Method and device for controlling chip

Abstract

The present application discloses a method and device for controlling a chip, the method comprising: reading a first process parameter from a chip, the first process parameter being used to indicate the process of the chip; determining a first driving strength of a pad driver of the chip according to the first process parameter; configuring the driving strength of the pad driver to the first driving strength, so that the output impedance of the pad driver matches the routing impedance of a circuit board carrying the chip. The present application can determine the driving strength of a pad driver of a chip according to the chip process, so that the output impedance of the pad driver matches the routing impedance of a circuit board carrying the chip, thereby avoiding the problem of impedance mismatch caused by chip process fluctuations.

Description

Technical Field

[0001] The present application relates to the field of chips, and in particular to a method and device for controlling a chip. Background Art

[0002] When designing a chip, the output impedance of the pad driver should match the trace impedance of the circuit board that carries the chip to meet the signal integrity requirements. However, the chip process has fluctuations, which will affect the output impedance of the pad driver, resulting in an impedance mismatch between the output impedance of the pad driver and the trace impedance of the circuit board. Summary of the invention

[0003] In view of this, the present application provides a method and device for controlling a chip to solve the impedance mismatch problem caused by chip process fluctuations.

[0004] A first aspect provides a method for controlling a chip, the method comprising reading a first process parameter from a chip, the first process parameter being used to indicate a process of the chip; determining a first driving strength of a pad driver of the chip according to the first process parameter; and configuring the driving strength of the pad driver to be the first driving strength so that an output impedance of the pad driver matches a routing impedance of a circuit board carrying the chip.

[0005] Optionally, determining the first driving strength of the pad driver of the chip according to the first process parameter includes: determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver, wherein the second driving strength is determined based on the routing impedance of the circuit board.

[0006] Optionally, determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver includes: determining the first driving strength by querying pre-stored mapping relationship information according to the first process parameter and the second driving strength of the pad driver, wherein the mapping relationship information includes a mapping relationship between the first process parameter, the first driving strength and the second driving strength.

[0007] Optionally, configuring the driving strength of the pad driver to be the first driving strength includes: programming the value of the first driving strength into a register of the port control circuit of the chip.

[0008] Optionally, the first process parameter is read from a fuse module of the chip.

[0009] Optionally, the first process parameter indicates a process corner of the first chip.

[0010] Optionally, the chip is a baseband chip.

[0011] A second aspect provides a device for controlling a chip, the device comprising: a memory for storing instructions;

[0012] A processor is used to execute the instructions to perform the following operations: read a first process parameter from a chip, wherein the first process parameter is used to indicate the process of the chip; determine a first driving strength of a pad driver of the chip according to the first process parameter; and configure the driving strength of the pad driver to be the first driving strength so that the output impedance of the pad driver matches the routing impedance of a circuit board carrying the chip.

[0013] Optionally, determining the first driving strength of the pad driver of the chip according to the first process parameter includes: determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver, wherein the second driving strength is determined based on the routing impedance of the circuit board.

[0014] Optionally, determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver includes: determining the first driving strength by querying pre-stored mapping relationship information according to the first process parameter and the second driving strength of the pad driver, wherein the mapping relationship information includes a mapping relationship between the first process parameter, the first driving strength and the second driving strength.

[0015] Optionally, configuring the driving strength of the pad driver to be the first driving strength includes: programming the value of the first driving strength into a register of the port control circuit of the chip.

[0016] Optionally, the first process parameter is read from a fuse module of the chip.

[0017] Optionally, the first process parameter indicates a process corner of the first chip.

[0018] Optionally, the chip is a baseband chip.

[0019] According to a third aspect, a computer-readable storage medium is provided, on which an executable code is stored. When the executable code is executed, the method described in the first aspect can be implemented.

[0020] According to a fourth aspect, a computer program product is provided, comprising an executable code, which, when executed, can implement the method described in the first aspect.

[0021] The technical solution provided in the embodiment of the present application can determine the driving strength of the chip's pad driver according to the chip process, so that the output impedance of the pad driver matches the routing impedance of the circuit board carrying the chip, so as to avoid impedance mismatch caused by chip process fluctuations and affect the performance of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of a chip I / O circuit provided in an embodiment of the present application.

[0023] Figure 2 A flowchart of a method for controlling a chip provided in an embodiment of the present application.

[0024] Figure 3 It is a schematic diagram of a method for controlling a chip provided in an embodiment of the present application.

[0025] Figure 4 It is a flow chart of another method for controlling a chip provided in an embodiment of the present application.

[0026] Figure 5 It is a schematic diagram of another method for controlling a chip provided in an embodiment of the present application.

[0027] Figure 6 It is a structural schematic diagram of a device for controlling a chip provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] An integrated circuit (IC) can be a microelectronic device or component. It can be made on a dielectric substrate by using a certain process to interconnect the components and wiring required in the circuit, such as transistors, diodes, resistors, capacitors, inductors, etc., and then packaged in a tube shell to form a microstructure with the required circuit function. With the improvement of IC design level and industrial manufacturing process capability, system on chip (SOC) has become the mainstream of IC design. SOC can be a special IC that integrates all functional modules of the system on a single semiconductor chip. The functional modules can include, for example, a CPU processor, a channel encoder, a digital signal processor, a modem, and an interface module. The baseband chip can be a highly integrated system on chip.

[0030] The interface module of the chip may include an interface circuit, and the interface circuit may include a chip input / output (I / O) circuit. Figure 1 This chapter introduces the I / O circuits of the chip and the special terms in the I / O circuits. Figure 1 The left side is the schematic diagram of the chip I / O circuit. It can be seen that the chip I / O circuit can include a pad driver, an output resistor, and an I / O pad. The pad driver, the output resistor, and the pad can be connected in series to form an I / O circuit. The I / O pad (I / OPAD) can be a general-purpose I / O port (GPIO).

[0031] In some embodiments, the I / O circuit may further include a port control logic (PCL), which may perform logical control on the chip I / O PAD. The PCL may map different hardware functions on the I / O PAD. For example, the PCL may allocate various situations in which the same PAD is used by different interface modules, and program the configuration data into the PCL register to implement the PCL's logical control of the chip I / O PAD. In some embodiments, the PCL may further define some additional electrical properties, such as pull-up / pull-down. In other embodiments, the PCL may further control the physical state of the I / O PAD, so that the I / OPAD is in one of activation, deactivation, and sleep.

[0032] Figure 1 The middle shows the routing of the printed circuit board (PCB) carrying the chip. In some embodiments, the chip I / O PAD can be connected to the pins of the chip through wires, and the pins of the chip can be soldered on the PCB carrying the chip to realize the transmission of chip signals. Figure 1 On the right is a schematic diagram of the chip I / O interface. That is, the chip can realize signal transmission with the interface through the chip I / O and PCB. The chip I / O interface can be a receiver of the chip I / O output signal. For example, the chip I / O interface can be a system power management interface (SPMI). In some embodiments, the type of chip I / O PAD can be defined according to the type of chip I / O interface. For example, an I / O PAD connected to SPMI can be called SPMI PAD.

[0033] The output impedance of the pad driver may be a resistance value measured at the output of the driver. In some embodiments, the output impedance of the pad driver may be an output impedance of a pad connected to the pad driver. The pad driver may be a PCL driver, so that the PCL controls the output impedance of the pad through the PCL driver.

[0034] The driving capability of a chip can be understood as the ability of the chip to drive a load. In the chip I / O circuit, the driving strength of the pad driver is linearly related to the output impedance of the pad driver. In some cases, the smaller the output impedance of the pad driver, the larger the output current of the chip I / O circuit, and the stronger the pad driver. In other cases, the larger the output impedance of the pad driver, the larger the output voltage of the chip I / O circuit, and the stronger the pad driver.

[0035] During the chip design phase, it is necessary to design a suitable driving strength for the I / O pad driver so that under this driving strength, the output impedance of the pad driver matches the impedance of the PCB trace, meeting the signal performance requirements and avoiding problems such as signal reflection and signal distortion caused by impedance mismatch. The signal performance, for example, can be signal integrity (SI).

[0036] The designed chip can be produced by a chip manufacturing plant. The chip production process may include wafer production, chip packaging and chip testing.

[0037] When the chip is manufactured in the factory, it is affected by the processing technology, processing environment, material characteristics, etc., resulting in some deviations in the performance of the chip. The process parameters of the chip can be used to indicate the process of the chip. The process parameters can be, for example, the resistance of the chip, the voltage of the chip, the current of the chip, and the process parameters during the processing, such as the manufacturing temperature. The process of the chip can include the process angle of the chip. The process angle of the chip can be, for example, a 3-process angle model, or, for example, a 5-process angle model. It should be understood that the present application does not limit the number of process angles of the process angle model. In the 3-process angle model, the chip can be divided into three types: TT, SS, and FF. The TT angle chip can be used to indicate the typical process angle of the N-type field effect transistor and the typical process angle of the P-type field effect transistor; the SS angle chip can be used to indicate the slow process angle of the N-type field effect transistor and the P-type field effect transistor; the FF angle chip can be used to indicate the fast process angle of the N-type field effect transistor and the P-type field effect transistor. In some embodiments, the carrier mobility in the transistors in the chips with different process angles is different. For example, the carrier migration speed in the transistors in the FF chip is faster.

[0038] Before the chip leaves the factory, the parameters of the chip can be measured by testing methods, and the test data can be written into the memory of the chip. The test data can be used to indicate different chip processes. As an example, the chip is tested at an automatic test engineer (ATE) in a chip manufacturing plant. The test parameters can be, for example, the voltage value of the chip working circuit, the frequency value of the chip working circuit, or the resistance value of the chip. The test value is processed to obtain a numerical deviation between the test value and the reference value, and different chip processes are indicated according to the numerical deviation. The reference value can be a design standard value or an average value of the test data.

[0039] As an example, the resistance of the test chip is tested in the factory to obtain the deviation between the chip resistance and the design value, and different chip processes can be determined based on the resistance deviation. The chip whose test resistance is consistent with the design resistance can be a normal chip, and the normal chip can be a TT process corner chip; the chip whose test value is biased towards the upper limit can be a SS process corner chip; the chip whose test value is biased towards the lower limit can be a FF process corner chip. The test data can be stored in the fuse module (ICfuse) of the chip, and the required test data can be obtained by reading data from the chip fuse module. In some embodiments, the IC fuse also stores other related data such as chip ID, production date, and process parameters.

[0040] As mentioned earlier, the driving strength of the chip pad driver is linearly related to the output impedance of the driver. Based on the same output impedance, the driving strengths of chips with different driving capabilities are inconsistent. For example, when the output impedance of the chip pad is 36.5, if a TT corner process chip is used, the driving strength of the pad driver of the chip can be designed to be 5. If an FF corner process chip is used, the driving capability of the FF corner process chip is strong, so the driving strength needs to be re-matched for FF. For example, the driving strength of the FF corner process chip is configured to be 3. At this driving strength, the driving strength of the FF corner process chip matches the output impedance value of 36.5.

[0041] The existing chip design technology matches the chip pad driver with a suitable driving strength according to the output impedance of the chip I / O circuit, so that under this driving strength, the output impedance of the chip pad driver matches the PCB trace impedance. However, the existing technology does not consider the changes in chip driving strength caused by chip process fluctuations during the design stage, and cannot adjust the driving strength of the chip pad driver according to the chip process. There is a problem that the process fluctuation causes impedance mismatch, which affects the performance of the chip signal.

[0042] As an example, during the chip design phase, a design value is set for the driving strength of the I / O PAD driver. Under this driving strength design value, the output impedance of the pad driver matches the PCB trace impedance, so the signal performance can be ensured. If the chip actually used is affected by the process, the driving capability of the pad driver is weak. Under the same driving strength design value, the actual output impedance is greater than the output impedance design value, and the output circuit is too small, resulting in incomplete signals; if the chip actually used is affected by the process and has a strong driving capability, under the same driving strength design value, the driving capability is too strong, the actual output impedance is less than the output impedance design value, and the output current is too large, resulting in increased power consumption and signal degradation.

[0043] To this end, the present application proposes a method and device for controlling a chip, which identifies the chip process and determines the driving strength of the pad driver based on the chip process, so that the output impedance of the pad driver matches the PCB trace impedance, so as to avoid impedance mismatch caused by chip process fluctuations and affect the performance of the chip.

[0044] Figure 3 This is an example flow chart of a method for controlling a chip provided in an embodiment of the present application. The method can be executed by a processor module, which can be, for example, a central processing unit (CPU). The processor module can be a processor inside the chip or a processor outside the chip, and the chip can be the baseband chip mentioned above.

[0045] In step S210 , a first process parameter is read, where the first process parameter is used to indicate the process of the chip.

[0046] The first process parameter may be any process parameter of the chip, and the first process parameter may be used to indicate the process of the chip. The first process parameter may be read from the chip, for example, the first process parameter may be obtained from chip parameter data stored in the chip, the parameter data may be pre-stored in the memory of the chip, and in some embodiments, the first process parameter may be read from a fuse module in the chip.

[0047] The first process parameter may be, for example, a voltage of a chip circuit, or a current of a chip circuit, or a chip resistance. It should be understood that the present application does not limit the type of the first process parameter.

[0048] In step S220 , a first driving strength of a pad driver of the chip is determined according to the first process parameter.

[0049] In some embodiments, the chip process can be determined according to the first process parameter, and the driving strength of the chip pad driver can be determined, and the matching design of the PCB trace impedance can be performed based on this. The pad driver driving strength can be designed according to the comparison relationship between the pad driving strength and the output impedance, and the comparison relationship can be shown in Table 1, for example.

[0050]

[0051] As can be seen from Table 1, the driving strength of the pad driver can be divided into 8 levels according to the resistance value of the SPMI PAD output impedance, and each level of driving strength can correspond to the resistance value range of the PAD output impedance.

[0052] As a possible implementation method, the chip pad output impedance is 55.0, and the chip process can be determined according to the first process parameter. If the chip process parameter indicates that the chip is a TT corner process chip, the driving strength of the chip pad driver can be designed to be 2; if the chip process parameter indicates that the chip is a FF corner process chip, the driving capability of the FF corner chip is stronger, and the driving strength of the FF corner chip can be designed to be 1; if the chip process parameter indicates that the chip is a TT corner process chip, the driving capability of the TT corner process chip is relatively weak, and the driving strength of the TT corner process chip can be designed to be 3.

[0053] In step S230, the driving strength of the pad driver is configured to be a first driving strength, so that the output impedance of the pad driver matches the trace impedance of the circuit board carrying the chip.

[0054] In some embodiments, a configuration instruction may be sent by a processor to configure the driver driving strength of the pad, and the processor may be, for example, a CPU in a chip, or a processing module outside the chip. The processor may configure the driving strength of the pad driver by configuring the pad driver bits, for example, the driving strength of the pad driver may be configured from 100 to 011.

[0055] In some embodiments, the processor may program the value of the first driving strength of the pad driver into a register of the port control circuit of the chip, for example, the first driving strength may be programmed into a PCL register, so that the processor can quickly read the first driving strength and configure the driving strength.

[0056] It can be seen that the method for controlling the chip provided in the embodiment of the present application can identify the chip process and adjust the driving strength of the pad driver according to the chip process, so that the output impedance of the pad driver matches the PCB trace impedance, so as to avoid the influence of chip process fluctuations on the chip transmission signal.

[0057] In some embodiments, the first driving strength of the pad driver of the chip can be determined according to the PCB trace impedance and the first process parameter. In this way, the driving strength of the chip can be matched according to the preset PCB trace impedance, and the chip can be adapted to different PCB hardware design schemes to avoid changes in PCB design and speed up the design process of the chip. The following continues to be illustrated in conjunction with Table 1. As an example, in order to match the PCB trace impedance of 36Ohm, if the first process parameter of the chip indicates that the chip is a TT angle chip, the driving strength of the chip pad can be designed to be 5, and the output impedance of the pad driver is 36.5 at this driving strength, and the output impedance of the pad driver is a value that matches the PCB trace impedance. If the first process parameter of the chip indicates that the chip is an FF angle chip, the driving strength of the chip pad can be designed to be 3, and the output impedance of the pad driver is 35.4 at this driving strength, and the output impedance of the pad driver is a value that matches the PCB trace impedance. It should be understood that the pad output impedance matches the PCB trace impedance, which can be completely equal to the resistance value, or it can be unequal to the resistance value within a certain difference range.

[0058] As a simple implementation method, when determining the first driving strength of the chip pad according to the chip process parameters, the first driving strength of the chip pad can be determined according to the chip process parameters and the second driving strength of the chip pad, wherein the second driving strength of the pad is determined according to the PCB trace impedance. In other words, in the hardware design stage, the second driving strength of the pad driver can be determined according to the PCB trace impedance, and then the first driving strength of the pad driver can be determined according to the chip process and the second driving strength of the chip pad. Under the first driving strength, the output impedance of the pad driver and the PCB trace impedance are matched. In some embodiments, the first driving strength of the pad driver can be queried by querying the pre-stored mapping information of the relationship between the first chip process parameters, the first driving strength and the second driving strength. The mapping information can be, for example, a relationship mapping table, such as the relationship mapping table shown in Table 2.

[0059]

[0060] The relationship mapping table shown in Table 2 may include a chip process parameter table and a chip pad drive strength conversion table, wherein the drive strength conversion table includes the target driver number and the second drive strength of the target driver. The chip pad drive strength conversion table provides four target drivers with different second drive strengths. This is because, for the same type of PAD, the hardware design on the PCB board is different, and the drive strength required by the PAD is different. For example, when the same interface is close to the chip, the required chip drive strength is low, and when the same interface is far from the chip, the required chip drive strength is high.

[0061] The following is a method for controlling a chip provided by an embodiment of the present application in conjunction with Table 2. As an example, the resistance parameter of the chip is read as 1600 from the fuse module of the chip, and the identification of the chip process parameter is determined to be 7 according to the process parameter table in Table 2. The second drive strength 011 is read from the drive strength conversion table in Table 2, that is, the second drive strength of the target driver No. 2 is read, and then the first drive strength is read as 010 according to the chip process parameter identification 7 and the second drive strength 011 in the drive strength conversion table. Then, the drive strength of the target driver No. 2 is configured from 011 to 010.

[0062] Figure 3 A schematic diagram of a method for controlling a chip provided in an embodiment of the present application, Figure 4 A schematic flow chart of a method for controlling a chip provided in an embodiment of the present application is shown below in conjunction with Figure 3 and Figure 4 The method for controlling a chip provided in an embodiment of the present application is introduced.

[0063] In step S410 , a second driving strength of the pad driver is determined.

[0064] The second driving strength may be a target driving strength determined according to the impedance of the PCB trace, and the target driving strength may be determined according to the physical characteristics of the PCB trace through hardware testing, hardware simulation, and PCB parameter feature extraction. The physical characteristics of the PCB trace may include the type of interface connected to the chip pad and the wiring method on the PCB board.

[0065] In step S420, the process parameters of the chip are read.

[0066] The chip's process parameters can be read from the fuses inside the chip.

[0067] In step S430, the first driving strength is determined in the pad driving strength conversion table according to the second driving strength of the pad driver and the chip process parameters.

[0068] The pad drive strength conversion table may be, for example, a relationship mapping table as shown in Table 2. In the relationship mapping table as shown in Table 2, the actual drive strength of the chip pad driver is determined according to the process parameters of the chip and the target drive strength of the pad driver.

[0069] In some embodiments, before executing this step, the target drive strength can also be obtained from the hardware configuration information of the chip. The hardware configuration information can be, for example, a pad allocation table (PAT), or a hardware ID (Hardware ID, HWID), or can be read from a non-volatile memory (None VolatileMemory, NVM) to obtain the target drive strength of the pad driver, or can be read from a chip fuse to obtain the target drive strength of the pad driver. This application does not limit the method of reading the second drive strength of the pad, and in actual application, a suitable reading method can be selected as needed.

[0070] In step S440 , the driving strength of the pad driver is configured to be a first driving strength.

[0071] Figure 5 A schematic diagram of another method for controlling a chip provided in an embodiment of the present application, such as Figure 5 As shown, during the initialization of the chip pad driver, the pad driver can be a driver such as a PCL driver. The driver can read the default driving strength of the pad driver from the PAT table of the response operation mode. In the CR1 PCB compensation part, the target driving strength can be obtained from the PCB HWID and the HWID table, that is, the target driving strength is determined according to the PCB hardware characteristics. In the CR2 chip process compensation part, the system control unit (System control unit, SCU) can read the chip process parameters from the chip fuse, and determine the final driving strength of the pad driver according to the chip process parameters and the target driving strength in the pad drive strength conversion table.

[0072] It can be seen that the method for controlling a chip provided in the embodiment of the present application can detect the process of the chip, can obtain the chip parameters from the chip fuse, indicate the process of the chip through different chip parameters, and adjust the driving strength of the pad driver according to the process of the chip, so that the output impedance of the chip matches the impedance of the PCB trace. Good impedance matching can save chip reliability and power consumption, and at the same time, maximize the yield rate of the chip manufacturing plant chip, as many corner chips as possible can be configured as useful chips, saving huge costs.

[0073] Combination of the above Figures 1 to 5 , describes the method embodiment of the present application in detail, and the following is combined with Figure 6 , describes the device embodiment of the present application in detail. It should be understood that the description of the method embodiment corresponds to the description of the device embodiment, so the parts not described in detail can refer to the previous method embodiment.

[0074] Figure 6 It is a schematic structural diagram of a control chip device provided in one embodiment of the present application. Figure 6 The control device 600 shown may include a memory 610 and a processor 620, wherein the memory 610 can be used to store instructions, and the processor 620 can be used to execute the instructions to perform the following operations: reading a first process parameter from a chip, wherein the first process parameter is used to indicate the process of the chip; determining a first driving strength of a pad driver of the chip based on the first process parameter; configuring the driving strength of the pad driver to the first driving strength so that the output impedance of the pad driver matches the routing impedance of the circuit board carrying the chip.

[0075] Optionally, determining the first driving strength of the pad driver of the chip according to the first process parameter includes: determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver, wherein the second driving strength is determined based on the routing impedance of the circuit board.

[0076] Optionally, determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver includes: querying pre-stored mapping relationship information according to the first process parameter and the second driving strength of the pad driver to determine the first driving strength, wherein the mapping relationship information includes a mapping relationship between the first process parameter, the first driving strength and the second driving strength.

[0077] Optionally, configuring the driving strength of the pad driver to be the first driving strength includes: programming a value of the first driving strength into a register of a port control circuit of the chip.

[0078] Optionally, the first process parameter is read from a fuse module of the chip.

[0079] Optionally, the first process parameter indicates a process corner of the first chip.

[0080] Optionally, the chip is a baseband chip.

[0081] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions can be transmitted from a website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (Digital Subscriber Line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server, data center, etc. that contains one or more available media integrated. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a digital video disc (DVD)), or a semiconductor medium (eg, a solid state disk (SSD)).

[0082] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments of the present application can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0083] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for controlling a chip, characterized in that: The method comprises: Reading a first process parameter from a chip, where the first process parameter is used to indicate a process of the chip; Determining a first driving strength of a pad driver of the chip according to the first process parameter; Configuring the driving strength of the pad driver to be the first driving strength so that the output impedance of the pad driver matches the routing impedance of the circuit board carrying the chip; The step of determining a first driving strength of a pad driver of the chip according to the first process parameter includes: Determining a first driving strength of the pad driver according to the first process parameter and a second driving strength of the pad driver, wherein the second driving strength is determined based on a trace impedance of the circuit board; The determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver includes: According to the first process parameter and the second driving strength of the pad driver, the first driving strength is determined by querying pre-stored mapping relationship information, wherein the mapping relationship information includes a mapping relationship among the first process parameter, the first driving strength and the second driving strength.

2. The method according to claim 1, characterized in that: The step of configuring the driving strength of the pad driver to be the first driving strength includes: The value of the first driving strength is programmed into a register of a port control circuit of the chip.

3. The method according to claim 1, characterized in that The first process parameter is read from a fuse module of the chip.

4. The method according to claim 1, characterized in that: The first process parameter indicates a process corner of the chip.

5. The method according to claim 1, characterized in that The chip is a baseband chip.

6. A device for controlling a chip, characterized in that: The device comprises: A memory for storing instructions; The processor is used to execute the instructions to perform the following operations: Reading a first process parameter from a chip, where the first process parameter is used to indicate a process of the chip; Determining a first driving strength of a pad driver of the chip according to the first process parameter; Configuring the driving strength of the pad driver to be the first driving strength so that the output impedance of the pad driver matches the routing impedance of the circuit board carrying the chip; The step of determining a first driving strength of a pad driver of the chip according to the first process parameter includes: Determining a first driving strength of the pad driver according to the first process parameter and a second driving strength of the pad driver, wherein the second driving strength is determined based on a trace impedance of the circuit board; The determining the first driving strength of the pad driver according to the first process parameter and the second driving strength of the pad driver comprises: According to the first process parameter and the second driving strength of the pad driver, the first driving strength is determined by querying pre-stored mapping relationship information, wherein the mapping relationship information includes a mapping relationship among the first process parameter, the first driving strength and the second driving strength.

7. The device according to claim 6, characterized in that The step of configuring the driving strength of the pad driver to be the first driving strength includes: The value of the first driving strength is programmed into a register of a port control circuit of the chip.

8. The device according to claim 6, characterized in that The first process parameter is read from a fuse module of the chip.

9. The device according to claim 6, characterized in that The first process parameter indicates a process corner of the chip.

10. The device according to claim 6, characterized in that The chip is a baseband chip.

Images