A wafer cleaning system with improved airflow and working method thereof

Abstract

The present invention discloses a wafer cleaning system with improved airflow and a working method thereof, wherein the wafer cleaning system with improved airflow comprises: an isolation chamber; a cleaning unit, the cleaning unit is arranged in the isolation chamber, and the cleaning unit is connected with the isolation chamber, and the cleaning unit is used to clean the wafer; an air input unit, the air output unit is used to input clean air to the top of the isolation chamber; a gas exhaust unit, the gas exhaust unit is used to exhaust the gas at the inner bottom of the cleaning unit; a nitrogen input unit, the nitrogen input unit is used to input nitrogen into the cleaning unit. Through the application of the present invention, the internal airflow of the cleaning unit in the isolation chamber is maintained in a relatively stable state under the cooperation of the air input unit, the gas exhaust unit and the nitrogen input unit, so that in the cleaning process of the wafer, the cleaning liquid used for wafer cleaning is difficult to crystallize and accumulate, and the cleaning quality of the wafer is further improved.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more particularly to a wafer cleaning system with improved airflow and its operating method. Background Art

[0002] Existing single-wafer cleaning equipment typically employs a cavity combined with other spray devices to clean the wafer surface. During this process, the wafer rotates at high speed, and the cleaning solution sprayed by the spray devices diffuses across the wafer surface and is then ejected outwards. Simultaneously, a corresponding air-blowing structure is installed within the cavity to assist in the wafer cleaning process. However, in existing wafer cleaning equipment, the airflow changes generated by the operation of the air-blowing structure can easily lead to crystal accumulation of the cleaning solution at the wafer edges and on the inner walls of the cavity during wafer rotation, affecting the normal operation of the wafer cleaning process. Summary of the Invention

[0003] In view of this, in order to solve the above problems, the object of the present invention is to provide a wafer cleaning system with improved airflow, comprising:

[0004] Isolation room;

[0005] A cleaning unit is provided in the isolation chamber and is connected to the isolation chamber. The cleaning unit is used to clean wafers.

[0006] An air input unit is provided for inputting clean air into the top of the isolation chamber;

[0007] A gas discharge unit is provided for discharging gas from the bottom inner part of the cleaning unit.

[0008] A nitrogen input unit is used to input nitrogen into the cleaning unit.

[0009] In another preferred embodiment, the cleaning unit includes: a support platform, a spray assembly, and a cleaning chamber. The cleaning chamber is disposed within the isolation chamber, the support platform is disposed within the cleaning chamber, the wafer is supported on the support platform, and the spray assembly is disposed above the support platform for spraying cleaning fluid onto the wafer.

[0010] In another preferred embodiment, the air input unit includes an air inlet, an air purification device, and an air supply device. The input end of the air inlet is located outside the isolation chamber, the output end of the air inlet is connected to the input end of the air purification device, the input end of the air supply device is connected to the output end of the air purification device, and the output end of the air supply device passes through the isolation chamber and is located above the support platform.

[0011] In another preferred embodiment, the gas discharge unit includes: a gas outlet, an exhaust device, and a gas filter. The output end of the gas outlet is located outside the isolation chamber, the input end of the gas outlet is connected to the output end of the exhaust device, the input end of the exhaust device is connected to the output end of the gas filter, and the input end of the gas filter passes through the isolation chamber and is connected to the bottom of the cleaning chamber.

[0012] In another preferred embodiment, a waste liquid tank is provided at the bottom of the cleaning chamber, one end of the top of the waste liquid tank is connected to the bottom of the cleaning chamber, and the other end of the top of the waste liquid tank is connected to the input end of the gas filtration device.

[0013] In another preferred embodiment, the nitrogen input unit includes a nitrogen supply device and a nitrogen nozzle. The nitrogen supply device is disposed outside the isolation chamber, and the input end of the nitrogen supply device passes through the isolation chamber and the cleaning chamber and is connected to the nitrogen nozzle. The nitrogen nozzle is disposed on the support platform and is used to blow air onto the bottom of the wafer.

[0014] In another preferred embodiment, the nitrogen nozzle is provided with a plurality of vent holes, which are arranged circumferentially along the nitrogen nozzle, and each vent hole is positioned toward the bottom edge of the wafer.

[0015] In another preferred embodiment, the output end of the air input unit is provided with a first gas flow monitoring device, the input end of the gas discharge unit is provided with a second gas flow monitoring unit, and the output end of the nitrogen input unit is provided with a third gas flow monitoring unit.

[0016] In another preferred embodiment, the system further includes a control system, wherein the cleaning unit, the first gas flow monitoring device, the second gas flow monitoring device, and the third gas flow monitoring device are all communicatively connected to the control system.

[0017] The present invention also aims to provide a method for operating an airflow-improved wafer cleaning system, comprising the airflow-improved wafer cleaning system described in any one of the above-mentioned claims, including the following steps:

[0018] Step S1: The cleaning unit cleans the wafer.

[0019] Step S2: The nitrogen input unit inputs nitrogen into the cleaning unit;

[0020] In step S3, the nitrogen input unit continues to input nitrogen into the cleaning unit, and the air input unit inputs clean gas into the isolation chamber;

[0021] In step S4, the nitrogen input unit continues to input nitrogen into the cleaning unit, the air input unit continues to input clean gas into the isolation chamber, and the gas exhaust unit simultaneously exhausts the gas in the cleaning unit.

[0022] The present invention, by adopting the above-mentioned technical solution, has the following positive effects compared with the prior art: By applying the present invention, the airflow inside the cleaning unit in the isolation chamber is kept in a relatively stable state with the cooperation of the air input unit, the gas exhaust unit and the nitrogen input unit. This allows the airflow on the surface of the wafer to diffuse evenly during the wafer cleaning process, and also makes it difficult for the cleaning solution used for wafer cleaning to crystallize and accumulate, thereby further improving the cleaning quality of the wafer. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a wafer cleaning system with improved airflow according to the present invention.

[0024] In the attached image:

[0025] 1. Isolation chamber; 2. Cleaning unit; 3. Air inlet; 4. Air purification device; 5. Air supply device; 6. Gas outlet; 7. Exhaust device; 8. Gas filtration device; 9. Nitrogen supply device; 10. Nitrogen nozzle; 11. Waste liquid tank. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0027] like Figure 1The diagram illustrates a preferred embodiment of a wafer cleaning system with improved airflow, comprising: an isolation chamber 1; a cleaning unit 2 disposed within and connected to the isolation chamber 1, the cleaning unit 2 being used to clean wafers; an air input unit for inputting clean air into the top of the isolation chamber 1; a gas exhaust unit for exhausting gas from the bottom of the cleaning unit; and a nitrogen input unit for inputting nitrogen into the cleaning unit. Furthermore, after the cleaning unit 2 begins cleaning the wafer, the airflow inside the cleaning unit 2 is unstable due to the rotation of the wafer caused by the introduction of nitrogen supply device 9. At this time, clean air is blown into the isolation chamber 1 through the air input unit and a pressurized blow is formed at the top of the cleaning unit 2. Then, the gas exhaust device is activated to exhaust the gas at the bottom of the cleaning unit 2. At this time, the air input unit continues to blow clean air into the isolation chamber 1 and a depressurized blow is formed at the top of the cleaning unit 2, thereby stabilizing the airflow control inside the cleaning unit 2 and making the airflow distribution on the surface of the wafer uniform, thus ensuring the uniform diffusion of the cleaning solution.

[0028] Furthermore, as a preferred embodiment, the cleaning unit 2 includes: a support platform, a spray assembly, and a cleaning chamber. The cleaning chamber is disposed within the isolation chamber 1, the support platform is disposed within the cleaning chamber, the support platform supports a wafer, and the spray assembly is disposed above the support platform. The spray assembly is used to spray cleaning fluid onto the wafer.

[0029] Furthermore, as a preferred embodiment, the support stage has a rotating clamping part, which is used to clamp the wafer and drive the wafer to rotate at a certain height.

[0030] Furthermore, as a preferred embodiment, the air input unit includes: an air inlet 3, an air purification device 4, and an air supply device 5. The input end of the air inlet 3 is located outside the isolation chamber 1, the output end of the air inlet 3 is connected to the input end of the air purification device 4, the input end of the air supply device 5 is connected to the output end of the air purification device 4, and the output end of the air supply device 5 passes through the isolation chamber 1 and is located above the support platform.

[0031] Furthermore, as a preferred embodiment, the top of the cleaning chamber is provided with an opening, which is positioned directly opposite the output end of the air supply device 5.

[0032] Furthermore, as a preferred embodiment, the inner wall of the cleaning chamber is curved in the vertical direction.

[0033] Furthermore, as a preferred embodiment, the gas discharge unit includes: a gas outlet 6, an exhaust device 7, and a gas filter 8. The output end of the gas outlet 6 is located outside the isolation chamber 1, the input end of the gas outlet 6 is connected to the output end of the exhaust device 7, the input end of the exhaust device 7 is connected to the output end of the gas filter 8, and the input end of the gas filter 8 passes through the isolation chamber 1 and is connected to the bottom of the cleaning chamber.

[0034] Furthermore, in a preferred embodiment, a waste liquid tank 11 is provided at the bottom of the cleaning chamber, one end of the top of the waste liquid tank 11 is connected to the bottom of the cleaning chamber, and the other end of the top of the waste liquid tank 11 is connected to the input end of the gas filtration device 8.

[0035] Furthermore, as a preferred embodiment, a liquid level detection device is provided in the waste liquid tank 11. The liquid level detection device is used to detect the height of the waste liquid in the waste liquid tank 11, and the liquid level detection device is connected to the control system. When it is detected that the waste liquid tank 11 is full, it sends a message to the control system to remind the staff to clean the waste liquid tank 11.

[0036] Furthermore, as a preferred embodiment, the nitrogen input unit includes a nitrogen supply device 9 and a nitrogen nozzle 10. The nitrogen supply device 9 is disposed outside the isolation chamber 1. The input end of the nitrogen supply device 9 passes through the isolation chamber 1 and the cleaning chamber and is connected to the nitrogen nozzle 10. The nitrogen nozzle 10 is disposed on the support platform and is used to blow air onto the bottom of the wafer.

[0037] Furthermore, as a preferred embodiment, the cleaning unit 2 is also equipped with a nitrogen nozzle, which is connected to the nitrogen supply device 9 via a pipeline. Furthermore, during the wafer cleaning process, nitrogen gas is blown onto the upper surface of the wafer through the nitrogen nozzle to coordinate with the spraying of ultrapure water, thereby forming a stable water film on the wafer surface.

[0038] Furthermore, as a preferred embodiment, the nitrogen nozzle 10 is provided with a plurality of vent holes, which are arranged circumferentially along the nitrogen nozzle 10, with each vent hole facing the bottom edge of the wafer. Further, the vent holes are used to blow air towards the outer edge of the bottom surface of the wafer, thereby sweeping away contaminants and preventing the splashing of cleaning fluid from the wafer.

[0039] Furthermore, as a preferred embodiment, the output end of the air input unit is provided with a first gas flow monitoring device, the input end of the gas discharge unit is provided with a second gas flow monitoring unit, and the output end of the nitrogen input unit is provided with a third gas flow monitoring unit.

[0040] Furthermore, as a preferred embodiment, it also includes: a control system, wherein the cleaning unit 2, the first gas flow monitoring device, the second gas flow monitoring device and the third gas flow monitoring device are all communicatively connected to the control system.

[0041] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention.

[0042] In addition to the above, the present invention also has the following embodiments:

[0043] A method of operating a wafer cleaning system with improved airflow, comprising the wafer cleaning system with improved airflow as described above, including the following steps:

[0044] Step S1: Cleaning unit 2 cleans the wafer;

[0045] Step S2: The nitrogen input unit inputs nitrogen into the cleaning unit;

[0046] In step S3, the nitrogen input unit continues to input nitrogen into the cleaning unit, and the air input unit inputs clean gas into the isolation chamber 1.

[0047] In step S4, the nitrogen input unit continues to input nitrogen into the cleaning unit, the air input unit continues to input clean gas into the isolation chamber 1, and the gas exhaust unit simultaneously exhausts the gas in the cleaning unit.

[0048] The above description is only a preferred embodiment of the present invention and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning system with improved airflow, characterized in that: include: Isolation room; A cleaning unit, the cleaning unit is arranged in the isolation chamber, and the cleaning unit is connected to the isolation chamber, the cleaning unit is used to clean the wafer, and the cleaning unit includes: A cleaning chamber, wherein the cleaning chamber is arranged in the isolation chamber, A carrier, the carrier is arranged in the cleaning chamber, and the wafer is carried on the carrier, A spray assembly, the spray assembly is used to spray a cleaning liquid onto the wafer, and the spray assembly is arranged above the carrier platform; An air input unit, the air input unit is used to input clean air into the top of the isolation chamber, the air input unit comprises: an air inlet, wherein an input end of the air inlet is arranged outside the isolation room, An air purification device, wherein the output end of the air inlet is connected to the input end of the air purification device, An air supply device, the input end of the air supply device is connected to the output end of the air purification device, and the output end of the air supply device passes through the isolation chamber and is arranged above the supporting platform; A gas exhaust unit, the gas exhaust unit is used to exhaust the gas at the inner bottom of the cleaning unit; A nitrogen input unit, the nitrogen input unit is used to input nitrogen into the cleaning unit, the nitrogen input unit comprises: a nitrogen supply device and a nitrogen nozzle, the nitrogen supply device is arranged outside the isolation chamber, the input end of the nitrogen supply device passes through the isolation chamber and the cleaning chamber and is connected to the nitrogen nozzle, the nitrogen nozzle is arranged on the supporting platform, and the nitrogen nozzle is used to blow air to the bottom of the wafer.

2. The wafer cleaning system with improved airflow according to claim 1, characterized in that: The gas exhaust unit includes: a gas exhaust port, an exhaust device and a gas filtering device. The output end of the gas exhaust port is arranged outside the isolation chamber, the input end of the gas exhaust port is connected to the output end of the exhaust device, the input end of the exhaust device is connected to the output end of the gas filtering device, and the input end of the gas filtering device passes through the isolation chamber and is connected to the bottom of the cleaning chamber.

3. The wafer cleaning system with improved airflow according to claim 2, characterized in that: A waste liquid tank is arranged at the bottom of the cleaning chamber, one end of the top of the waste liquid tank is connected to the bottom of the cleaning chamber, and the other end of the top of the waste liquid tank is connected to the input end of the gas filtering device.

4. The wafer cleaning system with improved airflow according to claim 1, characterized in that: The nitrogen nozzle is provided with a plurality of outlet holes, which are arranged in a circumferential direction of the nitrogen nozzle, and each of the outlet holes is arranged toward the edge of the bottom of the wafer.

5. The wafer cleaning system with improved airflow according to claim 1, characterized in that: The output end of the air input unit is provided with a first gas flow monitoring device, the input end of the gas exhaust unit is provided with a second gas flow monitoring unit, and the output end of the nitrogen input unit is provided with a third gas flow monitoring unit.

6. The wafer cleaning system with improved airflow according to claim 5, characterized in that: Also includes: The control system, the cleaning unit, the first gas flow monitoring device, the second gas flow monitoring device and the third gas flow monitoring device are all communicatively connected to the control system.

7. A method for operating a wafer cleaning system with improved airflow, comprising the wafer cleaning system with improved airflow as claimed in any one of claims 1 to 6, characterized in that: The steps include: Step S1, the cleaning unit cleans the wafer; Step S2, the nitrogen input unit inputs nitrogen into the cleaning unit; Step S3, the nitrogen input unit continues to input nitrogen into the cleaning unit, and the air input unit inputs clean air into the isolation chamber; Step S4, the nitrogen input unit keeps inputting nitrogen into the cleaning unit, the air input unit continues to input clean gas into the isolation chamber, and the gas exhaust unit exhausts the gas in the cleaning unit at the same time.

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