Antenna module and manufacturing method thereof

Abstract

An antenna module includes: a first dielectric layer having a first dielectric surface, a second dielectric surface opposite the first dielectric surface, and a first dielectric side surface extending between the first and second dielectric surfaces; a first antenna layer formed on the first dielectric surface; a ground layer formed below the second dielectric surface; and a conductive layer formed on the first dielectric side surface of the first dielectric layer, wherein the conductive layer is electrically connected to the ground layer and extends from the ground layer toward the first antenna layer, but does not contact the first dielectric surface. By utilizing the present invention, electromagnetic wave interference can be shielded.

Description

Technical Field

[0001] The present invention relates to an antenna module, and more particularly to an antenna module including a lateral conductive layer. Background Art

[0002] Traditional antenna modules consist of an antenna and a chip. The chip can transmit and receive signals to and from the antenna. However, the chip is easily interfered with by electromagnetic waves. Therefore, shielding the chip from electromagnetic interference has become a key task in the industry. Summary of the Invention

[0003] An antenna module includes: a first dielectric layer having a first dielectric surface, a second dielectric surface opposite to the first dielectric surface, and a first dielectric side surface extending between the first dielectric surface and the second dielectric surface; a first antenna layer formed on the first dielectric surface; a ground layer formed below the second dielectric surface; and a conductive layer formed on the first dielectric side surface of the first dielectric layer, wherein the conductive layer is electrically connected to the ground layer and extends from the ground layer toward the first antenna layer but does not contact the first dielectric surface.

[0004] A method for manufacturing an antenna module comprises: providing a structure including a first dielectric layer, a first antenna layer, and a ground layer, wherein the first dielectric layer has a first dielectric surface, a second dielectric surface opposite to the first dielectric surface, and a first dielectric side surface extending between the first dielectric surface and the second dielectric surface, the first antenna layer is formed on the first dielectric surface, and the ground layer is formed below the second dielectric surface; placing the structure on an adhesive layer and in a through-portion of a metal frame; and forming a conductive layer to cover portions of the structure not covered by the adhesive layer and the metal frame, wherein the conductive layer is formed on the first dielectric side surface of the first dielectric layer, the conductive layer is electrically connected to the ground layer, and extends from the ground layer toward the first antenna layer without contacting the first dielectric surface.

[0005] A method for manufacturing an antenna module comprises: providing a structure including a first dielectric layer, a first antenna layer, and a ground layer, wherein the first dielectric layer has a first dielectric surface, a second dielectric surface opposite to the first dielectric surface, and a first dielectric side extending between the first dielectric surface and the second dielectric surface, the first antenna layer is formed on the first dielectric surface, and the ground layer is formed below the second dielectric surface; placing an adhesive layer to cover the first dielectric layer of the structure; forming a plurality of first cutting channels to pass through the adhesive layer and a portion of the first dielectric layer, wherein the first dielectric layer forms a first side; forming a conductive layer to cover the adhesive layer and the first side; removing the adhesive layer to expose the first dielectric layer; and forming a plurality of second cutting channels to pass through another portion of the first dielectric layer, wherein the first dielectric layer forms a second side, and the first side and the second side are not coplanar.

[0006] By utilizing the present invention, interference from electromagnetic waves can be shielded.

[0007] Other embodiments and advantages will be described in the detailed description below. This summary is not intended to define the invention. The invention is defined by the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above-mentioned objectives and advantages of the present invention will become more clear to those skilled in the art after reading the following detailed description and accompanying drawings.

[0009] Figure 1A A schematic diagram of an antenna module according to an embodiment of the present invention is illustrated.

[0010] Figure 1B exemplifiable Figure 1A Top view of the antenna module.

[0011] Figure 1C exemplifiable Figure 1A Bottom view of the antenna module.

[0012] Figure 2 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0013] Figure 3A A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0014] Figure 3B exemplifiable Figure 3A Bottom view of the antenna module.

[0015] Figure 4A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0016] Figure 5 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0017] Figure 6 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0018] Figure 7 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0019] Figure 8 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0020] Figure 9 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0021] Figure 10 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0022] Figure 11 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0023] Figure 12 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0024] Figure 13 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0025] Figure 14 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0026] Figure 15 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0027] Figure 16 A schematic diagram of an antenna module according to another embodiment of the present invention is illustrated.

[0028] 17A to 17D exemplifiable Figures 1A to 1C Manufacturing processes of antenna modules.

[0029] Figure 18 exemplifiable Figure 2 Manufacturing process of antenna module.

[0030] Figures 19A to 19D exemplifiable Figure 3A to Figure 3B Manufacturing process of antenna module.

[0031] Figures 20A to 20G exemplifiable Figure 4 Manufacturing process of antenna module.

[0032] Figures 21A to 21G exemplifiable Figure 11 Manufacturing process of antenna module.

[0033] Figures 22A to 22G exemplifiable Figure 14 Manufacturing process of antenna module. DETAILED DESCRIPTION

[0034] refer to Figures 1A to 1C , Figure 1A A schematic diagram of an antenna module 100 according to an embodiment of the present invention may be illustrated. Figure 1B exemplifiable Figure 1A A top view of the antenna module 100 is shown. Figure 1C exemplifiable Figure 1A 1 is a bottom view of the antenna module 100.

[0035] The antenna module 100 may include a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a grounding layer 130, a conductive layer 140, a second antenna layer 150, at least one routing layer 160, at least one feeding pad 162, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, and a molding compound 190.

[0036] The first dielectric layer 110 may have a first dielectric surface 110u, a second dielectric surface 110b opposite the first dielectric surface 110u, and a first dielectric lateral surface 110s extending between the first dielectric surface 110u and the second dielectric surface 110b. The first antenna layer 120 may be formed on the first dielectric surface 110u. The ground layer 130 may be formed below the second dielectric surface 110b. The conductive layer 140 may be formed on the first dielectric lateral surface 110s of the first dielectric layer 110. The conductive layer 140 may be electrically connected to the ground layer 130 and extend from the ground layer 130 toward the first antenna layer 120, but may not contact the first dielectric surface 110u.

[0037] The side conductive layer 140 can shield electromagnetic waves from interfering with at least one conductive component surrounded by the conductive layer 140 (eg, the first electronic component 180 , the second electronic component 185 and / or the wiring layer 160 ) and can determine the size of the antenna module 100 .

[0038] As shown in Table 1 below, compared with a structure in which the conductive layer 140 contacts the first dielectric surface 110u or extends to the first dielectric surface 110u (referred to as a "full-side conductive layer" in Table 1), the conductive layer 140 in this embodiment may not contact the first dielectric surface 110u or extend to the first dielectric surface 110u (referred to as a "partial-side conductive layer" in Table 1). Therefore, the antenna gain can be reduced by 0.2 dB, and the size of the antenna module can still be reduced by 17%.

[0039] Table 1

[0040]

[0041] The first dielectric layer 110 may be a single-layer structure or a multi-layer structure. In this embodiment, the first dielectric layer 110 may include multiple sub-dielectric layers, and at least two sub-dielectric layers may be formed of the same material or different materials. For example, the first dielectric layer 110 may include a first sub-dielectric layer 111 and multiple second sub-dielectric layers 112. In one embodiment, the first sub-dielectric layer 111 may be formed of a material including FR4, FR5, BT, ceramic, glass, molding compound, or liquid crystal polymer, and / or the second sub-dielectric layer 112 may be formed of a material including FR4, FR5, BT, ceramic, glass, molding compound, or liquid crystal polymer.

[0042] like Figure 1A As shown, at least one conductive via 115 may pass through the first dielectric layer 110 to electrically connect the second antenna layer 150 to the wiring layer 160. For example, the conductive via 115 may pass through the first sub-dielectric layer 111. For example, the conductive via 115 may be electrically connected to a feeding point. In another embodiment, the conductive via 115 may be omitted, and the signal transmitted by the first electronic component 180 may be coupled to the second antenna layer 150 using a slot-coupled feed technique.

[0043] like Figure 1BAs shown, in this embodiment, the first antenna layer 120 and the second antenna layer 150 can be separated from each other by the second sub-dielectric layer 112. The first antenna layer 120 can be a patterned antenna layer. For example, the first antenna layer 120 can include a plurality of antenna portions 121 arranged in an n×m array, where n is an integer greater than or equal to 1, and m is an integer greater than or equal to 1.

[0044] like Figure 1A As shown, in this embodiment, the ground layer 130 may be formed on the second dielectric surface 110b of the first dielectric layer 110 and may extend to the first dielectric side surface 110s of the first dielectric layer 110 to physically (or directly) connect to the conductive layer 140. In another embodiment, the ground layer 130 may not extend to the first dielectric side surface 110s, so that the ground layer 130 may be indirectly electrically connected to the conductive layer 140 via another conductive component. In addition, the ground layer 130 may have a plurality of openings 130a, each of which may receive a corresponding feed pad 162, thereby preventing the feed pad 162 from contacting the physical material of the ground layer 130. For example, the feed pad 162 and the ground layer 130 may be formed in the same layer. In addition, for example, the ground layer 130 may be formed of a metal including aluminum, copper, gold, silver, iron, or a combination thereof.

[0045] like Figure 1A As shown, the conductive layer 140 may also extend to one surface of at least one second dielectric layer 170. In addition, the conductive layer 140 may cover the second dielectric side surface 170s of at least one second dielectric layer 170 and the molding compound 190. Therefore, the conductive layer 140 may shield electromagnetic waves from interfering with at least one conductive component (such as the first electronic component 180 and / or the wiring layer 160) in the second dielectric layer 170 and the molding compound 190. Figure 1B and Figure 1C As shown, the conductive layer 140 may closely surround the first dielectric layer 110 , the second dielectric layer 170 , and the molding compound 190 .

[0046] like Figure 1A As shown, the second antenna layer 150 can be formed within the first dielectric layer 110. In this embodiment, the second antenna layer 150 can be formed on one sub-dielectric layer, for example, on the upper surface 110u of the first sub-dielectric layer 111. In another embodiment, the second antenna layer 150 can be formed on the upper surface of the second sub-dielectric layer 112.

[0047] like Figure 1AAs shown, for example, each wiring layer 160 can be a patterned layer. For example, each wiring layer 160 can include at least one conductive trace 161, wherein the conductive trace 161 of one wiring layer 160 can be electrically connected to the conductive trace 161 of another wiring layer 160 through at least one conductive via 163.

[0048] like Figure 1A As shown, a plurality of second dielectric layers 170 may be formed below the second dielectric surface 110b, and one of the plurality of wiring layers 160 may be formed on a surface of a corresponding second dielectric layer 170. The wiring layers 160 may be separated by corresponding second dielectric layers 170.

[0049] like Figure 1A As shown, the first electronic component 180 can be disposed on at least one wiring layer 160 and electrically connected to the at least one wiring layer 160. The first electronic component 180 can be electrically connected to the second antenna layer 150 through the wiring layer 160. A molding compound 190 can be formed on the wiring layer 160 and can encapsulate the first electronic component 180 and the second electronic component 185. In one embodiment, for example, the first electronic component 180 can be a radio frequency integrated circuit (RFIC), however, this example is not limiting.

[0050] like Figure 1A As shown, the second electronic component 185 may be placed on the wiring layer 160 and may be electrically connected to the wiring layer 160. The second electronic component 185 may be electrically connected to the second antenna layer 150 through the wiring layer 160. In one embodiment, for example, the second electronic component 185 may be a passive component, such as a resistor, an inductor, and / or a capacitor, however, this example is not limiting.

[0051] like Figure 1A As shown, connector 187 can be placed on wiring layer 160 and can be electrically connected to wiring layer 160. Connector 187 can be electrically connected to first electronic component 180 and / or second electronic component 185 through wiring layer 160. Wiring layer 160 can have a portion 160A exposed and not covered by molding compound 190. Connector 187 can be placed on this portion 160A of wiring layer 160 and can be electrically connected to one of the conductive traces 161 of wiring layer 160. Antenna module 100 can be electrically connected to an external component (not shown) through connector 187. For example, the external component can be a printed circuit board.

[0052] like Figure 1A As shown, molding compound 190 may include molding lateral surfaces 190s and molding lower surface 190b, which may collectively define the outer boundary of molding compound 190. Conductive layer 140 may cover molding lateral surfaces 190s and molding lower surface 190b. Furthermore, molding compound 190 may be formed of, for example, novolac-based resin, epoxy-based resin, silicone-based resin, or other suitable encapsulant. A suitable filler, such as powdered SiO2, may also be included. Molding compound 190 may be applied using any of a variety of molding techniques, such as compression molding, injection molding, or transfer molding.

[0053] refer to Figure 2 , Figure 2 A schematic diagram of an antenna module 200 according to another embodiment of the present invention is illustrated.

[0054] The antenna module 200 may include a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 240, a second antenna layer 150, at least one wiring layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187 and a molding compound 190.

[0055] Conductive layer 240 of antenna module 200 may include the same or similar features as conductive layer 140 of antenna module 100 , except that conductive layer 240 may also extend between first dielectric surface 110 u and second dielectric surface 110 b , or between first dielectric surface 110 u and second antenna layer 150 .

[0056] refer to Figure 3A and Figure 3B , Figure 3A A schematic diagram of an antenna module 300 according to another embodiment of the present invention is shown. Figure 3B exemplifiable Figure 3A 1 is a bottom view of the antenna module 300.

[0057] like Figure 3AAs shown, the antenna module 300 may include a first dielectric layer 110, at least one conductive through-hole 115, a first antenna layer 120, a ground layer 130, a conductive layer 340, a second antenna layer 150, at least one wiring layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185 (not shown, optionally) and at least one contact point 387.

[0058] like Figure 3A As shown, the conductive layer 340 may be electrically connected to the ground layer 130 and may be formed on the first dielectric side 110 s of the first dielectric layer 110 and the second dielectric side 170 s of each second dielectric layer 170 .

[0059] like Figure 3A As shown, for example, contact points 387 can be solder balls, solder paste, conductive pillars, etc. Multiple contact points 387 can be placed on wiring layer 160. Antenna module 300 can be electrically connected to an external component via contact points 387, where, for example, the external component can be a printed circuit board. In this embodiment, first electronic component 180 and contact points 387 can be placed on the same side of wiring layer 160. For example, contact points 387 and first electronic component 180 can be placed on the bottommost wiring layer 160. In addition, one of wiring layers 160 can be electrically grounded via one of contact points 387, so that ground layer 130 can be electrically grounded via wiring layer 160 and contact points 387.

[0060] refer to Figure 4 , Figure 4 A schematic diagram of an antenna module 300' according to another embodiment of the present invention is shown. Antenna module 300' may include a first dielectric layer 310, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 340, a second antenna layer 150, at least one routing layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185 (not shown, optional), and at least one contact 387. In this embodiment, first dielectric layer 310 may have a first dielectric side 310s, wherein first dielectric side 310s may include a first side 310s1 and a second side 310s2 that is not aligned with first side 310s1. In other words, first side 310s1 and second side 310s2 are not coplanar.

[0061] refer to Figure 5 , Figure 5 A schematic diagram of an antenna module 400 according to another embodiment of the present invention is illustrated.

[0062] like Figure 5 As shown, the antenna module 400 may include a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 440, a second antenna layer 150, at least one wiring layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185 (not shown) and at least one contact point 387, a third dielectric layer 470 and at least one conductive via 475.

[0063] like Figure 5 As shown, the conductive layer 440 may be electrically connected to the ground layer 130 and may be formed on the first dielectric side 110s of the first dielectric layer 110 , the second dielectric side 170s of each second dielectric layer 170 , and the third dielectric side 470s of the third dielectric layer 470 .

[0064] like Figure 5 As shown, first electronic component 180 and contact point 387 may be placed on opposite sides of wiring layer 160. A third dielectric layer 470 may be placed between wiring layer 160 and first dielectric layer 110 and may seal first electronic component 180. In one embodiment, third dielectric layer 470 may be formed of a material such as FR4, FR5, BT, or a molding compound. At least one conductive via 475 may pass through third dielectric layer 470 and may electrically connect one of wiring layers 160 to conductive via 115.

[0065] refer to Figure 6 , Figure 6 A schematic diagram of an antenna module 400' according to another embodiment of the present invention is shown. Antenna module 400' may include a first dielectric layer 310, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 340, a second antenna layer 150, at least one routing layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185 (not shown, optional), and at least one contact 387. In this embodiment, first dielectric layer 310 may have a first dielectric side 310s, wherein first dielectric side 310s may include a first side 310s1 and a second side 310s2 that is not aligned with first side 310s1. In other words, first side 310s1 and second side 310s2 are not coplanar.

[0066] refer to Figure 7 , Figure 7 A schematic diagram of an antenna module 500 according to another embodiment of the present invention is illustrated.

[0067] like Figure 7As shown, the antenna module 500 may include a first dielectric layer 110, at least one conductive through-hole 115, a first antenna layer 120, a ground layer 130, a conductive layer 540, a second antenna layer 150, at least one wiring layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, a molding compound 190 and at least one contact point 387.

[0068] like Figure 7 As shown, the conductive layer 540 can be electrically connected to the ground layer 130 and can be formed on the first dielectric side 110s of the first dielectric layer 110, the second dielectric side 170s of each second dielectric layer 170, and the molding compound 190. In this embodiment, the conductive layer 540 may include a first conductive layer 541 and a second conductive layer 542, wherein the first conductive layer 541 is formed on the first dielectric side 110s of the first dielectric layer 110, and the second conductive layer 542 is formed on the second dielectric side 170s of each second dielectric layer 170 and the molding compound 190. The first conductive layer 541 can produce the same effect as that in Table 1, and the second conductive layer 542 can shield the components in the molding compound 190 from interference by electromagnetic waves.

[0069] In this embodiment, a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a second antenna layer 150, and a first conductive layer 541 may be formed in / on a substrate 500A, and a second conductive layer 542, at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, and a molding compound 190 may form a package 500B, wherein the substrate 500A and the package 500B are positioned relative to each other and may be electrically connected via contact points 387.

[0070] refer to Figure 8 , Figure 8A schematic diagram of an antenna module 500' according to another embodiment of the present invention is shown. Antenna module 500' may include a first dielectric layer 310, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 540, a second antenna layer 150, at least one routing layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, a molding compound 190, and at least one contact 387. In this embodiment, first dielectric layer 310 may have a first dielectric side 310s, wherein first dielectric side 310s may include a first side 310s1 and a second side 310s2 that is not aligned with first side 310s1. In other words, first side 310s1 and second side 310s2 are not coplanar.

[0071] In this embodiment, first dielectric layer 310, at least one conductive via 115, first antenna layer 120, ground layer 130, second antenna layer 150, and first conductive layer 541 may be formed in / on substrate 500A′, and second conductive layer 542, at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, connector 187, and molding compound 190 may form package 500B, wherein substrate 500A′ and package 500B are positioned opposite each other and may be electrically connected via contact point 387. Furthermore, in the present invention, at least one wiring layer 160, at least one dielectric layer 170, and at least one conductive via 163 may be considered or used as another substrate.

[0072] Additionally, in another embodiment, the ground layer 130 may be placed on one of the dielectric layers 170. For example, the ground layer 130 may be placed on the uppermost dielectric layer 170.

[0073] refer to Figure 9 , Figure 9 A schematic diagram of an antenna module 600 according to another embodiment of the present invention is illustrated.

[0074] like Figure 9 As shown, the antenna module 600 may include a first dielectric layer 110, at least one conductive via 115, at least one conductive via 615, a first antenna layer 120, a ground layer 130, a conductive layer 540, at least one wiring layer 160, at least one feed pad 162, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, a molding compound 190, and at least one contact point 387.

[0075] In this embodiment, Figure 9As shown, the conductive via 115 and the plurality of conductive vias 615 may collectively pass through the first dielectric layer 110 and may electrically connect the first antenna layer 120 and the feed pad 162 .

[0076] In this embodiment, a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a second antenna layer 150, a first conductive layer 541 and at least one conductive via 615 may be formed in / on a substrate 600A, and a second conductive layer 542, at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187 and a molding compound 190 may form a package 500B, wherein the substrate 600A and the package 500B are positioned opposite each other and may be electrically connected via contact points 387.

[0077] refer to Figure 10 , Figure 10 A schematic diagram of an antenna module 600' according to another embodiment of the present invention is shown. Antenna module 600' may include a first dielectric layer 310, at least one conductive via 115, at least one conductive via 615, a first antenna layer 120, a ground layer 130, a conductive layer 540, at least one routing layer 160, at least one feed pad 162, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, a molding compound 190, and at least one contact 387. In this embodiment, first dielectric layer 310 may have a first dielectric side 310s, wherein first dielectric side 310s may include a first side 310s1 and a second side 310s2 that is not aligned with first side 310s1. In other words, first side 310s1 and second side 310s2 are not coplanar.

[0078] In this embodiment, the first dielectric layer 310, at least one conductive via 115, the first antenna layer 120, the ground layer 130, the second antenna layer 150, the first conductive layer 541 and the at least one conductive via 615 can be formed in / on the substrate 600A′, and the second conductive layer 542, at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, the connector 187 and the molding compound 190 can form a package 500B, wherein the substrate 600A′ and the package 500B are placed opposite each other and can be electrically connected through the contact point 387.

[0079] refer to Figure 11 , Figure 11 A schematic diagram of an antenna module 700 according to another embodiment of the present invention is illustrated.

[0080] like Figure 11As shown, antenna module 700 may include multiple antenna elements 700A, a second substrate 500B, and at least one contact point 387. The antenna elements 700A may be spaced apart from one another, and each antenna element 700A may include the same or similar features as substrate 500A'. For example, each antenna element 700A may include a first dielectric layer 310, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 140, and a first conductive layer 541. Each antenna element 700A may be electrically connected to the second substrate 500B via at least one contact point 387.

[0081] refer to Figure 12 , Figure 12 A schematic diagram of an antenna module 800 according to another embodiment of the present invention is illustrated.

[0082] like Figure 12 As shown, antenna module 800 may include multiple antenna elements 800A, a second substrate 500B, and at least one contact point 387. The antenna elements 800A may be spaced apart from one another, and each antenna element 800A may include the same or similar features as substrate 600A'. For example, each antenna element 800A may include a first dielectric layer 310, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 140, a first conductive layer 541, and at least one conductive via 615. Each antenna element 800A may be electrically connected to the second substrate 500B via at least one contact point 387.

[0083] refer to Figure 13 , Figure 13 A schematic diagram of an antenna module 900 according to another embodiment of the present invention is shown below.

[0084] like Figure 13 As shown, the antenna module 900 may include a substrate 500A and a package 900B, wherein the package 900B may include a second conductive layer 542, at least one wiring layer 160 and at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185 (not shown, optional), and at least one contact point 387. The substrate 500A may be electrically connected to the package 900B via the at least one contact point 387.

[0085] refer to Figure 14 , Figure 14 A schematic diagram of an antenna module 1000 according to another embodiment of the present invention is illustrated.

[0086] The antenna module 1000 may include a first dielectric layer 1010, a first antenna layer 120, a ground layer 130, a first conductive layer 541, a connector 187, at least one conductive via 115, at least one conductive via 615, at least one wiring layer 160, at least one feed pad 162, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a molding compound 190, and at least one contact point 387.

[0087] First dielectric layer 1010, first antenna layer 120, ground layer 130, first conductive layer 541, at least one conductive via 115, and at least one conductive via 615 may form substrate 1000A, while at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, and molding compound 190 may form package 1000B. Package 1000B and substrate 1000A may be electrically connected via at least one contact point 387.

[0088] In this embodiment, the connector 187 may be placed on one of the layers of the first dielectric layer 1010, for example, on the first sub-dielectric layer 111. The connector 187 and the package 1000B may be placed on the same side of the substrate 1000A.

[0089] In addition, the substrate (500A, 500A', 600A, 600A', 700A, 800A or 1000A) and the package (500B, 900B or 1000B) can be stacked to form a package on package (PoP), wherein the size (length and / or width) of the substrate can be equal to, greater than or less than the size of the package. Figure 7 In the antenna module 500, the length of the package 500B is greater than the length of the substrate 500A. Figure 14 In the antenna module 1000 , the length of the substrate 1000A is greater than the length of the package 1000B.

[0090] In addition, the first dielectric layer 1010 may further include at least one fourth dielectric layer 1011, wherein the fourth dielectric layer 1011 is formed between the first sub-dielectric layer 111 and the contact 387, or between the first sub-dielectric layer 111 and the package 1000B. In another embodiment, at least one wiring layer 160 may be formed on a surface of the at least one fourth dielectric layer 1011. In addition, the fourth dielectric layer 1011 may be formed of the same material as or different from the first sub-dielectric layer 111 or the second sub-dielectric layer 112.

[0091] In addition, at least one fourth dielectric layer 1011 formed between the first sub-dielectric layer 111 and the contact point 387 or between the first sub-dielectric layer 111 and the package can be applied to the substrate 500A, substrate 500A', substrate 600A, substrate 600A', antenna unit 700A, antenna unit 800A and / or substrate 1000A.

[0092] refer to Figure 15 , Figure 15 A schematic diagram of an antenna module 1100 according to another embodiment of the present invention is illustrated.

[0093] The antenna module 1100 may include a first dielectric layer 1110, at least one conductive via 1115, a first antenna layer 1120, a ground layer 1130, a conductive layer 1140, at least one wiring layer 1160, at least one conductive via 1163, multiple dielectric layers 1171 and 1172, at least one first electronic component 1180 and at least one contact point 387.

[0094] The first dielectric layer 1110 may have a first dielectric surface 1110u, a second dielectric surface 1110b opposite the first dielectric surface 1110u, and a first dielectric side surface 1110s extending between the first dielectric surface 1110u and the second dielectric surface 1110b. The first antenna layer 1120 may be formed on the first dielectric surface 1110u. The ground layer 1130 may be formed below the second dielectric surface 1110b. The conductive layer 1140 may be formed on the first dielectric side surface 1110s of the first dielectric layer 1110. The conductive layer 1140 may be electrically connected to the ground layer 1130 and extend from the ground layer 1130 toward the first antenna layer 1120, but may not contact the first dielectric surface 1110u.

[0095] In this embodiment, for example, the first dielectric layer 1110 may be a single-layer structure. Dielectric layer 1171 may be formed of the same or different material as dielectric layer 1172. A ground layer 1130 may be embedded in one of the dielectric layers 1172. Ground layer 1130 may have multiple openings 1130a, each of which may allow a corresponding conductive via 1115 to pass through. The first electronic component 1180 may be electrically connected to the first antenna layer 1120 via the wiring layer 1160, the conductive vias 1163, and the conductive vias 1115. In one embodiment, for example, the first electronic component 1180 may be an RFIC, but this example is not limiting. In one embodiment, for example, the second electronic component 185 may be a passive component such as a resistor, inductor, and / or capacitor, but this example is not limiting. Contact points 387 may be, for example, solder balls, solder paste, conductive posts, etc. Multiple contact points 387 may be placed on the wiring layer 1160.

[0096] refer to Figure 16 , Figure 16 A schematic diagram of an antenna module 1200 according to another embodiment of the present invention is illustrated.

[0097] The antenna module 1200 may include a first dielectric layer 1210, at least one conductive via 1215, a first antenna layer 1220, a ground layer 1230, a conductive layer 1240, at least one wiring layer 1260, at least one conductive via 1615, multiple dielectric layers 1271 and 1272, at least one first electronic component 1180 and at least one contact point 387.

[0098] The first dielectric layer 1210 may have a first dielectric surface 1210u, a second dielectric surface 1210b opposite the first dielectric surface 1210u, and a first dielectric side surface 1210s extending between the first dielectric surface 1210u and the second dielectric surface 1210b. The first antenna layer 1220 may be formed on the first dielectric surface 1210u. The ground layer 1230 may be formed below the second dielectric surface 1210b. For example, the ground layer 1230 may be formed in the dielectric layer 1271 or one of the dielectric layers 1272. The conductive layer 1240 may be formed on the first dielectric side surface 1210s of the first dielectric layer 1210. The conductive layer 1240 may be electrically connected to the ground layer 1230 and extend from the ground layer 1230 toward the first antenna layer 1220, but may not contact the first dielectric surface 1210u.

[0099] In this embodiment, dielectric layer 1271 may be formed of a material different from that of dielectric layer 1272. Ground layer 1230 may be embedded in one of dielectric layers 1272. Ground layer 1230 may have a plurality of openings 1230a, each of which may accommodate a corresponding feed pad 1262, thereby preventing feed pad 1262 from contacting the physical material of ground layer 1230. First electronic component 1180 may be electrically connected to first antenna layer 1220 via wiring layer 1260, feed pad 1262, conductive via 1215, and conductive via 1615.

[0100] refer to 17A to 17D , 17A to 17D exemplifiable Figures 1A to 1C 1. The manufacturing process of the antenna module 100 is shown in FIG.

[0101] like Figure 17A As shown, a structure 100′ including a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a second antenna layer 150, at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, and a molding compound 190 can be placed on an adhesive layer 11 and within a metal frame 12. The metal frame 12 can have a penetrating portion 12a for accommodating a portion of the first dielectric layer 110.

[0102] like Figure 17B As shown, a cover 13 may be placed to cover the connector 187 .

[0103] like Figure 17C As shown, a conductive layer 140' can be formed by sputtering or spraying a conductive coating material to cover the portion of the structure 100' that is not covered by the adhesive layer 11, the metal frame 12, and the cover 13. In addition, for example, the conductive layer 140' can be formed of a metal including aluminum, copper, gold, silver, iron, or a combination thereof.

[0104] like Figure 17D As shown, the cover 13 may be removed to form the conductive layer 140 , and then the antenna module 100 may be formed.

[0105] refer to Figure 18 , Figure 18 exemplifiable Figure 2 1. The manufacturing process of the antenna module 200 is shown in FIG.

[0106] like Figure 18As shown, a structure 100′ including a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 140, a second antenna layer 150, at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, at least one second electronic component 185, a connector 187, and a molding compound 190 can be placed on the adhesive layer 11 and in the metal frame 22. The metal frame 22 can have a through portion 22a for accommodating a portion of the first dielectric layer 110.

[0107] In this embodiment, the depth t of the through portion 22 a of the metal frame 22 may be different from the depth of the through portion 12 a of the metal frame 12 . Accordingly, the extension length of the conductive layer 140 on the first dielectric layer 110 may be controlled.

[0108] Other manufacturing processes of the antenna module 200 may be similar to the corresponding manufacturing processes of the antenna module 100 , and thus similar details may be repeated here.

[0109] refer to Figures 19A to 19D , Figures 19A to 19D exemplifiable Figure 3A to Figure 3B 1. The manufacturing process of the antenna module 300 is shown in FIG.

[0110] like Figure 19A As shown, a structure 300′ including a first dielectric layer 110, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a conductive layer 140, a second antenna layer 150, at least one wiring layer 160, at least one dielectric layer 170, at least one first electronic component 180, and at least one contact point 387 can be placed on the adhesive layer 11 and in the metal frame 12. The metal frame 12 can have a through portion 12a for accommodating a portion of the first dielectric layer 110.

[0111] like Figure 19B As shown, a cover 33 may be placed to cover the contact point 387 .

[0112] like Figure 19C As shown, a conductive layer 340 ′ may be formed to cover portions of the structure 300 ′ that are not covered by the adhesive layer 11 , the metal frame 12 , and the cover 33 .

[0113] like Figure 19D As shown, the cover 33 may be removed to form the conductive layer 340 , and then the antenna module 300 may be formed.

[0114] The manufacturing process of the antenna module 400 , the substrate 500A, and the substrate 600A is similar to the manufacturing process of the antenna module 300 , and similar details may be repeated here.

[0115] refer to Figures 20A to 20G , Figures 20A to 20G exemplifiable Figure 4 Manufacturing process of the antenna module 300'.

[0116] like Figure 20A As shown, a structure 300 including a first dielectric layer 310, at least one conductive via 115, a first antenna layer 120, a ground layer 130, a second antenna layer 150, at least one wiring layer 160, and at least one dielectric layer 170 may be provided. Although not shown, a solder mask may cover the wiring layer 160 and / or the at least one dielectric layer 170 and may have a plurality of openings exposing a plurality of contact points (such as solder pads) electrically connected to the wiring layer 160.

[0117] like Figure 20B As shown, an adhesive layer 31 may be formed to cover the solder resist layer (not shown) and contact points (not shown) exposed from the solder resist layer of the structure 300 ″.

[0118] like Figure 20C As shown, at least one first singulation passage C1 may be formed through the adhesive layer 31, the wiring layer 160, the dielectric layer 170, and a portion of the first dielectric layer 310. After forming the first singulation passage C1, each dielectric layer 170 may form a second dielectric side 170s, and the first dielectric layer 310 may form a first side 310s1.

[0119] like Figure 20D As shown, the conductive layer 340 ′ may be formed by sputtering or spraying a conductive coating material, wherein the conductive layer 340 ′ covers the adhesion layer 31 , the second dielectric side 170 s of each second dielectric layer 170 , and the first side 310 s 1 of the first dielectric layer 310 .

[0120] like Figure 20E As shown, adhesive layer 31 may be removed to expose the solder resist layer (not shown) and the contact points (not shown) exposed from the solder resist layer.

[0121] like Figure 20F As shown, at least one first electronic component 180 and / or at least one contact point 387 may be placed on a contact point (not shown) exposed from the solder resist layer.

[0122] like Figure 20G As shown, at least one second cutting channel C2 may be formed through another portion of the first dielectric layer 310 to cut off the first dielectric layer 310. After forming the second cutting channel C2, the first dielectric layer 310 may form a second side surface 310s2, wherein the first side surface 310s1 and the second side surface 310s2 are not coplanar.

[0123] The manufacturing process of the antenna module 400 ′, the substrate 500A′, and the substrate 600A′ is similar to the manufacturing process of the antenna module 300 ′, and similar details may be repeated here.

[0124] refer to Figures 21A to 21G , Figures 21A to 21G exemplifiable Figure 11 1. The manufacturing process of the antenna module 700 is shown in FIG.

[0125] like Figure 21A As shown, a structure 700 ′ including a first dielectric layer 310 , at least one conductive via 115 , a first antenna layer 120 , a ground layer 130 , and a second antenna layer 150 may be provided.

[0126] like Figure 21B As shown, the adhesive layer 31 may cover the first dielectric layer 310 of the structure 700 ′.

[0127] like Figure 21C As shown, a plurality of first cutting channels C1 may be formed through the adhesive layer 31 and a portion of the first dielectric layer 310. After the first cutting channels C1 are formed, the first dielectric layer 310 may form a first side surface 310s1.

[0128] like Figure 21D As shown, the first conductive layer 541 ′ may be formed by sputtering or spraying a conductive coating material, wherein the first conductive layer 541 ′ may cover the adhesive layer 31 and the first side surface 310 s 1 of the first dielectric layer 310 .

[0129] like Figure 21E As shown, adhesive layer 31 may be removed to expose the solder resist layer (not shown) and the contact points (not shown) exposed from the solder resist layer.

[0130] like Figure 21F As shown, at least one contact 387 may be placed on a contact point (not shown) exposed from the solder resist layer.

[0131] like Figure 21G As shown, at least one second cutting channel C2 may be formed through another portion of the first dielectric layer 310 to cut through the first dielectric layer 310 and form a plurality of antenna elements 700A. After forming the second cutting channel C2, the first dielectric layer 310 may form a second side surface 310s2, wherein the first side surface 310s1 and the second side surface 310s2 are not coplanar.

[0132] The antenna unit 700A can then be placed on the Figure 11 to form the antenna module 700 on the package 500B.

[0133] The manufacturing process of antenna module 800 may be similar to the manufacturing process of antenna module 700 , and similar details may be repeated here.

[0134] refer to Figures 22A to 22G , Figures 22A to 22G exemplifiable Figure 14 1. The manufacturing process of the antenna module 1000 is shown in FIG.

[0135] like Figure 22A As shown, a structure 1000 ′ including a first dielectric layer 1010 , a first antenna layer 120 , a ground layer 130 , at least one conductive via 115 , and at least one conductive via 615 may be provided.

[0136] like Figure 22B As shown, the adhesive layer 31 may cover the first dielectric layer 1010 of the structure 1000 ′.

[0137] like Figure 22C As shown, a plurality of first cutting channels C1 may be formed through the adhesive layer 31 and a portion of the first dielectric layer 1010. After the first cutting channels C1 are formed, the first dielectric layer 1010 may form a first side surface 310s1.

[0138] like Figure 22D As shown, the first conductive layer 541 ′ may be formed by sputtering or spraying a conductive coating material, wherein the first conductive layer 541 ′ may cover the adhesive layer 31 and the first side surface 310 s 1 of the first dielectric layer 1010 .

[0139] like Figure 22E As shown, the adhesive layer 31 may be removed to expose the first dielectric layer 1010 and a plurality of contact points exposed from the first dielectric layer 1010 .

[0140] like Figure 22F As shown, Figure 14 The package 1000B and connector 187 can be placed from Figure 22E The first dielectric layer 1010 is exposed at the contact point.

[0141] like Figure 22G As shown, at least one second cutting channel C2 may be formed through another portion of the first dielectric layer 1010 to cut through the first dielectric layer 1010 and form the antenna module 1000. After forming the second cutting channel C2, the first dielectric layer 1010 may form a second side surface 310s2, wherein the first side surface 310s1 and the second side surface 310s2 are not coplanar.

[0142] Although the present invention has been described in terms of what are presently considered to be the most practical and preferred embodiments, it will be understood that the invention is not necessarily limited to the disclosed embodiments. On the contrary, the invention is intended to cover various modifications and similar arrangements included within the spirit and scope of the claims, which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.

Claims

1. An antenna module, comprising: a first dielectric layer having a first dielectric surface, a second dielectric surface opposite the first dielectric surface, and a first dielectric side extending between the first dielectric surface and the second dielectric surface; a first antenna layer formed on the first dielectric surface; a ground layer formed below a surface of the second dielectric; as well as A conductive layer is formed on the first dielectric side of the first dielectric layer, wherein the conductive layer is electrically connected to the ground layer and extends from the ground layer toward the first antenna layer but does not contact the first dielectric surface.

2. The antenna module according to claim 1, wherein: Also includes: at least one second dielectric layer below the second dielectric surface; as well as At least one wiring layer is formed on a surface of the at least one second dielectric layer.

3. The antenna module according to claim 2, wherein: The conductive layer also extends from the ground layer to the surface of the at least one second dielectric layer.

4. The antenna module according to claim 1, wherein: The first dielectric layer includes a plurality of sub-dielectric layers, and at least two sub-dielectric layers are formed of the same or different materials.

5. The antenna module according to claim 4, wherein: The antenna module further includes a second antenna layer formed on one of the sub-dielectric layers.

6. The antenna module according to claim 5, wherein: The conductive layer also extends between the first dielectric surface and the second antenna layer.

7. The antenna module according to claim 2, wherein: Also includes: a first electronic component placed on the wiring layer; as well as a molding compound covering the wiring layer, The conductive layer further covers the second dielectric side surface of the second dielectric layer and the molding compound.

8. The antenna module according to claim 7, wherein: A portion of the wiring layer is exposed and not covered by the molding compound, and the antenna module further includes: A connector is placed on the portion of the wiring layer.

9. The antenna module according to claim 2, wherein: Also includes: At least one contact is formed between the first dielectric layer and the second dielectric layer.

10. The antenna module according to claim 9, wherein: Also includes: a first electronic component placed on the wiring layer; as well as a molding compound covering the wiring layer, The conductive layer further covers the second dielectric side surface of the second dielectric layer and the molding compound.

11. The antenna module according to claim 10, wherein: A portion of the wiring layer is exposed and not covered by the molding compound, and the antenna module further includes: A connector is placed on the portion of the wiring layer.

12. The antenna module according to claim 9, wherein: Also includes: At least one fourth dielectric layer is formed between the first dielectric layer and the at least one contact point, wherein the at least one wiring layer is formed on a surface of the at least one fourth dielectric layer.

13. The antenna module according to claim 1, wherein: Also includes: a wiring layer formed below the second dielectric surface; as well as Place the contacts on the wiring layer.

14. The antenna module according to claim 13, wherein: Also includes: a first electronic component placed on the wiring layer, The first electronic component and the contact point are placed on the same side of the wiring layer.

15. The antenna module according to claim 13, wherein: Also includes: a first electronic component placed on the wiring layer, wherein the first electronic component and the contact point are placed on two opposite sides of a second dielectric layer; as well as A third dielectric layer is placed between the wiring layer and the first dielectric layer to seal the first electronic component.

16. The antenna module according to claim 1, wherein: Also includes: a plurality of antenna units, each antenna unit comprising the first dielectric layer, the first antenna layer and the ground layer, Wherein, the multiple antenna units are spaced apart from each other.

17. The antenna module according to claim 1, wherein: Also includes: a first electronic component; as well as A third dielectric layer, wherein the first electronic component is formed in the third dielectric layer.

18. The antenna module according to claim 1, wherein: Also includes: a substrate comprising the first dielectric layer, the first antenna layer, the ground layer, and the conductive layer; a package comprising at least one second dielectric layer below the second dielectric surface and at least one wiring layer formed on a surface of the at least one second dielectric layer; as well as connectors, The package and the connector are placed on the same side of the substrate.

19. The antenna module according to claim 18, wherein: Also includes: At least one fourth dielectric layer is formed between the first dielectric layer and the package, wherein the at least one wiring layer is formed on a surface of the at least one fourth dielectric layer.

20. A method for manufacturing an antenna module, comprising: Providing a structure including a first dielectric layer, a first antenna layer, and a ground layer, wherein the first dielectric layer has a first dielectric surface, a second dielectric surface opposite the first dielectric surface, and a first dielectric side extending between the first dielectric surface and the second dielectric surface, the first antenna layer is formed on the first dielectric surface, and the ground layer is formed below the second dielectric surface; placing the structure on the adhesive layer and in the through-going portion of the metal frame; as well as forming a conductive layer to cover portions of the structure not covered by the adhesive layer and the metal frame, wherein the conductive layer is formed on the first dielectric side of the first dielectric layer, the conductive layer is electrically connected to the ground layer, and extends from the ground layer toward the first antenna layer without contacting the first dielectric surface.

21. A method for manufacturing an antenna module, comprising: Providing a structure including a first dielectric layer, a first antenna layer, and a ground layer, wherein the first dielectric layer has a first dielectric surface, a second dielectric surface opposite the first dielectric surface, and a first dielectric side extending between the first dielectric surface and the second dielectric surface, the first antenna layer is formed on the first dielectric surface, and the ground layer is formed below the second dielectric surface; placing an adhesive layer to cover the first dielectric layer of the structure; forming a plurality of first cutting channels through the adhesive layer and a portion of the first dielectric layer, wherein the first dielectric layer forms a first side; forming a conductive layer to cover the adhesive layer and the first side surface; removing the adhesive layer to expose the first dielectric layer; as well as A plurality of second cutting channels are formed to pass through another portion of the first dielectric layer, wherein the first dielectric layer forms a second side surface, and the first side surface and the second side surface are not coplanar.

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