A mobile dual-temperature zone heating module

Abstract

The present invention provides a mobile dual-temperature zone heating module, comprising: a linear moving component; a heating component, which is arranged on the linear moving component, and includes a low-temperature heating module and a high-temperature heating module, wherein the low-temperature heating module and the high-temperature heating module are arranged side by side in the moving direction of the linear moving component; wherein the heating component can switch the heating module in contact with a fixed microfluidic chip under the drive of the linear moving component. Based on the technical solution of the present invention, the microfluidic chip can be switched between two temperature intervals, eliminating the need to wait for the temperature to rise and fall to reach the set temperature in a single temperature zone, thereby improving the test efficiency and saving the time for nucleic acid amplification; at the same time, the microfluidic chip is fixed to move the heating module, so that the sample placement area only needs to match the size of the microfluidic chip, which is conducive to the miniaturized design of the PCR instrument in structure, effectively reducing the cost and equipment weight and simplifying the equipment structure.

Description

Technical Field

[0001] The invention relates to the technical field of PCR instrument heating devices, and in particular to a mobile dual-temperature zone heating module. Background Art

[0002] The nucleic acid amplification process requires heating the microfluidic chip containing the nucleic acid amplification reagent, and the temperature needs to be adjusted as the test proceeds. There are currently two types of microfluidic PCR instruments: single-temperature zone and dual-temperature zone. Among them, the single-temperature zone PCR instrument has only one temperature platform, which meets the test requirements by changing the temperature of the temperature platform; while the current dual-temperature zone PCR instrument mainly keeps the two temperature platforms with different temperatures fixed, allowing the microfluidic chip containing the nucleic acid amplification reagent to move repeatedly between the two different temperature platforms and heat them in a close fit.

[0003] However, both of the above heating schemes have certain technical defects. For single-temperature zone PCR instruments, the temperature adjustment and change takes time, resulting in a longer nucleic acid amplification time, which is basically twice as long as the dual-temperature zone, and the test efficiency is low. For the current dual-temperature zone PCR instruments, if the microfluidic chip is to be moved, it is necessary to further expand the sample placement area to provide space for the chip to move, which is not conducive to the structural design of the PCR instrument and increases the cost; and the dual-temperature zone PCR instruments on the market are relatively heavy and not easy to carry.

[0004] Therefore, it is necessary to propose a mobile dual-temperature zone heating module to overcome the technical defects of the above heating solutions. Summary of the invention

[0005] In order to solve the problems of the above heating methods, such as affecting test efficiency, being unfavorable to instrument structure design, and having high instrument costs, the present application proposes a mobile dual-temperature zone heating module.

[0006] The present invention provides a mobile dual-temperature zone heating module, comprising:

[0007] Linear motion components;

[0008] A heating component is arranged on the linear moving component, and comprises a low-temperature heating module and a high-temperature heating module, wherein the low-temperature heating module and the high-temperature heating module are arranged side by side in the moving direction of the linear moving component;

[0009] Wherein, the heating component can switch the heating module in contact with the microfluidic chip at a fixed position under the drive of the linear moving component.

[0010] In one embodiment, the surfaces at the top of the low-temperature heating module and the high-temperature heating module are heating surfaces, and the heating surfaces can be fitted with the bottom surface of the microfluidic chip.

[0011] In one embodiment, the heating assembly further comprises an elastic supporting structure for supporting the heating module;

[0012] Wherein, the heating surface at the top of the heating module located on the elastic support structure is not lower than the bottom surface of the microfluidic chip.

[0013] In one embodiment, the two edges of the heating module in the moving direction of the linear moving component respectively have guiding slopes;

[0014] The highest point of the guiding slope smoothly transitions to the heating surface, and the height of the lowest point is lower than the height of the bottom surface of the microfluidic chip.

[0015] In one embodiment, the elastic support structure includes a plurality of pillars, each of which is sleeved with a spring, the top end of the spring fits into the bottom surface of the heating module and the height of the top end is higher than the height of the top end of the pillar.

[0016] In one embodiment, the heating assembly further includes a guide structure, which includes at least two guide posts located on opposite sides of the corresponding heating module, and the guide posts extend along the deformation direction of the elastic support structure and contact the edge of the corresponding heating module.

[0017] In one embodiment, a guide slot is provided on the guide column, and the guide slot extends along the deformation direction of the elastic support structure. The edge of the heating module has a guide sliding block fitted in the guide slot.

[0018] In one embodiment, the heating component further includes a fixing base for supporting the low-temperature heating module and the high-temperature heating module, and the fixing base is connected to the linear moving component.

[0019] In one embodiment, the linear motion component adopts a linear motor module or a stepper motor module, and the heating component is fixedly arranged on the movable part of the motor module.

[0020] In one embodiment, the heating temperatures of the low-temperature heating module and the high-temperature heating module are both adjustable.

[0021] The above technical features can be combined in various suitable ways or replaced by equivalent technical features as long as the purpose of the present invention can be achieved.

[0022] The mobile dual-temperature zone heating module provided by the present invention has at least the following beneficial effects compared with the prior art:

[0023] A mobile dual-temperature zone heating module of the present invention enables the microfluidic chip to switch between two temperature intervals, eliminating the need to wait for the single temperature zone to rise or fall to reach the set temperature, greatly improving the test efficiency and saving the time for nucleic acid amplification. At the same time, by fixing the position of the microfluidic chip and moving the heating module, the sample placement area only needs to match the size of the microfluidic chip, reducing the space area required for the sample placement area, which is conducive to the miniaturization design of the PCR instrument in structure and greatly reduces costs; it can also reduce the weight of the equipment, making it easier to carry. In addition, the modularization degree of each functional part of the dual-temperature zone heating module of the present invention is high, which reduces the overall number of components and facilitates later maintenance and disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be described in more detail below based on embodiments and with reference to the accompanying drawings, wherein:

[0025] Figure 1 An axonometric schematic diagram showing the overall structure of the heating module of the present invention;

[0026] Figure 2 An exploded view of the structure of the heating module of the present invention is shown;

[0027] Figure 3 A top view showing the overall structure of the heating module of the present invention;

[0028] In the drawings, like reference numerals are used for like parts. The drawings are not necessarily to scale.

[0029] Reference numerals:

[0030] 10-linear moving component, 20-heating component, 201-heating surface, 202-guide slider, 21-low temperature heating module, 22-high temperature heating module, 23-elastic supporting structure, 231-pillar, 232-spring, 24-guide structure, 241-guide column, 242-guide slide, 25-fixed seat, 30-microfluidic chip. DETAILED DESCRIPTION

[0031] The present invention will be further described below in conjunction with the accompanying drawings.

[0032] An embodiment of the present invention provides a mobile dual-temperature zone heating module, comprising:

[0033] Linear moving component 10;

[0034] The heating assembly 20 is arranged on the linear moving assembly 10, and includes a low temperature heating module 21 and a high temperature heating module 22, and the low temperature heating module 21 and the high temperature heating module 22 are arranged side by side in the moving direction of the linear moving assembly 10;

[0035] The heating component 20 can be driven by the linear moving component 10 to switch the heating module in contact with the microfluidic chip 30 at a fixed position.

[0036] Specifically, as shown in the attached figure Figure 1 As shown, the idea of ​​heating the microfluidic chip 30 of the present invention is: make the microfluidic chip 30 fixed and move the heating module of the dual temperature zone. In this way, the microfluidic chip 30 can be switched between the low-temperature heating module 21 and the high-temperature heating module 22 to achieve heating at different temperatures. Among them, the heating component 20 provides a heating function, and the linear moving component 10 provides a linear moving function. The temperatures of the low-temperature heating module 21 and the high-temperature heating module 22 in the heating component 20 are only relatively high and low. The two are arranged along the moving direction of the linear moving component 10. In this way, the linear moving component 10 can switch the heating module of the microfluidic chip 30 fixed in the corresponding position between the low-temperature heating module 21 and the high-temperature heating module 22 by driving the heating component 20 to move, so that the corresponding heating module contacts the microfluidic chip 30 to meet the heating requirements at the corresponding temperature.

[0037] The heating module of this embodiment is based on a dual-temperature zone heating component 20, so that the microfluidic chip 30 can switch between two temperature zones, eliminating the need to wait for temperature changes in a single temperature zone, thereby improving test efficiency. At the same time, by fixing the position of the microfluidic chip 30 and moving the heating module, the sample placement area only needs to match the size of the microfluidic chip 30, reducing the space area required for the sample placement area, which is conducive to the miniaturization of the PCR instrument in structure and greatly reduces costs.

[0038] It should be noted that the present embodiment mainly describes that the heating component 20 mainly includes two types of heating modules, namely, a low-temperature heating module 21 and a high-temperature heating module 22. As for the specific number of the low-temperature heating module 21 and the high-temperature heating module 22, it can be further designed according to the needs. For example, the low-temperature heating module 21 and the high-temperature heating module 22 can be set to multiple and correspond to each other to meet the needs and possibilities of heating multiple chips at the same time.

[0039] Preferably, the heating temperatures of the low-temperature heating module 21 and the high-temperature heating module 22 are both adjustable.

[0040] Specifically, since the microfluidic chip 30 may need to undergo a plurality of heating processes at different temperature values ​​during the test, the low-temperature heating module 21 and the high-temperature heating module 22 are both set to be temperature-adjustable, so as to meet different temperature requirements. In addition, while the microfluidic chip 30 is heated by one of the heating modules, the temperature of the other heating module can be pre-adjusted to the temperature required for the next stage of heating, and the alternating cooperation between the two heating modules can improve the test efficiency and eliminate the waiting process for temperature changes.

[0041] In one embodiment, the top surfaces of the low-temperature heating module 21 and the high-temperature heating module 22 are heating surfaces 201 , and the heating surfaces 201 can be attached to the bottom surface of the microfluidic chip 30 .

[0042] Specifically, the attached drawings Figure 1 and Figure 2 As shown, the microfluidic chip 30 is placed horizontally in a fixed position, the heating module is located below the microfluidic chip 30 as a whole, the heating membrane group for heating the microfluidic chip 30 is located directly below the microfluidic chip 30, and the heating surface 201 on the upper surface of the heating module is in contact with the bottom surface of the microfluidic chip 30 to achieve heat transfer.

[0043] In one embodiment, the heating assembly 20 further includes an elastic support structure 23 for supporting the heating module;

[0044] The heating module located on the elastic support structure 23 has a heating surface 201 on the top thereof at a height not lower than the bottom surface of the microfluidic chip 30 .

[0045] Specifically, the attached drawings Figure 2 As shown, the heating module is supported on the elastic support structure 23, and the elastic support structure 23 has the following two functions:

[0046] First, the height of the heating surface 201 at the top of the heating module is equal to the height of the bottom surface of the microfluidic chip 30, that is, theoretically the two surfaces are flush. In this case, the elastic support structure 23 is used for buffering to avoid possible collisions between the microfluidic chip 30 and the corresponding heating module when switching the heating modules.

[0047] Secondly, in case that the height of the heating surface 201 at the top of the heating module is higher than the height of the bottom surface of the microfluidic chip 30, the elastic support structure 23 is used to make the microfluidic chip 30 and the corresponding heating module fit more closely together through elastic force. Specifically, in the process of switching the corresponding heating module to the position directly below the microfluidic chip 30 by moving, since the initial height of the heating surface 201 at the top of the heating module is higher than the bottom surface of the microfluidic chip 30, the microfluidic chip 30 will gradually press the heating module downward and compress the elastic support structure 23. The elastic force of the elastic support structure 23 after compression will react on the contact surface between the heating module and the microfluidic chip 30, making the contact surfaces of the two closer to each other, improving the tightness of the contact of the contact surfaces, and ensuring the heating effect.

[0048] In one embodiment, two edges of the heating module in the moving direction of the linear moving component 10 respectively have guiding slopes;

[0049] The highest point of the guiding slope smoothly transitions to the heating surface 201 , and the height of the lowest point is lower than the height of the bottom surface of the microfluidic chip 30 .

[0050] Specifically, since the initial height of the heating surface 201 on the top of the heating module is higher than the bottom surface of the microfluidic chip 30, the microfluidic chip 30 requires a guiding structure to squeeze the corresponding heating module. Therefore, guiding slopes are set on the edges of both sides of the heating module to guide the microfluidic chip 30 to squeeze the corresponding heating module downward to avoid the two being stuck to each other.

[0051] In one embodiment, the elastic support structure 23 includes a plurality of pillars 231 , each of which is covered with a spring 232 , the top of the spring 232 fits the bottom surface of the heating module and the height of the top is higher than the height of the top of the pillar 231 .

[0052] Specifically, as shown in the attached figure Figure 2 As shown, the spring 232 in the elastic support structure 23 mainly plays the role of elastic support, and the pillar 231 is used to keep the spring 232 always deforming in the form of extension and contraction along its axis to prevent the microfluidic chip 30 from bending or other deformations when squeezing the corresponding heating module. The height of the top of the pillar 231 is lower than the height of the top of the spring 232, and the space corresponding to the height difference between the two corresponds to the space provided for the deformation of the spring 232.

[0053] Preferably, when the heating module cooperates with the microfluidic chip 30 , the bottom of the heating module contacts the top of the pillar 231 .

[0054] In one embodiment, the heating assembly 20 further includes a guide structure 24, which includes at least two guide posts 241 located on opposite sides of the corresponding heating module, and the guide posts 241 extend along the deformation direction of the elastic support structure 23 and contact the edge of the corresponding heating module.

[0055] Specifically, as shown in the attached figure Figures 1 to 3 As shown, since the spring 232 does not have a rigid structure, it is easy to produce deflections in other directions, such as bending, during the axial expansion and contraction deformation, and thus a guide structure 24 needs to be set for further guidance to ensure that the heating module moves straight up and down when the spring 232 is deformed.

[0056] In one embodiment, a guide slot 242 is provided on the guide column 241 , and the guide slot 242 extends along the deformation direction of the elastic support structure 23 . The edge of the heating module has a guide slider 202 that fits in the guide slot 242 .

[0057] Specifically, as shown in the attached figure Figure 2 As shown, the inner side of the guide column 241 has a guide groove 242, and the guide slider 202 on the edge of the heating module is matched in the guide groove 242. The function of the guide groove 242 and the guide slider 202 is to further ensure that the deformation direction of the spring 232 is along its axial direction, that is, to ensure that the heating module moves straight up and down when the spring 232 is deformed.

[0058] In one embodiment, the heating component 20 further includes a fixing base 25 for carrying the low-temperature heating module 21 and the high-temperature heating module 22 , and the fixing base 25 is connected to the linear moving component 10 .

[0059] Specifically, as shown in the attached figure Figure 2 As shown, other components in the heating assembly 20 are all arranged on a fixing seat 25 , and the fixing seat 25 is connected to the linear moving assembly 10 .

[0060] In one embodiment, the linear moving component 10 adopts a linear motor module or a stepping motor module, and the heating component 20 is fixedly disposed on the movable part of the motor module.

[0061] Specifically, as shown in the attached figure Figure 2 As shown, the linear motion assembly 10 of the present invention adopts a linear motor module, which has the advantages of smooth operation and low noise compared to other structures such as gear racks or screw sliders. Depending on the situation, a stepper motor module can also be used, which also has the same advantages.

[0062] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "bottom", "top", "front", "back", "inside", "outside", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0063] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A mobile dual-temperature zone heating module, characterized in that: include: Linear motion components; A heating component is arranged on the linear moving component, and comprises a low-temperature heating module and a high-temperature heating module, wherein the low-temperature heating module and the high-temperature heating module are arranged side by side in the moving direction of the linear moving component; The surfaces of the tops of the low-temperature heating module and the high-temperature heating module are heating surfaces, and the heating surfaces can be fitted with the bottom surface of the microfluidic chip. The heating component can switch the heating module in contact with the fixed microfluidic chip under the drive of the linear moving component. The heating assembly further comprises an elastic supporting structure for supporting the heating module, and the heating module located on the elastic supporting structure has a heating surface at the top thereof not lower than the bottom surface of the microfluidic chip; The two edges of the heating module in the moving direction of the linear moving component respectively have guiding slopes, the highest point of the guiding slopes smoothly transitions with the heating surface, and the height of the lowest point is lower than the height of the bottom surface of the microfluidic chip.

2. The mobile dual-temperature zone heating module according to claim 1, characterized in that: The elastic support structure includes a plurality of pillars, each of which is sleeved with a spring, the top end of the spring is matched with the bottom surface of the heating module and the height of the top end is higher than the height of the top end of the pillar.

3. The mobile dual-temperature zone heating module according to claim 2, characterized in that: The heating assembly further comprises a guide structure, wherein the guide structure comprises at least two guide posts located on opposite sides of the corresponding heating module, wherein the guide posts extend along the deformation direction of the elastic support structure and contact the edge of the corresponding heating module.

4. The mobile dual-temperature zone heating module according to claim 3, characterized in that: The guide column is provided with a guide slot, and the guide slot extends along the deformation direction of the elastic support structure. The edge of the heating module has a guide sliding block matched in the guide slot.

5. The mobile dual-temperature zone heating module according to claim 1, characterized in that: The heating component also includes a fixing seat for carrying the low-temperature heating module and the high-temperature heating module, and the fixing seat is connected to the linear moving component.

6. The mobile dual-temperature zone heating module according to claim 1 or 5, characterized in that: The linear moving component adopts a linear motor module or a stepping motor module, and the heating component is fixedly arranged on the movable part of the motor module.

7. The mobile dual-temperature zone heating module according to claim 1, characterized in that: The heating temperatures of the low-temperature heating module and the high-temperature heating module are both adjustable.

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