A UV dissolving machine

Abstract

The invention discloses a UV disintegrator, which relates to the technical field of disintegrators, comprising an external shell and support assemblies and roller assemblies arranged at the four corners of the bottom of the external shell, the external shell comprising a wafer placement box located on the upper left side, a basket main box for placing a wafer basket located on the upper right side, a wafer secondary box for lifting the wafer basket located on the lower right side, and a disintegration box for disintegrating wafers located on the lower left side, the wafer placement box, the basket main box, the wafer secondary box and the disintegration box are connected in sequence, a wafer box for placing wafers is arranged in the wafer placement box, a wafer basket, a mounting frame, an adjustment frame arranged on the mounting frame and capable of adjusting the distance between the wafer baskets, and a mechanical gripper assembly arranged on the mounting frame and capable of moving horizontally along the mounting frame to pick up wafers in the wafer box are arranged in the basket main box; the invention has a reasonable design and has the advantages of high integration, good disintegration effect and high working efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of glue dissolving machines, and more particularly to the technical field of UV glue dissolving machines. Background Art

[0002] In the semiconductor chip production process, wafers are secured to a frame with a dicing tape before the chips are diced. After the dicing process is complete, the tape is irradiated with UV light to cure and harden the adhesive, reducing its viscosity and facilitating smoother packaging. UV exposure weakens the adhesive strength, making it easier for the wafer or chip to peel off the tape after exposure.

[0003] The UV degumming machine solves the degumming process of wafer, glass and ceramic cutting technology. The applicable industry is not only limited to the semiconductor packaging industry, but also suitable for degumming UV films of semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, integrated circuit boards, and mobile hard drives.

[0004] The UV degumming machine in the prior art has the disadvantages of low working efficiency, uneven degumming effect and poor heat dissipation. How to solve the above technical problems has become the direction of efforts of those skilled in the art. Summary of the Invention

[0005] The purpose of the present invention is to provide a UV disintegrator to solve the above technical problems.

[0006] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0007] A UV degumming machine comprises an external shell and support assemblies and roller assemblies arranged at the four corners of the bottom of the external shell, the external shell comprises a wafer placement box located on the upper left side, a basket main box for placing a wafer basket located on the upper right side, a wafer secondary box for lifting and lowering the wafer basket located on the lower right side, and a degumming box for degumming wafers located on the lower left side, the wafer placement box, the basket main box, the wafer secondary box and the degumming box are connected in sequence, a wafer box for placing wafers is arranged in the wafer placement box, a wafer basket, a mounting frame, an adjustment frame arranged on the mounting frame and capable of adjusting the distance of the wafer basket, and a mechanical gripper assembly arranged on the mounting frame and capable of moving horizontally along the mounting frame to pick up wafers in the wafer box are arranged in the basket main box.

[0008] Furthermore, a linear lifting mechanism is provided in the wafer sub-box, the top of the linear lifting mechanism is connected to the bottom of the adjustment frame, and the linear lifting mechanism is a lifting cylinder.

[0009] Furthermore, a partition is provided in the dissolution box, a disc-shaped quartz glass is inlaid in the middle of the partition, a wafer basket A is provided on both sides of the quartz glass, a pair of adjustment mechanisms A for adjusting the distance between the wafer baskets A are provided on the partition, and a UV lamp tube assembly for aligning the quartz glass is provided below the partition.

[0010] Furthermore, the adjustment frame mechanism and the adjustment mechanism A are both adjustment cylinders.

[0011] Furthermore, a nitrogen nozzle is provided at the top of the dissolution box, and an exhaust fan for causing nitrogen to form convection is provided at the bottom of the dissolution box.

[0012] Furthermore, a cooling fan is provided in the dissolution box.

[0013] Furthermore, the wafer box is a U-shaped folding plate with an opening facing downward, the width of the U-shaped folding plate is adapted to the width of the wafer basket, an opening is provided on the wafer placement box, a sealing cover is hingedly provided at the opening, and a transparent observation window and a handle are provided on the sealing cover.

[0014] Furthermore, a control panel is provided on the left side of the basket main box, and a plurality of control buttons are provided on the control panel.

[0015] Furthermore, a vertical guide plate is provided on the right side wall inside the main box of the basket, and two parallel guide rails are provided on the vertical guide plate. A vertical plate is provided on the right end of the mounting frame, and two slots are provided on the vertical plate for engaging with the two guide rails.

[0016] The beneficial effects of the present invention are as follows:

[0017] 1. The present invention has a reasonable design. When working, the wafer to be debonded is placed in the wafer box of the wafer placement box, and the mechanical gripper assembly on the mounting frame is moved to the wafer box to grab the wafer and place it on the wafer basket on the wafer placement box. The mounting frame is lowered to the wafer sub-box below by the linear lifting mechanism, and the wafer is sent into the debonding box by the mechanical gripper assembly, and the debonding treatment is carried out by the UV lamp assembly. The wafer is transported by the same mechanical gripper assembly, which can reduce the structure of the debonding machine and make the debonding machine occupy a small area. This structure can save loading and unloading time, improve work efficiency, and have a stable debonding effect.

[0018] 2. A nitrogen nozzle is installed on the top of the disassembly box, and an exhaust fan is installed at the bottom of the disassembly box, so that the nitrogen in the disassembly box forms an upward and downward convection, thereby enhancing the disassembly effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention;

[0020] Figure 2 yes Figure 1 Schematic diagram of the structure without the outer shell;

[0021] Figure 3 yes Figure 2 Front view of

[0022] Figure 4 It is a structural diagram of the disintegration box;

[0023] Figure markings: 1-wafer secondary box, 1-1-linear lifting mechanism, 2-basket main box, 2-1-adjustment frame, 2-2-wafer basket, 2-3-mechanical gripper assembly, 2-4-guide rail, 2-5-mounting frame, 2-6-vertical guide plate, 3-control panel, 4-wafer placement box, 5-degumming box, 5-1-partition, 5-2-wafer basket A, 5-3-quartz glass, 5-4-nitrogen nozzle, 5-5-adjustment mechanism A, 5-6-UV lamp tube assembly, 5-7-exhaust fan, 6-support assembly, 7-roller assembly. DETAILED DESCRIPTION

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0026] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0027] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0028] Example 1

[0029] like Figures 1 to 4 As shown, this embodiment provides a UV degumming machine, including an external shell and a support assembly 6 and a roller assembly 7 arranged at the four corners of the bottom of the external shell, the external shell includes a wafer placement box 4 located on the upper left side, a basket main box 2 for placing a wafer basket located on the upper right side, a wafer secondary box 1 for lifting and lowering the wafer basket located on the lower right side, and a degumming box 5 for wafer degumming located on the lower left side, the wafer placement box 4, the basket main box 2, the wafer secondary box 1 and the degumming box 5 are connected in sequence, the wafer placement box 4 is provided with a wafer box 4-3 for placing wafers, the basket main box 2 is provided with a wafer basket 2-2, a mounting frame 2-5, an adjustment frame 2-1 arranged on the mounting frame 2-5 and capable of adjusting the distance of the wafer basket 2-2, and a mechanical gripper assembly 2-3 arranged on the mounting frame 2-5 and capable of moving horizontally along the mounting frame 2-5 to pick up wafers in the wafer box 4-3.

[0030] A linear lifting mechanism 1 - 1 is provided in the wafer sub-box 1 , the top of the linear lifting mechanism 1 - 1 is connected to the bottom of the adjustment frame 2 - 1 , and the linear lifting mechanism 1 - 1 is a lifting cylinder.

[0031] A partition 5-1 is provided in the degumming box 5, and a disc-shaped quartz glass 5-3 is inlaid in the middle of the partition 5-1. Wafer baskets A5-2 are also provided on the partition 5-1 and located on both sides of the quartz glass 5-3. A pair of adjustment mechanisms A5-5 for adjusting the distance between the wafer baskets A5-2 are also provided on the partition 5-1. A UV lamp tube assembly 5-6 for aligning with the quartz glass 5-3 is provided below the partition 5-1.

[0032] The adjustment frame mechanism 2-1 and the adjustment mechanism A5-5 are both adjustment cylinders.

[0033] In this embodiment, during operation, the wafer to be debonded is placed in the wafer box of the wafer placement box, and the mechanical gripper assembly on the mounting frame is moved to the wafer box to grab the wafer and placed on the wafer basket on the wafer placement box. The mounting frame is lowered to the wafer sub-box below by the linear lifting mechanism, and the wafer is sent into the debonding box by the mechanical gripper assembly, and debonding treatment is carried out by the UV lamp assembly. The wafer is transported by the same mechanical gripper assembly, which can reduce the structure of the debonding machine and make the debonding machine occupy a small area. This structure can save loading and unloading time, improve work efficiency, and the debonding effect is stable.

[0034] Example 2

[0035] This embodiment is a further optimization based on the embodiment 1, specifically:

[0036] A nitrogen nozzle 5-4 is provided at the top of the disintegration box 5, and an exhaust fan 5-7 for forming nitrogen convection is provided at the bottom of the disintegration box 5.

[0037] A cooling fan is provided in the dissolution box 5 .

[0038] The wafer box 4-3 is a U-shaped folding plate with an opening facing downward. The width of the U-shaped folding plate is adapted to the width of the wafer basket 2-2. An opening is provided on the wafer placement box 4, and a sealing cover 4-1 is hingedly provided at the opening. The sealing cover 4-1 is provided with a transparent observation window 4-2 and a handle.

[0039] A control panel 3 is provided on the left side of the basket main box 2, and a plurality of control buttons are provided on the control panel 3.

[0040] The right side wall of the main box 2 is provided with a vertical guide plate 2-6, on which two parallel guide rails 2-7 are provided. The right end of the mounting frame 2-5 is provided with a vertical plate, on which two slots are provided for engaging with the two guide rails 2-7. This structural design increases the stability of the lifting.

Claims

1. A UV dissolving machine, comprising an outer shell and support assemblies (6) and roller assemblies (7) arranged at the four corners of the bottom of the outer shell, characterized in that: The outer shell comprises a wafer placement box (4) located on the upper left side, a basket main box (2) for placing a wafer basket located on the upper right side, a wafer secondary box (1) for lifting the wafer basket located on the lower right side, and a debonding box (5) for debonding the wafer located on the lower left side. The wafer placement box (4), the basket main box (2), the wafer secondary box (1) and the debonding box (5) are sequentially connected. A wafer box (4-3) for placing wafers is provided in the wafer placement box (4). A wafer basket (2-2), a mounting frame (2-5), an adjustment frame (2-1) provided on the mounting frame (2-5) and capable of adjusting the distance of the wafer basket (2-2) placed therein, and a mechanical gripper assembly (2-3) provided on the mounting frame (2-5) and capable of moving horizontally along the mounting frame (2-5) to the wafer box (4-3) to pick up wafers are provided in the basket main box (2). A linear lifting mechanism (1-1) is provided in the wafer sub-box (1), the top of the linear lifting mechanism (1-1) is connected to the bottom of the adjustment frame (2-1), and the linear lifting mechanism (1-1) is a lifting cylinder; A partition (5-1) is provided in the dissolution box (5), a disc-shaped quartz glass (5-3) is inlaid in the middle of the partition (5-1), a wafer basket A (5-2) located on both sides of the quartz glass (5-3) is provided on the partition (5-1), a pair of adjustment mechanisms A (5-5) for adjusting the spacing between the wafer baskets A (5-2) are provided on the partition (5-1), and a UV lamp assembly (5-6) for aligning the quartz glass (5-3) is provided below the partition (5-1).

2. A UV dissolving machine according to claim 1, characterized in that, The adjustment frame (2-1) and the adjustment mechanism A (5-5) are both adjustment cylinders.

3. A UV dissolving machine according to claim 1, characterized in that, A nitrogen nozzle (5-4) is provided at the top of the disintegration box (5), and an exhaust fan (5-7) for causing nitrogen to form convection is provided at the bottom of the disintegration box (5).

4. A UV dissolving machine according to claim 1, characterized in that, A cooling fan is provided in the degumming box (5).

5. A UV dissolving machine according to claim 1, characterized in that, The wafer box (4-3) is a U-shaped folding plate with an opening facing downward, the width of the U-shaped folding plate is adapted to the width of the wafer basket (2-2), the wafer placement box (4) is provided with an opening, a sealing cover (4-1) is hingedly provided at the opening, and a transparent observation window (4-2) and a handle are provided on the sealing cover (4-1).

6. A UV dissolving machine according to claim 1, characterized in that, A control panel (3) is provided on the left side of the basket main box (2), and a plurality of control buttons are provided on the control panel (3).

7. A UV dissolving machine according to claim 1, characterized in that: A vertical guide plate (2-6) is provided on the right side wall of the interior of the basket main box (2), two mutually parallel guide rails (2-7) are provided on the vertical guide plate (2-6), and a vertical plate is provided on the right end of the mounting frame (2-5), two slots for engaging with the two guide rails (2-7) are provided on the vertical plate.

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