Sealing resin composition

Abstract

The present invention provides a sealing resin composition which is excellent in moisture permeation resistance, and also excellent in adhesion and transparency. A sealing resin composition comprising (A) a polyolefin-based resin, (B) a hygroscopic filler, (C) a metal complex, and (D) an adhesion promoter, wherein the content of (B) the hygroscopic filler is more than 45 mass% relative to 100 mass% of non-volatile components in the sealing resin composition, and (C) the metal complex is a metal complex in which a bidentate ligand having both of the coordination atoms as oxygen atoms and a monodentate ligand having a coordination atom as an oxygen atom are bonded to a central metal.

Description

Technical Field

[0001] This invention relates to sealing resin compositions, and more particularly to sealing resin compositions suitable for sealing electronic devices such as organic EL (electroluminescence) devices or solar cells. Background Technology

[0002] In order to protect electronic devices, especially organic EL (electroluminescence) devices and solar cells, which are not resistant to moisture, from the influence of external gases containing moisture, a method of sealing electronic devices with a resin composition containing hygroscopic filler is known (Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2017 / 057708. Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] From the viewpoint of obtaining a sealing resin composition with high moisture permeability resistance, it is ideal to increase the content of hygroscopic filler in the resin composition. However, increasing the content of hygroscopic filler can lead to a decrease in the adhesiveness and transparency of the resin composition. Therefore, the object of the present invention is to provide a sealing resin composition with excellent moisture permeability resistance, as well as excellent adhesiveness and transparency.

[0008] Technical solutions adopted to solve technical problems

[0009] After careful research to solve the above-mentioned problems, the inventors discovered that even when a high amount of hygroscopic filler, tackifier, and specific metal complex are incorporated into a resin composition containing polyolefin resin, a resin composition with excellent moisture resistance, adhesion, and transparency can be formed, thus completing the present invention.

[0010] That is, the present invention has the following features;

[0011] [1] A sealing resin composition comprising (A) a polyolefin resin, (B) a hygroscopic filler, (C) a metal complex, and (D) a tackifier.

[0012] Of which, relative to 100% by mass of the non-volatile components in the sealing resin composition, (B) the content of hygroscopic filler exceeds 45% by mass.

[0013] (C) Metal complexes are metal complexes formed by combining a bidentate ligand with two oxygen atoms and a monodentate ligand with an oxygen atom with a central metal.

[0014] [2] According to the sealing resin composition of [1], wherein (B) the hygroscopic filler is semi-calcined hydrotalcite;

[0015] [3] The sealing resin composition according to [1] or [2], wherein the central metal of (C) metal complex is aluminum or titanium.

[0016] [4] The sealing resin composition according to any one of [1] to [3], wherein (C) the metal complex is a metal complex represented by general formula (1),

[0017] [Chemical Formula 1]

[0018]

[0019] In the formula,

[0020] M represents the metals in periods 2 through 6 of the periodic table.

[0021] R1 and R3 each independently represent a hydrogen atom, an alkyl group optionally with a substituent, an alkoxy group optionally with a substituent, an aryl group optionally with a substituent, or an aralkyl group optionally with a substituent.

[0022] R2 represents a hydrogen atom, an alkyl group optionally having a substituent, an alkoxy group optionally having a substituent, an alkoxycarbonyl group optionally having a substituent, an aryl group optionally having a substituent, or an aralkyl group optionally having a substituent.

[0023] X represents a monodentate ligand with oxygen as its coordinating atom.

[0024] The solid line between the oxygen atom (O) and M within the brackets [] represents a covalent bond.

[0025] The dashed line between the oxygen atom (O) and M within the brackets [] represents a coordinate bond, and

[0026] m is an integer of 3 or 4, n is an integer from 1 to 3, and m > n.

[0027] [5] The sealing resin composition according to [4], wherein M in formula (1) is aluminum or titanium;

[0028] [6] The sealing resin composition according to any one of [1] to [5], wherein (A) the polyolefin resin includes a polyolefin resin having an anhydride group and / or a polyolefin resin having an epoxy group;

[0029] [7] The sealing resin composition according to any one of [1] to [5], wherein (A) the polyolefin resin includes a polyolefin resin having an anhydride group and a polyolefin resin having an epoxy group;

[0030] [8] A sealing resin composition according to any one of [1] to [5], wherein (A) the polyolefin resin comprises a reaction product of a polyolefin resin having an anhydride group and a polyolefin resin having an epoxy group;

[0031] [9] The sealing resin composition according to any one of [1] to [8], wherein the content of (C) metal complex is 0.1 to 5% by mass relative to 100% by mass of the non-volatile component in the resin composition;

[0032]

[10] The sealing resin composition according to any one of [1] to [9], wherein the content of (D) tackifier is 5 to 40% by mass relative to 100% by mass of the non-volatile component in the resin composition;

[0033]

[11] A sealing resin composition according to any one of [1] to

[10] , wherein the composition is used for sealing electronic devices;

[0034]

[12] The sealing resin composition according to

[11] , wherein the electronic device is an organic EL device or a solar cell;

[0035]

[13] A sealing sheet comprising a support and a layer of the resin composition described in any one of [1] to

[12] formed on the support;

[0036]

[14] An electronic device wherein the device is sealed with a sealing resin composition as described in any one of [1] to

[10] ;

[0037]

[15] The electronic device according to

[14] , wherein the electronic device is an organic EL device or a solar cell.

[0038] The effects of the invention

[0039] According to the present invention, a sealing resin composition that not only has excellent moisture resistance but also excellent adhesion and transparency can be realized. Detailed Implementation

[0040] [Sealing Resin Composition]

[0041] The sealing resin composition of the present invention (hereinafter also referred to as the "resin composition") includes, as essential components, (A) a polyolefin resin, (B) a hygroscopic filler, (C) a metal complex, and (D) a tackifier.

[0042] <(A) Polyolefin resins>

[0043] The sealing resin composition of the present invention comprises a polyolefin resin (hereinafter also referred to as "component (A)"). The polyolefin resin may be used without particular limitation as long as it has a backbone derived from an olefin. It should be noted that the olefin is preferably a monoolefin having one olefinic carbon-carbon double bond and / or a diene having two olefinic carbon-carbon double bonds. Examples of monoolefins preferably include α-olefins such as ethylene, propylene, 1-butene, isobutene, 1-pentene, 1-hexene, 1-heptene, and 1-octene; examples of dienes preferably include 1,3-butadiene, isoprene, 1,3-pentadiene, and 2,3-dimethylbutadiene. One or more monoolefins and dienes may be used. Only one type of polyolefin resin may be used, or two or more types may be used in combination.

[0044] Polyolefin resins can be any of homopolymers, random copolymers, or block copolymers. Furthermore, copolymers can include: (i) copolymers of two or more monoolefins, (ii) copolymers of monoolefins and dienes, or (iii) copolymers of monoolefins with olefinic unsaturated compounds other than olefins (excluding diene monomers), such as unsaturated carboxylic acid esters (e.g., methyl methacrylate) or aromatic vinyl compounds (e.g., styrene).

[0045] Polyolefin resins are preferably polybutene resins and polypropylene resins. Here, "polybutene resin" refers to a resin in which the main unit (the unit with the highest content) of all olefin monomer units constituting the polymer is derived from butene, and "polypropylene resin" refers to a resin in which the main unit (the unit with the highest content) of all olefin monomer units constituting the polymer is derived from propylene.

[0046] It should be noted that when polybutene resins are copolymers, monomers other than butene can include, for example, styrene, ethylene, propylene, and isoprene. When polypropylene resins are copolymers, monomers other than propylene can include, for example, ethylene, butene, and isoprene.

[0047] From the viewpoint of further improving the moisture permeability and other properties of the sealing resin composition, polyolefin resins may include: polyolefin resins having an anhydride group (i.e., carbonyloxycarbonyl group (-CO-O-CO-)) and / or polyolefin resins having an epoxy group. Examples of anhydride groups include groups derived from succinic anhydride, groups derived from maleic anhydride, and groups derived from glutaric anhydride. One or more anhydride groups may be present. Polyolefin resins having anhydride groups are, for example, obtained by grafting an unsaturated compound having an anhydride group onto a polyolefin resin under free radical reaction conditions. Alternatively, an unsaturated compound having an anhydride group may be free radical copolymerized with an olefin. Similarly, polyolefin resins having epoxy groups may be obtained by grafting an unsaturated compound having epoxy groups, such as (meth)acrylate glycidyl ether, 4-hydroxybutyl acrylate glycidyl ether, or allyl glycidyl ether, onto a polyolefin resin under free radical reaction conditions. In addition, unsaturated compounds with epoxy groups can be copolymerized with olefins via free radical polymerization.

[0048] As polyolefin resins containing anhydride groups, polybutene resins and polypropylene resins containing anhydride groups are preferred. Furthermore, as polyolefin resins containing epoxy groups, polybutene resins and polypropylene resins containing epoxy groups are preferred.

[0049] In polyolefin resins containing anhydride groups, the concentration of the anhydride groups in the resin is preferably 0.05–10 mmol / g, more preferably 0.1–5 mmol / g. The concentration of the anhydride groups, according to JIS K2501, is obtained from the acid value, which is defined as the number of mg of potassium hydroxide required to neutralize the acid present in 1 g of resin.

[0050] In polyolefin resins containing epoxy groups, the concentration of epoxy groups in the resin is preferably 0.05–10 mmol / g, more preferably 0.1–5 mmol / g. The epoxy group concentration is determined by the epoxy equivalent based on JIS K7236-1995.

[0051] From the viewpoint of further improving the moisture permeability and other properties of the sealing resin composition, (A) is preferably a polyolefin resin, including polyolefin resins with anhydride groups and polyolefin resins with epoxy groups.

[0052] Such component (A) can form a cross-linked structure by reacting the anhydride groups with the epoxy groups through heating. In this case, when component (A) includes a reactant of a polyolefin resin having anhydride groups and a polyolefin resin having epoxy groups, the resin composition of the present invention can form a sealing layer with further improved moisture permeability and other properties. It should be noted that the formation of the cross-linked structure can also be performed after sealing with the resin composition (i.e., after the sealing layer is formed), but in cases where the device to be sealed, such as an organic EL device, contains heat-sensitive elements, it is ideal to form the cross-linked structure in advance on the resin composition layer formed on the substrate during the manufacture of the sealing sheet.

[0053] (A) When the composition comprises a polyolefin resin having an anhydride group and a polyolefin resin having an epoxy group, the ratio of the epoxy group polyolefin resin to the anhydride group polyolefin resin in the reaction is not particularly limited, provided that a suitable crosslinking structure can be formed. The molar ratio of epoxy group to anhydride group (epoxy group: anhydride group) is preferably 100:10 to 100:400, more preferably 100:25 to 100:350, and particularly preferably 100:40 to 100:300.

[0054] (A) The number-average molecular weight of the component is not particularly limited, but from the viewpoint of providing good coatability of the varnish when the sealing resin composition is processed into a film and good compatibility with other components in the resin composition, it is preferable to be 1,000,000 or less, more preferably 750,000 or less, further preferably 500,000 or less, and even more preferably 400,000 or less. On the other hand, from the viewpoint of preventing depressions when applying the varnish of the sealing resin composition and improving the moisture permeability resistance and mechanical strength of the formed sealing resin composition layer, it is preferable to be 2,000 or more, more preferably 10,000 or more, further preferably 30,000 or more, and particularly preferably 50,000 or more. It should be noted that the number-average molecular weight is determined by gel permeation chromatography (GPC) (polystyrene conversion). The number-average molecular weight determined by GPC can be measured using an LC-9A / RID-6A instrument manufactured by Shimadzu Corporation, a Shodex K-800P / K-804L / K-804L column manufactured by Showa Denko Corporation, and toluene or similar substances as the mobile phase. The measurement is performed at a column temperature of 40°C and calculated using a standard curve of standard polystyrene.

[0055] The following are specific examples of component (A). Specific examples of polypropylene resins include: "T-YP341" (glycidyl methacrylate modified propylene-butene random copolymer, with butene units accounting for 29% of the total propylene and butene units, epoxy group concentration of 0.638 mmol / g, number average molecular weight of 155,000) manufactured by Hoshikō PMC Co., Ltd.; "T-YP279" (maleic anhydride modified propylene-butene random copolymer, with butene units accounting for 36% of the total propylene and butene units, anhydride group concentration of 0.464 mmol / g, number average molecular weight of 35,000) manufactured by Hoshikō PMC Co., Ltd.; and "T-YP276" (glycidyl methacrylate modified propylene-butene random copolymer, with butene units accounting for 36% of the total propylene and butene units, epoxy group concentration of 0.638 mmol / g, number average molecular weight of 155,000) manufactured by Hoshikō PMC Co., Ltd. Examples of butene-butene copolymers include: "T-YP312" (maleic anhydride-modified propylene-butene random copolymer, with butene units comprising 100% by mass of propylene and butene units, 36% by mass, epoxy group concentration, 0.638 mmol / g, number average molecular weight, 57,000), manufactured by Starlight PMC Co., Ltd.; and "T-YP313" (glycidyl methacrylate-modified propylene-butene random copolymer, with butene units comprising 100% by mass of propylene and butene units, 29% by mass, anhydride group concentration, 0.464 mmol / g, number average molecular weight, 60,900), manufactured by Starlight PMC Co., Ltd.

[0056] Specific examples of polybutene resins include: HV-1900 (JX Energy Corporation): polybutene (number average molecular weight: 2900), HV-300M (Toho Chemical Co., Ltd.): maleic anhydride modified liquid polybutene (anhydride concentration: 0.77 mmol / g, number average molecular weight: 2100), BASF's "OPPANOLB100" (polyisobutylene, viscosity average molecular weight: 1,110,000), BASF's "N50SF" (polyisobutylene, viscosity average molecular weight: 400,000), etc.

[0057] The content of component (A) in the sealing resin composition of the present invention is not particularly limited, but from the viewpoints of adhesion and shape retention of the sealing layer as a sealing resin composition, and from the viewpoints of coating and workability (adhesion suppression) during film processing, the content is preferably 50% by mass or less, more preferably 45% by mass or less, and even more preferably 35% by mass or less, relative to 100% by mass of the non-volatile component in the resin composition. Furthermore, the content is preferably 10% by mass or more, more preferably 15% by mass or more, and even more preferably 20% by mass or more, relative to 100% by mass of the non-volatile component in the resin composition.

[0058] Furthermore, when component (A) is in the form of a polyolefin resin having an anhydride group and / or a polyolefin resin having an epoxy group, the amount of the polyolefin resin having an anhydride group and / or the polyolefin resin having an epoxy group is preferably 5 to 90% by mass, more preferably 10 to 80% by mass, and even more preferably 15 to 70% by mass, relative to the total amount of component (A).

[0059] <(B) Hygroscopic fillers>

[0060] The sealing resin composition of the present invention contains a hygroscopic filler (hereinafter also referred to as "component (B)").

[0061] (B) Hygroscopic fillers: Any filler capable of absorbing moisture is acceptable, with no particular limitation. Preferred examples include metal oxides and metal hydroxides. Specifically, examples include metal oxides such as calcium oxide, magnesium oxide, strontium oxide, aluminum oxide, barium oxide, calcined hydrotalcite, and calcined dolomite, and metal hydroxides such as calcium hydroxide, magnesium hydroxide, strontium hydroxide, aluminum hydroxide, barium hydroxide, and semi-calcined hydrotalcite. From the perspective of hygroscopicity, semi-calcined hydrotalcite and calcined hydrotalcite are preferred; from the perspective of transparency, semi-calcined hydrotalcite is preferred.

[0062] The following describes calcined hydrotalcite and semi-calcined hydrotalcite as preferred hygroscopic fillers. Hydrotalcite can be classified into uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite. Particularly from the viewpoint of the transparency and moisture permeability resistance of the resin composition, semi-calcined hydrotalcite is preferred. Uncalcined hydrotalcite, for example, is natural hydrotalcite (Mg6Al2(OH)2). 16 Metal hydroxides with layered crystal structures, such as CO3·4H2O, are examples of metal hydroxides with layered crystal structures, for instance, those consisting of layers [Mg1-] forming the basic framework. X Al X (OH)2] X+ and the intermediate layer [(CO3)] X / 2 ·mH2O] X-Formation. The uncalcined hydrotalcite in this invention is a concept of hydrotalcite-like compounds, including synthetic hydrotalcite and the like. Examples of hydrotalcite-like compounds include compounds represented by the following formulas (I) and (II).

[0063] [M 2+ 1-x M 3+ x (OH)2] x+ ·[(A n- ) x / n ·mH2O] x- (I)

[0064] (where M is in the formula) 2+ Indicates Mg 2+ Zn 2+ divalent metal ions, M 3+ Indicates Al 3+ Fe 3+ Trivalent metal ions, A n- CO3 2- Cl - NO3 - (For anions with the same n-valent valence, 0 < x < 1, 0 ≤ m < 1, and n is a positive number.)

[0065] In formula (I), M 2+ Mg is better 2+ M 3+ Al is better 3+ A n- CO3 is better 2- .

[0066] M 2+ x Al2(OH) 2x+6-nz (A n- ) z ·mH2O(II)

[0067] (where M is in the formula) 2+ Indicates Mg 2+ Zn 2+ Isovalent metal ions, A n- CO3 2- Cl - NO3 - For anions with the same n-valent oxidation state, x is a positive number greater than 2, z is a positive number less than 2, m is a positive number, and n is a positive number.

[0068] In equation (II), M 2+ Mg is better 2+ A n- CO3 is better 2- .

[0069] Semi-calcined hydrotalcite refers to a layered crystal structure of metal hydroxide obtained by calcining uncalcined hydrotalcite, resulting in a reduced or absent amount of interlayer water. If described using a compositional formula, "interlayer water" refers to "H₂O" as recorded in the compositional formula of the aforementioned uncalcined natural hydrotalcite and hydrotalcite-like compounds.

[0070] On the other hand, calcined hydrotalcite refers to a metal oxide with an amorphous structure obtained by calcining uncalcined or semi-calcined hydrotalcite, in which not only the interlayer water disappears but also the hydroxyl groups disappear due to condensation dehydration.

[0071] Uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by their saturated water absorption rate. Semi-calcined hydrotalcite has a saturated water absorption rate of 1% by weight or more but less than 20% by weight. On the other hand, uncalcined hydrotalcite has a saturated water absorption rate of less than 1% by weight, while calcined hydrotalcite has a saturated water absorption rate of 20% by weight or more.

[0072] The aforementioned "saturated water absorption rate" refers to the following: after weighing 1.5g of uncalcined, semi-calcined, or calcined hydrotalcite using a balance and determining its initial mass, the sample is placed in a small environmental test chamber (ESPEC SH-222) set to 60℃ and 90%RH (relative humidity) for 200 hours under atmospheric pressure. The mass increase rate of this 200-hour standing period relative to the initial mass can be calculated using the following formula (i):

[0073] Saturated water absorption rate (mass%) = 100 × (mass after moisture absorption - initial mass) / initial mass (i).

[0074] The saturated water absorption rate of semi-calcined hydrotalcite is preferably above 3% by mass and below 20% by mass, and more preferably above 5% by mass and below 20% by mass.

[0075] Furthermore, uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by the rate of decrease in thermal mass determined using thermogravimetric analysis. Semi-calcined hydrotalcite has a thermal mass decrease rate of less than 15% by mass at 280°C and a thermal mass decrease rate of more than 12% by mass at 380°C. On the other hand, uncalcined hydrotalcite has a thermal mass decrease rate of more than 15% by mass at 280°C, and calcined hydrotalcite has a thermal mass decrease rate of less than 12% by mass at 380°C.

[0076] For thermogravimetric analysis, a Hitachi High-Tech Science TG / DTAEXSTAR 6300 was used. 5 mg of hydrotalcite was weighed into an aluminum sample dish. The sample was taken uncovered and under a nitrogen atmosphere at a flow rate of 200 mL / min, increasing from 30°C to 550°C at a heating rate of 10°C / min. The rate of decrease in thermogravimetric analysis can be calculated using the following equation (ii):

[0077] The rate of decrease in thermal weight (mass%) = 100 × (mass before heating - mass at the specified temperature) / mass before heating (ii).

[0078] Furthermore, uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished based on the peaks and relative intensity ratios determined by powder X-ray diffraction. For semi-calcined hydrotalcite, powder X-ray diffraction shows a split peak or a peak with a shoulder formed by the synthesis of two peaks in the vicinity of 2θ (8–18°). The relative intensity ratio (low-angle diffraction intensity / high-angle diffraction intensity) of the peak or shoulder appearing on the low-angle side (= low-angle side diffraction intensity) to that of the peak or shoulder appearing on the high-angle side (= high-angle side diffraction intensity) is 0.001–1,000. On the other hand, uncalcined hydrotalcite has only one peak in the vicinity of 8–18°, or the relative intensity ratio of the peak or shoulder appearing on the low-angle side to that of the peak or shoulder appearing on the high-angle side falls outside the aforementioned range. Calcined hydrotalcite does not exhibit characteristic peaks in the 8°–18° region, but does have a characteristic peak at 43°. For powder X-ray diffraction (PXRD) measurements, a powder X-ray diffractometer (PANalytical, Empyrean) is used with a CuKα cathode. The diffraction was performed under the following conditions: voltage 45V, current 40mA, sampling width 0.0260°, scanning speed 0.0657° / s, and the diffraction angle range (2θ) was 5.0131–79.9711°. Peak search was performed using the peak search function of the software provided with the diffraction apparatus, under the following conditions: minimum significance 0.50, minimum peak tip 0.01°, maximum peak tip 1.00°, baseline width 2.00°, and the method being the minimum value of the second derivative.

[0079] Specific examples of uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be given as follows:

[0080] • DHT-4C (manufactured by Kyowa Chemical Industry Co., Ltd.): Semi-calcined hydrotalcite (average particle size: 400 nm, BET specific surface area: 15 m²) 2 / g)

[0081] • DHT-4A-2 (manufactured by Kyowa Chemical Industry Co., Ltd.): Semi-calcined hydrotalcite (average particle size: 400 nm, BET specific surface area: 13 m²) 2 / g)

[0082] • KW-2200 (manufactured by Kyowa Chemical Industry Co., Ltd.): Calcined hydrotalcite (average particle size: 400 nm, BET specific surface area: 146 m²)2 / g)

[0083] • DHT-4A (manufactured by Kyowa Chemical Industry Co., Ltd.): Uncalcined hydrotalcite (average particle size: 400 nm, BET specific surface area: 10 m²) 2 / g).

[0084] The average particle size of the hygroscopic filler is not particularly limited, but from the viewpoint of its influence on the sealed object and its resistance to moisture permeation, it is preferably 25 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 5 μm or less, and most preferably 1 μm or less. On the other hand, from the viewpoint of the dispersibility of the hygroscopic filler and the viscosity of the resin composition, the average particle size is preferably 0.001 μm or more, more preferably 0.01 μm or more, and further preferably 0.1 μm or more.

[0085] The average particle size of hygroscopic fillers can be determined using laser diffraction scattering based on the Mie scattering theory. Specifically, the particle size distribution of the hygroscopic filler can be prepared on a volume basis using a laser diffraction particle size distribution measuring device, and the median particle size can be used as the average particle size for measurement. The sample used for measurement is preferably a sample obtained by dispersing the hygroscopic filler in water using ultrasound. As a laser diffraction particle size distribution measuring device, the LA-500 manufactured by Horiba Corporation can be used.

[0086] It should be noted that, in hygroscopic fillers, the average particle size of hydrotalcite is preferably 1–1000 nm, and more preferably 10–800 nm. The average particle size of hydrotalcite is the median particle size of the particle size distribution when the particle size distribution is prepared on a volume basis by laser diffraction scattering particle size distribution determination (JIS Z8825).

[0087] Furthermore, among hygroscopic fillers, hydrotalcite has a preferred BET specific surface area of ​​1–250 m². 2 / g, preferably 5-200m 2 / g. The BET specific surface area of ​​hydrotalcite can be calculated using the BET method by using a specific surface area measuring device (Macsorb HM1210 type, manufactured by MOUNTECH Corporation) to adsorb nitrogen onto the sample surface and then using the BET multi-point method.

[0088] (B) The component may be a material that has been surface-treated with a surface treatment agent. As a surface treatment agent, for example, higher fatty acids, alkyl silanes, silane coupling agents, etc., may be used, with higher fatty acids and alkyl silanes being preferred. One or more surface treatment agents may be used.

[0089] Examples of higher fatty acids include stearic acid, linalic acid, myristic acid, and palmitic acid, which have 18 or more carbon atoms, with stearic acid being preferred. One or more of these can be used. Examples of alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, dimethyldimethoxysilane, octyltriethoxysilane, and n-octadecyldimethyl(3-(trimethoxysilyl)propyl)ammonium chloride. One or more of these can be used. Examples of silane coupling agents include epoxy-based silane coupling agents such as 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropyltriethoxysilane, 3-epoxypropoxypropyl(dimethoxy)methylsilane, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; mercapto-based silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 11-mercaptoundecyltrimethoxysilane; and thiol-based silane coupling agents such as 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and N-(2- Amino-based silane coupling agents such as (aminoethyl)-3-aminopropyldimethoxymethylsilane; urea-based silane coupling agents such as 3-ureapropyltriethoxysilane; vinyl-based silane coupling agents such as vinyltrimethoxysilane, vinyltriethoxysilane, and vinylmethyldiethoxysilane; styryl-based silane coupling agents such as p-styryltrimethoxysilane; acrylate-based silane coupling agents such as 3-acryloyloxypropyltrimethoxysilane and 3-methacryloyloxypropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanate-propyltrimethoxysilane; sulfide-based silane coupling agents such as bis(triethoxysilylpropyl)disulfide and bis(triethoxysilylpropyl)tetrasulfide; phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazole silane, triazine silane, etc. One or more of these can be used in combination.

[0090] Surface treatment of component (B) can be performed, for example, by mixing the untreated component (B) at room temperature using a mixer while simultaneously spraying in a surface treatment agent and mixing for 5 to 60 minutes. Known mixers can be used, such as V-type mixers, belt mixers, double-cone mixers, Henschel mixers, concrete mixers, ball mills, and cutter mills. Alternatively, when pulverizing hygroscopic materials using a ball mill, a method of mixing and surface treating with the aforementioned higher fatty acids, alkylsilanes, or silane coupling agents can be employed. The amount of surface treatment agent varies depending on the type of component (B) or the type of surface treatment agent; preferably, it is 1 to 10 parts by mass relative to 100 parts by mass of component (B).

[0091] From the viewpoint of moisture permeability, the content of component (B) in the resin composition is higher than 45% by mass relative to 100% by mass of the non-volatile components in the resin composition. This content is preferably 46% by mass or more, more preferably 48% by mass or more, and even more preferably 50% by mass or more. There is no particular upper limit to this content as long as the effects of the present invention are achieved, but from the viewpoint of the adhesiveness and transparency of the resin composition, it is preferably 80% by mass or less, more preferably 75% by mass or less, and even more preferably 70% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition.

[0092] <(C) Metal Complexes>

[0093] The resin composition of the present invention comprises a metal complex (hereinafter also referred to as "(C) component"). As the (C) metal complex in the present invention, a metal complex is formed by combining a bidentate ligand with two oxygen atoms and a monodentate ligand with an oxygen atom with a central metal.

[0094] In this invention, a metal complex is a type of chemical substance formed by bonding other atoms, molecules, or ions to a metal atom or ion. A ligand, on the other hand, refers to a molecule or ion bonded to a metal atom or ion. Furthermore, the atom directly involved in this bonding is called a coordinating atom; a ligand with two coordinating atoms is called a bidentate ligand; and a ligand with one coordinating atom is called a monodentate ligand.

[0095] (C) There are no particular limitations on the composition. Any metal complex with a structure consisting of a bidentate ligand (hereinafter also referred to as "oxygen-bidentate ligand") with two oxygen atoms as coordinating atoms and a monodentate ligand (hereinafter also referred to as "oxygen-monodentate ligand") with an oxygen atom as coordinating a central metal can be used. Known metal complexes that satisfy this structure can be used. Preferably, the central metal is a metal from the 2nd to 6th period of the periodic table. More preferably, the central metal is a metal from the 3rd to 5th period. Even more preferably, the central metal is Al, Ti, Mn, Fe, Co, Ni, Cu, Zn, Ge, Zr, In, or Sn. Even more preferably, the central metal is Al, Ti, or Zr. From the viewpoint of the transparency of the resin composition, metal complexes with Al (aluminum) or Ti (titanium) as the central metal are particularly preferred. One or more of the components (C) can be used.

[0096] Examples of oxygen-bident ligands include compounds represented by the following formula (a).

[0097] [Chemical Formula 2]

[0098]

[0099] In equation (a), R1, R2, and R3 have the same meaning as the corresponding symbols in equation (1) described later.

[0100] The compound represented by formula (a) represents an oxygen-bident ligand coordinated before the central metal. It should be noted that in this invention, oxygen-bident ligands in the state coordinated to the central metal and oxygen-bident ligands coordinated before the central metal are sometimes referred to as "oxygen-bident ligands" without special distinction. Specific examples of the compound represented by formula (a) have the same meaning as specific examples of oxygen-bident ligands in metal complexes represented by formula (1) described later.

[0101] Examples of oxygen-monodentate ligands include alkoxide anions (ROA). - ), carboxylate anion (RCOO) - Examples of oxygen-monopalatine ligands are also the same as those in the metal complexes represented by formula (1) described later. It should be noted that in this invention, oxygen-monopalatine ligands in the state of being coordinated with the central metal and oxygen-monopalatine ligands coordinated before the central metal (alcohols (ROH), carboxylic acids (RCOOH)) are sometimes referred to as "oxygen-monopalatine ligands" without special distinction.

[0102] Furthermore, in the metal complex of component (C), the number of oxygen-bident ligands is 1 or more, preferably 1 or more and 3 or less, more preferably 2. When there are multiple oxygen-bident ligands, they can be the same ligand or different ligands, preferably the same ligand. Additionally, the number of oxygen-monopent ligands is 1 or more, preferably 1 or more and 3 or less, more preferably 2 or 3. When there are multiple oxygen-monopent ligands, they can be the same ligand or different ligands, preferably the same ligand.

[0103] (C) The composition is preferably a metal complex represented by the following general formula (1) (hereinafter also referred to as the metal complex of formula (1)).

[0104] [Chemical Formula 3]

[0105]

[0106] In equation (1),

[0107] M is the central metal of the metal complex, representing a metal from period 2 to period 6 of the periodic table. Preferably, it is a metal from period 3 to period 5, more preferably Al, Ti, Mn, Fe, Co, Ni, Cu, Zn, Ge, Zr, In, or Sn, even more preferably Al, Ti, or Zr, and particularly preferably Al (aluminum) or Ti (titanium).

[0108] R1 and R3 each independently represent a hydrogen atom, alkyl group, alkoxy group, aryl group, or aralkyl group;

[0109] R2 represents a hydrogen atom, alkyl group, alkoxy group, alkoxycarbonyl group, aryl group, or aralkyl group;

[0110] X represents oxygen-monodentate ligand.

[0111] The solid line between the oxygen atom (O) and M in [] represents a covalent bond, and the dashed line between the oxygen atom (O) and M in [] represents a coordinate bond.

[0112] m is an integer of 3 or 4, n is an integer from 1 to 3, and m > n.

[0113] The alkyl groups in R1, R2, and R3 can be either straight-chain or branched. The alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 10, and particularly preferably 1 to 6. Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, neopentyl, 1-ethylpropyl, hexyl, isohexyl, 1,1-dimethylbutyl, 2,2-dimethylbutyl, 3,3-dimethylbutyl, and 2-ethylbutyl. The alkyl group may optionally have a substituent. Examples of substituents include halogen atoms, hydroxyl groups, and optionally substituent-containing amino groups.

[0114] Examples of halogen atoms mentioned above include fluorine, chlorine, bromine, and iodine atoms. Examples of amino groups optionally having substituents mentioned above include amino groups, mono- or dialkylamino groups (e.g., methylamino, dimethylamino, ethylamino, diethylamino, propylamino, dibutylamino), mono- or dicycloalkylamino groups (e.g., cyclopropylamino, cyclohexylamino), mono- or diarylamino groups (e.g., phenylamino), mono- or diarylalkylamino groups (e.g., benzylamino, dibenzylamino), heterocyclic amino groups (e.g., pyridylamino), etc.

[0115] The alkoxy groups in R1, R2, and R3 are preferably alkoxy groups with 1 to 6 carbon atoms, such as methoxy, ethoxy, propoxy, isopropoxy, butoxy, isobutoxy, sec-butoxy, tert-butoxy, pentoxy, and hexoxy. The alkoxy group may optionally have a substituent. Examples of such substituents include halogen atoms, hydroxyl groups, and amino groups that may optionally have a substituent. Specific examples of halogen atoms and amino groups that may optionally have a substituent are the same as described above.

[0116] The aryl group in R1, R2, and R3 preferably has 6 to 18 carbon atoms, and more preferably 6 to 14. Examples of aryl groups include phenyl, 1-naphthyl, 2-naphthyl, 1-anthrayl, 2-anthrayl, and 9-anthrayl. The aryl group may optionally have a substituent. Examples of such substituents include halogen atoms, hydroxyl groups, alkyl groups optionally with substituents, alkenyl groups optionally with substituents, alkynyl groups optionally with substituents, and amino groups optionally with substituents.

[0117] The alkenyl group described above can be either linear or branched. The alkenyl group preferably has 2 to 10 carbon atoms, more preferably 2 to 6. Examples include ethenyl, 1-propenyl, 2-propenyl, 2-methyl-1-propenyl, 1-butenyl, 2-butenyl, 3-butenyl, 3-methyl-2-butenyl, 1-pentenyl, 2-pentenyl, 3-pentenyl, 4-pentenyl, 4-methyl-3-pentenyl, 1-hexenyl, 3-hexenyl, 5-hexenyl, etc. As optional substituents, examples include halogen atoms, hydroxyl groups, and optional substituents such as amino groups. Specific examples of halogen atoms and optional substituents such as amino groups are the same as described above.

[0118] The aforementioned alkynyl group can be either straight-chain or branched. The number of carbon atoms in the alkynyl group is preferably 2 to 10, more preferably 2 to 6. Examples include ethynyl, 1-propynyl, 2-propynyl, 1-butynyl, 2-butynyl, 3-butynyl, 1-pentynyl, 2-pentynyl, 3-pentynyl, 4-pentynyl, 1-hexynyl, 2-hexynyl, 3-hexynyl, 4-hexynyl, 5-hexynyl, 4-methyl-2-pentynyl, etc. As optional substituents of the alkynyl group, examples include halogen atoms, hydroxyl groups, and amino groups optionally substituented. Specific examples of halogen atoms and amino groups optionally substituented are the same as described above.

[0119] The aralkyl group in R1, R2, and R3 preferably has 7 to 16 carbon atoms. Examples include benzyl, phenethyl, naphthylmethyl, and phenylpropyl. The aralkyl group may optionally have substituents. Examples of substituents include halogen atoms, hydroxyl groups, and amino groups that may optionally have substituents. Specific examples of halogen atoms and amino groups that may optionally have substituents are the same as described above.

[0120] The alkoxycarbonyl group in R2 is preferably an alkoxycarbonyl group having 1 to 6 carbon atoms in the alkoxy group, such as methoxycarbonyl, ethoxycarbonyl, propoxycarbonyl, isopropoxycarbonyl, butoxycarbonyl, isobutoxycarbonyl, sec-butoxycarbonyl, tert-butoxycarbonyl, pentoxycarbonyl, hexoxycarbonyl, etc. The alkoxycarbonyl group may optionally have a substituent. Examples of such substituents include halogen atoms, hydroxyl groups, and amino groups that may optionally have a substituent. Specific examples of halogen atoms are the same as those for halogen atoms substituting alkyl groups described above, and specific examples of amino groups that may optionally have a substituent are the same as those for amino groups that may optionally have a substituent alkyl groups described above.

[0121] In the formula, the oxygen-monodentate ligand represented by X is usually a Brønsted acid ( Conjugate bases of (acids) can be exemplified by, for example, alkoxide anions (RO). - ), carboxylate anion (RCOO) - )wait.

[0122] Alkyl salt anion (RO) - In the organic group R, it can be either an aliphatic group or an aromatic group. Furthermore, the aliphatic group can be either a saturated aliphatic group or an unsaturated aliphatic group. The organic group R preferably has 1 to 20 carbon atoms, more preferably 1 to 10, and particularly preferably 1 to 6. As an alkoxide anion (RO... - Examples of such salts include methanol salts, ethanol salts, propanol salts, isopropanol salts, butanol salts, isobutanol salts, sec-butanol salts, tert-butanol salts, pentanol salts, and hexanol salts.

[0123] Carboxylate anion (RCOO) -In the organic group R, it can be either an aliphatic group or an aromatic group. Furthermore, the aliphatic group can be either a saturated aliphatic group or an unsaturated aliphatic group. The organic group R preferably has 1 to 20 carbon atoms, more preferably 1 to 10, and particularly preferably 1 to 6. As a carboxylate anion (RCOO... - Examples of carboxylate anions can be found, such as those corresponding to carboxylic acids like acetic acid, propionic acid, and benzoic acid.

[0124] The brackets [] in the formula represent oxygen-bident ligands. Specific examples of oxygen-bident ligands include: acetylacetone, 3-methyl-2,4-pentanedione, acetoacetaldehyde, 2,4-hexanedione, 2,4-heptanedione, 5-methyl-2,4-hexanedione, 5,5-dimethyl-2,4-hexanedione, benzoylacetone, benzoylacetophenone, salicylaldehyde, 1,1,1-trifluoroacetylacetone, 1,1,1,5,5,5-hexafluoroacetylacetone, 3-methoxy-2,4-pentanedione, 3-cyano-2,4-pentanedione, 3-nitro-2,4-pentanedione, 3-chloro-2,4-pentanedione, acetoacetic acid, methyl acetoacetate, ethyl acetoacetate, propyl acetoacetate, salicylic acid, methyl salicylate, malonic acid, dimethyl malonate, diethyl malonate, etc. When coordinated to a central metal, the oxygen-bident ligand becomes the structure obtained by removing one or more protons from it.

[0125] Specific examples of metal complexes represented by formula (1) can be given as follows. Examples of metal complexes with Al (aluminum) as the central metal can be given as alkyl aluminum diisopropyl acetoacetate (9-octadecynyl aluminum diisopropyl acetoacetate), ethyl aluminum diisopropyl acetoacetate, ethyl aluminum di-n-butyl acetoacetate, propyl aluminum diisopropyl acetoacetate, n-butyl aluminum diisopropyl acetoacetate, etc.

[0126] In addition, examples of metal complexes with Ti (titanium) as the central metal M include allyl titanium triisopropyl acetoacetate, di-n-butoxy (bis-2,4-pentanedione acid) titanium, diisopropoxy bis (tetramethylheptanedione acid) titanium, diisopropoxy bis (ethoxyacetyl) titanium, cresol titanium, and bis (pentanedione) titanium oxide.

[0127] In addition, examples of metal complexes with Zr (zirconium) as the central metal M include allyl zirconium acetoacetate triisopropyl ester, di-n-butoxy (bis-2,4-pentanedione) zirconium, diisopropoxy (bis-2,4-pentanedione) zirconium, diisopropoxy bis (tetramethylheptanedione) zirconium, diisopropoxy bis (ethoxyacetoacetate) zirconium, zirconium butoxy (acetoacetate) (bisethoxyacetoacetate) zirconium, and tributoxy monoacetylacetone zirconium, etc.

[0128] The content of component (C) in the resin composition is not particularly limited. From the viewpoint of the adhesiveness and transparency of the resin composition, it is preferably 0.1% by mass or more, and more preferably 0.3% by mass or more, relative to 100% by mass of the non-volatile components in the resin composition. Furthermore, from the viewpoint of easily suppressing the influence of released gases from component (C) on the sealed object, this content is preferably 5% by mass or less, and more preferably 3% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition.

[0129] In one embodiment of the present invention, the content of component (C) in the resin composition of the present invention is preferably 0.1 to 5% by mass, and more preferably 0.3 to 3% by mass, relative to 100% by mass of the non-volatile components in the resin composition.

[0130] Even when incorporating metal complexes that differ from the components of (C) of this invention (e.g., metal complexes in which oxygen-bident ligands are bound to a central metal but not to an oxygen-monodentate ligand; metal complexes in which oxygen-monodentate ligands are bound to a central metal but not to an oxygen-bidentate ligand), the desired resin composition possessing excellent adhesion, transparency, and moisture permeability cannot be achieved. While the reasons may not be clear, they can be speculated as follows: For the metal complex having a structure in which oxygen-bidate ligands and oxygen-monodentate ligands are bonded to the central metal as component (C) of the present invention, since it has oxygen-monodentate ligands that are easily hydrolyzed, it is easy to modify the surface of the hygroscopic filler as component (B), and component (B) can be fully dispersed in the resin composition. Furthermore, if the resin composition is applied to the sealing object, the oxygen-bidate ligands chelate and exchange with the functional groups on the surface of glass, plastic, inorganic film, etc., present on the surface of the sealing object, resulting in a strong bond. Even when component (B) is incorporated in a high content, a resin composition with excellent moisture resistance, adhesion, and transparency is formed.

[0131] <(D) Tackifier>

[0132] The sealing resin composition of the present invention contains a tackifier (hereinafter also referred to as "(D) component").

[0133] There are no particular limitations on the tackifier, but examples include terpene resins, terpene phenol resins, rosin resins, hydrogenated terpene resins, aromatic modified terpene resins, coumarone resins, indene resins, and petroleum resins (aliphatic petroleum resins, hydrogenated alicyclic petroleum resins, aromatic petroleum resins, aliphatic-aromatic copolymer petroleum resins, alicyclic petroleum resins, dicyclopentadiene (hereinafter also referred to as "DCPD") petroleum resins, hydrogenated dicyclopentadiene petroleum resins, etc.). From the viewpoint of adhesion and transparency, dicyclopentadiene petroleum resins and hydrogenated dicyclopentadiene petroleum resins are preferred, and hydrogenated dicyclopentadiene petroleum resins are particularly preferred.

[0134] The content of component (D) in the resin composition is not particularly limited. From the viewpoint of the adhesive properties of the resin composition, it is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 15% by mass or more, relative to 100% by mass of the non-volatile components in the resin composition. Furthermore, from the viewpoint of adhesive stability in the high-temperature range, this content is preferably 40% by mass or less, more preferably 30% by mass or less, and even more preferably 25% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition.

[0135] In one embodiment of the present invention, the content of component (D) in the resin composition of the present invention is preferably 5 to 40% by mass relative to 100% by mass of the non-volatile component in the resin composition, more preferably 10 to 30% by mass, and even more preferably 15 to 25% by mass.

[0136] <(E) Additives>

[0137] The following additives may be incorporated into the resin composition of the present invention, without impairing the effects of the invention: mineral oil softeners, vegetable oil softeners, styrofoams, fatty acids, fatty acid salts, synthetic organic compounds, synthetic oils, etc.; curing agents; organic fillers such as rubber particles, silicone powder, nylon powder, fluororesin powder, etc.; defoamers or leveling agents such as silicone, fluorine, and polymers; binding agents such as triazole compounds, thiazole compounds, triazine compounds, and porphyrin compounds; thickeners such as Orben and Benton; antioxidants; heat stabilizers; and light stabilizers. In addition, inorganic fillers other than hygroscopic fillers may also be incorporated. Examples of such inorganic fillers include silica, mica, alumina, barium sulfate, talc, clay, mica powder, calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium dioxide, barium zirconate, and calcium zirconate.

[0138] <(F) Curing agent and / or curing accelerator>

[0139] For the resin composition of the present invention, for example, in the case of containing epoxy-based polyisobutylene resins, a curing agent and / or a curing accelerator may be included. Only one curing agent and / or curing accelerator may be used, or two or more may be used in combination. Examples of curing agents include imidazole compounds, tertiary amines or quaternary ammonium compounds, dimethylurea compounds, organophosphorus compounds, primary or secondary amine compounds, etc. Examples of curing accelerators include imidazole compounds, tertiary amines or quaternary ammonium compounds, dimethylurea compounds, organophosphorus compounds, etc.

[0140] Examples of imidazole compounds used as curing agents and / or curing accelerators in this invention include 1H-imidazolium, 2-methylimidazolium, 2-phenyl-4-methylimidazolium, 2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 2-undecylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-undecylimidazolium ontyltriazine, 2,4-diamino-6-(2'-undecylimidazolyl-(1'))-ethyl-triazine, 2-phenyl-4,5-bis(hydroxymethyl)imidazolium, 1-benzyl-2-methylimidazolium, 1-benzyl-2-phenylimidazolium, 2-phenylimidazolium, 2-dodecylimidazolium, 2-heptadecanylimidazolium, 1,2-dimethylimidazolium, etc. Imidazoles, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 2,4-diamino-6-(2'-methylimidazolyl-(1')-ethyl-triazine, 2,4-diamino-6-(2'-methylimidazolyl-(1'))-ethyl-triazine isocyanuric acid adducts, etc. Specific examples of imidazole compounds include Curezol2MZ, 2P4MZ, 2E4MZ, 2E4MZ-CN, C11Z, C11Z-CN, C11Z-CNS, C11Z-A, 2PHZ, 1B2MZ, 1B2PZ, 2PZ, C17Z, 1.2DMZ, 2P4MHZ-PW, 2MZ-A, 2MA-OK (all manufactured by Shikoku Chemical Industry Co., Ltd.), etc.

[0141] Regarding the tertiary amine or quaternary ammonium compounds used as curing agents and / or curing accelerators in this invention, there are no particular limitations. Examples include quaternary ammonium salts such as tetramethylammonium bromide and tetrabutylammonium bromide; diazabicyclic compounds such as DBU (1,8-diazabicyclo[5.4.0]undecene-7), DBN (1,5-diazabicyclo[4.3.0]nonene-5), DBU-phenol salts, DBU-octanoate, DBU-p-toluenesulfonate, DBU-formate, and DBU-phenol phenolic varnish resin salts; tertiary amines such as benzyl dimethylamine, 2-(dimethylaminomethyl)phenol, and 2,4,6-tris(dimethylaminomethyl)phenol (TAP) and their salts, and dimethylurea compounds such as aromatic dimethylurea and aliphatic dimethylurea.

[0142] Examples of primary or secondary amine compounds used as curing agents in this invention include: aliphatic amines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine, 1,3-diaminomethylcyclohexane, dipropylenediamine, diethylaminopropylamine, bis(4-aminocyclohexyl)methane, norbornenediamine, and 1,2-diaminocyclohexane; alicyclic amines such as N-aminoethylpiperazine and 1,4-bis(3-aminopropyl)piperazine; and aromatic amines such as diaminodiphenylmethane, m-phenylenediamine, m-phenylenediamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, and diethyltoluenediamine. Specific examples of primary or secondary amine compounds include KAYAHARDA-A (manufactured by Nippon Kayaku Co., Ltd.: 4,4'-diamino-3,3'-dimethyldiphenylmethane).

[0143] Specific examples of dimethylurea compounds used as curing agents and / or curing accelerators in this invention include aromatic dimethylureas such as DCMU (3-(3,4-dichlorophenyl)-1,1-dimethylurea) and U-CAT3512T (manufactured by San-Apro Corporation), and aliphatic dimethylureas such as U-CAT3503N (manufactured by San-Apro Corporation). From the perspective of curability, aromatic dimethylureas are preferred.

[0144] Examples of organophosphorus compounds used as curing agents and / or curing accelerators in this invention include: triphenylphosphine, tetraphenylphosphine tetratolylborate, tetraphenylphosphine tetraphenylborate, tri-tert-butylphosphine tetraphenylborate, (4-methylphenyl)triphenylphosphine thiocyanate, tetraphenylphosphine thiocyanate, butyltriphenylphosphine thiocyanate, triphenylphosphine triphenylborane, etc. Specific examples of organophosphorus compounds include TPP, TPP-MK, TPP-K, TTPub-K, TPP-SCN, and TPP-S (manufactured by Hokuko Chemical Industry Co., Ltd.).

[0145] The content of curing agent and / or curing accelerator in the resin composition is not particularly limited. From the viewpoint of preventing a decrease in the transparency, etc., of the sealing layer (resin composition layer), it is preferably 5% by mass or less, and more preferably 1% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition. On the other hand, from the viewpoint of suppressing the stickiness of the sealing layer, this content is preferably 0.0005% by mass or more, and more preferably 0.001% by mass or more, relative to 100% by mass of the non-volatile components in the resin composition.

[0146] <(G) Organic Solvents>

[0147] From the viewpoint of coating properties of the resin composition when preparing a sealing sheet on which a layer of resin composition is formed on a support described later, for example, an organic solvent can be incorporated into the resin composition of the present invention. Examples of organic solvents include ketones such as acetone, methyl ethyl ketone (hereinafter also referred to as "MEK"), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, cellolytic acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellolytic agents and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; and dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. Only one organic solvent may be used, or two or more may be used in combination. The amount of organic solvent is not particularly limited, but from the viewpoint of coating properties, it is preferable to use an amount such that the viscosity (25°C) of the resin composition is 300 to 2000 mPa·s.

[0148] <Method for manufacturing resin composition>

[0149] The resin composition of the present invention can be manufactured by mixing the above-mentioned components (including at least components (A) to (D)) using a mixing roller or a rotary mixer.

[0150] <Sealing Sheets>

[0151] For example, the resin composition of the present invention, which is made into a varnish by incorporating an organic solvent, is coated onto a support, and the resulting coating is dried by heating or blowing hot air, thereby obtaining a sealing sheet, which is a sheet on which a layer of the resin composition of the present invention is formed on the support. In the case of a sealing sheet prepared by using a resin composition in which a polyolefin resin having an anhydride group and a polyolefin resin having an epoxy group are included as component (A), during its preparation, the anhydride group and the epoxy group are reacted in advance to form a cross-linked structure, thereby improving the moisture permeability resistance of the resin composition layer and obtaining a sealing sheet with higher sealing performance (barrier performance against moisture and oxygen in the air, etc.).

[0152] Examples of supports for sealing sheets include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride; polyesters such as polyethylene terephthalate (hereinafter sometimes simply referred to as "PET") and polyethylene naphthalate; and plastic films such as polycarbonate and polyimide. PET is particularly preferred as a plastic film. Alternatively, the support can be a metal foil such as aluminum foil, stainless steel foil, or copper foil. The support can be pre-treated with a matte finish, corona treatment, and a release treatment (hereinafter, "support treated with a release treatment" will also be referred to as a "peelable support"). Examples of release treatments include those using silicone resin release agents, alkyd resin release agents, and fluoropolymer release agents. In the present invention, when the support has a release layer, this release layer is also considered part of the support. The thickness of the support is not particularly limited, but from an operability point of view, 20–200 μm is preferred, and 20–125 μm is more preferably.

[0153] A peelable support is a support on one side of the layer forming the resin composition of the present invention that has undergone a demolding treatment. It is a support that is peeled off before the sealing sheet is actually used to form a sealing structure. Therefore, moisture resistance is not necessary for a peelable support, but it is preferable to have moisture resistance from the viewpoint of preventing moisture from penetrating the layer of the resin composition during storage before the sealing sheet is supplied for sealing. To improve the moisture resistance of the sealing sheet, a plastic film with a barrier layer can be used as a support (hereinafter, the plastic film with the barrier layer will also be referred to as a "moisture-resistant support"). Examples of such barrier layers include nitrides such as silicon nitride, oxides such as aluminum oxide, stainless steel foil, and aluminum foil. Examples of such plastic films include the aforementioned plastic films. Commercially available plastic films with a barrier layer can be used. Alternatively, the moisture-resistant support can also be a film formed by laminating a metal foil and a plastic film together. For example, commercially available polyethylene terephthalate (PET) films with aluminum foil include "AL1N30 with PET" manufactured by Tokai Toyo Aluminum Sales Co., Ltd., and "AL3025 with PET" manufactured by Fukuda Metals Co., Ltd. Alternatively, a multi-layered support structure with two or more layers can be used, such as a support formed by bonding the aforementioned plastic film and metal foil together with an adhesive. This is inexpensive and advantageous from a processing point of view.

[0154] In sealing sheets, the resin composition layer can be protected with a protective film. Protecting the surface of the resin composition layer with a protective film prevents contamination or damage. Preferably, the protective film is the same plastic film as the support. Furthermore, the protective film may be pre-treated with a matte finish, corona treatment, and release treatment. The thickness of the protective film is not particularly limited, typically ranging from 1 to 150 μm, preferably from 10 to 100 μm.

[0155] For sealing sheets, if a moisture-proof and highly permeable support is used as the support, a sealing structure with high moisture resistance can be formed by laminating the sealing sheet onto the object being sealed. Examples of such moisture-proof and highly permeable supports include plastic films with inorganic materials such as silicon dioxide, silicon nitride, SiCN, and amorphous silicon deposited on their surfaces. Examples of plastic films include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride; polyesters such as polyethylene terephthalate and polyethylene naphthalate; polycarbonate; and polyimide. PET is particularly preferred as a plastic film. Examples of commercially available moisture-proof plastic films include the TECHBARRIER HX, AX, LX, and L series (manufactured by Mitsubishi Resin Corporation), and the X-BARRIER (manufactured by Mitsubishi Resin Corporation), which further improves moisture resistance. Multi-layer supports with two or more layers can also be used as supports.

[0156] It should be noted that in the case of a sealing sheet with a peelable support, the support can be peeled off after the sealing sheet is laminated to the object being sealed, and a separately prepared sealing substrate (a moisture-proof plastic film, copper foil, aluminum foil, or other metal foil) can be laminated.

[0157] A circular polarizer can be used as the support for the sealing sheet of the present invention. Typically, a circular polarizer consists of a polarizer and a quarter-wave plate. When using a circular polarizer as a support, the quarter-wave plate is usually positioned on the resin composition layer side. Alternatively, when using a support that includes both a circular polarizer and a moisture-proof support, it is preferable to position the moisture-proof support on the resin composition layer side and position the quarter-wave plate of the circular polarizer on the moisture-proof support side. The moisture-proof support and the circular polarizer can be bonded together with an adhesive, etc. There are no particular limitations on the adhesive; any highly transparent adhesive is acceptable, such as acrylic adhesives or polyvinyl alcohol adhesives.

[0158] It should be noted that a protective film for the polarizer (polarizer) can be provided in the circular polarizer. The protective film can also be a known protective film, such as the protective film described in Japanese Patent Application Publication No. 2016-105166 and International Publication No. 2014 / 003189.

[0159] In the sealing sheet of the present invention, the support body is preferably composed of at least one selected from a peelable support body, a moisture-proof support body, and a circular polarizer.

[0160] <Electronic Devices>

[0161] When sealing electronic devices with the resin composition of the present invention, it is preferable to use the sealing sheet described above. That is, by laminating the sealing sheet of the present invention onto the electronic device portion where the sealing structure is provided, an electronic device sealed with the sealing resin composition of the present invention can be obtained.

[0162] The sealing resin composition of the present invention is suitable for use as a sealing resin composition for electronic devices, especially for electronic devices such as organic EL devices and solar cells that require these properties, because it has excellent moisture permeability resistance, adhesion and transparency.

[0163] Example

[0164] The following examples illustrate the invention in more detail, but the invention is not limited to these examples. It should be noted that, unless otherwise specified, "parts" and "%" in the following description of the amounts of components and copolymer units refer to "parts by mass" and "% by mass," respectively.

[0165] The raw materials used in the examples and comparative examples are described below;

[0166] (A) Polyolefin resins

[0167] • T-YP312 (manufactured by Starlight PMC Co., Ltd.): A 40% toluene solution of maleic anhydride-modified propylene-butene copolymer (propylene unit / butene unit = 71% / 29%, anhydride group concentration: 0.464 mmol / g, number average molecular weight: 60900).

[0168] • T-YP313 (manufactured by Starlight PMC Co., Ltd.): A 40% toluene solution of glycidyl methacrylate-modified propylene-butene copolymer (propylene unit / butene unit = 71% / 29%, epoxy group concentration: 0.638 mmol / g, number average molecular weight: 155000).

[0169] • T-YP341 (manufactured by Starlight PMC Co., Ltd.): A 20% silicone solution of glycidyl methacrylate-modified propylene-butene random copolymer (propylene unit / butene unit = 71% / 29%, glycidyl group concentration: 0.638 mmol / g, number average molecular weight: 155000).

[0170] HV-1900 (JX Energy Corporation): Polybutene (number average molecular weight: 2900)

[0171] • HV-300M (manufactured by Toho Chemical Industry Co., Ltd.): Maleic anhydride modified liquid polybutene (anhydride concentration: 0.77 mmol / g, number average molecular weight: 2100).

[0172] (B) Hygroscopic fillers

[0173] • DHT-4C (manufactured by Kyowa Chemical Industry Co., Ltd.): Semi-calcined hydrotalcite (abbreviated as "semi-calcined HT" in Table 1) (average particle size: 400 nm, BET specific surface area: 15 m²) 2 / g).

[0174] (C) Metal complexes

[0175] ·Alumichelate(アルミキレート)M (manufactured by Kawaken Fine Chemicals Co., Ltd.): Alkylaluminum diisopropyl acetoacetate

[0176] ·KR38S (manufactured by Ajinomoto Fine-Techno Co., Ltd.): Isopropyltris(dioctylpyrophosphateacyloxy)titanate

[0177] • ORGATIX ZC540 (manufactured by Matsumoto Fine Chemical Co., Ltd.): Tributyloxymonoacetylacetone Zirconium

[0178] ·ORGATIXZC320 (manufactured by Matsumoto Fine Chemical Co., Ltd.): zirconium stearate.

[0179] (D) Tackifier

[0180] ARKONP125 (manufactured by Arakawa Chemical Co., Ltd.): A saturated hydrocarbon resin containing a cyclohexane ring, softening point 125℃.

[0181] ·T-REZHA125 (manufactured by Tonen Zeneral Co., Ltd.): hydrogenated DCPD type hydrocarbon resin (softening point 125℃).

[0182] (F) Curing agent

[0183] • Amine curing accelerator (2,4,6-tris(dimethylaminomethyl)phenol, hereinafter referred to as "TAP").

[0184] (G) Organic solvents

[0185] Toluene.

[0186] other

[0187] •Swasol#1000 (manufactured by Maruzen Petroleum Co., Ltd.): Aromatic mixed solvent.

[0188] After preparing the varnish of the resin composition according to the proportions shown in Table 1 using the following steps, a sealing sheet was produced; <Example 1>

[0189] To 77 parts of a cyclohexane-containing saturated hydrocarbon resin (ARKONP125, 60% Swasol solution), 35 parts of maleic anhydride-modified liquid polyisobutylene (HV-300M), 60 parts of polybutene (HV-1900), 1.5 parts of alkyl aluminum acetoacetate diisopropyl ester (Alumichelate M), and 270 parts of semi-calcined hydrotalcite (DHT-4C) were dispersed using a three-roll mill to obtain a mixture. To the obtained mixture, 40 parts of glycidyl methacrylate-modified polypropylene-polybutene copolymer (T-YP341, 20% silicone solution), 0.5 parts of amine curing accelerator (TAP), and 170 parts of toluene were incorporated, and the mixture was uniformly dispersed using a high-speed rotary mixer to obtain a varnish of the resin composition. The varnish is evenly applied to the release surface of a polyethylene terephthalate film (38 μm thick) (hereinafter referred to as PET film) treated with a silicone release agent using an orifice-type coating machine. The film is then heated at 140°C for 30 minutes to form a resin composition layer with a thickness of 20 μm (the residual solvent content in the resin composition layer is approximately 1% by mass). Next, a cover film (PET film (38 μm thick) treated with a silicone release agent) is laminated to obtain a sealing sheet.

[0190] <Example 2>

[0191] Except that 1.5 parts of tributyloxymonoacetylacetonate zirconium (ORGATIX ZC540) were used instead of 1.5 parts of alkyl aluminum acetoacetate diisopropyl ester (Alumichelate M), the same procedure as in Example 1 was performed to obtain a sealing sheet.

[0192] <Example 3>

[0193] Except that 77 parts of hydrogenated DCPD type hydrocarbon resin (T-REZHA125) were used instead of 77 parts of saturated hydrocarbon resin containing cyclohexane ring (ARKONP125, 60% organosilicon solution), the amount of alkyl aluminum diisopropyl acetoacetate (Alumichelate M) added was set to 1 part, and the amount of semi-calcined hydrotalcite (DHT-4C) added was set to 200 parts, the same procedure as in Example 1 was performed to obtain a sealing sheet.

[0194] <Example 4>

[0195] Except that polybutene (HV-1900) was not added and the amount of saturated hydrocarbon resin containing cyclohexane ring (ARKONP125, 60% silicone solution) added was set to 137 parts, the same procedure as in Example 1 was performed to obtain a sealing sheet.

[0196] <Example 5>

[0197] Except that the amount of alkyl aluminum diisopropyl acetoacetate (Alumichelate M) added was set to 1.8 parts and the amount of semi-calcined hydrotalcite (DHT-4C) added was set to 350 parts, the same procedure as in Example 1 was performed to obtain a sealing sheet.

[0198] <Example 6>

[0199] To 77 parts of a cyclohexane-containing saturated hydrocarbon resin (ARKONP125, 60% silicone solution), 95 parts of polybutene (HV-1900), 1 part of alkyl aluminum acetoacetate diisopropyl (Alumichelate M), and 200 parts of semi-calcined hydrotalcite (DHT-4C) were dispersed using a three-roll mill to obtain a mixture. To the resulting mixture, 20 parts of glycidyl methacrylate-modified polypropylene-polybutene copolymer (T-YP312, 40% toluene solution), 20 parts of maleic anhydride-modified propylene-butene copolymer (T-YP313, 40% toluene solution), 0.5 parts of amine curing accelerator (TAP), and 170 parts of toluene were incorporated, and the mixture was uniformly dispersed using a high-speed rotary mixer to obtain a varnish of the resin composition. Using the obtained varnish, the procedure was performed in the same manner as in Example 1 to obtain a sealing sheet.

[0200] <Comparative Example 1>

[0201] Except that 1 part of isopropyl tris(dioctyl pyrophosphoryloxy)titanate (KR38S) was used instead of 1 part of alkyl aluminum acetoacetate (Alumichelate M), the same procedure as in Example 3 was performed to obtain a sealing sheet.

[0202] <Comparative Example 2>

[0203] Except that 1.5 parts of zirconium stearate (ORGATIX ZC320) were used instead of 1.5 parts of alkyl aluminum acetoacetate (Alumichelate M), the same procedure as in Example 1 was performed to obtain a sealing sheet.

[0204] <Comparative Example 3>

[0205] Except for the absence of alkyl aluminum acetoacetate (Alumichelate M), the procedure was performed in the same manner as in Example 1 to obtain a sealing sheet.

[0206] <Comparative Example 4>

[0207] Except that alkyl aluminum diisopropyl acetoacetate (Alumichelate M) was not added and the amount of semi-calcined hydrotalcite (DHT-4C) added was set to 100 parts, the same procedure as in Example 6 was performed to obtain a sealing sheet.

[0208] <Determination Methods and Evaluation Methods>

[0209] The following section explains the various measurement and evaluation methods.

[0210] <Evaluation of Adhesion>

[0211] The cover film of the sealing sheet (cut into sheets 50 mm in length and 20 mm in width) prepared in the examples and comparative examples was peeled off. The resin composition layer was then laminated onto an aluminum foil / PET composite film "AL1N30 with PET" (aluminum foil: 30 μm, PET: 25 μm, manufactured by Toyo Aluminum Sales Co., Ltd., trade name) with a length of 100 mm and a width of 25 mm using a batch vacuum laminator (Nichigo-Morton Co., Ltd., V-160). Lamination was performed at a temperature of 80°C, a time of 300 seconds, and a pressure of 0.3 MPa. Then, the PET film was peeled off, and a glass plate (76 mm in length, 26 mm in width, and 1.2 mm in thickness, a microscopic slide) was laminated onto the exposed resin composition layer under the same conditions as described above. The adhesion of the resulting laminate was determined by the peel strength when peeled at a tensile speed of 300 mm / min in a direction 180 degrees relative to the length direction of the aluminum foil / PET composite film.

[0212] Good (○): Peel strength is above 0.2 kgf / cm

[0213] Poor (×): Peel strength less than 0.2 kgf / cm.

[0214] <Evaluation of Transparency>

[0215] The sealing sheets prepared in the examples and comparative examples were cut into 50 mm long and 20 mm wide pieces. After peeling off the cover film, the resin composition layer was laminated onto a glass plate (a 76 mm long, 26 mm wide, and 1.2 mm thick microscope slide, a white glass slide S1112 with ground edges manufactured by Matsunami Glass Industry Co., Ltd.) using a batch vacuum laminator (Nichigo-Morton Co., Ltd., V-160) to obtain an evaluation sample. The lamination conditions were: temperature 80°C, decompression time 30 seconds, followed by pressure of 0.3 MPa for 30 seconds. The PET film of the sealing sheet was peeled off, and the haze of the evaluation sample (20 μm thick) was measured using a haze meter manufactured by Suga Testing Machine Co., Ltd., with air as a reference, using D65 light. The transparency was evaluated according to the following criteria.

[0216] Good (○): Haze level below 3.5%

[0217] Unsatisfactory (×): Haze is above 3.5%.

[0218] <Evaluation of moisture permeability>

[0219] Except that, in each embodiment and comparative example, an aluminum foil / PET composite film “AL1N30 with PET” (aluminum foil: 30μm, PET: 25μm, trade name of Tokai Toyo Aluminum Sales Co., Ltd.) was used instead of the PET film (support) treated with an organosilicon release agent, the operation was carried out in the same manner as in each embodiment and comparative example to obtain a sealing sheet.

[0220] Alkali-free glass coated with calcium was used as a model of the light-emitting surface of an organic EL device. The onset time of the reduction in the light-emitting area of ​​the organic EL device was measured, thereby evaluating the moisture permeability resistance of each sealing sheet (calcium (Ca) test). Alkali-free glass with sides of 50 mm × 50 mm was washed with boiling isopropanol for 5 minutes and dried at 150°C for at least 30 minutes. Using this glass, calcium (99.8% purity) (thickness 300 nm) was deposited by vapor deposition using a mask with a distance of 3 mm from the end. Sealing sheets with a resin composition layer, similar to those in the examples and comparative examples, were heated at 130°C for 1 hour in a glove box. Then, the calcium-coated alkali-free glass was laminated to each sealing sheet in a glove box using a hot laminator (Fujipacker DAiSYA4 (LPD2325) manufactured by Fujipula Co., Ltd.), forming a laminate (evaluation sample).

[0221] If calcium comes into contact with water to form calcium oxide, it changes from white to transparent. Therefore, the intrusion of moisture into the evaluation sample can be evaluated by measuring the distance (mm) from the end of the evaluation sample to the white calcium oxide. Therefore, the calcium-containing evaluation sample is used as a model for the light-emitting surface of an organic EL device.

[0222] First, the distance from the end of the self-evaluation sample to the evaporated calcium was measured using a Mitutoyo Measuring Microscope MF-U manufactured by Mitutoyo Corporation, and this value was set as the initial value. Next, the evaluation sample was placed in a small environmental test chamber (ESPEC SH-222 manufactured by ESPEC Corporation) set to 85°C and 85% RH for a certain period of time, and the distance from the end of the self-evaluation sample to the calcium was measured at regular intervals. Based on the Fick diffusion equation, a theoretical curve was plotted using the least squares method based on the "distance from the end of the self-evaluation sample to the calcium" and the "time the evaluation sample was placed in the small environmental test chamber," thereby calculating the proportionality constant K. Using the calculated K, the time to reach X = 2.6 mm was used as the starting time for the reduction of the luminescent area. Higher moisture permeability results in a slower rate of moisture intrusion and a longer starting time for the reduction of the luminescent area.

[0223] [Mathematical Expression 1]

[0224]

[0225] (In the formula, X represents the distance (mm) from the end of the self-evaluation sample to the calcium, t represents the time (hr) during which the evaluation sample is placed in a small environmental tester, and K represents the proportionality constant.)

[0226] Good (○): 250 hours or more

[0227] Undesirable (×): Less than 250hr.

[0228] [Table 1]

[0229]

[0230] The results in Table 1 show that the sealing sheets of Examples 1-6 not only exhibit excellent moisture permeability resistance but also excellent adhesion and transparency. On the other hand, it can be seen that while the sealing sheets of Comparative Examples 1 and 3 have excellent adhesion, they have poor transparency. Furthermore, while the sealing sheet of Comparative Example 2 has excellent moisture permeability resistance and transparency, it has low adhesion. Moreover, it can be seen that while the sealing sheet of Comparative Example 4 has excellent adhesion and transparency, it has poor moisture permeability resistance.

[0231] Industrial applications

[0232] The sealing resin composition of the present invention not only has excellent moisture resistance, but also excellent adhesion and transparency, and is therefore suitable for sealing electronic devices, especially organic EL devices and solar cells.

[0233] This application is based on Japanese Patent Application No. 2019-180697, which was filed in Japan and whose contents are fully contained in this specification.

Claims

1. A sealing resin composition comprising (A) a polyolefin resin, (B) a hygroscopic filler, (C) a metal complex, and (D) a tackifier. in, (A) Polyolefin resins include polyolefin resins with anhydride groups and polyolefin resins with epoxy groups. Relative to 100% by mass of the non-volatile components in the resin composition, (A) the content of polyolefin resin is 35% by mass or less, and relative to 100% by mass of the non-volatile components in the sealing resin composition, (B) the content of hygroscopic filler is more than 45% by mass. The content of (C) metal complex is 0.1% to 5% by mass relative to 100% by mass of the non-volatile components in the resin composition. The content of (D) tackifier is 5-30% by mass relative to 100% by mass of the non-volatile components in the resin composition. (C) The metal complex is a metal complex represented by the general formula (1). In the formula, M represents the metals in periods 2 through 6 of the periodic table. R1 and R3 each independently represent a hydrogen atom, an alkyl group optionally with a substituent, an alkoxy group optionally with a substituent, an aryl group optionally with a substituent, or an aralkyl group optionally with a substituent. R2 represents a hydrogen atom, an alkyl group optionally having a substituent, an alkoxy group optionally having a substituent, an alkoxycarbonyl group optionally having a substituent, an aryl group optionally having a substituent, or an aralkyl group optionally having a substituent. X represents a monodentate ligand with oxygen as its coordinating atom. The solid line between the oxygen atom (O) and M within the brackets [] represents a covalent bond. The dashed line between the oxygen atom (O) and M within the brackets [] represents a coordinate bond, and m is an integer of 3 or 4, n is an integer from 1 to 3, and m > n.

2. The sealing resin composition according to claim 1, wherein, (B) The hygroscopic filler is semi-calcined hydrotalcite.

3. The sealing resin composition according to claim 1 or 2, wherein, (B) The content of hygroscopic filler is 46% to 80% by mass relative to 100% by mass of the non-volatile components in the sealing resin composition.

4. The sealing resin composition according to claim 3, wherein, (B) The content of hygroscopic filler is 48% to 75% by mass or more, relative to 100% by mass of the non-volatile components in the sealing resin composition.

5. The sealing resin composition according to claim 1, wherein, In formula (1), M is aluminum or titanium.

6. The sealing resin composition according to claim 1 or 2, wherein, (A) Polyolefin resins include reactants of polyolefin resins with anhydride groups and polyolefin resins with epoxy groups.

7. The sealing resin composition according to claim 1, wherein, The content of (C) metal complex is 0.3 to 3% by mass relative to 100% by mass of the non-volatile components in the resin composition.

8. The sealing resin composition according to claim 1 or 2, used for sealing electronic devices.

9. The sealing resin composition according to claim 8, wherein, The electronic devices are organic EL devices or solar cells.

10. A sealing sheet comprising: a support body and a layer of the resin composition of claim 1 or 2 formed on the support body.

11. An electronic device, wherein, The sealant was applied using the sealing resin composition according to claim 1 or 2.

12. The electronic device according to claim 11, wherein, The electronic devices are organic EL devices or solar cells.

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