Evaporation mask and method for manufacturing the same

Abstract

The present invention provides a vapor deposition mask without burrs and a method for manufacturing a vapor deposition mask that does not form burrs. In the method for manufacturing the vapor deposition mask of the present invention, a mask body having an opening pattern is formed on a first surface of a supporting substrate, a mask frame is arranged on the mask body, a temporary fixture including a ferromagnetic body is arranged on a second surface of the supporting substrate opposite to the first surface, the mask frame is fixed to the mask body by the magnetic force of the temporary fixture, a connecting portion connecting the mask body and the mask frame is formed, and the temporary fixture and the supporting substrate are removed.

Description

Technical Field

[0001] The present invention relates to a vapor deposition mask and a method for producing the vapor deposition mask. In particular, the present invention relates to a vapor deposition mask having a thin film-shaped mask body and a method for producing the vapor deposition mask. Background Art

[0002] An organic EL (Electroluminescence) display device is one of the flat panel display devices. In an organic EL display device, an organic EL element is provided in each pixel. The organic EL element has a structure in which a layer containing an organic EL material (hereinafter referred to as an "organic EL layer") is sandwiched between a pair of electrodes consisting of an anode electrode and a cathode electrode. The organic EL layer is composed of functional layers such as a light-emitting layer, an electron injection layer or a hole injection layer. The organic EL element can emit light in various wavelengths by selecting the organic material of the light-emitting layer.

[0003] In the case where the organic EL material is a low molecular weight compound, a vacuum evaporation method can be used to form a thin film in the organic EL layer. In the vacuum evaporation method, the evaporation material is heated by a heater under high vacuum and sublimated. The thin film is formed by depositing (evaporating) the sublimated evaporation material on the surface of the substrate. In addition, in the vacuum evaporation method, by using a mask (evaporation mask) having a large number of fine opening patterns, a high-precision thin film pattern corresponding to the opening pattern can be formed.

[0004] Evaporation masks can be classified according to the manufacturing method, and can be roughly divided into fine metal masks (FMM) patterned by etching and electro-fine forming masks (EFM) using electroforming technology. For example, Patent Document 1 discloses a method for manufacturing an evaporation mask, in which after a mask body having a fine opening pattern is formed by electroforming, the mask body is further connected to a mask frame by electroforming.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2017-210633 Summary of the invention

[0008] Technical problem to be solved by the invention

[0009] In the conventional EFM manufacturing method, burrs (more specifically, protrusions protruding from the surface of the mask body) are generated on the surface of the vapor deposition mask opposite to the vapor-deposited substrate. When there are burrs on the vapor deposition mask, the burrs may sometimes contact the vapor-deposited substrate during vapor deposition and damage the vapor-deposited substrate. As a result, there are cases where the components formed on the vapor-deposited substrate are destroyed. In addition, there are cases where a gap is generated between the vapor deposition mask and the vapor-deposited substrate, and the vapor deposition pattern formed on the vapor-deposited substrate is blurred. These phenomena will eventually become defects of the display device, and therefore become the main reason for reducing the yield of the display device. Therefore, in the conventional vapor deposition mask manufacturing method, it is necessary to use a cutter or the like to cut off the burrs of the vapor deposition mask and remove the burrs from the vapor deposition mask.

[0010] The process of removing burrs from the vapor deposition mask is usually performed manually. That is, the operator uses a microscope to confirm the position of the burrs on the vapor deposition mask and cuts off the burrs. Therefore, in the process of removing burrs from the vapor deposition mask, there are the following problems: not only the operation time varies depending on the proficiency of the operator, but also the quality of the vapor deposition mask varies depending on the proficiency of the operator. In addition, there is also the problem that the burrs cut off from the vapor deposition mask adhere to the vapor deposition mask as foreign matter.

[0011] The present invention has been made in view of the above-mentioned problems, and one of the technical problems to be solved is to provide a vapor deposition mask having no burrs and a method for manufacturing a vapor deposition mask without forming burrs.

[0012] Means for solving technical problems

[0013] In a method for manufacturing a vapor deposition mask according to one embodiment of the present invention, a mask body having an opening pattern is formed on a first surface of a supporting substrate, a mask frame is arranged on the mask body, a temporary fixing part comprising a ferromagnetic material is arranged on a second surface of the supporting substrate opposite to the first surface, the mask frame is fixed to the mask body by utilizing the magnetic force of the temporary fixing part to form a connecting portion connecting the mask body and the mask frame, and the temporary fixing part and the supporting substrate are removed.

[0014] A vapor deposition mask according to an embodiment of the present invention includes: a mask body having an opening pattern; a mask frame overlapping the mask body; and a connection portion connecting the mask body and the mask frame, wherein the mask is in direct contact with the mask frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1A This is a plan view of a vapor deposition mask according to one embodiment of the present invention.

[0016] Figure 1B This is a plan view of a vapor deposition mask according to one embodiment of the present invention.

[0017] Figure 1CThis is a cross-sectional view of a vapor deposition mask according to one embodiment of the present invention.

[0018] Figure 2A This is a plan view of a vapor deposition mask according to one embodiment of the present invention.

[0019] Figure 2B This is a cross-sectional view of a vapor deposition mask according to one embodiment of the present invention.

[0020] Figure 3A It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0021] Figure 3B It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0022] Figure 3C It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0023] Figure 3D It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0024] Figure 3E It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0025] Figure 3F It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0026] Figure 3G It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0027] Figure 3H It is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to one embodiment of the present invention.

[0028] Figure 4A This is a plan view of a fixing member used in a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

[0029] Figure 4B This is a plan view of a fixing member used in a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

[0030] Figure 4C This is a plan view of a fixing member used in a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

[0031] Figure 5A It is a cross-sectional view showing a conventional method for manufacturing a vapor deposition mask.

[0032] Figure 5BIt is a cross-sectional view showing a conventional method for manufacturing a vapor deposition mask.

[0033] Figure 5C It is a cross-sectional view showing a conventional method for manufacturing a vapor deposition mask.

[0034] Figure 5D It is a cross-sectional view showing a conventional method for manufacturing a vapor deposition mask.

[0035] Figure 5E It is a cross-sectional view showing a conventional method for manufacturing a vapor deposition mask.

[0036] Description of Reference Numerals

[0037] 10, 10A: evaporation mask, 110, 110A: mask body, 110-1: first surface, 110-2, 110A-2: second surface, 111: opening area, 112: non-opening area, 113: opening, 120: mask frame, 121: frame part, 122: barrier part, 130: connection part, 210: support substrate, 210-1: first surface, 210-2: second surface, 220: metal layer, 230: photoresist layer, 240: first plating layer, 250: protective layer, 260, 2 60A, 260B, 260C: temporary fixing parts, 261A, 261B, 261C: first fixing part, 262A, 262B, 262C: second fixing part, 263A: opening, 264C: connecting part, 270: second coating layer, 30: vapor deposition mask, 280: adhesive layer, 290: second coating layer, 310: mask body, 310-2: second surface, 311: opening area, 312: non-opening area, 320: mask frame, 330: connecting part, 331: burr, 340: gap. DETAILED DESCRIPTION

[0038] Hereinafter, various embodiments of the present invention will be described with reference to the drawings, etc. However, the present invention can be implemented in various forms within the scope of the present invention, and should not be interpreted as being limited to the description of the embodiments illustrated below.

[0039] In order to make the description clearer, the drawings sometimes schematically show the width, thickness, shape, etc. of each part compared with the actual method. However, the example shown in the drawings is only an example and does not limit the interpretation of the present invention. In this specification and each figure, the same component as the component described in the previous figure is sometimes marked with the same reference numeral and the detailed description is appropriately omitted.

[0040] In the present invention, when a plurality of films are formed by etching or light irradiation of a certain film, these plurality of films may have different functions and effects. However, these plurality of films are derived from films formed as the same layer in the same process, and have the same layer structure and the same material. Therefore, it is defined that these plurality of films exist in the same layer.

[0041] In the present specification and claims, when expressing the manner in which another structure is arranged on a certain structure, when it is simply recorded as "on...", unless otherwise specified, it is defined as including the following two situations: a situation in which another structure is arranged directly above a certain structure in a manner of contacting the certain structure; and a situation in which another structure is arranged above a certain structure with other structures interposed therebetween.

[0042] <First embodiment>

[0043] Reference Figure 1A to Figure 1C , the structure of the vapor deposition mask 10 according to one embodiment of the present invention is described.

[0044] Figure 1A and Figure 1B 1 is a plan view of a vapor deposition mask 10 according to an embodiment of the present invention. Specifically, Figure 1A is a plan view of the vapor deposition mask 10 as viewed from the first surface 110 - 1 of the mask body 110 . Figure 1B This is a plan view of the deposition mask 10 as viewed from the second surface 110 - 2 on the opposite side of the first surface 110 - 1 of the mask body 110 . Figure 1C 1 is a cross-sectional view of a vapor deposition mask 10 according to an embodiment of the present invention. Specifically, Figure 1C It is along Figure 1A or Figure 1B The cross-sectional view of the vapor deposition mask 10 cut along the line AA′ is shown.

[0045] The evaporation mask 10 includes a mask body 110, a mask frame 120, and a connection portion 130. Figure 1A and Figure 1B As shown in FIG. 1 , the mask frame 120 and the connection portion 130 are disposed on the first surface 110 - 1 of the mask body 110 . In addition, the mask frame 120 and the connection portion 130 overlap with the mask body 110 in a plan view. Figure 1A As shown in FIG. 1 , when viewed from the first surface 110 - 1 of the mask body 110 , the mask frame 120 and the connection portion 130 are exposed on the mask body 110 . Figure 1BAs shown, the mask frame 120 and the connection portion 130 are not exposed from the mask body 110 when viewed from the second surface 110-2 of the mask body 110. In other words, it can be said that the mask frame 120 and the connection portion 130 are covered by the mask body 110 when viewed from the second surface 110-2 of the mask body 110.

[0046] The mask body 110 includes an opening area 111 and a non-opening area 112. An opening 113 corresponding to the vapor deposition pattern and penetrating the mask body 110 is provided in the opening area 111. On the other hand, no opening 113 is provided in the non-opening area 112. The boundary between the opening area 111 and the non-opening area 112 is not necessarily clear. However, in most cases, the opening 113 is provided according to the vapor deposition pattern, so the interval between two adjacent openings 113 has a prescribed spacing. Therefore, the opening area 111 and the non-opening area 112 can be distinguished based on the prescribed spacing of the vapor deposition pattern.

[0047] The thickness of the mask body 110 is, for example, not less than 1 μm and not more than 10 μm. In addition, the mask body 110 is preferably formed of a material used in electroforming (or electrolytic plating). The mask body 110 can be formed of a material such as nickel or a nickel alloy.

[0048] When vapor deposition is performed using the vapor deposition mask 10, the second surface 110-2 of the mask body 110 contacts the vapor-deposited substrate. In the vapor deposition mask 10 of this embodiment, the second surface 110-2 of the mask body 110 is entirely composed of the mask body 110, and therefore, has no steps or burrs. Therefore, the vapor-deposited substrate will not be damaged by the burrs.

[0049] In addition, during the vapor deposition, the organic material can be deposited only through the openings 113 of the mask main body 110, so that a pattern (evaporation pattern) corresponding to the openings 113 is formed on the vapor-deposited substrate. Therefore, the openings 113 can be provided corresponding to the arrangement of pixels of the display device, for example, can be arranged in a matrix.

[0050] The mask frame 120 includes: a frame portion 121 located on the periphery of the vapor deposition mask 10; and a baffle portion 122 located on the inner side of the frame portion 121. In the mask frame 120, the inner side of the frame portion 121 is open, and the opening is divided by the baffle portions 122 arranged in a lattice. When the size of the mask frame 120 is large, there is a case where it is difficult to maintain the parallelism of the mask frame 120 to a prescribed reference due to warping or twisting of the frame portion 121. In the vapor deposition mask 10, the rigidity of the frame portion 121 is improved by the baffle portions 122, so that the parallelism of the mask frame 120 can be maintained to a prescribed reference. In addition, when the size of the vapor deposition mask 10 is small and the rigidity of the frame portion 121 is sufficiently high, the baffle portions 122 may not be provided.

[0051] The mask frame 120 may be formed by integrally forming the frame portion 121 and the barrier portion 122 , or may be formed by separately manufacturing the frame portion 121 and the barrier portion 122 and joining the frame portion 121 and the barrier portion 122 by, for example, welding.

[0052] exist Figure 1A In the figure, the mask frame 120 is divided into 12 openings by the barrier portion 122, but the number of the divided openings is not limited thereto. The number of the divided openings can be appropriately determined according to the size of the vapor-deposited substrate and the vapor deposition pattern. In addition, the configuration of the barrier portion 122 is not limited to a lattice shape. In the case where the mask frame 120 is a rectangle with short sides and long sides, warping or distortion is more likely to occur on the long sides than on the short sides. Therefore, it is preferred to set the barrier portion 122 in a manner connecting the opposite long sides. In addition, the configuration of the barrier portion 122 can also be a shape corresponding to the vapor deposition pattern.

[0053] The width of the frame 121 and the width of the barrier 122 can be appropriately determined according to the size of the deposition mask 10. In addition, in order to maximize the area of ​​the deposition pattern, the width of the barrier 122 is preferably smaller than the width of the frame 121.

[0054] The thickness of the mask frame 120 is, for example, 10 μm to 2000 μm. The mask frame 120 is preferably made of a material with a small thermal expansion coefficient. The mask frame 120 can be made of, for example, an Invar alloy containing iron and nickel or a Super Invar alloy containing iron, nickel, and cobalt.

[0055] The connection portion 130 can connect the mask body 110 and the mask frame 120. Figure 1C As shown, the mask body 110 is in direct contact with the mask frame 120, but the mask body 110 and the mask frame 120 are not bonded or joined. The connection part 130 is joined with the mask body 110 and the mask frame 120, so that the mask body 110 and the mask frame 120 can be connected and fixed via the connection part 130.

[0056] The connection part 130 only needs to be provided on at least a part of the side surface of the frame part 121 or the barrier part 122 of the mask frame 120. However, in order to increase the bonding strength between the mask body 110 and the mask frame 120, the connection part 130 is preferably provided on more than 1 / 2 of the side surface of the frame part 121 or the barrier part 122, and more preferably provided on the entire surface of the side surface of the frame part 121 or the barrier part 122. In addition, the connection part 130 is preferably formed of a material used in electroforming. The connection part 130 can be formed of a material such as nickel or a nickel alloy.

[0057] In the evaporation mask 10, as described above, the mask body 110 and the mask frame 120 are in direct contact, but the mask body 110 and the mask frame 120 are not directly fixed. Therefore, even if the mask body 110 and the mask frame 120 are made of materials with different thermal expansion coefficients, the stress of the mask body 110 or the mask frame 120 can be dispersed. In addition, the mask body 110 and the mask frame 120 may not be in direct contact, and a gap may be provided between the mask body 110 and the mask frame 120. In this case, the stress of the mask body 110 or the mask frame 120 can also be dispersed.

[0058] As described above, according to the vapor deposition mask 10 of this embodiment, the second surface 110-2 of the mask main body 110 that contacts the vapor-deposited substrate is entirely composed of the mask main body 110, and therefore, has no steps or burrs. Therefore, the vapor-deposited substrate is not damaged by the burrs. Therefore, the display device manufactured using the vapor deposition mask 10 has fewer defects caused by the vapor deposition process and an improved yield.

[0059] <Modification>

[0060] Reference Figure 2A and Figure 2B Hereinafter, the structure of a deposition mask 10A which is a modified example of the deposition mask 10 according to one embodiment of the present invention will be described. In the description of the structure of the deposition mask 10A, description of the same components as those of the deposition mask 10 may be omitted.

[0061] Figure 2A 1 is a plan view of a vapor deposition mask 10A according to an embodiment of the present invention. Specifically, Figure 2A This is a plan view of the vapor deposition mask 10A as viewed from the second surface 110A-2 of the mask body 110A. Figure 2B 1 is a cross-sectional view of a vapor deposition mask 10A according to an embodiment of the present invention. Specifically, Figure 2B It is along Figure 2A The cross-sectional view of the vapor deposition mask cut along the line BB' is shown.

[0062] In the vapor deposition mask 10A, the size of the mask body 110A is smaller than the size of the mask frame 120. Therefore, when the mask body 110A is viewed from the second surface 110A-2, the mask frame 120 is exposed from the mask body 110A. Specifically, the frame portion 121 of the mask frame 120 is exposed. In other words, it can also be said that when the mask body 110A is viewed from the second surface 110A-2, at least a portion of the frame portion 121 is not covered by the mask body 110A.

[0063] In the above-mentioned vapor deposition mask 10, the mask body 110 and the mask frame 120 are not bonded or joined. In the outer periphery of the vapor deposition mask 10, a gap is exposed between the mask body 110 and the frame 121, so there is a situation where the mask body 110 is deformed by an external force or peeled off from the mask frame 120. The larger the area where the mask body 110 and the frame 121 are not bonded or joined, the higher the possibility of this phenomenon. In the vapor deposition mask 10A, the mask body 110A is set in a manner that the area where the mask body 110A and the frame 121 are not bonded or joined becomes smaller in the outer periphery of the vapor deposition mask 10A. Therefore, it is not easy for the mask body 110A to be deformed or peeled off from the mask frame 120.

[0064] As described above, according to the evaporation mask 10A of the modified example of the present embodiment, the second surface 110A-2 of the mask body 110A in contact with the substrate to be evaporated does not have burrs. Therefore, the substrate to be evaporated is not damaged by the burrs. In addition, the mask body 110A is set in a manner smaller than the mask frame 120, so that the mask body 110A is not easily deformed or peeled off from the mask frame 120 at the outer periphery of the evaporation mask 10A. Therefore, the display device manufactured using the evaporation mask 10A has fewer defects caused by the evaporation process and an improved yield.

[0065] <Second embodiment>

[0066] Reference Figure 3A to Figure 3G , a method for manufacturing the vapor deposition mask 10 according to one embodiment of the present invention is described.

[0067] Figure 3A to Figure 3G It is a cross-sectional view showing a method for manufacturing the vapor deposition mask 10 according to one embodiment of the present invention.

[0068] Figure 3A to Figure 3C This is a diagram for explaining the first electroforming step.

[0069] First, if Figure 3A As shown, a metal layer 220 is formed on the first surface 210 - 1 of the support substrate 210 , and a photoresist layer 230 having a predetermined pattern is formed on the metal layer 220 .

[0070] The support substrate 210 can support each layer in the manufacturing process of the vapor deposition mask 10. Therefore, the support substrate 210 is preferably a rigid substrate. The manufacturing process of the vapor deposition mask 10 includes a process of heating the support substrate 210. When the support substrate 210 expands or shrinks due to the heat treatment, not only will the position of the photoresist layer 230 formed on the support substrate 210 be offset, but there is also a case of peeling due to stress. Therefore, in order to stabilize the manufacturing process of the vapor deposition mask 10, the support substrate 210 is further preferably a rigid substrate with a small thermal expansion coefficient. The material of the support substrate 210 is, for example, stainless steel (SUS304 or SUS430, etc.), 42 alloy, Invar alloy, super Invar alloy or stainless Invar alloy, etc.

[0071] The metal layer 220 can function as a base metal in the first electroforming step. The material of the metal layer 220 is, for example, nickel or a nickel alloy. The metal layer 220 can be formed by sputtering or the like.

[0072] The metal layer 220 is finally separated and removed. Therefore, in order to facilitate separation of the metal layer 220, a peeling layer may be provided on the metal layer 220. In this case, by peeling off the peeling layer, the metal layer 220 can be easily separated. In addition, the peeling layer itself may have conductivity.

[0073] The deposition mask 10 may be manufactured by electroless plating instead of electroforming. In this case, an insulating layer may be used instead of the metal layer 220 .

[0074] The photoresist layer 230 can function as a mask in the first electroforming process. The photoresist layer 230 can be formed by disposing one or more photosensitive dry film resists on the metal layer 220 in a manner having a predetermined film thickness and performing thermocompression bonding. The photosensitive dry film resist can be a positive type or a negative type. In the following, it is assumed that the photosensitive dry film resist is a negative type for explanation.

[0075] The photoresist layer 230 has a pattern corresponding to the opening pattern of the mask body 110 of the evaporation mask 10. The pattern of the photoresist layer 230 can be formed by photolithography. That is, the pattern of the photoresist layer 230 can be formed by bringing a photomask and a dry film resist into close contact, irradiating ultraviolet rays to expose the dry film, and dissolving and removing the unexposed portion.

[0076] Then, if Figure 3BAs shown, the photoresist layer 230 is used as a mask to form the first plating layer 240. The first plating layer 240 can be formed by electroforming. Specifically, the metal layer 220 and the photoresist layer 230 are placed in an electroforming tank bathed under predetermined conditions, and a metal plating layer is formed from the surface of the metal layer 220 not covered by the photoresist layer 230 to a height that does not exceed the film thickness of the photoresist layer 230. The material of the first plating layer 240 is, for example, nickel or an alloy of nickel and cobalt.

[0077] Then, if Figure 3C As shown, the photoresist layer 230 is stripped. The photoresist layer 230 can be stripped using, for example, an amine-based stripping solution.

[0078] The first plating layer 240 formed by electroforming may be polished before removing the photoresist layer 230. By polishing the first plating layer 240, the surface of the first plating layer 240 can be planarized.

[0079] In addition, the first plating layer 240 corresponds to the mask main body 110 of the vapor deposition mask 10. Therefore, in the following, the first plating layer 240 is described as the mask main body 110 for the sake of convenience.

[0080] Figure 3D and Figure 3E This is a diagram for explaining the mask frame bonding process.

[0081] like Figure 3D As shown, a protective layer 250 is formed on the opening region 111 of the mask body 110. The protective layer 250 can prevent particles generated in a process described later from entering the opening 113 of the opening region 111 and blocking the opening 113. In addition, the protective layer 250 can function as a mask in the second electroforming process described later.

[0082] The protective layer 250 may use the same material as the photoresist layer 230. In addition, the protective layer 250 may be formed by the same method as the photoresist layer 230.

[0083] Then, if Figure 3E As shown, the mask frame 120 is arranged on the mask body 110. The mask frame 120 is arranged in a manner that the frame portion 121 and the barrier portion 122 do not overlap with the opening area 111 of the mask body 110. That is, the mask frame 120 is arranged on the non-opening area 112 of the mask body. In addition, a temporary fixture 260 is arranged on the second surface 210-2 of the support substrate 210. The order of arranging the mask frame 120 and the temporary fixture 260 is not particularly limited. The temporary fixture 260 may be arranged after the mask frame 120 is arranged, or the mask frame 120 may be arranged after the temporary fixture 260 is arranged.

[0084] The temporary fixture 260 can use magnetic force to make the mask frame 120 and the mask body 110 close together. For this purpose, the temporary fixture 260 includes a ferromagnetic body. As the ferromagnetic body, for example, a samarium cobalt magnet containing samarium and cobalt, an alnico magnet containing iron, nickel and cobalt, or a neodymium magnet containing neodymium, iron and boron can be used. In addition, the temporary fixture 260 can also use a ferrite magnet, an electromagnet or a plastic magnet.

[0085] The temporary fixture 260 is disposed on the second surface 210-2 of the support substrate 210, which is a flat surface. Therefore, the temporary fixture 260 is preferably in the shape of a flat plate that can be closely attached to the second surface 210-2 of the support substrate 210. However, the temporary fixture 260 is not limited to a flat plate. The temporary fixture 260 can be in any shape as long as it corresponds to the shape of the second surface 210-2 of the support substrate 210.

[0086] The size of the temporary fixture 260 is not particularly limited. The size of the temporary fixture 260 can be appropriately determined in consideration of the sizes of the mask body 110 and the mask frame 120. The temporary fixture 260 can be larger than the mask body 110 or the mask frame 120, or smaller than the mask body 110 or the mask frame 120. However, in order for the mask body 110 and the frame portion 121 of the mask frame 120 to be closely attached, it is preferred that the temporary fixture 260 at least overlaps with the frame portion 121 of the mask frame 120 while sandwiching the mask body 110.

[0087] When the magnetic force of the temporary fixture 260 is adjusted, a spacer for adjusting the distance between the support substrate 210 and the temporary fixture 260 may be arranged between the support substrate 210 and the temporary fixture 260. The spacer may be in various shapes such as a flat plate, a rod, or a sphere. However, the spacer is preferably arranged so that the support substrate 210 and the temporary fixture 260 maintain a certain distance within the second surface 210-2 of the support substrate 210. In addition, the spacer may be a metal or an insulator. In addition, the spacer may also be arranged on the temporary fixture 260.

[0088] Figure 3F This is a diagram for explaining the second electroforming step.

[0089] like Figure 3F As shown, a second plating layer 270 is formed to connect the mask body 110 and the mask frame 120. The second plating layer 270 can be formed by electroforming by applying electricity to the metal layer 220 or the mask frame 120. The second plating layer 270 can be formed by the same method as the first plating layer 240.

[0090] The second plating layer 270 is provided on the non-opening region 112 of the mask body 110, and connects the mask body 110 to the side surface of the mask frame 120. That is, the second plating layer 270 corresponds to the connection portion 130 of the deposition mask 10. Therefore, for convenience, the second plating layer 270 is described as the connection portion 130 below.

[0091] Figure 3G and Figure 3H This is a diagram for explaining the support substrate separation step.

[0092] like Figure 3G As shown, the protective layer 250 is peeled off. The protective layer 250 can be peeled off by the same method as the photoresist layer 230.

[0093] Then, if Figure 3H As shown, the support substrate 210, the metal layer 220, and the temporary fixture 260 are separated from the mask body 110. First, the temporary fixture 260 is separated from the support substrate 210. The temporary fixture 260 is fixed to the support substrate 210 only by magnetic force. Therefore, by applying a physical force to the temporary fixture 260 to pull it away from the support substrate 210, the temporary fixture 260 can be easily separated from the support substrate 210. In addition, after separating the temporary fixture 260, the support substrate 210 and the metal layer 220 are separated from the mask body 110. The support substrate 210 and the metal layer 220 can be separated at the same time, and the metal layer 220 can also be separated after the support substrate 210 is separated.

[0094] Through the above-described steps, the vapor deposition mask 10 in which the mask frame 120 and the connection portion 130 overlap with the mask body 110 can be manufactured.

[0095] In addition, the order of the steps in the method for manufacturing the vapor deposition mask 10 is not limited to the above order. Figure 3D The protective layer 250 shown can also be formed in Figure 3E The mask frame 120 is made to be in close contact with the mask body. Figure 3G The peeling of the protective layer 250 shown can also be performed in Figure 3H The support substrate 210 shown is then separated.

[0096] Here, for comparison, refer to Figure 5A to Figure 5E , a method for manufacturing a conventional vapor deposition mask 30 is described. The vapor deposition mask 30 includes a mask body 310, a mask frame 320, and a connection portion 330. In addition, in the description of the conventional method for manufacturing the vapor deposition mask 30, the description of the same steps as the method for manufacturing the vapor deposition mask 10 is sometimes omitted.

[0097] Figure 5A to Figure 5EIt is a cross-sectional view showing a conventional method of manufacturing the vapor deposition mask 30 .

[0098] Figure 5A and Figure 5B This is a diagram for explaining the mask frame bonding process.

[0099] like Figure 5A As shown, a protective layer 250 is formed on the opening region 311 of the mask body 310. The mask body 310 is provided with an opening not only in the opening region 311 but also in the non-opening region 312. The opening in the opening region 311 is covered by the protective layer. However, the opening in the non-opening region 312 is not covered by the protective layer 250. The mask body 310 can be formed in the same manner as the mask body 110 using the support substrate 210 and the metal layer 220, and therefore the description thereof is omitted here.

[0100] Then, if Figure 5B As shown, an adhesive layer 280 is provided on the non-opening area 312 of the mask body 310, and a mask frame 320 is bonded on the adhesive layer 280. The adhesive layer 280 is removed in the process described later, so it does not need to be completely cured. As the material of the adhesive layer 280, for example, vinyl acetate resin, ethylene vinyl acetate resin, epoxy resin, cyanoacrylate resin, or acrylic resin can be used. In addition, as the material of the adhesive layer 280, a dry film resist can also be used. When a dry film resist is used as the material of the adhesive layer 280, the dry film resist can be weakly exposed in advance. By exposing the dry film resist in advance, the dry film resist can be easily removed in the process described later.

[0101] Figure 5C This is a diagram for explaining the second electroforming step.

[0102] like Figure 5C As shown, the second plating layer 290 connecting the mask body 310 and the mask frame 320 is formed. The second plating layer 290 can be formed in the same manner as the second plating layer 270 of the vapor deposition mask 10. The second plating layer 290 is provided in a manner to fill the opening of the non-opening area 312, so that the second plating layer 290 is in contact with the metal layer 220. In addition, the second plating layer 290 connects the upper surface and the side surface of the non-opening area 312 of the mask body 310 to the mask frame 320. That is, the second plating layer 290 corresponds to the connecting portion 330 of the vapor deposition mask 30. Therefore, in the following, for convenience, the second plating layer 290 is described as the connecting portion 330.

[0103] Figure 5D and Figure 5E This is a diagram for explaining the support substrate separation step.

[0104] like Figure 5D As shown, the protective layer 250 is peeled off.

[0105] Then, if Figure 5E As shown, the support substrate 210 and the metal layer 220 are separated. In the separation of the metal layer 220, in the area of ​​the metal layer 220 overlapping with the mask frame 320, not only the metal layer 220 is peeled off, but also a part of the mask body 310 and the adhesive layer 280 are peeled off. As a result, a gap 340 is formed below the mask frame 320, but if the connection portion 330 fused to the mask body 310 is broken (for example, shear failure), burrs 331 are generated. In addition, there is also a case where the connection portion 330 is formed in the gap between the metal layer 220 and the mask body 310, in which case the burrs 331 are also generated. The burrs 331 are formed at the same time as the metal layer 220 is peeled off, and therefore, the burrs 331 are formed protruding toward the second surface 310-2 of the mask body 310.

[0106] If the burrs 331 are generated, the vapor deposition mask 30 cannot be closely attached to the vapor deposition substrate. In this case, a gap is generated between the vapor deposition mask 30 and the vapor deposition substrate, so that the width of the vapor deposition pattern of the vapor deposition substrate is larger than the width of the opening pattern of the vapor deposition mask 30. As a result, problems such as color mixing and blurred light emission between pixels of the display device may occur.

[0107] In the method for manufacturing the vapor deposition mask 10 of the present embodiment, the mask body 110 is not peeled off when the metal layer 220 is peeled off. Therefore, the burrs 331 formed in the conventional vapor deposition mask 30 are not formed in the vapor deposition mask 10.

[0108] As described above, according to the manufacturing method of the vapor deposition mask 10 of this embodiment, burrs are not formed on the second surface 110-2 of the mask body 110 that contacts the vapor deposition substrate. Therefore, the vapor deposition substrate is not damaged by the burrs. Therefore, the display device manufactured using the vapor deposition mask 10 has fewer defects caused by the vapor deposition process and an improved yield.

[0109] <Modification>

[0110] The temporary fixture 260 is not limited to a flat plate having substantially the same size as the mask body 110 or the mask frame 120. Figure 4A to Figure 4C , several examples of the shape of the temporary fixing member 260 are described.

[0111] Figure 4A It is a plan view of a temporary fixture 260A used in the method for manufacturing the vapor deposition mask 10 according to one embodiment of the present invention.

[0112] The temporary fixing member 260A has a shape corresponding to the shape of the mask frame 120, and includes a first fixing portion 261A and a second fixing portion 262A. That is, the temporary fixing member 260A includes: a first fixing portion 261A for fixing the frame portion 121 of the mask frame 120 (making the frame portion 121 and the mask body 110 close together); and a second fixing portion 262A for fixing the barrier portion 122 of the mask frame 120 (making the barrier portion 122 and the mask body close together). In addition, the temporary fixing member 260A includes openings 263A divided by the second fixing portions 262A arranged in a lattice shape.

[0113] The width of each of the first fixing portion 261A and the second fixing portion 262A of the temporary fixing member 260A may be the same as, smaller than, or larger than the width of the frame portion 121 and the barrier portion 122 of the mask frame 120. In addition, the number of the second fixing portions 262A of the temporary fixing member 260A may be the same as, less than, or greater than the number of the barrier portions 122 of the mask frame 120.

[0114] Alternatively, a groove corresponding to the shape of the temporary fixture 260A may be provided on the second surface of the support substrate 210 so that the temporary fixture 260A fits in. In this case, the position of the temporary fixture 260A is fixed relative to the support substrate 210, so that the mask frame 120 is stabilized.

[0115] According to the temporary fixture 260A of this modification, a magnetic force can be generated in accordance with the shape of the mask frame 120 , and thus the mask frame 120 and the mask body 110 can be brought into close contact with each other stably.

[0116] Figure 4B It is a plan view of a temporary fixture 260B used in the method for manufacturing the vapor deposition mask 10 according to one embodiment of the present invention.

[0117] The temporary fixing member 260B includes a first fixing portion 261B and a second fixing portion 262B which are divided into a plurality of parts. The shape of the first fixing portion 261B may be different from the shape of the second fixing portion 262B.

[0118] The shape of the second fixing portion 262B is not limited to a rectangle. The shape of the second fixing portion 262B may be a circle, an ellipse, a polygon, etc. In addition, the second fixing portions 262B may not all be of the same shape, but may include different shapes.

[0119] The first fixing part 261B and the second fixing part 262B of the temporary fixing member 260B may be made of the same material or different materials. By making the first fixing part 261B or the second fixing part 262B of different materials, the magnetic force can be adjusted.

[0120] The second fixing portion 262B is preferably arranged to overlap with the stopper portion 122 of the mask frame 120, but the arrangement of the second fixing portion 262B is not limited thereto. The second fixing portion 262B is not integrated with the first fixing portion 261B, and therefore can be freely arranged according to the close contact state between the mask frame 120 and the mask body 110.

[0121] According to the temporary fixture 260B of this modification, the frame portion 121 of the mask frame 120 can be closely attached to the mask body 110 using the first fixing portion 261B of the temporary fixture 260B. On this basis, the deviation of the close attachment state between the barrier portion 122 of the mask frame 120 and the mask body 110 can be adjusted using the second fixing portion 262B of the temporary fixture 260B.

[0122] Figure 4C It is a plan view of a temporary fixture 260C used in the method for manufacturing the vapor deposition mask 10 according to one embodiment of the present invention.

[0123] The temporary fixing member 260C includes a first fixing portion 261C and a second fixing portion 262C divided into a plurality of parts. The shape of the first fixing portion 261C may be different from the shape of the second fixing portion 262C. In addition, the first fixing portion 261C and the second fixing portion 262C and the second fixing portions 262C are connected to each other by a connecting portion 264C.

[0124] The connecting portion 264C can be made of a material different from that of the first fixing portion 261C and the second fixing portion 262C as long as it can connect the first fixing portion 261C or the second fixing portion 262C. The connecting portion 264C can be made of a metal or resin. In addition, an elastic body such as a spring can also be used for the connecting portion 264C. When the connecting portion 264C is an elastic body, the configuration of the second fixing portion 262C can be adjusted.

[0125] According to the temporary fixing member 260C of this modification, the first fixing portion 261C and the second fixing portion 262C are connected by the connecting portion 264C, so that the mask frame 120 can be stably and tightly attached to the mask body 110. On this basis, by adjusting the configuration of the second fixing portion 262C, the deviation of the tight attachment state between the barrier portion 122 of the mask frame 120 and the mask body 110 can be finely adjusted.

[0126] As the embodiments of the present invention, the embodiments described above can be implemented in appropriate combination as long as they are not contradictory. In addition, the embodiments obtained by those skilled in the art by appropriately adding, deleting or changing the design of the constituent elements, or adding, omitting or changing the conditions of the processes based on the embodiments are also included in the scope of the present invention as long as they include the gist of the present invention.

[0127] Even if there are other effects that are different from the effects brought about by the technical solutions of the above-mentioned embodiments, as long as they are effects that can be known from the records in this specification, or effects that can be easily predicted by technical personnel in this field based on the records in this specification, they can of course be understood as effects brought about by the present invention.

Claims

1. A method for manufacturing a vapor deposition mask, characterized in that: forming a mask body having an opening pattern on a first surface of a support substrate, A mask frame is disposed on a non-opening area of ​​the mask body that does not overlap with the opening pattern in a manner of directly contacting the mask body. A temporary fixture including a ferromagnetic body is disposed on a second surface of the support substrate opposite to the first surface, and the mask frame and the mask body are closely attached to each other by utilizing the magnetic force of the temporary fixture. A connection portion for connecting the mask body to a side surface of the mask frame is formed on the non-opening area of ​​the mask body. separating the temporary fixture and the support substrate from the mask main body, The temporary fixing member includes a first fixing portion having a first shape and a second fixing portion having a second shape, The mask frame includes a frame portion and a barrier portion arranged in a lattice shape and located inside the frame portion. The first shape corresponds to the shape of the frame portion of the mask frame, The second shape corresponds to a shape of the stopper portion of the mask frame.

2. The method for manufacturing a vapor deposition mask according to claim 1, wherein: The mask main body and the connection portion are formed by electroforming.

3. The method for manufacturing a vapor deposition mask according to claim 1 or 2, wherein: The temporary fixing piece is in the shape of a flat plate.

4. The method for manufacturing a vapor deposition mask according to claim 1 or 2, wherein: A plurality of the temporary fixing members are provided.

5. The method for manufacturing a vapor deposition mask according to claim 1 or 2, wherein: The material of the first fixing portion is different from the material of the second fixing portion.

6. The method for manufacturing a vapor deposition mask according to claim 1 or 2, wherein: The first fixing portion and the second fixing portion are connected via a connecting portion.

7. The method for manufacturing a vapor deposition mask according to claim 6, wherein: The connecting portion includes an elastic body.

8. The method for manufacturing a vapor deposition mask according to claim 1, wherein: The ferromagnetic material includes at least one of iron, aluminum, samarium, cobalt and nickel.

9. The method for manufacturing a vapor deposition mask according to claim 1, wherein: In the evaporation mask, the mask body overlaps with the mask frame.

Images