Horizontal multi-silicon wafer transfer mechanism

Abstract

This invention discloses a horizontal multi-wafer transfer mechanism, comprising: a profile frame; a placement plate with several through slots; and several clamping mechanisms, each including two fixed plates, two driving devices, and several clamping rods. Each clamping rod has a slot, and two clamping rods are arranged in pairs on the fixed plates with their slots perpendicular to each other. The driving devices are tilted at a certain angle on the placement plates to drive the fixed plates to move. This invention uses a method simulating human fingers to hold the four corners of the silicon wafer, achieving the purpose of clamping while simultaneously correcting the wafer. It also minimizes wear on the wafer during contact, preventing contamination and reducing defect rates. One driving device can simultaneously position two clamping rods, solving the space limitation problem and enabling the horizontal placement of multiple wafers at once, with simultaneous loading and unloading from both top and bottom surfaces, improving transfer efficiency and flexibility.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer manufacturing technology, and in particular to a horizontal multi-wafer transfer mechanism. Background Technology

[0002] In photovoltaic applications, the most common method for flipping semi-finished coated silicon wafers is to use a robotic arm and suction cups to pick them up. The robotic arm flips them and places them into a device, then they are taken out from the other side to achieve the purpose of flipping. However, this suction cup gripping method can easily cause contamination and leave marks on the silicon wafers, which can affect the processing effect of subsequent processes and also have a certain impact on the molding effect of the finished product. Summary of the Invention

[0003] The purpose of this invention is to solve the above-mentioned technical problems by providing a horizontal multi-wafer transfer mechanism.

[0004] The technical solution of the present invention: a horizontal multi-wafer transfer mechanism, comprising:

[0005] Profile frame;

[0006] A placement plate is provided on the profile frame, and the placement plate is provided with several through slots;

[0007] Several clamping mechanisms are provided, including two fixed plates, two driving devices and several clamping rods. The clamping rods are provided with slots. The two fixed plates are arranged opposite each other. Every two clamping rods are arranged on the fixed plates and the slots on the two clamping rods are perpendicular to each other. The driving devices are arranged at a certain angle on the placement plate to drive the fixed plates to move.

[0008] Preferably, the driving device is at a 45-degree angle relative to the placement plate.

[0009] Preferably, one side of the fixing plate has an outwardly extending protrusion.

[0010] Preferably, it also includes several auxiliary support devices, which are disposed on the placement plate to guide and support the movement of the fixed plate.

[0011] Preferably, the auxiliary support device includes a guide rail and a movable block, the movable block being slidably disposed on the guide rail, and the guide rail being disposed on the placement plate at a certain angle.

[0012] Preferably, the guide rail is at a 45-degree angle to the placement plate.

[0013] Preferably, the fixing plate is provided with a plurality of clearance grooves.

[0014] The beneficial effects of this invention are as follows: This invention uses a method that simulates human fingers to fix the four corners of the silicon wafer to achieve the purpose of clamping, while simultaneously performing a correction action on the silicon wafer. Furthermore, it minimizes wear on the silicon wafer during contact, preventing contamination during gripping and reducing the defect rate. One drive device can simultaneously position the two clamping rods, solving the problem of limited space and reducing the number of cylinders used. It uses the simplest method to minimize the occurrence of wear, surface scratches, and cracks on the silicon wafer during the flipping process. It allows for the horizontal placement of multiple wafers at once and simultaneous loading and unloading from both the top and bottom surfaces, improving transfer efficiency and flexibility. Attached Figure Description

[0015] Figure 1 This is a perspective view of the overall structure of a preferred embodiment of the present invention;

[0016] Figure 2 This is a front view of the overall structure of a preferred embodiment of the present invention;

[0017] Figure 3 This is a perspective view of the placement plate arranged on the profile frame in a preferred embodiment of the present invention;

[0018] Figure 4 This is a perspective view of the clamping mechanism in a preferred embodiment of the present invention;

[0019] Figure 5 yes Figure 4 Enlarged view of a portion of point A in the middle;

[0020] Figure 6 This is a schematic diagram of a silicon wafer being placed on a mechanism.

[0021] Reference numerals: Profile frame 10, Placement plate 2, Through groove 21, Clamping mechanism 3, Fixing plate 31, Protrusion 311, Clearance groove 312, Drive device 32, Clamping rod 33, Slot 331, Auxiliary support device 4, Guide rail 41, Moving block 42. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Reference Figures 1 to 6 A horizontal multi-wafer transfer mechanism, comprising:

[0024] 10 profile frames;

[0025] Placement plate 2 is set on profile frame 10, and several through slots 21 are provided on placement plate 2;

[0026] Several clamping mechanisms 3 include two fixed plates 31, two driving devices 32 and several clamping rods 33. The clamping rods 33 are provided with slots 331. The two fixed plates 31 are arranged opposite each other. Each clamping rod 33 is arranged as a group on the fixed plate 31 and the slots 331 on the two clamping rods 33 are perpendicular to each other. The driving device 32 is inclined at a certain angle on the placement plate 2 for driving the fixed plate 31 to move. In this invention, the two fixing plates 31 are initially in an open state. When an external gripper picks up a silicon wafer and places it between the two fixing plates 31, the two driving devices 32 actuate to move the fixing plates 31 within the through slot 21, bringing the two fixing plates 31 closer together. A set of clamping rods 33 on one fixing plate 31 engages with a set of clamping rods 33 on the other fixing plate 31, and a slot 331 engages the side of the silicon wafer, thus securing the silicon wafer with the cooperation of the four clamping rods 33. When it is necessary to remove the silicon wafer from the two fixing plates 31, another external gripper picks up the silicon wafer from the bottom of the profile frame 10, and the two driving devices 32 actuate to move the two fixing plates 31 apart, thereby removing the silicon wafer. Specifically, the driving device 32 is a cylinder, and the fixing plates 31 are detachably mounted on the cylinder by bolts; the placement plate 2 is divided into two areas by a partition; and the clamping rods 33 are provided with protective pads to minimize wear on the silicon wafer when in contact with it.

[0027] As a preferred embodiment of the present invention, it may also have the following additional technical features:

[0028] In this embodiment, the driving device 32 is at a 45-degree angle to the placement plate 2, the two clamping rods 33 are a group and their slots 331 are perpendicular to each other. The driving device 32 drives the fixing plate 31 to move at a 45-degree angle to the placement plate 2, so that the slots 331 of the two clamping rods 33 can simultaneously engage with the side of the silicon wafer.

[0029] In this embodiment, the fixing plate 31 has an outwardly extending protrusion 311 on one side, and a clamping rod 33 is provided on the protrusion 311 so that the clamping rod 33 can fix the middle part near the silicon wafer so that the silicon wafer will not fall off.

[0030] In this embodiment, several auxiliary support devices 4 are also included, which are set on the placement plate 2 to guide and support the movement of the fixed plate 31.

[0031] In this embodiment, the auxiliary support device 4 includes a guide rail 41 and a movable block 42. The movable block 42 is slidably mounted on the guide rail 41, and the guide rail 41 is mounted on the placement plate 2 at a certain angle. Specifically, the fixing plate 31 is detachably mounted on the placement plate 2 by bolts.

[0032] In this embodiment, the guide rail 41 is at a 45-degree angle to the placement plate 2.

[0033] In this embodiment, the fixing plate 31 is provided with a number of clearance grooves 312, which facilitates the external gripper to grasp the silicon wafer without causing interference.

[0034] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0035] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A horizontal multi-wafer transfer mechanism, characterized in that, include: Profile frame (10); A placement plate (2) is provided on the profile frame (10), and the placement plate (2) is provided with a plurality of through slots (21). Several clamping mechanisms (3) are provided, including two fixed plates (31), two driving devices (32) and several clamping rods (33). The clamping rods (33) are provided with slots (331). The two fixed plates (31) are arranged opposite each other. Each pair of clamping rods (33) is arranged on the fixed plate (31) and the slots (331) on the two clamping rods (33) are perpendicular to each other. The driving device (32) is inclined at a certain angle on the placement plate (2) to drive the fixed plate (31) to move. Several auxiliary support devices (4) are set on the placement plate (2) to guide and support the movement of the fixed plate (31). The auxiliary support device (4) includes a guide rail (41) and a moving block (42). The moving block (42) is slidably set on the guide rail (41). The guide rail (41) is set on the placement plate (2) at a certain angle. The guide rail (41) is at a 45-degree angle to the placement plate (2).

2. The horizontal multi-wafer transfer mechanism according to claim 1, characterized in that: The drive device (32) is at a 45-degree angle to the placement plate (2).

3. The horizontal multi-wafer transfer mechanism according to claim 1, characterized in that: The fixing plate (31) has an outwardly extending protrusion (311) on one side.

4. The horizontal multi-wafer transfer mechanism according to claim 1, characterized in that: The fixing plate (31) is provided with a plurality of clearance grooves (312).

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