A flexible DC transmission module that takes into account the heat dissipation of multiple devices and multiple working conditions

Abstract

The present invention discloses a flexible direct current transmission module that takes into account the heat dissipation of multiple devices and multiple working conditions, including an IGBT working unit and a rectifier tube working unit. The IGBT working unit includes a heat dissipation module, an IGBT device, an explosion-proof baffle, a voltage-equalizing resistor, a first disc spring assembly, a first insulating heat block, and a first pressing frame. The first disc spring assembly, the heat dissipation module, and the first insulating heat block are sequentially installed on the first pressing frame. The IGBT device and the voltage-equalizing resistor are both installed on the heat dissipation module. The explosion-proof baffle is installed on the heat dissipation module and covers the side of the IGBT device. The heat dissipation module is connected to the rectifier tube working unit. The present invention reduces the module structure volume; improves the efficiency of the flexible direct current transmission module heat sink, improves the compatibility of multiple devices and multiple working conditions; reduces the difficulty of installation and disassembly operations and improves work efficiency, while reducing the pressure requirements of structural components and improving the reliability of structural functions; and improves the stability of module system applications.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronics, and in particular to a flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions. Background Art

[0002] Flexible DC transmission technology is a new type of DC transmission technology based on the turn-off semiconductor device IGBT (Insulated Gate Bipolar Transistor). It has strong technical advantages in improving power system stability, increasing system dynamic reactive power reserve, improving power quality, increasing the system's ability to absorb clean energy, and improving the reliability and flexibility of distribution networks. It has the advantages of good environmental protection, small footprint, and low environmental impact. It is suitable for application areas such as grid connection of clean energy such as solar energy, power supply of isolated islands (passive loads), and power supply of large cities. It is an important technical means to build smart grids.

[0003] The electronic components within a flexible DC transmission converter valve module require heat dissipation design to ensure they operate within a safe junction temperature range. Existing flexible DC transmission modules primarily employ two types of heat dissipation structures: one employing bolted electronic components, with the power module heat sink individually matched to each component; the other employing independent heat dissipation structures for high-voltage, high-current electronic components.

[0004] Flexible DC transmission modules that use individually matched power module heat sinks and electronic components cannot achieve high voltage and high current operation. Furthermore, under the same operating conditions, the heat dissipation structure has low utilization, resulting in a relatively large valve volume and affecting the overall volume control of the flexible DC converter valve. Flexible DC transmission modules with independent heat dissipation structures, when operating multiple devices simultaneously or under various operating conditions, require large heat dissipation circuits, resulting in a relatively complex module design and limited compatibility. Summary of the Invention

[0005] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art and to provide a flexible direct current transmission module that takes into account the heat dissipation of multiple devices and multiple working conditions.

[0006] The objectives of the present invention are achieved through the following technical solutions: A flexible direct current transmission module that takes into account the heat dissipation of multiple devices and multiple working conditions, including an IGBT working unit and a rectifier tube working unit, the IGBT working unit including a heat dissipation module, an IGBT device, an explosion-proof baffle, a voltage-grading resistor, a first disc spring assembly, a first insulating heat block and a first pressing frame, the first disc spring assembly, the heat dissipation module and the first insulating heat block are sequentially installed on the first pressing frame, the IGBT device and the voltage-grading resistor are both installed on the heat dissipation module, the explosion-proof baffle is installed on the heat dissipation module and covers the side of the IGBT device, and the heat dissipation module is connected to the rectifier tube working unit.

[0007] A better choice is that the rectifier tube working unit includes a second pressing frame, a second disc spring assembly, a second insulating heat block, a positioning pad and a rectifier tube. The second disc spring assembly, the second insulating heat block, the heat dissipation module, the rectifier tube and the positioning pad are connected in sequence, and the second disc spring assembly and the positioning pad are both installed on the second pressing frame.

[0008] A better choice is that the second pressing frame includes a third pressing plate, a fourth pressing plate, multiple second positioning screws and multiple second nuts, one end of the multiple second positioning screws is installed on the third pressing plate, and the other ends of the multiple second positioning screws pass through the fourth pressing plate and are connected to the multiple second nuts, the second disc spring assembly is installed on the third pressing plate, and the positioning pad is installed on the fourth pressing plate.

[0009] A better choice is that the second disc spring assembly includes a second pressure top plate, a second disc spring and a second pressure top rod, one end of the second pressure top rod is connected to the second pressure top plate, the other end of the second pressure top rod is installed on the second disc spring, the second pressing frame is provided with a second circular groove, the second disc spring is installed in the second circular groove, and the second pressure top plate is connected to the second insulating heat block.

[0010] A better choice is that the heat dissipation module includes a first radiator, a second radiator, a connecting water pipe, a water inlet pipe, a water outlet pipe and a drainage baffle. The first radiator is installed on both sides of the second radiator. The two sides of the IGBT device are tightly attached to the first radiator and the second radiator. The second radiator is connected to the first radiator through a connecting water pipe. The drainage baffle is installed on the first radiator. The water inlet pipe passes through the drainage baffle and is connected to one of the first radiators. The water outlet pipe passes through the drainage baffle and is connected to another of the first radiators. The explosion-proof baffle is installed on the second radiator. One of the first radiators is connected to the insulating heat block, and the other first radiator is connected to the first disc spring assembly.

[0011] A better choice is that the diversion baffle includes a blocking mounting part, a guide part and multiple blocking parts, the blocking mounting part is installed on the first radiator by bolts, the blocking mounting part is provided with a pipe inlet hole, the water inlet pipe and the water outlet pipe pass through the pipe inlet hole respectively, the multiple blocking parts are connected to the blocking mounting part to form a flow limiting groove, the flow limiting groove is provided with a notch, and the notch is connected to the guide part.

[0012] A better choice is that the explosion-proof baffle includes a mounting block and an explosion-proof plate, the mounting block is installed on the heat dissipation module, the explosion-proof plate is connected to both sides of the mounting block, the mounting block is provided with a first through hole and a second through hole, and the connecting water pipe passes through the first through hole and the second through hole respectively.

[0013] A better choice is that the first disc spring assembly includes a first pressure top plate, a first disc spring and a first pressure top rod, one end of the first pressure top rod is connected to the first pressure top plate, the other end of the first pressure top rod is installed on the first disc spring, the first pressing frame is provided with a first circular groove, the first disc spring is installed in the first circular groove, and the first pressure top plate is connected to the heat dissipation module.

[0014] A better choice is that the first pressing frame includes a first pressing plate, a second pressing plate, multiple first positioning screws and a first nut, one end of the multiple first positioning screws is installed on the second pressing plate, the other end of the multiple first positioning screws passes through the first pressing plate and is connected to the first nut, the first disc spring assembly is installed on the second pressing plate, and the insulating heat block is installed on the first pressing plate.

[0015] The present invention has the following advantages and beneficial effects compared to the prior art:

[0016] 1. The present invention achieves high-voltage and high-current operation through the IGBT working unit and the rectifier tube working unit, improves the utilization rate of the flexible DC transmission module's heat dissipation structure and the efficiency of the radiator, reduces the module structure volume, improves the compatibility of multiple devices and multiple working conditions, reduces the difficulty of installation and disassembly operations and improves work efficiency. At the same time, it reduces the pressure requirements of structural components, improves the reliability of structural functions, reduces the probability of occurrence of extreme working condition operation risks, and improves the stability of flexible DC transmission module system applications.

[0017] 2. The present invention improves the radiator efficiency of the flexible DC transmission module and reduces the risk of module leakage through the first radiator, the second radiator, the connecting water pipe, the water inlet pipe, the water outlet pipe and the drainage baffle. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of a flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions of the present invention;

[0019] Figure 2This is a front view of a flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions of the present invention;

[0020] Figure 3 This is a rear view of a flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions of the present invention;

[0021] Figure 4 This is a press-fit structure diagram of an IGBT device in a flexible DC transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions according to the present invention;

[0022] Figure 5 This is a press-fit structure diagram of a rectifier tube of a flexible DC transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions in the present invention;

[0023] Figure 6 This is a schematic diagram of an explosion-proof baffle of a flexible DC transmission module that takes into account heat dissipation of multiple devices and multiple working conditions in the present invention;

[0024] Figure 7 This is a schematic diagram of a diversion baffle of a flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple working conditions in the present invention;

[0025] Components in the drawings: 1-IGBT working unit; 101-first press-fit plate; 102-second press-fit plate; 103-first positioning screw; 104-first insulating heat block; 105-first heat sink; 106-second heat sink; 107-first nut; 108-first pressing disc spring assembly; 1081-first pressure top plate; 1082-first disc spring; 1083-first pressure top rod; 109-flow baffle; 1091-blocking mounting portion; 1092-pipe inlet hole; 1093-blocking portion; 1094-flow guide portion; 1095-screw hole; 110-anti- Explosion baffle; 1101-mounting block; 1102-explosion-proof plate; 1103-first through hole; 1104-second through hole; 111-connecting water pipe; 112-water inlet pipe; 113-water outlet pipe; 114-equalizing resistor; 115-IGBT device; 2-rectifier tube working unit; 201-third press-fit plate; 202-fourth press-fit plate; 203-second positioning screw; 204-second disc spring assembly; 2041-second pressure top plate; 2042-second disc spring; 2043-second pressure top rod; 205-rectifier tube; 206-positioning pad; 207-second insulating heat block; 208-second nut. DETAILED DESCRIPTION

[0026] The purpose of the present invention is described in further detail below with reference to the accompanying drawings and specific examples. The examples cannot be described one by one here, but the implementation methods of the present invention are not limited to the following examples.

[0027] A flexible direct current transmission module that takes into account the heat dissipation of multiple devices and multiple working conditions includes an IGBT working unit 1, a rectifier tube working unit 2 and a heat dissipation module. The IGBT working unit 1 includes an IGBT device 115, an explosion-proof baffle 110, a voltage-equalizing resistor 114, a first disc spring assembly 108, a first insulating heat block 104 and a first pressing frame. The first disc spring assembly 108, one end of the heat dissipation module and the first insulating heat block 104 are connected in sequence. The first disc spring assembly 108 is mounted on the top of the second press-fit plate 102 of the first pressing frame, and the first insulating heat block 104 is mounted on the bottom of the first press-fit plate 101 of the first pressing frame. Two IGBT devices 115 are both mounted in the interlayer of the heat dissipation module, the voltage-equalizing resistor 114 is mounted on the bottom of the heat dissipation module, the explosion-proof baffle 110 is mounted on the second heat sink 106 of the heat dissipation module and covers the side of the IGBT device. The other end of the second heat sink 106 of the heat dissipation module extends out of the first pressing frame and enters the second pressing frame of the rectifier tube working unit 2. The existing one-to-one matching structural solutions often use bolt-connected devices, which have high thermal resistance and low withstand voltage and current levels. If high-voltage devices are used, the equipotential between devices needs to be achieved through busbars (copper bars). However, due to the limited flow area, it is difficult to effectively increase the overall operating current. This embodiment mainly uses press-fit IGBT devices, which are directly connected through a heat sink. This improves the flow capacity without adding other components, while also reducing contact resistance and thermal resistance, allowing the device to operate more stably in high-voltage and high-current environments.

[0028] The IGBT device 115 switches the current in the system on and off; the grading resistor 114 assists in the charging and discharging process during system startup and shutdown. The heat dissipation module cools the IGBT device 115, grading resistor 114, and rectifier 205. The explosion-proof baffle 110 is made of a polymer insulating material, such as unsaturated polyester, ABS, and epoxy resin. It is bolted to the second heat sink 106 and features a three-dimensional, six-degree-of-freedom design for optimal positioning. The main body features a wing-like or fishbone-like structure on both sides, effectively increasing strength while reducing space usage. If the internal chip of the IGBT device 115 burns or explodes due to extreme operating conditions such as overload or short circuit, the explosion-proof baffle 110 seals the gap between the first and second heat sinks 105, 106, effectively dissipating the debris and impact of the IGBT device 115, preventing damage to the peripheral components and waterways of the oil-based DC transmission module and minimizing the risk of further damage. The first disc spring assembly 108 is used to compress and position the heat sink module, IGBT device 115, and first insulating heat block 104. The first insulating heat block 104 is a circular, skirted structure made of epoxy resin. This not only improves insulation performance but also provides a certain degree of thermal insulation. This prevents heat generated by the IGBT device 115 from dissipating to the rest of the module, thus preventing insufficient natural heat dissipation that could affect normal operation. The first pressing frame secures the heat sink module, IGBT device 115, first disc spring assembly 108, and first insulating heat block 104, acting as a support.

[0029] The first pressing frame includes a first pressing plate 101, a second pressing plate 102, four first positioning screws 103 and four first nuts 107. One end of the four first positioning screws 103 is installed on the second pressing plate 102, and the other end of the four first positioning screws 103 passes through the first pressing plate 101 and is connected to the first nut. A first circular groove is provided at the center of the second pressing plate 102, and a first circular through hole is opened at the center of the circular groove. The first disc spring 1082 of the first disc spring assembly 108 is installed in the first circular groove of the second pressing plate 102. The first pressure push rod 1083 of the first disc spring assembly 108 can pass through the first circular through hole. The first insulating heat block 104 is installed at the bottom of the first pressing plate 101.

[0030] The first and second press-fit plates 101 and 102 are used to clamp and secure the IGBT device 115, explosion-proof baffle 110, voltage-equalizing resistor 114, first disc spring assembly 108, and first insulating heat block 104. The first positioning screws 103 are arranged at equal intervals and constructed from carbon structural steel. The outer surface of the first positioning screws 103 is coated with an insulating coating or rubber material to further enhance the module's insulation performance and meet the requirements of high-voltage environments. A first nut 107 is used to lock the first positioning screws 103 and the first press-fit plate 101.

[0031] The first disc spring assembly 108 includes a first pressure top plate 1081, a first disc spring 1082 and a first pressure top rod 1083. The first pressure top plate 1081 is connected to one end of the first disc spring 1082 through the first pressure top rod 1083. The other end of the first disc spring 1082 is installed on the top of the second pressing plate 102 of the first pressing frame. The top of the first pressure top plate 1081 is connected to the first radiator 105 of the heat dissipation module.

[0032] First disc spring 1082 is a stacked spring (made of high-strength spring steel) with a multi-piece conical ring structure. Its maximum coverage area is no less than 50% of the mounting area of ​​IGBT device 115. This prevents excessively small springs from affecting uniform pressure transmission, while excessive springs can affect the overall structural volume and economic efficiency. First pressure pin 1083 is used to securely position first pressure plate 1081.

[0033] During the installation process of the IGBT working unit 1, the pressing force is transmitted sequentially through the first pressing pin 1083 and the first pressing plate 1081. The first pressing plate 101 and the second pressing plate 102 do not directly transmit pressure, and the pressing force can be applied slowly without being affected by the components of the flexible DC transmission module itself. After the pressing force is applied, the first positioning screw 103 is respectively connected to the first pressing plate 101 and the second pressing plate 102 by threaded connection, and a square diagonal force is used to fix it to ensure the uniformity of the overall force. During the disassembly process, the unloading force is also applied through the first pressing pin 1083 and the first pressing plate 1081. There is no direct pressure transmission between the first pressing plate 101 and the second pressing plate 102, and the release rate is slow and controllable. This can effectively avoid the problem of excessive force on the screw, inability to apply torque, and gnashing when releasing pressure directly through the first pressing plate 101 and the second pressing plate 102, as well as the risk of components popping out and posing personal safety risks due to excessive pressure release.

[0034] The rectifier tube working unit 2 includes a second pressing frame, a second disc spring assembly 204, a second insulating heat block 207, a positioning pad 206 and a rectifier tube 205. The second disc spring assembly 204, the second insulating heat block 207, the heat dissipation module, the rectifier tube 205 and the positioning pad 206 are connected in sequence. The second disc spring assembly 204 is installed at the top inside the second pressing frame, and the positioning pad 206 is installed at the bottom inside the second pressing frame.

[0035] The rectifier tube 205 plays a role in preventing the IGBT from being broken down; the second pressing frame is used to fix the two disc spring assemblies, the second insulating heat block 207, the positioning pad 206 and the rectifier tube 205, and plays a supporting role. The second disc spring assembly 204 is used to press and position the heat dissipation module, the IGBT device 115, and the first insulating heat block 104. The second insulating heat block 207 is a round pancake-shaped structure with a skirt, made of epoxy resin. In addition to improving the insulation performance, it also has a certain heat insulation effect, hindering the speed at which the heat generated by the rectifier tube 205 diffuses to the other components of the module, avoiding insufficient natural heat dissipation capacity and affecting normal use. The positioning pad 206 is a conical column structure (the diameter of the lower surface is the same as the circular boss size of the surface of the fourth pressing plate 202, and the upper surface is in direct contact with the rectifier tube 205 and is the same size as the mounting surface diameter of the rectifier tube 205). While ensuring accurate positioning, it can solve the stress concentration problem of the pressing force in the corresponding part and improve the stability of use.

[0036] The second pressing frame includes a third pressing plate 201, a fourth pressing plate 202, four second positioning screws 203 and four second nuts 208. One end of the four second positioning screws 203 is installed on the third pressing plate 201 through threads, and the other ends of the four second positioning screws 203 pass through the circular holes of the fourth pressing plate 202 and are connected to the four second nuts 208. A second circular groove is provided at the center of the bottom of the third pressing plate 201, and a second circular through hole is provided at the center of the second circular groove. The second disc spring 2042 of the second disc spring assembly is installed in the second circular groove of the third pressing plate 201. The second pressure push rod 2043 of the second disc spring assembly can pass through the second circular through hole, and the positioning pad 206 is installed on the fourth pressing plate 202.

[0037] The third press plate 201 and the fourth press plate 202 are tightened and clamped together by second positioning screws 203, acting as a clamp. The second positioning screws 203 are constructed from carbon structural steel, and their outer surfaces are coated with an insulating coating or rubber material to further enhance the module's insulation performance and meet the requirements of high-voltage environments. Second nuts 208 are used to secure the fourth press plate 202 and the four second positioning screws 203.

[0038] The second disc spring assembly 204 includes a second pressure top plate 2041, a second disc spring 2042 and a second pressure top rod 2043. The second insulating heat block 207, the second pressure top plate 2041, the second pressure top rod 2043 and the second disc spring 2042 are connected in sequence. The second disc spring 2042 is installed on the third pressing plate 201 of the second pressing frame.

[0039] The second pressure plate 2041 is used to press against the second insulating heat block 207. The second disc spring 2042 is composed of multiple conical ring-shaped stacked springs (made of high-strength spring steel). Its maximum coverage area is no less than two-thirds of the installation area of ​​the rectifier tube 205. This prevents a small size from affecting uniform pressure transmission, while a large size from affecting the overall structure's footprint and economic efficiency. The second pressure pin 2043 is used to secure the second pressure plate 2041.

[0040] The pressing force during the installation process of the rectifier tube working unit 2 is transmitted in sequence through the second pressure-applying push rod 2043 and the second pressure-applying push plate 2041. The pressure is not directly transmitted between the third pressing plate 201 and the fourth pressing plate 202. The pressing force application speed can be slow and is not affected by the module's own components. After the pressing force is applied, the third pressing plate 201, the fourth pressing plate 202 and the second positioning screw 203 are connected by threads and fixed with a square diagonal force to ensure the uniformity of the overall force. During the disassembly process, the unloading force is also loaded through the second pressure-applying push rod 2043. The pressure is not directly transmitted between the third pressing plate 201 and the fourth pressing plate 202. The release rate is slow and controllable, which can effectively avoid the problem that the second positioning screw 203 may be subjected to excessive force and unable to apply torque and teeth when the pressure is released directly through the third pressing plate 201 and the fourth pressing plate 202, and the risk of personal safety caused by the pressure being released too quickly causing the component to pop out.

[0041] The heat dissipation module includes two first radiators 105, a second radiator 106, a connecting water pipe 111, a water inlet pipe 112, a water outlet pipe 113 and two drainage baffles 109. The first radiator 105 is installed on both sides of the second radiator 106. There is an installation gap between the first radiator 105 and the second radiator 106. The two sides of the IGBT device are closely attached to the first radiator 105 and the second radiator 106. The water inlet of the second radiator 106 is connected to the water outlet of the first radiator 105 above through the connecting water pipe 111, and the water outlet of the second radiator 106 is connected to the water outlet of the first radiator 105 above through the connecting water pipe 111. The tube 111 is connected to the water inlet of the first radiator 105 below, and the two drainage baffles 109 are respectively installed on the two first radiators 105 by screws. The water inlet pipe 112 passes through the drainage baffle 109 and is connected to the water inlet of the upper first radiator 105. The water outlet pipe 113 passes through the drainage baffle 109 and is connected to the water outlet of the first radiator 105 below. The explosion-proof baffle 110 is installed on the front side of the second radiator 106. The top of the upper first radiator 105 is connected to the first insulating heat block 104, and the bottom of the lower first radiator 105 is connected to the first disc spring assembly 108.

[0042] The diversion baffle 109 includes a blocking mounting portion 1091, multiple blocking portions 1093 and a guide portion 1094. The blocking mounting portion 1091 is installed at the water outlet and water inlet of the first radiator 105 by bolts. The blocking mounting portion 1091 is provided with an inlet hole 1092, which is respectively passed through by the water inlet pipe 112 and the water outlet pipe 113. The blocking portions 1093 are all connected around the blocking mounting portion 1091 to form a flow limiting groove. A notch is provided at the flow limiting groove, which is connected to the guide portion 1094.

[0043] The blocking mounting portion 1091 is the main part of the diversion baffle 109, and is used to isolate the first radiator 105 from the cooling water in the event of water leakage from the interface. The blocking portion 1093 prevents the cooling water from flowing out of the blocking mounting portion 1091, and the diversion portion 1094 diverts the cooling water out of the blocking mounting portion 1091. The first radiator 105 is used to cool the IGBT device 115 and the equalizing resistor 114. The second radiator 106 is used to cool the two IGBT devices 115 and the rectifier tube 205. The connecting water pipe 111 adopts a flexible polytetrafluoroethylene tube with strong plasticity. It can effectively adjust the installation deviation of its components and radiators and reduce local stress. At the same time, it has a certain pressure-bearing buffer space when the water pressure rises instantaneously to prevent instantaneous collapse. The water inlet pipe 112 is used to transport cooling water to the first radiator 105. The water outlet pipe 113 is used to transport cooling water from the first radiator 105. The diversion baffle 109 is made of high-strength anti-corrosion metal material (stainless steel, aluminum alloy), distributed at the water inlet and outlet of the module corresponding to the first radiator 105 (in the horizontal direction relative to the whole), and fixed by bolt connection. The diversion baffle 109 is an open groove structure (the blocking mounting part 1091 is surrounded by the blocking part 1093). The open side of the blocking mounting part 1091 is set to a 30° to 60° guide part 1094 leading out to the area outside the radiator below. The part of the outer surface that is in direct contact with the radiator has a self-sealing structure. Under unexpected working conditions such as long-term aging of the water pipe or excessive water pressure, the leaked coolant is collected and discharged out of the module to prevent it from flowing directly to the surface of electrical components inside the flexible DC transmission module and affecting normal operation.

[0044] The explosion-proof baffle 110 includes a mounting block 1101 and an explosion-proof plate 1102. The mounting block 1101 is installed on the front side of the second radiator 106 of the heat dissipation module. The explosion-proof plate 1102 is connected to both sides of the mounting block 1101. The explosion-proof plate 1102 just blocks the installation gap between the first radiator 105 and the second radiator 106. The mounting block 1101 is provided with a first through hole 1103 and a second through hole 1104. The connecting water pipe 111 passes through the first through hole 1103 and the second through hole 1104 respectively.

[0045] Mounting block 1101 facilitates connection of water pipe 111 to second heat sink 106 via first through-hole 1103 and second through-hole 1104, and also secures explosion-proof plate 1102. Explosion-proof plate 1102 effectively dissipates the impact of the explosion of IGBT device 115, preventing damage to peripheral components of the module and the waterway, and minimizing the risk of further damage.

[0046] The IGBT device 115, rectifier 205, and grading resistor 114 operate independently, with multiple operating conditions, including rectification and inversion. The heat dissipation of the devices varies significantly under different operating conditions. The four components are cooled by three heat sinks (including the first heat sink 105 and the second heat sink 106). The combined heat dissipation capacity of the first heat sink 105 and the second heat sink 106 is compatible with all operating conditions, making the design more compact under high-power conditions. Furthermore, the module water connection adopts a full series connection. Compared with the traditional solution of independent heat dissipation and parallel connection of water paths for each component, this reduces the difficulty of multi-condition design and the uncertainty of operating flow matching. When the module structure under this solution is applied to the entire valve system, the number of water pipe joints is greatly reduced, reducing the potential risk of water leakage. Compared with the parallel connection of multiple modules or the full series connection of modules, the piping design of the entire valve is simple and economical. The designed piping and structural protection scheme also effectively improves the stability of the system operation when encountering extreme hydropower operating conditions.

[0047] The above specific implementation manner is a preferred embodiment of the present invention and does not limit the present invention. Any other changes or other equivalent replacement methods that do not deviate from the technical solution of the present invention are included in the protection scope of the present invention.

Claims

1. A flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple working conditions, characterized in that: It includes an IGBT working unit and a rectifier tube working unit. The IGBT working unit includes a heat dissipation module, an IGBT device, an explosion-proof baffle, a voltage-grading resistor, a first disc spring assembly, a first insulating heat block, and a first pressing frame. The first disc spring assembly, the heat dissipation module, and the first insulating heat block are sequentially mounted on the first pressing frame. The IGBT device and the voltage-grading resistor are both mounted on the heat dissipation module. The explosion-proof baffle is mounted on the heat dissipation module and covers the side of the IGBT device. The heat dissipation module is connected to the rectifier tube working unit. The explosion-proof baffle includes a mounting block and an explosion-proof plate. The mounting block is mounted on the heat dissipation module. The explosion-proof plate is connected to both sides of the mounting block. The mounting block is provided with a first through hole and a second through hole. The connecting water pipe of the heat dissipation module passes through the first through hole and the second through hole respectively. The explosion-proof plate has a wing-type or fishbone-type structure. The first disc spring assembly includes a first pressure top plate, a first disc spring and a first pressure top rod, one end of the first pressure top rod is connected to the first pressure top plate, and the other end of the first pressure top rod is installed on the first disc spring. The first pressing frame is provided with a first circular groove, the first disc spring is installed in the first circular groove, and the first pressure top plate is connected to the heat dissipation module; the coverage area of ​​the first disc spring is greater than 50% of the installation area of ​​the IGBT device.

2. A flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions according to claim 1, characterized in that: The rectifier tube working unit includes a second pressing frame, a second disc spring assembly, a second insulating heat block, a positioning pad and a rectifier tube. The second disc spring assembly, the second insulating heat block, the heat dissipation module, the rectifier tube and the positioning pad are connected in sequence. The second disc spring assembly and the positioning pad are both installed on the second pressing frame.

3. A flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions according to claim 2, characterized in that: The second pressing frame includes a third pressing plate, a fourth pressing plate, multiple second positioning screws and multiple second nuts. One end of the multiple second positioning screws is installed on the third pressing plate, and the other ends of the multiple second positioning screws pass through the fourth pressing plate and are connected to the multiple second nuts. The second disc spring assembly is installed on the third pressing plate, and the positioning pad is installed on the fourth pressing plate.

4. The flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple working conditions according to claim 2 is characterized in that: The second disc spring assembly includes a second pressure top plate, a second disc spring and a second pressure top rod, one end of the second pressure top rod is connected to the second pressure top plate, the other end of the second pressure top rod is installed on the second disc spring, the second pressing frame is provided with a second circular groove, the second disc spring is installed in the second circular groove, and the second pressure top plate is connected to the second insulating heat block.

5. The flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple working conditions according to claim 1 is characterized in that: The heat dissipation module includes a first radiator, a second radiator, a connecting water pipe, a water inlet pipe, a water outlet pipe and a drainage baffle. The first radiator is installed on both sides of the second radiator. The two sides of the IGBT device are tightly attached to the first radiator and the second radiator. The second radiator is connected to the first radiator through a connecting water pipe. The drainage baffle is installed on the first radiator. The water inlet pipe passes through the drainage baffle and is connected to one of the first radiators. The water outlet pipe passes through the drainage baffle and is connected to another of the first radiators. The explosion-proof baffle is installed on the second radiator. One of the first radiators is connected to the insulating heat block, and the other first radiator is connected to the first disc spring assembly.

6. A flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions according to claim 5, characterized in that: The diversion baffle includes a blocking mounting portion, a guide portion and multiple blocking portions. The blocking mounting portion is mounted on the first radiator by bolts. The blocking mounting portion is provided with a pipe inlet hole, and the water inlet pipe and the water outlet pipe pass through the pipe inlet hole respectively. The multiple blocking portions are connected to the blocking mounting portion to form a flow limiting groove. The flow limiting groove is provided with a notch, and the notch is connected to the guide portion.

7. The flexible direct current transmission module that takes into account heat dissipation of multiple devices and multiple operating conditions according to claim 1, characterized in that: The first pressing frame includes a first pressing plate, a second pressing plate, multiple first positioning screws and a first nut. One end of the multiple first positioning screws is installed on the second pressing plate, and the other end of the multiple first positioning screws passes through the first pressing plate and is connected to the first nut. The first disc spring assembly is installed on the second pressing plate, and the insulating heat block is installed on the first pressing plate.

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