PCB board processing method, PCB board and PCB board drilling method

Abstract

The application relates to the technical field of PCB processing, and specifically discloses a PCB processing method, a PCB and a PCB drilling method; wherein the PCB processing method comprises the following steps: selecting at least one core plate, opening a preset hole at a preset position on the core plate according to preset parameters, setting a distinguishing layer on the hole wall of the preset hole, the material of the distinguishing layer being different from that of the core plate, selecting a covering layer, and bonding the covering layer with the core plate. The PCB obtained by the PCB processing method has a preset hole arranged inside, the preset hole is arranged near a position on the PCB which needs to be drilled, the expansion and contraction coefficient of the preset hole can more accurately reflect the expansion and contraction coefficient of the position on the PCB which needs to be drilled, the expansion and contraction compensation precision of the drilling position can be effectively improved, and the drilling alignment can be more accurate.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, and in particular to a PCB board processing method, a PCB board, and a PCB board drilling method. Background Technology

[0002] In PCB manufacturing, when forming multilayer PCBs through lamination, the uniformity variation between layers increases with the number of stacked layers, making it increasingly difficult to control expansion and contraction. This can easily lead to significant alignment errors in the subsequent single-drilling process, affecting the overall drilling quality. To improve the accuracy of single-drilling, CCD-based target holes are now available on the market, providing a compensation coefficient to offset drilling errors. Typically, OPL equipment is used to punch four target holes at the four corners of the PCB, and these four target holes are captured during the single-drilling process by the CCD-based equipment to compensate for expansion and contraction.

[0003] However, the distance between the target holes is affected by the design size of the PCB board. The larger the size of the PCB board, the larger the distance between the target holes. When the CCD is used for target positioning, the error becomes larger, and the obtained coefficient compensation cannot accurately reflect the expansion and contraction of the PCB board, which in turn leads to unsatisfactory alignment accuracy in one drilling operation. Summary of the Invention

[0004] Based on this, it is necessary to propose a PCB board processing method, a PCB board, and a PCB board drilling method to effectively increase the alignment accuracy of PCB board drilling in one pass, in order to address the above problems.

[0005] In a first aspect, embodiments of the present invention provide a PCB board processing method, the PCB board processing method comprising:

[0006] Select at least one core board, and drill a preset hole at a preset position on the core board according to preset parameters. The preset position is selected close to the position on the core board where the hole needs to be drilled.

[0007] A differentiating layer is provided on the wall of the preset hole, and the material of the differentiating layer is different from that of the core board;

[0008] Select a cover layer and attach the cover layer to the core board.

[0009] In some embodiments of the PCB board processing method, the step of selecting at least one core board and opening a preset hole at a preset position on the core board according to preset parameters includes:

[0010] Select at least one core board, and divide the core board into multiple preset areas according to the circuit layout of the core board, and process at least one preset hole in each preset area;

[0011] The step of setting a distinguishing layer on the wall of the preset hole includes: plating a copper layer on the wall of the preset hole by electroplating.

[0012] In some embodiments of the PCB board processing method, the step of forming at least one preset hole in each preset area includes:

[0013] Four pre-set holes with a diameter of 1.6 mm are opened in each of the pre-set areas;

[0014] Three or four pre-drilled holes are made in each of the preset areas.

[0015] In some embodiments of the PCB board processing method, the step of selecting a cover layer and bonding the cover layer to the core board includes:

[0016] Select multiple core boards, stack the multiple core boards together, and place a curing sheet between two adjacent core boards;

[0017] The cover layer is stacked on the two outermost core plates, and the curing sheet is disposed between the cover layer and the core plates.

[0018] In some embodiments of the PCB board processing method, after the step of selecting the cover layer and bonding the cover layer to the core board, the method further includes:

[0019] The cover layer and the core board are pressed together to form a PCB board;

[0020] Mill the edges of the PCB board to remove any protruding or overflowing material from its perimeter.

[0021] The location of the unlined circuits inside the PCB board is determined by X-ray imaging, and positioning holes are drilled at the edge of the PCB board where there are no circuits.

[0022] In some embodiments of the PCB board processing method, the step of drilling positioning holes at the edge of the PCB board where no circuits are provided includes:

[0023] At least three positioning holes are drilled on the edge of the PCB board using a drilling machine equipped with an X-ray device, and the at least three positioning holes are arranged in an "L" shape.

[0024] Directional holes for connection with locating pins are drilled on the edge of the PCB board using a drilling machine equipped with an X-ray device.

[0025] Secondly, embodiments of the present invention also provide a PCB board manufactured according to the PCB board processing method described above, the PCB board comprising:

[0026] A multilayer core board, wherein multiple preset holes are provided through the core board, and the inner wall of the preset holes is plated with a differentiating layer; the multiple core boards are stacked together, and two adjacent core boards are fixedly connected.

[0027] The two outermost core plates are also connected to a cover layer, which covers the preset hole.

[0028] In some embodiments of the PCB board, at least three positioning holes are provided on the edge of the PCB board, and the at least three positioning holes are arranged in an "L" shape. The PCB board is also provided with orientation holes for determining the orientation of the PCB board.

[0029] Thirdly, embodiments of the present invention also provide a PCB drilling method for drilling holes in the PCB board described above, the PCB drilling method comprising:

[0030] The PCB board is placed on the worktable of the primary drilling equipment. The primary drilling equipment processes the depth control hole at the position of the preset hole to form a depth control hole that communicates with the preset hole. Along the axial direction of the depth control hole, the size of the preset hole is smaller than the size of the depth control hole.

[0031] The differentiating layer is captured using a single-drilling device to obtain the actual position information of the corresponding preset hole, and the expansion and contraction coefficient is calculated based on the actual position information and the preset position.

[0032] The PCB board is drilled once using a single-drilling machine based on the coefficient of expansion and contraction.

[0033] In some embodiments of the PCB drilling method, the step of forming a depth-controlled drill hole communicating with the preset hole at the location of the preset hole using a primary drilling machine includes:

[0034] Select a tool with a drilling range larger than the preset hole diameter, and use the tool to drill a depth-controlled hole coaxial with the preset hole at the position of the preset hole on the PCB board.

[0035] The embodiments of the present invention have the following beneficial effects:

[0036] According to the PCB board processing method, PCB board, and PCB board drilling method in the above embodiments, the PCB board processing method pre-processes preset holes on the core board. After the cover layer and the core board are bonded together, the cover layer covers the preset holes, making the preset holes buried. After the cover layer and the core board are pressed together, a PCB board with preset holes inside can be processed. The expansion and contraction coefficient of the preset holes is consistent with the expansion and contraction coefficient of the PCB board after pressing. Through the above method, it can be understood that buried holes are preset in the core board, thus forming buried holes that can reflect the expansion and contraction coefficient inside the PCB board. When drilling the PCB board, the preset holes are first drilled. By grasping the position of the differentiating layer, the position information of the preset holes after pressing can be obtained. Then, the position information of the preset holes after pressing can be compared with preset parameters to obtain the expansion and contraction coefficient. Compared to existing PCBs that only have target holes at the four corners, this invention provides a PCB with pre-set holes inside, obtained through a PCB processing method. The pre-set holes are located near the drilling positions on the PCB, so the expansion and contraction coefficient of the pre-set holes can more accurately reflect the expansion and contraction coefficient of the drilling positions on the PCB, effectively improving the expansion and contraction compensation accuracy of the drilling positions, and thus ensuring more accurate drilling alignment. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] in:

[0039] Figure 1 A flowchart of a PCB board processing method according to an embodiment of the present invention is shown;

[0040] Figure 2 A schematic diagram of a PCB board processing method according to an embodiment of the present invention is shown.

[0041] Figure 3 A front view of a PCB board according to an embodiment of the present invention is shown;

[0042] Figure 4 A cross-sectional view of a PCB board according to an embodiment of the present invention is shown;

[0043] Figure 5 A flowchart of a PCB drilling method according to an embodiment of the present invention is shown.

[0044] Explanation of key component symbols:

[0045] 1. Core board; 11. Epoxy board; 12. Copper foil layer; 13. Pre-drilled holes; 131. Differentiating layer; 14. Pre-drilled holes;

[0046] 2. Covering layer; 3. Curing sheet; 4. Positioning hole; 5. Orientation hole. Detailed Implementation

[0047] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0048] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0050] In a first aspect, embodiments of the present invention provide a PCB board processing method. When the PCB board formed by the PCB board processing method is drilled once, the expansion and contraction coefficient of the PCB board formed by the processing can be obtained first. The expansion and contraction coefficient can be used to better determine the position of the first drill, making the alignment of the first drill more accurate.

[0051] In the embodiments of the present invention, please refer to Figure 1 and Figure 2 The PCB manufacturing process may include the following steps:

[0052] S10. Select at least one core board and open a preset hole at a preset position on the core board according to preset parameters. The preset position is selected close to the position on the core board where the hole needs to be drilled.

[0053] S20. A differentiating layer is provided on the wall of the preset hole, the material of the differentiating layer being different from the material of the core board;

[0054] S30. Select the cover layer and attach the cover layer to the core board.

[0055] The number of layers in a PCB depends on the number of copper foil layers 12. Generally, three-layer or higher PCBs are formed by laminating multiple core boards 1 together, or by laminating multiple core boards 1 and cover layers 2 together. In this embodiment of the invention, the processing of a six-layer PCB is used as an example. It should be noted that in this embodiment of the invention, the core board 1 can be composed of an epoxy board 11 and copper foil layers 12 disposed at both ends of the epoxy board 11. The epoxy board 11 is made of fiberglass cloth and resin adhesive, and the epoxy board 11 provides support for the two copper foil layers 12. The six-layer PCB in this embodiment of the invention is formed by laminating two core boards 1 and two cover layers 2 together. It should be noted that the cover layer 2 can be a copper layer.

[0056] Before lamination, a pre-drilled hole 13 needs to be drilled through the core board 1 at a pre-defined position according to preset parameters. Each preset parameter determines the coordinates of a preset position on the core board 1, thus determining the initial position of the pre-drilled hole 13 on the core board 1. This preset position needs to be close to the drilling position when drilling holes in the PCB board later, so that the pre-drilled hole can more accurately reflect the expansion and contraction coefficient of the subsequent drilling position, improving the accuracy of drilling expansion and contraction compensation.

[0057] It should be noted that the copper foil layer 12 needs to be designed with circuitry according to requirements. Therefore, when opening the pre-drilled holes 13 on the core board 1, these circuits need to be avoided. In order to ensure the smooth progress of subsequent processes, a distinguishing layer 131 also needs to be plated on the inner wall of the pre-drilled holes 13. The material of the distinguishing layer 131 needs to be different from that of the core board 1. The purpose of the distinguishing layer 131 is to facilitate the location of the pre-drilled holes 13.

[0058] During the pressing process, the two core boards 1 are pressed together, and then the two cover layers are pressed onto the opposite ends of the two core boards 1, so that the PCB board is formed as a whole. At this time, the preset hole 13 is blocked by the copper foil layer 12 after pressing, so that the preset hole 13 layer is a buried hole.

[0059] The above method can be used to process a PCB board with a preset hole 13. When drilling the PCB board with a primary drilling machine, the preset hole 13 needs to be drilled first. In this way, the position of the preset hole 13 can be determined by grasping the position of the differentiating layer 131. At this time, the expansion and contraction coefficient is obtained by matching the actual position information of the preset hole 13 with the preset position. The expansion and contraction coefficient can reflect the magnitude of the uniformity error between two adjacent core boards 1 and between the core board 1 and the cover layer 2 during the lamination process. The drilling position of the primary drilling of the PCB board is determined by the expansion and contraction coefficient, thereby increasing the accuracy of the primary drilling of the PCB board.

[0060] In one specific embodiment, step S10 includes: S110, selecting at least one core board, dividing the core board into multiple preset areas according to the circuit layout of the core board, and forming at least one preset hole in each preset area; step S20 includes: S210, plating a copper layer on the hole wall of the preset hole by electroplating.

[0061] The selected core boards need to have consistent dimensions because the copper foil layer on the core board needs to be configured with circuitry. These circuits can be divided into multiple preset regions based on the required drilling position. To minimize the error in the obtained expansion and contraction coefficient, preset holes can be drilled in each of these preset regions to obtain the expansion and contraction coefficient for each preset region. It should be noted that, in this embodiment of the invention, a layer of copper can be electroplated onto the wall of the preset hole to facilitate the positioning of the preset hole.

[0062] In one specific embodiment, step S110 includes the following steps:

[0063] S111. Four preset holes with a diameter of 1.6mm are opened in each preset area;

[0064] S112. Three or four pre-drilled holes are made in each of the preset areas.

[0065] Please refer to Figure 2 As mentioned above, the core board 1 can be divided into preset areas based on the circuitry and the locations requiring drilling. Each preset area contains a preset hole 13. When dividing the preset areas, it is preferable to divide them into rectangles. This facilitates the regular and equidistant placement of the preset holes 13 within the preset areas. Specifically, a preset hole 13 can be placed at each of the four corners or along each of the four sides of the preset area, allowing each preset hole 13 to reflect the expansion and contraction within a certain range in its vicinity. Alternatively, the positions of the preset holes 13 can be determined based on the circuitry layout on the core board 1. Multiple preset holes 13 can be evenly spaced or distributed according to a certain pattern to form a preset area. The preset holes 13 are responsible for reflecting the expansion and contraction coefficient within the enclosed preset area, and multiple preset holes 13 within the same preset area are responsible for the expansion and contraction coefficient within a specific range of the preset area.

[0066] It should be noted that the diameter of the preset hole 13 is not limited in this embodiment of the invention. It should not affect the subsequent processing of the core board 1, and should be easy to observe. In this embodiment of the invention, the diameter of the preset hole 13 is set to 1.6 mm.

[0067] It should be noted that, please refer to... Figure 3Subsequently, when obtaining the position of the preset hole 13, it is necessary to use a depth-controlled drill to drill to connect with the preset hole 13 so that the preset hole 13 is exposed. However, sometimes if the drilling is incorrect, the preset hole 13 may be drilled through directly, which will not accurately determine the position information of the preset hole 13. To avoid this situation, an additional set of pre-set holes 14 can be set in each preset area of ​​the core board 1 where the preset hole 13 needs to be set. The number of pre-set holes 14 is preferably three or four, that is, the number of pre-set holes 14 is close to the number of preset holes 13, or equal to the number of preset holes 13. Figure 3 As shown in the figure, four pre-drilled holes 14 are provided in each pre-drilled area. The pre-drilled holes 14 are provided to ensure that even if the pre-drilled holes 13 are rendered unusable, the expansion / contraction coefficient can still be obtained by drilling the pre-drilled holes 14. Alternatively, in the process of setting pre-drilled holes 13 on the core board 1, pre-drilled holes 13 can be provided on each core board 1. This way, even if the pre-drilled hole 13 on one core board 1 is rendered unusable, the expansion / contraction coefficient can still be obtained from the pre-drilled hole 13 on another core board 1.

[0068] In one specific embodiment, step S30 includes:

[0069] S31. Select a plurality of the core boards, stack the plurality of the core boards together, and place a curing sheet between two adjacent core boards;

[0070] S32. The cover layer is stacked on the two outermost core plates, and the curing sheet is disposed between the cover layer and the core plates;

[0071] Please refer to Figure 2 When pressing the core board 1 and the cover layer 2, a pressing medium, namely a curing sheet 3, is required. In this embodiment of the invention, the curing sheet 3 can be made of PP (polypropylene). During pressing, the curing sheet 3 is heated and melted by the high temperature and pressure of the pressing device, and then cured to press the cover layer 2 onto the core board 1 and to press the two core boards 1 together. It should be noted that the pressing device can be an existing device, and the pressing process can refer to existing processes, which will not be described in detail here.

[0072] In one embodiment, the method further includes the following after step S30:

[0073] S40. Press the cover layer and the core board together to form a PCB board;

[0074] S50. Mill the edges of the PCB board to remove any protruding or overflowing material from the periphery of the PCB board.

[0075] S60. Use X-ray imaging to determine the location of the unlined circuits inside the PCB board, and drill positioning holes at the unlined circuit locations on the edge of the PCB board.

[0076] When the cover layer and the core board are pressed together, the melted curing film will overflow, leaving the perimeter of the formed multilayer PCB board with re-cured curing film, which affects the appearance of the PCB board and the quality of the pressing. Therefore, it is necessary to mill off the curing film on the perimeter of the PCB board.

[0077] It should be noted that by setting positioning holes on the PCB board, the position of the PCB board can be fixed by inserting positioning pins into the positioning holes during the first drilling of the PCB board, so as to prevent the position of the PCB board from shifting.

[0078] In one specific embodiment, step S50 includes:

[0079] S51. Drill at least three positioning holes on the edge of the PCB board using a drilling machine equipped with an X-RAY device, wherein the at least three positioning holes are arranged in an "L" shape.

[0080] S52. Drill directional holes on the edge of the PCB board using a drilling machine equipped with an X-ray device for connection with locating pins.

[0081] Please refer to Figure 2 Generally, three positioning holes 4 are made on the PCB board. These three positioning holes 4 are arranged in an "L" shape along the edge of the PCB board. When a pin is inserted into the positioning hole 4, the "L" shape provides a better positioning effect. It should be noted that, in a preferred embodiment, three more positioning holes 4 can be made. These three positioning holes 4 are also arranged in an "L" shape along the edge of the PCB board. If a pin is driven into a positioning hole 4 and that positioning hole 4 is damaged, it is convenient to replace it with another set of positioning holes 4 for positioning.

[0082] Directional hole 5 is positioned on the PCB board at a location where its orientation can be determined, not at the center. This allows for the placement of a locating pin on the drilling machine's worktable. The engagement of directional hole 5 with the locating pin, and locating hole 4 with the pin, ensures accurate PCB board positioning and prevents drilling errors caused by incorrect orientation. It's important to note that both locating hole 4 and directional hole 5 can be drilled using a drilling machine equipped with X-ray equipment. The X-ray function allows visualization of areas on the PCB board without traces, enabling drilling of these un-traceable edges.

[0083] Secondly, please refer to Figure 3 and Figure 4This invention also provides a PCB board manufactured according to the aforementioned PCB board processing method. The PCB board includes a multilayer core board 1, with multiple pre-set holes 13 penetrating through it. The inner wall of each pre-set hole 13 is plated with a differentiating layer 131 distinct from the core board 1. The multilayer core boards 1 are stacked together, and adjacent core boards 1 are connected by a curing sheet 3. A cover layer 2 is also connected to the two outermost core boards 1 via the curing sheet 3, making the pre-set holes 13 buried vias. It should be noted that the PCB board has two core boards 1, each core board 1 having upper and lower copper foil layers 12.

[0084] In one specific embodiment, the PCB board is rectangular, and at least three positioning holes 4 are provided along its edges. Preferably, six positioning holes 4 are provided. Three positioning holes 4 are spaced apart at each of the opposite ends of the PCB board. This allows any one positioning hole 4 at one end of the PCB board to engage with two positioning holes 4 at the other end. The three positioning holes 4 form an "L" shape for positioning the PCB board. Notably, the PCB board also includes orientation holes 5 for determining its orientation. These orientation holes 5 are located at one end between the two rows of positioning holes 4 on the PCB board, enabling the determination of whether the PCB board is correctly positioned.

[0085] Thirdly, please refer to Figure 5 This invention also provides a PCB drilling method for drilling holes in the aforementioned PCB board, the PCB drilling method comprising the following steps:

[0086] S60. Place the PCB board on the worktable of the primary drilling equipment, and use the primary drilling equipment to process a depth-controlled drill hole communicating with the preset hole at the position of the preset hole. Along the axial direction of the depth-controlled drill hole, the size of the preset hole is smaller than the size of the depth-controlled drill hole.

[0087] S70. Use a primary drilling device to capture the differentiating layer to obtain the actual position information of the corresponding preset hole, and calculate the expansion and contraction coefficient based on the actual position information and the preset position.

[0088] S80. Drill the PCB board once using a single-drilling machine according to the expansion and contraction coefficient.

[0089] When drilling a PCB board in one pass using a primary drilling machine, pins are inserted into the positioning holes to fix the PCB board on the worktable of the primary drilling machine. The primary drilling machine has a depth-controlled drilling structure with a depth control accuracy of ±0.02mm, which is much smaller than the thickness of the core board. Therefore, a milling cutter can be mounted on the primary drilling machine. The milling cutter can drill a hole at the position of the preset hole on the PCB board with controlled depth. The purpose of controlled depth drilling is to expose the preset hole so that the preset hole can be easily grasped, and it cannot drill through the core board. Therefore, the milling depth needs to be determined according to the depth of the preset hole.

[0090] To ensure the pre-drilled hole is fully exposed, a flat-end mill with a suitable machining range must be selected. The machining range of the flat-end mill is chosen based on the diameter of the pre-drilled hole to successfully expose it. The inner wall of the exposed pre-drilled hole has a differentiating layer, which is a copper layer plated on by electroplating. Specifically, the position of the differentiating layer can be captured by a CCD camera on the drilling equipment, thereby determining the position of the pre-drilled hole. Then, by matching the position of the pre-drilled hole after pressing with the position determined by preset parameters, the expansion and contraction coefficient can be obtained. This increases the accuracy of subsequent single-drilling of the PCB board.

[0091] In one specific embodiment, step S60 includes: selecting a tool with a drilling range larger than the preset hole diameter, and using the tool to drill a depth-controlled hole coaxial with the preset hole at the position of the preset hole on the PCB board. The tool mentioned above can be a milling cutter, a grooving cutter, or other tools with a facet angle of 180 degrees, etc., and is not specifically limited here; it can be selected according to the specific scenario.

[0092] In one application scenario, considering that the drilling deviation due to expansion and contraction during the actual lamination and molding of the PCB board is no more than 0.3mm, the machining range of the flat-end mill can be selected to be at least 0.6mm larger than the preset hole diameter. In this case, even when milling the preset hole into the PCB board using preset parameters, the preset hole will be completely milled out.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A method of processing a PCB board, characterized by, Includes the following steps: Select at least one core board and drill a preset hole at a preset position on the core board according to preset parameters, including: dividing the core board into multiple preset areas according to the circuit layout of the core board, and forming at least one preset hole in each preset area; the preset position is selected close to the position on the core board where the hole needs to be drilled; A differentiating layer is provided on the wall of the preset hole, and the material of the differentiating layer is different from that of the core board; Select a cover layer and attach the cover layer to the core board; The core board with the cover layer is pressed together. The expansion and contraction coefficient is obtained based on the preset position parameters of the preset holes and the actual position parameters of the preset holes after pressing. The actual position of the hole to be drilled on the core board is obtained through the expansion and contraction coefficient.

2. The PCB board processing method of claim 1, wherein, The step of setting a distinguishing layer on the wall of the preset hole includes: plating a copper layer on the wall of the preset hole by electroplating.

3. The PCB processing method of claim 2, wherein, The step of forming at least one preset hole in each preset area includes: Four pre-set holes with a diameter of 1.6 mm are opened in each of the pre-set areas; Three or four pre-drilled holes are made in each of the preset areas.

4. The PCB board processing method of claim 1, wherein, The step of selecting the cover layer and bonding the cover layer to the core board includes: Select multiple core boards, stack the multiple core boards, and place a curing sheet between two adjacent core boards; The cover layer is stacked on the two outermost core plates, and the curing sheet is disposed between the cover layer and the core plates.

5. The PCB board processing method of claim 1, wherein, After the steps of selecting the cover layer and bonding the cover layer to the core board, the method further includes: The cover layer and the core board are pressed together to form a PCB board; Mill the edges of the PCB board to remove any protruding or overflowing material from its perimeter. The location of the unlined circuitry inside the PCB board is determined by X-ray imaging, and positioning holes are drilled at the edge of the PCB board where the unlined circuitry is located.

6. The PCB processing method of claim 5, wherein, The step of drilling positioning holes at the edge of the PCB board where no traces are provided includes: At least three positioning holes are drilled on the edge of the PCB board using a drilling machine equipped with an X-RAY device, and the at least three positioning holes are arranged in an "L" shape. Directional holes for connection with locating pins are drilled on the edge of the PCB using a drilling machine equipped with an X-ray device.

7. A PCB board manufactured according to the method of manufacturing a PCB board according to any one of claims 1 to 6, characterized in that, include: A multilayer core board, wherein multiple preset holes are provided through the core board, and the inner wall of the preset holes is plated with a differentiating layer; the multiple core boards are stacked together, and two adjacent core boards are fixedly connected. The two outermost core plates are also connected to a cover layer, which covers the preset hole.

8. The PCB board of claim 7, wherein, The PCB board has at least three positioning holes on its edge, and the at least three positioning holes are arranged in an "L" shape. The PCB board also has orientation holes for determining the orientation of the PCB board.

9. A PCB board drilling method for the PCB board of claim 7, characterized by, Includes the following steps: The PCB board is placed on the worktable of the primary drilling equipment. The primary drilling equipment processes the depth control hole at the position of the preset hole to form a depth control hole that communicates with the preset hole. Along the axial direction of the depth control hole, the size of the preset hole is smaller than the size of the depth control hole. The actual position information of the corresponding preset hole is captured by using a first drilling device to capture the distinguished layer, and a shrinkage coefficient is calculated according to the actual position information and the preset position; According to the shrinkage coefficient, the PCB is drilled by using the first drilling device.

10. The PCB board drilling method of claim 9, wherein, The step of forming the depth control drilling hole communicated with the preset hole by using the first drilling device at the position of the preset hole comprises: A cutter with a drilling range greater than the diameter of the preset hole is selected, and the cutter is used to open a depth control drilling hole coaxial with the preset hole at the position of the preset hole on the PCB.

Images