A wet process wafer cleaning platform

Abstract

The present invention discloses a wafer cleaning platform for a wet process, comprising: a carrying platform, a plurality of clamping assemblies, the plurality of clamping assemblies being mounted on the carrying platform, the plurality of clamping assemblies being used together to clamp a wafer; a first air blowing line, the first air blowing line being arranged in the carrying platform, the first air blowing line penetrating the upper surface of the carrying platform and being formed with a plurality of first air blowing holes, the axis of each first air blowing hole being arranged toward a position where a clamping assembly contacts the wafer. Through the application of the present invention, a wafer cleaning platform suitable for a wet process is provided, and by designing a special sharp protrusion for the clamping assembly, the crystallization accumulation of the cleaning liquid between the clamping assembly and the wafer is greatly reduced, and at the same time, in conjunction with the first air blowing line, the cleaning liquid is blown and cleaned at the contact position between the clamping assembly and the wafer, thereby ensuring the wet cleaning quality of the wafer and reducing the residue of dirt.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a wafer cleaning platform for a wet process. Background Art

[0002] At present, wafers that have completed the initial production process often need to undergo corresponding cleaning work. Production companies generally use a wet process to clean the wafer surface, that is, the wafer is clamped into the cleaning equipment by a robot. The cleaning equipment includes a corresponding spray component and a rotatable carrier. The limiting support for the wafer is generally achieved by installing a corresponding wafer clamping structure on the carrier. This wafer clamping structure is often arranged in a ring shape along the outer edge of the carrier, so that the outer edge of the wafer is against the inner side of several clamping structures to achieve clamping and fixation. However, in the actual wet process cleaning process, the existing wafer clamping structure often blocks part of the cleaning liquid thrown out by the wafer, causing the cleaning liquid to form crystals and accumulate between the clamping structure and the edge of the wafer, and also contaminates the upper surface of the carrier, which has an adverse effect on the cleaning work of the wafer. Summary of the Invention

[0003] In view of this, in order to solve the above problems, the object of the present invention is to provide a wafer cleaning platform for a wet process, comprising:

[0004] Carrying platform,

[0005] A plurality of clamping assemblies, each of which is mounted on the carrying platform and is used to clamp the wafer;

[0006] The first air blowing pipeline is arranged in the carrying platform, the first air blowing pipeline passes through the upper surface of the carrying platform and forms a plurality of first air blowing holes, and the axis of each of the first air blowing holes is arranged toward a position where the clamping assembly contacts the wafer.

[0007] In another preferred embodiment, the clamping assembly includes: a mounting portion and a clamping head, the mounting portion is fixedly connected to the supporting platform, the clamping head is arranged at the upper end of the mounting portion, and the clamping head abuts against the outer edge of the lower surface of the wafer.

[0008] In another preferred embodiment, the mounting portion and the clamping head are an integrated structure.

[0009] In another preferred embodiment, a plurality of mounting grooves are provided on the outer edge of the carrying platform, each of the mounting portions is fixedly installed in one of the mounting grooves, and the upper surface of the mounting portion is flush with the upper surface of the carrying platform.

[0010] In another preferred embodiment, the clamping head includes: a first clamping part, a second clamping part and a third clamping part connected in sequence from top to bottom, the horizontal outer contour of the first clamping part is smaller than the horizontal outer contour of the second clamping part, the horizontal outer contour of the second clamping part is smaller than the horizontal outer contour of the third clamping part, the third clamping part is connected to the upper surface of the mounting part, and the wafer rests on the connection between the first clamping part and the second clamping part.

[0011] In another preferred embodiment, the first clamping portion is configured as an upwardly protruding sharp structure.

[0012] In another preferred embodiment, the horizontal outer contour of the second clamping portion is gradually increased from top to bottom.

[0013] In another preferred embodiment, the horizontal outer contour of the third clamping portion is gradually increased from top to bottom.

[0014] In another preferred embodiment, an inclined surface is formed on the outer side of the second clamping portion, and the axis of the first blowing hole passes through the inclined surface.

[0015] In another preferred embodiment, an annular edge is formed on the outer edge of the upper surface of the carrying platform, and the level of the outer edge of the annular edge is lower than the level of the inner edge of the annular edge.

[0016] Due to the adoption of the above technical solution, the present invention has the following positive effects compared with the prior art: through the application of the present invention, a wafer cleaning platform suitable for wet process is provided, and through the special sharp protrusion design of the clamping component, the crystal accumulation of the cleaning liquid between the clamping component and the wafer is greatly reduced. At the same time, in conjunction with the first blowing pipeline, the cleaning liquid at the contact position between the clamping component and the wafer is blown and cleaned, thereby ensuring the wet cleaning quality of the wafer and reducing the residual dirt. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a partial schematic diagram of a wafer cleaning platform for wet process of the present invention.

[0018] In the attached figure:

[0019] 1. Carrying platform; 2. Clamping assembly; 3. Wafer; 4. First air blowing pipeline; 5. Mounting part; 6. Clamping head; 7. Mounting groove; 8. First clamping part; 9. Second clamping part; 10. Third clamping part; 11. Annular edge; 12. Second air blowing pipeline. DETAILED DESCRIPTION

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0021] like Figure 1 As shown, a preferred embodiment of a wafer cleaning platform for a wet process is shown, comprising: a carrier platform 1, a plurality of clamping assemblies 2, the plurality of clamping assemblies 2 are all mounted on the carrier platform 1, and the plurality of clamping assemblies 2 are used together to clamp a wafer 3; a first air blowing pipe 4, the first air blowing pipe 4 is arranged in the carrier platform 1, the first air blowing pipe 4 passes through the upper surface of the carrier platform 1 and is formed with a plurality of first air blowing holes, the axis of each first air blowing hole is arranged toward a position where a clamping assembly 2 contacts the wafer 3. Furthermore, through the cooperation between the first air blowing hole and the clamping assembly 2, the first air blowing hole is purged toward the contact position between the wafer 3 and the clamping assembly 2, thereby avoiding the crystallization accumulation of the cleaning liquid thrown off by the centrifugal force during the rotation of the wafer 3, and the plurality of clamping assemblies 2 are arranged in sequence along the outer edge of the upper surface of the carrier platform 1.

[0022] Furthermore, as a preferred embodiment, a plurality of first blowing holes are arranged in sequence along the outer edge of the upper surface ring of the carrying platform 1 in a circumferential direction.

[0023] Furthermore, as a preferred embodiment, each clamping assembly 2 is aligned with at least one blowing hole.

[0024] Furthermore, as a preferred embodiment, the first air blowing pipeline 4 is connected to an air supply device, and the air supply device is used to provide an air flow with a certain intensity into the first air blowing pipeline 4.

[0025] Furthermore, as a preferred embodiment, the gas supply device is used to provide nitrogen.

[0026] Furthermore, as a preferred embodiment, the plurality of clamping assemblies 2 are equidistantly arranged in the circumferential direction along the upper surface of the carrying platform 1 .

[0027] Furthermore, as a preferred embodiment, the clamping assembly 2 includes: a mounting portion 5 and a clamping head 6, the mounting portion 5 is fixedly connected to the supporting platform 1, the clamping head 6 is arranged at the upper end of the mounting portion 5, and the clamping head 6 is against the outer edge of the lower surface of the wafer 3.

[0028] Furthermore, as a preferred embodiment, the mounting portion 5 and the clamping head 6 are an integrated structure.

[0029] Furthermore, as a preferred embodiment, a plurality of mounting grooves 7 are provided on the outer edge of the carrying platform 1 , each mounting portion 5 is fixedly installed in a mounting groove 7 , and the upper surface of the mounting portion 5 is flush with the upper surface of the carrying platform 1 .

[0030] Furthermore, as a preferred embodiment, the horizontal cross-section of the mounting groove 7 is arranged to be quadrilateral.

[0031] Furthermore, as a preferred embodiment, the clamping head 6 includes: a first clamping part 8, a second clamping part 9 and a third clamping part 10 connected in sequence from top to bottom, the horizontal outer contour of the first clamping part 8 is smaller than the horizontal outer contour of the second clamping part 9, the horizontal outer contour of the second clamping part 9 is smaller than the horizontal outer contour of the third clamping part 10, the third clamping part 10 is connected to the upper surface of the mounting part 5, and the wafer 3 rests on the connection between the first clamping part 8 and the second clamping part 9.

[0032] Furthermore, as a preferred embodiment, the above-mentioned horizontal outer contour refers to the outer contour of the cross section of the corresponding structure along the horizontal direction.

[0033] Furthermore, as a preferred embodiment, the horizontal cross-sections of the first clamping portion 8, the second clamping portion 9, and the third clamping portion 10 are all arranged to be circular.

[0034] Furthermore, as a preferred embodiment, the first clamping portion 8 is configured as a sharp structure protruding upward.

[0035] Furthermore, as a preferred embodiment, the horizontal outer contour of the first clamping portion 8 is gradually increased from top to bottom.

[0036] Furthermore, as a preferred embodiment, the upper end of the first clamping portion 8 is spherical.

[0037] Furthermore, as a preferred embodiment, the horizontal outer contour of the second clamping portion 9 is gradually increased from top to bottom.

[0038] Furthermore, as a preferred embodiment, the horizontal outer contour of the third clamping portion 10 is gradually increased from top to bottom.

[0039] Furthermore, as a preferred embodiment, the outer wall of the third clamping portion 10 is arranged in an arc shape.

[0040] Furthermore, as a preferred embodiment, an inclined surface is formed on the outer side of the second clamping portion 9, and the axis of the first blowing hole passes through the inclined surface.

[0041] Furthermore, as a preferred embodiment, the axis of the first blowing hole is parallel to and flush with the inclined surface.

[0042] Furthermore, as a preferred embodiment, an annular edge 11 is formed on the outer edge of the upper surface of the carrying platform 1 , and the level of the outer edge of the annular edge 11 is lower than the level of the inner edge of the annular edge 11 .

[0043] Furthermore, as a preferred embodiment, the clamping assembly 2 is disposed on the inner side of the annular edge 11 .

[0044] The above descriptions are merely preferred embodiments of the present invention and are not intended to limit the implementation and protection scope of the present invention.

[0045] The present invention also has the following implementation modes based on the above:

[0046] In a further embodiment of the present invention, it also includes: a second air blowing pipeline 12, the second air blowing pipeline 12 is arranged in the carrying platform 1, and the second air blowing pipeline 12 passes through the upper surface of the carrying platform 1 to form a plurality of second air blowing holes, and the axis of each second air blowing hole is arranged to be inclined upward.

[0047] In a further embodiment of the present invention, the axis of the second blowing hole is arranged toward the outer edge of the lower surface of the wafer 3 .

[0048] In a further embodiment of the present invention, the axis of the second blowing hole is arranged parallel to the axis of the first blowing hole.

[0049] In a further embodiment of the present invention, the plurality of first blowing holes are collectively arranged in a first ring shape, and the plurality of second blowing holes are collectively arranged in a second ring shape.

[0050] In a further embodiment of the present invention, the diameter of the first ring shape is greater than the diameter of the second ring shape.

[0051] In a further embodiment of the present invention, the first air blowing pipeline 4 and the second air blowing pipeline 12 are both used for blowing out nitrogen.

[0052] In a further embodiment of the present invention, the second air blowing pipeline 12 and the first air blowing pipeline 4 may be connected to the same air supply device through other pipelines.

[0053] In a further embodiment of the present invention, the first blowing pipeline 4 includes a plurality of first branch pipelines, and one end of each of the plurality of first branch pipelines is formed with the above-mentioned first blowing holes.

[0054] In a further embodiment of the present invention, each first branch pipeline includes a first horizontal pipeline, a vertical pipeline and a first inclined pipeline connected in sequence, the first horizontal pipeline is arranged in the horizontal direction, the vertical pipeline is arranged in the vertical direction, the first inclined pipeline is arranged at an angle relative to the horizontal plane, and the higher end of the first inclined pipeline passes through the upper surface of the carrying platform 1 to form the above-mentioned first blowing hole

[0055] In a further embodiment of the present invention, the other ends of the plurality of first branch pipelines are connected in parallel to an air supply channel, and the air supply channel is used to connect to the air supply device.

[0056] In a further embodiment of the present invention, the second blowing pipeline 12 includes a plurality of second branch pipelines, and one end of each of the plurality of second branch pipelines is formed with the aforementioned second blowing holes.

[0057] In a further embodiment of the present invention, each second branch pipeline includes a second horizontal pipeline and a second inclined pipeline connected in sequence, the second horizontal pipeline is arranged in the horizontal direction, and the second inclined pipeline is inclined relative to the horizontal plane. The higher end of the second inclined pipeline passes through the upper surface of the supporting platform 1 and forms the above-mentioned second blowing hole.

[0058] In a further embodiment of the present invention, the other ends of the plurality of second branch pipelines are connected in parallel to an air supply channel.

[0059] The above description is only a preferred embodiment of the present invention and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning platform for a wet process, characterized in that: include: Carrying platform, A plurality of clamping assemblies, each of which is mounted on the carrying platform and is used to clamp the wafer; a first air blowing pipeline, the first air blowing pipeline being arranged in the carrying platform, the first air blowing pipeline penetrating the upper surface of the carrying platform and forming a plurality of first air blowing holes, the axis of each of the first air blowing holes being arranged toward a position where the clamping assembly contacts the wafer; The clamping assembly includes: a mounting portion and a clamping head, wherein the mounting portion is fixedly connected to the carrying platform, the clamping head is arranged at the upper end of the mounting portion, and the clamping head abuts against the outer edge of the lower surface of the wafer; The clamping head includes: a first clamping portion, a second clamping portion, and a third clamping portion connected in sequence from top to bottom, wherein the horizontal outer profile of the first clamping portion is smaller than the horizontal outer profile of the second clamping portion, and the horizontal outer profile of the second clamping portion is smaller than the horizontal outer profile of the third clamping portion, and the third clamping portion is connected to the upper surface of the mounting portion, and the wafer abuts against the connection between the first clamping portion and the second clamping portion; The horizontal outer contour of the second clamping portion is gradually increased from top to bottom; An inclined surface is formed on the outer side of the second clamping portion, and the axis of the first blowing hole passes through the inclined surface; The first clamping portion is configured as an upwardly protruding sharp structure.

2. The wafer cleaning platform for wet process according to claim 1, characterized in that: The mounting portion and the clamping head are an integrated structure.

3. The wafer cleaning platform for wet process according to claim 1, characterized in that: The outer edge of the carrying platform is provided with a plurality of installation grooves, each of the installation parts is fixedly installed in one of the installation grooves, and the upper surface of the installation part is flush with the upper surface of the carrying platform.

4. The wafer cleaning platform for wet process according to claim 1, characterized in that: The horizontal outer contour of the third clamping portion is gradually increased from top to bottom.

5. The wafer cleaning platform for wet process according to claim 1, characterized in that: An annular edge is formed on the outer edge of the upper surface of the carrying platform, and the level of the outer edge of the annular edge is lower than the level of the inner edge of the annular edge.

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