A capacitor device and installation structure for a BSG system

Abstract

The present invention relates to a capacitor device and an installation structure for a BSG system. The capacitor device includes a capacitor core, an insulating partition, a negative electrode plate, and a positive electrode plate. The capacitor device further includes a fixing frame, which is provided with a positive input terminal, a negative input terminal, and a plurality of capacitor installation slots. Each capacitor installation slot is a cylindrical slot perpendicular to the main body of the fixing frame, and ribs are provided inside the cylindrical slot. The capacitor core is installed in the capacitor installation slot; the insulating partition is located between the negative electrode plate and the positive electrode plate, and the three are stacked in sequence and integrally connected to the fixing frame. The positive electrode plate is electrically connected to the positive electrode of the capacitor core and the positive input terminal of the fixing frame respectively, and the negative electrode plate is electrically connected to the negative electrode of the capacitor core and the negative input terminal of the fixing frame respectively. Compared with the prior art, the present invention has the advantages of high mechanical reliability, small ESR and ESL, good heat dissipation capacity, strong vibration resistance, etc., which helps to realize the miniaturized design of the BSG system assembly.

Description

Technical Field

[0001] The present invention relates to the field of capacitor devices for BSG systems, and in particular to a capacitor device and an installation structure for a BSG system. Background Art

[0002] The BSG system is a motor system assembly that highly integrates a motor and a controller, and has functions such as start-stop, power generation, and boosting; this system assembly is arranged at the front-end gear train of the engine, and can increase the engine speed from zero to above idle speed in a very short time through belt drive, so as to achieve rapid start-stop of the engine. At the same time, it can also assist when the vehicle climbs a slope and recover energy when braking, thereby achieving a fuel-saving effect of about 10%. This system belongs to the main development technical route in the field of mild hybrid power. Since the BSG system assembly is installed at the P0 position and is usually directly fixed on the engine block, its installation environment has characteristics such as small space, high temperature, and severe mechanical vibration. Therefore, relatively high requirements are put forward for the volume, heat dissipation ability, and vibration reliability of the BSG system assembly. During the design process of the internal sub-components of the BSG system assembly, it is also necessary to take into account characteristics such as small volume, good heat dissipation ability, and high mechanical vibration resistance. The BSG system assembly also has relatively high requirements for the ESR, ESL, and ripple current of electrolytic capacitors, and in its technical route, it is more inclined to use multiple aluminum electrolytic capacitors in parallel. Therefore, there is an urgent need for a capacitor device with small volume, small inductance, good heat dissipation ability, and high mechanical vibration resistance.

[0003] The utility model with the publication number CN210075007U discloses an integrated packaged electrolytic capacitor module for an IBSG motor controller, including a housing with an opening at the bottom. The housing is provided with a positive connection plate and a negative connection plate. This module further includes: a composite busbar, hermetically arranged at the bottom opening of the housing, including a positive plate and a negative plate respectively connected to the positive connection plate and the negative connection plate; an electrolytic capacitor, connected between the positive plate and the negative plate of the composite busbar and placed inside the housing; a PCBA board, connected to the positive plate and the negative plate of the composite busbar; and a grounding plate, connected to the PCBA board.

[0004] This capacitor module has the following disadvantages:

[0005] 1. The electrolytic capacitor is only fixed at both ends, and is prone to vibration, affecting the reliability of the connection of the electrolytic capacitor;

[0006] 2. The outside of the capacitor module is covered with a housing, and the heat conduction speed is slow, affecting heat dissipation. Summary of the Invention

[0007] The purpose of the present invention is to overcome the defects of the above-mentioned existing technologies and provide a capacitor device and an installation structure for a BSG system that ensure vibration reliability and improve heat dissipation speed.

[0008] The object of the present invention can be achieved by the following technical solutions:

[0009] A capacitor device for a BSG system, comprising a capacitor core, an insulating partition, a negative electrode plate and a positive electrode plate. The capacitor device further includes a fixing frame, which is provided with a positive input terminal, a negative input terminal and a plurality of capacitor mounting grooves. Each of the capacitor mounting grooves is a cylindrical groove perpendicular to the main body of the fixing frame, and ribs are provided inside the cylindrical groove. The capacitor core is installed in the capacitor mounting groove;

[0010] The insulating partition is located between the negative electrode plate and the positive electrode plate. The three are stacked in sequence and are integrally connected to the fixing frame. The positive electrode plate is electrically connected to the positive electrode of the capacitor core and the positive input terminal of the fixing frame respectively, and the negative electrode plate is electrically connected to the negative electrode of the capacitor core and the negative input terminal of the fixing frame respectively.

[0011] Further, the capacitor mounting groove includes two partially overlapping cylindrical grooves, which are in an overall figure-eight shape. Each cylindrical groove in the capacitor mounting groove is provided with one of the capacitor cores.

[0012] Further, the fixing frame is of a rectangular structure, and the capacitor mounting grooves are inclined with respect to the length and width of the fixing frame.

[0013] Further, the insulating partition, the positive electrode plate and the negative electrode plate are all provided with through holes for the positive capacitor pin and the negative capacitor pin of the capacitor core to extend out; the positive electrode plate is connected to the positive capacitor pin by soldering, and the negative electrode plate is connected to the negative capacitor pin by soldering.

[0014] Further, a hole group is provided at the soldering connection between the positive electrode plate and the positive capacitor pin, and a hole group is provided at the soldering connection between the negative electrode plate and the negative capacitor pin.

[0015] The hole group includes a first round hole at the center and a plurality of second round holes surrounding the first round hole. The diameter of the first round hole is larger than the diameter of the second round hole. The first round hole is used for installing the pin of the capacitor core.

[0016] Further, the capacitor mounting groove is filled with silica gel.

[0017] Further, a capacitor card slot is provided on the side surface of the capacitor core. The capacitor card slot is an annular concave groove distributed along the circumferential direction of the capacitor core.

[0018] Further, the capacitor device further includes a Y capacitor, which is electrically connected to the positive input terminal and the negative input terminal of the fixing bracket respectively. The Y capacitor includes a Y capacitor plate, and the Y capacitor plate is respectively connected with a grounding copper sheet, a positive Y capacitor pin and a negative Y capacitor pin. The positive input terminal of the fixing bracket is provided with a positive Y capacitor hole, and the negative input terminal is provided with a negative Y capacitor hole. The positive Y capacitor pin is further connected to the positive Y capacitor hole, the negative Y capacitor pin is further connected to the negative Y capacitor hole, and the grounding copper sheet is further connected to the grounding end of the fixing bracket.

[0019] The present invention also provides an installation structure of a capacitor device for a BSG system as described above, including an installation base plate, a power MOS module and a capacitor device for a BSG system as claimed in claim 1. The power MOS module and the capacitor device are both installed on the installation base plate. The installation base plate is provided with a plurality of installation grooves, and the shapes and sizes of the installation grooves match those of the capacitor installation grooves. Each installation groove is correspondingly installed with a capacitor installation groove.

[0020] Further, the installation groove is filled with silica gel.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] (1) The fixing bracket in the capacitor device of the present invention is provided with a capacitor installation groove, and the capacitor core is installed in a vertical installation manner. The ribs in the capacitor installation groove can hold the capacitor card slot of the capacitor core, which is the first step to tightly hold the capacitor core, thus preventing the capacitor core from vibrating and increasing the strength of the fixing bracket.

[0023] The capacitor device is fixed by the fixing bracket without an outer plastic shell, thus avoiding the risk of over-temperature damage caused by the slow heat conduction speed of the traditional plastic shell. The heat generated by the capacitor core can be quickly dissipated into the air and conducted to the installation base plate, improving the heat dissipation speed and efficiency, meeting the requirements of more severe usage environments. Moreover, the positive plate and the negative plate of the capacitor device are highly laminated, reducing the structural volume and further reducing the inductance, and greatly reducing the ESL of the overall capacitor.

[0024] (2) The capacitor installation groove includes two partially overlapping cylindrical grooves, and the overall shape is an 8 shape; the fixing bracket is a rectangular structure, and the capacitor installation groove is inclined with respect to the length and width of the fixing bracket; the positive plate, the insulating partition and the negative plate are highly laminated; the above settings effectively reduce the overall volume of the capacitor device and have a high integration degree.

[0025] (3) Both the positive plate and the negative plate are connected to the corresponding pins of the capacitor core by soldering, and the soldering joints are both set as a structure of a hole group. This setting can increase the fixing strength and vibration reliability of the soldering, and at the same time improve the current-carrying area.

[0026] (4) The entire capacitor device is filled with silica gel in the capacitor installation groove, which further ensures vibration reliability. In addition, a capacitor card slot is provided on the side of the capacitor core, and the silica gel is filled in the capacitor card slot, further ensuring the reliable connection of the capacitor core and improving the vibration reliability once again.

[0027] (5) The installation structure of the capacitor device of the present invention is provided with four symmetrically arranged "8"-shaped installation grooves on the right side of the installation bottom plate. Its function is that after the capacitor core, insulating partition, negative electrode plate, positive electrode plate, and Y capacitor are completely assembled and welded on the fixing frame, silica gel is integrally poured into the "8"-shaped installation grooves of the installation bottom plate to ensure that all gaps are filled with silica gel. The entire capacitor device is firmly encapsulated on the installation bottom plate. At the same time, with the fixing bolts between the capacitor device and the installation bottom plate, it is sufficient to meet the high vibration reliability requirements of the capacitor device; curing the capacitor device on the installation bottom plate is convenient for heat dissipation and meets the vibration deformation requirements. Description of the Drawings

[0028] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the present invention;

[0029] Figure 2 It is an exploded schematic diagram of the structure of the embodiment of the present invention;

[0030] Figure 3 It is a schematic diagram of the structure of the fixing frame in the embodiment of the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of the capacitor core in the embodiment of the present invention;

[0032] Figure 5 It is a schematic diagram of the structure of the insulating partition in the embodiment of the present invention;

[0033] Figure 6 It is a schematic diagram of the structure of the negative copper row in the embodiment of the present invention;

[0034] Figure 7 It is a schematic diagram of the structure of the positive copper row in the embodiment of the present invention;

[0035] Figure 8 It is a schematic diagram of the structure of the Y capacitor in the embodiment of the present invention;

[0036] Figure 9 It is a schematic diagram of the installation structure of the capacitor device in the embodiment of the present invention;

[0037] Figure 10 It is a schematic diagram of the installation bottom plate structure of the capacitor device in the embodiment of the present invention;

[0038] In the figure, 1 is a fixing bracket, 101 is a positive input electrode plate, 102 is a positive hole of the Y capacitor, 103 is a negative hole of the Y capacitor, 104 is a negative input electrode plate, 105 is a capacitor mounting groove, 2 is a capacitor core, 201 is a positive capacitor pin, 202 is a negative capacitor pin, 203 is a capacitor card slot, 3 is an insulating partition, 301 is a cylindrical groove, 302 is a waist-shaped groove, 303 is a circular hole, 4 is a negative electrode plate, 401 is a negative input terminal, 402 is a first negative hole, 403 is a second negative hole, 404 is a first cylindrical hole, 405 is a negative output terminal, 5 is a positive electrode plate, 501 is a positive input terminal, 502 is a first positive hole, 503 is an elliptical hole, 504 is a second cylindrical hole, 505 is a positive output terminal, 6 is a Y capacitor, 601 is a negative pin of the Y capacitor, 602 is a positive pin of the Y capacitor, 603 is a Y capacitor plate, 604 is a grounding copper sheet, 7 is a power MOS module, 8 is a mounting bottom plate, and 801 is a mounting groove. Specific embodiments

[0039] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation manners and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0040] Embodiment 1

[0041] This embodiment provides a capacitor device for a BSG system, including a capacitor core 2, an insulating partition 3, a negative electrode plate 4, and a positive electrode plate 5. The capacitor device further includes a fixing bracket 1, which is provided with a positive input terminal, a negative input terminal, and a plurality of capacitor mounting grooves 105. Each capacitor mounting groove 105 is a cylindrical groove perpendicular to the main body of the fixing bracket, and ribs are provided inside the cylindrical groove. The capacitor core 2 is installed in the capacitor mounting groove 105; the ribs are preferably strip-shaped, which can increase the strength of the fixing bracket on the one hand and clamp the capacitor core on the other hand.

[0042] The capacitor core 2, the insulating partition 3, the negative electrode plate 4, and the positive electrode plate 5 are all installed directly above the fixing bracket 1. The insulating partition 3 is located between the negative electrode plate 4 and the positive electrode plate 5. The three are stacked in sequence and are integrally connected to the fixing bracket 1. The positive electrode plate 5 is electrically connected to the positive electrode of the capacitor core 2 and the positive input terminal of the fixing bracket 1 respectively, and the negative electrode plate 4 is electrically connected to the negative electrode of the capacitor core 2 and the negative input terminal of the fixing bracket 1 respectively.

[0043] The overall installation of the capacitor core 2, the insulating partition 3, the negative electrode plate 4, and the positive electrode plate 5 can be realized by setting bolt holes on the insulating partition 3 and the negative electrode plate 4, setting bolt grooves on the fixing bracket 1, and passing bolts through the bolt holes and bolt grooves.

[0044] As a preferred embodiment, the capacitor mounting groove 105 includes two partially overlapping cylindrical grooves, which are integrally in an 8 - shape. Each cylindrical groove in the capacitor mounting groove 105 is provided with a capacitor core 2. The fixing frame 1 is of a rectangular structure, and the capacitor mounting groove 105 is inclined with respect to the length and width of the fixing frame 1.

[0045] As a preferred embodiment, the insulating partition 3, the positive electrode plate 5 and the negative electrode plate 4 are all provided with through - holes for the positive capacitor pin 201 and the negative capacitor pin 202 of the capacitor core 2 to extend out; the positive electrode plate 5 is connected to the positive capacitor pin 201 by soldering, and the negative electrode plate 4 is connected to the negative capacitor pin 202 by soldering.

[0046] Further, as a preferred embodiment, a hole group is provided at the soldering joint between the positive electrode plate 5 and the positive capacitor pin 201, and a hole group is provided at the soldering joint between the negative electrode plate 4 and the negative capacitor pin 202.

[0047] The hole group includes a first round hole at the center and a plurality of second round holes surrounding the first round hole. The diameter of the first round hole is larger than that of the second round holes, and the first round hole is used for installing the pins of the capacitor core 2.

[0048] Setting it as a hole group can increase the fixing strength and vibration reliability of soldering, and at the same time can also increase the current - carrying area.

[0049] As a preferred embodiment, the capacitor mounting groove 105 is filled with silica gel to fix the capacitor core 2.

[0050] Further, as a preferred embodiment, a capacitor card slot 203 is provided on the side of the capacitor core 2. The capacitor card slot 203 is an annular concave groove distributed along the circumferential direction of the capacitor core 2. The silica gel is filled in the capacitor card slot, which further ensures the reliable connection of the capacitor core and improves the vibration reliability again.

[0051] As a preferred embodiment, the capacitor device further includes a Y - capacitor 6. The Y - capacitor 6 is electrically connected to the positive input terminal and the negative input terminal of the fixing frame 1 respectively. The Y - capacitor 6 includes a Y - capacitor plate 603, which is respectively connected with a grounding copper sheet 604, a Y - capacitor positive pin 602 and a Y - capacitor negative pin 601. The positive input terminal of the fixing frame 1 is provided with a Y - capacitor positive hole 102, the negative input terminal is provided with a Y - capacitor negative hole 103. The Y - capacitor positive pin 602 is also connected to the Y - capacitor positive hole 102, the Y - capacitor negative pin 601 is also connected to the Y - capacitor negative hole 103, and the grounding copper sheet 604 is also connected to the grounding end of the fixing frame 1.

[0052] This embodiment also provides an installation structure of a capacitor device for a BSG system as described above, including an installation base plate 8, a power MOS module 7, and the capacitor device for the BSG system as described above. The power MOS module 7 and the capacitor device are both installed on the installation base plate 8. The installation base plate 8 is provided with a plurality of installation grooves 801, and the shapes and sizes of the installation grooves 801 match those of the capacitor installation grooves 105. Each installation groove 801 is correspondingly installed with a capacitor installation groove 105.

[0053] The installation grooves 801 are filled with silica gel, that is, silica gel is integrally poured into the installation grooves of the installation base plate 8 to ensure that all gaps are filled with silica gel. The entire capacitor device is firmly encapsulated on the installation base plate 8, which is convenient for heat dissipation and meets the requirements of vibration deformation. The installation directions of the installation grooves 801 correspond to those of the capacitor installation grooves 105. Preferably, both the installation grooves 801 and the capacitor installation grooves 105 are installed perpendicular to the installation base plate 8.

[0054] Combining the above preferred implementation manners can obtain an optimal implementation manner. The following describes the specific implementation process of this optimal implementation manner.

[0055] As Figure 1 and Figure 2 shown, the capacitor device for the BSG system includes a fixing frame 1, a capacitor core 2 installed directly above the fixing frame, an insulating partition 3, a negative electrode plate 4, a positive electrode plate 5, and a Y capacitor 6 placed on the bottom surface. The capacitor core 2 is placed in the slot of the fixing frame 1. The insulating partition 3 is located between the positive electrode plate 5 and the negative electrode plate 4 and is fixed on the fixing frame 1. The positive electrode plate 5 is electrically connected to the positive electrode of the capacitor core 2 and the positive input terminal of the fixing frame 1 respectively. The negative electrode plate 4 is electrically connected to the negative electrode of the capacitor core 2 and the negative input terminal of the fixing frame 1 respectively. The Y capacitor 6 is electrically connected to the positive input terminal and the negative input terminal of the fixing frame 1 respectively.

[0056] As Figure 3 shown, in this embodiment, the fixing frame 1 includes a positive input electrode plate 101, a Y capacitor positive electrode hole 102, a Y capacitor negative electrode hole 103, a negative input electrode plate 104, and a capacitor installation groove 105. The positive input electrode plate 101 and the negative input electrode plate 104 are arranged side by side and parallel, and are integrally injection-molded in the plastic body of the fixing frame 1. The positive input electrode plate 101 and the negative input electrode plate 104 are respectively provided with a Y capacitor positive electrode hole 102 and a Y capacitor negative electrode hole 103. Both the positive input electrode plate 101 and the negative input electrode plate 104 have four cylindrical bosses with a diameter of 0.5 mm. There are 4 capacitor installation grooves 105 in total, which are in the shape of an 8-shaped cylindrical groove. Long strip-shaped ribs are arranged inside the cylindrical groove, which can increase the strength of the fixing frame on the one hand and clamp the capacitor core on the other hand.

[0057] As Figure 4As shown in the figure, in this embodiment, the capacitor core 2 includes one positive capacitor pin 201, two negative capacitor pins 202, and two capacitor slots 203. The positive capacitor pin 201 and the negative capacitor pins 202 are both cylindrical, and the capacitor slots 203 are circular recessed grooves. The positive capacitor pin 201 is located at the center of one end, and the negative capacitor pins 202 are located on both sides of one end and are directly integrated with the housing of the capacitor core 2.

[0058] As Figure 5 shown in the figure, in this embodiment, the insulating partition 3 is provided with cylindrical grooves 301, waist-shaped grooves 302, and circular holes 303. There are two rows of cylindrical grooves 301 distributed on both sides. A circular hole with a diameter of 1.5 mm is provided at the center of the cylindrical groove 301. A waist-shaped hole is provided at the center of the waist-shaped groove 302 and is located at the center position. The circular holes 303 are divided into two rows and are provided between the cylindrical grooves 301 and the waist-shaped grooves 302.

[0059] As Figure 6 shown in the figure, in this embodiment, the negative electrode plate 4 is provided with a negative input terminal 401, a first negative electrode hole 402, a second negative electrode hole 403, a first cylindrical hole 404, and a negative output terminal 405. The negative input terminal 401 is provided on the left side and has 4 circular holes with a diameter of 0.5 mm. The first negative electrode hole 402 has 8 hole groups, which are arranged in two rows on both sides. Each hole group is composed of 1 large circle with a diameter of 1 mm at the center and 6 small circles with a diameter of 0.5 mm surrounding it. The second negative electrode hole 403 has 4 hole groups, which are provided at the middle position. Each hole group is composed of 2 large circles with a diameter of 1 mm in the middle and 8 small circles with a diameter of 0.5 mm surrounding it. The first cylindrical holes 404 are arranged in two rows between the first negative electrode hole 402 and the second negative electrode hole 403. The negative output terminal 405 is provided on the right side and has three bifurcations.

[0060] As Figure 7 shown in the figure, in this embodiment, the positive electrode plate 5 is provided with a positive input terminal 501, a first positive electrode hole 502, an oval hole 503, a second cylindrical hole 504, and a positive output terminal 505. The positive input terminal 501 is provided on the left side and has 4 circular holes with a diameter of 0.5 mm. There are 4 oval holes 503 in total, which are provided at the centermost position. The first positive electrode hole 502 has 8 hole groups, which are arranged in two rows on both sides of the oval hole 503. Each hole group is composed of 1 large circle with a diameter of 1 mm at the center and 6 small circles with a diameter of 0.5 mm surrounding it. The second cylindrical holes 504 are divided into 8 and arranged in two rows on both sides of the positive electrode plate. The positive output terminal 505 is provided on the right side and has three bifurcations.

[0061] As Figure 8As shown, in this embodiment, the Y capacitor 6 includes a negative Y-capacitor pin 601, a positive Y-capacitor pin 602, a Y-capacitor plate 603, and a grounding copper sheet 604. One end of the negative Y-capacitor pin 601 and the positive Y-capacitor pin 602 is soldered to the Y-capacitor plate 603, and the other ends are respectively fixed to the positive Y-capacitor hole 602 and the negative Y-capacitor hole 601 of the fixing bracket 1 by soldering. One end of the grounding copper sheet 604 is fixed to the Y-capacitor plate 603 by soldering, and the other end is fixed to the ground together with the fixing point of the fixing bracket 1. The four cylindrical bosses of the positive input terminal plate 101 of the fixing bracket 1 are fitted with the four round holes with a diameter of 0.5 mm of the positive input terminal 501 of the positive electrode plate 5 and fixed by soldering. The four cylindrical bosses of the negative input terminal plate 104 of the fixing bracket 1 are fitted with the four round holes with a diameter of 0.5 mm of the negative input terminal 401 of the negative electrode plate 4 and fixed by soldering. The positive capacitor pin 202 of the capacitor core 2 is fixed to the first positive hole 502 of the positive electrode plate 5 by soldering. The negative capacitor pin 202 of the capacitor core 2 is simultaneously fixed to the first negative hole 402 and the second negative hole 403 of the negative electrode plate 4 by soldering. Setting it as a hole group can increase the fixing strength and vibration reliability of soldering, and at the same time can also increase the current-carrying area.

[0062] As Figure 9 shown, the capacitor device is fixed to the mounting base plate 8 by bolts, and the power MOS module 7 is fixed to the mounting base plate 8 by bolts. Moreover, the positive output terminal 505 of the positive electrode plate and the negative output terminal 405 of the negative electrode plate of the capacitor device are respectively fixedly connected to the positive and negative input terminals of the power MOS module 7 by bolts.

[0063] As Figure 10 shown, four symmetrically arranged "8"-shaped mounting grooves with a depth of 21 mm are provided on the right side of the mounting base plate 8. Its function is that after the capacitor core 2, the insulating partition 3, the negative electrode plate 4, the positive electrode plate 5, and the Y capacitor 6 are completely assembled and soldered on the fixing bracket 1, silicone is integrally poured into the "8"-shaped mounting grooves of the mounting base plate 8 to ensure that all gaps are filled with silicone. The entire capacitor device is firmly potted on the mounting base plate 8. At the same time, with the fixing bolts between the capacitor device and the mounting base plate 8, it is sufficient to meet the high vibration reliability requirements of the capacitor device.

[0064] In this embodiment, the electrolytic capacitor device has the advantages of high mechanical reliability, small ESR and ESL, good heat dissipation ability, strong vibration resistance, etc., which helps to realize the miniaturized design of the BSG system assembly.

[0065] In this embodiment, after the capacitor core 2, the insulating partition 3, the negative electrode plate 4, the positive electrode plate 5 and the Y capacitor 6 are completely assembled and welded on the fixing frame 1, the entire capacitor device is assembled. Then, the capacitor device and the power MOS module 7 are fixed on the mounting base plate 8 together with bolts. Finally, silicone is poured into the mounting groove on the mounting base plate 8 as a whole to ensure that all gaps are filled with silicone, and the capacitor device is cured on the mounting base plate 8, which is convenient for heat dissipation and meets the requirements of vibration deformation.

[0066] The preferred specific embodiments of the present invention have been described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and variations according to the concept of the present invention without creative work. Therefore, all technical solutions that can be obtained by those skilled in the art in the technical field of the present invention based on the concept of the present invention through logical analysis, reasoning or limited experiments on the basis of the prior art should be within the protection scope determined by the claims.

Claims

1. A capacitor device for a BSG system, comprising a capacitor core (2), an insulating separator (3), a negative electrode plate (4) and a positive electrode plate (5), characterized in that, The capacitor device further includes a fixing bracket (1), which is provided with a positive input terminal, a negative input terminal, and a plurality of capacitor mounting grooves (105). Each of the capacitor mounting grooves (105) is a cylindrical groove perpendicular to the main body of the fixing bracket, and ribs are provided inside the cylindrical groove. The capacitor core (2) is installed in the capacitor mounting groove (105). The insulating partition (3) is located between the negative electrode plate (4) and the positive electrode plate (5). The three are stacked in sequence and are integrally connected to the fixing bracket (1). The positive electrode plate (5) is electrically connected to the positive electrode of the capacitor core (2) and the positive input terminal of the fixing bracket (1) respectively. The negative electrode plate (4) is electrically connected to the negative electrode of the capacitor core (2) and the negative input terminal of the fixing bracket (1) respectively. The capacitor mounting groove (105) includes two partially overlapping cylindrical grooves, which are integrally in an 8 - shaped configuration. Each of the cylindrical grooves in the capacitor mounting groove (105) is installed with one capacitor core (2). The fixing bracket (1) has a rectangular structure, and the capacitor mounting grooves (105) are inclined with respect to the length and width of the fixing bracket (1).

2. The capacitance device for a BSG system according to claim 1, characterized in that, The insulating partition (3), the positive electrode plate (5), and the negative electrode plate (4) are all provided with through - holes for the capacitor positive lead (201) and the capacitor negative lead (202) of the capacitor core (2) to extend out. The positive electrode plate (5) is connected to the capacitor positive lead (201) by soldering, and the negative electrode plate (4) is connected to the capacitor negative lead (202) by soldering.

3. The capacitive device for a BSG system according to claim 2, wherein, The soldering connection between the positive electrode plate (5) and the capacitor positive lead (201) is provided with a hole group, and the soldering connection between the negative electrode plate (4) and the capacitor negative lead (202) is provided with a hole group. The hole group includes a first round hole at the center and a plurality of second round holes surrounding the first round hole. The diameter of the first round hole is larger than the diameter of the second round hole. The first round hole is used for installing the lead of the capacitor core (2).

4. A capacitor device for a BSG system according to claim 1, characterized in that, The capacitor mounting groove (105) is filled with silica gel.

5. A capacitor device for a BSG system according to claim 4, characterized in that, The side of the capacitor core (2) is provided with a capacitor card slot (203), which is an annular concave groove distributed along the circumferential direction of the capacitor core (2).

6. The capacitive device for a BSG system according to claim 1, wherein The capacitor device further includes a Y - capacitor (6), which is electrically connected to the positive input terminal and the negative input terminal of the fixing bracket (1) respectively. The Y - capacitor (6) includes a Y - capacitor plate (603), which is respectively connected with a grounding copper sheet (604), a Y - capacitor positive lead (602), and a Y - capacitor negative lead (601). The positive input terminal of the fixing bracket (1) is provided with a Y - capacitor positive electrode hole (102), and the negative input terminal is provided with a Y - capacitor negative electrode hole (103). The Y - capacitor positive lead (602) is also connected to the Y - capacitor positive electrode hole (102), the Y - capacitor negative lead (601) is also connected to the Y - capacitor negative electrode hole (103), and the grounding copper sheet (604) is also connected to the grounding end of the fixing bracket (1).

7. An installation structure of a capacitor device for a BSG system as described in claim 1, characterized in that, Comprising an installation base plate (8), a power MOS module (7), and a capacitor device for a BSG system as described in claim 1, the power MOS module (7) and the capacitor device are both mounted on the installation base plate (8), the installation base plate (8) is provided with a plurality of installation grooves (801), the installation grooves (801) are matched with the shape and size of the capacitor installation grooves (105), and a capacitor installation groove (105) is correspondingly installed in each of the installation grooves (801).

8. The mounting structure according to claim 7, characterized in that, The installation groove (801) is filled with silica gel.

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