Internal channel design for liquid cooling equipment

Abstract

A microprocessor is attached to a cooling plate. The cooling plate is formed by two identical shells, each shell having a fluid chamber therein communicating with one or more fluid channels and fluid ports. The two shells are attached to each other so that the open top of each fluid chamber faces the other open top so that the two fluid chambers form a large chamber. Fins are positioned inside the fluid chambers so that a fluid channel is formed between every two fins for cooling fluid flow and removing heat from the fins. The fluid chamber formed by the two shells is divided by the fins into a plurality of fluid channels between the fins.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to data center cooling. More specifically, embodiments of the present invention relate to cold plates for liquid cooling of microchips. Background Art

[0002] Cooling is an important factor in the design of computer systems and data centers. The number of high-performance electronic components, such as high-performance processors, packaged inside servers has steadily increased, increasing the amount of heat generated and dissipated during normal operation of the server. If the environment in which the servers used in a data center operate is allowed to increase in temperature over time, the reliability of the server will decrease. Maintaining a proper thermal environment is critical to the proper operation of these servers in the data center and the performance and life of the servers. It requires more effective and efficient cooling solutions, especially when cooling these high-performance servers.

[0003] Liquid cooling can be implemented to remove heat from high-end processors such as CPUs and GPUs. In such systems, the processor abuts a cold plate that acts as a heat sink, with liquid circulated within the cold plate to remove heat from the cold plate. Various designs have been proposed to create a circuitous path for the liquid to flow inside the cold plate, or to increase the contact area of ​​the liquid with the inner surface of the cold plate. Considerations for such designs include pressure, flow, flow resistance, cooling capacity, power consumption, cost, etc. Summary of the invention

[0004] A first aspect of the present invention provides a cooling plate for cooling a microchip, comprising: a first shell and a second shell, wherein the first shell and the second shell each have a fluid chamber formed therein, the fluid chamber having a solid bottom and an open top, the shell also having a fluid port connected to the fluid of the fluid chamber; a plurality of fins, each fin having a length matching the length of the fluid chamber and a width corresponding to the depth of the fluid chamber; wherein the first shell is attached to the second shell so that the open top of the fluid chamber of the first shell faces the open top of the fluid chamber of the second shell; and wherein the plurality of fins are arranged inside the fluid chamber of the first shell and the fluid chamber of the second shell.

[0005] In some embodiments, the plurality of fins includes a first set of fins and a second set of fins, and wherein the first set of fins are attached inside the fluid chamber of the first shell and the second set of fins are attached inside the fluid chamber of the second shell.

[0006] In some embodiments, the first set of fins is attached inside the fluid chamber of the first shell in parallel with the second set of fins being attached inside the fluid chamber of the second shell.

[0007] In some embodiments, the first set of fins are attached inside the fluid chamber of the first shell perpendicularly to the second set of fins attached inside the fluid chamber of the second shell.

[0008] In some embodiments, each of the shells further includes a fluid channel formed in the solid bottom of the fluid chamber and in fluid communication with the port.

[0009] In some embodiments, the cooling plate further includes a baffle positioned between the first set of fins and the second set of fins.

[0010] In some embodiments, each of the first shell and the second shell further includes a secondary fluid channel formed in the solid bottom of the fluid chamber and oriented perpendicularly to and in fluid communication with the fluid channel.

[0011] In some embodiments, at least one of the first set of fins and the second set of fins is attached such that each of the fins forms an acute angle with the solid bottom of the fluid chamber.

[0012] In some embodiments, the first set of fins and the second set of fins are attached such that the fins are staggered so that each of the fins of the first set of fins is aligned between two fins of the second set of fins.

[0013] In some embodiments, each of the first shell and the second shell further comprises a fluid channel formed in the solid bottom of the fluid chamber and connected to the port fluid, wherein the fluid channel formed in the first shell has a different size than the fluid channel formed in the second shell.

[0014] In some embodiments, the first shell and the second shell have the same shape as each other.

[0015] In some embodiments, one of the first shell and the second shell further includes a secondary fluid channel formed in the solid bottom of the fluid chamber.

[0016] A second aspect of the present invention provides a processor and cold plate assembly, comprising: a cold plate; a microprocessor, the microprocessor being attached to the cold plate; wherein the cold plate comprises: a first shell and a second shell, the first shell and the second shell both having a fluid chamber formed therein, the fluid chamber having a solid bottom and an open top, the shell also having a fluid port connected to the fluid of the fluid chamber; a plurality of fins, each fin having a length matching the length of the fluid chamber and a width corresponding to the depth of the fluid chamber; wherein the first shell is attached to the second shell so that the open top of the fluid chamber of the first shell faces the open top of the fluid chamber of the second shell; and wherein the plurality of fins are arranged inside the fluid chamber of the first shell and the fluid chamber of the second shell.

[0017] In some embodiments, the plurality of fins includes a first set of fins and a second set of fins, and wherein the first set of fins are attached inside the fluid chamber of the first shell and the second set of fins are attached inside the fluid chamber of the second shell.

[0018] In some embodiments, each of the shells further includes a fluid channel formed in the solid bottom of the fluid chamber and in fluid communication with the port.

[0019] A third aspect of the present invention provides a method for manufacturing a cold plate for a microchip, comprising: forming a first shell and a second shell, and forming a fluid chamber in each shell, the fluid chamber having a solid bottom and an open top, and also forming a fluid port in each shell that is fluidly connected to the fluid chamber; forming a plurality of fins, each fin having a length matching the length of the fluid chamber and a width corresponding to the depth of the fluid chamber; attaching the fins to the interior of the fluid chamber of at least one of the first shell and the second shell; attaching the first shell to the second shell so that the open top of the fluid chamber of the first shell faces the open top of the fluid chamber of the second shell.

[0020] In some embodiments, forming the plurality of fins includes forming a first set of fins and forming a second set of fins, and attaching the fins inside the fluid chamber includes attaching the first set of fins inside the fluid chamber of the first shell and attaching the second set of fins inside the fluid chamber of the second shell.

[0021] In some embodiments, the first set of fins are attached to be oriented perpendicularly to the second set of fins.

[0022] In some embodiments, at least one of the first set of fins and the second set of fins is attached such that each fin is oriented at an acute angle relative to the solid bottom of the fluid chamber.

[0023] In some embodiments, the method further includes forming a fluid channel at the solid bottom of the fluid chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Embodiments of the invention are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements.

[0025] Figure 1 is a block diagram illustrating an example of a data center facility according to one embodiment.

[0026] Figure 2 is a block diagram illustrating an example of an electronics rack according to one embodiment.

[0027] Figure 3 is a block diagram illustrating an example of a cold plate configuration according to one embodiment.

[0028] Figure 4 is an exploded view showing various elements of a cooling plate according to an embodiment, and Figure 4A yes Figure 4 Cross section of a cooling plate.

[0029] Figure 5 An embodiment with secondary fluid channels is shown.

[0030] Figure 6 An embodiment having a secondary fluid channel with parallel fins is shown.

[0031] Figure 7 An embodiment with vertical fins and secondary fluid channels is shown.

[0032] Figure 8 An embodiment with a secondary fluid chamber is shown.

[0033] Fig. 9 An embodiment is shown having fluid channels formed by short fins.

[0034] Fig.10 A cross section of a cooling plate according to an embodiment is shown.

[0035] Fig.11 A cross section of a cooling plate according to another embodiment is shown.

[0036] Fig.12 A cross section of a cooling plate according to a further embodiment is shown.

[0037] Fig.13is a flow chart illustrating an embodiment of a method for manufacturing a cooling plate. DETAILED DESCRIPTION

[0038] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and the accompanying drawings are illustrative of the present invention and should not be construed as limiting the present invention. Many specific details are described to provide a thorough understanding of various embodiments of the present invention. However, in some cases, in order to provide a concise discussion of embodiments of the present invention, well-known or conventional details are not described.

[0039] References in the specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the invention. The phrase "in one embodiment" appearing in different places in the specification does not necessarily refer to the same embodiment.

[0040] Embodiments disclosed herein include designs for cold plates that can provide efficient cooling for a variety of applications while simplifying production and thereby reducing the cost of the plate. Various designs can involve three parts: two main frames with liquid chambers therein, the main frames can be identical; and a set of fins positioned inside the liquid chambers of the two main frames. Before describing the construction and features of the cold plate, a general description of the computing environment in which the cold plate is implemented is provided below.

[0041] Figure 1 is a block diagram illustrating an example of a data center or data center unit that employs a cooling panel according to the disclosed embodiments. In this example, Figure 1 A top view of at least a portion of a data center is shown. Figure 1 According to one embodiment, a data center system 100 includes one or more rows of electronic racks of information technology (IT) components, equipment, or instruments 101-102, such as, for example, computer servers or computing nodes that provide data services to various clients via a network (e.g., the Internet). In this embodiment, each row includes an array of electronic racks such as electronic racks 110A-110N. However, more or fewer rows of electronic racks may be implemented. Typically, rows 101-102 are aligned in parallel, with front ends facing each other and rear ends facing away from each other, forming an aisle 103 therebetween to allow management personnel to walk therein. However, other configurations or arrangements may also be applied. For example, two rows of electronic racks may face each other back to back without forming an aisle between them, while their front ends face away from each other. The rear ends of the electronic racks may be connected to a room cooling liquid manifold.

[0042] In one embodiment, each of the electronic racks (e.g., electronic racks 110A-110N) includes a housing to accommodate a plurality of IT components arranged in a stack operating therein. The electronic rack may include a cooling liquid manifold, a plurality of server slots (e.g., standard racks or chassis configured with the same or similar form factor), and a plurality of server chassis (also referred to as server blades or server racks) that can be inserted into and removed from the server slots. Each server chassis represents a computing node having one or more processors, memory, and / or permanent storage devices (e.g., hard disks), wherein the computing node may include one or more servers operating therein. At least one of the processors is attached to a liquid cold plate (also referred to as a cold plate assembly) to receive cooling liquid. In addition, one or more optional cooling fans are associated with the server chassis to provide air cooling to the computing nodes contained therein. Note that the cooling system 120 can be coupled to a plurality of data center systems, such as the data center system 100.

[0043] In one embodiment, the cooling system 120 includes an external liquid loop connected to a cooling tower or dry cooler outside the building / house container. The cooling system 120 may include, but is not limited to, evaporative cooling, free air, large thermal mass rejection, and waste heat recovery designs. The cooling system 120 may include or be coupled to a cooling liquid source that provides the cooling liquid.

[0044] In one embodiment, each server chassis is modularly coupled to a cooling liquid manifold so that the server chassis can be removed from the electronics rack without affecting the operation of the cooling liquid manifold and the remaining server chassis in the electronics rack. In another embodiment, each server chassis is coupled to the cooling liquid manifold by a quick release coupling assembly having a server liquid inlet connector and a server liquid outlet connector coupled to a flexible hose to distribute cooling liquid to a cold plate of a processor. The server liquid inlet connector is used to receive cooling liquid from a cooling liquid manifold mounted on a rear end of the electronics rack via a rack liquid inlet connector. The server liquid outlet connector is used to send warmer or hotter liquid carrying heat exchanged from the processor to the cooling liquid manifold via a rack liquid outlet connector and then back to a coolant distribution unit (CDU) within the electronics rack.

[0045] In one embodiment, a cooling liquid manifold disposed on the rear end of each electronic rack is coupled to a liquid supply line 132 (also referred to as a room supply manifold) to receive cooling liquid from the cooling system 120. The cooling liquid is distributed through a liquid distribution loop attached to a cold plate assembly on which the processor is mounted to remove heat from the processor. The cold plate is configured similar to a radiator with liquid distribution pipes attached or embedded therein. The resulting warmer or hotter liquid carrying heat exchanged from the processor is transmitted back to the cooling system 120 via a liquid return line 131 (also referred to as a room return manifold).

[0046] Liquid supply / return lines 131-132 are referred to as data center or room liquid supply / return lines (e.g., global liquid supply / return lines) that supply cooling liquid to all electronic racks in rows 101-102. Liquid supply lines 132 and liquid return lines 131 are coupled to a heat exchanger of a CDU located within each electronic rack, forming a primary loop. A secondary loop of the heat exchanger is coupled to each server chassis in the electronic rack to deliver cooling liquid to the cold plates of the processors.

[0047] In one embodiment, the data center system 100 further includes an optional airflow delivery system 135 to generate airflow to flow through the air space of the server chassis of the electronic rack to exchange heat generated by the computing nodes (e.g., servers) due to the operation of the computing nodes, and discharge the heat-exchanged airflow to the external environment or a cooling system (e.g., an air-liquid heat exchanger) to reduce the temperature of the airflow. For example, the air supply system 135 generates an airflow of cool / cold air to circulate from the aisle 103 through the electronic racks 110A-110N, thereby taking away the exchanged heat.

[0048] A cool air flow enters the electronics rack through the front end of the electronics rack, while a warm / hot air flow leaves the electronics rack from the rear end of the electronics rack. The warm / hot air with the exchanged heat is exhausted from the room / building or cooled using a separate cooling system such as an air-to-liquid heat exchanger. Thus, the cooling system is a liquid-to-air hybrid cooling system, in which a portion of the heat generated by the processor is removed by a cooling liquid via a corresponding cold plate, while the remainder of the heat generated by the processor (or other electronic device or processing equipment) is removed by air flow cooling.

[0049] Figure 2 200 shows an electronic rack according to one embodiment. Figure 1 Any of the electronics racks shown, such as, for example, electronics racks 110A-110N. Figure 2According to one embodiment, the electronics rack 200 includes, but is not limited to, a cooling distribution unit (CDU) 201, a rack management unit (RMU) 202, and one or more server chassis 203A-203E (collectively, server chassis 203). The server chassis 203 can be inserted into an array of server slots (e.g., standard shelves) from the front end 204 or the rear end 205 of the electronics rack 200, respectively. Note that although five server chassis 203A-203E are shown here, more or fewer server chassis can be held within the electronics rack 200. Also note that the specific locations of the CDU 201, RMU 202, and / or server chassis 203 are shown for illustration purposes only; other arrangements or configurations of the CDU 201, RMU 202, and / or server chassis 203 can also be implemented. In one embodiment, the electronics rack 200 can be open to the environment or partially contained by a rack container, as long as the cooling fans can generate airflow from the front to the rear.

[0050] In addition, for at least some of the server chassis 203, an optional fan module (not shown) is associated with the server chassis. Each of the fan modules includes one or more cooling fans. The fan modules can be mounted on the rear end of the server chassis 203 or on the electronics rack to generate an airflow that flows from the front end 204, travels through the air space of the server chassis 203, and exits at the rear end 205 of the electronics rack 200.

[0051] In one embodiment, the CDU 201 mainly includes a heat exchanger 211, a liquid pump 212 and a pump controller (not shown), as well as some other components, such as a liquid reservoir, a power supply, a monitoring sensor, etc. The heat exchanger 211 can be a liquid-liquid heat exchanger. The heat exchanger 211 includes a first loop having an inlet port and an outlet port, and the first loop has a first pair of liquid connectors connected to an external liquid supply / return line 131-132 to form a primary loop. The connector connected to the external liquid supply / return line 131-132 can be set or installed on the rear end 205 of the electronic rack 200. The liquid supply / return line 131-132 (also called the room liquid supply / return line) can be connected to the cooling system 120 as described above.

[0052] In addition, the heat exchanger 211 also includes a second loop with two ports, the second loop having a second pair of liquid connectors coupled to the liquid manifold 225 (also referred to as the rack manifold) to form a secondary loop, which may include a supply manifold (also referred to as a rack liquid supply line or a rack supply manifold) for supplying cooling liquid to the server chassis 203 and a return manifold (also referred to as a rack liquid return line or a rack return manifold) for returning warmer liquid to the CDU 201. Please note that the CDU 201 may be any kind of commercially available or custom-made CDU. Therefore, the details of the CDU 201 will not be described herein.

[0053] Each of the server chassis 203 may include one or more IT components (e.g., a central processing unit or CPU such as an x86 CPU or an ARM CPU, a general / graphical processing unit (GPU), memory, and / or storage devices). Each IT component may perform data processing tasks, wherein the IT component may include software installed in a storage device, loaded into a memory, and executed by one or more processors to perform data processing tasks. The server chassis 203 may include a host server (referred to as a host node) connected to one or more computing servers (also referred to as computing nodes, such as CPU servers and GPU servers). The host server (having one or more CPUs) typically interfaces with clients over a network (e.g., the Internet) to receive requests for specific services such as storage services (e.g., cloud-based storage services such as backup and / or recovery), as well as requests to execute applications to perform certain operations (e.g., image processing, deep data learning algorithms or modeling, etc., as part of a software as a service or SaaS platform). In response to the request, the host server assigns the task to one or more of the computing nodes or computing servers (having one or more GPUs) managed by the host server. The computing servers perform the actual tasks and may generate heat during operation.

[0054] The electronics rack 200 also includes an optional RMU 202 that is configured to provide and manage power supplied to the servers 203 and the CDU 201. The RMU 202 can be coupled to a power supply unit (not shown) to manage the power consumption of the power supply unit. The power supply unit can include necessary circuitry (e.g., an alternating current (AC) to direct current (DC) or DC to DC power converter, a battery, a transformer or a regulator, etc.) to provide power to the remaining components of the electronics rack 200.

[0055] In one embodiment, the RMU 202 includes an optimization module 221 and a rack management controller (RMC) 222. The RMC 222 may include a monitor to monitor the operating status of various components (such as, for example, computing nodes 203, CDU 201, and fan modules) within the electronic rack 200. Specifically, the monitor receives operating data representing the operating environment of the electronic rack 200 from various sensors. For example, the monitor may receive operating data representing the temperature of the processor, cooling liquid, and airflow, which may be captured and collected via various temperature sensors. The monitor may also receive data representing the fan power and pump power generated by the fan module 231 and the liquid pump 212, which may be proportional to their respective speeds. These operating data are referred to as real-time operating data. Please note that the monitor may be implemented as a separate module within the RMU 202.

[0056] Based on the operational data, the optimization module 221 performs optimization using a predetermined optimization function or optimization model to derive a set of optimal fan speeds for the fan module 231 and an optimal pump speed for the liquid pump 212, so that the total power consumption of the liquid pump 212 and the fan module 231 is minimized, while the operational data associated with the liquid pump 212 and the cooling fan of the fan module are within their respective design specifications. Once the optimal pump speed and the optimal fan speed have been determined, the RMC 222 configures the liquid pump 212 and the cooling fan of the fan module 231 based on the optimal pump speed and the fan speed.

[0057] As an example, based on the optimal pump speed, the RMC 222 communicates with the pump controller of the CDU 201 to control the speed of the liquid pump 212, which in turn controls the liquid flow rate of the cooling liquid supplied to the liquid manifold 225 for distribution to at least some of the server chassis 203. Similarly, based on the optimal fan speed, the RMC 222 communicates with each of the fan modules to control the speed of each cooling fan of the fan module 231, thereby controlling the airflow rate of the fan module. Note that each of the fan modules can be individually controlled with its specific optimal fan speed, and different fan modules and / or different cooling fans within the same fan module can have different optimal fan speeds.

[0058] Please note that if Figure 2The rack configuration shown is shown and described for illustrative purposes only; other configurations or arrangements may also be applicable. For example, the CDU 201 may be an optional unit. The cold plate of the server chassis 203 may be coupled to the rack manifold, which may be coupled directly to the room manifolds 131-132 without using a CDU. Although not shown, a power supply unit may be disposed within the electronic rack 200. The power supply unit may be implemented as a standard chassis that is the same or similar to the server chassis, wherein the power supply chassis may be inserted into any standard shelf, replacing any server chassis 203. In addition, the power supply chassis may also include a battery backup unit (BBU) to provide battery power to the server chassis 203 when the main power source is unavailable. The BBU may include one or more battery packs, and each battery pack includes one or more battery cells, and the necessary charging and discharging circuits for charging and discharging the battery cells.

[0059] Figure 3 is a block diagram illustrating a processor cold plate configuration according to one embodiment. The processor / cold plate assembly 300 may represent a processor cold plate assembly such as a processor cold plate assembly 300. Figure 2 Any processor / cold plate configuration of the server chassis 203 shown. Figure 3 , the processor 301 is inserted into a processor socket mounted on a printed circuit board (PCB) or motherboard 302, which is connected to other electronic components or circuits of the data processing system or server. The processor 301 also includes a cold plate 303 attached thereto, the cold plate 303 is connected to the rack manifold, and the rack manifold is connected to the liquid supply line 132 and / or the liquid return line 131. A portion of the heat generated by the processor 301 is removed by the cooling liquid via the cold plate 303. The remainder of the heat enters the air space below or above, which can be removed by the airflow generated by the cooling fan 304. Various embodiments of the cold plate 303 will now be described.

[0060] Figure 4 is an exploded view showing various elements of a cooling plate according to one embodiment. Figure 4 (and other figures herein), various elements are shown as transparent so that the internal structure can be visualized for a better understanding of the design. In this example, the cooling plate is made of two shells 410 and 412, which are also referred to as main frames, which are identical in this example. In addition, the cooling plate includes a fin module 420 housed in the two shells. Each of the shells 410 and 412 can be made of a thermally conductive material, such as aluminum or copper, and fluid chambers 416 and 418 are formed in the shells, respectively. In addition, each shell has fluid channels 413 and 415 formed at the bottom of the fluid chamber. Finally, fluid ports 417 and 419 provide fluid communication between the respective fluid chambers and the outside of the respective shells to circulate cooling fluid from the cooling system. Figure 4The partial enlarged view of FIG. 4 illustrates the outline shape of shell 412 at the cross section indicated by line AA and shows the relative orientation of fluid chamber 418 and fluid channel 415. Shell 410 can be manufactured identically to shell 412, except that it is Figure 4 As shown in the partial enlarged view, the fluid chamber 418 has a solid bottom, an open top and a defined depth. It should be mentioned that although the shapes of the cross-sections of the fluid channels 413, 415 and the fluid ports 417, 419 can vary, they are more commonly designed as semicircular and circular, respectively.

[0061] The fin module is formed of a plurality of fins 422, which can take a variety of shapes and numbers. In this particular example, two sets or rows of fins 422 are attached in parallel to a baffle 424. The fins are sized to have a height (or width) commensurate with the depth of the fluid chamber. In this way, when the two shells are attached together, the fins 422 can contact the bottom wall of the fluid chamber, such as Figure 4A shown.

[0062] Figure 4A After the entire cooling plate is assembled, Figure 4 That is, shell 410 has been attached to shell 412, and fin assembly 420 is inserted into the gap formed by two fluid chambers 416 and 418. By the way, since the two shells are symmetrical, Figure 4A In the example of FIG. 4 , one shell is rotated 180° so that port 417 is on one side and port 419 is on the opposite side of the cooling plate. Figure 4 As shown, both ports can be on the same side. Figure 4A As shown, fin 422 extends from the bottom of fluid chamber 418 to the bottom (or top) of fluid chamber 416. Thus, each space between two fins 422 forms a fin channel 426. That is, fluid entering through one port (such as port 419) will flow inside channel 415 and will then be dispersed through multiple fin channels to fluid channel 413 and then exit through port 417. Because the incoming fluid is cool, it serves to transport heat away from the cold plate, thereby removing heat from any components (such as microchips) in contact with the cold plate.

[0063] In one example, the fin assembly 420 is attached to at least one of the shells. For example, the fins can be welded to one of the shells, or cold welded using, for example, indium solder. This improves the thermal conductivity between the shell and the fin. In addition, in this example, since the shells are symmetrical, the fluid channels 413 and 415 face each other when the cooling plate is assembled. This can cause the cooling fluid to flow directly from one channel 413 and 415 to another channel, thereby reducing the cooling efficiency. To avoid this direct flow, in this example, a baffle 424 is disposed in the middle of the fin 422 so that when assembled, it forces the cooling fluid to flow around it, thereby preventing direct flow from one fluid channel to another fluid channel. Of course, although some other embodiments may be shown without baffles, any disclosed embodiment may be implemented with baffles.

[0064] Figure 4 The fin module 420 consists of several pairs of fins (e.g., two sets of fins) arranged in parallel. Of course, the fin module can be made using several single fins whose width is twice the depth of each fluid chamber. In this way, when installed, each single fin will extend from the bottom of one fluid chamber to the bottom of the complementary fluid chamber. On the other hand, by using paired fins, each fin having a width corresponding to the depth of one fluid chamber, different arrangements of the fins are possible. The following embodiments provide some examples.

[0065] Figure 5 An embodiment is shown in which a set of fins inserted into one fluid chamber is positioned orthogonally to another set of fins placed in a complementary fluid chamber. Figure 5 Two halves of a cooling plate prior to final assembly are shown. The upper half consists of a shell 510 having fins 522 inserted into its fluid chamber and having a fluid channel 513 leading to a port 517. Note that in this example, the fluid channel 513 is oriented perpendicular to the fins 522. In order to adequately distribute the fluid within the fluid chamber and the fluid channel formed by the fins, a multi-fluid channel design is proposed. The basic design requires at least two channels, one primary fluid channel and one secondary fluid channel, but more channels can be formed. The primary fluid channel is the channel connected to the fluid port, and the secondary fluid channel is the channel perpendicular to the primary fluid channel. If the primary fluid channel is perpendicular to the fins, the secondary fluid channel is not required, but the secondary fluid channel can improve performance. If the primary fluid channel is parallel to the fins, the secondary fluid channel is a required structure.

[0066] The following designs take into account different types of combination scenarios. Figure 5In the embodiment of the present invention, the fluid ports 517 and 519 are perpendicular to the fins, so the secondary fluid channel is not necessary, but it is better to have it. The secondary fluid channel 533 is formed perpendicular to the primary fluid channel (i.e., the main fluid channel) 513. The secondary fluid channel 533 is oriented parallel to the fins 522, and it is used to assist in fluid distribution. The complementary shell 512 has a primary fluid chamber 516 oriented perpendicular to the fins. Therefore, a secondary fluid channel 535 is provided, and the secondary fluid channel 535 is oriented perpendicular to the primary fluid channel (i.e., the main fluid channel) 515 for assisting the flow of coolant. When the two shells 510 and 512 are attached to each other, the fins 522 are oriented perpendicular to the fins 523, which increases the flow resistance, thereby enhancing heat transfer. Similarly, in this example, each of the ports 517 and 519 is perpendicular to the fins.

[0067] Figure 6 Another example of a cooling plate is shown, where each shell includes a primary fluid channel (i.e., main fluid channel) and a secondary fluid channel (i.e., secondary cooling channel). The two shells are identical, and Figure 5 and Figure 6 The difference between the two is in the assembly. Figure 5 When assembled together, they are in a vertical orientation, but Figure 6 In parallel in the same direction. Figure 6 In the embodiment of the invention, the two sets of fins are parallel to each other, which reduces the flow resistance and thus reduces the pressure. In addition to the change in orientation, Figure 6 The elements of the embodiment are Figure 5 The elements are identical and are therefore marked with the same reference numerals.

[0068] exist Figure 6 In the example, like Figure 5 As with the embodiments, the ports are positioned perpendicular to the fins, which means that the minimum requirement is a fluid channel. However, this is not a requirement. Figure 7 An embodiment is shown in which one port is perpendicular to the fin and the other port is parallel to the fin. Figure 7 In the case of Figure 5 Likewise, except for the change in orientation, Figure 7 The elements of the embodiment are Figure 5 The components are the same and are therefore marked with the same reference numerals. Figures 5 to 7In the variations shown, one can see the strong advantage of the disclosed design in that the two shells can be manufactured identically to one another and the same set of fins can be used in a variety of orientations to provide different flow resistances / pressures and thus different heat transfer capabilities without having to redesign or remanufacture the parts. The design of two fluid channels (primary and secondary) perpendicular in one shell provides the benefit of strong flexibility in structural design and assembly.

[0069] exist Figures 5 to 7 In the embodiment, a secondary fluid channel is provided to assist the fluid to flow out of the primary fluid channel (i.e., the main fluid channel) ( Figure 5 , Figure 6 and Figure 7 535 in ), or used as a primary fluid channel (i.e., a main fluid channel) (e.g. Figure 7 533 in FIG. 5). It can be seen that, through this design, the primary fluid channel (i.e., the main fluid channel) does not have to be the primary fluid channel connected to the fluid port.

[0070] Figure 8 Another alternative is shown which does not require a secondary fluid channel. Figure 8 In the example, the bottom shell is similar to Figure 4 The upper shell 510 is constructed in the same manner as shown in the embodiment of , i.e., with only one fluid channel 515. The fin 523 is disposed inside the fluid chamber 518 and is positioned perpendicular to the fluid channel 515. The upper shell 510 also has a fin 522 inserted into the interior of the fluid chamber 516. However, instead of having a conventional secondary fluid channel, the upper shell includes a wider secondary fluid channel below the fin, which can be referred to as a secondary fluid chamber 514. Note that this is primarily intended for upper shells in phase change cooling use cases. The fin is partially in contact with the bottom of the fluid chamber 516. The secondary fluid chamber 514 can have different sizes that are smaller than the primary fluid chamber (i.e., the main fluid chamber) 516. The secondary fluid chamber 514 is connected to the port 517. Note that in this particular example, the fins in the fluid chamber 516 are parallel to the fins in the fluid chamber 518, but this is not mandatory, as a vertical arrangement can also work. The fluid port 517 can be in different sides of the shell 510. Additionally, it is noted that this embodiment is particularly beneficial for systems that employ phase change in the cooling cycle. For example, cooling liquid can enter via port 519, and as the cooling liquid removes heat from the fins on the way to the top shell, it can change phase to vapor. Thus, the secondary fluid chamber 514 can be configured to receive vapor, which may require an expanded volume compared to the liquid phase.

[0071] Fig. 9 Another example is shown in which no fluid passage is formed in the shell. Instead, the fins are made shorter than the length of the fluid chamber, thereby forming a fluid passage leading to the port. Fig. 9 The left side of the figure shows the elements of the cooling plate before final assembly, while the right side shows the cooling plate after assembly is complete. Here again, each of the shells 510 and 512 can be made identical, having a fluid chamber formed therein. Each of the fluid chambers is closed on one side and open on the other side, so that when the two shells are attached to each other, the two fluid chambers combine to form one large fluid chamber. Fig. 9 As shown, each fin 522 has a width equal to the depth of the fluid chamber 516, but a length shorter than the length of the fluid chamber 516. Thus, when the fins 522 are assembled inside the fluid chamber 516, they abut one side of the fluid chamber 516, but leave a space 540 on the other side of the fluid chamber 516. Thus, the space 540 essentially defines a fluid channel for distributing fluid to all of the fluid channels between the fins. Note that although in Fig. 9 Both the input and output ports are on the same side, but one of the shells can be rotated before assembly so that the input and output ports are on opposite sides.

[0072] Fig.10 A side cross-sectional view of an embodiment is shown in which one set of fins is perpendicular to the other set of fins. Fig.10 , the bottom shell 512 has a fluid chamber 518 open at its top side. A fluid channel 515 is formed at the closed bottom end of the fluid chamber and leads to an inlet port 519. The top shell 510 includes a complementary fluid chamber 516 open at the bottom, so that when the two shells are assembled, the two fluid chambers 516 and 518 form a large fluid chamber. A fluid channel 513 is formed at the closed bottom of the fluid chamber 516 and leads to an outlet port 517. Fins 522 are attached to the inside of the fluid chamber 516 at an oblique angle or an acute angle relative to the bottom of the fluid chamber 516. Fins 523 are attached to the inside of the fluid chamber 518 oriented perpendicular to the fins 522. The fins 523 can be arranged at an oblique angle or a right angle relative to the bottom of the fluid chamber 518. As shown by the dotted line, the fluid enters the fluid channel 515 via the inlet port 519. From fluid channel 515 , the fluid disperses through the spaces between fins 523 and then between fins 522 , reaches fluid channel 513 at the top, and then exits through outlet port 517 .

[0073] Fig.11 A side cross-sectional view of an embodiment is shown in which one set of fins is parallel but tilted to another set of fins. Fig.11518. In the embodiment of the present invention, the bottom shell 512 has a fluid chamber 518 open at its top side. A fluid channel 515 is formed at the closed bottom end of the fluid chamber 518 and leads to an inlet port 519. The top shell 510 includes a complementary fluid chamber 516 open at the bottom, so that when the two shells are assembled, the two fluid chambers 516 and 518 form a large fluid chamber. A fluid channel 513 is formed at the closed bottom of the fluid chamber 516 and leads to an outlet port 517. Note that in this example, the port 517 is in the opposite side of the inlet port 519. Since the two shells are identical and symmetrical, the ports can be aligned anyway. The fin 522 is attached to the inside of the fluid chamber 516 at an oblique angle relative to the bottom of the fluid chamber 516, while the fin 523 is attached to the inside of the fluid chamber 518, oriented parallel to the fin 522 and aligned with the fin 522. The fins 523 are shown arranged at opposite angles of inclination relative to the bottom of the fluid chamber 518, but this is merely an example. As shown by the dashed lines, the fluid enters the fluid channel 515 via the inlet port 519. From the fluid channel 515, the fluid disperses through the spaces between the fins 523 and then between the fins 522, reaches the fluid channel 513 at the top, and then exits via the outlet port 517.

[0074] Fig.12 Shows something like Fig.11 , except that fins 523 are staggered with fins 522 such that each fin 523 is aligned between two fins 522. Otherwise, the two embodiments are similar.

[0075] Fig.13 6 is a flow chart illustrating an embodiment of a method for manufacturing a cooling plate. In step 600, the shells are manufactured by forming a fluid cavity or chamber in each shell and forming a port in fluid communication with the fluid cavity. Forming the cavity can be accomplished, for example, by milling a solid block of metal such as aluminum or copper. In this example, the two shells are identical, each having a cavity with a solid bottom and an open top (see FIG. 6 ). Figure 4 ), so that each shell forms a "basin". As shown, in some embodiments, one or more fluid channels are also formed in each shell and are in fluid communication with the port. The fluid channels can also be formed by milling a metal block. In step 605, fins are formed. As shown in some embodiments, the fins can be formed as two separate groups. In other embodiments, the fins can be formed as an integral part of the shell by machining the fluid cavity while the fins are formed during machining, for example. The fin size is designed to have a length that matches the length of the cavity and a width that matches the depth of the cavity. Note that when the fins are attached at an oblique angle inside the fluid cavity, the width of the fin can be slightly larger than the depth of the cavity.

[0076] In step 610, fins are attached to the interior of the fluid cavity of at least one shell. Better thermal conductivity can be obtained by physical attachment using a conductive agent (e.g., by welding). If the fins are integrally formed to the shell, this step can be skipped. In step 615, one shell is flipped and placed on the second shell so that the two cavities face each other to form a large cavity surrounding the fins. The two shells are attached to each other using, for example, bonding, welding, bolts, etc. In another embodiment, the fins can be designed as part of the shell instead of being designed as a separate part.

[0077] In the foregoing description, embodiments of the present invention have been described with reference to specific exemplary embodiments of the present invention. It will be apparent that various modifications may be made thereto without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Therefore, the description and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. A cooling plate for cooling a microchip, include: a first shell and a second shell, each having a fluid chamber formed therein, the fluid chamber having a solid bottom and an open top, the shells further having a fluid port in fluid communication with the fluid chamber; a plurality of fins, each fin having a length matching the length of the fluid chamber and a width comparable to the depth of the fluid chamber; wherein the first shell is attached to the second shell such that the open top of the fluid chamber of the first shell faces the open top of the fluid chamber of the second shell; and wherein the plurality of fins are arranged inside the fluid chamber of the first shell and the fluid chamber of the second shell; wherein each of said shells further comprises a fluid passage formed in said solid bottom of said fluid chamber and in fluid communication with said port; Wherein, each of the first shell and the second shell also includes a secondary fluid channel, which is formed in the solid bottom of the fluid chamber and is oriented vertically to the fluid channel and is fluidly connected to the fluid channel; through the fluid channel and the secondary fluid channel, the fluid is fully distributed in the fluid chamber and the fluid channel formed by the fins, and the secondary fluid channel is used to assist fluid distribution.

2. The cooling plate according to claim 1, in, The plurality of fins includes a first set of fins and a second set of fins, and wherein the first set of fins is attached inside the fluid chamber of the first shell and the second set of fins is attached inside the fluid chamber of the second shell.

3. The cooling plate according to claim 2, in, The first set of fins is attached inside the fluid chamber of the first shell in parallel with the second set of fins being attached inside the fluid chamber of the second shell.

4. The cooling plate according to claim 2, in, The first set of fins is attached inside the fluid chamber of the first shell perpendicularly to the second set of fins attached inside the fluid chamber of the second shell.

5. The cooling plate of claim 2 further comprising a baffle positioned between the first set of fins and the second set of fins.

6. The cooling plate according to claim 2, in, At least one of the first set of fins and the second set of fins is attached such that each of the fins forms an acute angle with the solid bottom of the fluid chamber.

7. The cooling plate according to claim 2, in, The first set of fins and the second set of fins are attached such that the fins are staggered so that each of the fins of the first set of fins is aligned between two fins of the second set of fins.

8. The cooling plate according to claim 1, in, Each of the first shell and the second shell further includes a fluid channel formed in the solid bottom of the fluid chamber and in fluid communication with the port, wherein the fluid channel formed in the first shell has a different size than the fluid channel formed in the second shell.

9. The cooling plate according to claim 1, in, The first shell and the second shell have the same shape as each other.

10. The cooling plate according to claim 1, in, One of the first shell and the second shell further includes a secondary fluid channel formed in the solid bottom of the fluid chamber.

11. An assembly comprising a processor and a cold plate, include: Cold plate; a microprocessor attached to the cold plate; Wherein, the cold plate comprises: a first shell and a second shell, each having a fluid chamber formed therein, the fluid chamber having a solid bottom and an open top, the shells further having a fluid port in fluid communication with the fluid chamber; a plurality of fins, each fin having a length matching the length of the fluid chamber and a width comparable to the depth of the fluid chamber; wherein the first shell is attached to the second shell such that the open top of the fluid chamber of the first shell faces the open top of the fluid chamber of the second shell; and wherein the plurality of fins are arranged inside the fluid chamber of the first shell and the fluid chamber of the second shell; wherein each of said shells further comprises a fluid passage formed in said solid bottom of said fluid chamber and in fluid communication with said port; Wherein, each of the first shell and the second shell also includes a secondary fluid channel, which is formed in the solid bottom of the fluid chamber and is oriented vertically to the fluid channel and is fluidly connected to the fluid channel; through the fluid channel and the secondary fluid channel, the fluid is fully distributed in the fluid chamber and the fluid channel formed by the fins, and the secondary fluid channel is used to assist fluid distribution.

12. The assembly according to claim 11, in, The plurality of fins includes a first set of fins and a second set of fins, and wherein the first set of fins is attached inside the fluid chamber of the first shell and the second set of fins is attached inside the fluid chamber of the second shell.

13. A method of manufacturing a cold plate for a microchip, the cold plate being the cold plate of claim 11, include: forming a first shell and a second shell and forming a fluid chamber in each shell, the fluid chamber having a solid bottom and an open top, and further forming a fluid port in each shell in fluid communication with the fluid chamber; forming a plurality of fins, each fin having a length matching the length of the fluid chamber and a width comparable to the depth of the fluid chamber; attaching the fin inside the fluid chamber of at least one of the first shell and the second shell; The first shell is attached to the second shell such that the open top of the fluid chamber of the first shell faces the open top of the fluid chamber of the second shell.

14. The method according to claim 13, in, Forming the plurality of fins includes forming a first set of fins and forming a second set of fins, and attaching the fins inside the fluid chamber includes attaching the first set of fins inside the fluid chamber of the first shell and attaching the second set of fins inside the fluid chamber of the second shell.

15. The method according to claim 14, in, The first set of fins are attached to be oriented perpendicularly to the second set of fins.

16. The method according to claim 14, in, At least one of the first set of fins and the second set of fins is attached such that each fin is oriented at an acute angle relative to the solid bottom of the fluid chamber.

17. The method of claim 13, further comprising forming a fluid channel at the solid bottom of the fluid chamber.

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