A notebook cooling system and method using internal and external two-phase cooling cycle coupling

Abstract

A notebook heat dissipation system and method using an internal and external two-phase heat dissipation cycle coupling, the heat dissipation system includes a built-in cooling circulation pipeline and an external cooling circulation pipeline, the built-in cooling circulation pipeline includes a built-in evaporator and a built-in condenser cyclically connected to the built-in evaporator through a built-in connecting pipeline, the external cooling circulation pipeline includes an external condenser, the external condenser is cyclically connected to the built-in evaporator through an external pipeline, the built-in evaporator is connected to the external pipeline through an external pipeline connector, and the external cooling circulation pipeline is detachably connected through the external pipeline connector. In low-load mode, the built-in cooling circulation pipeline is opened separately, and in high-load mode, the built-in evaporator is connected to the external cooling circulation pipeline through an external pipeline connector. The present invention can effectively reduce the probability of notebook chip frequency reduction under high load, reduce the surface temperature of the notebook keyboard, and can greatly reduce fan noise.

Description

Technical Field

[0001] The invention belongs to the technical field of heat dissipation of electronic equipment, and in particular relates to a notebook heat dissipation system and method using internal and external two-phase heat dissipation cycle coupling. Background Art

[0002] When a laptop is in use, the graphics card, processor, and power inductor will generate a lot of heat due to high load operation. In order to prevent electronic components from failing at high temperatures, it is usually necessary to cool the chip through a built-in heat dissipation module.

[0003] Previously, notebook heat dissipation was usually achieved through built-in heat pipes and fans to dissipate internal heat. This method has limited heat dissipation capacity. At the same time, the large area of ​​heat pipes can easily cause the temperature of the notebook keyboard and palm rest to be higher than human body temperature, affecting the user experience. Since conventional built-in heat dissipation uses high-speed centrifugal fans, when the heat dissipation requirements are high, the fan speed can only be increased, which generates high noise and poor experience. With the continuous improvement of notebook chip power, higher requirements will be placed on heat dissipation capacity in the future. The current popular heat dissipation methods will be difficult to meet the heat dissipation requirements in the future. Summary of the invention

[0004] The purpose of the present invention is to address the problems in the above-mentioned prior art and provide a notebook cooling system and method using an internal and external two-phase cooling cycle coupling, which effectively reduces the probability of notebook chip frequency reduction under high load, reduces the surface temperature of the notebook keyboard, and can greatly reduce fan noise.

[0005] In order to achieve the above object, the present invention has the following technical solutions:

[0006] In a first aspect, a notebook cooling system using an internal and external two-phase cooling cycle coupling is provided, comprising an internal cooling circulation pipeline and an external cooling circulation pipeline, wherein the internal cooling circulation pipeline comprises an internal evaporator and an internal condenser cyclically connected to the internal evaporator via an internal connecting pipeline, and the external cooling circulation pipeline comprises an external condenser, and the external condenser is cyclically connected to the internal evaporator via an external pipeline, wherein the internal evaporator is connected to the external pipeline via an external pipeline connector, and the external cooling circulation pipeline is detachably connected via the external pipeline connector.

[0007] As a preferred solution of the notebook cooling system of the present invention, the built-in connecting pipeline between the inlet of the built-in evaporator and the outlet of the built-in condenser is a built-in low-temperature pipeline, and the built-in connecting pipeline between the outlet of the built-in evaporator and the inlet of the built-in condenser is a built-in high-temperature pipeline, and a built-in liquid pump is arranged on the built-in low-temperature pipeline.

[0008] As a preferred solution of the notebook cooling system of the present invention, the built-in condenser is provided with a built-in fan, the external condenser is provided with an external fan, and the external fan is an axial flow fan.

[0009] As a preferred solution of the notebook cooling system of the present invention, the built-in condenser is cyclically connected to the microchannel heat exchanger, the microchannel heat exchanger is in close contact with the processor chip, the graphics card chip and the power supply chip, and the contact surfaces of the microchannel heat exchanger and the processor chip, the graphics card chip and the power supply chip are coated with silicone grease.

[0010] As a preferred solution of the notebook cooling system of the present invention, the external pipeline between the inlet of the built-in evaporator and the outlet of the external condenser is an external low-temperature pipeline, the external pipeline between the outlet of the built-in evaporator and the inlet of the external condenser is an external high-temperature pipeline, an external liquid reservoir is arranged on the external high-temperature pipeline, an external air pump is arranged between the external liquid reservoir and the external condenser, and a second external liquid pump is arranged between the external liquid reservoir and the built-in evaporator.

[0011] As a preferred solution of the notebook cooling system of the present invention, a first external liquid pump is arranged on the external low-temperature pipeline.

[0012] As a preferred solution of the notebook cooling system of the present invention, the external pipe connectors on the inlet and outlet of the built-in evaporator are connected to one end of the third external liquid pump through a branch pipe, and the other end of the third external liquid pump is connected to the external high-temperature pipe between the external air pump and the external condenser.

[0013] In a second aspect, a heat dissipation method of the notebook heat dissipation system using the internal and external two-phase heat dissipation cycle coupling is provided, comprising the following steps:

[0014] In low-load mode, the built-in cooling circulation pipeline is opened separately, and the liquid working medium changes into a gas-liquid two-phase state through the built-in evaporator, and then enters the built-in condenser through the built-in connecting pipeline. After completing the heat exchange with the outside, it re-enters the built-in evaporator through the built-in connecting pipeline for another cycle;

[0015] In high load mode, the built-in evaporator is connected to the external cooling circulation pipeline through an external pipeline connector. The liquid working medium absorbs heat through the built-in evaporator and becomes a gas-liquid two-phase working medium, and then enters the external condenser through the external pipeline. The gaseous working medium is condensed into liquid through heat exchange with the environment, and then returns to the built-in evaporator for recirculation.

[0016] As a preferred solution of the heat dissipation method of the present invention, the liquid working medium absorbs heat through the built-in evaporator to become a gas-liquid two-phase working medium, and then enters the external liquid reservoir through a second external liquid pump. The gaseous working medium enters the external gas pump and is pumped to the external condenser through an external high-temperature pipeline.

[0017] As a preferred solution of the heat dissipation method of the present invention, the low load mode is an operating power consumption ≤ 50W, and the high load mode is an operating power consumption > 50W. In the high load mode, it is determined whether the system is connected to a power supply. If not, the current operating power consumption is maintained. If so, the user is prompted to connect an external cooling circulation pipeline. If the external cooling circulation pipeline is already connected, the power consumption is increased and full load is allowed. If not, the built-in connecting pipeline and the built-in condenser are opened to the maximum state.

[0018] Compared with the prior art, the present invention has at least the following beneficial effects:

[0019] The built-in cooling circulation pipeline adopts a two-phase heat dissipation cycle to solve the heat dissipation of the notebook under low load. At the same time, the external cooling circulation pipeline is connected to the built-in cooling circulation pipeline through the rear interface of the notebook using an external pipeline connector. By connecting the external two-phase heat dissipation cycle, the following problems are solved when the traditional notebook heat dissipation module is used: 1. When the ambient temperature is high, the air inlet temperature is high, resulting in poor cooling capacity of the fan air outlet to the heat pipe and the heat dissipation fins under high load of the notebook, resulting in the heat generated by the chip cannot be discharged in time, the chip is in a high temperature state, and finally the processor and graphics card are down-clocked, and even the power supply chip is burned. 2. The heat exchange capacity of the single liquid phase is limited, and the heat dissipation module is large in size, which reduces the portability of the notebook. The present invention can effectively reduce the probability of notebook chip down-clocking under high load, effectively reduce the surface temperature of the notebook keyboard, and greatly reduce the fan noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The present invention adopts a schematic diagram of the structure of a notebook cooling system with internal and external two-phase cooling cycles coupled;

[0021] Figure 2 The present invention adopts a heat dissipation method flow chart of a notebook heat dissipation system with an internal and external two-phase heat dissipation cycle coupling;

[0022] In the attached drawings: 1-built-in fan; 2-built-in condenser; 3-built-in high-temperature pipeline; 4-built-in evaporator; 5-built-in low-temperature pipeline; 6-built-in liquid pump; 7-built-in connecting pipeline; 8-external pipeline connector; 9-first external liquid pump; 10-external low-temperature pipeline; 11-external condenser; 12-external fan; 13-external high-temperature pipeline; 14-external air pump; 15-external liquid reservoir; 16-second external liquid pump; 17-third external liquid pump. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0024] See also Figure 1The embodiment of the present invention proposes a notebook heat dissipation system that adopts internal and external two-phase heat dissipation cycle coupling, including a built-in cooling cycle pipeline and an external cooling cycle pipeline, the built-in cooling cycle pipeline includes a built-in evaporator 4 and a built-in condenser 2 that is cyclically connected to the built-in evaporator 4 through a built-in connecting pipeline 7, wherein the built-in connecting pipeline 7 between the inlet of the built-in evaporator 4 and the outlet of the built-in condenser 2 is a built-in low-temperature pipeline 5, and the built-in connecting pipeline 7 between the outlet of the built-in evaporator 4 and the inlet of the built-in condenser 2 is a built-in high-temperature pipeline 3, and a built-in liquid pump 6 is provided on the built-in low-temperature pipeline 5. A built-in fan 1 is provided in the built-in condenser 2. The external cooling cycle pipeline includes an external condenser 11, which is cyclically connected to the built-in evaporator 4 through an external pipeline, and the built-in evaporator 4 is connected to the external pipeline through an external pipeline connector 8, and the external cooling cycle pipeline is detachably connected through the external pipeline connector 8. An external fan 12 is provided in the external condenser 11, and the external fan 12 is an axial flow fan. The external pipeline between the inlet of the built-in evaporator 4 and the outlet of the external condenser 11 is an external low-temperature pipeline 10, and a first external liquid pump 9 is arranged on the external low-temperature pipeline 10. The external pipeline between the outlet of the built-in evaporator 4 and the inlet of the external condenser 11 is an external high-temperature pipeline 13, and an external liquid reservoir 15 is arranged on the external high-temperature pipeline 13. An external air pump 14 is arranged between the external liquid reservoir 15 and the external condenser 11, and a second external liquid pump 16 is arranged between the external liquid reservoir 15 and the built-in evaporator 4. The external pipeline connectors 8 on the inlet and outlet of the built-in evaporator 4 are connected to one end of the third external liquid pump 17 through branch pipelines, and the other end of the third external liquid pump 17 is connected to the external high-temperature pipeline 13 between the external air pump 14 and the external condenser 11. The above-mentioned built-in condenser 2 of the present invention is cyclically connected to the microchannel heat exchanger, the microchannel heat exchanger is in close contact with the processor chip, graphics chip and power supply chip, and the contact surface between the microchannel heat exchanger and the processor chip, graphics chip and power supply chip is coated with silicone grease with high thermal conductivity.

[0025] See also Figure 2 The embodiment of the present invention provides a heat dissipation method of a notebook heat dissipation system using an internal and external two-phase heat dissipation cycle coupling, comprising the following steps:

[0026] In low-load mode, the specific low-load mode is when the operating power consumption is ≤50W, that is, when the total load of the CPU and GPU is 50W or lower, the built-in cooling circulation pipeline is opened separately, and the liquid working medium changes into a gas-liquid two-phase state through the built-in evaporator 4, and then enters the built-in condenser 2 through the built-in connecting pipeline 7, completes the heat exchange with the outside, and then re-enters the built-in evaporator 4 through the built-in connecting pipeline 7 for another cycle;

[0027] In high load mode, specifically, the operating power consumption is greater than 50W, that is, when the total load of the CPU and GPU is greater than 50W, the built-in evaporator 4 is connected to the external cooling circulation pipeline through the external pipeline connector 8, and the liquid working medium absorbs heat through the built-in evaporator 4 to become a gas-liquid two-phase working medium, and then enters the external condenser 11 through the external pipeline. The gaseous working medium is condensed into liquid through heat exchange with the environment, and then returns to the built-in evaporator 4 for recirculation.

[0028] In one embodiment, after the liquid working medium absorbs heat through the built-in evaporator 4 and becomes a gas-liquid two-phase working medium, it enters the external liquid reservoir 15 through the second external liquid pump 16, and the gaseous working medium therein enters the external gas pump 14 and is pumped to the external condenser 11 through the external high-temperature pipeline 13. In the high-load mode, it is determined whether the system is connected to the power supply. If not, the current operating power consumption is maintained. If yes, the user is prompted to connect to the external cooling circulation pipeline. If the external cooling circulation pipeline is connected, the power consumption is increased to allow full load. If not, the built-in liquid pump 6 and the built-in fan 1 are turned on to the maximum state.

[0029] In the present invention, when the mobile office or the notebook is under low load, the built-in liquid pump 6 can be turned on separately. The built-in liquid pump 6 is a micro liquid pump. Under the push of the micro liquid pump, the low-temperature circulating medium enters the heat exchanger with a micro channel structure through the connecting pipe, wherein the heat exchanger is in close contact with the processor chip, the graphics chip and the power supply chip, and the contact surface of the heat exchanger and the chip is coated with silicone grease with a high thermal conductivity coefficient. The temperature of the low-temperature medium rises after passing through the micro channel heat exchanger in close contact with the chip, and part of the liquid medium evaporates and absorbs heat to become gaseous. The heat exchange is enhanced by boiling, and the surface temperature of the chip is reduced to ensure that the chip is at a normal working temperature. The medium passing through the high temperature side heat exchanger becomes a two-phase high temperature medium and enters the low temperature side heat exchanger through the connecting pipe. The high temperature two-phase medium performs forced convection heat exchange with the air at the fan outlet in the low temperature side heat exchanger, releases heat to the environment, realizes the reduction of its own temperature, and the gaseous medium condenses into liquid and re-participates in the two-phase heat exchange cycle.

[0030] In high load mode, the external two-phase heat exchange radiator is connected to the internal two-phase heat exchange radiator through the reserved interface and the external pipe connector 8. The working fluid in the external radiator and the internal radiator can flow freely through the pipe. The external radiator has a larger circulation pump and a low-temperature side heat exchanger. At the same time, the external radiator fan adopts an axial flow fan with strong wind power and low noise, which can effectively cool the low-temperature side heat exchanger and reduce noise.

[0031] In the embodiment, when the total load of the CPU and GPU is 50W or lower, the internal heat dissipation cycle is turned on. When the liquid refrigerant flows through the heat exchanger at the CPU and GPU through the circulation pipeline driven by the liquid pump, the CPU and GPU are at high temperature, and the working fluid absorbs heat to cool the CPU and GPU, and the target is controlled within 80°C. The high-temperature working fluid flows to the fan side of the heat exchanger through the circulation pipeline, and the fan exhausts air to cool the high-temperature liquid in the heat exchanger, and returns to the low-temperature working fluid pipeline to participate in the heat dissipation cycle.

[0032] When the CPU and GPU are under high load and connected to power and external circulation cooling system, the internal and external cooling cycles can be turned on at the same time, allowing the system power consumption to increase to 300W, and the notebook can run at full load without frequency reduction. When the CPU and GPU are under high load and connected to the external circulation cooling system and power, but not connected to the external circulation cooling system, the liquid pump and fan speed in the internal circulation cooling system increase to the maximum allowable value, and the system cooling power consumption increases to 150W.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to impose any limitation on the technical solution of the present invention. Those skilled in the art should understand that, without departing from the spirit and principles of the present invention, the technical solution can also be subjected to several simple modifications and substitutions, and these modifications and substitutions are also within the scope of protection covered by the claims.

Claims

1. A notebook cooling system using internal and external two-phase cooling cycle coupling, characterized in that: The invention comprises a built-in cooling circulation pipeline and an external cooling circulation pipeline, wherein the built-in cooling circulation pipeline comprises a built-in evaporator (4) and a built-in condenser (2) which is cyclically connected to the built-in evaporator (4) via a built-in connecting pipeline (7), and the external cooling circulation pipeline comprises an external condenser (11), wherein the external condenser (11) is cyclically connected to the built-in evaporator (4) via an external pipeline, wherein the built-in evaporator (4) is connected to the external pipeline via an external pipeline connector (8), and the external cooling circulation pipeline is detachably connected via the external pipeline connector (8); The external pipeline between the inlet of the built-in evaporator (4) and the outlet of the external condenser (11) is an external low-temperature pipeline (10), the external pipeline between the outlet of the built-in evaporator (4) and the inlet of the external condenser (11) is an external high-temperature pipeline (13), an external liquid reservoir (15) is arranged on the external high-temperature pipeline (13), an external air pump (14) is arranged between the external liquid reservoir (15) and the external condenser (11), and a second external liquid pump (16) is arranged between the external liquid reservoir (15) and the built-in evaporator (4).

2. The notebook cooling system using internal and external two-phase cooling cycle coupling according to claim 1 is characterized in that: The built-in connecting pipeline (7) between the inlet of the built-in evaporator (4) and the outlet of the built-in condenser (2) is a built-in low-temperature pipeline (5), and the built-in connecting pipeline (7) between the outlet of the built-in evaporator (4) and the inlet of the built-in condenser (2) is a built-in high-temperature pipeline (3). A built-in liquid pump (6) is provided on the built-in low-temperature pipeline (5).

3. The notebook cooling system using internal and external two-phase cooling cycle coupling according to claim 1 is characterized in that: The built-in condenser (2) is provided with a built-in fan (1), the external condenser (11) is provided with an external fan (12), and the external fan (12) is an axial flow fan.

4. The notebook cooling system using internal and external two-phase cooling cycle coupling according to claim 1 is characterized in that: The built-in condenser (2) is cyclically connected to the microchannel heat exchanger, the microchannel heat exchanger is in close contact with the processor chip, the graphics chip and the power supply chip, and the contact surfaces of the microchannel heat exchanger and the processor chip, the graphics chip and the power supply chip are coated with silicone grease.

5. The notebook cooling system using internal and external two-phase cooling cycle coupling according to claim 1 is characterized in that: The external low-temperature pipeline (10) is provided with a first external liquid pump (9).

6. The notebook cooling system using internal and external two-phase cooling cycle coupling according to claim 1 is characterized in that: The external pipeline connectors (8) on the inlet and outlet of the built-in evaporator (4) are connected to one end of a third external liquid pump (17) through a branch pipeline, and the other end of the third external liquid pump (17) is connected to an external high-temperature pipeline (13) between an external air pump (14) and an external condenser (11).

7. A heat dissipation method for a notebook heat dissipation system using an internal and external two-phase heat dissipation cycle coupling as claimed in any one of claims 1 to 6, characterized in that: The following steps are involved: In the low-load mode, the built-in cooling circulation pipeline is opened alone, the liquid working medium changes into a gas-liquid two-phase state through the built-in evaporator (4), then enters the built-in condenser (2) through the built-in connecting pipeline (7), completes heat exchange with the outside, and then re-enters the built-in evaporator (4) through the built-in connecting pipeline (7) to circulate again; In the high-load mode, the built-in evaporator (4) is connected to the external cooling circulation pipeline via an external pipeline connector (8), the liquid working medium absorbs heat through the built-in evaporator (4) to become a gas-liquid two-phase working medium, and then enters the external condenser (11) through the external pipeline, the gaseous working medium is condensed into liquid through heat exchange with the environment, and then returns to the built-in evaporator (4) for recirculation.

8. The heat dissipation method according to claim 7, characterized in that: After the liquid working medium absorbs heat in the built-in evaporator (4) to become a gas-liquid two-phase working medium, it enters the external liquid storage tank (15) through the second external liquid pump (16), and the gaseous working medium therein enters the external gas pump (14) and is pumped to the external condenser (11) through the external high-temperature pipeline (13).

9. The heat dissipation method according to claim 7, characterized in that: The low load mode is an operating power consumption of ≤50W, and the high load mode is an operating power consumption of >50W. In the high load mode, it is determined whether the system is connected to a power supply. If not, the current operating power consumption is maintained. If so, the user is prompted to connect an external cooling circulation pipeline. If the external cooling circulation pipeline is connected, the power consumption is increased to allow full load. If the external cooling circulation pipeline is not connected, the built-in connecting pipeline (7) and the built-in condenser (2) are opened to the maximum state.

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