Chip Testing System

Abstract

The present invention discloses a chip testing system, which includes a chip tray kit, an insert mounting device, a testing device, an insert dismounting device and a conveying device. The chip tray kit includes a tray, a chip fixing member and an auxiliary insert. The chip fixing member is fixed to the tray and is used to carry a plurality of chips. The insert mounting device is used to fixedly arrange the auxiliary insert on one side of the chip fixing member, and the auxiliary insert is used to limit the movement range of the chips in the chip fixing member. The insert dismounting device is used to dismount the auxiliary insert. The testing device includes a cover body, a pressing component, a temperature regulating device and a testing machine platform. The chip tray kit is connected to the testing machine platform, and during the process of testing the chips, the pressing component that is connected to the temperature regulating device and reaches a predetermined temperature correspondingly presses on the surfaces of the respective chips.

Description

Technical Field

[0001] The present invention relates to a chip testing system, and more particularly to a chip testing system suitable for high-frequency testing of chips. Background Art

[0002] In existing common IC chip testing systems, especially the testing equipment used for high-frequency testing of IC chips, during the process of installing IC chips, due to various factors, some IC chips may not be correctly electrically connected to the relevant probes of the testing equipment. Therefore, the incorrectly installed IC chips cannot be correctly tested.

[0003] Since in the existing IC chip testing systems, after the IC chips are installed in the testing equipment, basically there is no further check on whether the IC chips have been correctly installed in the testing equipment. Therefore, relevant personnel often have to wait until the entire batch of IC chips has been tested before they will find that some IC chips have not been correctly detected because they were not correctly installed. Summary of the Invention

[0004] The present invention discloses a chip testing system, mainly used to improve the problem that in the existing IC chip testing systems, it is easy for IC chips to be not correctly installed in the testing equipment, resulting in the IC chips not being correctly detected.

[0005] One embodiment of the present invention discloses a chip testing system for performing a testing operation on multiple chips. The chip testing system includes a chip tray kit, an insert mounting device, a testing device, an insert dismounting device, and a conveying device. The chip tray kit includes a tray, multiple chip fixing members, and multiple auxiliary inserts. The tray has multiple tray perforations, each of which penetrates the tray; multiple chip fixing members are detachably fixed to the tray, and each chip fixing member is located in each tray perforation; each chip fixing member has multiple fixing perforations and multiple chip receiving grooves, each fixing perforation penetrates the chip fixing member, each chip receiving groove is connected to each fixing perforation, each chip receiving groove is used to accommodate one chip, and multiple connecting portions of the chips accommodated in each chip receiving groove are fixed by the chip fixing member; multiple auxiliary inserts are detachably fixed to one side of the multiple chip fixing members, and each auxiliary insert is used to limit the movement range of the multiple chips disposed in each chip fixing member relative to the chip fixing member; each auxiliary insert has multiple insertion perforations, and when each auxiliary insert is fixedly disposed on one side of the chip fixing member, each insertion perforation communicates with the chip receiving groove; an insert mounting device for mounting the multiple auxiliary inserts on one side of the multiple chip fixing members; a chip testing device includes at least one testing station, at least one cover, multiple pressing components, and a temperature adjusting device. At least one testing station can be connected to the chip tray kit, and the testing station is used to perform a testing operation on the multiple chips carried by the chip tray kit; at least one cover has a receiving groove recessed on one side, and the cover is used to cover one side of the tray; multiple pressing components are disposed on the cover, and each pressing component is located in the receiving groove of the cover, and the multiple pressing components are used to press one surface of the multiple chips carried by the multiple chip fixing members of the chip tray kit; a temperature adjusting device is connected to the multiple pressing components, and the temperature adjusting device is used to make the temperature of each pressing member reach a predetermined temperature; an insert dismounting device for removing the multiple auxiliary inserts from one side of the multiple chip fixing members; a conveying device for transferring the chip tray kit.

[0006] Preferably, the chip testing device includes at least four chambers, a low-temperature testing module, a high-temperature testing module, at least five movable doors, and an inflation device. The four chambers are respectively defined as a preparation chamber, a low-temperature chamber, a buffer chamber, and a high-temperature chamber. The temperature in the preparation chamber is lower than room temperature and higher than the temperature in the low-temperature chamber. The temperature in the low-temperature chamber ranges from -50 degrees to 20 degrees. The temperature in the buffer chamber is higher than the temperature in the low-temperature chamber and lower than the temperature in the high-temperature chamber. The temperature in the high-temperature chamber ranges from 25 degrees to 150 degrees. The low-temperature testing module is disposed in the low-temperature chamber and is used to contact the multiple chips carried by the chip tray kit, so as to test the multiple chips in a low-temperature state. The high-temperature testing module is disposed in the high-temperature chamber and is used to contact the multiple chips carried by the chip tray kit, so as to test the multiple chips in a high-temperature state. There is a movable door between each chamber. The inflation device is used to fill each chamber with a clean super dry air. When any one of the movable doors is opened, the inflation device will fill the corresponding chamber with super dry air.

[0007] Preferably, the chip testing device includes at least three chambers, a low-temperature testing module, at least three movable doors, and an inflation device. The two chambers are respectively defined as a preparation chamber, a low-temperature chamber, and a buffer chamber. The temperature in the preparation chamber is lower than room temperature and higher than the temperature in the low-temperature chamber. The temperature in the low-temperature chamber ranges from -50 degrees to 20 degrees. The temperature in the buffer chamber is higher than the temperature in the low-temperature chamber and lower than 25 degrees. The low-temperature testing module is disposed in the low-temperature chamber and is used to contact the multiple chips carried by the chip tray kit, so as to test the multiple chips in a low-temperature state. There is a movable door between the two chambers. The inflation device is used to fill each chamber with a clean super dry air. When any one of the movable doors is opened, the inflation device will fill the corresponding chamber with super dry air.

[0008] Preferably, the chip testing device includes at least three chambers, a high-temperature testing module, at least three movable doors, and an inflation device. The three chambers are respectively defined as a buffer chamber, a high-temperature chamber, and a cooling chamber. The temperature in the buffer chamber is higher than 20 degrees. The temperature in the high-temperature chamber ranges from 25 degrees to 150 degrees. The temperature in the cooling chamber is lower than the temperature in the high-temperature chamber and higher than room temperature. The high-temperature testing module is disposed in the high-temperature chamber and is used to contact the multiple chips carried by the chip tray kit, so as to test the multiple chips in a high-temperature state. There is a movable door between each chamber. The inflation device is used to fill each chamber with a clean super dry air. When any one of the movable doors is opened, the inflation device will fill the corresponding chamber with super dry air.

[0009] Preferably, the chip testing system further includes at least one burn-in device, at least one main conveying mechanism, and at least two auxiliary conveying mechanisms. The main conveying mechanism is used to move the chip tray kit between the burn-in device and the chip testing device; the burn-in device is used to perform a burn-in test on multiple chips carried by the chip tray kit; an auxiliary conveying mechanism is arranged between the burn-in device and the main conveying mechanism, and the auxiliary conveying mechanism is used to move the chip tray kit between the main conveying mechanism and the burn-in device, so that the chip tray kit is connected to or separated from the burn-in device; another auxiliary conveying mechanism is arranged between the chip testing device and the main conveying mechanism, and the other auxiliary conveying mechanism is used to move the chip tray kit between the main conveying mechanism and the chip testing device, so that the chip tray kit is connected to or separated from the chip testing device.

[0010] Preferably, the chip testing system further includes a main chamber, an inflation device, and two main movable doors. The chip testing device, the burn-in device, the main conveying mechanism, and the auxiliary conveying mechanism are arranged in the main chamber. The inflation device is used to fill the main chamber with a super dry air, which is clean; the main chamber has an inlet and an outlet. A main movable door is arranged at the inlet of the main chamber, and another main movable door is arranged at the outlet of the main chamber.

[0011] Preferably, the chip testing system further includes a conversion device, which is used to convert the chip tray kit with multiple auxiliary inserts fixedly arranged thereon between a horizontal state and a vertical state.

[0012] Preferably, each chip fixing member further includes multiple chip receiving grooves. Each accommodating groove, each chip receiving groove, and each fixing through hole are interconnected. Each chip fixing member further forms at least one limiting structure in each chip receiving groove, and the limiting structure is used to limit the movement range of the chip arranged in the chip receiving groove relative to the chip fixing member; each auxiliary insert further includes a body and multiple protruding parts. The multiple protruding parts protrude outward from one side of the body. Each insertion through hole penetrates the body and a protruding part; when each auxiliary insert is fixedly arranged on one side of the chip fixing member, each protruding part is correspondingly located in the accommodating groove; the outer diameter of each protruding part is smaller than the aperture of each accommodating groove, and the outer diameter of each protruding part is larger than the aperture of each chip receiving groove, and the aperture of each insertion through hole is smaller than the aperture of each chip receiving groove; a gap is formed between each protruding part and the chip arranged in the chip receiving groove.

[0013] Preferably, each pressing component includes: a base for fixedly disposed on the cover; a pressing member including a contact portion having a contact surface, a part of the contact portion can extend into one of the fixing perforations, and the contact surface is used for pressing a surface of a chip disposed in one of the chip receiving grooves; at least one elastic member, both ends of which are fixed to the base and the pressing member; when the pressing member presses the surface of the chip, the elastic member will be elastically deformed, and when the pressing member no longer presses the surface of the chip, the elastic restoring force generated by the compression of the elastic member will cause the pressing member to return to the state of not pressing the chip.

[0014] Preferably, when the cover is covered on one side of the tray, the cover, the tray, the plurality of chip fixing members, the plurality of auxiliary insertion members and the plurality of chips together form a closed space; the chip testing device further includes at least one vacuum pumping device for pumping air in the closed space to make the closed space in a negative pressure state.

[0015] Preferably, the cover includes a body and a conduction structure, the temperature regulating device is connected to the conduction structure, the temperature regulating device is used to increase or decrease the temperature of the conduction structure, each base is detachably fixed to the conduction structure, and the conduction structure can transfer heat energy to and from the plurality of pressing members through the plurality of bases and the plurality of elastic members, so that the temperature of each pressing member reaches a predetermined temperature.

[0016] Preferably, each pressing component further includes a heat conducting member connected to the pressing member and the base, and the heat conducting member is located between the pressing member and the base, and the heat conducting member is used to assist the mutual transfer of heat energy between the pressing member and the base.

[0017] Preferably, each pressing member further includes a abutting portion, each pressing component further includes at least one fixing structure and at least one limiting member, the fixing structure is fixed to the base, the limiting member is detachably fixed to the fixing structure, a part of the limiting member is used for abutting against the abutting portion of the pressing member, and the limiting member and the fixing structure can jointly limit the movement range of the pressing member relative to the base; each limiting member includes a receiving notch for receiving a part of the contact portion.

[0018] Preferably, the chip tray kit further includes a plurality of auxiliary fixing members and a plurality of elastic members, each auxiliary fixing member is detachably fixed to the tray, and a plurality of auxiliary fixing members are disposed around each tray perforation, and the plurality of auxiliary fixing members are used to limit the movement range of the chip fixing members located in the plurality of tray perforations relative to the tray; a plurality of elastic members are disposed between each chip fixing member and the side wall forming each tray perforation.

[0019] Preferably, the chip tray kit further includes a plurality of quick-release components, and each auxiliary insertion member can be detachably connected to each chip fixing member through at least one set of quick-release components.

[0020] Preferably, each chip fixing member has at least one groove, and each groove is used to set a set of quick-release components. The quick-release components set in the groove include: two limiting members and two elastic members. One end of each elastic member is fixed to the side wall forming the groove, and the other end of each elastic member is fixed to a limiting member. A gap is formed between the two limiting members; at least two engaging members are provided on one side of each auxiliary insertion member; the two engaging members of each auxiliary insertion member can be engaged with the two limiting members of each chip fixing member.

[0021] Preferably, each auxiliary insertion member has at least one through hole. When each auxiliary insertion member is fixedly arranged on one side of each chip fixing member, the through hole is communicated with the gap; each gap is used to provide a push rod of an insertion member disassembly device to pass through. The push rod passing through the through hole of the auxiliary insertion member can push against the two limiting members, so that the two limiting members no longer engage with the two engaging members.

[0022] Preferably, each limiting member has a clamping groove, and each limiting member is partitioned into a pushing portion and a clamping portion by the clamping groove. The clamping portion has a clamping inclined surface; each engaging member has a clamping inclined surface; when the clamping inclined surfaces of each engaging member and each limiting member contact each other, the movement range of each engaging member relative to the limiting member will be restricted.

[0023] In summary, through the designs of multiple pressing components and temperature regulating devices, etc., the chip testing system of the present invention can make each chip be pressed by the pressing member reaching the predetermined temperature when being tested by the testing machine. In this way, not only can each chip be firmly connected to the testing machine, but also each chip can be tested at the predetermined temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the chip testing system of the present invention.

[0025] Figure 2 It is a schematic diagram of the chip testing device of the chip testing system of the present invention.

[0026] Figure 3 It is a schematic diagram of the chip testing device of the present invention.

[0027] Figure 4 is Figure 3 a partial enlarged schematic diagram.

[0028] Figure 5 and Figure 6 They are partial enlarged schematic diagrams of different perspectives of the chip tray kit of the present invention.

[0029] Figure 7 and Figure 8 They are partial exploded schematic diagrams of different perspectives of the chip tray kit of the present invention.

[0030] Figure 9 It is a partial sectional exploded view of the chip tray kit of the present invention.

[0031] Figure 10 It is a partial sectional view of the chip tray kit of the present invention provided with chips.

[0032] Figure 11 It is a partial exploded view of the chip tray kit of the present invention.

[0033] Figures 12 to 14 It is an action schematic diagram of the auxiliary insert and the chip fixing member of the chip tray kit of the present invention being fixed to each other.

[0034] Figure 15 It is Figure 3 a partial enlarged schematic diagram of.

[0035] Figure 16 It is a partial exploded view of the pressing component of the present invention.

[0036] Figure 17 It is a partial sectional view of the pressing component of the present invention.

[0037] Figure 18 It is a sectional view of the cover body and the chip tray kit of the present invention being separated from each other.

[0038] Figure 19 It is a sectional view of the cover body and the chip tray kit of the present invention being combined with each other.

[0039] Figure 20 It is Figure 19 a partial enlarged schematic diagram of.

[0040] Figure 21 It is a sectional view of different embodiments of the pressing component of the present invention. Detailed implementation manners

[0041] In the following description, if it is pointed out to refer to a specific drawing or as shown in a specific drawing, it is only used to emphasize that in the subsequent description, most of the related content mentioned appears in that specific drawing, but it does not limit that only that specific drawing can be referred to in the subsequent description.

[0042] Please refer to Figure 1 and Figure 2 , Figure 1 which is shown as a block diagram of the chip testing system of the present invention, Figure 2 which is shown as a block diagram of the testing equipment of the chip testing system of the present invention. As Figure 1As shown, the chip testing system D includes a feeding device D1, a chip mounting device D2, an insert mounting device D3, a transfer device D4, a conversion device D5, a conveying device D6, multiple pre-burning devices D7, a chip testing device D8, an inflation device D9, an insert dismounting device D100, a chip dismounting device D200, a post-testing device D300, and a sorting device D400. In different embodiments, the chip testing system D may also not include at least one of the feeding device D1, the chip mounting device D2, the conversion device D5, the pre-burning devices D7, the post-testing device D300, the sorting device D400, and the inflation device D9.

[0043] The feeding device D1 is used to convey multiple chips C to be tested (as Figure 6 shown). The chip mounting device D2 is used to mount the multiple chips conveyed by the feeding device D1 into the respective chip holders 12 (as Figure 3 shown and described in detail later) of the chip tray kit 1 (as Figure 3 and Figure 7 shown and described in detail later) in the multiple chip slots 122 (as Figure 7 shown and described in detail later). In practical applications, the chip mounting device D2 may, for example, include a moving mechanism and multiple suction cups. The moving mechanism can cooperate with the multiple suction cups to simultaneously adsorb one or more chips C and place the multiple chips C into the multiple chip holders 12 in a tray 11 (as Figure 5 shown and described in detail later) at the same time. Of course, in practical applications, the chip mounting device D2 may have different mechanisms according to different types of chips C. In practical applications, the transfer device D4 may also include relevant mechanisms or devices for transferring the chip tray kit 1, and the relevant mechanisms or devices can place the chip tray kit 1 in the chip mounting device D2.

[0044] The insert mounting device D3 is used to fix multiple auxiliary inserts 15 (as Figure 5 and Figure 7 shown and described in detail later) on one side of each chip holder 12 (as Figure 3 and Figure 7 shown and described in detail later) that already contains multiple chips C. For example, the insert mounting device D3 may include a stage, a holding mechanism (not shown in the figure), and a transfer mechanism. One or more chip tray kits 1 that already have multiple chip holders 12 and multiple chips C are placed on the stage. The holding mechanism is used to hold one or more auxiliary inserts 15. The transfer mechanism is connected to the holding mechanism and is used to drive the holding mechanism to move, so that one or more auxiliary inserts 15 held by the holding mechanism are fixedly arranged on the chip tray kit 1 located on the stage (as Figure 3On one side of the chip fixing member 12 as shown.

[0045] In each chip fixing member 12 (such as Figure 7 shown), a quick-release component 16 (such as Figure 7 and Figure 11 shown, to be described in detail later) is provided. In an embodiment, the insert mounting device D3 may include a plurality of the aforementioned inserts R (such as Figures 12 to 14 shown, to be described in detail later). In actual application, the chip mounting device D2 and the insert mounting device D3 may be integrated into the same machine; the numbers of the chip mounting device D2 and the insert mounting device D3 are not limited to a single one, and can be increased according to requirements.

[0046] The transfer device D4 is used to transfer the chip tray kit 1 (such as Figure 5 and Figure 7 shown) which has been provided with a plurality of auxiliary inserts 15 (such as Figure 1 shown) and carries a plurality of chips C to the conversion device D5. It should be noted that after the plurality of auxiliary inserts 15 are installed on one side of the plurality of chip fixing members 12 (such as Figure 7 shown) on the tray 11 by the insert mounting device D3, each auxiliary insert 15 will be firmly connected to each chip fixing member 12. Therefore, when the transfer device D4 transfers the chip tray kit 1 that has been provided with a plurality of auxiliary inserts 15, it can directly hold the tray 11, and the transfer device D4 may not have a mechanism for holding the plurality of auxiliary inserts 15 on the chip tray kit 1.

[0047] The conversion device D5 is used to convert the chip tray kit 1 (such as Figure 3 shown) from a horizontal state to a vertical state (such as Figure 3 the state presented). After the chip tray kit 1 passes through the insert mounting device D3, since the plurality of auxiliary inserts 15 (such as Figure 5 and Figure 7 shown) have been fixedly arranged on one side of each chip fixing member 12 (such as Figure 6 and Figure 7 shown), and each chip C arranged in the chip fixing member 12 has been jointly restricted by the chip fixing member 12 and the auxiliary insert 15, when the conversion device D5 converts the chip tray kit 1 from a horizontal state to a vertical state, the plurality of chips C arranged in the chip tray kit 1 will not leave the chip tray kit 1.

[0048] Through the design of the auxiliary insert 15 (such as Figure 5 and Figure 7 shown), the conversion device D5, etc., the chip tray kit 1 (such as Figure 3When moving between various devices in the chip testing system D (as shown), the chip tray kit 1 can always remain upright. In this way, the space required for the chip tray kit 1 during the transfer process can be significantly reduced, thereby reducing the space required for the chip testing system D.

[0049] In different embodiments, the chip testing system D may not include the conversion device D5, and when the chip tray kit 1 (as Figure 3 shown) moves between various devices included in the chip testing system D, it can remain in a horizontal state. In practical applications, the transfer device D4 and the conversion device D5 may respectively include a mechanism for holding the chip tray kit 1 and a mechanism for driving the chip tray kit 1 to move; for example, the transfer device D4 and the conversion device D5 may respectively have a mechanism similar to a robotic arm.

[0050] The conveying device D6 is disposed adjacent to the conversion device D5. The conveying device D6 may, for example, include a first main conveying mechanism D61, three first sub-conveying mechanisms D62, an auxiliary conveying mechanism D63, a second main conveying mechanism D64, and two second sub-conveying mechanisms D65 (as Figure 2 shown). The first main conveying mechanism D61 is disposed adjacent to a plurality of pre-burning devices D7, and one first sub-conveying mechanism D62 is provided between each pre-burning device D7 and the first main conveying mechanism D61.

[0051] The conversion device D5 is used to transfer the chip tray kit 1 (as Figure 3 shown) to the first main conveying mechanism D61. The first main conveying mechanism D61 is used to transfer the chip tray kit 1 (as Figure 3 shown) that has been tested by the pre-burning device D7 to the chip testing device D8 or the auxiliary conveying mechanism D63. Each first sub-conveying mechanism D62 is used to connect the chip tray kit 1 located on the first main conveying mechanism D61 to the pre-burning device D7, and each first sub-conveying mechanism D62 is also used to separate the chip tray kit 1 from the pre-burning device D7 and move the chip tray kit 1 to the first main conveying mechanism D61.

[0052] Each pre-burning device D7 is used to perform a burn-in test on a plurality of chips C carried by the chip tray kit 1 (as Figure 3 shown) connected thereto. As Figure 3 shown, in practical applications, the pre-burning device D7 may include a testing machine table 2, a cover 3, a plurality of pressing components 4, a temperature adjustment device 5, a vacuum pumping device 6, and a moving device 7, but is not limited thereto. The operating relationships between the testing machine table 2, the cover 3, the plurality of pressing components 4, the temperature adjustment device 5, the vacuum pumping device 6, and the moving device 7 will be described in detail later.

[0053] As shown Figure 1 in the drawings of this embodiment, the chip testing system D is taken as an example with three pre-burning devices D7, but the number of pre-burning devices D7 included in the chip testing system D is not limited thereto. In Figure 1 the embodiment shown, the conversion device D5 can continuously convey three chip tray kits 1 (as Figure 3 shown) to the first main conveying mechanism D61, and the three first sub-conveying mechanisms D62 can successively move one of the chip tray kits 1 located on the first main conveying mechanism D61 from the first main conveying mechanism D61 into the corresponding pre-burning device D7. Then, the three pre-burning devices D7 can respectively perform pre-burning tests on multiple chips C carried by the three chip tray kits 1. When any one of the pre-burning devices D7 completes the pre-burning test on the multiple chips C carried by the chip tray kit 1, the corresponding first sub-conveying mechanism D62 will transfer the chip tray kit 1 to the first main conveying mechanism D61, and the first main conveying mechanism D61 will transfer the chip tray kit 1 to the auxiliary conveying mechanism D63.

[0054] It should be noted that in different embodiments, a single pre-burning device D7 can also perform pre-burning tests on multiple chips C carried by two or more chip tray kits 1. That is to say, in practical applications, a single pre-burning device D7 can perform pre-burning tests on multiple chips C carried by one or more chip tray kits 1 according to requirements.

[0055] As Figure 1 and Figure 2 shown, the auxiliary conveying mechanism D63 is used to move the chip tray kit 1 that has passed the pre-burning test (as Figure 3 shown) from the first main conveying mechanism D61 to the second main conveying mechanism D64. The second main conveying mechanism D64 and the second sub-conveying mechanism D65 can cooperate with each other to connect the chip tray kit 1 with the chip testing device D8, so that the chip testing device D8 can perform tests on it, and the second main conveying mechanism D64 and the second sub-conveying mechanism D65 can cooperate with each other to also separate the chip tray kit 1 from the chip testing device D8.

[0056] It should be noted that in the drawings of this embodiment, the first main conveying mechanism D61 and the second main conveying mechanism D64 are taken as an example to be arranged substantially parallel to each other, and the chip tray kit 1 located on the first main conveying mechanism D61 (as Figure 3As shown, it is transferred to the second main conveyor D64 by the auxiliary conveyor D63. In an embodiment where multiple pre-burning devices D7 and chip testing devices D8 are arranged side by side, the first main conveyor D61 can also be directly connected to the second main conveyor D64, and the chip testing system D may not have the auxiliary conveyor D63.

[0057] In practical applications, the first main conveyor D61, the first auxiliary conveyor D62, the second main conveyor D64, and the second auxiliary conveyor D65, for example, may include a slide rail group, a pneumatic cylinder / hydraulic cylinder, a mechanism for holding the chip tray kit 1 (as Figure 3 shown), a sensor for sensing whether the chip tray kit 1 has been connected or separated from the chip testing device D8 or the pre-burning device D7, etc., which are not limited herein. The number of conveyors included in the conveyor D6 can vary according to the number and installation positions of the pre-burning devices D7 and the chip testing devices D8, and is not limited to what is shown in the figure.

[0058] In a preferred embodiment, the chip testing system D may further include a main chamber D500, an environmental state control device D600, and two main movable doors D700. The chip testing device D8, each pre-burning device D7, the first main conveyor D61 included in the transfer device D4, three second auxiliary conveyors D65, the auxiliary conveyor D63, the second main conveyor D64, and the second auxiliary conveyor D65 are all arranged in the main chamber D500. The inflation device D9 is used to fill the main chamber D500 with clean (clean) ultra-dry gas (super dry air).

[0059] The main chamber D500 has an entrance and an exit, and a main movable door D700 is provided at the entrance and the exit of the main chamber D500 respectively. The main chamber D500 is mainly connected to the outside through the entrance and the exit, and the two main movable doors D700 are mainly used to keep the main chamber D500 unconnected to the outside, so as to maintain the environmental state (such as temperature, humidity, content of specific gas, etc.) inside the main chamber D500. The main movable door D700 is basically opened only when the chip tray kit 1 enters and leaves the main chamber D500, and in other cases, the main movable door D700 can basically remain closed, but this is not limiting.

[0060] In practical applications, the gas filling device D9 can continuously output clean and extremely dry gas (super dry air) to the main chamber D500. Or, the gas filling device D9 can continuously monitor environmental state parameters such as the content of clean and extremely dry gas in the main chamber D500, the temperature, and humidity in the main chamber D500. And the gas filling device D9 can automatically output clean and extremely dry gas to the main chamber D500 when the content of clean and extremely dry gas is lower than a predetermined amount, or when environmental state parameters such as the temperature and humidity in the main chamber D500 are lower than a predetermined value.

[0061] In a preferred embodiment, when any one of the main active doors D700 is opened, the gas filling device D9 can be controlled to actuate, and the gas filling device D9 will output clean and extremely dry gas to the main chamber D500. Or, the gas filling device D9 will output a larger amount of clean and extremely dry gas (super dry air) to the main chamber D500. Thus, it can ensure that the content of clean and extremely dry gas in the main chamber D500 is maintained at a predetermined content.

[0062] The environmental state control device D600 is used to control the environmental state in the main chamber D500, such as temperature, humidity, etc. Through the settings of the gas filling device D9 and the environmental state control device D600, the chip C carried by the chip tray kit 1 (as Figure 3 shown) will not be easily contaminated with impurities such as dust during the transfer process, and it can also make the temperature of the chip C carried by the chip tray kit 1 approximately the same as the temperature of the main chamber D500.

[0063] As Figure 2 shown, it shows a schematic diagram of the chip testing device of the present invention. The chip testing device D8 can include five chambers, a low-temperature testing module D82, a high-temperature testing module D83, at least one gas filling device D84, at least six active doors D85, six environmental state control devices D86, and three temporary storage devices D87. In different embodiments, the chip testing device D8 may not include the environmental state control device D86 and the temporary storage device D87.

[0064] The five chambers are respectively defined as a preparatory chamber D811, a low-temperature chamber D812, a buffer chamber D813, a high-temperature chamber D814, and a cooling chamber D815. The low-temperature chamber D812 is located between the preparatory chamber D811 and the buffer chamber D813. The buffer chamber D813 is located between the low-temperature chamber D812 and the high-temperature chamber D814. Active doors D85 are provided at the entrances and exits of each chamber. The high-temperature chamber D814 is located between the buffer chamber D813 and the cooling chamber D815.

[0065] The temperature in the preparation chamber D811 is lower than room temperature (e.g., 25 degrees) and higher than the temperature in the low-temperature chamber D812. The temperature in the low-temperature chamber D812 ranges from -50 degrees to 20 degrees. The temperature in the buffer chamber D813 is higher than the temperature in the low-temperature chamber D812 and lower than the temperature in the high-temperature chamber D814. The temperature in the high-temperature chamber D814 ranges from 25 degrees to 150 degrees. The temperature in the cooling chamber D815 is lower than the temperature in the high-temperature chamber D814 and higher than room temperature. In different embodiments, the chip testing device D8 may also not include the cooling chamber D815.

[0066] The low-temperature testing module D82 is disposed in the low-temperature chamber D812. The low-temperature testing module D82 is used to contact a plurality of chips C carried by the chip tray kit 1 (as Figure 3 shown), so that the plurality of chips C are tested in a low-temperature state. The high-temperature testing module D83 is disposed in the high-temperature chamber D814. The high-temperature testing module D83 is used to contact a plurality of chips C carried by the chip tray kit 1, so that the plurality of chips C are tested in a high-temperature state.

[0067] The second main conveying mechanism D64 is used to move the chip tray kit 1 between the preparation chamber D811, the low-temperature chamber D812, the buffer chamber D813, the high-temperature chamber D814, and the cooling chamber D815. A temporary storage device D87 and a second auxiliary conveying mechanism D65 are respectively disposed in the preparation chamber D811, the buffer chamber D813, and the cooling chamber D815. Each temporary storage device D87 is used to store at least one chip tray kit 1, and each second auxiliary conveying mechanism D65 is used to move the chip tray kit 1 between the temporary storage device D87 and the second main conveying mechanism D64.

[0068] A second auxiliary conveying mechanism D65 is disposed between the low-temperature testing module D82 and the second main conveying mechanism D64. The second auxiliary conveying mechanism D65 is used to move the chip tray kit 1 (as Figure 3 shown) between the second main conveying mechanism D64 and the low-temperature testing module D82, and the second auxiliary conveying mechanism D65 is used to connect the plurality of chips C carried by the chip tray kit 1 with the low-temperature testing module D82, so that the plurality of chips C can be tested at low temperature by the low-temperature testing module D82. The test content of the low-temperature testing module D82 on the chip C can be determined according to the type and actual needs of the chip C, and is not limited herein.

[0069] A second auxiliary conveying mechanism D65 is disposed between the high-temperature testing module D83 and the second main conveying mechanism D64. The second auxiliary conveying mechanism D65 is used to move the chip tray kit 1 (as Figure 3moves between the second main conveying mechanism D64 and the high-temperature test module D83 as shown in the figure, and the second auxiliary conveying mechanism D65 is used to connect the multiple chips C carried by the chip tray kit 1 to the high-temperature test module D83, so that the multiple chips C can be subjected to high-temperature testing by the high-temperature test module D83. The test content of the high-temperature test module D83 for the chip C can be determined according to the type and actual requirements of the chip C, and is not limited herein.

[0070] The gas charging device D84 is used to charge each chamber with clean super dry air. The gas charging device D84 mentioned here is the same as the aforementioned gas charging equipment D9, and will not be elaborated here. Each environmental state control device D86 is used to monitor and adjust the environmental state (such as temperature, humidity, etc.) in each chamber. Moving doors D85 are provided at the inlets and outlets of each chamber, and each moving door D85 is used to enclose each chamber, so that each chamber can maintain environmental states such as a predetermined temperature, humidity, and the content of the super dry air. In a preferred embodiment, when any one of the moving doors D85 is opened, the gas charging device D84 can be controlled to charge the associated chamber with super dry air.

[0071] As described above, the chip tray kit 1 on the second main conveying mechanism D64 (as Figure 3 shown in the figure) will cooperate with each second auxiliary conveying mechanism D65 in sequence, so that the chip tray kit 1 is sequentially moved into the temporary storage device D87 in the preliminary chamber D811, the low-temperature test module D82 in the low-temperature chamber D812, the temporary storage device D87 in the buffer chamber D813, the high-temperature test module D83 in the high-temperature chamber D814, and the temporary storage device D87 in the cooling chamber D815. When the chip tray kit 1 is sent into the temporary storage device D87 in the preliminary chamber D811, the temperature of the multiple chips C carried by the chip tray kit 1 will gradually drop to approximately the same temperature as the preliminary chamber D811. Then, the chip tray kit 1 will be sent into the low-temperature chamber D812, and the multiple chips C will be subjected to low-temperature testing by the low-temperature test module D82; after the multiple chips C complete the low-temperature testing, the chip tray kit 1 will be moved into the buffer chamber D813, and the temperature of the multiple chips C of the chip tray kit 1 will gradually rise to approximately the same temperature as the buffer chamber D813. Then, the chip tray kit 1 will be sent into the high-temperature chamber D814, and the multiple chips C will be subjected to high-temperature testing by the high-temperature test module D83; when the multiple chips C complete the high-temperature testing, the chip tray kit 1 will be moved into the temporary storage device D87 in the cooling chamber D815 until the temperature of the multiple chips C drops to approximately the same temperature as the cooling chamber D815, and then the chip tray kit 1 will be moved to the second main conveying mechanism D64.

[0072] In different embodiments, the chip tray kit 1 may also be a staging device D87 that is sequentially moved into the buffer chamber D813, a high-temperature test module D83 in the high-temperature chamber D814, a staging device D87 in the cooling chamber D815, a staging device D87 in the preparation chamber D811, and a low-temperature test module D82 in the low-temperature chamber D812. In special applications, the chip testing device D8 may also be only the buffer chamber D813, the high-temperature chamber D814, and the cooling chamber D815, or the chip testing device D8 may also be only the preparation chamber D811, the low-temperature chamber D812, and the buffer chamber D813.

[0073] By filling the preparation chamber D811, the low-temperature chamber D812, the buffer chamber D813, the high-temperature chamber D814, and the cooling chamber D815 with clean super dry air and designing for multiple chips C to sequentially enter multiple chambers, the temperature of the multiple chips C will gradually decrease and increase, and dew condensation or frosting will not easily occur on the surface of the chips C, and the chips C will not be damaged due to drastic temperature changes.

[0074] As Figures 1 to 3 shown, after the chip tray kit 1 completes low-temperature testing and high-temperature testing in the chip testing device D8 in sequence, the chip tray kit 1 will be moved to the second main conveying mechanism D64. Then, the conversion device D5 and the transfer device D4 will convert the chip tray kit 1 located on the second main conveying mechanism D64 to a horizontal state and move it to the insert removal device D100. The insert removal device D100 is used to remove the multiple auxiliary inserts 15 of the chip tray kit 1, so that the chips C located in the multiple chip slots 122 are exposed; then, the chip removal device D200 will take out each chip C from the chip slot 122. In a specific implementation, the insert removal device D100 and the chip removal device D200 can be two independent machine devices, but they can also be integrated into a single machine device.

[0075] After the chip removal device D200 takes out the multiple chips C from the chip slots 122, it will move the chips C into the post-test device D300, and the post-test device D300 will perform a post-test on each chip C. After the post-test device D300 completes the test operation on the chip C, it will move the chip C into the sorting device D400, and the sorting device D400 will classify each chip C according to the test results of each chip C in the pre-burn test, low-temperature test, high-temperature test, and post-test.

[0076] In practical applications, the aforementioned pre-burn device D7, low-temperature test module D82, and high-temperature test module D83 can be the same device. As Figure 3As shown, in one of the embodiments, the aforementioned pre-burning device D7, low-temperature test module D82, and high-temperature test module D83 may each include a test machine platform 2, a cover 3, a plurality of pressing components 4, a temperature adjustment device 5, a vacuum pumping device 6, a moving device 7, and a processing device 8.

[0077] Please refer back Figure 1 , in different embodiments, the chip testing system D may further include a pre-test device D800. The pre-test device D800 may be adjacent to the feeding device D1 and the chip mounting device D2. The transfer device D4 may first transfer the chips from the feeding device D1 to the pre-test device D800 for an open / short test and a leakage test. If the chips pass the pre-test, they are then transferred to the chip mounting device D2.

[0078] The test machine platform 2 and the cover 3 are used to jointly hold a chip tray kit 1. As Figure 3 and Figure 4 shown, the test machine platform 2 can be connected to the chip tray kit 1, and the test machine platform 2 is used to be electrically connected to a plurality of chips C carried by the chip tray kit 1 (as Figure 10 shown) and test the plurality of chips C. The test content of the test machine platform 2 for each chip C can be designed according to the actual type and requirements of the chip C, and is not limited herein. In practical applications, the test machine platform 2 may include a machine platform body 21, a control module 22, and a plurality of probe seats 23. The control module 22 is provided on the machine platform body 21. Each probe seat 23 includes a plurality of probes (not shown in the figure), and the plurality of probes of each probe seat 23 are used to be electrically connected to the chips C to be tested. The control module 22 can execute relevant test programs to perform relevant tests on the plurality of chips C to be tested (as Figure 10 shown) through the plurality of probe seats 23. In practical applications, the machine platform body 21 may have a structure or mechanism (not shown in the figure) for fixing with the chip tray kit 1, and the machine platform body 21 or each probe seat 23 may have a structure or mechanism (not shown in the figure) for assisting in restricting the chips C, which is not limited herein. The control module 22 may, for example, include a circuit board, a microprocessor, a control circuit, etc.

[0079] As Figure 3 , Figures 5 to 10As shown, the chip tray kit 1 may include a tray 11 and 24 chip fixing members 12. The tray 11 includes 24 tray perforations 111, and each tray perforation 111 penetrates through the tray 11. The number of tray perforations 111 of the tray 11, the shape of the plurality of tray perforations 111, the arrangement manner, etc. are not limited to those shown in the figure. The number of chip fixing members 12 corresponds to the number of tray perforations 111. Each chip fixing member 12 is detachably fixed to the tray 11, and each chip fixing member 12 is correspondingly fixed in the tray perforations 111.

[0080] In practical applications, the chip tray kit 1 may further include a plurality of auxiliary fixing members 13. A part of the auxiliary fixing members 13 are detachably (for example, cooperating with at least one screw) fixed to one side surface of the tray 11, and another part of the auxiliary fixing members 13 are detachably fixed to the other side surface of the tray 11. In the drawings of this embodiment, each chip fixing member 12 may be fixed to the tray 11 by 10 auxiliary fixing members 13, and 4 auxiliary fixing members 13 and 6 auxiliary fixing members 13 are respectively provided on the two opposite side surfaces of the tray 11. Through the arrangement of 10 auxiliary fixing members 13, the chip fixing member 12 will be fixed in the tray perforations 111. Regarding the shape of the auxiliary fixing members 13 and the number of auxiliary fixing members 13 by which a single chip fixing member 12 is fixed to the tray 11, they are not limited to those shown in the figure.

[0081] As Figures 7 to 10 shown, each chip fixing member 12 includes 16 fixing perforations 121, 16 chip receiving grooves 122 and a plurality of limiting structures 123. The number of fixing perforations 121, chip receiving grooves 122 and limiting structures 123 included in each chip fixing member 12 are not limited to those shown in the figure. Each fixing perforation 121 penetrates through the chip fixing member 12, the chip receiving groove 122 is connected to the fixing perforation 121, and each chip receiving groove 122 is used to carry a chip C to be tested. A plurality of electrical connection parts (not shown in the figure, such as various pins) of the chip C disposed in the chip receiving groove 122 are exposed outside the chip fixing member 12, and the plurality of electrical connection parts can be connected to a plurality of probe seats 23 of the testing machine 2. Thus, the testing machine 2 (as Figure 3 shown) can be electrically connected to the chip C.

[0082] The side walls of the chip receiving groove 122 extend towards the chip receiving groove 122 to form a plurality of limiting structures 123. The limiting structures 123 located in the same chip receiving groove 122 are used to jointly limit the movement range of the chip C located in the chip receiving groove 122, so as to prevent the chip C disposed in the chip receiving groove 122 from leaving the chip receiving groove 122. In this embodiment, it is taken as an example that the chip C disposed in the chip receiving groove 122 is restricted by 4 limiting structures 123. However, the number, formation position, shape, etc. of the limiting structures 123 are not limited to those shown in the figure. Of course, the limiting structures 123 cannot block the electrical connection portion of the chip C disposed in the chip receiving groove 122 from connecting to the probe base 23 of the testing machine 2.

[0083] As Figure 9 shown, in practical applications, the chip fixing member 12 may further include a guiding structure 124 inside. The guiding structure 124 may be, for example, an inclined surface inclined towards the chip receiving groove 122. Through the design of the guiding structure 124, during the process of the chip C being disposed in the chip receiving groove 122 through the fixing through hole 121, even if the placement position of the chip C has a slight deviation, the chip C will still be aligned by the guiding structure 124 and be successfully disposed in the chip receiving groove 122.

[0084] As described above, by designing the chip fixing member 12 to be detachably fixed to the tray 11, the user can selectively replace the chip fixing member 12 with different shapes and sizes of chip receiving grooves 122 and fixing through holes 121 according to the types, shapes, and sizes of the chips C to be tested.

[0085] As Figure 7 and Figure 8 shown, in a preferred application, the chip tray kit 1 may further include a plurality of elastic members 14. One end of each elastic member 14 is fixedly disposed in the first receiving groove 1121 of the side wall 112 forming each tray through hole 111, and the other end of each elastic member 14 is correspondingly disposed in the second receiving groove 1251 of the side wall 125 of the chip fixing member 12. In an embodiment where the outer shape of the chip fixing member 12 is generally rectangular, at least one of the elastic members 14 may be disposed between each side wall 125 of the chip fixing member 12 and the side wall 125 forming the tray through hole 111.

[0086] When the chip fixing member 12 is fixedly arranged in the tray through hole 111, the plurality of elastic members 14 will be in a compressed state, and the elastic force generated by each compressed elastic member 14 will push against the chip fixing member 12. Thus, the chip fixing member 12 can be stably arranged in the tray through hole 111. Since the plurality of elastic members 14 are arranged between the side wall 125 of the chip fixing member 12 and the side wall 112 forming the tray through hole 111, and the plurality of auxiliary fixing members 13 are fixed to two opposite wide side surfaces of the tray 11, when a user removes the plurality of auxiliary fixing members 13 from the tray 11, the chip fixing member 12 will still be continuously arranged on the tray 11 due to the pushing of the plurality of elastic members 14. Thus, the problem of the chip fixing member 12 falling to the ground when the plurality of auxiliary fixing members 13 are detached from the tray 11 can be avoided. Additionally, through the arrangement of the plurality of elastic members 14, when the chip tray kit 1 is fixed to one side of the testing machine 2 (as Figure 1 shown), the chip fixing member 12 can slightly move relative to the tray 11. Thereby, the plurality of chips C carried by the chip fixing member 12 can be more easily connected to the plurality of probe seats 23 of the testing machine 2 (as Figure 2 shown).

[0087] As Figure 3 and Figures 7 to 11 shown, the chip tray kit 1 may further include 24 auxiliary inserts 15. The number of the auxiliary inserts 15 corresponds to the number of the chip fixing members 12, and the number of the auxiliary inserts 15 is not limited to that shown in the figure. Each auxiliary insert 15 is detachably arranged on one side of each chip fixing member 12.

[0088] Each auxiliary insert 15 includes a body 151 and a plurality of protruding portions 152. The protruding portions 152 protrude outward from one side of the body 151, and the number of the protruding portions 152 corresponds to the number of the fixing through holes 121 of each chip fixing member 12. The chip fixing member 12 may further be formed with a plurality of receiving grooves 126. Each receiving groove 126 communicates with each chip receiving groove 122. The aperture W1 of the receiving groove 126 is larger than the aperture W2 of the chip receiving groove 122, and the receiving groove 126 is used to receive the protruding portions 152 of the auxiliary insert 15.

[0089] The auxiliary insert 15 has an insertion through hole 153 that penetrates through the body 151 and the protruding portions 152. The aperture W3 of the insertion through hole 153 is larger than the outer diameter W4 of the contact portion 421 of the pressing member 42 (as Figure 14 shown, to be described in detail later), and a part of the contact portion 421 can pass through the insertion through hole 153 and expose on one side of the auxiliary insert 15 (as Figure 18As shown). The aperture W3 of the insertion perforation 153 is smaller than the aperture W2 of the chip receiving groove 122. The height of the protruding portion 152 can be approximately equal to the depth of the receiving groove 126. When the protruding portion 152 is located in the receiving groove 126, the body 151 of the auxiliary insert 15 correspondingly abuts against the top surface 128 of the chip fixing member 12 (as Figure 10 shown).

[0090] As Figure 9 shown, in order to facilitate the protruding portion 152 to quickly and correctly enter the fixing perforation 121, the protruding portion 152 can further include a plurality of guiding inclined surfaces 1521, and the plurality of guiding inclined surfaces 1521 are used to make it easier for the protruding portion 152 to enter the fixing perforation 121. As Figure 10 shown, in practical applications, when the chip receiving groove 122 is provided with the chip C and the protruding portion 152 is located in the receiving groove 126, a gap G is formed between the protruding portion 152 and the surface C1 of the chip C, and the protruding portion 152 does not contact the surface C1 of the chip C. When the chip fixing member 12 and the auxiliary insert 15 are fixedly arranged on the tray 11, the chip C arranged in the chip receiving groove 122 of the chip fixing member 12 will be jointly restricted by the chip fixing member 12 and the auxiliary insert 15 at the same time, and it is basically difficult for each chip C to break away from the chip fixing member 12.

[0091] Regarding the manner in which each auxiliary insert 15 is detachably arranged on one side of each chip fixing member 12, no limitation is imposed herein. Any manner that can make each auxiliary insert 15 detachably arranged on each chip fixing member 12 belongs to the scope that can be implemented in this embodiment. For example, in one embodiment, each auxiliary insert 15 and each chip fixing member 12 can be arranged together in the tray perforation 111 of the tray 11, and the aforementioned plurality of auxiliary fixing members 13 can be used to limit the movement ranges of each auxiliary insert 15 and each chip fixing member 12 relative to the tray 11. That is to say, each auxiliary insert 15 and each chip fixing member 12 are fixedly arranged in the tray perforation 111 of the tray 11 through the plurality of auxiliary fixing members 13.

[0092] Continuing from the above, as Figure 3 , Figure 7 , Figure 8 , Figures 11 to 14As shown, in one of the preferred embodiments, the chip tray kit 1 may further include a plurality of quick-release components 16. At least one quick-release component 16 is provided between each auxiliary insert 15 and each chip fixing member 12. Each auxiliary insert 15 can be quickly mounted on one side of the chip fixing member 12 or quickly removed from one side of the chip fixing member 12 through at least one quick-release component 16. For example, each chip fixing member 12 may be provided with two quick-release components 16, and each quick-release component 16 may include: two limiting members 161 and two elastic members 162. The chip fixing member 12 may further have a groove 127. One end of each of the two elastic members 162 is fixedly provided on the side wall forming the groove 127. The other end of each elastic member 162 is fixedly connected to one of the limiting members 161, and the two limiting members 161 of each quick-release component 16 are disposed in one of the grooves 127.

[0093] Each limiting member 161 can be pushed to move in the groove 127 and correspondingly compress the elastic member 162 connected thereto. The compressed elastic member 162 can correspondingly generate an elastic restoring force. When the limiting member 161 is no longer pushed, the elastic restoring force generated by the compression of the elastic member 162 will cause the limiting member 161 to return to the position where it is not pushed. When the two limiting members 161 are disposed in the groove 127, a gap P is formed between the two limiting members 161.

[0094] Each limiting member 161 may have a card slot 1611. Each card slot 1611 divides the limiting member 161 into a pushing portion 16A and a clamping portion 16B. A guiding inclined surface 16A1 is formed at one end of the pushing portion 16A opposite to the elastic member 162, and a clamping inclined surface 16B1 is formed at one end of the clamping portion 16B facing the pushing portion 16A.

[0095] As Figure 12 shown, each auxiliary insert 15 may form a through hole 155, and each auxiliary insert 15 is provided with two engaging members 154. The two engaging members 154 are located at both ends of the through hole 155. A clamping inclined surface 1541 is formed at one end of each engaging member 154 opposite to the through hole 155. The through hole 155 of the auxiliary insert 15 is used to provide an insert R to extend therein. The insert R is used to push the two limiting members 161 provided on the chip fixing member 12. In practical applications, the insert R may be fixed to related robotic arms and other devices for fixing the auxiliary insert 15 to the chip fixing member 12.

[0096] As Figures 12 to 13As shown, the auxiliary insert 15 and the insert R cooperate with each other. The process of fixing to the chip fixing member 12 can be as follows: First, the insert R passes through the through hole 155 of the auxiliary insert 15 and enters the gap P formed between the two limiting members 161. Since the outer diameter of the insert R is greater than the width of the gap P, when the insert R enters the groove 127, the insert R will push against the pushing portions 16A of the two limiting members 161, and each limiting member 161 will move in the direction of the elastic member 162 accordingly, and each elastic member 162 will be compressed and elastically deformed.

[0097] Continuing from above, as Figure 13 shown, when the end of the insert R abuts against the bottom of the groove 127 formed, each engaging member 154 will be correspondingly arranged in the engaging groove 1611 of each limiting member 161. The engaging inclined surfaces 1541 of each engaging member 154 are arranged facing each other with the engaging inclined surfaces 16B1 of the engaging portions 16B of the adjacent limiting members 161, and each engaging inclined surface 1541 and the adjacent engaging inclined surface 16B1 do not contact each other. Then, as Figure 14 shown, when the insert R is removed from the groove 127, the elastic restoring force generated by the compression of the two elastic members 162 in the groove 127 will cause the two limiting members 161 to move in the direction of approaching each other. Finally, the engaging inclined surfaces 16B1 of the engaging portions 16B of each limiting member 161 will abut against the engaging inclined surfaces 1541 of the adjacent engaging members 154, and the auxiliary insert 15 will be engaged and fixed to the chip fixing member 12 accordingly.

[0098] As Figure 14 shown, in the case where the auxiliary insert 15 is fixed to the chip fixing member 12 through the engaging member 154 and the quick-release assembly 16, relevant mechanisms such as a robotic arm can pass the insert R through the through hole 155 of the auxiliary insert 15 and enter the gap P between the two limiting members 161 to push against the two limiting members 161. At this time, the two limiting members 161 will change from the Figure 14 state to the Figure 13 state. In the Figure 13 state, the engaging inclined surfaces 16B1 of each limiting member 161 will no longer contact the engaging inclined surfaces 1541 of the adjacent engaging members 154, and relevant mechanisms such as a robotic arm can hold the auxiliary insert 15 and pull the auxiliary insert 15 away from the chip fixing member 12 to separate the auxiliary insert 15 from the chip fixing member 12.

[0099] As Figure 5 and Figure 7As shown, it is worth mentioning that in an embodiment where each auxiliary insert 15 is fixed to one side of the chip fixing member 12 through a quick-release component 16, each auxiliary insert 15 may be formed with a plurality of avoidance holes 156, and each avoidance hole 156 is used to avoid the auxiliary fixing member 13, so that the auxiliary fixing member 13 does not limit the movement range of the auxiliary insert 15.

[0100] Please refer to Figure 15 and Figure 18 , the cover 3 may have a body 31 and a conduction structure 32. A receiving groove 311 is recessed on one side of the body 31. The conduction structure 32 is formed on one side of the body 31 and the conduction structure 32 is located in the receiving groove 311. A plurality of pressing components 4 are arranged on the cover 3, and each pressing component 4 is located in the receiving groove 311 of the cover 3. It should be noted that in Figure 17 of this embodiment, it is taken as an example that a plurality of pressing components 4 protrude from one end of the cover 3, but it is not limited thereto. In different embodiments, a plurality of pressing components 4 may also not protrude from the cover 3, and each pressing component 4 is completely located in the receiving groove 311 of the cover 3. In other words, the sum of the thickness of the conduction structure 32 and the height of each pressing component 4 may be greater than, equal to, or less than the depth of the receiving groove 311 of the cover 3.

[0101] The cover 3 is used to cover one side of the tray 11. When the cover 3 covers one side of the tray 11, a plurality of pressing components 4 arranged on the cover 3 may correspondingly press against the surface C1 of the chip C in the chip fixing member 12 of the tray 11 (as Figure 18 shown). In different embodiments, when the cover 3 covers one side of the tray 11, a plurality of pressing components 4 may not contact the plurality of chips C until the closed space formed by the cover 3 and the tray 11 is evacuated, and then the plurality of pressing components 4 press against the surface C1 of the plurality of chips C. Regarding the size, shape of the cover 3 and the number of the pressing components 4 arranged on the conduction structure 32 of the cover 3, they are not limited to those shown in the figure.

[0102] In practical applications, the cover 3 and the tray 11 may respectively have guiding structures 33, 113 that can be mutually engaged. For example, each guiding structure 33 of the cover 3 may have a blind hole, and each guiding structure 113 of the tray 11 may be a columnar structure. When the cover 3 covers one side of the tray 11, the columnar structure of the tray 11 will correspondingly engage in the blind hole of the cover 3. Through the design of the guiding structure 33 of the cover 3 and the guiding structure 113 of the tray 11, the cover 3 can be quickly and correctly covered on one side of the tray 11, and accordingly each pressing component 4 can be quickly and correctly located on one side of the chip C in the chip receiving groove 122. The number, shape, etc. of the guiding structure 33 of the cover 3 and the guiding structure 113 of the tray 11 are not limited to those shown in the figure.

[0103] As shown Figures 15 to 17 in the figure, each pressing component 4 includes: a base 41, a pressing member 42, and two elastic members 43. In this embodiment, taking 16 pressing components 4 sharing the same base 41 as an example, but not limited thereto. In different embodiments, multiple pressing components 4 may not share the same base 41. The base 41 can be detachably and fixedly arranged on the conduction structure 32 of the cover 3. In different embodiments, the base 41 can also be integrally formed with the conduction structure 32. In the embodiment where the base 41 is detachably and fixedly arranged on the cover 3, relevant personnel can easily replace and repair the pressing component 4.

[0104] Each pressing member 42 includes a contact portion 421 and a abutting portion 422. The contact portion 421 has a contact surface 4211. The outer diameter of the contact portion 421 is smaller than the aperture W3 of the insertion through hole 153 (as Figure 10 shown), and a part of the contact portion 421 can extend into the insertion through hole 153 (as Figure 10 shown), and the contact surface 4211 can press against the surface C1 of the chip C. The contact portion 421 is mainly used to press against the surface C1 of the chip C so that the chip C can be stably connected to the testing machine 2 (as Figure 3 shown). Thereby, it is avoided that the chip C is separated from the probe of the probe base 23 (as Figure 5 shown) during the testing process by the testing machine 2.

[0105] The abutting portion 422 is connected to the contact portion 421. The abutting portion 422 is used to limit the movement range of the pressing member 42 relative to the auxiliary insertion member 15, thereby preventing the contact portion 421 from pressing against the chip C excessively. As Figure 20 shown, when the cover 3 is covered on one side of the tray 11, the abutting portions 422 of each pressing member 42 will be located on one side of the auxiliary insertion member, and the contact portions 421 of the pressing member 42 will correspondingly be located in the insertion through hole 153, and the contact surface 4211 will correspondingly be located on one side of the surface C1 of the chip C.

[0106] Both ends of each elastic member 43 are fixed to the base 41 and the pressing member 42. When the contact surface 4211 of the pressing member 42 contacts the uneven surface C1 of the chip C, at least one elastic member 43 will be in a compressed state, and the elastic restoring force generated by the compression of the elastic member 43 can make the contact surface 4211 still closely contact the surface C1 of the chip C. The number of elastic members 43 included in each pressing component 4 is not limited to two. In different embodiments, a single pressing component 4 may also only include one elastic member 43 or more than 3 elastic members 43.

[0107] As Figure 16 and Figure 17As shown, in practical applications, the elastic member 43 can be, for example, a compression spring. The pressing component 4 can include two compression springs (elastic members 43), and the pressing component 4 can also include two guiding members 44 and two fixing kits 45. The abutting portion 422 of the pressing member 42 can have two first grooves 4221, and the base 41 has two second grooves 411. Each first groove 4221 is arranged facing a second groove 411, and both ends of each compression spring are respectively engaged with the first groove 4221 and the second groove 411.

[0108] The abutting portion 422 of the pressing member 42 can also have two through holes 4222. Each through hole 4222 communicates with each first groove 4221. Two fixing kits 45 are fixedly arranged in the two through holes 4222. Each fixing kit 45 has a through hole 451. One end of each guiding member 44 is fixed to the base 41, and the other end of each guiding member 44 passes through the through hole 451 of each fixing kit 45. When the pressing member 42 moves relative to the base 41, each fixing kit 45 can move relative to each guiding member 44, and the two guiding members 44 and the two fixing kits 45 can jointly limit the moving direction of the pressing member 42 relative to the base 41. Through the design of the two guiding members 44 and the fixing kits 45, it can effectively limit the pressing member 42 to move substantially along the axis L perpendicular to the surface of the base 41 (as Figure 18 shown). In this way, when the pressing member 42 presses against the surface C1 of the chip C, the contact portion 421 of the pressing member 42 will be in contact with the surface C1 of the chip C with the entire contact surface 4211.

[0109] Please refer back Figure 16 , each pressing component 4 can also include at least one fixing structure 46 and at least one limiting member 47. The limiting member 47 is detachably fixed to the fixing structure 46. A part of the limiting member 47 abuts against the abutting portion 422 of the pressing member 42, and the limiting member 47 and the fixing structure 46 can jointly limit the movement range of the pressing member 42 relative to the base 41. For example, the base 41 can have 24 fixing structures 46. Every 4 fixing structures 46 are arranged in a row on the base 41. Every 6 fixing structures 46 and 2 limiting members 47 jointly limit 4 pressing members 42, and the 24 fixing structures 46 cooperate with 8 limiting members 47 to arrange 16 pressing members 42 on the base 41. Among them, each fixing structure 46 can have a locking hole 461, and each limiting member 47 has 3 through holes 471. Three screws S can cooperate with 3 fixing structures 46 and the 3 through holes 471 of one limiting member 47 to fix a single limiting member 47 to the 3 fixing structures 46, and a single limiting member 47 correspondingly presses against the abutting portions 422 of 4 pressing members 42.

[0110] In practical applications, the limiting member 47 may further include a receiving notch 472 for receiving a part of the contact portion 421. In the attached drawings of this embodiment, therefore, a single limiting member 47 abuts against the abutting portions 422 of 4 limiting members 47 at the same time. Thus, the limiting member 47 may correspondingly have 4 receiving notches 472, and the 4 receiving notches 472 are correspondingly for receiving parts of the contact portions 421 of 4 limiting members 47. Through the design of the receiving notch 472, the movement direction of the pressing member 42 relative to the base 41 can be assisted in being restricted, so that the pressing member 42 moves substantially along a direction perpendicular to the axis L of the base 41 (as Figure 18 shown).

[0111] In embodiments where each pressing assembly 4 has a guiding member 44, the limiting member 47 correspondingly has at least one avoiding through-hole 473, and each avoiding through-hole 473 is used for the guiding member 44 to pass through. That is to say, when the pressing member 42 moves towards the base 41, a part of the guiding member 44 will protrude from the avoiding through-hole 473. The shape of the avoiding through-hole 473 is not limited to that shown in the figure.

[0112] Please refer to Figure 3 and Figure 15 , the temperature regulating device 5 may be connected to a plurality of pressing assemblies 4 through the cover 3, and the temperature regulating device 5 is used to make the temperature of each pressing member 4 reach a predetermined temperature. Through the setting of the temperature regulating device 5, when the chip C disposed on the chip fixing member 12 is connected to the testing machine 2 and is tested by the testing machine 2, the pressing member 42 at the predetermined temperature will press against the surface C1 of the chip C (as Figure 8 shown), Figure 8 shown), so that the chip C can be tested in an environment at a predetermined temperature. In a preferred embodiment, the pressing member 42 may be made of a metal material with a high thermal conductivity coefficient.

[0113] In the existing common chip testing operations, a plurality of chips are tested in a large freezing chamber or an oven. Since the temperatures in each area of the freezing chamber or the oven are difficult to be exactly the same, a plurality of chips cannot be tested under the same temperature, thus resulting in unreliable test results. On the contrary, in the pre-burning device D7, the low-temperature testing module D82 and the high-temperature testing module D83 of the present invention, during the process that the chip C is tested by the testing machine 2, the contact surfaces 4211 of each pressing member 4 at the predetermined temperature (as Figure 14 shown) Figure 8 press against the surfaces C1 of each chip C (as Figure 8 shown), so that a plurality of chips C will be tested at substantially the same temperature.

[0114] In practical applications, the temperature adjustment device 5 can, according to requirements, make the temperature of each pressing member 42 reach a predetermined temperature in any way, and this is not limited herein. For example, the temperature adjustment device 5 can be connected to the conduction structure 32 of the cover body 3, and each base 41 is fixed to the conduction structure 32. The temperature adjustment device 5 can increase or decrease the temperature of the conduction structure 32, and the conduction structure 32 can transfer heat energy to and from the plurality of pressing members 42 through the plurality of bases 41 and the plurality of elastic members 43, so that the temperature of each pressing member 42 reaches the predetermined temperature. The conduction structure 32 referred to herein means a structure made of a material with a high thermal conductivity coefficient. In an embodiment where the main body 31 of the cover body 3 and the conduction structure 32 are integrally formed, the temperature adjustment device 5 transfers heat energy through the cover body 3 and the plurality of pressing components 4. In an embodiment where the conduction structure 32 and the main body 31 of the cover body 3 are not integrally formed, the temperature adjustment device 5 can be directly connected to the conduction structure 32.

[0115] In one embodiment, the conduction structure 32 may contain at least one flow channel (not shown in the figure), and the temperature adjustment device 5 can provide a fluid into the flow channel to increase or decrease the temperature of the conduction structure 32. The fluid is, for example, various high-temperature fluids or low-temperature fluids. In one embodiment, the temperature adjustment device 5 may include a temperature controller (not shown in the figure) and a heating coil (not shown in the figure). The temperature controller is electrically connected to the heating coil, and the heating coil is disposed in the conduction structure 32. The temperature controller can activate the heating coil to increase the temperature of the conduction structure 32. In an embodiment where the temperature adjustment device 5 includes a temperature controller, the temperature adjustment device 5 may further include a refrigeration chip (not shown in the figure). The temperature controller is electrically connected to the refrigeration chip, and the refrigeration chip is disposed in the conduction structure 32. The temperature controller can activate the refrigeration chip to decrease the temperature of the conduction structure 32. In practical applications, a refrigeration chip and a heating coil can also be simultaneously disposed in the conduction structure 32, and this is not limited herein.

[0116] Such as Figure 16As shown, in order to make it easier for the temperature of the pressing member 42 to reach the predetermined temperature, each pressing assembly 4 may further include a heat conducting member 48. The heat conducting member 48 is located between the pressing member 42 and the base 41, and is connected to the pressing member 42 and the base 41. The heat conducting member 48 is used to assist in the transfer of heat energy between the pressing member 42 and the base 41. The heat conducting member 48 may, for example, include two elastic arms 481, one end of which is connected to each other. When the pressing member 42 moves toward the base 41, the two elastic arms 481 are elastically deformed by the pressing member 42. When the pressing member 42 moves away from the base 41, the elastic restoring force generated by the compression of the elastic arms 481 will restore the elastic arms 481 to an uncompressed state. In this way, whether the pressing member 42 is stationary or moving relative to the base 41, the heat energy between the pressing member 42 and the conductive structure 32 can be well transferred to each other through the heat conducting member 48. It is worth mentioning that the guide member 44 and the fixing assembly 45 may also be made of materials with high thermal conductivity, and the guide member 44 and the fixing assembly 45 may also be used to conduct heat energy between the pressing member 42 , the base 41 and the conductive structure 32 .

[0117] Please also refer to Figure 3 、 Figures 19 to 21 The processing device 8 is electrically connected to the test machine 2, the vacuum device 6 and the moving device 7, and the processing device 8 can control the operation of the test machine 2, the vacuum device 6 and the moving device 7. The processing device 8 is, for example, various computers, various servers, etc. The moving device 7 is connected to the cover 3, and the moving device 7 can drive the cover 3 to move closer to or away from the tray 11. The moving device 7 referred to here is mainly used to make the cover 3 and the tray 11 closer to each other or farther away from each other. Therefore, in different embodiments, the moving device 7 can also be connected to the tray 11, and the moving device 7 drives the tray 11 to move closer to or away from the cover 3.

[0118] like Figure 20 As shown, when the moving device 7 drives the cover 3 to move toward the tray 11, and the cover 3 is covered on one side of the tray 11, and the tray 11 is fixed to the test machine 2 on the side opposite to the cover 3 (as shown in FIG. Figure 3 , the contact surface 4211 of each pressing member 42 will abut against the surface C1 of the chip C. One side of the chip C is connected to the probe holder 23 of the tester 2. The cover 3, chip holder 12, tray 11, and multiple chips C together form a closed space SP. At this time, the processing device 8 controls the vacuum pump 6 to operate, causing the vacuum pump 6 to extract air from the closed space SP, thereby creating a negative pressure state in the closed space SP.

[0119] It is worth mentioning that the pre-burning device D7 and the chip testing device D83 may also include at least one detector (not shown in the figure). The detector is electrically connected to the processing device 8. The detector is used to detect whether the cover 3 is covered on one side of the tray 11. When the processing device 8 determines that the cover 3 has been covered on one side of the tray 11 based on the detection result of the detector, the processing device 8 will control the vacuum pumping device 6 to actuate.

[0120] By designing to pump out the gas in the closed space SP through the vacuum pumping device 6 to make the closed space SP in a negative pressure state, it can effectively avoid the temperature in the closed space SP from being affected by the external environment of the closed space SP. Accordingly, the humidity in the closed space SP can be effectively controlled, thereby significantly reducing the problem of condensation on the surface C1 of the chip C.

[0121] It is worth mentioning that by designing the pressing member 42 to connect two elastic members 43, when the contact surface 4211 or the surface C1 of the chip C is uneven, most areas of the contact surface 4211 of the pressing member 42 can still press on the surface C1 of the chip C. More specifically, when the contact surface 4211 and the surface C1 of the chip C are inclined, one of the elastic members 43 will be in a compressed state, and the elastic restoring force generated by the compression of the elastic member 43 will make the contact surface 4211 closely press on the surface C1 of the chip C.

[0122] Please refer to Figure 10 and Figure 20 , since the aperture W3 of the insertion hole 153 of each auxiliary insertion member 15 is smaller than the aperture W2 of the chip receiving groove 122. Therefore, when the closed space SP is converted from a negative pressure state back to an atmospheric pressure state and the moving device 7 moves away from the tray 11, if the chip C adheres to the pressing member 42, during the process that the contact portion 421 leaves the auxiliary insertion member 15 along the insertion hole 153, the chip C will be pushed by the end of the protruding portion 152 of the auxiliary insertion member 15 close to the chip receiving groove 122 to separate from the contact portion 421. That is to say, by providing the auxiliary insertion member 15 on the tray 11 and designing the aperture W3 of the insertion hole 153 to be smaller than the aperture W2 of the chip receiving groove 122, it can ensure that when the cover 3 and the plurality of pressing components 4 move away from the tray 11, the problem that the chip C adheres to the contact portion 421 does not occur.

[0123] When the pre-burning device D7 and the chip testing device D8 of the present invention are manufactured and sold, they may include a testing machine 2, a cover 3, a plurality of pressing components 4, a temperature adjusting device 5, and a processing device 8, but not limited thereto. In different embodiments, when the pre-burning device D7 and the chip testing device D8 of the present invention are manufactured and sold, they may also include at least one of a chip tray kit 1, a vacuum pumping device 6, and a moving device 7. In addition, the above-mentioned chip tray kit 1 of the present invention may also be manufactured and sold separately.

[0124] Please refer to Figure 21 , which shows a cross-sectional schematic view of different embodiments of the pressing component of the present invention. The biggest difference between the pressing component of this embodiment and the previous embodiment is that the heat conducting member 48 may be a columnar structure. One end of the heat conducting member 48 is fixed in a groove 423 of the pressing member 42, and one end of the heat conducting member 48 is movably arranged in a receiving groove 412 of the base 41. The other end of the heat conducting member 48 is fixed to the pressing member 42. When the pressing member 42 moves relative to the base 41, the heat conducting member 48 moves corresponding to the receiving groove 412 of the base 41, and the heat conducting member 48 is always in contact with the side wall forming the receiving groove 412. The temperature adjusting device 5 transfers heat energy to and from the pressing member 42 through the base 41 and the heat conducting member 48 presented as a columnar structure.

[0125] In summary, through the designs of a plurality of pressing components and a temperature adjusting device, etc., the chip testing system of the present invention can make each chip be pressed by a pressing member reaching a predetermined temperature when being tested by the testing machine. In this way, not only can each chip be firmly connected to the testing machine, but also each chip can be tested at a predetermined temperature.

[0126] The above are only the preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the protection scope of the present invention.

Claims

1. A chip testing system, characterized in that: The chip testing system is used to perform a test operation on a plurality of chips, and the chip testing system includes: A chip tray kit comprising: A tray having a plurality of tray through-holes, each of the tray through-holes being disposed throughout the tray; A plurality of chip holders are detachably fixed to the tray, and each of the chip holders is located in each of the tray through-holes; each of the chip holders has a plurality of fixing through-holes and a plurality of chip receiving slots, each of the fixing through-holes is provided through the chip holder, each of the chip receiving slots is connected to each of the fixing through-holes, each of the chip receiving slots is used to receive one of the chips, and a plurality of connection portions of the chip received in each of the chip receiving slots are fixed by the chip; and A plurality of auxiliary inserts are detachably fixed to one side of the plurality of chip holders, each of the auxiliary inserts being used to limit the range of movement of the plurality of chips disposed in each of the chip holders relative to the chip holder; each of the auxiliary inserts has a plurality of insertion holes, and when each of the auxiliary inserts is fixed to one side of the chip holder, each of the insertion holes communicates with the chip receiving groove; an inserter mounting device for mounting the plurality of auxiliary inserters on one side of the plurality of chip mounting members; A chip testing device comprising: At least one testing machine, which can be connected to the chip tray assembly, and the testing machine is used to perform the testing operation on the plurality of chips carried by the chip tray assembly; At least one cover, one side of which is concave to form a receiving groove, and the cover is used to cover one side of the tray; a plurality of pressing components disposed on the cover, each of the pressing components being located in the receiving groove of the cover, the plurality of pressing components being used to press a surface of the plurality of chips carried by the plurality of chip fixing members of the chip tray assembly; and a temperature regulating device connected to the plurality of pressing assemblies, the temperature regulating device being used to adjust the temperature of a pressing member of each pressing assembly to a predetermined temperature; an insert disassembly device for removing the plurality of auxiliary inserts from one side of the plurality of chip fixing members; and A conveying device is used to transfer the chip tray assembly.

2. The chip testing system according to claim 1, wherein: The chip testing equipment includes at least four chambers, a low-temperature test module, a high-temperature test module, at least five movable doors, and an inflation device. The four chambers are respectively defined as a preparation chamber, a low-temperature chamber, a buffer chamber, and a high-temperature chamber. The temperature in the preparation chamber is lower than room temperature and higher than the temperature in the low-temperature chamber, the temperature in the low-temperature chamber is between -50 degrees Celsius and 20 degrees Celsius, the temperature in the buffer chamber is higher than the temperature in the low-temperature chamber and lower than the temperature in the high-temperature chamber, and the temperature in the high-temperature chamber is between 25 degrees Celsius and 150 degrees Celsius. The low-temperature test module is provided with the low-temperature chamber, the low-temperature test module is used to contact the multiple chips carried by the chip tray kit, so that the multiple chips are tested at a low temperature. The high-temperature test module is provided with the high-temperature chamber, the high-temperature test module is used to contact the multiple chips carried by the chip tray kit, so that the multiple chips are tested at a high temperature. A movable door is provided between each of the chambers. The inflation device is used to inject clean super dry gas (super dry gas) into the chamber. air) is filled into each of the chambers; when any of the movable doors is opened, the inflation device will fill the corresponding chamber with the extremely dry gas.

3. The chip testing system according to claim 1, wherein: The chip testing equipment includes at least three chambers, a low-temperature testing module, at least three movable doors and an inflation device. The two chambers are respectively defined as a preparation chamber, a low-temperature chamber and a buffer chamber. The temperature in the preparation chamber is lower than the room temperature and higher than the temperature in the low-temperature chamber. The temperature in the low-temperature chamber is between -50 degrees and 20 degrees. The temperature in the buffer chamber is higher than the temperature in the low-temperature chamber and lower than 25 degrees. The low-temperature testing module is provided with the low-temperature chamber. The low-temperature testing module is used to contact the multiple chips carried by the chip tray kit, so that the multiple chips are tested under low-temperature conditions. A movable door is provided between the two chambers. The inflation device is used to fill clean, extremely dry gas into each chamber. When any of the movable doors is opened, the inflation device will fill the corresponding chamber with the extremely dry gas.

4. The chip testing system according to claim 1, wherein: The chip testing equipment includes at least three chambers, a high-temperature test module, at least three movable doors and an inflation device. The three chambers are respectively defined as a buffer chamber, a high-temperature chamber and a cooling chamber. The temperature in the buffer chamber is higher than 20 degrees, the temperature in the high-temperature chamber is between 25 degrees and 150 degrees, and the temperature in the cooling chamber is lower than the temperature in the high-temperature chamber and higher than room temperature. The high-temperature test module is provided in the high-temperature chamber. The high-temperature test module is used to contact the multiple chips carried by the chip tray kit and test the multiple chips under high temperature conditions. A movable door is provided between each of the chambers. The inflation device is used to fill clean, extremely dry gas into each of the chambers. When any of the movable doors is opened, the inflation device will fill the corresponding chamber with the extremely dry gas.

5. The chip testing system according to claim 2, characterized in that: The chip testing system further includes at least one burn-in device, at least one main conveying mechanism and at least two auxiliary conveying mechanisms, the main conveying mechanism is used to move the chip tray kit between the burn-in device and the chip testing device; the burn-in device is used to perform a burn-in test on the multiple chips carried by the chip tray kit; one auxiliary conveying mechanism is provided between the burn-in device and the main conveying mechanism, the auxiliary conveying mechanism is used to move the chip tray kit between the main conveying mechanism and the burn-in device, so that the chip tray kit is connected to or separated from the burn-in device; another auxiliary conveying mechanism is provided between the chip testing device and the main conveying mechanism, the other auxiliary conveying mechanism is used to move the chip tray kit between the main conveying mechanism and the chip testing device, so that the chip tray kit is connected to or separated from the chip testing device.

6. The chip testing system according to claim 5, characterized in that: The chip testing system further includes a main chamber, an inflation device, and two main movable doors. The chip testing device, the pre-burning device, the main conveying mechanism, and the auxiliary conveying mechanism are arranged in the main chamber. The inflation device is used to fill clean super dry air into the main chamber. The main chamber has an inlet and an outlet. The inlet of the main chamber is provided with one main movable door, and the outlet of the main chamber is provided with another main movable door.

7. The chip testing system according to claim 1, wherein: The chip testing system further includes a conversion device, which is used to convert the chip tray assembly, on which the plurality of auxiliary inserts are fixed, between a horizontal state and an upright state.

8. The chip testing system according to claim 1, wherein: Each of the chip fixing parts further includes a plurality of chip receiving grooves and a plurality of receiving grooves, each of the receiving grooves, each of the chip receiving grooves and each of the fixing through-holes are connected to each other, and each of the chip fixing parts further includes at least one limiting structure formed in each of the chip receiving grooves, and the limiting structure is used to limit the range of movement of the chip arranged in the chip receiving groove relative to the chip fixing part; each of the auxiliary inserts further includes a main body and a plurality of protrusions, a plurality of the protrusions are formed by protruding outward from one side of the main body, and each of the insertion through-holes passes through the main body and one of the protrusions; when each of the auxiliary inserts is fixedly arranged on one side of the chip fixing part, each of the protrusions is correspondingly located in the receiving groove; the outer diameter of each of the protrusions is smaller than the aperture of each of the receiving grooves, and the outer diameter of each of the protrusions is larger than the aperture of each of the chip receiving grooves, and the aperture of each of the insertion through-holes is smaller than the aperture of each of the chip receiving grooves; a gap is formed between each of the protrusions and the chip arranged in the chip receiving groove.

9. The chip testing system according to claim 1, wherein: Each of the pressing components comprises: a base, which is used to be fixedly mounted on the cover; a pressing member comprising a contact portion having a contact surface, a portion of which is capable of extending into one of the fixing through-holes, and the contact surface is used to press a surface of the chip disposed in one of the chip receiving grooves; At least one elastic member has its two ends fixed to the base and the pressing member; when the pressing member presses against the surface of the chip, the elastic member will elastically deform, and when the pressing member no longer presses against the surface of the chip, the elastic restoring force generated by the pressure on the elastic member will cause the pressing member to return to a state where it is not pressing against the chip.

10. The chip testing system according to claim 9, characterized in that: When the cover is installed on one side of the tray, the cover, the tray, the plurality of chip fixing parts, the plurality of auxiliary inserts and the plurality of chips together form a closed space; the chip testing equipment further includes at least one vacuum pumping device, which is used to extract the air in the closed space to make the closed space in a negative pressure state.

11. The chip testing system according to claim 9, characterized in that: The cover includes a main body and a conductive structure. The temperature regulating device is connected to the conductive structure and is used to increase or decrease the temperature of the conductive structure. Each of the bases is detachably fixed to the conductive structure. The conductive structure can transfer heat energy to the multiple pressing members through the multiple bases and the multiple elastic members, so that the temperature of each pressing member reaches the predetermined temperature.

12. The chip testing system according to claim 9, characterized in that: Each of the pressing components also includes a heat conductive member, which is connected to the pressing component and the base, and is located between the pressing component and the base. The heat conductive member is used to assist in the mutual transfer of heat energy between the pressing component and the base.

13. The chip testing system according to claim 9, characterized in that: Each of the pressing members also includes a resting portion, and each of the pressing assemblies also includes at least one fixed structure and at least one limiting member, the fixed structure is fixed to the base, and the limiting member is detachably fixed to the fixed structure, a portion of the limiting member is used to rest against the resting portion of the pressing member, and the limiting member and the fixed structure can jointly limit the range of movement of the pressing member relative to the base; each of the limiting members includes an accommodating notch, and the accommodating notch is used to accommodate a portion of the contact portion.

14. The chip testing system according to claim 1, wherein: The chip tray kit also includes multiple auxiliary fixing parts and multiple elastic parts. Each of the auxiliary fixing parts is detachably fixed to the tray, and multiple auxiliary fixing parts are arranged around each of the tray through-holes. The multiple auxiliary fixing parts are used to limit the range of movement of the chip fixing parts located in the multiple tray through-holes relative to the tray; multiple elastic parts are arranged between each of the chip fixing parts and the side walls forming each of the tray through-holes.

15. The chip testing system according to claim 1, wherein: The chip tray kit further comprises a plurality of quick-release components, and each of the auxiliary inserts can be detachably connected to each of the chip fixing components via at least one set of the quick-release components.

16. The chip testing system according to claim 15, characterized in that: Each of the chip fixing parts has at least one groove, and each of the grooves is used to set a group of the quick-release components. The quick-release components set in the grooves include: two limiting parts and two elastic parts, one end of each of the elastic parts is fixed to the side wall forming the groove, and the other end of each of the elastic parts is fixed to one of the limiting parts, and a gap is formed between the two limiting parts; at least two engaging parts are set on one side of each of the auxiliary inserts; the two engaging parts of each of the auxiliary inserts can be engaged with the two limiting parts of each of the chip fixing parts.

17. The chip testing system according to claim 16, wherein: Each of the auxiliary inserts has at least one through-hole. When each of the auxiliary inserts is fixedly arranged on one side of each of the chip fixing parts, the through-hole and the gap are communicated with each other. Each of the gaps is used to provide a push rod of the insert removal device to pass through. The push rod passing through the through-hole of the auxiliary insert can push against the two limiting parts, so that the two limiting parts no longer engage with the two engaging parts.

18. The chip testing system according to claim 17, wherein: Each of the limiting members has a slot, and each of the limiting members is divided into a pushing portion and a locking portion by the slot, and the locking portion has a locking inclined surface; each of the locking members has a locking inclined surface; when the locking inclined surfaces of each of the locking members contact the locking inclined surfaces of each of the limiting members, the range of movement of each of the locking members relative to the limiting member will be limited.

Images