Electronic system and drop test method for electronic system

Abstract

The embodiment of the present invention provides an electronic system and a drop test method for the electronic system. The electronic system includes: a carrier, the surface of the carrier includes two long sides and two short sides, and a plurality of lock holes for fixing the carrier are arranged in the carrier; a packaging structure is arranged on the surface of the carrier; a mass block is arranged on the surface of the carrier, and a portion of the plurality of lock holes are arranged adjacent to one of the two short sides, and an outer common tangent parallel to one of the short sides is determined through the edge of a portion of the lock holes away from one of the short sides, and the mass block is located in the area defined between one of the short sides of the surface and the corresponding outer common tangent. The embodiment of the present invention can at least improve the reliability of the product.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to an electronic system and a drop test method for the electronic system. Background Art

[0002] In addition to pursuing high-density packaging and reducing costs, packaging technology has gradually developed from early wire bonding and flip chip packaging to system-in-a-package (SiP) to adapt to the development trend of short, light and thin electronic products. For handheld electronic products, the packaging structure is required to effectively improve the reliability performance in system-level testing and board-level testing, thereby increasing the life cycle of handheld electronic products. The drop test in the board-level reliability test is to test the product in a bare or packaged state, and after a certain height of free fall, check its damage degree to provide reference for improved structure or packaging. Taking the drop test of the current electronic product packaging structure as an example, in the 1500G drop test, the impact of the fall will cause the solder joint to be subjected to great stress, resulting in the fracture of the solder joint, and then there is a risk of product failure. Summary of the invention

[0003] In view of the problems existing in the related art, an object of the present invention is to provide an electronic system and a drop test method for the electronic system, so as to improve the reliability of the electronic system.

[0004] An embodiment of the present invention provides an electronic system, which includes: a carrier board, a surface of which includes two long sides and two short sides, and a plurality of lock holes for fixing the carrier board are provided in the carrier board; a packaging structure is provided on the surface of the carrier board; a mass block is provided on the surface of the carrier board, wherein a portion of the plurality of lock holes are provided adjacent to one of the two short sides, and an external common tangent line parallel to one of the short sides is determined through edges of a portion of the lock holes away from one of the short sides, and the mass block is located in an area defined between one of the short sides of the surface and the corresponding external common tangent line.

[0005] In some embodiments, the packaging structure is disposed in the middle of the carrier.

[0006] In some embodiments, the number of the plurality of locking holes is four, and the four locking holes are respectively disposed adjacent to four corners of the surface of the carrier board.

[0007] In some embodiments, the number of mass blocks is two, one of the two mass blocks is arranged in the area defined by one of the two short sides and the outer common tangent of the corresponding two key holes, and the other of the two mass blocks is arranged in the area defined by the other short side of the two short sides and the outer common tangent of the corresponding two key holes.

[0008] In some embodiments, an axis passes through the center of the surface of the carrier plate and is parallel to the short side, and the two mass blocks are symmetrically arranged with respect to the axis.

[0009] In some embodiments, the electronic system also includes a connector, which is arranged between the packaging structure and the carrier to connect the packaging structure and the carrier. The mass block is configured to absorb vibration energy when the electronic system falls to share the stress suffered by the connector when it falls.

[0010] In some embodiments, the mass is located in the middle of the region in a direction parallel to the short side.

[0011] In some embodiments, in a direction parallel to the short side, there is a gap between the mass block and the adjacent locking hole.

[0012] In some embodiments, a side wall of the proof mass parallel to the short side is aligned with the short side of the defined area.

[0013] On the other hand, an embodiment of the present invention further provides a drop test method for an electronic system, comprising: providing an electronic system, the electronic system comprising a carrier board and a packaging structure and a mass block located on the surface of the carrier board, wherein the surface of the carrier board has two long sides and two short sides, a plurality of lock holes for fixing the carrier board are arranged in the carrier board, two of the plurality of lock holes are arranged along a direction parallel to the short sides and adjacent to the same one of the two short sides, and the mass block is located in an area defined by a short side of the surface and an outer common tangent line of the corresponding two lock holes; providing a drop test device, and performing a drop test on the electronic system using the drop test device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Various aspects of the present invention will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the sizes of the various components may be arbitrarily increased or reduced for clarity of discussion.

[0015] Figure 1 is a side view of an electronic system according to an embodiment of the present invention.

[0016] Figure 2 yes Figure 1 A top view of the electronic system.

[0017] Figure 3is a schematic diagram showing different positions of the mass block in the simulation test.

[0018] Figure 4 is a diagram showing the mass block located at Figure 3 Schematic diagram of the results of the stress on the connector and the kinetic energy of the system in the drop test simulation at multiple different positions.

[0019] Figure 5 is a diagram showing the mass block located at Figure 3 A plot of kinetic energy versus time in a drop test simulation at multiple different positions in the image.

[0020] Figure 6 is a diagram showing the mass block located at Figure 3 Schematic diagram of the variation of the deformation of the carrier plate over time at position D2 in the figure and when no mass block is set.

[0021] Figure 7 is a flow chart of a drop test method for an electronic system according to an embodiment of the present invention. DETAILED DESCRIPTION

[0022] In order to better understand the spirit of the embodiments of the present invention, some preferred embodiments of the present invention are further described below.

[0023] Embodiments of the present invention will be described in detail below. Throughout the present specification, the same or similar components and components with the same or similar functions are represented by similar reference numerals. The embodiments of the drawings described herein are illustrative, diagrammatic, and are used to provide a basic understanding of the present invention. The embodiments of the present invention should not be interpreted as limiting the present invention.

[0024] In this specification, unless otherwise specified or limited, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "above", "below", "top", "bottom" and their derivative terms (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the directions described in the discussion or depicted in the drawings. These relative terms are only used for convenience of description and do not require that the present invention be constructed or operated in a specific direction.

[0025] An embodiment of the present invention provides an electronic system. Figure 1 is a side view of an electronic system according to an embodiment of the present invention, Figure 2 yes Figure 1 A top view of the electronic system.

[0026] Combined with reference Figure 1 and Figure 2 , the electronic system 100 includes a carrier 10, and also includes a packaging structure 20 disposed on a surface 11 of the carrier 10. The packaging structure 20 is connected to the carrier 10 via a connector 25. The connector 25 may be, for example, a solder ball or a solder bump. In some embodiments, the carrier 10 may be a printed circuit board (PCB). Figure 2 As shown in the top view in FIG. 1 , the surface 11 of the carrier 10 has a rectangular shape, so the surface 11 includes two long sides 12a and 12b that are oppositely disposed and parallel to each other, and the surface 11 also includes two short sides 14a and 14b that are oppositely disposed and parallel to each other. The two long sides 12a and 12b extend in the X direction, and the two short sides 14a and 14b extend in the Y direction.

[0027] The carrier board 10 is provided with a plurality of locking holes 16 a , 16 b , 16 c , 16 d penetrating the carrier board 10 , and the locking holes 16 a , 16 b , 16 c , 16 d are used to fix the carrier board 10 . Figure 2 In the illustrated embodiment, four locking holes 16a, 16b, 16c, and 16d are provided. The four locking holes 16a, 16b, 16c, and 16d are respectively provided adjacent to the four corners of the surface 11 of the carrier 10. The four locking holes 16a, 16b, 16c, and 16d are provided adjacent to the four corners to avoid occupying the space in the center of the carrier 10 for the packaging structure 20 to be provided. In addition, when the locking holes 16a, 16b, 16c, and 16d are adjacent to the four corners, the electronic system 100 shakes more obviously when it falls, and it is more necessary to reduce the vibration when it falls to improve reliability. In other embodiments, the locking holes may also have other numbers.

[0028] A mass block 30 is also disposed on the surface 11 of the carrier plate 10. The present invention provides benefits by disposing the mass block 30 on the carrier plate 10. Further, an embodiment of the present invention also provides a specific disposition area for disposing the mass block 30.

[0029] Specifically, when the electronic system 100 falls, part of the energy brought by the impact is converted into deformation energy of the carrier 10, and the other part is converted into system kinetic energy. The greater the kinetic energy received by the electronic system 100, the greater the instantaneous deformation energy will be, which may cause the risk of failure of the packaging structure 20 on the carrier 10 of the electronic system 100. Among them, kinetic energy can most directly reflect the energy generated by the system at the moment of impact. In addition, the connector 25 located in the peripheral area of ​​the packaging structure 20 will be subject to the maximum stress, so the connector 25 at this position is the focus of observing the stress distribution.

[0030] As described above, a simulation test is performed to observe the stress and kinetic energy of the connector 25 when the electronic system 100 falls. First, the mass blocks 30 are respectively arranged at different positions on the surface 11 of the carrier board 10 to perform a simulation test. Figure 3 FIG. 2 shows a schematic diagram of the mass block 30 being located at different positions in the simulation test. Figure 2 and Figure 3 As shown, in the simulation test, the mass block 30 is respectively set at 6 different positions D2-D7 of the area 50 of the surface 11 of the carrier 10 to perform the simulation test. The area 50 is one of the four equally divided areas of the surface 11 of the carrier 10 (such as Figure 2 As shown). In the simulation test, the mass block 30 is also divided into four equal parts. That is to say, although Figure 3 FIG. 4 shows one of the four equally divided regions and the position of the mass block 30 therein, but the mass blocks 30 are also arranged at positions corresponding to the positions D2 to D7 in the other four equally divided regions.

[0031] like Figure 1 and Figure 3 As shown, the mass blocks 30 are individually arranged in the region 50 at six positions D2-D7, and Figure 3 The corresponding coordinates of the six positions D2-D7 are also shown. A drop test simulation can be performed using ANSYS LS-DYNA software to observe the stress and kinetic energy of the connector 25 when the electronic system 100 falls.

[0032] like Figure 1 , Figure 2 and Figure 4 As shown, Figure 4 The schematic diagram shows the stress on the connector 25 and the system kinetic energy in the drop test simulation when the mass block 30 is located at different positions D2-D7. Figure 4 The simulation results without the mass block 30 are also shown, and the simulation results without the mass block 30 correspond to Figure 4 Reference number D1. Figure 4As shown, it can be observed that when the mass block 30 is placed at positions D2, D3, and D7, the stress on the connector 25 is less than the stress on D1 when the mass block 30 is not set. When the mass block 30 is placed at positions D4, D5, and D6, the stress on the connector 25 is greater than the stress on D1 when the mass block 30 is not set. It can be seen that, with the outer common tangent line L1 of the lock holes 16a and 16b away from the short side 14a as the boundary, when the mass block 30 is placed on the side close to the short side 14a of the carrier 10 (such as the above positions D2, D3, and D7), the stress on the connector 25 is reduced, and the maximum kinetic energy that the electronic system 100 can withstand is also reduced accordingly; if the mass block 30 is placed between the outer common tangent line L1 of the lock hole and the packaging structure 20 (such as the above positions D4, D5, and D6), the risk of the connector 25 breaking will increase.

[0033] In addition, if Figure 5 As shown, Figure 5 Also shown is a mass 30 (see Figure 2 ) is a graph showing the change in kinetic energy over time in a drop test simulation when the mass block 30 is placed at different positions D2-D7, wherein when the mass block 30 is located at the position D3-D7, it has a similar kinetic energy change curve, and when the mass block 30 is located at the position D2, the kinetic energy performance is better than the kinetic energy performance of the mass block 30 at the position D3-D7.

[0034] refer to Figure 2 and Figure 6 As shown, Figure 6 FIG. 1 is a schematic diagram showing the variation of the deformation of the carrier plate 10 with time when the mass block 30 is located at the position D2 and when the mass block 30 is not provided. The simulation result of the deformation when the mass block 30 is not provided corresponds to Figure 6 Observe that Figure 6 It can be seen that when the mass block 30 is located at the position D2 , the amplitude of the deformation of the carrier 10 varying with time is lower than when the mass block 30 is not provided, thereby reducing the continuous oscillation time of the carrier 10 in the electronic system 100 .

[0035] Therefore, according to an embodiment of the present invention, return to reference Figure 1 and Figure 2As shown, the mass block 30 is arranged in the area 40 of the surface 11. The area 40 is the area defined between a short side 14a of the surface 11 and the outer common tangent line L1 of the corresponding lock holes 16a and 16b. Among them, the lock holes 16a and 16b are the lock holes arranged adjacent to the short side 14a among all the lock holes. The outer common tangent line L1 of the lock hole passes through the edge of the lock holes 16a and 16b away from the short side 14a, and the outer common tangent line L1 of the lock hole is tangent to the circular lock holes 16a and 16b at the same time, and the outer common tangent line L1 of the lock hole and the short side 14a are respectively located on the opposite sides of the lock holes 16a and 16b. The outer common tangent line L1 of the lock hole can be parallel to the short side 14a. In addition, it can be seen from the above simulation results that by arranging the mass block 30 in the above-mentioned specific area 40, when the electronic system 100 falls, the mass block 30 can absorb the vibration energy to share the stress suffered by the connector 25 when it falls. Therefore, the technical solution of the present invention can improve the stress distribution of the electronic system 100 after being impacted and reduce the continuous oscillation time of the carrier 10, thereby effectively reducing the stress and kinetic energy impact on the connector 25, achieving the purpose of avoiding fatigue damage of the connector 25, and increasing the reliability performance of the electronic system 100.

[0036] Still refer to Figure 1 and Figure 2 As shown, in some embodiments, the mass block 30 may be a rectangular parallelepiped structure. In a top view, the upper surface of the mass block 30 may have a rectangular shape. In other embodiments, the upper surface of the mass block 30 may have a square shape in a top view. In other embodiments, the mass block 30 may also have other shapes. In some embodiments, the upper surface of the mass block 30 may be flush with the upper surface of the packaging structure 20. In other embodiments, the upper surface of the mass block 30 may also be higher or lower than the upper surface of the packaging structure 20.

[0037] The package structure 20 may be located in the middle of the carrier 10. The center of the package structure 20 is aligned with the center of the carrier 10. When the package structure 20 is located in the middle of the carrier 10, the electronic system 100 shakes more obviously when it falls, and it is more necessary to reduce the vibration when it falls to improve reliability. In some embodiments, the distance S1 between the package structure 20 and the common tangent line L1 outside the keyhole is greater than the distance S2 between the common tangent line L1 outside the keyhole and the adjacent short side 14a. In other words, the size of the region 40 in the length direction X of the carrier 10 is smaller than the distance S1 between the region 40 and the package structure 20. In some embodiments, the distance S1 may be equal to the distance S2, or the distance S1 may be smaller than the distance S2.

[0038] In some embodiments, the mass block 30 is located in the middle of the region 40 in the Y direction, that is, the center of the mass block 30 is aligned with the midpoint of the short side 14a in the X direction. Placing the mass block 30 in such a position can better absorb vibration energy to share the stress suffered by the electronic system 100 when it falls, thereby improving the shock absorption effect.

[0039] In some embodiments, the mass block 30 is spaced apart from the long sides 12a and 12b, and the mass block 30 may not extend to the long sides 12a and 12b. In some embodiments, the mass block 30 has a side wall parallel to the X direction, such as the side wall 30a. The side wall 30a of the mass block 30 is spaced apart from the adjacent locking hole 16a in the Y direction by a spacing S3. Since the locking holes 16a and 16b can cooperate with the fixing member to fix the carrier 10, the locking holes 16a and 16b themselves are less likely to shake, so the mass block 30 is too close to the locking hole 16, and the effect is more obvious when there is a spacing between the mass block 30 and the locking holes 16a and 16b.

[0040] The other side wall of the mass block 30, which is arranged opposite to the side wall 30a, has a configuration similar to the side wall 30a. In such an embodiment, the mass block 30 is located in the area between the key holes 16a and 16b. The package structure 20 is also located in the area corresponding to the key holes 16a and 16b. The mass block 30 has a size W1 in the Y direction. The package structure 20 has a size W2 in the Y direction. In some embodiments, the size W1 of the mass block 30 can be smaller than the size W2 of the package structure 20.

[0041] The mass block 30 also includes two side walls 30b and 30c parallel to the short side 14a. The side wall 30b of the mass block 30 can be aligned with the short side 14a. There can be a gap S4 between the side wall 30c of the mass block 30 and the outer common tangent line L1 of the keyhole, and the mass block 30 does not extend to the outer common tangent line L1 of the keyhole. The gap S4 between the mass block 30 and the outer common tangent line L1 of the keyhole is greater than the radius of the keyholes 16a and 16b, that is, there is a gap between the mass block 30 and the keyholes 16a and 16b in the X direction. Since the keyholes 16a and 16b can cooperate with the fixing parts to fix the carrier 10, the keyholes 16a and 16b themselves are less likely to shake, so the mass block 30 is too close to the keyhole 16. The effect is not great, and the effect is more obvious when there is a gap between the mass block 30 and the keyholes 16a and 16b.

[0042] In addition, corresponding to the other short side 14b of the surface 11 of the carrier 10 opposite to the short side 14a, two adjacent lock holes 16c and 16d are provided. And another lock hole outer common tangent L2 is determined by the edges of the lock holes 16c and 16d. And another area 40' of the surface 11 is defined between the short side 14b and the corresponding lock hole outer common tangent L2. In some embodiments, another mass block 30' is provided in the area 40'. In some embodiments, the surface 11 has an axis 18 passing through the center of the surface 11 in the Y direction, and the two mass blocks 30, 30' are symmetrically arranged relative to the axis 18. By symmetrically arranging the two mass blocks 30, 30', the vibration energy can be better absorbed to share the stress suffered by the electronic system 100 when it falls, thereby improving the shock absorption effect. The mass block 30' can have a similar configuration to the above-mentioned mass block 30, so it will not be repeated here.

[0043] According to another aspect of an embodiment of the present invention, a drop test method for an electronic system is provided. Figure 7 is a flow chart of a drop test method for an electronic system according to an embodiment of the present invention. Figure 7 As shown, in the drop test method, at step S702, an electronic system is provided, such as the electronic system 100 provided with the mass block 30 as described above. Then, at step S704, a drop test device is provided, and the electronic system 100 is subjected to a drop test, such as a 1500G drop test, using the drop test device. Since the electronic system 100 is provided with the mass block 30 in a specific area, the stress distribution of the electronic system 100 after being impacted and the continuous swing time of the carrier 10 can be improved, thereby effectively reducing the stress and kinetic energy impact on the connector 25. After a drop test of, for example, 1500G, the connector 25 between the carrier 10 and the packaging structure 20 in the electronic system 100 will not be damaged, thereby increasing the reliability performance of the electronic system 100.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic system, characterized in that: include: A carrier plate, the surface of which includes two long sides and two short sides, and the carrier plate is provided with a plurality of locking holes for fixing the carrier plate; A packaging structure is disposed on the surface of the carrier, and the packaging structure is disposed in the middle of the carrier; A mass block is arranged on the surface of the carrier plate, wherein a portion of the plurality of key holes are arranged adjacent to one of the two short sides, and an outer common tangent line parallel to the one short side is determined through edges of the portion of the key holes away from the one short side, and the mass block is located in an area defined between the one short side of the surface and the corresponding outer common tangent line.

2. The electronic system according to claim 1, characterized in that: The center of the packaging structure is aligned with the center of the carrier.

3. The electronic system according to claim 1, characterized in that: The number of the plurality of locking holes is four, and the four locking holes are respectively arranged adjacent to four corners of the surface of the carrier board.

4. The electronic system according to claim 1, characterized in that: There are two mass blocks, one of which is arranged in the area defined by one of the two short sides and the corresponding outer common tangent of the two key holes, and the other of the two mass blocks is arranged in the area defined by the other short side of the two short sides and the corresponding outer common tangent of the two key holes.

5. The electronic system according to claim 4, characterized in that: An axis passes through the center of the surface of the carrier plate and is parallel to the short side, and the two mass blocks are symmetrically arranged relative to the axis.

6. The electronic system according to claim 1, characterized in that: Also includes: a connector, disposed between the packaging structure and the carrier to connect the packaging structure and the carrier, The mass block is configured to absorb vibration energy when the electronic system falls, so as to share the stress suffered by the connecting component when it falls.

7. The electronic system according to claim 1, characterized in that: In a direction parallel to the short side, the mass block is located in the middle of the region.

8. The electronic system according to claim 7, characterized in that: In a direction parallel to the short side, there is a gap between the mass block and the adjacent locking hole.

9. The electronic system according to claim 1, characterized in that: One side wall of the mass block parallel to the short side is aligned with the one short side defining the region.

10. A drop test method for an electronic system, characterized in that: include: An electronic system is provided, the electronic system comprising a carrier board and a packaging structure and a mass block located on a surface of the carrier board, wherein the packaging structure is arranged at a middle position of the carrier board, the surface of the carrier board has two long sides and two short sides, a plurality of locking holes for fixing the carrier board are arranged in the carrier board, two of the plurality of locking holes are arranged along a direction parallel to the short sides and adjacent to the same one of the two short sides, and the mass block is located in a region defined by a short side of the surface and an outer common tangent line of the corresponding two locking holes; A drop test device is provided, and a drop test is performed on the electronic system using the drop test device.

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