Wafer cleaning apparatus and its transport device

Abstract

The application discloses a wafer cleaning equipment and a transmission device thereof. The disclosed wafer transmission device comprises a wafer loading part, a support base, a first adjusting assembly and a second adjusting assembly. The wafer loading part comprises a loading support, the support base comprises a support substrate, the loading support is connected with the support substrate, and the position of the loading support on the support surface of the support substrate is adjustable. The first adjusting assembly is used for adjusting the position of the loading support relative to the support substrate in a first direction, and the second adjusting assembly is used for adjusting the position of the loading support relative to the support substrate in a second direction. The first direction and the second direction are both parallel to the support surface, and the first direction is different from the second direction. The above scheme can solve the problem that when the adjusting assembly adjusts the position of the wafer loading part on the support surface of the support base, the adjustment can only be performed in one direction, the adjustment in other directions needs to be manually disassembled and adjusted, the adjustment accuracy is not high, and the adjustment efficiency is low.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wafer cleaning device and a transmission device thereof. Background Art

[0002] Wafer cleaning is a crucial step in semiconductor manufacturing. During wafer cleaning, a robotic arm is typically required to accurately grasp the wafers loaded onto a conveyor and then place them into a cleaning tank for cleaning. The accuracy of the robotic arm's ability to grasp the wafers is a critical step in the wafer cleaning process.

[0003] In the wafer cleaning equipment, the position of the manipulator is relatively fixed and cannot be adjusted. If the position of the wafer placed on the transmission device is not accurate, the manipulator may be at risk of damaging the wafer when grabbing the wafer. Therefore, the position of the wafer needs to be adjusted in advance when the manipulator grabs the wafer. The transmission device includes a wafer loading part, a support base and an adjustment component. The wafer loading part is used to support the wafer, and the wafer loading part is connected to the support base. Since the support base is fixed, adjusting the position of the wafer requires adjusting the position of the wafer loading part relative to the support base. In the related art, the wafer loading part can only be adjusted in one direction along the support surface of the support base through the adjustment component, and in other directions it can only be adjusted by disassembling it and then pushing it by hand or other methods. This adjustment method has the problems of low adjustment efficiency and low adjustment accuracy. Summary of the Invention

[0004] The present invention discloses a wafer cleaning device and a transmission device thereof, so as to solve the problem that when an adjustment component adjusts the position of a wafer loading part on a supporting surface of a supporting base, the adjustment can only be performed in one direction, and adjustment in other directions requires manual disassembly and adjustment, resulting in low adjustment accuracy and low adjustment efficiency.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, the present application discloses a wafer transfer device, comprising a wafer loading portion, a support base, a first adjustment component and a second adjustment component, wherein:

[0007] The wafer loading part includes a loading bracket, the supporting base includes a supporting substrate, the loading bracket is connected to the supporting substrate, and the position of the loading bracket on the supporting surface of the supporting substrate is adjustable;

[0008] The first adjustment component cooperates with the loading bracket and is used to adjust the position of the loading bracket relative to the supporting substrate in a first direction. The second adjustment component cooperates with the loading bracket and is used to adjust the position of the loading bracket relative to the supporting substrate in a second direction. The first direction and the second direction are both parallel to the supporting surface, and the first direction is different from the second direction.

[0009] In a second aspect, the present application also discloses a wafer cleaning device, comprising the wafer transfer device described in the first aspect.

[0010] The technical solution adopted by the present invention can achieve the following technical effects:

[0011] The wafer transfer device disclosed in the embodiment of the present application connects the loading bracket to the supporting substrate, and the position of the loading bracket relative to the supporting surface of the supporting substrate is adjustable, so that the first adjustment component can adjust the position of the loading bracket relative to the supporting substrate in the first direction, and the second adjustment component can adjust the position of the loading bracket relative to the supporting substrate in the second direction, thereby making it possible to adjust the position of the wafer loaded on the wafer loading part in the first direction and the second direction; by adjusting the first adjustment component and the second adjustment component from two different directions, the adjustment of the loading bracket in different directions can be performed by the adjustment component, rather than adjusting by hand pushing or other means after disassembly, thereby effectively improving the adjustment efficiency when adjusting the position of the loading bracket relative to the supporting substrate, and also improving the adjustment accuracy during adjustment; by setting the first direction and the second direction to be different, the position of the loading bracket on the supporting surface of the supporting substrate can be adjusted at any position, which can effectively improve the adjustment area range of the first adjustment component and the second adjustment component, thereby effectively improving the adjustment ability of the loading bracket on the supporting substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A schematic structural diagram of a wafer transfer device from a first perspective disclosed in an embodiment of the present invention;

[0013] Figure 2 A schematic structural diagram of a wafer transfer device from a second perspective disclosed in an embodiment of the present invention;

[0014] Figure 3 A partial schematic diagram of a wafer transfer device disclosed in an embodiment of the present invention;

[0015] Figure 4 This is a schematic diagram of the overall structure of the wafer transfer device disclosed in an embodiment of the present invention.

[0016] Description of reference numerals:

[0017] 100-wafer loading part, 110-loading bracket, 120-wafer supporting teeth, 130-supporting tooth connecting plate,

[0018] 200-support base, 210-support base plate, 211-fixing bolt, 220-support column,

[0019] 300-first adjustment component, 310-first adjustment plate, 311-first strip hole, 312-drag fixing plate, 320-first bolt, 330-first adjustment mechanism, 331-drag bracket, 331a-first through hole, 332-drag bolt,

[0020] 400-second adjustment assembly, 410-second adjustment plate, 411-second strip hole, 420-second bolt, 430-second adjustment mechanism, 431-first top screw, 432-first mounting block,

[0021] 500-third adjustment assembly, 510-second top screw, 520-second mounting block,

[0022] 600-fourth adjustment assembly, 610-third adjustment plate, 620-third bolt, 630-third adjustment mechanism, 700-threaded hole. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0025] Please refer to Figures 1 to 4 This application discloses a wafer transfer device. The disclosed wafer transfer device can be an elevator used to transfer wafers in a tank cleaning apparatus, or a device used to transfer wafers in other processes. The disclosed wafer transfer device includes a wafer loading portion 100, a support base 200, a first adjustment assembly 300, and a second adjustment assembly 400.

[0026] The wafer loading section 100 includes a loading bracket 110 and other components, such as wafer supporting teeth 120 and a supporting tooth connecting plate 130. The loading bracket 110 is used to connect with the other components of the wafer loading section 100, so that the loading bracket 110 and the other components of the wafer loading section 100 form a single unit. By adjusting the position of the loading bracket 110, the position of the wafer loaded on the wafer loading section 100 can be adjusted.

[0027] The support base 200 serves as the foundation for mounting other components of the wafer transfer device. The support base 200 can be connected to a motor, which can drive the support base 200 to rise and fall. The support base 200 includes a support base 210, to which the loading bracket 110 is connected. The loading bracket 110 is positionally adjustable on the support surface of the support base 210, allowing the loading bracket 110 to change the position of other components on the wafer loading section 100. Furthermore, the position of the wafer loaded on the wafer loading section 100 can be adjusted by adjusting the position of the loading bracket 110 on the support base 210.

[0028] The first adjustment assembly 300 cooperates with the loading bracket 110. The first adjustment assembly 300 can be connected to the support substrate 210 and the loading bracket 110. The first adjustment assembly 300 can be used to connect the support substrate 210 to the loading bracket 110. The cooperation between the first adjustment assembly 300 and the loading bracket 110 can be that the first adjustment assembly 300 pushes or pulls the loading bracket 110 to adjust the position of the loading bracket 110 relative to the support substrate 210 in the first direction. The first adjustment assembly 300 can also be indirectly connected to the loading bracket 110 through other components. For example, the first adjustment assembly 300 can be connected to the loading bracket 110 through a second adjustment assembly 400, and the loading bracket 110 can be connected to the second adjustment assembly 400. The first adjustment assembly 300 can drive the second adjustment assembly 400 to move to adjust the position of the loading bracket 110 relative to the support substrate 210 in the first direction. The first adjustment assembly 300 is used to adjust the position of the loading bracket 110 relative to the support substrate 210 in the first direction. The second adjustment assembly 400 cooperates with the loading bracket 110. The second adjustment assembly 400 can be connected to the support substrate 210 and the loading bracket 110. The cooperation between the second adjustment assembly 400 and the loading bracket 110 can be that the second adjustment assembly 400 pushes or pulls the loading bracket 110 to adjust the position of the loading bracket 110 in the second direction relative to the support substrate 210. The second adjustment assembly 400 can also be indirectly connected to the support substrate 210 through other components. For example, the second adjustment assembly 400 can be connected to the support substrate 210 through the first adjustment assembly 300. The second adjustment assembly 400 can be connected to the loading bracket 110 and can drive the loading bracket 110 to move relative to the first adjustment assembly 300 to adjust the position of the loading bracket 110 in the second direction relative to the support substrate 210. The second adjustment assembly 400 is used to adjust the position of the loading bracket 110 in the second direction relative to the support substrate 210. The first direction and the second direction are both parallel to the support surface, and the first direction is different from the second direction.

[0029] The first adjustment assembly 300 and the second adjustment assembly 400 can be a screw mechanism, which can include a screw and a screw slider. The screw slider can be mounted on the screw, which can be set on the support base plate 210. The screw slider can be connected to the loading bracket 110. The screw slider and the screw screw thread cooperate to move along the axis of the screw. By rotating the screw in different directions, the movement direction of the screw slider on the screw can be changed, and the screw slider can drive the loading bracket 110 to move in the first direction or the second direction of the support base plate 210, thereby changing the position of the loading bracket 110 relative to the support base plate 210 in the first direction or the second direction. Of course, the first adjustment assembly 300 and the second adjustment assembly 400 can also be a jackscrew structure. The jackscrew can be threadedly connected to the support base plate 210, and one end of the jackscrew can abut against the loading bracket 110. By rotating the jackscrew, the loading bracket 110 can be pushed to move, thereby adjusting the position of the loading bracket 110 in the first direction or the second direction of the support base plate 210. The first adjustment assembly 300 and the second adjustment assembly 400 may also be configured as an articulated plate and a jackscrew structure. The support base 210 may be connected to the loading bracket 110 via the articulated plate. The jackscrew may be connected to the support base 210, and the jackscrew may push the articulated plate to adjust the position of the loading bracket 110 relative to the support base 210 in the first direction or the second direction. The first adjustment assembly 300 and the second adjustment assembly 400 may also be other adjustment mechanisms, and the specific structures of the first adjustment assembly 300 and the second adjustment assembly 400 are not limited herein.

[0030] The first direction and the second direction may be orthogonal to each other so that the loading bracket 110 does not interfere with each other when adjusting the position of the loading bracket 110 in the first direction or the second direction on the support substrate 210. Of course, the first direction and the second direction may also be non-orthogonal.

[0031] During the specific implementation process, the loading bracket 110 is connected to the supporting substrate 210, and the position of the loading bracket 110 on the supporting surface of the supporting substrate 210 is adjustable. The first adjustment component 300 is used to adjust the position of the loading bracket 110 relative to the supporting substrate 210 in a first direction, and the second adjustment component 400 is used to adjust the position of the loading bracket relative to the supporting substrate 210 in a second direction. The first direction and the second direction are both parallel to the supporting surface of the loading bracket 110, and the first direction and the second direction are different.

[0032] The wafer transfer device disclosed in the embodiment of the present application is connected to the loading bracket 110 and the support base 210, and the position of the loading bracket 110 relative to the support surface of the support base 210 is adjustable, so that the first adjustment component 300 can adjust the position of the loading bracket 110 relative to the support base 210 in the first direction, and the second adjustment component 400 can adjust the position of the loading bracket 110 relative to the support base 210 in the second direction, thereby making it possible to adjust the position of the wafer loaded on the wafer loading part 100 in the first direction and the second direction; by adjusting the first adjustment component 300 and the second adjustment component 400 from two different directions, the loading bracket 110 can be adjusted to the first direction and the second direction. The adjustment of the bracket 110 in different directions is performed through the adjustment assembly, rather than by manual pushing or other means after disassembly, thereby effectively improving the adjustment efficiency when adjusting the position of the loading bracket 110 relative to the supporting substrate 210, and also improving the adjustment accuracy during adjustment; by setting the first direction and the second direction to be different, the position of the loading bracket 110 on the supporting surface of the supporting substrate 210 can be adjusted at any position, which can effectively increase the adjustment area range of the first adjustment assembly 300 and the second adjustment assembly 400, thereby effectively improving the adjustment ability of the loading bracket 110 on the supporting substrate 210.

[0033] In an optional embodiment, the first adjustment assembly 300 may include a first adjustment plate 310, a first adjustment mechanism 330, and a first bolt 320. The loading bracket 110 may be connected to the first adjustment plate 310. The first adjustment plate 310 may have a first strip-shaped hole 311 extending in a first direction. The first bolt 320 may pass through the first strip-shaped hole 311 and be connected to the support base 210, so that the first adjustment plate 310 is connected to the support base 210, and the first adjustment plate 310 is located on one side of the support surface. The loading bracket 110 may be connected to the support base 200 via the first adjustment plate 310. The first bolt 320 and the first strip-shaped hole 311 may slide relative to each other in the first direction, so that the first adjustment plate 310 can move relative to the support base 210 in the first direction.

[0034] In the first state, the first bolt 320 may be in a tightened state, and the first adjustment plate 310 may be fixedly connected to the support base plate 210 via the first bolt 320 , so that the first adjustment plate 310 and the support base plate 210 do not move in the first direction.

[0035] In the second state, the first bolt 320 can be in a loosened state, and the first adjustment mechanism 330 can adjust the movement of the first adjustment plate 310 along the first direction to adjust the position of the loading bracket 110 relative to the supporting base plate 210 in the first direction. The first bolt 320 can slide in the first direction relative to the first strip hole 311.

[0036] By configuring the first adjustment assembly 300 to include a first adjustment plate 310, a first adjustment mechanism 330, and a first bolt 320, the loading bracket 110 is connected to the first adjustment plate 310, and the first adjustment plate 310 is connected to the support base plate 210, so that the loading bracket 110 is connected to the support base plate 210 through the first adjustment assembly 300, and further, the position of the loading bracket 110 relative to the support base plate 210 in the first direction is adjusted by adjusting the position of the first adjustment plate 310 relative to the support base plate 210 in the first direction; when the connection between the first adjustment plate 310 and the support base plate 210 fails due to frequent adjustment, the problem can be solved by simply replacing or repairing the first adjustment plate 310. The first adjustment plate 310 can effectively avoid the problem of high maintenance costs caused by damage to the loading bracket 110 due to frequent adjustments when the loading bracket 110 is directly connected to the support base 210. At the same time, by providing a first strip hole 311 extending along the first direction on the first adjustment mechanism 330, the first strip hole 311 provides a movement channel for the first adjustment plate 310 to move relative to the support base 210 in the first direction. At the same time, the first strip hole 311 also serves as a guide for the movement of the first adjustment plate 310, thereby making the movement of the first adjustment plate 310 relative to the support base 210 more stable and the movement position more precise. One end of the first strip hole 311 can be open to facilitate the connection of the first adjustment plate 310 to the support base 210. It is not necessary to completely remove the first bolt 320. The first bolt 320 only needs to be loosened to allow the first adjustment plate 310 to be inserted.

[0037] Specifically, the first adjustment mechanism 330 may be a lead screw mechanism, a linear drive motor, or the like, and is not specifically limited herein. The second adjustment assembly 400 may also adjust the position of the loading bracket 110 relative to the support substrate 210 in the second direction by adjusting the movement of the first adjustment plate 310 in the second direction. The second adjustment assembly 400 may also be directly connected to the loading bracket 110 to adjust the loading bracket 110 relative to the support substrate 210 in the second direction.

[0038] Furthermore, the first adjustment mechanism 330 may include a drag bracket 331 and a drag bolt 332. The drag bracket 331 may be fixedly connected to the support base plate 210, for example, the drag bracket 331 and the support base plate 210 are connected by a fixing bolt 211. The drag bracket 331 may have a first through hole 331a extending therethrough, and the nut at the first end of the drag bolt 332 may have an annular groove. The hole wall of the first through hole 331a may be sleeved within the annular groove to limit the movement of the drag bolt 332 at the first through hole 331a along the axis of the first through hole 331a. The drag bolt 332 may be rotatable relative to the first through hole 331a, and the second end of the drag bolt 332 may be threadedly connected to the first adjustment plate 310. The first end of the drag bolt 332 does not move relative to the axis of the first through hole 331a. The second end of the drag bolt 332 is threadedly connected to the first adjustment plate 310. The connection between the first adjustment plate 310 and the support base plate 210 also restricts the rotation of the first adjustment plate 310. When the first end of the drag bolt 332 rotates relative to the first through hole 331a, the second end of the drag bolt 332 can threadably engage with the threaded hole 700 of the first adjustment plate 310, causing the first adjustment plate 310 to move in the first direction. The first adjustment plate 310 can be provided with a drag fixing plate 312, which can be provided with a threaded hole 700. The second end of the drag bolt 332 can threadably engage with the threaded hole 700 of the drag fixing plate 312, thereby connecting the second end of the drag bolt 332 to the first adjustment plate 310 via the drag fixing plate 312. This facilitates maintenance in the event of a threaded engagement failure.

[0039] By setting the first adjustment mechanism 330 as a structural assembly including a dragging bracket 331 and a dragging bolt 332, the first end of the dragging bolt 332 can rotate on the dragging bracket 331 and cannot move along the axial direction of the first through hole 331a. The second end of the drag is threadedly connected to the first adjustment plate 310, so that the rotational movement of the dragging bolt 332 can be converted into movement of the first adjustment plate 310 along the first direction. Since the rotation control of the dragging bolt 332 is relatively simple, and the rotation control is more stable, the adjustment accuracy is relatively high, so that the first adjustment plate 310 drives the loading bracket 110 to adjust the position in the first direction more stably, the adjustment is more precise, and the operation is easier.

[0040] In an optional embodiment, the second adjustment assembly 400 may include a second adjustment plate 410, a second adjustment mechanism 430, and a second bolt 420. The loading bracket 110 may be connected to the second adjustment plate 410, and the second adjustment plate 410 may be connected to the support base plate 210, so that the loading bracket 110 is connected to the support base plate 210 through the first adjustment assembly 300 and the second adjustment assembly 400. The second adjustment plate 410 may have a second strip-shaped hole 411 extending in the second direction, and the second bolt 420 may pass through the second strip-shaped hole 411 to connect to the first adjustment plate 310, so that the second adjustment plate 410 is connected to the side of the first adjustment plate 310 facing away from the support base plate 210.

[0041] In the third state, the second bolt 420 may be in a tightened state, and the second adjustment plate 410 may be fixedly connected to the first adjustment plate 310 by the second bolt 420 .

[0042] In the fourth state, the second bolt 420 can be in a loosened state, and the second adjustment mechanism 430 can adjust the second adjustment plate 410 to move along the second direction to adjust the position of the loading bracket 110 relative to the supporting substrate 210 in the second direction, and the second bolt 420 can slide in the second direction relative to the second strip hole 411.

[0043] By setting the second adjustment assembly 400 as a structural assembly including a second adjustment plate 410, a second adjustment mechanism 430 and a second bolt 420, a second strip hole 411 is opened on the second adjustment plate 410, and the second bolt 420 can pass through the second strip hole 411 and be connected to the first adjustment plate 310, so that the second adjustment plate 410 is connected to the first adjustment plate 310, and the second strip hole 411 can slide relative to the second bolt 420 in the second direction, thereby providing a moving channel for the second adjustment plate 410 to move along the second direction. At the same time, the second strip hole 411 also has a guide The second adjusting mechanism 430 is used to adjust the second adjusting plate 410 to move in the second direction, and the first adjusting mechanism 330 is used to adjust the first adjusting plate 310 to move in the first direction. This structure can realize step-by-step adjustment of the first adjusting plate 310 and the second adjusting plate 410, thereby avoiding damaging the position of the loading bracket 110 in the second direction when adjusting the position of the loading bracket 110 in the first direction, and avoiding damaging the position of the loading bracket 110 in the first direction when adjusting the position of the loading bracket 110 in the second direction, thereby effectively improving the adjustment efficiency and adjustment accuracy.

[0044] Furthermore, the second adjustment mechanism 430 may include two first top screws 431 and two first mounting blocks 432. The two first mounting blocks 432 may be provided on the first adjustment plate 310, and may be respectively provided on both sides of the second adjustment plate 410 along the second direction, and provided on the central axis of the second adjustment plate 410 along the second direction. The two first top screws 431 are respectively threadedly engaged with the first threaded holes of the two first mounting blocks 432. The first top screws 431 can abut against the second adjustment plate 410 by threading with the first threaded holes, and can push the second adjustment plate 410 to move along the second direction. After being adjusted into place, the two first top screws 431 can both abut against the first adjustment plate 310, which can further improve the connection stability between the second adjustment plate 410 and the first adjustment plate 310 in the second direction in the third state.

[0045] By setting the second adjustment mechanism 430 as a structural component including a first push screw 431 and a first mounting block 432, the first push screw 431 can be threadedly engaged with the first threaded hole of the first mounting block 432 and then abut against the second adjustment plate 410, so that the first push screw 431 can push the second adjustment plate 410 to move along the second direction; when the first push screw 431 rotates, the feed amount of the first push screw 431 is relatively accurate, so that the movement of the second adjustment plate 410 along the second direction is also more accurate, so that the position of the loading bracket 110 relative to the supporting base plate 210 in the second direction is also more accurate, and the first push screw 431 is relatively simple to adjust, which can effectively improve the adjustment efficiency. At the same time, the push screw structure is relatively simple, which can effectively improve the overall economy.

[0046] In an optional embodiment, the wafer transfer device may include a third adjustment assembly 500. The third adjustment assembly 500 may include a plurality of second push screws 510 and a plurality of second mounting blocks 520. The plurality of second mounting blocks 520 may be provided on the first adjustment plate 310 and may be provided on both sides of the second adjustment plate 410 along the second direction, and may be away from the central axis of the second adjustment plate 410, and the extension direction of the central axis may be consistent with the second direction. The plurality of second push screws 510 may be threadedly engaged with the second threaded holes of the plurality of second mounting blocks 520 in a one-to-one correspondence. The second push screws 510 may abut against the second adjustment plate 410 by threading with the second threaded holes, and may push the second adjustment plate 410 to deflect along the center of the second adjustment plate 410.

[0047] By setting a second top screw 510 and a second mounting block 520, and the second mounting block 520 is set on the first adjustment plate 310, and is set on both sides of the second adjustment plate 410 along the second direction, and is set away from the central axis of the second adjustment plate 410, the extension direction of the central axis is consistent with the second direction, so that when the second top screw 510 pushes the second adjustment plate 410, the second adjustment plate 410 is deflected relative to the center of the second adjustment plate 410, thereby effectively solving the problem that the loading bracket 110 needs to be deflected and adjusted. At the same time, the adjustment of the second top screw 510 is relatively simple, which can effectively improve the adjustment efficiency, and the adjustment accuracy of the top screw mechanism is relatively high, thereby improving the adjustment accuracy.

[0048] In an optional embodiment, the wafer transfer device may include a fourth adjustment assembly 600. The fourth adjustment assembly 600 may include a third adjustment plate 610, a third bolt 620, and a third adjustment mechanism 630. The loading bracket 110 may be connected to the third adjustment plate 610, and the third adjustment plate 610 may be connected to the side of the second adjustment plate 410 facing away from the support substrate 210 via the third bolt 620. The third adjustment mechanism 630 may be located in a first edge region of the third adjustment plate 610 and may be used to adjust the distance between the first edge region and the second adjustment plate 410. When adjusting the distance between the first edge region and the second adjustment plate 410, the third bolt 620 may be loosened first and then tightened after the adjustment is complete. By adjusting the distance between the first edge area and the second adjustment plate 410, the pitch angle of the third adjustment plate 610 relative to the second adjustment plate 410 can be adjusted, so that the third adjustment plate 610 can drive the loading bracket 110 to move together, thereby improving the adjustment ability of the loading bracket 110, and the horizontality of the wafer supporting teeth 120 of the wafer loading part 100 is also adjusted through the loading bracket 110, thereby ensuring that the wafer supported on the wafer supporting teeth 120 meets the horizontality when the robot grasps it, thereby effectively preventing the robot from damaging the wafer.

[0049] By setting a third adjustment plate 610 and a third bolt 620, the third adjustment plate 610 can be connected to the second adjustment plate 410 through the third bolt 620, and the third adjustment mechanism 630 can be located in the first edge area of ​​the third adjustment plate 610 to adjust the distance between the first edge area and the second adjustment plate 410, so that the pitch angle of the third adjustment plate 610 relative to the second adjustment plate 410 can be adjusted, and then the third adjustment plate 610 can drive the loading bracket 110 to move together, thereby improving the adjustment ability of the loading bracket 110, and the horizontality of the wafer supporting teeth 120 of the wafer loading part 100 can be adjusted through the loading bracket 110, thereby ensuring that the wafer supported on the wafer supporting teeth 120 meets the horizontality when the robot grasps it, thereby effectively preventing the robot from damaging the wafer. By layering the first adjustment plate 310, the second adjustment plate 410, and the third adjustment plate 610, step-by-step adjustment can be achieved when adjusting the position of the loading bracket 110 relative to the support base 200. When adjusting the corresponding position or angle, it will not affect the changes in other positions and directions, thereby effectively improving the efficiency and accuracy of the adjustment.

[0050] Specifically, when adjusting the spacing between the first edge region and the second adjustment plate 410, the spacing between the position of the third adjustment plate 610 away from the first edge region and the second adjustment plate 410 does not change, thereby achieving a pitch angle of the third adjustment plate 610 relative to the second adjustment plate 410. Of course, the spacing between the position of the third adjustment plate 610 away from the first edge region and the second adjustment plate 410 may also be changed, as long as it is different from the spacing change between the first edge region and the second adjustment plate 410. If the assembly accuracy meets the requirements, the loading bracket 110 only needs to meet the levelness requirements and the levelness of the wafer supporting teeth 120 can also be met. Therefore, when the third adjustment mechanism 630 adjusts the pitch angle of the third adjustment plate 610 relative to the second adjustment plate 410, it only needs to determine the levelness of the loading bracket 110.

[0051] Furthermore, there may be multiple third bolts 620, and the multiple third bolts 620 may be spaced apart. The third adjustment plate 610 may have multiple first edge regions, and the multiple third bolts 620 are respectively disposed in corresponding first edge regions. Each first edge region is provided with a top screw threaded hole, and the top screw threaded holes are spaced apart from the third bolts 620. The third adjustment mechanism 630 may include multiple third top screws, and the multiple third top screws may be threadedly engaged with the multiple top screw threaded holes in a one-to-one correspondence. Any third top screw may be threadedly engaged with the top screw threaded hole to abut against the second adjustment plate 410, thereby adjusting the spacing between the first edge region corresponding to the third top screw and the second adjustment plate 410.

[0052] The third adjustment plate 610 is provided with multiple first edge areas, and multiple third bolts 620 are respectively provided in the corresponding first edge areas. Each first edge area is provided with a top screw threaded hole, and the top screw threaded holes and the third bolts 620 are arranged at intervals, so that multiple third top screws can correspond one-to-one with the multiple top screw threaded holes, so that any third top screw can adjust the distance between the corresponding first edge area and the second adjustment plate 410, so that the distance between the third adjustment plate 610 and the second adjustment plate 410 in different areas can be adjusted respectively, thereby effectively improving the adjustment ability of the pitch angle of the third adjustment plate 610 relative to the second adjustment plate 410, and then the adjustment ability of the loading bracket 110 on the supporting substrate 210 can be improved by adjusting the distance between the third adjustment plate 610 and the second adjustment plate 410 in different areas.

[0053] In an optional embodiment, the wafer transfer apparatus may further include a third adjustment assembly 500, which may be used to adjust the deflection of the loading bracket 110 along the connection center between the loading bracket 110 and the support substrate 210. By providing the third adjustment assembly 500, the deflection of the loading bracket 110 can be further adjusted, further improving the adjustment capability of the loading bracket 110.

[0054] Specifically, the third adjustment component 500 can be a screw mechanism, a jackscrew mechanism, or a linear drive motor, etc., and no specific limitation is made to the third adjustment component 500 here.

[0055] In an optional embodiment, the wafer transfer apparatus may further include a fourth adjustment assembly 600. The loading bracket 110 may have a second edge region. The fourth adjustment assembly 600 may be connected between the second edge region and the support substrate 210, and the fourth adjustment assembly 600 may be used to adjust the distance between the second edge region and the support substrate 210. By providing the fourth adjustment assembly 600, the distance between the second edge region of the loading bracket 110 and the support substrate 210 may be adjusted, thereby adjusting the pitch angle of the loading bracket 110 relative to the support substrate 210, and further adjusting the levelness of the loading bracket 110. Alternatively, the levelness of the wafer supporting teeth 120 of the wafer loading portion 100 may be adjusted by adjusting the loading bracket 110, thereby effectively improving the adjustment capability of the loading bracket 110 relative to the support substrate 210.

[0056] Specifically, the fourth adjustment assembly 600 can be a screw mechanism, a jackscrew mechanism or a bolt, and the specific structure of the fourth adjustment assembly 600 is not limited here.

[0057] In an alternative embodiment, the wafer loading portion 100 can further comprise wafer support teeth 120 for loading the wafer and a support teeth connecting plate 130 for connecting the wafer support teeth 120 with the loading support 110. The support base 200 further comprises a support column 220 which can be connected with the support base plate 210 for supporting the support base plate 210.

[0058] The present application further discloses a cleaning apparatus, which comprises a robot, a process tank and the wafer transfer device disclosed in the above embodiments. The robot is used to pick up the wafer on the wafer loading portion 100 and place it in the process tank, or the robot is used to pick up the wafer in the process tank and place it on the wafer loading portion 100.

[0059] The above embodiments of the present application mainly describe the differences between the embodiments. The different optimization features between the embodiments can be combined to form a better embodiment without contradiction. In order to make the description concise, the combination of the different optimization features will not be described here.

[0060] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments. The above specific embodiments are only illustrative but not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, which are all within the protection of the present application.

Claims

1. A wafer transfer device, used in a wafer cleaning device, wherein the wafer cleaning device is used to grab a wafer on the wafer transfer device by a robot and place it in a process tank, or to grab the wafer in the process tank by the robot and place it on the wafer transfer device, characterized in that: The wafer transfer device comprises a wafer loading portion (100), a support base (200), a first adjustment component (300) and a second adjustment component (400), wherein: The wafer loading portion (100) comprises a loading bracket (110), wafer supporting teeth (120) and a supporting tooth connecting plate (130); the supporting base (200) comprises a supporting substrate (210); the loading bracket (110) is connected to the supporting substrate (210); and the position of the loading bracket (110) on the supporting surface of the supporting substrate (210) is adjustable; the loading bracket (110) is used to be connected to the supporting tooth connecting plate (130); the wafer supporting teeth (120) are connected to the supporting tooth connecting plate (130), so that the loading bracket (110), the wafer supporting teeth (120) and the supporting tooth connecting plate (130) become a whole; The first adjustment component (300) cooperates with the loading bracket (110) and is used to adjust the position of the loading bracket (110) relative to the supporting substrate (210) in a first direction. The second adjustment component (400) cooperates with the loading bracket (110) and is used to adjust the position of the loading bracket (110) relative to the supporting substrate (210) in a second direction. The first direction and the second direction are both parallel to the supporting surface, and the first direction is different from the second direction.

2. The wafer transfer device according to claim 1, wherein: The first adjustment assembly (300) comprises a first adjustment plate (310), a first adjustment mechanism (330) and a first bolt (320); the loading bracket (110) is connected to the first adjustment plate (310); the first adjustment plate (310) is provided with a first strip hole (311) extending along the first direction; the first bolt (320) passes through the first strip hole (311) and is connected to the support base plate (210) so that the first adjustment plate (310) is connected to the support base plate (210); and the first adjustment plate (310) is located on one side of the support surface; In a first state, the first adjustment plate (310) is fixedly connected to the support base plate (210) via the first bolt (320); In the second state, the first adjustment mechanism (330) can adjust the first adjustment plate (310) to move along the first direction to adjust the position of the loading bracket (110) relative to the supporting base plate (210) in the first direction, and the first bolt (320) can slide in the first direction relative to the first strip hole (311).

3. The wafer transfer device according to claim 2, wherein: The first adjustment mechanism (330) includes a dragging bracket (331) and a dragging bolt (332), wherein the dragging bracket (331) is fixedly connected to the supporting base plate (210), and the dragging bracket (331) is provided with a first through hole (331a) extending therethrough, and a nut at the first end of the dragging bolt (332) is provided with an annular groove, and the first through hole (331a) is sleeved in the annular groove to limit the dragging bolt (332) from moving at the first through hole (331a) along the axis direction of the first through hole (331a), and the dragging bolt (332) can rotate relative to the first through hole (331a), and the second end of the dragging bolt (332) is threadedly connected to the first adjustment plate (310).

4. The wafer transfer device according to claim 2, wherein: The second adjustment assembly (400) comprises a second adjustment plate (410), a second adjustment mechanism (430) and a second bolt (420); the loading bracket (110) is connected to the second adjustment plate (410); the second adjustment plate (410) is provided with a second strip hole (411) extending along the second direction; the second bolt (420) passes through the second strip hole (411) and is connected to the first adjustment plate (310), so that the second adjustment plate (410) is connected to a side of the first adjustment plate (310) facing away from the supporting substrate (210); In the third state, the second adjustment plate (410) is fixedly connected to the first adjustment plate (310) via the second bolt (420); In the fourth state, the second adjustment mechanism (430) can adjust the second adjustment plate (410) to move along the second direction to adjust the position of the loading bracket (110) relative to the supporting base plate (210) in the second direction, and the second bolt (420) can slide in the second direction relative to the second strip hole (411).

5. The wafer transfer device according to claim 4, wherein: The second adjustment mechanism (430) includes two first top screws (431) and two first mounting blocks (432). The two first mounting blocks (432) are provided on the first adjustment plate (310) and are respectively provided on both sides of the second adjustment plate (410) along the second direction and are provided on the central axis of the second adjustment plate (410) along the second direction. The two first top screws (431) are respectively threadedly engaged with the first threaded holes of the two first mounting blocks (432). The first top screw (431) can be abutted against the second adjustment plate (410) by engaging with the threads of the first threaded holes and can push the second adjustment plate (410) to move along the second direction.

6. The wafer transfer device according to claim 4, wherein: The wafer transfer device also includes a third adjustment component (500), the third adjustment component (500) includes a plurality of second top screws (510) and a plurality of second mounting blocks (520), the plurality of second mounting blocks (520) are arranged on the first adjustment plate (310), and are arranged on both sides of the second adjustment plate (410) along the second direction, and away from the central axis of the second adjustment plate (410), and the extension direction of the central axis is consistent with the second direction, the plurality of second top screws (510) are threadedly engaged with the second threaded holes of the plurality of second mounting blocks (520) in a one-to-one correspondence, the second top screws (510) can be abutted against the second adjustment plate (410) by threading with the second threaded holes, and can push the second adjustment plate (410) to deflect along the center of the second adjustment plate (410).

7. The wafer transfer device according to claim 4, wherein: The wafer transfer device also includes a fourth adjustment component (600), the fourth adjustment component (600) includes a third adjustment plate (610), a third bolt (620) and a third adjustment mechanism (630), the loading bracket (110) is connected to the third adjustment plate (610), the third adjustment plate (610) is connected to the side of the second adjustment plate (410) away from the supporting substrate (210) through the third bolt (620), the third adjustment mechanism (630) is located in the first edge area of ​​the third adjustment plate (610), and the third adjustment mechanism (630) is used to adjust the distance between the first edge area and the second adjustment plate (410).

8. The wafer transfer device according to claim 7, wherein: There are multiple third bolts (620), and multiple third bolts (620) are arranged at intervals. The third adjustment plate (610) has multiple first edge areas, and multiple third bolts (620) are respectively arranged in the corresponding first edge areas. Each first edge area is provided with a top screw threaded hole, and the top screw threaded hole is arranged at intervals from the third bolt (620). The third adjustment mechanism (630) includes multiple third top screws, and the multiple third top screws are threadedly matched with the multiple top screw threaded holes in a one-to-one correspondence. Any of the third top screws can be abutted against the second adjustment plate (410) by threading with the top screw threaded hole to adjust the distance between the first edge area corresponding to the third top screw and the second adjustment plate (410).

9. The wafer transfer device according to claim 1, wherein: The wafer transfer device further comprises a third adjustment component (500), wherein the third adjustment component (500) can be used to adjust the deflection of the loading bracket (110) along the connection between the loading bracket (110) and the supporting substrate (210).

10. The wafer transfer device according to claim 1, wherein: The wafer transfer device further includes a fourth adjustment component (600), the loading bracket (110) has a second edge area, the fourth adjustment component (600) is connected between the second edge area and the supporting substrate (210), and the fourth adjustment component (600) is used to adjust the distance between the second edge area and the supporting substrate (210).

11. A wafer cleaning device, characterized in that: It comprises a robot, a process tank and a wafer transfer device as described in any one of claims 1 to 10, wherein the robot is used to grab the wafer located on the wafer transfer device and place it in the process tank, or the robot is used to grab the wafer located in the process tank and place it on the wafer transfer device.

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