element as a result of the presence or absence of cross-hatching or shading. In addition, in the drawings, the size and relative sizes of elements and / or regions can be exaggerated for clarity and / or descriptive purposes. When embodiments can be practiced differently, a particular order in which processes are described can be performed differently. For example, two consecutively described processes can be performed at substantially the same time or in an order opposite to that described. Moreover, like reference numerals designate like elements.

[0049] When an element or layer is referred to as being “on”, “connected to”, or “coupled to” another element or layer, it can be directly on, connected, or coupled to the other element or layer, or intervening elements or layers can be present. In contrast, when an element or layer is referred to as being “directly on”, “directly connected to”, or “directly coupled to” another element or layer, there are no intervening elements or layers present. In this regard, the term “connected” can refer to physical or electrical and / or fluid connection, with or without intervening elements. Also, the D1 axis, the D2 axis, and the D3 axis are not limited to the three axes of a rectangular coordinate system such as the x-axis, the y-axis, and the z-axis, and can be interpreted in a broader sense. For example, the D1 axis, the D2 axis, and the D3 axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of the present disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted to include only X, only Y, only Z, or any combination of two or more of X, Y, and Z (such as, for example, XYZ, XYY, YZ, and ZZ). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0050] Although the terms “first”, “second”, etc. can be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings disclosed.

[0051] Spatially relative terms (such as “beneath”, “below”, “lower”, “under”, “above”, “upper”, “on”, “over”, “higher”, “side” (as in “sidewall”), and the like) can be used herein for the purpose of describing the orientation of one element relative to another element as illustrated in the figures. Such relative terms include different orientations of the device in use, operation, and / or manufacture than depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. The terms “below” and “under” can, therefore, encompass both an orientation of above and below. Moreover, the device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0052] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. Furthermore, the terms “comprising,” “including,” and / or variations thereof, when used in this specification, describe the presence of the stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than terms of degree, thus explaining the inherent biases in measured, calculated, and / or provided values ​​that would be recognized by those skilled in the art.

[0053] Various embodiments are described herein with reference to sectional views and / or exploded views of schematic diagrams illustrating idealized embodiments and / or intermediate structures. Thus, variations in the shapes shown in the drawings due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the embodiments disclosed herein should not be construed as limited to the specific shapes shown in the drawings, but will include deviations in shape due to, for example, manufacturing processes. In this way, the areas shown in the drawings can be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, thus not intended to be limiting.

[0054] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formalized sense, unless expressly defined herein.

[0055] Figure 1 This is a plan view showing a splicing display constructed according to an embodiment based on the principles of the invention.

[0056] Reference Figure 1 The video wall display TD may include multiple display devices 10. The multiple display devices 10 may be arranged in, but is not limited to, a grid pattern. The multiple display devices 10 may be connected in a first direction (X-axis direction) or a second direction (Y-axis direction), and the video wall display TD may have a specific shape. For example, the multiple display devices 10 may all have the same size. However, it will be understood that the embodiments described herein are not limited to this. For another example, the multiple display devices 10 may have different sizes (i.e., in...). Figure 1In the middle, the display apparatus 10-1 can have a size different from that of the display apparatus 10-2.

[0057] Each of the plurality of display apparatuses 10 can have a rectangular shape including a longer side and a shorter side. The display apparatuses 10 can be arranged such that the longer sides or the shorter sides of the display apparatuses 10 are connected to each other. Some of the display apparatuses 10 can be disposed on edges of the tiled display TD to form one side of the tiled display TD. Some other display apparatuses 10 can be disposed at corners of the tiled display TD and can form two adjacent sides of the tiled display TD. Still some other display apparatuses 10 can be disposed on inner sides of the tiled display TD and can be surrounded by other display apparatuses 10.

[0058] Each of the display apparatuses 10 can include a display area DA and a non-display area NDA. The display area DA can include a plurality of pixels to display an image. The non-display area NDA can be disposed around the display area DA to surround the display area DA and can not display an image.

[0059] The tiled display TD can have, without limitation, a substantially planar shape. The tiled display TD can have a three-dimensional shape to provide a three-dimensional experience to a viewer. For example, when the tiled display TD has a three-dimensional shape, at least some of the display apparatuses 10 can have a curved shape. For another example, the display apparatuses 10 can have a flat shape and are connected to each other at a predetermined angle such that the tiled display TD can have a three-dimensional shape.

[0060] The tiled display TD can include seams SM positioned between the plurality of display areas DA. The tiled display TD can be formed by connecting the non-display areas NDA of the adjacent display apparatuses 10 to each other. The plurality of display apparatuses 10 can be connected to each other by a bonding member or an adhesive member. The non-display areas NDA of the adjacent display apparatuses 10 can be stacked on each other in a thickness direction (or a Z-axis direction) in each of the seams SM. Accordingly, the display areas DA of the display apparatuses 10 can be very close to each other such that the seams SM between the display areas DA of the display apparatuses 10 are not identified by a viewer. Reflectivity of external light at the display areas DA of the plurality of display apparatuses 10 can be substantially equal to reflectivity of external light at the seams SM between the display areas DA of the display apparatuses 10. Accordingly, the seams SM between the display areas DA of the display apparatuses 10 of the tiled display TD can be prevented from being identified by a viewer, thereby eliminating visible seams SM and allowing a viewer to be immersed in a displayed image without being hindered by an ugly seam between adjacent display areas DA (i.e., between the display area DA of the display apparatus 10-1 and the display area DA of the display apparatus 10-2).

[0061] The tiled display TD can include first to fourth display devices 10-1 to 10-4. The number relationship and the coupling relationship of the display devices 10 are not limited by the embodiments described herein. The number of the display devices 10 can be determined according to the size of the display devices 10 and the size of the tiled display TD. Figure 1

[0062] Each of the display devices 10 can include a plurality of pixels arranged in rows and columns in a display area DA. Each of the plurality of pixels can include a light emitting area LA defined by a pixel defining layer or a bank, and can emit light having a certain peak wavelength through the light emitting area LA. For example, the display area DA of each of the display devices 10 can include first to third light emitting areas LA1, LA2, and LA3. In each of the first to third light emitting areas LA1, LA2, LA3, light generated by a light emitting element of the display device 10 exits from the display device 10.

[0063] The first to third light emitting areas LA1, LA2, and LA3 can emit light having a predetermined peak wavelength to the outside of the display device 10. The first light emitting area LA1 can emit light of a first color, the second light emitting area LA2 can emit light of a second color, and the third light emitting area LA3 can emit light of a third color. For example, the light of the first color can be red light having a peak wavelength in the range of 610 nm to 650 nm, the light of the second color can be green light having a peak wavelength in the range of 510 nm to 550 nm, and the light of the third color can be blue light having a peak wavelength in the range of 440 nm to 480 nm. However, it will be understood that the embodiments described herein are not limited thereto.

[0064] The first to third light emitting areas LA1, LA2, and LA3 can be repeatedly and sequentially arranged along a first direction (X-axis direction) of the display area DA. For example, the area of the first light emitting area LA1 can be greater than the area of the second light emitting area LA2, and the area of the second light emitting area LA2 can be greater than the area of the third light emitting area LA3. For another example, the area of the first light emitting area LA1, the area of the second light emitting area LA2, and the area of the third light emitting area LA3 can all have substantially equal sizes.

[0065] The display area DA of the display device 10 can include a light blocking area BA surrounding the plurality of light emitting areas LA. The light blocking area BA can prevent mixing of different colors of light emitted from the first to third light emitting areas LA1, LA2, and LA3.

[0066] ​The flexible film FPCB can be disposed in the non-display area NDA of each of the display apparatuses 10. The flexible film FPCB can be attached to a pad disposed on the base portion of each of the plurality of display apparatuses 10. One side of the flexible film FPCB can be connected to the pad, and the other side of the flexible film FPCB can be connected to a source circuit board (not shown). The flexible film FPCB can transmit a signal from the source driver SIC to the display apparatus 10.

[0067] The source driver SIC can be disposed on the flexible film FPCB, respectively, and can be connected to the plurality of pixels of the display apparatus 10. For example, the source driver SIC can be an integrated circuit (IC). The source driver SIC can convert digital video data into an analog data voltage based on a source control signal from a timing controller, and can supply the analog data voltage to a data line of the display area DA through the flexible film FPCB.

[0068] The flexible film FPCB can be disposed on the non-display area NDA disposed along the edges of the tiled display TD. For example, the flexible film FPCB can be disposed on the upper side of the non-display areas NDA of the first display apparatus 10-1 and the second display apparatus 10-2 and on the lower side of the non-display areas NDA of the third display apparatus 10-3 and the fourth display apparatus 10-4. However, it will be understood that the embodiments described herein are not limited thereto.

[0069] Figure 2 is a cross-sectional view taken along a line I-I' of Figure 1 .

[0070] Referring to Figure 2 , the display area DA of the display apparatus 10 can include first to third light emitting areas LA1, LA2, and LA3. In each of the first to third light emitting areas LA1, LA2, LA3, light generated by the light emitting diode ED of the display apparatus 10 exits from the display apparatus 10.

[0071] The display apparatus 10 can include a first base portion SUB1, a first support layer PI1, a display layer DPL, a second support layer PI2, and a second base portion SUB2. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL.

[0072] The first base portion SUB1 can support and protect the display apparatus 10. For example, the first base portion SUB1 can be, but is not limited to, a glass substrate including a glass material.

[0073] A first support layer PI1 can be disposed on the first base portion SUB1 to support a surface of the display layer DPL. The first support layer PI1 can be deposited or coated on the first base portion SUB1. For example, the first support layer PI1 can include, but is not limited to, polyimide (PI).

[0074] A thin film transistor layer TFTL can be disposed on the first support layer PI1. The thin film transistor layer TFTL can include a buffer layer BF, a thin film transistor TFT, a gate insulator GI, an interlayer dielectric layer ILD, a connection electrode CNE, a first passivation layer PAS1, and a first planarization layer OC1.

[0075] The buffer layer BF can be disposed on the first support layer PT1. The buffer layer BF can include an inorganic material capable of preventing air or moisture from penetrating. For example, the buffer layer BF can include a plurality of inorganic films stacked with each other.

[0076] The thin film transistor TFT can be disposed on the buffer layer BF in the display area DA and can form a pixel circuit of each of a plurality of pixels. For example, the thin film transistor TFT can be a driving transistor or a switching transistor of the pixel circuit. The thin film transistor TFT can include a semiconductor region ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0077] The semiconductor region ACT, the source electrode SE, and the drain electrode DE can be disposed on the buffer layer BF. The semiconductor region ACT can be superposed on the gate electrode GE in a thickness direction and can be insulated from the gate electrode GE by the gate insulator GI. The source electrode SE and the drain electrode DE can be formed by converting a material of the semiconductor region ACT into a conductor.

[0078] The gate electrode GE can be disposed on the gate insulator GI. The gate electrode GE can be superposed on the semiconductor region ACT, and the gate insulator GI is interposed between the gate electrode GE and the semiconductor region ACT.

[0079] The gate insulator GI can be disposed on the semiconductor region ACT, the source electrode SE, and the drain electrode DE. For example, the gate insulator GI can cover the semiconductor region ACT, the source electrode SE, the drain electrode DE, and the buffer layer BF and can insulate the semiconductor region ACT from the gate electrode GE. The gate insulator GI can include a contact hole through which the connection electrode CNE passes.

[0080] The interlayer dielectric layer ILD can be disposed over the gate electrode GE. For example, the interlayer dielectric layer ILD can include a contact hole through which the connection electrode CNE passes. The contact hole of the interlayer dielectric layer ILD can be connected to the contact hole of the gate insulator GI.

[0081] The connection electrode CNE can be disposed on the interlayer dielectric layer ILD. The connection electrode CNE can connect the drain electrode DE of the thin film transistor TFT with the first electrode AE of the light emitting element. The connection electrode CNE can contact the drain electrode DE through a contact hole formed in the gate insulator GI and the interlayer dielectric layer ILD.

[0082] The first passivation layer PAS1 can be disposed over the connection electrode CNE to protect the thin film transistor TFT. For example, the first passivation layer PAS1 can include a contact hole through which the first electrode AE of the light emitting element passes.

[0083] The first planarization layer OC1 can be disposed on the first passivation layer PAS1 to provide a planar surface over the thin film transistor layer TFTL. For example, the first planarization layer OC1 can include a contact hole through which the first electrode AE of the light emitting element passes. The contact hole in the first planarization layer OC1 can be connected to the contact hole in the first passivation layer PAS1. The first planarization layer OC1 can include an organic material.

[0084] The thin film transistor layer TFTL can further include a gate driver GIC disposed on the buffer layer BF in the non-display area NDA. The gate driver GIC can be connected to the thin film transistors TFT of a plurality of pixels. The gate driver GIC can include at least one thin film transistor TFT to form a gate driving circuit. The thin film transistors TFT of the gate driver GIC can be disposed on the same layer as the thin film transistors TFT of the pixels, but embodiments described herein are not limited thereto.

[0085] For another example, the gate driver GIC of the thin film transistor layer TFTL can be disposed in the display area DA. When the display device 10 includes the gate driver GIC disposed in the display area DA, the non-display area NDA of the display device 10 can be reduced.

[0086] The light emitting element layer EML can include a light emitting element, a first bank BNK1, a second bank BNK2, and a second passivation layer PAS2.

[0087] The light emitting element can be disposed on the thin film transistor layer TFTL. The light emitting element can include a first electrode AE, a second electrode CE, and a light emitting diode ED.

[0088] The first electrode AE can be disposed on the first planarization layer OC1. For example, the first electrode AE can be disposed on the first bank BNK1 disposed on the first planarization layer OC1 to cover the first bank BNK1. The first electrode AE can be disposed to overlap each of the first to third light emitting areas LA1, LA2, and LA3 defined by the second bank BNK2. The first electrode AE can be connected to a drain electrode DE of a thin film transistor TFT. The first electrode AE can be, but is not limited to, an anode electrode of a light emitting element.

[0089] The second electrode CE can be disposed on the first planarization layer OC1 such that the second electrode CE is spaced apart from the first electrode AE. For example, the second electrode CE can be disposed on the first bank BNK1 disposed on the first planarization layer OC1 to cover the first bank BNK1. The second electrode CE can be disposed to overlap each of the first to third light emitting areas LA1, LA2, and LA3 defined by the second bank BNK2. For example, the second electrode CE can receive a common voltage applied to all pixels. The second electrode CE can be, but is not limited to, a cathode electrode of a light emitting element.

[0090] A light emitting diode ED can be disposed between the first electrode AE and the second electrode CE over the first planarization layer OC1. The light emitting diode ED can be disposed on an insulating layer covering a portion of the first electrode AE and a portion of the second electrode CE. One end of the light emitting diode ED can be connected to the first electrode AE, and the other end of the light emitting diode ED can be connected to the second electrode CE. For example, a plurality of light emitting diodes ED can include active layers having the same material, such that they can emit light in the same wavelength range or light of the same color. Light emitted from the first to third light emitting areas LA1, LA2, and LA3, respectively, can have the same color. For example, the light emitting diode ED can emit light of a third color or blue light having a peak wavelength in a range of 440 nm to 480 nm. Accordingly, the light emitting element layer EML can emit light of a third color or blue light.

[0091] The light emitting diode ED can have a size of micrometers or nanometers and can be an inorganic light emitting diode including an inorganic material. The inorganic light emitting diode can be aligned between two electrodes facing each other by an electric field formed in a specific direction between the two electrodes.

[0092] As another example, the light emitting element can include an organic light emitting diode including an organic material. The organic light emitting diode can emit light when holes and electrons recombine in an organic emission layer by a voltage applied to each of a first electrode and a second electrode of the light emitting element.

[0093] A second bank BNK2 can be disposed on the first planarization layer OC1 to define the first to third light emitting areas LA1, LA2, and LA3. For example, the second bank BNK2 can surround each of the first to third light emitting areas LA1, LA2, and LA3. However, it will be understood that embodiments described herein are not limited thereto. The second bank BNK2 can separate and insulate the first or second electrode AE or CE of each of the plurality of light emitting elements. The second bank BNK2 can be disposed in each of the light blocking areas BA.

[0094] A second passivation layer PAS2 can be disposed on the light emitting elements and the second bank BNK2. The second passivation layer PAS2 can cover the plurality of light emitting elements to protect the plurality of light emitting elements. The second passivation layer PAS2 can prevent impurities such as moisture and air from penetrating from the outside, thereby preventing damage to the plurality of light emitting elements.

[0095] A filler layer FIL can be used to fill a space between the light emitting element layer EML and the wavelength conversion layer WLCL, and can be surrounded by a sealing member AM. For example, the filler layer FIL can be made of an organic material and can transmit light. The filler layer FIL can be made of, but is not limited to, a silicon-based organic material, an epoxy-based organic material, or the like. For another example, the filler layer FIL can be removed.

[0096] The sealing member AM can be interposed between an edge of the first substrate portion SUB1 and an edge of the second substrate portion SUB2 in the non-display area NDA. The sealing member AM can be disposed in the non-display area NDA along the first substrate portion SUB1 and the second substrate portion SUB2 to seal the filler layer FIL. The first substrate portion SUB1 and the second substrate portion SUB2 can be bonded to each other by the sealing member AM. For example, the sealing member AM can include an organic material. The sealing member AM can be made of, but is not limited to, an epoxy resin.

[0097] The wavelength conversion layer WLCL can include a second light blocking member BK2, a first wavelength conversion unit WLC1, a second wavelength conversion unit WLC2, a light transmission unit LTU, and a second cap layer CAP2.

[0098] The second light blocking member BK2 can be disposed on the second cap layer CAP2 in the light blocking area BA. The second light blocking member BK2 can be superposed on the second bank BNK2 in the thickness direction. The second light blocking member BK2 can block transmission of light. The second light blocking member BK2 can improve a color gamut of the display device 10 by preventing light from intruding and mixing between the first to third light emitting areas LA1, LA2, and LA3. The second light blocking member BK2 can be arranged in a lattice shape on a plane that surrounds the first to third light emitting areas LA1, LA2, and LA3.

[0099] The second light-blocking member BK2 can include an organic light-blocking material and a lyophobic component. For example, the second light-blocking member BK2 can be made of a black organic material including a lyophobic component. The second light-blocking member BK2 can be formed via a coating process and an exposure process for an organic light-blocking material including a lyophobic component or the like.

[0100] The first wavelength conversion unit WLC1 can be disposed in the first light emitting area LA1 on the second cap layer CAP2. The first wavelength conversion unit WLC1 can be surrounded by the second light-blocking member BK2. The first wavelength conversion unit WLC1 can include a first base resin BS1, a first scatterer SCT1, and a first wavelength shifter WLS1.

[0101] The first base resin BS1 can include a material having a relatively high light transmittance. The first base resin BS1 can be made of a transparent organic material. For example, the first base resin BS1 can include at least one organic material among an epoxy resin, an acrylic resin, a cardo resin, and an imide resin.

[0102] The first scatterer SCT1 can have a refractive index different from that of the first base resin BS1 and can form an optical interface with the first base resin BS1. For example, the first scatterer SCT1 can include a light scattering material or light scattering particles that scatter at least a portion of the transmitted light. For example, the first scatterer SCT1 can include a metal oxide such as titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), zinc oxide (ZnO), and tin oxide (SnO2), or can include an organic particle such as an acrylic resin and a polyurethane resin. The first scatterer SCT1 can scatter light in any direction regardless of the incident direction of incident light, without substantially changing the peak wavelength of the incident light.

[0103] The first wavelength shifter WLS1 can convert or shift the peak wavelength of the incident light to a first peak wavelength. For example, the first wavelength shifter WLS1 can convert blue light provided from the display device 10 into red light having a single peak wavelength in the range of 610 nm to 650 nm and output the light. The first wavelength shifter WLS1 can be a quantum dot, a quantum rod, or a phosphor. The quantum dot can be a particle substance that emits colored light when an electron jumps from a conduction band to a valence band.

[0104] A portion of the blue light emitted from the light emitting element layer EML can pass through the first wavelength conversion unit WLC1 without being converted into red light by the first wavelength shifter WLS1. When such blue light is incident on the first color filter CF1, it can be blocked by the first color filter CF1. On the other hand, the red light converted by the first wavelength conversion unit WLC1 can pass through the first color filter CF1 to exit to the outside. Accordingly, the first light emitting area LA1 can emit red light.

[0105] The second wavelength conversion unit WLC2 can be disposed in the second light emitting area LA2 on the second cover layer CAP2. The second wavelength conversion unit WLC2 can be surrounded by the second light blocking member BK2. The second wavelength conversion unit WLC2 can include a second base resin BS2, a second scatterer SCT2, and a second wavelength shifter WLS2.

[0106] The second base resin BS2 can include a material having a relatively high light transmittance. The second base resin BS2 can be made of a transparent organic material. For example, the second base resin BS2 can be made of the same material as that of the first base resin BS1, or can be made of one of the materials listed above for the first base resin BS1.

[0107] The second scatterer SCT2 can have a refractive index different from that of the second base resin BS2, and can form an optical interface with the second base resin BS2. For example, the second scatterer SCT2 can include a light scattering material or light scattering particles that scatter at least a portion of the transmitted light. For example, the second scatterer SCT2 can be made of the same material as that of the first scatterer SCT1, or can be made of one of the materials listed above for the first scatterer SCT1. The second scatterer SCT2 can scatter light in an arbitrary direction regardless of the incident direction of the incident light, without substantially changing the peak wavelength of the incident light.

[0108] The second wavelength shifter WLS2 can convert or shift the peak wavelength of the incident light to a second peak wavelength different from the first peak wavelength of the first wavelength shifter WLS1. For example, the second wavelength shifter WLS2 can convert blue light provided from the display device 10 into green light having a unimodal peak wavelength in the range of 510 nm to 550 nm, and output the light. The second wavelength shifter WLS2 can be a quantum dot, a quantum rod, or a phosphor. The second wavelength shifter WLS2 can include the materials listed above for the first wavelength shifter WLS1. The wavelength conversion range of the second wavelength shifter WLS2 can be formed of a quantum dot, a quantum rod, or a phosphor, such that the wavelength conversion range of the second wavelength shifter WLS2 is different from the wavelength conversion range of the first wavelength shifter WLS1.

[0109] The light transmission unit LTU can be disposed in the third light emitting area LA3 on the second cover layer CAP2. The light transmission unit LTU can be surrounded by the second light blocking member BK2. The light transmission unit LTU can transmit the incident light without converting the peak wavelength of the incident light. The light transmission unit LTU can include a third base resin BS3 and a third scatterer SCT3.

[0110] The third base resin BS3 can include a material having a relatively high light transmittance. The third base resin BS3 can be made of a transparent organic material. For example, the third base resin BS3 can be made of the same material as that of the first base resin BS1 or the second base resin BS2, or can be made of one of the materials of the first base resin BS1 or the second base resin BS2 listed above.

[0111] The third scatterer SCT3 can have a refractive index different from that of the third base resin BS3, and can form an optical interface with the third base resin BS3. For example, the third scatterer SCT3 can include a light scattering material or light scattering particles that scatter at least a portion of the transmitted light. For example, the third scatterer SCT3 can be made of the same material as that of the first scatterer SCT1 or the second scatterer SCT2, or can be made of one of the materials of the first scatterer SCT1 or the second scatterer SCT2 listed above. The third scatterer SCT3 can scatter light in an arbitrary direction regardless of the incident direction of incident light, without substantially changing the peak wavelength of the incident light.

[0112] The second cover layer CAP2 can cover the bottom of the first wavelength conversion unit WLC1, the second wavelength conversion unit WLC2, the light transmission unit LTU, and the second light blocking member BK2. For example, the second cover layer CAP2 can seal the first wavelength conversion unit WLC1, the second wavelength conversion unit WLC2, and the light transmission unit LTU, thereby preventing damage or contamination of the first wavelength conversion unit WLC1, the second wavelength conversion unit WLC2, and the light transmission unit LTU. For example, the second cover layer CAP2 can include an inorganic material.

[0113] The color filter layer CFL can include the first cover layer CAP1, the first light blocking member BK1, and the first to third color filters CF1, CF2, and CF3.

[0114] The first cover layer CAP1 can be disposed on the wavelength conversion layer WLCL. The first cover layer CAP1 can seal the lower surfaces of the first to third color filters CF1, CF2, and CF3. For example, the first cover layer CAP1 can include an inorganic material.

[0115] The first light blocking member BK1 can be disposed under the second support layer PI2 in the light blocking area BA. The first light blocking member BK1 can be overlapped with the second light blocking member BK2 or the second bank BNK2 in the thickness direction. The first light blocking member BK1 can block the transmission of light. The first light blocking member BK1 can improve the color gamut of the display device 10 by preventing light from intruding and mixing between the first to third light emitting areas LA1, LA2, and LA3. The first light blocking member BK1 can be arranged in a lattice shape surrounding the first to third light emitting areas LA1, LA2, and LA3 on a plane.

[0116] The first color filter CF1 can be disposed in the first light emitting area LA1 under the second support layer PI2. The first color filter CF1 can be surrounded by the first light blocking member BK1. The first color filter CF1 can be superposed with the first wavelength conversion unit WLC1 in a thickness direction. The first color filter CF1 can selectively transmit light of a first color (e.g., red light), and can block and absorb light of a second color (e.g., green light) and light of a third color (e.g., blue light). For example, the first color filter CF1 can be a red color filter and can include a red colorant.

[0117] The second color filter CF2 can be disposed in the second light emitting area LA2 under the second support layer PI2. The second color filter CF2 can be surrounded by the first light blocking member BK1. The second color filter CF2 can be superposed with the second wavelength conversion unit WLC2 in a thickness direction. The second color filter CF2 can selectively transmit light of a second color (e.g., green light), and can block and absorb light of a first color (e.g., red light) and light of a third color (e.g., blue light). For example, the second color filter CF2 can be a green color filter and can include a green colorant.

[0118] The third color filter CF3 can be disposed in the third light emitting area LA3 under the second support layer PI2. The third color filter CF3 can be surrounded by the first light blocking member BK1. The third color filter CF3 can be superposed with the light transmitting unit LTU in a thickness direction. The third color filter CF3 can selectively transmit light of a third color (e.g., blue light), and can block and absorb light of a first color (e.g., red light) and light of a second color (e.g., green light). For example, the third color filter CF3 can be a blue color filter and can include a blue colorant.

[0119] The first to third color filters CF1, CF2, CF3 can absorb a portion of light introduced from the outside of the display device 10 to reduce reflection of light from the outside. Accordingly, the first to third color filters CF1, CF2, CF3 can prevent color distortion due to reflection of external light.

[0120] The second support layer PI2 can be disposed under the second base portion SUB2 to support opposite surfaces of the display layer DPL. The second support layer PI2 can be deposited or coated on the second base portion SUB2. For example, the second support layer PI2 can include, but is not limited to, polyimide (PI).

[0121] The second substrate part SUB2 can be disposed on the second support layer PI2. The second substrate part SUB2 can support and protect the display device 10. For example, the second substrate part SUB2 can be, but is not limited to, a glass substrate including a glass material or an encapsulation substrate. The second substrate part SUB2 can prevent permeation of oxygen or moisture, and can protect the display device 10 from particles such as dust.

[0122] Figure 3 is a cross-sectional view taken along a line II-II' of Figure 1 In the following description, elements identical to those described above will be briefly described or omitted for ease of explanation of the drawing.

[0123] Referring to Figure 3 , the display device 10 can include a first substrate part SUB1, a first support layer PI1, a display layer DPL, a second support layer PI2, and a second substrate part SUB2. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL.

[0124] The display device 10 can further include a pad PAD, a flexible film FPCB, and a source driver SIC disposed in the non-display area NDA.

[0125] The pad PAD can be disposed on the thin film transistor layer TFTL in the non-display area NDA. The pad PAD can be disposed more outward than the sealing member AM that bonds the first substrate part SUB1 and the second substrate part SUB2. The pad PAD can be connected to the thin film transistor TFT of the thin film transistor layer TFTL through a connection line.

[0126] The flexible film FPCB can be attached to a surface of the pad PAD. For example, the flexible film FPCB can be, but is not limited to, disposed on the pad PAD through an anisotropic conductive film. One side of the flexible film FPCB can be connected to the pad PAD, and the other side of the flexible film FPCB can be connected to a source circuit board (not shown). The flexible film FPCB can transmit a signal from the source driver SIC to the thin film transistor TFT of the thin film transistor layer TFTL.

[0127] The source driver SIC can be disposed on the flexible film FPCB, and can be connected to a plurality of pixels of the display device 10. For example, the source driver SIC can be an integrated circuit (IC). The source driver SIC can convert digital video data into an analog data voltage based on a source control signal from a timing controller, and can supply the analog data voltage to a data line of the display area DA through the flexible film FPCB.

[0128] Figure 4 is a cross-sectional view taken along a line II-II' of Figure 1a cross-sectional view taken along line III-III' of FIG. 1A.

[0129] Referring to Figure 4 The tiled display TD can include a display area DA of the first display device 10-1, a display area DA of the second display device 10-2, and a seam SM between the display area DA of the first display device 10-1 and the display area DA of the second display device 10-2.

[0130] Each of the display devices 10-1 and 10-2 can include a first substrate portion SUB1, a first support layer PIl, a display layer DPL, a second support layer PI2, and a second substrate portion SUB2.

[0131] The first substrate portion SUB1 of the first display device 10-1 can be disposed in the display area DA. The first substrate portion SUB1 can support a surface of the first support layer PIl. For example, the first substrate portion SUB1 can be, but is not limited to, a glass substrate including a glass material. The first substrate portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the first display device 10-1. A portion of the first substrate portion SUB1 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are coupled together. Accordingly, the first substrate portion SUB1 of the first display device 10-1 can not be disposed in the seam SM. The first substrate portion SUB1 of the first display device 10-1 can be spaced apart from the first substrate portion SUB1 of the second display device 10-2, and the seam SM is located between the first substrate portion SUB1 of the first display device 10-1 and the first substrate portion SUB1 of the second display device 10-2.

[0132] The first support layer PIl can be disposed on the first substrate portion SUB1 in the display area DA and in the seam SM. The first support layer PIl can support one surface of the display layer DPL. For example, the first support layer PIl can include, but is not limited to, polyimide (PI). A side surface of the first support layer PIl of the first display device 10-1 can be in contact with a side surface of the first substrate portion SUB1 of the second display device 10-2.

[0133] The display layer DPL can be disposed on the first support layer PIl in the display area DA and in the seam SM. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL. Optionally, a side surface of the display layer DPL of the first display device 10-1 can be in contact with a side surface of the first substrate portion SUB1 of the second display device 10-2.

[0134] The second support layer PI2 can be disposed on the display layer DPL in the display area DA and the seam SM. The second support layer PI2 can be disposed on a surface of the second substrate portion SUB2 to support an opposite surface of the display layer DPL. For example, the second support layer PI2 can include, but is not limited to, polyimide (PI). A side surface of the second support layer PI2 of the first display device 10-1 can be in contact with a side surface of the first substrate portion SUB1 of the second display device 10-2.

[0135] The second substrate portion SUB2 can be disposed on the second support layer PI2 in the display area DA. The second substrate portion SUB2 can support an opposite surface of the second support layer PI2. For example, the second substrate portion SUB2 can be, but is not limited to, a glass substrate including a glass material. The second substrate portion SUB2 can support the display area DA and the non-display area NDA during a process of manufacturing the first display device 10-1. A portion of the second substrate portion SUB2 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the second substrate portion SUB2 of the first display device 10-1 can not be disposed in the seam SM. The second substrate portion SUB2 of the first display device 10-1 can be spaced apart from the second substrate portion SUB2 of the second display device 10-2, and the seam SM is located between the second substrate portion SUB2 of the first display device 10-1 and the second substrate portion SUB2 of the second display device 10-2.

[0136] The tiled display TD can further include an adhesive film AF. The adhesive film AF can attach an upper surface of the second support layer PI2 of the first display device 10-1 to a lower surface of the first support layer PI1 of the second display device 10-2 in the seam SM. For example, the adhesive film AF can include an adhesive coated on either side, so that the first display device 10-1 and the second display device 10-2 can be bonded to each other. Accordingly, the non-display areas NDA of the first display device 10-1 and the second display device 10-2 adjacent to each other can be stacked on each other in the thickness direction (or the Z-axis direction) in the seam SM.

[0137] The first base portion SUB1 of the second display device 10-2 can be disposed in the display area DA. The first base portion SUB1 can support a surface of the first support layer P11. For example, the first base portion SUB1 can be, but is not limited to, a glass substrate including a glass material. The first base portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the second display device 10-2. A portion of the first base portion SUB1 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the first base portion SUB1 of the second display device 10-2 can not be disposed in the seam SM. The first base portion SUB1 of the first display device 10-1 can be spaced apart from the first base portion SUB1 of the second display device 10-2, and the seam SM is located between the first base portion SUB1 of the first display device 10-1 and the first base portion SUB1 of the second display device 10-2.

[0138] The first support layer P11 can be disposed on the first base portion SUB1 in the display area DA and in the seam SM. The first support layer P11 can support one surface of the display layer DPL. For example, the first support layer P11 can include, but is not limited to, polyimide (PI). A side surface of the first support layer P11 of the second display device 10-2 can be in contact with a side surface of the second base portion SUB2 of the first display device 10-1. A lower surface of the first support layer P11 of the second display device 10-2 can be attached to an upper surface of the second support layer P12 of the first display device 10-1 in the seam SM.

[0139] The display layer DPL can be disposed on the first support layer P11 in the display area DA and in the seam SM. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL. Optionally, a side surface of the display layer DPL of the second display device 10-2 can be in contact with a side surface of the second base portion SUB2 of the first display device 10-1. The sealing member AM of the first display device 10-1 can face a side surface of the first base portion SUB1 of the second display device 10-2. The sealing member AM of the second display device 10-2 can face a side surface of the second base portion SUB2 of the first display device 10-1.

[0140] The second support layer PI2 can be disposed on the display layer DPL in the display area DA and the seam SM. The second support layer PI2 can be disposed on a surface of the second substrate portion SUB2 to support an opposite surface of the display layer DPL. For example, the second support layer PI2 can include, but is not limited to, polyimide (PI). A side surface of the second support layer PI2 of the second display device 10-2 can be in contact with a side surface of the second substrate portion SUB2 of the first display device 10-1.

[0141] The second substrate portion SUB2 can be disposed on the second support layer PI2 in the display area DA. The second substrate portion SUB2 can support an opposite surface of the second support layer PI2. For example, the second substrate portion SUB2 can be, but is not limited to, a glass substrate including a glass material. The second substrate portion SUB2 can support the display area DA and the non-display area NDA during a process of manufacturing the second display device 10-2. A portion of the second substrate portion SUB2 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the second substrate portion SUB2 of the second display device 10-2 can not be disposed in the seam SM. The second substrate portion SUB2 of the first display device 10-1 can be spaced apart from the second substrate portion SUB2 of the second display device 10-2, and the seam SM is located between the second substrate portion SUB2 of the first display device 10-1 and the second substrate portion SUB2 of the second display device 10-2.

[0142] A thickness of each of the first substrate portion SUB1 and the second substrate portion SUB2 can be greater than a thickness of the display layer DPL. For example, the thickness of each of the first substrate portion SUB1 and the second substrate portion SUB2 can be a multiple of the thickness of the display layer DPL, but embodiments described herein are not limited thereto. Each of the first display device 10-1 and the second display device 10-2 includes the first substrate portion SUB1 and the second substrate portion SUB2 having a predetermined thickness, so that the first display device 10-1 and the second display device 10-2 can be stably supported when they are bonded together.

[0143] The non-display areas NDA of the first display device 10-1 and the second display device 10-2 can be stacked on top of each other along the thickness direction (or the Z-axis direction) within a single seam SM. Therefore, the display areas DA of the display devices 10 can be very close to each other, such that the seam SM between the display areas DA of the display devices 10 is not perceptible to the viewer. The reflectivity of external light at the display areas DA of the multiple display devices 10 can be substantially equal to the reflectivity of external light at the seam SM between the display areas DA of the display devices 10. Therefore, the seam SM between the display areas DA of the display devices 10 of the spliced ​​display TD can be prevented from being perceptible to the viewer, thereby eliminating the visible seam SM and allowing the viewer to immerse themselves in the displayed image.

[0144] Figure 5 and Figure 6 It shows the manufacturing process. Figure 4 A cross-sectional view of the manufacturing process of the splicing display.

[0145] exist Figure 5 In the example shown, each of the display devices 10-1 and 10-2 may include a first substrate SUB1, a first support layer PI1, a display layer DPL, a second support layer PI2, and a second substrate SUB2.

[0146] The first support layer PI1, the thin film transistor layer TFTL, and the light-emitting element layer EML can be sequentially stacked on the first substrate SUB1. The first substrate SUB1 can support the display area DA and the non-display area NDA during the manufacturing process of the first display device 10-1 and the second display device 10-2.

[0147] The second support layer PI2, the color filter layer CFL, and the wavelength conversion layer WLCL can be sequentially stacked on the second substrate SUB2. The second substrate SUB2 can support the display area DA and the non-display area NDA during the manufacturing process of the first display device 10-1 and the second display device 10-2.

[0148] The first substrate SUB1 and the second substrate SUB2 can be attached together by a sealing member AM. A filler layer FIL can be used to fill the space between the light-emitting element layer EML on the first substrate SUB1 and the wavelength conversion layer WLCL on the second substrate SUB2. The sealing member AM can be disposed along the first substrate SUB1 and the second substrate SUB2 in the non-display area NDA to seal the filler layer FIL.

[0149] exist Figure 6The first substrate portion SUB1 and the second substrate portion SUB2 can be attached to each other, and then a portion of each of the first substrate portion SUB1 and the second substrate portion SUB2 corresponding to the seam SM can be removed. The process of removing the portion of the first substrate portion SUB1 and the portion of the second substrate portion SUB2 can include, but is not limited to, a cutting process.

[0150] The non-display areas NDA of the first display device 10-1 and the second display device 10-2 adjacent to each other can be stacked on each other in the thickness direction (or the Z-axis direction) in the seam SM. The upper surface of the second support layer PI2 of the first display device 10-1 can be attached to the lower surface of the first support layer PIl of the second display device 10-2 by the adhesive film AF (see Figure 4 ).

[0151] Figure 7 is another example of a cross-sectional view taken along the line III-III' of Figure 1 . Except for the bonding relationship between the first display device and the second display device, Figure 7 the tiled display of Figure 4 is substantially the same as the tiled display of

[0152] Referring to Figure 7 , the tiled display TD can include the display area DA of the first display device 10-1, the display area DA of the second display device 10-2, and the seam SM between the display area DA of the first display device 10-1 and the display area DA of the second display device 10-2.

[0153] Each of the display devices 10-1 and 10-2 can include a first substrate portion SUB1, a first support layer PIl, a display layer DPL, and a second substrate portion SUB2.

[0154] The first substrate portion SUB1 of the first display device 10-1 can be disposed in the display area DA. The first substrate portion SUB1 can support the surface of the first support layer PIl. For example, the first substrate portion SUB1 can be, but is not limited to, a glass substrate including a glass material. The first substrate portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the first display device 10-1. A portion of the first substrate portion SUB1 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Thus, the first substrate portion SUB1 of the first display device 10-1 can not be disposed in the seam SM. The side surface of the first substrate portion SUB1 of the first display device 10-1 can be in contact with the side surface of the second substrate portion SUB2 of the second display device 10-2 in the seam SM.

[0155] The first support layer PI1 can be disposed on the first substrate portion SUB1 in the display area DA and in the seam SM. The first support layer PI1 can support one surface of the display layer DPL. For example, the first support layer PI1 can include, but is not limited to, polyimide (PI).

[0156] The display layer DPL can be disposed on the first support layer PI1 in the display area DA and in the seam SM. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL.

[0157] The second substrate portion SUB2 can be disposed on the display layer DPL in the display area DA and in the seam SM. The second substrate portion SUB2 can support an opposite surface of the display layer DPL. For example, the second substrate portion SUB2 can be, but is not limited to, a glass substrate including a glass material. The second substrate portion SUB2 can support the display area DA and the non-display area NDA of the first display device 10-1. Since the opposite surface of the display layer DPL in the first display device 10-1 is supported by the second substrate portion SUB2, an additional support layer is not required between the second substrate portion SUB2 and the display layer DPL. The second substrate portion SUB2 of the first display device 10-1 and the second substrate portion SUB2 of the second display device 10-2 can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM.

[0158] The tiled display TD can further include an adhesive film AF. The adhesive film AF can attach a lower surface of the first support layer PI1 of the first display device 10-1 to an upper surface of the second substrate portion SUB2 of the second display device 10-2 in the seam SM. For example, the adhesive film AF can include an adhesive coated on either side, such that the first display device 10-1 and the second display device 10-2 can be bonded to each other. Accordingly, the non-display areas NDA of the first display device 10-1 and the second display device 10-2 adjacent to each other can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM. The display layer DPL of the first display device 10-1 and the display layer DPL of the second display device 10-2 can be stacked with the adhesive film AF in the thickness direction (or Z-axis direction) in the seam SM.

[0159] The first base portion SUB1 of the second display device 10-2 can be disposed in the display area DA. The first base portion SUB1 can support a surface of the first support layer PIl. For example, the first base portion SUB1 can be, but is not limited to, a glass substrate including a glass material. The first base portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the second display device 10-2. A portion of the first base portion SUB1 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the first base portion SUB1 of the second display device 10-2 can not be disposed in the seam SM.

[0160] The first support layer PIl can be disposed on the first base portion SUB1 in the display area DA and in the seam SM. The first support layer PIl can support one surface of the display layer DPL. For example, the first support layer PIl can include, but is not limited to, polyimide (PI).

[0161] The display layer DPL can be disposed on the first support layer PIl in the display area DA and in the seam SM. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL.

[0162] The second base portion SUB2 can be disposed on the display layer DPL in the display area DA and in the seam SM. The second base portion SUB2 can support an opposite surface of the display layer DPL. For example, the second base portion SUB2 can be, but is not limited to, a glass substrate including a glass material. The second base portion SUB2 can support the display area DA and the non-display area NDA. Since the opposite surface of the display layer DPL in the second display device 10-2 is supported by the second base portion SUB2, an additional support layer is not needed between the second base portion SUB2 and the display layer DPL. The second base portion SUB2 of the first display device 10-1 and the second base portion SUB2 of the second display device 10-2 can be stacked on each other in the thickness direction (or the Z-axis direction) in the seam SM. A side surface of the second base portion SUB2 of the second display device 10-2 can be in contact with a side surface of the first base portion SUB1 of the first display device 10-1.

[0163] The thickness of each of the first and second substrate portions SUB1 and SUB2 can be greater than the thickness of the display layer DPL. For example, the thickness of each of the first and second substrate portions SUB1 and SUB2 can be a multiple of the thickness of the display layer DPL, but the present disclosure is not limited thereto. Each of the first and second display apparatuses 10-1 and 10-2 includes the first and second substrate portions SUB1 and SUB2 having a predetermined thickness, so that the first and second display apparatuses 10-1 and 10-2 can be stably supported when they are coupled together.

[0164] The non-display area NDA of the first display apparatus 10-1 and the non-display area NDA of the second display apparatus 10-2 can be stacked on each other in the thickness direction (or Z-axis direction) in a single seam SM. Accordingly, the display areas DA of the plurality of display apparatuses 10 can be very close to each other such that the seam SM between the display areas DA of the plurality of display apparatuses 10 is not identified by a viewer. The reflectivity of external light at the display areas DA of the plurality of display apparatuses 10 can be substantially equal to the reflectivity of external light at the seam SM between the display areas DA of the display apparatus 10. Accordingly, the seam SM between the display areas DA of the display apparatuses 10 of the tiled display TD can be prevented from being identified by a viewer, thereby eliminating the visible seam SM and allowing the viewer to be immersed in the displayed image without being hindered by the unsightly seam between the portions of the image being displayed.

[0165] Figure 8 and Figure 9 is a cross-sectional view illustrating a process of manufacturing a tiled display. Figure 7

[0166] In Figure 8 , each of the display apparatuses 10-1 and 10-2 can include a first substrate portion SUB1, a first support layer PIl, a display layer DPL, and a second substrate portion SUB2.

[0167] The first support layer PIl, the thin film transistor layer TFTL, and the light emitting element layer EML can be sequentially stacked on the first substrate portion SUB1. The first substrate portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the first and second display apparatuses 10-1 and 10-2.

[0168] The color filter layer CFL and the wavelength conversion layer WLCL can be sequentially stacked on the second substrate portion SUB2. The second substrate portion SUB2 can support the display area DA and the non-display area NDA during a process of manufacturing the first and second display apparatuses 10-1 and 10-2.

[0169] ​The first substrate portion SUB1 and the second substrate portion SUB2 can be attached together through the sealing member AM. The filler layer FIL can be used to fill between the light emitting element layer EML on the first substrate portion SUB1 and the wavelength conversion layer WLCL on the second substrate portion SUB2. The sealing member AM can be disposed in the non-display area NDA along the first substrate portion SUB1 and the second substrate portion SUB2 to seal the filler layer FIL.

[0170] In Figure 9 , the first substrate portion SUB1 and the second substrate portion SUB2 are attached together, and then a portion of the first substrate portion SUB1 of the first display device 10-1 and the second display device 10-2 corresponding to the seam SM can be removed. The process of removing the portion of the first substrate portion SUB1 can include, but is not limited to, a cutting process.

[0171] The non-display areas NDA of the first display device 10-1 and the second display device 10-2 adjacent to each other can be stacked on each other in the thickness direction (or the Z-axis direction) in the seam SM. The lower surface of the first support layer PIl of the first display device 10-1 can be attached to the upper surface of the second substrate portion SUB2 of the second display device 10-2 through the adhesive film AF (see Figure 7 ).

[0172] Figure 10 is another example of a cross-sectional view taken along the line III-III' of Figure 1 . In addition to the bonding relationship between the first display device and the second display device, Figure 10 the tiled display of Figure 4 and Figure 7 is substantially the same as the tiled display of

[0173] Referring to Figure 10 , the tiled display TD can include the display area DA of the first display device 10-1, the display area DA of the second display device 10-2, and the seam SM between the display area DA of the first display device 10-1 and the display area DA of the second display device 10-2.

[0174] Each of the display devices 10-1 and 10-2 can include a first substrate portion SUB1, a first support layer PIl, a display layer DPL, a second support layer PI2, and a second substrate portion SUB2.

[0175] The first base portion SUB1 of the first display device 10-1 can be disposed in the display area DA. The first base portion SUB1 can support a surface of the first support layer PIl. For example, the first base portion SUB1 can be, but is not limited to, a glass substrate including a glass material. The first base portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the first display device 10-1. A portion of the first base portion SUB1 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the first base portion SUB1 of the first display device 10-1 can not be disposed in the seam SM. A side surface of the first base portion SUB1 of the first display device 10-1 can be in contact with a side surface of the first base portion SUB1 of the second display device 10-2 in the seam SM.

[0176] The first support layer PIl can be disposed on the first base portion SUB1 in the display area DA and in the seam SM. The first support layer PIl can support one surface of the display layer DPL. For example, the first support layer PIl can include, but is not limited to, polyimide (PI). A side surface of the first support layer PIl of the first display device 10-1 can be in contact with a side surface of the second base portion SUB2 of the second display device 10-2.

[0177] The display layer DPL can be disposed on the first support layer PIl in the display area DA and in the seam SM. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL. Alternatively, a side surface of the display layer DPL of the first display device 10-1 can be in contact with a side surface of the second base portion SUB2 of the second display device 10-2.

[0178] The second support layer PI2 can be disposed on the display layer DPL in the display area DA and in the seam SM. The second support layer PI2 can be disposed on a surface of the second base portion SUB2 to support an opposite surface of the display layer DPL. For example, the second support layer PI2 can include, but is not limited to, polyimide (PI). A side surface of the second support layer PI2 of the first display device 10-1 can be in contact with a side surface of the second base portion SUB2 of the second display device 10-2.

[0179] The second substrate part SUB2 can be disposed on the second support layer PI2 in the display area DA and the seam SM. The second substrate part SUB2 can support opposite surfaces of the second support layer PI2. For example, the second substrate part SUB2 can be, but is not limited to, a glass substrate including a glass material. The second substrate part SUB2 can support the display area DA and the seam SM of the first display device 10-1. A side surface of the second substrate part SUB2 of the first display device 10-1 can be in contact with a side surface of the second substrate part SUB2 of the second display device 10-2. The second substrate part SUB2 of the first display device 10-1 and the first substrate part SUB1 of the second display device 10-2 can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM.

[0180] The tiled display TD can further include an adhesive film AF. The adhesive film AF can attach a lower surface of the first support layer PI1 of the first display device 10-1 to an upper surface of the second support layer PI2 of the second display device 10-2 in the seam SM. For example, the adhesive film AF can include an adhesive coated on either side so that the first display device 10-1 and the second display device 10-2 can be bonded to each other. Accordingly, the non-display areas NDA of the first display device 10-1 and the second display device 10-2 adjacent to each other can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM.

[0181] The first substrate part SUB1 of the second display device 10-2 can be disposed in the display area DA and the seam SM. The first substrate part SUB1 can support a surface of the first support layer PI1. For example, the first substrate part SUB1 can be, but is not limited to, a glass substrate including a glass material. The first substrate part SUB1 can support the display area DA and the non-display area NDA of the second display device 10-2. A side surface of the first substrate part SUB1 of the second display device 10-2 can be in contact with a side surface of the first substrate part SUB1 of the first display device 10-1. The first substrate part SUB1 of the second display device 10-2 and the second substrate part SUB2 of the first display device 10-1 can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM.

[0182] The first support layer PI1 can be disposed on the first substrate part SUB1 in the display area DA and the seam SM. The first support layer PI1 can support one surface of the display layer DPL. For example, the first support layer PI1 can include, but is not limited to, polyimide (PI). A side surface of the first support layer PI1 of the second display device 10-2 can be in contact with a side surface of the first substrate part SUB1 of the first display device 10-1.

[0183] The display layer DPL can be disposed on the first support layer PIl in the display area DA and the seam SM. The display layer DPL can include a thin film transistor layer TFTL, a light emitting element layer EML, a filler layer FIL, a sealing member AM, a wavelength conversion layer WLCL, and a color filter layer CFL. Optionally, a side surface of the display layer DPL of the second display device 10-2 can be in contact with a side surface of the first base portion SUBl of the first display device 10-1.

[0184] The second support layer PI2 can be disposed on the display layer DPL in the display area DA and the seam SM. The second support layer PI2 can be disposed on a surface of the second base portion SUB2 to support an opposite surface of the display layer DPL. For example, the second support layer PI2 can include, but is not limited to, polyimide (PI). A side surface of the second support layer PI2 of the second display device 10-2 can be in contact with a side surface of the first base portion SUBl of the first display device 10-1.

[0185] The second base portion SUB2 can be disposed on the second support layer PI2 in the display area DA. The second base portion SUB2 can support an opposite surface of the second support layer PI2. For example, the second base portion SUB2 can be, but is not limited to, a glass substrate including a glass material. The second base portion SUB2 of the second display device 10-2 can support the display area DA and the non-display area NDA during a process of manufacturing the second display device 10-2. A portion of the second base portion SUB2 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the second base portion SUB2 of the second display device 10-2 can not be disposed in the seam SM. A side surface of the second base portion SUB2 of the second display device 10-2 can be in contact with a side surface of the second base portion SUB2 of the first display device 10-1 in the seam SM.

[0186] A thickness of each of the first base portion SUBl and the second base portion SUB2 can be greater than a thickness of the display layer DPL. For example, the thickness of each of the first base portion SUBl and the second base portion SUB2 can be a multiple of the thickness of the display layer DPL, but embodiments described herein are not limited thereto. Each of the first display device 10-1 and the second display device 10-2 includes the first base portion SUBl and the second base portion SUB2 having a predetermined thickness, so that the first display device 10-1 and the second display device 10-2 can be stably supported when they are bonded together.

[0187] The non-display area NDA of the first display device 10-1 and the non-display area NDA of the second display device 10-2 can be stacked on each other in a single seam SM in a thickness direction (or a Z-axis direction). Accordingly, the display areas DA of the plurality of display devices 10 can be close to each other such that the seam SM between the display areas DA of the plurality of display devices 10 is not identified by a viewer. The reflectivity of external light at the display areas DA of the plurality of display devices 10 can be substantially equal to the reflectivity of external light at the seam SM between the display areas DA of the display devices 10. Accordingly, the seam SM between the display areas DA of the display devices 10 of the tiled display TD can be prevented from being identified by a viewer, thereby eliminating the visible seam SM and allowing the viewer to be immersed in the displayed image.

[0188] Figure 11 and Figure 12 is a cross-sectional view illustrating a process of manufacturing a tiled display. Figure 10

[0189] In the example shown in FIG. 1A, each of the display devices 10-1 and 10-2 can include a first substrate portion SUB1, a first support layer PIl, a display layer DPL, a second support layer PI2, and a second substrate portion SUB2. Figure 11 The first support layer PIl, a thin film transistor layer TFTL, and a light emitting element layer EML can be sequentially stacked on the first substrate portion SUB1. The first substrate portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the first display device 10-1 and the second display device 10-2.

[0190] The second support layer PI2, a color filter layer CFL, and a wavelength conversion layer WLCL can be sequentially stacked on the second substrate portion SUB2. The second substrate portion SUB2 can support the display area DA and the non-display area NDA during a process of manufacturing the first display device 10-1 and the second display device 10-2.

[0191] The first substrate portion SUB1 and the second substrate portion SUB2 can be attached together by a sealing member AM. A filler layer FIL can be used to fill between the light emitting element layer EML on the first substrate portion SUB1 and the wavelength conversion layer WLCL on the second substrate portion SUB2. The sealing member AM can be disposed in the non-display area NDA along the first substrate portion SUB1 and the second substrate portion SUB2 to seal the filler layer FIL.

[0192] In the example shown in FIG. 1A, each of the display devices 10-1 and 10-2 can include a first substrate portion SUB1, a first support layer PIl, a display layer DPL, a second support layer PI2, and a second substrate portion SUB2.

[0193] Figure 12 ​​In this case, after the first and second substrate portions SUB1 and SUB2 are attached together, a portion of the first substrate portion SUB1 of the first display device 10-1 corresponding to the seam SM can be removed, and a portion of the second substrate portion SUB2 of the second display device 10-2 corresponding to the seam SM can be removed. The process of removing the portion of the first substrate portion SUB1 of the first display device 10-1 and the portion of the second substrate portion SUB2 of the second display device 10-2 can include, but is not limited to, a cutting process.

[0194] The non-display areas NDA of the first and second display devices 10-1 and 10-2 adjacent to each other can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM. The lower surface of the first support layer PIl of the first display device 10-1 can be attached to the upper surface of the second support layer PI2 of the second display device 10-2 by the adhesive film AF (see Figure 10 ).

[0195] Figure 13 is a plan view illustrating a tiled display according to another embodiment. Except for the coupling relationship between the first to fourth display devices, Figure 13 the tiled display of Figure 1 is substantially the same as the tiled display of

[0196] Referring to Figure 13 , the tiled display TD can include a plurality of display devices 10. The plurality of display devices 10 can be connected in the first direction (X-axis direction), but embodiments described herein are not limited thereto. For example, the plurality of display devices 10 can all have the same size. However, it will be understood that embodiments described herein are not limited thereto. For another example, the display devices 10 can have different sizes.

[0197] Each of the plurality of display devices 10 can have a rectangular shape including a longer side and a shorter side. The display devices 10 can be arranged such that their longer sides are connected to each other. Some of the display devices 10 can be disposed in the center of the tiled display TD in the first direction (X-axis direction), and some other display devices 10 can be disposed at one side and the opposite side of the tiled display TD in the first direction (X-axis direction).

[0198] Each of the display devices 10 can include a display area DA and a non-display area NDA. The display area DA can include a plurality of pixels to display an image. The non-display area NDA can be disposed around the display area DA to surround the display area DA, and can not display an image.

[0199] The tiled display TD can include a seam SM positioned between the plurality of display areas DA. The tiled display TD can be formed by connecting the non-display areas NDA of the adjacent display apparatuses 10 to each other. The plurality of display apparatuses 10 can be connected to each other by a coupling member or an adhesive member. The non-display areas NDA of the adjacent display apparatuses 10 can be stacked in the thickness direction (or the Z-axis direction) in a single seam SM. Accordingly, the display areas DA of the plurality of display apparatuses 10 can be close to each other such that the seam SM between the display areas DA of the plurality of display apparatuses 10 is not recognized by a viewer. The reflectivity of external light at the display areas DA of the plurality of display apparatuses 10 can be substantially equal to the reflectivity of external light at the seam SM between the display areas DA of the display apparatus 10. Accordingly, it is possible to prevent the seam SM between the display areas DA of the display apparatus 10 of the tiled display TD from being recognized by a viewer, thereby eliminating the visible seam SM and allowing the viewer to be immersed in the displayed image without having to watch the ugly seam between the parts of the image being displayed.

[0200] The tiled display TD can include first to fourth display apparatuses 10-1 to 10-4. The number relationship and the coupling relationship of the display apparatuses 10 are not limited to Figure 13 the embodiments described herein. The number of the display apparatuses 10 can be determined according to the size of the display apparatus 10 and the size of the tiled display TD.

[0201] A flexible film FPCB can be disposed in the non-display area NDA of each of the display apparatuses 10. The flexible film FPCB can be attached to a pad disposed on the base portion of each of the plurality of display apparatuses 10. One side of the flexible film FPCB can be connected to the pad, and the other side of the flexible film FPCB can be connected to a source circuit board (not shown). The flexible film FPCB can transmit a signal from the source driver SIC to the display apparatus 10.

[0202] The flexible film FPCB can be disposed on the non-display area NDA disposed along the edge of the tiled display TD. For example, a plurality of flexible films FPCB can be disposed on the upper side of the non-display area NDA of each of the first to fourth display apparatuses 10-1 to 10-4, but the embodiments described herein are not limited thereto.

[0203] Figure 14 is an example of a cross-sectional view taken along the line IV-IV' of Figure 13 FIG. 1.

[0204] Referring to Figure 14 , the tiled display TD can include the display areas DA of the first to fourth display apparatuses 10-1 to 10-4 and the seam SM between the display areas DA.

[0205] Each of the display apparatuses 10-1 to 10-4 can include a first substrate portion SUB1, a first support layer PI1, a display layer DPL, a second support layer PI2, and a second substrate portion SUB2. The first substrate portion SUB1 and the second substrate portion SUB2 can support the display area DA and the non-display area NDA during a process of manufacturing the display apparatus 10. Portions of the first substrate portion SUB1 and the second substrate portion SUB2 corresponding to the seam SM can be removed before the first display apparatus 10-1 to the fourth display apparatus 10-4 are bonded together. As a result, the first substrate portion SUB1 and the second substrate portion SUB2 can not be disposed in the seam SM.

[0206] The first substrate portion SUB1 of the first display apparatus 10-1 can be spaced apart from the first substrate portion SUB1 of the second display apparatus 10-2, and the seam SM is located between the first substrate portion SUB1 of the first display apparatus 10-1 and the first substrate portion SUB1 of the second display apparatus 10-2. The second substrate portion SUB2 of the first display apparatus 10-1 can be spaced apart from the second substrate portion SUB2 of the second display apparatus 10-2, and the seam SM is located between the second substrate portion SUB2 of the first display apparatus 10-1 and the second substrate portion SUB2 of the second display apparatus 10-2.

[0207] The upper surface of the second support layer PI2 of the first display apparatus 10-1 can be bonded with the lower surface of the first support layer PI1 of the second display apparatus 10-2 in the seam SM. The side surface of the first support layer PI1 and the side surface of the second support layer PI2 of the first display apparatus 10-1 can be in contact with the side surface of the first substrate portion SUB1 of the second display apparatus 10-2. The side surface of the first support layer PI1 and the side surface of the second support layer PI2 of the second display apparatus 10-2 can be in contact with the side surface of the second substrate portion SUB2 of the first display apparatus 10-1.

[0208] The lower surface of the first support layer PI1 of the second display apparatus 10-2 can be bonded with the upper surface of the second support layer PI2 of the third display apparatus 10-3 in the seam SM. The upper surface of the second support layer PI2 of the third display apparatus 10-3 can be bonded with the lower surface of the first support layer PI1 of the fourth display apparatus 10-4 in the seam SM.

[0209] Figure 15 is another example of a cross-sectional view taken along the line IV-IV' of Figure 13

[0210] Referring to Figure 15 , the tiled display TD can include the display areas DA of the first display apparatus 10-1 to the fourth display apparatus 10-4 and the seams SM located between the display areas DA.

[0211] ​Each of the display devices 10-1 to 10-4 can include a first substrate portion SUB1, a first support layer PI1, a display layer DPL, and a second substrate portion SUB2.

[0212] The first substrate portion SUB1 can be disposed in the display area DA but not in the seam SM. The first substrate portion SUB1 can support the display area DA and the non-display area NDA during a process of manufacturing the display device 10. A portion of the first substrate portion SUB1 corresponding to the seam SM can be removed before the first to fourth display devices 10-1 to 10-4 are bonded together.

[0213] The second substrate portion SUB2 can be disposed in the display area DA and the seam SM to support the display area DA and the seam SM. Since the opposite surfaces of the display layer DPL in the display device 10 are supported by the second substrate portion SUB2, no additional support layer is needed between the second substrate portion SUB2 and the display layer DPL. The second substrate portions SUB2 of the display devices 10 adjacent to each other can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM. The second substrate portion SUB2 of the first display device 10-1 and the second substrate portion SUB2 of the second display device 10-2 can be stacked on each other in the thickness direction (or Z-axis direction) in the seam SM.

[0214] A lower surface of the first support layer PI1 of the first display device 10-1 can be bonded with an upper surface of the second substrate portion SUB2 of the second display device 10-2 in the seam SM. A side surface of the first substrate portion SUB1 of the first display device 10-1 can be in contact with a side surface of the second substrate portion SUB2 of the second display device 10-2 in the seam SM.

[0215] An upper surface of the second substrate portion SUB2 of the second display device 10-2 can be bonded with a lower surface of the first support layer PI1 of the third display device 10-3 in the seam SM. A side surface of the second substrate portion SUB2 of the second display device 10-2 can be in contact with a side surface of the first substrate portion SUB1 of the third display device 10-3.

[0216] A lower surface of the first support layer PI1 of the third display device 10-3 can be bonded with an upper surface of the second substrate portion SUB2 of the fourth display device 10-4 in the seam SM. A side surface of the first substrate portion SUB1 of the third display device 10-3 can be in contact with a side surface of the second substrate portion SUB2 of the fourth display device 10-4 in the seam SM.

[0217] Figure 16 is another example of a cross-sectional view taken along the line IV-IV' of Figure 13 is another example of a cross-sectional view taken along the line IV-IV' of

[0218] Referring to Figure 16The tiled display TD can include display areas DA of the first to fourth display devices 10-1 to 10-4 and a seam SM between the display areas DA.

[0219] Each of the display devices 10-1 to 10-4 can include a first substrate part SUB1, a first support layer P11, a display layer DPL, a second support layer P12, and a second substrate part SUB2.

[0220] The first substrate part SUB1 of the first display device 10-1 can support the display area DA and the non-display area NDA during a process of manufacturing the first display device 10-1. A portion of the first substrate part SUB1 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the first substrate part SUB1 of the first display device 10-1 can not be disposed in the seam SM.

[0221] The second substrate part SUB2 of the first display device 10-1 can be disposed in the display area DA and the seam SM to support the display area DA and the seam SM. A side surface of the second substrate part SUB2 of the first display device 10-1 can be in contact with a side surface of the second substrate part SUB2 of the second display device 10-2. The second substrate part SUB2 of the first display device 10-1 and the first substrate part SUB1 of the second display device 10-2 can be stacked on each other in the seam SM in a thickness direction (or a Z-axis direction).

[0222] The first substrate part SUB1 of the second display device 10-2 can be disposed in the display area DA and the seam SM to support the display area DA and the seam SM. A side surface of the first substrate part SUB1 of the second display device 10-2 can be in contact with a side surface of the first substrate part SUB1 of the first display device 10-1. The first substrate part SUB1 of the second display device 10-2 and the second substrate part SUB2 of the first display device 10-1 can be stacked on each other in the seam SM in a thickness direction (or a Z-axis direction).

[0223] The second substrate part SUB2 of the second display device 10-2 can support the display area DA and the non-display area NDA during a process of manufacturing the second display device 10-2. A portion of the second substrate part SUB2 corresponding to the seam SM can be removed before the first display device 10-1 and the second display device 10-2 are bonded together. Accordingly, the second substrate part SUB2 of the second display device 10-2 can not be disposed in the seam SM.

[0224] The lower surface of the first support layer PI1 of the first display device 10-1 can be bonded with the upper surface of the second support layer PI2 of the second display device 10-2 in the seam SM. The side surface of the first support layer PI1 and the side surface of the second support layer PI2 of the first display device 10-1 can be in contact with the side surface of the second base portion SUB2 of the second display device 10-2. The side surface of the first support layer PI1 and the side surface of the second support layer PI2 of the second display device 10-2 can be in contact with the side surface of the first base portion SUB1 of the first display device 10-1.

[0225] The upper surface of the second support layer PI2 of the second display device 10-2 can be bonded with the lower surface of the first support layer PI1 of the third display device 10-3 in the seam SM. The lower surface of the first support layer PI1 of the third display device 10-3 can be bonded with the upper surface of the second support layer PI2 of the fourth display device 10-4 in the seam SM.

[0226] While certain embodiments and implementations have been described herein, other embodiments and modifications will occur to those skilled in the art. Therefore, the inventive subject matter is not limited to the described embodiments, but includes all such modifications and alterations as fall within the scope and spirit of the appended claims and various obvious modifications and equivalents thereof.

Claims

1. A tiled display, the tiled display comprising: a first display device and a second display device disposed adjacent to each other, each of the first display device and the second display device including a display area having a light emitting area and a joint between adjacent display areas in the display area, wherein each of the first display device and the second display device includes: a first base portion in the display area; a first support layer on the first base portion and in the joint in the display area; a display layer on the first support layer in the display area and the joint; a second support layer on the display layer in the display area and the joint; and a second base portion on the second support layer in the display area, wherein the first support layer of the second display device is disposed on the second support layer of the first display device in the joint, and wherein a side surface of the first support layer and / or a side surface of the second support layer of the first display device is in contact with a side surface of the first base portion of the second display device.

2. The tiled display of claim 1, further comprising: an adhesive film attaching a lower surface of the first support layer of the second display device to an upper surface of the second support layer of the first display device in the joint.

3. The tiled display of claim 1, wherein, a side surface of the first support layer and / or a side surface of the second support layer of the second display device is in contact with a side surface of the second base portion of the first display device.

4. The tiled display of claim 1, wherein, the display layer includes: a thin film transistor layer on the first support layer and including a plurality of thin film transistors; a light emitting element layer on the thin film transistor layer and including a plurality of light emitting elements; a wavelength conversion layer on the light emitting element layer and including wavelength conversion units respectively corresponding to the light emitting areas; and a color filter layer on the wavelength conversion layer and including color filters respectively corresponding to the light emitting areas.

5. The tiled display of claim 4, wherein, the display layer further includes: a filler layer between the light emitting element layer and the wavelength conversion layer; and a sealing member in the joint and surrounding the filler layer on a planar surface.

6. The tiled display of claim 5, wherein, a side surface of the sealing member of the first display device faces a side surface of the first base portion of the second display device, and wherein a side surface of the sealing member of the second display device faces a side surface of the second base portion of the first display device.

7. The tiled display of claim 4, wherein, the tiled display further includes a gate driver electrically connected to the plurality of thin film transistors in the display area.

8. The tiled display of claim 1, wherein, each of the first base portion and the second base portion includes a glass material, and wherein each of the first support layer and the second support layer includes polyimide.

9. The tiled display of claim 1, wherein, a thickness of the first base portion and / or the second base portion is greater than a thickness of the display layer.

10. A tiled display comprising: a first display device and a second display device disposed adjacent to each other, each of the first display device and the second display device including a display area having a light emitting area and a joint between adjacent display areas in the display area, wherein each of the first display device and the second display device includes: a first base portion in the display region; a first support layer on the first base portion in the display region and in the joint; a display layer on the first support layer in the display region and in the joint; and a second base portion provided on the display layer in the display region and in the joint, wherein the first support layer of the first display device is provided on the second base portion of the second display device in the joint, and wherein a side surface of the first base portion of the first display device is in contact with a side surface of the second base portion of the second display device.

11. The tiled display according to claim 10, further comprising: an adhesive film attaching a lower surface of the first support layer of the first display device to an upper surface of the second base portion of the second display device in the joint.

12. The tiled display of claim 11, wherein, each of the display layer of the first display device and the display layer of the second display device is laminated with the adhesive film in the joint in a thickness direction.

13. A tiled display comprising: a first display device and a second display device each including a first display region and a second display region and a joint between the first display region and the second display region, the first display region and the second display region each having a light emitting region, wherein the first display device includes: a first base portion in the first display region; a first support layer on the first base portion in the first display region and in the joint; and a display layer on the first support layer in the first display region and in the joint, wherein the second display device includes: a first base portion in the second display region and in the joint; a first support layer on the first base portion in the second display region and in the joint; and a display layer on the first support layer in the second display region and in the joint, and wherein a side surface of the first base portion of the first display device is in contact with a side surface of the first base portion of the second display device.

14. The tiled display of claim 13, wherein, the first display device further includes: a second support layer on the display layer in the first display region and in the joint; and a second base portion on the second support layer in the first display region and in the joint, and wherein the second display device further includes: a second support layer on the display layer in the second display region and in the joint; and a second base portion on the second support layer in the second display region.

15. The tiled display of claim 14, wherein, the first support layer of the first display device is provided on the second support layer of the second display device in the joint.

16. The tiled display of claim 14, wherein, a side surface of the first support layer and / or a side surface of the second support layer of the first display device is in contact with a side surface of the second base portion of the second display device.

17. The tiled display of claim 14, wherein, A side surface of the first support layer of the second display device and / or a side surface of the second support layer is in contact with the side surface of the first base portion of the first display device.

18. The tiled display of claim 14, wherein, A side surface of the second base portion of the first display device is in contact with a side surface of the second base portion of the second display device.

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