A process task execution method and a semiconductor process apparatus

Abstract

The embodiment of the present application provides a process task execution method and a semiconductor process equipment, the method comprises the following steps: starting the process task, and dividing wafers with the same process chamber transmission path in the process task into a subtask; when starting the subtask of the process task, respectively determining the type of the process chamber according to the transmission sequence of the process chamber in the transmission path of the subtask of the process task; functionally configuring the process chamber according to the type of the process chamber to execute the subtask of the process task; and executing all the subtasks of the process task to complete the execution of the process task. According to the embodiment of the present application, the transmission path of the wafer is analyzed in real time to determine the chamber type, the chamber function is flexibly configured according to the chamber type, manual repeated modification of the configuration item is not needed, the manual maintenance cost is saved, and the chamber configuration flexibility is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular, to a process task execution method and a semiconductor process equipment. BACKGROUND

[0002] In the process of performing etching, different types of chambers are connected on the same transmission platform, and considering the front and back relationship of etching film layers, serial and continuous processes occur between the chambers. For example, a PM1 chamber and a PM2 chamber are connected on the transmission platform, and in the process, after the wafer ends the SiN etching process of the PM2, it is required to directly perform the Al2O3 process in the PM1 without being transmitted back to the cassette before entering the PM1. This serial transmission mode can make full use of the chambers and improve the wafer transmission efficiency, while meeting the needs of different etching processes.

[0003] In the software control system of the equipment, according to the different functions of the process chambers, the first process chamber passing through in the transmission path can be defined as a Smart PM, and the serial chamber connected with the Smart PM in the transmission path can be defined as a Serial PM. The same chamber can be used as a Smart PM in one transmission path of one process task (Job) and as a Serial PM in another transmission path. The type of the chamber is set through a configuration file, and when the use mode of the chamber changes, the maintenance personnel needs to modify the corresponding configuration item in the configuration file to modify the type of the chamber, and the configuration can take effect after the software is restarted. In the automatic production process, the processing method of setting the type of the chamber through manual repeated modification of the configuration item has poor flexibility. SUMMARY

[0004] In view of the above problems, the embodiments of the present application are proposed to provide a process task execution method and a corresponding semiconductor process equipment which can overcome the above problems or at least partially solve the above problems.

[0005] To solve the above problems, the embodiments of the present application disclose a process task execution method applied to a semiconductor process equipment, wherein the semiconductor process equipment comprises process chambers used for performing process tasks on wafers, and the method comprises the following steps:

[0006] starting the process task, and dividing the wafers with the same process chamber transmission path in the process task into a subtask;

[0007] when starting the subtask of the process task, determining the types of the process chambers according to the transmission sequence of the process chambers in the transmission path of the subtask of the process task;

[0008] configuring the process chamber according to a type of the process chamber based on a transmission order of the process chamber in a transmission path of a subtask of the process task;

[0009] configuring the process chamber according to a type of the process chamber based on a transmission order of the process chamber in a transmission path of a subtask of the process task;

[0010] configuring the process chamber according to a type of the process chamber based on a transmission order of the process chamber in a transmission path of a subtask of the process task;

[0011] if the process chamber is a first process chamber required to be passed in the transmission path of the subtask of the process task, determining the type of the process chamber as the first process chamber;

[0012] if the process chamber is a process chamber other than the first process chamber required to be passed in the transmission path of the subtask of the process task, determining the type of the process chamber as the second process chamber.

[0013] configuring the process chamber according to a type of the process chamber based on a transmission order of the process chamber in a transmission path of a subtask of the process task;

[0014] configuring the process chamber according to a type of the process chamber based on a transmission order of the process chamber in a transmission path of a subtask of the process task;

[0015] configuring the process chamber according to a type of the process chamber based on a transmission order of the process chamber in a transmission path of a subtask of the process task;

[0016] after a last wafer in a previous subtask completes a process in a first process chamber in the previous subtask, adjusting a type of a first target process chamber in the previous subtask as a second process chamber in a next subtask, and controlling the next subtask to enter a waiting state in a case that there is no first process chamber in the next subtask.

[0017] configuring the process chamber according to a type of the process chamber based on a transmission order of the process chamber in a transmission path of a subtask of the process task;

[0018] The last wafer in the last subtask is processed in the last second process chamber in the last subtask, and after the process is completed, the next subtask is started, the type of a second target process chamber of the second process chamber type in the last subtask is adjusted to the first process chamber type in the next subtask, and the wafer of the next subtask is scheduled to be transferred from the wafer box to the first process chamber of the next subtask for process.

[0019] Optionally, the functional configuration of the process chamber according to the type of the process chamber to execute the subtask of the process task comprises:

[0020] The first process chamber is configured with a wafer scheduling function, a process monitoring function, a chamber recovery function and a first wafer processing function, and the second process chamber is configured with a second wafer processing function.

[0021] Optionally, the functional configuration of the process chamber according to the type of the process chamber to execute the subtask of the process task comprises:

[0022] The chamber states of the first process chamber and the second process chamber after the functional configuration are determined respectively;

[0023] If the chamber state of the first process chamber is the idle state and the chamber state of the second process chamber is the normal available state, the wafer of the subtask of the process task is scheduled to be transferred from the wafer box to the first process chamber for process to execute the subtask of the process task.

[0024] Optionally, it further comprises:

[0025] When the last wafer in the current subtask is processed in the first process chamber of the current subtask, the first process chamber of the current subtask is controlled to monitor the process remaining time of the last wafer in the current subtask;

[0026] If the process remaining time reaches a preset time threshold, the next subtask of the current subtask is started, and the wafer of the next subtask is scheduled to be transferred from the wafer box to the first process chamber of the next subtask for process.

[0027] Optionally, before the wafer of the subtask of the process task is scheduled to be transferred from the wafer box to the first process chamber for process to execute the subtask of the process task, it further comprises:

[0028] The first process chamber is controlled to execute the chamber recovery function to recover the chamber environment.

[0029] The embodiment of the application also discloses a semiconductor process equipment comprising a process chamber for processing a wafer, and the semiconductor process equipment further comprises:

[0030] a controller, configured to start the process task, and divide wafers with same process chamber transmission path in the process task into a subtask; when starting the subtask of the process task, determine types of the process chambers respectively according to transmission sequences of the process chambers in the transmission path of the subtask of the process task; functionally configure the process chambers according to the types of the process chambers to execute the subtask of the process task; and execute all the subtasks of the process task to complete the process task.

[0031] Optionally, the types of the process chambers include first process chambers and second process chambers, and the controller is configured to determine the type of the process chamber as the first process chamber if the process chamber is a first process chamber required to be passed in the transmission path of the subtask of the process task, and determine the type of the process chamber as the second process chamber if the process chamber is a process chamber other than the first process chamber required to be passed in the transmission path of the subtask of the process task.

[0032] Optionally, the controller is further configured to adjust the types of the process chambers according to transmission sequences of the process chambers in the transmission path of a next subtask when switching between two adjacent subtasks of one process task or when switching between two adjacent subtasks of two adjacent process tasks.

[0033] Optionally, the controller is configured to, after a last wafer in a previous subtask completes a process in a first process chamber in the previous subtask, control a second process chamber in the previous subtask to perform a process for the last wafer in the previous subtask, adjust a type of a first target process chamber of the first type in the previous subtask to a second type in a next subtask, and control the next subtask to enter a waiting state if there is no first process chamber in the next subtask.

[0034] Optionally, the controller is further configured to, after the last wafer in the previous subtask completes the process in the last second process chamber in the previous subtask, start the next subtask, adjust a type of a second target process chamber of the second type in the previous subtask to the first type in the next subtask, and schedule wafers of the next subtask to be transmitted from a wafer cassette to a first process chamber of the next subtask for a process.

[0035] Optionally, the controller is configured to configure the first process chamber with wafer scheduling function, process monitoring function, chamber recovery function and first wafer processing function, and configure the second process chamber with second wafer processing function.

[0036] Optionally, the controller is configured to determine the chamber state of the first process chamber and the second process chamber after the function configuration respectively, and if the chamber state of the first process chamber is idle state and the chamber state of the second process chamber is normal available state, schedule the wafer of the subtask of the process task to be transferred from the cassette to the first process chamber for process to execute the subtask of the process task.

[0037] Optionally, the controller is further configured to control the first process chamber of the current subtask to monitor the process remaining time of the last wafer in the current subtask when the last wafer in the current subtask is processed in the first process chamber of the current subtask, and if the process remaining time reaches a preset time threshold, start the next subtask of the current subtask and schedule the wafer of the next subtask to be transferred from the cassette to the first process chamber of the next subtask for process.

[0038] Optionally, the controller is further configured to control the first process chamber to execute the chamber recovery function to recover the chamber environment.

[0039] Embodiments of the present application include the following advantages:

[0040] In embodiments of the present application, the wafers with the same process chamber transmission path in the process task to be executed can be divided into a subtask, and the type of the process chamber is determined according to the transmission order of the process chamber in the transmission path of the subtask, and the process chamber is configured with functions. By using this method, the transmission path of the wafer is analyzed in real time to determine the type of the chamber, and the chamber function configuration is flexibly performed according to the type of the chamber, without the need for manual repeated modification of the configuration item, thereby saving the manual maintenance cost and improving the flexibility of the chamber configuration. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 is a schematic diagram of serial transmission of wafers in multiple chambers of an etching device;

[0042] Figure 2 is a functional comparison diagram of Smart PM and Serial PM;

[0043] Figure 3 is a schematic diagram of wafer transmission in different process tasks;

[0044] Figure 4 is a schematic diagram of execution timing of multiple process tasks;

[0045] Figure 5is a step flow chart of a process task execution method according to an embodiment of the present application;

[0046] Figure 6 is a step flow chart of another process task execution method according to an embodiment of the present application;

[0047] Figure 7 is a flow chart of a process task execution method according to an embodiment of the present application;

[0048] Figure 8 is an execution timing diagram of a process task execution method according to an embodiment of the present application;

[0049] Figure 9 is a structural block diagram of a semiconductor process equipment according to an embodiment of the present application. DETAILED DESCRIPTION

[0050] In order to make the above objectives, characteristics and advantages of the present application more apparent, more comprehensible, the present application will be further described in detail below with reference to the drawings and specific embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0051] In semiconductor manufacturing process equipment, many etching equipment adopts cluster form, 3-6 chambers are hung on the transmission platform at the same time to improve the transmission efficiency of the transmission platform as much as possible, and to achieve the purpose of optimal capacity of multiple chambers. In the field of IC (integrated circuit), in order to avoid mutual interference between chambers, etching equipment often hangs the same type of process chamber, so that after the process of each chamber is completed, the wafer will be transmitted from the chamber to the vacuum manipulator, and then returned to the Foup (wafer box) through the TM (transmission platform).

[0052] In the fields of silicon-based micro display, packaging, etc., due to the relatively large critical dimension of etching process, the requirement for particle control is relatively less stringent than in the IC field, and there is no necessary requirement for metal contamination, therefore, in order to fully utilize the chamber and achieve the purpose of passing the line as soon as possible, different types of chambers will be hung on the same transmission platform, and considering the relationship with the etching film layer, there will be a situation of serial continuous process between the chambers. Referring to Figure 1 the wafer multi-chamber serial transmission schematic diagram in an etching equipment is shown as follows:

[0053] Foup (wafer box) -> EFEM (equipment front end module) -> LoadLock (wafer transfer station) -> TM (transmission platform) -> Smart PM (PM) -> TM -> Serial PM (PM) -> TM -> LoadLock -> EFEM -> Foup.

[0054] In the software control system, the first chamber passed in the transmission path is defined as Smart PM according to the different functions of the respective process chambers, and the serial chambers in series with the Smart PM in the transmission path are defined as Serial PM. The Smart PM process is relatively complex, and the Smart PM needs to perform the action of restoring the chamber before the wafer performs the etching process; the chamber type of the Seriel PM is generally a stripping chamber, and the specific process is to remove the by-products attached to the wafer, and the process is relatively simple and does not need to perform actions such as chamber restoration. In addition, the Smart PM can configure the conditions for the wafer to participate in scheduling, monitor the remaining time of the wafer etching process in the chamber, and after the process remaining time reaches the set value, the next wafer in the Foup can be scheduled to participate in the transmission. For example, the process time of the wafer in the Smart PM can be set to 60s, and then the next wafer in the tray that has not undergone the process can be scheduled to participate in the transmission.

[0055] After the Smart PM performs the chamber restoration action, when the remaining time of the wafer process in the chamber is monitored to reach the preset time, the wafer in the tray is planned to participate in the handling sequence to ensure that the wafer is transmitted in time, so as to improve the utilization rate of the chamber. The Serial PM is only part of the transmission path and only has the function of processing wafers, and does not have the function of scheduling wafers. Referring to Figure 2 , a function comparison diagram of Smart PM and Serial PM is shown. Because the use mode of the chamber in the past is relatively fixed, the type of the chamber is realized by maintaining the configuration file. The configuration file is maintained by the software engineer, and when the use mode of the chamber changes, the configuration item needs to change accordingly. The software engineer modifies the configuration item, and after restarting the software, the configuration can take effect.

[0056] The flexibility of setting the type of the chamber by maintaining the configuration item is poor. In the continuous automatic production process, the type of the same chamber may change. Referring to Figure 3 , a wafer transmission diagram in different process tasks is shown. In Job1, the types of PM1 and PM2 are defined as Smart PM and Serial PM respectively; in Job2, because the process mode of the wafer is different, the transmission path changes, and the types of PM1 and PM2 are defined as Serial PM and Smart PM respectively. In the automatic production process, it is not feasible to set the type of the chamber by repeatedly modifying the configuration item by manual.

[0057] In the same Job, because the transmission path of the wafer is different, the type of the same chamber may change in a Job, and in this case, the prior art does not support it.

[0058] In addition, in an automatic production process, multiple Jobs use the same chamber and each chamber is of the same type in multiple Jobs, the Jobs are executed one by one in the order of being issued to the equipment. In the prior solution, the last wafer in the previous Job can be started only after the last Seriel PM process is completed. Referring to Figure 4 , a timing diagram of execution of multiple process tasks is shown. In Job 1, PM1 and PM2 processes are completed, and Job 2 starts to execute PM1 process and PM2 process. PM1 has a long idle time (PM1 IDLE Time), which reduces the production capacity. Figure 4

[0059] Therefore, the present application provides a process task execution method and a corresponding semiconductor process equipment to overcome the above problems or at least partially solve the above problems.

[0060] One of the core ideas of the embodiments of the present application is that the wafers with the same process chamber transmission path in the required process tasks can be divided into a subtask, and the type of the process chamber is determined according to the transmission order of the process chamber in the transmission path of the subtask, and the process chamber is functionally configured. By using this method, the chamber type is determined by real-time analysis of the transmission path of the wafer, and the chamber function is configured flexibly according to the chamber type, without the need for manual repeated modification of the configuration item, saving the cost of manual maintenance and improving the flexibility of chamber configuration.

[0061] Referring to Figure 5 , a step flowchart of a process task execution method according to an embodiment of the present application is shown, which is applied to a semiconductor process equipment including a process chamber for performing a process task on a wafer, and can include the following steps:

[0062] Step 501, starting the process task, and dividing wafers with the same process chamber transmission path in the process task into a subtask.

[0063] The semiconductor process equipment can be a multi-chamber cluster equipment. The wafer can be sequentially processed in multiple process chambers of the equipment. The complete wafer transmission path is usually that the wafer is transmitted from a wafer box to a transmission platform, from the transmission platform to a process chamber for processing, and then from the process chamber back to the wafer box. The process chamber transmission path of the present application specifically refers to the transmission path of the process chamber in the complete wafer transmission path. The process chamber is used for processing the wafer.

[0064] ​When the process task is started, the wafers in the process task which occupy the same process chamber and have the same transmission sequence of the process chamber can be first divided into a subtask according to the transmission path of the process chamber. One process task can be divided into multiple subtasks according to the above method. For example, in a Job, the first 10 wafers are first transmitted to PM1 and then transmitted to PM2 for process, and the first 10 wafers can be attributed to the subtask Pjob1; the last 10 wafers are first transmitted to PM2 and then transmitted to PM1 for process, and the last 10 wafers can be attributed to the subtask Pjob2.

[0065] Step 502, when starting the subtask of the process task, the type of the process chamber is determined according to the transmission sequence of the process chamber in the transmission path of the subtask of the process task.

[0066] The type of the process chamber can include a first process chamber and a second process chamber, the first process chamber corresponds to the above-mentioned Smart PM, and the second process chamber corresponds to the above-mentioned Serial PM. The first process chamber required to pass through in the transmission path can be defined as a Smart PM, and the serial chamber connected with the Smart PM in the transmission path can be defined as a Serial PM. For example, in the transmission path, the wafer needs to be first transmitted to PM1 and then transmitted to PM2 for process, and PM1 can be determined as the first process chamber and PM2 can be determined as the second process chamber.

[0067] Step 503, the process chamber is functionally configured according to the type of the process chamber to execute the subtask of the process task.

[0068] The type of the process chamber has a corresponding relationship with the configuration function, after the type of the process chamber is determined, the equipment can automatically functionally configure each process chamber according to the type of the chamber, without manual modification of the configuration item.

[0069] Step 504, all the subtasks of the process task are executed to complete the execution of the process task.

[0070] In the embodiment of the application, the process task is divided into subtasks, and when all the subtasks are executed, it means that the process task is executed.

[0071] In summary, in the embodiment of the present application, the wafers with the same process chamber transmission path in the required process task can be divided into a subtask, and the type of the process chamber is determined according to the transmission sequence of the process chamber in the transmission path of the subtask, and the process chamber is functionally configured. By using this method, the transmission path of the wafer is analyzed in real time to determine the type of the chamber, and the chamber function configuration is flexibly performed according to the type of the chamber, without the need for manual repeated modification of the configuration item, thereby saving the manual maintenance cost and improving the flexibility of the chamber configuration.

[0072] Referring to Figure 6 , another process task execution method of the embodiment of the present application is shown, which is applied to a semiconductor process equipment including process chambers for performing process tasks on wafers, and can include the following steps:

[0073] Step 601, starting the process task, and dividing the wafers with the same process chamber transmission path in the process task into a subtask.

[0074] The semiconductor process equipment can be a multi-chamber cluster equipment. The wafers can be sequentially processed in multiple process chambers of the equipment. The complete wafer transmission path is usually that the wafer is transmitted from a cassette to a transmission platform, from the transmission platform to a process chamber for processing, and then from the process chamber back to the cassette after the processing is completed. The process chamber transmission path of the present application specifically refers to the transmission path of the process chamber in the complete wafer transmission path. The process chamber is used for processing the wafer.

[0075] In the embodiment of the present application, the process task is divided into multiple subtasks according to the process chamber transmission path of the wafer. When the process task or the subtask in the process task occupies different process chambers, multiple process tasks or multiple subtasks can be executed synchronously without affecting each other.

[0076] Step 602, when starting the subtask of the process task, the type of the process chamber is determined according to the transmission sequence of the process chamber in the transmission path of the subtask of the process task.

[0077] The type of the process chamber includes a first process chamber and a second process chamber. The first process chamber corresponds to the Smart PM mentioned above; and the second process chamber corresponds to the Serial PM mentioned above.

[0078] When starting to execute a subtask in a process task, the type of each process chamber can be determined according to the transmission sequence of the process chamber in the transmission path corresponding to the subtask. The first process chamber required to pass through in the transmission path can be defined as a Smart PM, and the serial chamber connected in series with the Smart PM in the transmission path can be defined as a Serial PM. It should be noted that in addition to the above-mentioned chamber type determination method, the chamber type can also be flexibly set according to actual needs by those skilled in the art, for example, the first two process chambers required to pass through in the transmission path can be defined as a first process chamber, and the serial chamber connected in series with the first two process chambers in the transmission path can be defined as a second process chamber. The determination method of the chamber type is not specifically limited in the embodiments of the present application.

[0079] In step 603, the process chamber is functionally configured according to the type of the process chamber to execute the subtask of the process task.

[0080] In the embodiments of the present application, the correspondence between the type of the process chamber and the configuration function can be pre-stored in the semiconductor process equipment. When the chamber type to which the process chamber belongs is determined, the equipment can automatically functionally configure each process chamber according to the chamber type, without manual modification of the configuration item.

[0081] For step 603, the following steps can be performed:

[0082] In substep S11, the first process chamber is configured with a wafer scheduling function, a process monitoring function, a chamber recovery function and a first wafer processing function, and the second process chamber is configured with a second wafer processing function.

[0083] In an optional embodiment, the first process chamber can be configured with a wafer scheduling function, a process monitoring function, a chamber recovery function and a corresponding first wafer processing function.

[0084] The process monitoring function refers to monitoring the process remaining time of the wafer being processed in the chamber; the wafer scheduling function refers to scheduling the next wafer in the cassette to participate in the transmission when the process remaining time of the wafer reaches a preset time threshold, to ensure timely transmission of the wafer; the chamber recovery function refers to cleaning the chamber environment before the process; and the first wafer processing function refers to a relatively complex processing process for the wafer.

[0085] The second process chamber can also be configured with a second wafer processing function. The second wafer processing function refers to a relatively simple processing process for the wafer, such as a de-gluing process.

[0086] For step 603, the following steps can be performed:

[0087] Sub-step S21, respectively determine the chamber state of the first process chamber and the second process chamber after the functional configuration.

[0088] Sub-step S22, if the chamber state of the first process chamber is the idle state and the chamber state of the second process chamber is the normal available state, dispatch the wafer of the sub-task of the process task from the cassette to the first process chamber for process to execute the sub-task of the process task.

[0089] In the case that the first process chamber is in the idle state and the second process chamber is in the normal available state, the wafer can be dispatched to participate in the transmission and process, otherwise the process task can be set to the waiting state.

[0090] In an example, before the dispatching the wafer of the sub-task of the process task from the cassette to the first process chamber for process to execute the sub-task of the process task, further comprising:

[0091] Control the first process chamber to execute the chamber recovery function to recover the chamber environment.

[0092] In a specific implementation, in the case that the process chamber is in the alarm or in the maintenance state or other unavailable state, monitor the chamber state, when the chamber can normally participate in the process, according to the current executed sub-task, set the chamber type, and then add the chamber to the scheduling of the corresponding sub-task. When the first process chamber in the sub-task completes the chamber recovery action according to the setting, and the second process chamber can be normally used, the first process chamber can start to dispatch the first wafer (W1) to participate in the movement and process, otherwise the process task is in the waiting state.

[0093] Step 604, execute all the sub-tasks of the process task to complete the execution of the process task.

[0094] Dispatch the first wafer from the cassette to participate in the transmission, the sub-task starts, and after the wafer is transmitted to the first process chamber, the wafer can be processed in the first process chamber. The first process chamber can monitor the process remaining time, if it is monitored that the process remaining time reaches the preset time threshold, and the second process chamber in the sub-task is in the normal available state, the first process chamber can dispatch the next wafer (Wn) in the sub-task to participate in the transmission. After the wafer in the first process chamber completes the process, the wafer can be transmitted into the second process chamber for process. Repeat the above process until the process of all wafers in the sub-task is executed.

[0095] After a subtask is executed, the next subtask can be started. In an optional embodiment, when the last wafer in the current subtask is processed in the first process chamber of the current subtask, the first process chamber of the current subtask monitors the remaining processing time of the last wafer in the current subtask; if the remaining processing time reaches a preset time threshold, the next subtask of the current subtask is started, and the wafer of the next subtask is transferred from the wafer box to the first process chamber of the next subtask for processing.

[0096] When the process chamber transmission path of the currently executed subtask is the same as the process chamber transmission path of the next executed subtask, the first process chamber can monitor the remaining processing time when the last wafer in the subtask is processed in the first process chamber, and when a preset time threshold is reached, the first process chamber can be released to the next subtask in advance, and the next subtask can be started; if the wafer in the current process task is completely processed in the first process chamber, the first process chamber can be released to the next process task in advance, and the next process task can be started.

[0097] Step 605, when switching between two adjacent subtasks of one process task or when switching between two adjacent subtasks of two adjacent process tasks, the type of the process chamber is adjusted according to the transmission sequence of the process chamber in the transmission path of the next subtask.

[0098] In the embodiments of the present application, the type of the process chamber needs to be adjusted when switching between two adjacent subtasks (including belonging to the same process task or belonging to different process tasks).

[0099] For step 605, the following steps can be performed:

[0100] After the last wafer in the previous subtask is processed in the first process chamber in the previous subtask, the type of the first target process chamber of the first process chamber in the previous subtask is adjusted to the second process chamber in the next subtask while the second process chamber in the previous subtask is controlled to process the last wafer in the previous subtask, and if there is no first process chamber in the next subtask, the next subtask is controlled to enter a waiting state.

[0101] After the next subtask is controlled to enter the waiting state, the following steps are further included:

[0102] The last wafer in the last sub-task is processed in the last second process chamber in the last sub-task, and the next sub-task is started after the last wafer is processed in the last second process chamber in the last sub-task. The type of a second target process chamber of the second process chamber type in the last sub-task is adjusted to the first process chamber type in the next sub-task, and the wafer in the next sub-task is scheduled to be transferred from the wafer cassette to the first process chamber in the next sub-task for processing.

[0103] In an optional embodiment, the last wafer in the last sub-task can be transferred to the second process chamber for processing after the corresponding first process chamber is processed. At this time, the first process chamber in the last sub-task can be released to the next sub-task, and the type of the first target process chamber of the first process chamber type in the last sub-task is adjusted to the second process chamber type in the next sub-task. At this time, the next sub-task enters a waiting state because there is no first process chamber available in the next sub-task.

[0104] The last wafer in the last sub-task is processed in the last second process chamber in the last sub-task, and the next sub-task is started after the last wafer is processed in the last second process chamber in the last sub-task. The type of a second target process chamber of the second process chamber type in the last sub-task is adjusted to the first process chamber type in the next sub-task. At this time, the wafer in the next sub-task can be started to be scheduled because there is a first process chamber available in the next sub-task.

[0105] In an optional embodiment, the last wafer in the last sub-task of the last process task is processed in the first process chamber in the last sub-task of the last process task, and it is determined whether the process chamber transmission path of the first sub-task of the next process task to be executed is the same as the process chamber transmission path of the last sub-task of the last process task. If it is determined that the process chamber transmission path of the first sub-task of the next process task to be executed is the same as the process chamber transmission path of the last sub-task of the last process task, the second process chamber in the last sub-task of the last process task is controlled to process the last wafer in the last sub-task of the last process task, the first sub-task of the next process task is started, and the wafer in the first sub-task of the next process task is scheduled to be transferred from the wafer cassette to the first process chamber in the first sub-task of the next process task for processing.

[0106] Using the above method, if the process chamber transmission path of the last sub-task of the last process task is the same as the process chamber transmission path of the first sub-task of the next process task, the first process chamber in the last sub-task of the last process task can be released to the next process task in advance.

[0107] In order for those skilled in the art to better understand the steps 601 to 605 of the embodiments of the present application, the following is described by an example:

[0108] Referring to Figure 7 , a flow chart of a process task execution method according to an embodiment of the present application is shown, and the specific flow includes:

[0109] 1. When starting a Job, the wafer transmission path is parsed, and the Job is divided into one or more sub-tasks (PJob), the wafers in the same PJob have the same process chamber transmission path, and the multiple PJobs are executed in sequence.

[0110] 2. When starting a PJob, the type of process chamber is set according to the transmission path of the current PJob, including Smart PM and Serial PM, and the process chamber is added to the scheduling of the PJob.

[0111] 3. The Smart PM in the PJob completes the chamber recovery action according to the setting, and when the Smart PM and the Serial PM in the PJob are idle and can be normally used, the Smart PM can start scheduling the wafers in the Foup to participate in movement and process; otherwise, the Job is in a waiting state.

[0112] 4. When the wafers are processed in the Smart PM, after the remaining time of the process in the Smart PM reaches the set value, i.e., reaches the preset timing, and the Serial PM in the PJob is idle and can be normally processed, the Smart PM can schedule the next wafer in the PJob to participate in movement, and after completing the process in the Smart PM, the wafer in the Smart PM is transmitted to the Serial PM for processing; otherwise, the Job is in a waiting state.

[0113] 5. Repeat step 4 until the wafers in the PJob are all processed.

[0114] 6. When the last wafer in the PJob is processed in the Smart PM, the Smart PM can release the Smart PM to the next PJob in advance after monitoring that the remaining process time reaches the set value, and the next PJob can be started; if all the wafers in the Job are processed, the Smart PM can be released to the next Job, and the next Job can be started.

[0115] 7. Repeat the above steps until all Jobs are completed.

[0116] The execution timing of the Job is described by taking two process chambers + two Jobs as an example:

[0117] (I) In different Jobs or PJobs, the types of process chambers are different

[0118] Job1

[0119] Pjob1: Foup→EFEM→LL→TM→PM1→TM→PM2→TM→LL→EFEM→Foup

[0120] Pjob2: Foup→EFEM→LL→TM→PM2→TM→PM1→TM→LL→EFEM→Foup

[0121] Job2

[0122] Pjob1: Foup→EFEM→LL→TM→PM1→TM→PM2→TM→LL→EFEM→Foup

[0123] Pjob2: Foup→EFEM→LL→TM→PM2→TM→PM1→TM→LL→EFEM→Foup

[0124] After Job1 and Job2 are issued to the equipment, the process is as follows:

[0125] 1. After Job1 is started, according to the different transmission paths of the process chambers, Job1 is divided into Pjob1 and Pjob2. After Job1.Pjob1 is started, PM1 and PM2 are set to Smart PM and Serial PM. After PM1 completes the chamber recovery action according to the setting, PM1 schedules a wafer (W1) to be transmitted to PM1 for process through TM;

[0126] 2. When PM1 monitors that the remaining process time reaches the set value, that is, reaches the preset opportunity, and PM2 can normally process, PM1 schedules the next wafer (Wn) in Job1.PJob1 to move. After the wafer (W1) completes the PM1 process, it is transmitted to PM2 for process;

[0127] 3. Step 2 is repeated until the last wafer in Job1.PJob1 completes the process in PM1. At this time, Job1.PJob2 is started and PM1 is set to Serial PM. Since there is no Smart PM available for Job1.PJob2 at this time, Job1.PJob2 enters a waiting state;

[0128] 4. After the last wafer in Job1.PJob1 completes the process in PM2, Job1.Pjob2 is started and PM2 is set to Smart PM;

[0129] 5、When the remaining time of the process monitored by PM2 reaches the set value, and PM1 can normally process, PM2 dispatches the next wafer (Wn) in Job1.PJob2 to move. After the wafer completes the process in PM2, it is transferred to PM1 for process;

[0130] 6、Repeat step 5 until the last wafer in Job1.PJob2 completes the process in PM2. At this time, Job2.Pjob1 is started and PM2 is set as Serial PM. Since there is no Smart PM available for Job2.Pjob1 at this time, Job2.Pjob1 enters a waiting state;

[0131] 7、After the last wafer in Job1.PJob2 completes the process in PM1, Job2.Pjob1 is started and PM1 is set as Smart PM;

[0132] 8、Repeat steps 1, 2, 3, 4, 5, and 6 until Job2 ends.

[0133] (ii) In different jobs, the types of process chambers are the same

[0134] Job1

[0135] Pjob1: Foup→EFEM→LL→TM→PM1→TM→PM2→TM→LL→EFEM→Foup

[0136] Job2

[0137] Pjob1: Foup→EFEM→LL→TM→PM1→TM→PM2→TM→LL→EFEM→Foup

[0138] After Job1 and Job2 are issued to the equipment, the process is as follows:

[0139] 1、After Job1 is started, Pjob1 is started, PM1 and PM2 are set as Smart PM and Serial PM, and PM1 dispatches the wafer (W1) to move through TM to PM1 for process;

[0140] 2、When the remaining time of the process monitored by PM1 reaches the set value, i.e., reaches the preset timing, and PM2 can normally process, PM1 dispatches the next wafer (Wn) in Job1.PJob1 to move. After the wafer completes the process in PM1, the wafer in PM1 is transferred to PM2 for process;

[0141] 3, repeat step 2 until the last wafer in Job1.Pjob1 is finished in PM1, at this time Job2.PJob1 starts, PM1 is released to Job2, PM1 is set as Smart PM, Job2.PJob1 can start to transfer wafers immediately, until all wafers in Job2 are finished. Figure 8 The execution timing diagram of the process task execution method is shown in FIG. 9. In different Jobs, if the transfer paths of the process chambers are the same, PM1 can start the process of Job2 immediately after finishing the process of Job1, which can improve the utilization of the chambers and the production capacity of the equipment.

[0142] In conclusion, in the embodiments of the present application, wafers with the same transfer path of the process chamber in the process task to be executed can be divided into a subtask, and the type of the process chamber is determined according to the transfer order of the process chamber in the transfer path of the subtask, and the process chamber is functionally configured. By using this method, the transfer path of the wafer is analyzed in real time to determine the type of the chamber, and the chamber is flexibly configured according to the type of the chamber, without the need for manual repeated modification of the configuration items, saving the cost of manual maintenance and improving the flexibility of chamber configuration. In addition, the problem that the Job cannot be executed when the type of the same process chamber changes in different Jobs in the automatic production process can be solved. In the case where there are multiple Jobs in the equipment and the transfer paths of the process chambers are the same, the Job executed later can be started in advance, which improves the utilization of the chamber and further improves the production capacity of the equipment.

[0143] It should be noted that for the method embodiments, in order to simply describe, they are all described as a combination of a series of actions, but those skilled in the art should know that the embodiments of the present application are not limited by the order of the actions described, because according to the embodiments of the present application, certain steps can be performed in other order or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions involved are not necessarily necessary for the embodiments of the present application.

[0144] Referring to FIG. 9, Figure 9 , a structural block diagram of a semiconductor process equipment according to an embodiment of the present application is shown, which includes process chambers for performing process tasks on wafers, and further includes:

[0145] The controller 9011 is configured to start the process task, divide wafers with the same process chamber transmission path in the process task into a subtask, determine the type of the process chamber according to the transmission sequence of the process chamber in the transmission path of the subtask of the process task when starting the subtask of the process task, perform functional configuration on the process chamber according to the type of the process chamber to execute the subtask of the process task, and execute all the subtasks of the process task to complete the process task.

[0146] In an optional embodiment of the present application, the type of the process chamber includes a first process chamber and a second process chamber, and the controller is configured to determine the type of the process chamber as the first process chamber if the process chamber is the first process chamber required to be passed in the transmission path of the subtask of the process task, and determine the type of the process chamber as the second process chamber if the process chamber is a process chamber other than the first process chamber required to be passed in the transmission path of the subtask of the process task.

[0147] In an optional embodiment of the present application, the controller is further configured to adjust the type of the process chamber according to the transmission sequence of the process chamber in the transmission path of the next subtask when switching between two adjacent subtasks of one process task or when switching between two adjacent subtasks of two adjacent process tasks.

[0148] In an optional embodiment of the present application, the controller is configured to, after the last wafer in the previous subtask completes the process in the first process chamber in the previous subtask, control the second process chamber in the previous subtask to perform the process on the last wafer in the previous subtask, adjust the type of the first target process chamber of the first type in the previous subtask to the second type in the next subtask, and control the next subtask to enter a waiting state if there is no first process chamber in the next subtask.

[0149] In an optional embodiment of the present application, the controller is further configured to, after the last wafer in the previous subtask completes the process in the last second process chamber in the previous subtask, start the next subtask, adjust the type of a second target process chamber of the second type in the previous subtask to the first type in the next subtask, and schedule the wafer of the next subtask to be transmitted from a wafer cassette to the first process chamber of the next subtask for process.

[0150] In an alternative embodiment of the present application, the controller is configured to configure the first process chamber with wafer scheduling function, process monitoring function, chamber recovery function and first wafer processing function, and configure the second process chamber with second wafer processing function.

[0151] In an alternative embodiment of the present application, the controller is configured to determine the chamber status of the first process chamber and the second process chamber after the function configuration respectively, and if the chamber status of the first process chamber is idle status and the chamber status of the second process chamber is normal available status, then schedule the wafer of the subtask of the process task to be transferred from the cassette to the first process chamber for process to execute the subtask of the process task.

[0152] In an alternative embodiment of the present application, the controller is further configured to control the first process chamber of the current subtask to monitor the process remaining time of the last wafer of the current subtask when the last wafer of the current subtask is processed in the first process chamber of the current subtask, and if the process remaining time reaches a preset time threshold, then start the next subtask of the current subtask and schedule the wafer of the next subtask to be transferred from the cassette to the first process chamber of the next subtask for process.

[0153] In an alternative embodiment of the present application, the controller is further configured to control the first process chamber to execute the chamber recovery function to recover the chamber environment.

[0154] In summary, in the embodiment of the present application, the wafers with the same process chamber transfer path in the process task to be executed can be divided into a subtask, and the type of the process chamber is determined according to the transfer order of the process chamber in the transfer path of the subtask, and the process chamber is configured with functions according to the type of the process chamber. By using this method, the transfer path of the wafer is analyzed in real time to determine the type of the chamber, and the chamber function configuration is flexible according to the type of the chamber, without the need for manual repeated modification of the configuration item, saving the manual maintenance cost and improving the flexibility of the chamber configuration.

[0155] For the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the related parts are referred to the part of the method embodiment.

[0156] The embodiment of the present application also provides an electronic device, which comprises a processor, a memory and a computer program stored in the memory and capable of running on the processor, wherein the computer program is executed by the processor to implement each process of the process task execution method embodiment and achieve the same technical effect, and thus the details are not repeated here.

[0157] The embodiment of the present application further provides a computer readable storage medium, and a computer program is stored on the computer readable storage medium. The computer program is executed by a processor to implement each process of the process task execution method embodiment, and the same technical effects can be achieved. To avoid repetition, details are not described herein.

[0158] For the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and relevant parts are described in the part of the method embodiment.

[0159] Each embodiment in the specification is described in a progressive manner, and each embodiment mainly describes differences from other embodiments. The same parts between each embodiment are described in each other.

[0160] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a device, or a computer program product. Therefore, the embodiments of the present application can be in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the embodiments of the present application can be in the form of a computer program product implemented on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program codes.

[0161] The embodiments of the present application are described with reference to flowcharts and / or block diagrams of the method, terminal device (system), and computer program product according to the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and the combination of the flows and / or blocks in the flowcharts and / or block diagrams can be implemented by computer program instructions. These computer program instructions can be provided to a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to produce a machine, so that the instructions executed by the computer or other programmable data processing terminal device produce a device for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 an apparatus that performs the functions specified in one or more flows and / or blocks.

[0162] These computer program instructions can also be stored in a computer readable storage medium that can guide the computer or other programmable data processing terminal device to work in a specific manner, so that the instructions stored in the computer readable storage medium produce a product including instruction apparatus, which implements the functions specified in the flowcharts and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 an apparatus that performs the functions specified in one or more flows and / or blocks.

[0163] These computer program instructions can also be loaded into a computer or other programmable data processing terminal device, so that a series of operational steps are performed on the computer or other programmable terminal device to generate a computer-implemented process, so that the instructions executed on the computer or other programmable terminal device provide a process for implementing the functions specified in the flowchart Figure 1 one flowchart or multiple flowcharts and / or blocks Figure 1 one flowchart or multiple flowcharts and / or blocks

[0164] Although the preferred embodiments of the present application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they have the basic inventive concept. Therefore, the appended claims are intended to cover all changes and modifications falling within the scope of the embodiments of the present application.

[0165] Finally, it should be noted that the relational terms herein, such as first and second, and the like, are used solely to distinguish one from another entity or action, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or terminal device. Without further limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or terminal device that comprises the recited element.

[0166] The above describes in detail a process task execution method and a semiconductor process equipment provided by the present application, and the principles and implementation manners of the present application are described by using specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manners and application ranges can be changed. In summary, the content of the present description should not be understood as a limitation of the present application.

Claims

1. A method of process task execution, characterized by, Applied to a semiconductor process equipment, the semiconductor process equipment includes a process chamber for processing a wafer, the method comprises: starting the process task, and dividing wafers with the same process chamber transmission path in the process task into a subtask; when starting the subtask of the process task, determining the type of the process chamber according to the transmission sequence of the process chamber in the transmission path of the subtask of the process task; functionally configuring the process chamber according to the type of the process chamber to execute the subtask of the process task; executing all subtasks of the process task to complete the process task; wherein the type of the process chamber includes a first process chamber and a second process chamber, and the type of the process chamber is determined according to the transmission sequence of the process chamber in the transmission path of the subtask of the process task, comprising: if the process chamber is the first process chamber required to pass through in the transmission path of the subtask of the process task, the type of the process chamber is determined as the first process chamber; if the process chamber is a process chamber other than the first process chamber required to pass through in the transmission path of the subtask of the process task, the type of the process chamber is determined as the second process chamber.

2. The method of claim 1, wherein, Further comprising: when switching between two adjacent subtasks of one process task, or when switching between two adjacent subtasks of two adjacent process tasks, adjusting the type of the process chamber according to the transmission sequence of the process chamber in the transmission path of the next subtask.

3. The method of claim 2, wherein, The type of the process chamber is adjusted according to the transmission sequence of the process chamber in the transmission path of the next subtask, comprising: after the last wafer in the previous subtask completes the process in the first process chamber in the previous subtask, the type of the first target process chamber of the first process chamber in the previous subtask is adjusted to the second process chamber in the next subtask, and the next subtask is controlled to enter a waiting state in the case that there is no first process chamber in the next subtask.

4. The method of claim 3, wherein, After the next subtask is controlled to enter a waiting state, further comprising: after the last wafer in the previous subtask completes the process in the last second process chamber in the previous subtask, starting the next subtask, adjusting the type of a second target process chamber of the second process chamber in the previous subtask to the first process chamber in the next subtask, and scheduling the wafer of the next subtask to be transmitted from a wafer cassette to the first process chamber of the next subtask for processing.

5. The method of claim 1, wherein, The process chamber is functionally configured according to the type of the process chamber to execute the subtask of the process task, comprising: The first process chamber is configured with a wafer scheduling function, a process monitoring function, a chamber recovery function and a first wafer processing function, and the second process chamber is configured with a second wafer processing function.

6. The method of claim 1, wherein, The function configuration of the process chambers according to the types of the process chambers comprises: The chamber states of the first process chamber and the second process chamber after the function configuration are determined respectively; If the chamber state of the first process chamber is an idle state and the chamber state of the second process chamber is a normal available state, the wafers of the sub-tasks of the process task are scheduled to be transferred from a cassette to the first process chamber for processing to execute the sub-tasks of the process task.

7. The method of claim 1, wherein, Further comprising: When the last wafer in a current sub-task is processed in the first process chamber of the current sub-task, the first process chamber of the current sub-task is controlled to monitor the processing remaining time of the last wafer in the current sub-task; If the processing remaining time reaches a preset time threshold, a next sub-task of the current sub-task is started, and the wafers of the next sub-task are scheduled to be transferred from a cassette to the first process chamber of the next sub-task for processing.

8. The method of claim 6, wherein, Before the scheduling of the wafers of the sub-tasks of the process task to be transferred from a cassette to the first process chamber for processing to execute the sub-tasks of the process task, further comprising: The first process chamber is controlled to execute the chamber recovery function to recover the chamber environment.

9. A semiconductor process apparatus characterized by comprising: The semiconductor process equipment comprises: A controller is configured to start the process task, divide the wafers with the same process chamber transfer path in the process task into a sub-task, determine the types of the process chambers according to the transfer sequence of the process chambers in the transfer path of the sub-task of the process task when starting the sub-task of the process task, functionally configure the process chambers according to the types of the process chambers to execute the sub-task of the process task, and execute all the sub-tasks of the process task to complete the process task. The types of the process chambers comprise a first process chamber and a second process chamber, and the controller is configured to determine the type of the process chamber as the first process chamber if the process chamber is the first process chamber required to be passed in the transfer path of the sub-task of the process task, and determine the type of the process chamber as the second process chamber if the process chamber is other process chamber required to be passed in the transfer path of the sub-task of the process task except the first process chamber.

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