X-ray detector bonding method

Abstract

The present invention provides an X-ray detector bonding method. Through the X-ray detector bonding equipment, the glue to be bonded can be firstly adsorbed to the first substrate located on the upper mold carrier and the second substrate located on the lower mold carrier due to surface tension, and then the first substrate is released, so that the glue to be bonded can be naturally leveled between the first substrate and the second substrate, so that the bonding glue layer can be free of bubbles and evenly distributed, and the first substrate and the second substrate can be tightly bonded, so as to improve product quality and prepare high-quality X-ray detectors.

Description

Technical Field

[0001] The invention relates to the technical field of X-ray detection, and in particular to an X-ray detector bonding method. Background Art

[0002] Digital Radiography (DR) is a new X-ray photography technology developed in the 1990s. With its significant advantages such as faster imaging speed, more convenient operation, and higher imaging resolution, it has become the leading direction of digital X-ray photography technology and has been recognized by clinical institutions and imaging experts around the world. It is increasingly used in medical imaging diagnosis, industrial flaw detection, security inspection and other fields.

[0003] An X-ray detector is generally a detector that uses semiconductor technology to convert X-ray energy into electrical signals to generate X-ray images.

[0004] Existing X-ray detectors can be divided into two types based on the way of energy conversion: indirect conversion X-ray detectors and direct conversion X-ray detectors. Among them, indirect conversion X-ray detectors are more widely used, and they mainly include scintillators and photoreceptor arrays. In the preparation process, the scintillator is usually first prepared on a first substrate to form a rigid scintillator structure, or fiber optic plates (FOP), and thin film transistors TFT and photodiodes PD are prepared on a second substrate to form a rigid photosensitive structure, or CMOS transistor structure, and then the prepared scintillator structure is bonded to the photosensitive structure to prepare an X-ray detector.

[0005] However, in existing X-ray detector bonding equipment, a planar pressing method is usually used to bond the scintillator structure and the photosensitive structure, both of which are made of hard materials. However, during the bonding process, the equipment often produces glue layer bubbles in the liquid glue, which makes it impossible for the scintillator structure and the photosensitive structure to fit tightly, affecting product quality and causing the prepared X-ray detector to have image distortion problems.

[0006] Therefore, it is necessary to provide an X-ray detector bonding method. Summary of the invention

[0007] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an X-ray detector bonding method for solving the problem of bubbles in the adhesive layer generated when bonding the X-ray detector in the prior art.

[0008] To achieve the above-mentioned and other related purposes, the present invention provides an X-ray detector bonding method, comprising the following steps:

[0009] Provided is an X-ray detector laminating device, the X-ray detector laminating device comprising an upper mold adsorption module, a lower mold carrier, a rotating module and a height adjustment module, wherein the upper mold adsorption module comprises an upper mold carrier and an upper mold adsorption component, and the rotating module comprises a rotating shaft, through which the upper mold carrier is movably connected to form a connecting end with the lower mold carrier;

[0010] Providing a first substrate, adsorbing the first substrate to the upper mold carrier by the upper mold adsorption component, and providing a second substrate, and placing the second substrate on the lower mold carrier;

[0011] Adding glue to the second substrate to form a glue to be bonded having an elliptical morphology;

[0012] With the rotating shaft as the axis, the upper mold carrier and the lower mold carrier are closed, and the upper mold carrier is supported by the height adjustment module to make the upper mold carrier contact with the inclined surface of the glue to be bonded and stay there for a period of time, so that the glue to be bonded is adsorbed to the first substrate and the second substrate;

[0013] The first substrate is released by the upper mold adsorption component, and the glue to be bonded is naturally leveled between the first substrate and the second substrate to complete the bonding.

[0014] Optionally, the first substrate includes a scintillator substrate or a photosensitive substrate, and the second substrate includes a scintillator substrate or a photosensitive substrate arranged corresponding to the first substrate.

[0015] Optionally, the height adjustment module includes a first inclined protrusion component and a displacement adjustment component, the first inclined protrusion component is located on the side of the upper mold carrier, the displacement adjustment component is arranged on the side of the lower mold carrier, the displacement adjustment component includes a displacement adjustment component and a second inclined protrusion component, and the second inclined protrusion component is arranged corresponding to the first inclined protrusion component, and the position of the second inclined protrusion component is adjusted by the displacement adjustment component to change the angle between the upper mold carrier and the lower mold carrier.

[0016] Optionally, the displacement adjustment component includes a handwheel, a guide column, a screw and a dust cover, the handwheel is connected to the guide column, the guide column is connected to the screw, the screw is connected to the second inclined protrusion component, and the displacement of the second inclined protrusion component is adjusted by the handwheel.

[0017] Optionally, the height adjustment module includes a first height adjustment member adjacent to the rotating axis and a second height adjustment member away from the rotating axis, and the first height adjustment member is arranged at the edge of the lower mold carrier or the edge of the upper mold carrier, and the second height adjustment member is arranged at the edge of the lower mold carrier or the edge of the upper mold carrier, and the height difference between the connecting ends of the upper mold carrier and the lower mold carrier is adjusted by the first height adjustment member, and the angle between the upper mold carrier and the lower mold carrier is adjusted by the second height adjustment member.

[0018] Optionally, the upper mold carrier is also provided with a handle.

[0019] Optionally, the upper mold adsorption component includes a vacuum upper mold adsorption component or an electrostatic upper mold adsorption component; the lower mold carrier is also provided with a lower film adsorption component, and the lower film adsorption component includes a vacuum lower film adsorption component or an electrostatic lower film adsorption component, or a limiting groove is provided on the surface of the lower mold carrier, and the second substrate to be bonded is limited by the limiting groove.

[0020] Optionally, the rotating module further includes a support plate that supports the rotating shaft, and a support plate height adjustment member connected to the support plate, and the height difference between the connecting ends of the upper mold carrier and the lower mold carrier is adjusted by the support plate height adjustment member.

[0021] Optionally, it also includes an upper mold adjustment module, which includes a back plate and a back plate height adjustment member in contact with the back plate, the upper mold carrier is supported by the back plate, and the angle between the upper mold carrier and the lower mold carrier in the open state is adjusted by the back plate height adjustment member.

[0022] Optionally, it further comprises a carrying platform, a level is arranged on the surface of the carrying platform, and adjustable mounting feet are arranged on the bottom of the carrying platform.

[0023] As described above, the X-ray detector bonding method of the present invention, through the X-ray detector bonding equipment, can make the glue to be bonded firstly adsorbed to the first substrate located on the upper mold carrier and the second substrate located on the lower mold carrier due to surface tension, and then release the first substrate, so that the glue to be bonded can be naturally leveled between the first substrate and the second substrate, so that the bonding glue layer can be free of bubbles and evenly distributed, and the first substrate and the second substrate can be tightly bonded to improve product quality and prepare high-quality X-ray detectors. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Shown is a process flow chart of the X-ray detector bonding method of the present invention.

[0025] Figure 2Shown is a schematic diagram of the operation of the X-ray detector bonding method of the present invention.

[0026] Figure 3 Shown is a schematic diagram of the structure of the X-ray detector bonding device in Example 1 in an open state.

[0027] Figure 4 Display as Figure 3 Schematic diagram of the structure of the X-ray detector bonding device in the closed state.

[0028] Figure 5 It is a schematic diagram of the structure of the upper mold adsorption module in the first embodiment.

[0029] Figure 6 Shown is a schematic structural diagram of the displacement adjustment component in Example 1.

[0030] Figure 7 It is a schematic diagram of the structure of the rotating module and the upper mold adjustment module in the second embodiment.

[0031] Figure 8 It shows a schematic diagram of the structure of the X-ray detector bonding device in the third embodiment in the open state.

[0032] Fig. 9 It is a schematic diagram of the structure of the X-ray detector bonding device in the fourth embodiment in the open state.

[0033] Component number description

[0034] 10. First substrate

[0035] 20 Second substrate

[0036] 30 Glue to be bonded

[0037] 100 Upper mold adsorption module

[0038] 101 Upper mold carrier

[0039] 1021 Vacuum Suction Cup

[0040] 1022 Vacuum value display window

[0041] 1023 Vacuum trigger button

[0042] 103 first inclined protruding part

[0043] 104 Handle

[0044] 200 Lower mold carrier

[0045] 300 Rotation Module

[0046] 301 Rotating axis

[0047] 302 Support plate

[0048] 303 Support plate height adjustment

[0049] 400 Displacement Adjustment Assembly

[0050] 401 second inclined protruding part

[0051] 402 Handwheel

[0052] 403 Guide column

[0053] 404 Screw

[0054] 405 Dust Cover

[0055] 500 Upper die adjustment module

[0056] 501 Back Panel

[0057] 502 Back panel height adjustment

[0058] 600 Loading Platform

[0059] 601 Level

[0060] 602 Adjustable mounting feet

[0061] 700 Height adjustment

[0062] 701 First height adjustment member

[0063] 702 Second height adjustment member DETAILED DESCRIPTION

[0064] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0065] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0066] Embodiment 1

[0067] See also Figure 1 and Figure 2This embodiment provides an X-ray detector bonding method, comprising the following steps:

[0068] S1: Provide an X-ray detector bonding device, the X-ray detector bonding device comprising an upper mold adsorption module, a lower mold carrier, a rotation module and a height adjustment module, wherein the upper mold adsorption module comprises an upper mold carrier and an upper mold adsorption component, and the rotation module comprises a rotation shaft, through which the upper mold carrier is movably connected to form a connection end with the lower mold carrier;

[0069] S2: providing a first substrate, adsorbing the first substrate onto the upper mold carrier by the upper mold adsorption component, providing a second substrate, and placing the second substrate onto the lower mold carrier;

[0070] S3: adding glue to the second substrate to form a glue to be bonded having an elliptical morphology;

[0071] S4: With the rotating shaft as the axis, the upper mold carrier and the lower mold carrier are closed, and the upper mold carrier is supported by the height adjustment module to contact the inclined surface of the glue to be bonded and stay for a period of time, so that the glue to be bonded is adsorbed to the first substrate and the second substrate;

[0072] S5: The first substrate is released by the upper mold adsorption component, and the glue to be bonded is naturally leveled between the first substrate and the second substrate to complete the bonding.

[0073] like Figure 2 and Figure 3 to Figure 6 In the X-ray detector bonding method of the present embodiment, the X-ray detector bonding device can make the glue 30 to be bonded firstly adsorbed to the first substrate 10 located on the upper mold carrier 101 and the second substrate 20 located on the lower mold carrier 200 due to surface tension, and then release the first substrate 10, so that the glue 30 to be bonded can be naturally leveled between the first substrate 10 and the second substrate 20, so that the bonding glue layer can be free of bubbles, and the first substrate 10 and the second substrate 20 can be tightly bonded, so as to improve product quality and prepare high-quality X-ray detectors.

[0074] For details, see Figures 3 to 6The present embodiment provides an X-ray detector bonding device, wherein the X-ray detector bonding device includes the height adjustment module including a first inclined protrusion component 103 and a displacement adjustment component 400, the displacement adjustment component 400 includes a displacement adjustment component and a second inclined protrusion component 401, and the second inclined protrusion component 401 is arranged corresponding to the first inclined protrusion component 103, and the position of the second inclined protrusion component 401 is adjusted by the displacement adjustment component to change the angle between the upper mold carrier 101 and the lower mold carrier 200.

[0075] Specifically, the X-ray detector bonding device includes:

[0076] An upper mold adsorption module 100, the upper mold adsorption module 100 comprises an upper mold carrier 101, an upper mold adsorption component and a first inclined protruding component 103, wherein the first inclined protruding component 103 is disposed on the side of the upper mold carrier 101, and the first substrate 10 to be bonded is adsorbed or released by the upper mold adsorption component;

[0077] A lower mold carrier 200, through which the second substrate 20 to be bonded is carried;

[0078] A rotating module 300 , wherein the rotating module 300 is connected to one end of the upper mold carrier 101 and the lower mold carrier 200 , and the upper mold carrier 101 is movably connected to the lower mold carrier 200 through the rotating module 300 ;

[0079] The displacement adjustment component 400 is arranged on the side of the lower mold carrier 200. The displacement adjustment component 400 includes a displacement adjustment component and a second inclined protrusion component 401, and the second inclined protrusion component 401 is arranged corresponding to the first inclined protrusion component 103. The position of the second inclined protrusion component 401 is adjusted by the displacement adjustment component to change the angle between the upper mold carrier 101 and the lower mold carrier 200.

[0080] The X-ray detector bonding device in this embodiment can make the first inclined protrusion component 103 contact with the second inclined protrusion component 401 through the displacement adjustment component 400 located on the side of the lower mold carrier 200, and form a certain angle between the upper mold carrier 101 and the lower mold carrier 200, so that when the first substrate 10 and the second substrate 20 are subsequently bonded, the bonding adhesive layer can be free of bubbles, and the first substrate 10 and the second substrate 20 can be tightly bonded to improve product quality and prepare high-quality X-ray detectors.

[0081] As an example, the first substrate 10 may include a scintillator substrate or a photosensitive substrate, and the second substrate 20 may include a scintillator substrate or a photosensitive substrate disposed corresponding to the first substrate 10 .

[0082] Specifically, the first substrate 10 may include a first base and a scintillator layer on the first base, wherein the first base may include an Al plate or a Cu plate, etc.; the scintillator layer may include a CsI scintillator layer, etc. The second substrate 20 may include a second base, such as a glass base, etc., and the second base has a photoreceptor array, wherein the photoreceptor array may include a thin film transistor, and the thin film transistor may include a bottom-gate thin film transistor or a top-gate thin film transistor, etc. The types and structures of the first substrate 10 and the second substrate 20 are not excessively limited here.

[0083] By coating glue between the first substrate 10 and the second substrate 20 , the first substrate 10 and the second substrate 20 can be bonded together by the X-ray detector bonding equipment to prepare the X-ray detector.

[0084] As an example, the rotating module 300 includes a manually adjustable rotating module or an automatically adjustable rotating module.

[0085] Specifically, Figure 3 to Figure 5 In this embodiment, the rotating module 300 adopts a manually adjustable rotating module with a relatively simple structure, that is, the upper mold carrier 101 is also provided with a handle 104 connected to the upper mold carrier 101. By holding the handle 104, the upper mold carrier 101 is rotated through the rotating module 300 to change the angle between the upper mold carrier 101 and the lower mold carrier 200. In this embodiment, the rotating module 300 adopts a rotating shaft 301 with a relatively simple structure. However, it is not limited to this. The rotating module 300 may also adopt an automatically adjustable rotating module to rotate the upper mold carrier 101, which will not be elaborated here. For example, a controller connected to the upper mold carrier 101 may be used to brake the rotation of the rotating module 300.

[0086] As an example, Figure 6 The displacement adjustment component includes a handwheel 402, a guide column 403, a screw rod 404 and a dust cover 405. The handwheel 402 is connected to the guide column 403, the guide column 403 is connected to the screw rod 404, and the screw rod 404 is connected to the second inclined protrusion component 401. The displacement of the second inclined protrusion component 401 is adjusted by the handwheel 402.

[0087] Specifically, in this embodiment, the displacement adjustment component 400 is arranged on the side of the lower mold carrier 200, and the second inclined protrusion component 401 is arranged corresponding to the first inclined protrusion component 103. Figure 2 When the upper mold carrier 101 is in a closed state, the first inclined protrusion component 103 and the second inclined protrusion component 401 can be contacted by adjusting the displacement adjustment component 400, and the first substrate 10 adsorbed by the upper mold carrier 101 is in contact with the inclined slope of the glue on the second substrate 20, so that the upper mold carrier 101 can be positioned by the second inclined protrusion component 401, and after staying for a period of time, the glue can be adsorbed onto the first substrate 10 due to surface tension, and then, when the upper and lower surfaces of the glue are equivalent to the combined area of ​​the first substrate 10 and the second substrate 20, the first substrate 10 can be released by the upper mold adsorption component, so that the glue can flow slowly and naturally between the first substrate 10 and the second substrate 20, so that there is no bubble in the bonding glue layer, and the first substrate 10 and the second substrate 20 can be tightly fitted to improve product quality and prepare high-quality X-ray detectors.

[0088] As an example, the upper mold adsorption component includes a vacuum upper mold adsorption component or an electrostatic upper mold adsorption component.

[0089] Specifically, Figure 4 and Figure 5 In this embodiment, the upper mold adsorption component adopts a vacuum upper mold adsorption component, that is, the upper mold adsorption component includes a plurality of vacuum suction cups 1021, a vacuum value display window 1022 and a vacuum trigger button 1023 arranged on the inner surface of the upper mold carrier 101, so as to adsorb and release the first substrate 10 to be bonded through the vacuum suction cups 1021, and the number and distribution of the vacuum suction cups 1021 are not excessively restricted here. However, the type of the upper mold adsorption component is not limited thereto, and the upper mold adsorption component can also be an electrostatic upper mold adsorption component as required, which is not excessively restricted here.

[0090] As an example, the lower mold carrier 200 is also provided with a lower film adsorption component, and the lower film adsorption component includes a vacuum lower film adsorption component or an electrostatic lower film adsorption component, so as to limit the second substrate through the lower film adsorption component. Among them, when the upper mold adsorption component is a vacuum upper mold adsorption component, a plurality of vacuum suction cups can be provided on the inner surface of the upper mold carrier to adsorb the second substrate to be bonded through the vacuum suction cups. Of course, the lower film adsorption component can also be an electrostatic lower film adsorption component as needed. For the structure and type of the lower film adsorption component, please refer to the upper mold adsorption component, which will not be described in detail here.

[0091] As an example, a limiting groove is provided on the surface of the lower mold carrier 200, and the second substrate to be bonded is limited by the limiting groove.

[0092] Specifically, Figure 3 As shown, in this embodiment, the lower mold carrier 200 adopts a relatively simple structure and is provided with a limiting groove, so as to directly limit the second substrate to be bonded through the limiting groove. The size of the limiting groove can be set according to the size of the second substrate, which will not be elaborated here.

[0093] Embodiment 2

[0094] See also Figure 7 This embodiment also provides an X-ray detector bonding device. The difference from the first embodiment is that the rotating module 300 in the X-ray detector bonding device also includes a support plate 302 carrying the rotating shaft 301, and a support plate height adjustment member 303 connected to the support plate 302, and the support plate height adjustment member 303 is used to adjust the height difference between the connecting ends of the upper mold carrier 101 and the lower mold carrier 200, so as to adjust the connecting height of the upper mold carrier 101 and the lower mold carrier 200. The height difference of the connecting end is adjusted, and the X-ray detector bonding equipment also includes an upper mold adjustment module 500, and the upper mold adjustment module 500 includes a back plate 501 and a back plate height adjustment member 502 in contact with the back plate 501. The upper mold carrier 101 is supported by the back plate 501, and the angle between the upper mold carrier 101 and the lower mold carrier 200 in the open state is adjusted by the back plate height adjustment member 502 to improve the adjustment flexibility of the upper mold carrier 101 and make it have a wider range of applications.

[0095] Regarding the X-ray detector bonding method and device, please refer to Example 1, which will not be described in detail here.

[0096] Embodiment 3

[0097] See also Figure 8The present embodiment also provides an X-ray detector bonding device. The difference from the first embodiment is that the X-ray detector bonding device also includes a carrier platform 600, and a level 601 is provided on the surface of the carrier platform 600, and an adjustable mounting foot 602 is provided at the bottom of the carrier platform 600, so that the level of the surface of the carrier platform 600 can be observed by the level 601 provided on the surface of the carrier platform 600, and the level of the surface of the carrier platform 600 can be adjusted by the adjustable mounting foot 602 at the bottom of the carrier platform 600, so that the lower mold carrier 200 located on the carrier platform 600 can have a horizontal surface, avoiding the problem of uneven distribution of the subsequent glue due to fluidity, so that when the first substrate 10 and the second substrate 20 are bonded, the bonding glue layer can be free of bubbles and the glue layer can be evenly distributed, and the first substrate 10 and the second substrate 20 can be tightly bonded to improve product quality and prepare high-quality X-ray detectors.

[0098] The level 601 may include a bubble level or an electronic level, and the number N of the levels 601 may include N≥1. The type, number, and distribution of the level 601 and the type, number, and distribution of the adjustable mounting feet 602 are not excessively limited here. As for the X-ray detector bonding method and device, please refer to the first embodiment, which will not be described here.

[0099] Embodiment 4

[0100] See also Fig. 9 This embodiment also provides an X-ray detector bonding device. The difference from the first embodiment is that the height adjustment module in the X-ray detector bonding device includes a first height adjustment member 701 adjacent to the rotating axis 301 and a second height adjustment member 702 away from the rotating axis 301, and the first height adjustment member 701 can be set at the edge of the lower mold carrier 200 or the edge of the upper mold carrier 101, and the second height adjustment member 702 can be set at the edge of the lower mold carrier 200 or the edge of the upper mold carrier 101. The height difference between the connecting ends of the upper mold carrier 101 and the lower mold carrier 200 is adjusted by the first height adjustment member 701, and the angle between the upper mold carrier 701 and the lower mold carrier 702 is adjusted by the second height adjustment member 702. Since the height adjustment member is arranged vertically, the size of the X-ray detector bonding device can be reduced, so that when the first substrate 10 and the second substrate 20 are subsequently bonded, there will be no bubbles in the bonding adhesive layer, and the first substrate 10 and the second substrate 20 can be tightly bonded to improve product quality and prepare a high-quality X-ray detector.

[0101] The height adjustment member may include a manual lifting rod or an automatic lifting rod. The type, quantity, and distribution of the height adjustment member are not excessively limited here. As for the X-ray detector laminating method and device, please refer to the first embodiment, which will not be described in detail here.

[0102] In summary, the X-ray detector bonding method of the present invention, through the X-ray detector bonding equipment, can make the glue to be bonded firstly adsorbed to the first substrate located on the upper mold carrier and the second substrate located on the lower mold carrier due to surface tension, and then release the first substrate, so that the glue to be bonded naturally flows between the first substrate and the second substrate, and can make the bonding glue layer free of bubbles and evenly distributed, and the first substrate and the second substrate can be tightly bonded to improve product quality and prepare high-quality X-ray detectors. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0103] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for bonding an X-ray detector, characterized in that: The following steps are involved: Provided is an X-ray detector laminating device, the X-ray detector laminating device comprising an upper mold adsorption module, a lower mold carrier, a rotating module and a height adjustment module, wherein the upper mold adsorption module comprises an upper mold carrier and an upper mold adsorption component, the rotating module comprises a rotating shaft, and the upper mold carrier is movably connected to the rotating shaft to form a connecting end with the lower mold carrier; Providing a first substrate, adsorbing the first substrate to the upper mold carrier by the upper mold adsorption component, and providing a second substrate, and placing the second substrate on the lower mold carrier; Adding glue to the second substrate to form a glue to be bonded having an elliptical morphology; With the rotating shaft as the axis, the upper mold carrier and the lower mold carrier are closed, and the upper mold carrier is supported by the height adjustment module to make the upper mold carrier contact with the inclined surface of the glue to be bonded and stay there for a period of time, so that the glue to be bonded is adsorbed to the first substrate and the second substrate; The first substrate is released by the upper mold adsorption component, and the glue to be bonded is naturally leveled between the first substrate and the second substrate to complete the bonding; The first substrate includes a scintillator substrate or a photosensitive substrate, and the second substrate includes a scintillator substrate or a photosensitive substrate arranged corresponding to the first substrate; The height adjustment module includes a first inclined protrusion component and a displacement adjustment component, the first inclined protrusion component is located on the side of the upper mold carrier, the displacement adjustment component is arranged on the side of the lower mold carrier, the displacement adjustment component includes a displacement adjustment component and a second inclined protrusion component, and the second inclined protrusion component is arranged corresponding to the first inclined protrusion component, and the position of the second inclined protrusion component is adjusted by the displacement adjustment component to change the angle between the upper mold carrier and the lower mold carrier.

2. The X-ray detector bonding method according to claim 1, characterized in that: The displacement adjustment component includes a handwheel, a guide column, a screw and a dust cover, the handwheel is connected to the guide column, the guide column is connected to the screw, the screw is connected to the second inclined protrusion component, and the displacement of the second inclined protrusion component is adjusted by the handwheel.

3. The X-ray detector bonding method according to claim 1, characterized in that: The height adjustment module includes a first height adjustment member adjacent to the rotating axis and a second height adjustment member away from the rotating axis, and the first height adjustment member is arranged at the edge of the lower mold carrier or the edge of the upper mold carrier, and the second height adjustment member is arranged at the edge of the lower mold carrier or the edge of the upper mold carrier. The height difference between the connecting ends of the upper mold carrier and the lower mold carrier is adjusted by the first height adjustment member, and the angle between the upper mold carrier and the lower mold carrier is adjusted by the second height adjustment member.

4. The X-ray detector bonding method according to claim 1, characterized in that: The upper mold carrier is also provided with a handle.

5. The X-ray detector bonding method according to claim 1, characterized in that: The upper mold adsorption component includes a vacuum upper mold adsorption component or an electrostatic upper mold adsorption component; the lower mold carrier is also provided with a lower film adsorption component, and the lower film adsorption component includes a vacuum lower film adsorption component or an electrostatic lower film adsorption component, or a limiting groove is provided on the surface of the lower mold carrier, and the second substrate to be bonded is limited by the limiting groove.

6. The X-ray detector bonding method according to claim 1, characterized in that: The rotating module also includes a support plate that supports the rotating shaft, and a support plate height adjustment member connected to the support plate, and the height difference between the connecting ends of the upper mold carrier and the lower mold carrier is adjusted by the support plate height adjustment member.

7. The X-ray detector bonding method according to claim 1, characterized in that: It also includes an upper mold adjustment module, which includes a back plate and a back plate height adjustment member in contact with the back plate, the upper mold carrier is supported by the back plate, and the angle between the upper mold carrier and the lower mold carrier in the open state is adjusted by the back plate height adjustment member.

8. The X-ray detector bonding method according to claim 1, characterized in that: It also includes a bearing platform, a level is arranged on the surface of the bearing platform, and adjustable mounting feet are arranged on the bottom of the bearing platform.

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