Processing device for electronic components

Abstract

The processing device for electronic components includes: a sheet holding part that holds a sheet having a sticking surface to which an electronic component is stuck; a plurality of suction parts arranged along a circular orbit passing through a suction area; a rotating part that holds the plurality of suction parts; a rotation driving part that rotates the rotating part; an ejecting part that ejects the sheet toward the suction area side; a sheet position adjusting part that changes the position of the sheet holding part in the direction along the sticking surface; and an ejecting position adjusting part that changes the position of the ejecting part in the direction along the sticking surface.

Description

Technical Field

[0001] The present disclosure relates to a processing apparatus for electronic components. Background Art

[0002] Patent Document 1 discloses an electronic component mounting method in which a suction nozzle and a push rod are moved so that the center of a chip, the center of the suction nozzle for sucking the chip, and the center of the push rod for pushing the chip toward the suction nozzle side coincide.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2009-044044 Summary of the Invention

[0006] The present disclosure relates to a simplified and effective apparatus for aligning the position of an electronic component, the position of a suction portion for picking up the electronic component, and the position of an ejecting portion for ejecting the electronic component toward the suction portion side.

[0007] A processing apparatus for an electronic component according to an aspect of the present disclosure includes: a sheet holding portion that holds a sheet having a sticking surface to which an electronic component is stuck; a plurality of suction portions arranged along a circular orbit passing through a suction region sandwiching the electronic component with the sheet; a rotating portion that holds the plurality of suction portions; a rotation driving portion that rotates the rotating portion around a rotation axis fixed as a central axis along the circular orbit; an ejecting portion that is arranged so as to sandwich the sheet with the electronic component and ejects the sheet toward the suction region side; a sheet position adjusting portion that changes the position of the sheet holding portion in a direction along the sticking surface; and an ejecting position adjusting portion that changes the position of the ejecting portion in a direction along the sticking surface. Brief Description of the Drawings

[0008] Figure 1 is a top view schematically showing a processing apparatus for an electronic component.

[0009] Figure 2 is a side view of a picking portion.

[0010] Figure 3 is along Figure 2 a cross-sectional view taken along line III-III in

[0011] Figure 4 is along Figure 3 a cross-sectional view taken along line IV-IV in

[0012] Figure 5 is a block diagram exemplifying a functional aspect structure of a controller.

[0013] Figure 6 is a block diagram exemplifying a hardware structure of a controller.

[0014] Figure 7 is a flowchart exemplifying a calibration process.

[0015] Figure 8 is a flowchart exemplifying a pick-up process.

[0016] Figure 9 is a flowchart exemplifying a handover process.

[0017] Figure 10 is a flowchart exemplifying a photographing process of an electronic component. Detailed implementation manners

[0018] Hereinafter, the implementation manners will be described in detail while referring to the accompanying drawings. In the description, the same reference numerals are given to the same elements or elements having the same function, and repeated descriptions are omitted.

[0019] 〔Processing device〕

[0020] The processing device 1 for electronic components in the present implementation manner is a so-called die sorter, which, while conveying the electronic components W formed in the previous processes such as dicing, performs processes such as appearance inspection, electrical characteristic inspection, and marking on them, and on this basis, packages the electronic components W in a carrier tape, a container tube, etc. As Figure 1 and Figure 2 shown, the processing device 1 includes: a conveying device 10, a plurality of processing units 20, and a controller 200.

[0021] The conveying device 10 conveys the electronic components W along a circular track CR1. The electronic components W to be conveyed have two main surfaces Wa and Wb that are parallel to each other. The conveying device 10 includes: a turntable 11, a plurality of holding parts 12, a rotation driving part 13, and a plurality of lifting driving parts 18. The turntable 11 is arranged to be rotatable about a vertical rotation axis Ax1. The plurality of holding parts 12 are arranged at equal intervals along a circumference centered on the rotation axis Ax1 and are fixed to the turntable 11. The plurality of holding parts 12 respectively hold the electronic components W. The holding part 12 can hold the electronic components W in any manner. Specific examples of the manner of holding the electronic components W can include vacuum adsorption, electrostatic adsorption, and gripping, etc. For example, the holding part 12 performs vacuum adsorption on any one of the main surfaces Wa and Wb (for example, the main surface Wa) from one side in a direction orthogonal to the turntable 11 (a direction parallel to the rotation axis Ax1).

[0022] As an example, the holding unit 12 has: a suction nozzle 15, a holder 16, and a spring 17. The suction nozzle 15 performs vacuum suction on the main surface Wa of the electronic component W from above. For example, the suction nozzle 15 is arranged perpendicular to the turntable 11, and the lower end of the suction nozzle 15 opens vertically downward. The holder 16 is fixed to the outer peripheral portion of the turntable 11 and holds the suction nozzle 15 in a vertically movable manner. The spring 17 resists the downward movement of the suction nozzle 15 by its elastic force. When a downward external force is applied to the upper end of the suction nozzle 15, the spring 17 elastically deforms as the suction nozzle 15 descends. When the downward external force applied to the upper end of the suction nozzle 15 disappears, the spring 17 elastically returns to push the suction nozzle 15 back to the height before the descent.

[0023] The rotary drive unit 13 uses, for example, an electric motor as a power source and directly drives the turntable 11 to rotate around the rotation axis Ax1 without passing through a gear. As a result, the plurality of holding units 12 move along a horizontal circular orbit CR1 centered on the rotation axis Ax1. The rotary drive unit 13 is controlled to repeat the rotation and stop of the turntable 11 at the same interval as the angular distance (angular distance around the rotation axis Ax1) between adjacent holding units 12. Hereinafter, the plurality of positions where the plurality of holding units 12 are respectively arranged when the rotary drive unit 13 stops the turntable 11 are referred to as "a plurality of stop positions SP1".

[0024] The plurality of lifting drive units 18 lift and lower the suction nozzles 15 of the plurality of holding units 12 individually. The plurality of lifting drive units 18 are respectively fixed above the plurality of stop positions SP1 in a manner that does not rotate together with the turntable 11. In a state where the holding unit 12 is located below it, the lifting drive unit 18 applies a downward force to the upper end of the suction nozzle 15 using, for example, an electric motor or a cylinder as a power source. As a result, the suction nozzle 15 descends. When the lifting drive unit 18 releases the state of applying a downward force to the upper end of the suction nozzle 15, the suction nozzle 15 rises to the height before the descent due to the elastic force of the spring 17.

[0025] The plurality of processing units 20 are provided to correspond to the plurality of stop positions SP1 respectively. It should be noted that it is not necessarily required to provide the processing units 20 at all the stop positions SP1. Each processing unit 20 performs a predetermined process on the electronic component W arranged at the stop position SP1 (the stop position SP1 corresponding to this processing unit 20). The "process" here includes any act of changing the state of the electronic component W. For example, performing marking on the electronic component W, holding the electronic component W in the holding unit 12, and recovering the electronic component W released from the holding unit 12 belong to the "process". In addition, the correction of the holding position of the electronic component W by the holding unit 12 also belongs to the "process". Moreover, since the state where the inspection data is unknown is changed to the state where the inspection data is known, any inspection performed on the electronic component W also belongs to the "process".

[0026] As a specific example of the processing unit 20, the pickup unit 100 can be cited. The pickup unit 100 picks up the electronic component W from the wafer adhesive sheet, conveys it to the vicinity of an arbitrary stop position SP1, and delivers it to the holding unit 12 at the stop position SP1. As other examples of the processing unit 20, a position correction unit, an appearance inspection unit, an electrical characteristic inspection unit, a marking unit, a good product recovery unit, a defective product recovery unit, etc. can be cited. The position correction unit corrects the holding position of the electronic component W in the holding unit 12. The appearance inspection unit inspects the appearance of the electronic component W based on the captured image of the electronic component W. The electrical characteristic inspection unit inspects the electrical characteristics of the electronic component W. As specific examples of the electrical characteristics, the resistance between terminals, capacitance, etc. can be cited. The marking unit performs marking on the electronic component W by laser marking or the like. The good product recovery unit accommodates the electronic component W without abnormality in all inspections in a carrier tape, a tray, or the like. The defective product recovery unit recovers the electronic component W with abnormality in any inspection into a box or the like.

[0027] Hereinafter, the structure of the pickup unit 100 will be described. As Figure 2 shown, the pickup unit 100 has: a sheet holding unit 110, a sheet position adjusting unit 120, a rotary pickup 130, an ejecting unit 150, and an ejecting position adjusting unit 160.

[0028] The sheet holding unit 110 holds a sheet having an adhesive surface to which the electronic component W is adhered. As a specific example of the sheet, the wafer adhesive sheet 91 to which the electronic component W is adhered can be cited. The wafer adhesive sheet 91 has an adhesive surface 93 having adhesiveness to which the semiconductor wafer is adhered. The semiconductor wafer is adhered to the adhesive surface 93 in a state where it is divided into a plurality of electronic components W (for example, semiconductor chips) by dicing. The main surface Wa of the electronic component W is adhered to the adhesive surface 93. A frame 92 may also be adhered to the peripheral portion of the wafer adhesive sheet 91. In this case, the sheet holding unit 110 may also be configured to hold the frame 92. The sheet holding unit 110 holds the frame 92 around the conveying device 10 in such a manner that the adhesive surface 93 stands vertically and faces the rotation axis Ax1.

[0029] The sheet position adjusting unit 120 changes the position of the sheet holding unit 110 in the direction along the adhesive surface 93. For example, the sheet position adjusting unit 120 changes the position of the sheet holding unit 110 in two directions in the direction along the adhesive surface 93. As an example, the sheet position adjusting unit 120 has: a first driving unit 121 and a second driving unit 122. The first driving unit 121 uses, for example, an electric motor or the like as a power source to displace the frame 92 in the vertical direction along the adhesive surface 93. The second driving unit 122 uses, for example, an electric motor or the like as a power source to displace the frame 92 in the horizontal direction along the adhesive surface 93.

[0030] The rotary picker 130 picks up the electronic components W one by one from the wafer adhesive sheet 91 held by the sheet holding unit 110, conveys and delivers them to the holding unit 12. The rotary picker 130 is arranged between the rotary shaft Ax1 and the sheet holding unit 110 below the turntable 11.

[0031] For example, the rotary picker 130 has: a plurality of suction portions 131, a rotating portion 132, and a rotation driving portion 133. The plurality of suction portions 131 are arranged along a circular orbit CR2. The circular orbit CR2 is arranged such that the electronic component W on the adhesive surface 93 is located between the circular orbit CR2 and the wafer adhesive sheet 91. The electronic component W to be picked up by the rotary picker 130 is located between the suction area A1 and the wafer adhesive sheet 91. In other words, the position for arranging the electronic component W to be picked up is formed between the suction area A1 and the wafer adhesive sheet 91. The circular orbit CR2 is along a vertical plane including the rotary shaft Ax1. This plane is perpendicular to the adhesive surface 93 held by the sheet holding unit 110. The plurality of suction portions 131 may also be arranged at equal intervals (equal angular pitch around the rotary shaft Ax1) along the circular orbit CR2. Figure 2 The case where four suction portions 131 are arranged at 90° intervals is illustrated as an example, but the number of suction portions 131 is not limited to four.

[0032] The circular orbit CR2 also passes through the handover area A2. In other words, the handover area A2 is arranged side by side with the suction area A1 along the circular orbit CR2. The handover area A2 is located at the uppermost part of the circular orbit CR2. The position of the handover area A2 coincides with the stop position SP1 corresponding to the pick-up unit 100. Hereinafter, this stop position SP1 will be referred to as the "handover stop position SP1". The rotary picker 130 delivers the electronic component W from the suction portion 131 located in the handover area A2 to the holding unit 12. In other words, the conveying device 10 acquires the electronic component W from any one of the suction portions 131 in the handover area A2 and conveys the electronic component W. For example, the conveying device 10 adsorbs the electronic component W in the handover area A2 through the holding unit 12 arranged at the handover stop position SP1.

[0033] The plurality of suction portions 131 may also be arranged such that when any one of the suction portions 131 is located in the suction area A1, another suction portion 131 is located in the handover area A2. For example, around the center of the circular orbit CR2, the interval (angular pitch) between adjacent suction portions 131 is the same as the interval (angular pitch) between the suction area A1 and the handover area A2.

[0034] Each adsorption portion 131 adsorbs and picks up the target electronic component W. The adsorption portion 131 can adsorb the electronic component W in any manner. Specific examples of the manner of adsorbing the electronic component W include vacuum adsorption, electrostatic adsorption, etc. For example, the adsorption portion 131 has an adsorption nozzle 134. The adsorption nozzle 134 opens to the outside in the radial direction of the circular orbit CR2 and performs vacuum adsorption on the main surface Wb of the electronic component W.

[0035] The rotating portion 132 holds a plurality of adsorption portions 131. The rotation driving portion 133 causes the rotating portion 132 to rotate around a rotation axis Ax2 fixed along the central axis of the circular orbit CR2. The rotation driving portion 133 uses, for example, an electric motor as a power source and directly drives the rotating portion 132 to rotate around the rotation axis Ax2 without passing through a gear. The rotation driving portion 133 is fixed around the rotation axis Ax1 so that the rotation axis Ax2 does not displace relative to the rotation axis Ax1.

[0036] The rotary picker 130 may further have a plurality of buffer portions 135. The plurality of buffer portions 135 are respectively sandwiched between the rotation driving portion 133 and the plurality of adsorption portions 131. Each buffer portion 135 causes the corresponding adsorption portion 131 to retreat in response to an inward external force (an external force toward the rotation axis Ax2) acting on the adsorption portion 131. It should be noted that the retreat here means displacement toward the rotation axis Ax2. The buffer portion 135 has a spring 136. The spring 136 resists the retreat of the adsorption nozzle 134 by its elastic force. When an inward external force is applied to the adsorption nozzle 134, the spring 136 elastically deforms in response to the retreat of the adsorption nozzle 134, and when the inward external force disappears, it elastically returns to push the adsorption nozzle 134 back to the position before the retreat.

[0037] The ejecting portion 150 is arranged such that the wafer adhesive sheet 91 is located between the ejecting portion 150 and the target electronic component W to be picked up. The ejecting portion 150 ejects the wafer adhesive sheet 91 and the target electronic component W to the adsorption region A1 side. The ejecting portion 150 has an ejecting pin 151 protruding toward the back surface 94 (the back surface of the adhesive surface 93) of the wafer adhesive sheet 91. The ejecting pin 151 is along a line (hereinafter referred to as the "ejecting line") 152 perpendicular to the adhesive surface 93 and the back surface 94. The ejecting portion 150 uses, for example, an electric motor or the like as a power source to move the ejecting pin 151 forward or backward along the ejecting line 152.

[0038] The ejection position adjustment unit 160 changes the position of the ejection unit 150 in the direction along the bonding surface 93 (in the direction of the plane parallel to the bonding surface 93). For example, the ejection position adjustment unit 160 changes the position of the ejection unit 150 in two directions in the direction along the bonding surface 93. As an example, the ejection position adjustment unit 160 includes a first drive unit 161 and a second drive unit 162. The first drive unit 161 uses, for example, an electric motor or the like as a power source to displace the ejection unit 150 in the vertical direction along the plane parallel to the bonding surface 93. The second drive unit 162 uses, for example, an electric motor or the like as a power source to displace the ejection unit 150 in the horizontal direction along the plane parallel to the bonding surface 93.

[0039] The pickup unit 100 may further include a first imaging unit 170. The circular orbit CR2 also passes through a first imaging area A3 that is the imaging object of the first imaging unit 170. In other words, the first imaging area A3 is arranged side by side with the adsorption area A1 along the circular orbit CR2. The first imaging unit 170 is arranged to image the first imaging area A3 from the outer peripheral side of the circular orbit CR2, and image the electronic component W or the adsorption unit 131 located in the first imaging area A3. For example, the first imaging unit 170 includes a camera 171. The camera 171 includes an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and a lens that forms an image on the imaging element. The camera 171 is arranged such that the first imaging area A3 is located between the camera 171 and the rotation axis Ax2. The lens of the camera 171 faces the first imaging area A3. In Figure 2 the first imaging area A3 is located at the lowermost part of the circular orbit CR2.

[0040] The pickup unit 100 may further include a second imaging unit 180. The second imaging unit 180 images the adsorption area A1 from the inner peripheral side of the circular orbit CR2. Imaging from the inner peripheral side means that the optical path from the adsorption area A1 to the imaging position of the captured image of the second imaging unit 180 passes through a viewing point located on the inner periphery of the circular orbit CR2. The imaging position of the captured image of the second imaging unit 180 may not necessarily be located on the inner periphery of the circular orbit CR2.

[0041] In order to set the viewing point for imaging the adsorption area A1 on the inner periphery of the circular orbit CR2, the rotating unit 132 may also include: a cavity portion formed at the center of the circular orbit CR2; and a window portion provided between adjacent adsorption units 131 for guiding light from the outside of the rotating unit 132 to the cavity portion. For example, as Figure 3 and Figure 4As shown, the rotating part 132 has: a cylindrical part 137, a rotating plate 138, and a plurality of window parts 139. The cylindrical part 137 surrounds the rotating shaft Ax2 to form a cavity part 141, and holds a plurality of suction parts 131. The cylindrical part 137 has a cylindrical shape, and its central axis coincides with the rotating shaft Ax2. Hereinafter, one end of the cylindrical part 137 on the side of the rotation driving part 133 among the two ends is referred to as the "driving end", and the end on the side opposite to the rotation driving part 133 is referred to as the "open end". The rotating plate 138 closes the driving end of the cylindrical part 137 and is connected to the rotation driving part 133. The plurality of window parts 139 are formed in the cylindrical part 137 and are arranged alternately with the plurality of suction parts 131. In other words, the window parts 139 are respectively formed between adjacent suction parts 131. The window part 139 is, for example, a through hole that guides light from the outside of the cylindrical part 137 into the cavity part 141.

[0042] The second photographing part 180 photographs the suction area A1 from the cavity part 141 via the window part 139. For example, the second photographing part 180 has a reflecting mirror 181 and a camera 182. The reflecting mirror 181 is provided in the cavity part 141. The reflecting mirror 181 reflects the light introduced into the cavity part 141 from the suction area A1 side through the window part 139 toward the open end side of the cylindrical part 137. It should be noted that the reflecting mirror 181 can be any component having a reflecting surface that reflects the above-mentioned light toward the open end side of the cylindrical part 137. The reflecting mirror 181 can be a plate-shaped reflecting mirror or a prism arranged so that one surface becomes the above-mentioned reflecting surface. The camera 182 photographs the suction area A1 via the reflecting mirror 181. For example, the camera 182 has a photographing element such as a CCD image sensor or a CMOS image sensor, and a lens that forms an image on the photographing element. The camera 182 is arranged outside the cavity part 141 with the lens facing the open end of the cylindrical part 137. Therefore, the light reflected toward the open end side by the reflecting mirror 181 enters the lens of the camera 182. In this way, by providing the reflecting mirror 181 in the cavity part 141, an optical path through the viewpoint located on the inner circumference of the circular orbit CR2 is formed. As long as an image through the viewpoint located on the inner circumference of the circular orbit CR2 can be photographed, the camera 182 can be arranged in any manner. For example, the camera 182 can be arranged inside the cavity part 141 or outside the circular orbit CR2.

[0043] The controller 200 is configured to perform: intermittently rotating the rotating unit 132 by the rotation driving unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction area A1. In addition, the controller 200 is configured to perform: whenever any one of the plurality of suction units 131 is arranged in the suction area A1, controlling the sheet position adjustment unit 120 so that the position of the electronic component W is aligned with the position of the suction unit 131, and controlling the ejection position adjustment unit 160 so that the position of the ejection unit 150 is aligned with the position of the suction unit 131.

[0044] For example, as Figure 5 shown, as a structural aspect in terms of functions (hereinafter referred to as "function modules"), the controller 200 has: a rotation control unit 211, a first shooting control unit 212, a reference position calculation unit 213, a second shooting control unit 214, a component position calculation unit 215, a third shooting control unit 216, an ejection position calculation unit 217, a position information storage unit 218, a fourth shooting control unit 219, an alignment control unit 221, a suction control unit 222, a handover control unit 223, and a conveyance control unit 224. Hereinafter, each function module will be described. The processing of executing each function module corresponds to the processing executed by the controller 200.

[0045] The rotation control unit 211 intermittently rotates the rotating unit 132 by the rotation driving unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction area A1. It should be noted that intermittently rotating means repeating rotation and stop. For example, the rotation control unit 211 starts from the state where any one of the suction units 131 is arranged in the suction area A1, and intermittently rotates the rotating unit 132 by the rotation driving unit 133 at intervals equal to the angular distance between adjacent suction units 131. In addition, the rotation control unit 211 rotates the rotating unit 132 in the direction ( Figure 2 the clockwise direction in ) of each suction unit 131 through the suction area A1, the first shooting area A3, and the handover area A2 in sequence.

[0046] The first shooting control unit 212 causes the first shooting unit 170 to acquire an image of the suction unit 131 in the first shooting area A3 in the state where any one of the plurality of suction units 131 does not hold the electronic component W and is located in the first shooting area A3.

[0047] The reference position calculation unit 213 calculates the position of the suction unit 131 when it is arranged in the suction area A1 based on the image of the suction unit 131 obtained by the first imaging control unit 212 causing the first imaging unit 170 to acquire (hereinafter simply referred to as "the image of the suction unit 131"). The reference position calculation unit 213 calculates the position of the suction unit 131 in the first imaging area A3 based on the image of the suction unit 131 (hereinafter referred to as "the actual position of the suction unit 131"). Subsequently, the reference position calculation unit 213 calculates the error of the actual position of the suction unit 131 with reference to the designed position of the suction unit 131 in the first imaging area A3 (hereinafter referred to as "the ideal position of the suction unit 131"). Subsequently, the reference position calculation unit 213 adds the above error to the designed position of the suction unit 131 in the suction area A1 to calculate the position of the suction unit 131 in the suction area A1. For example, the reference position calculation unit 213 calculates the positions of the suction unit 131 in two directions along the bonding surface 93 (along a plane parallel to the bonding surface 93). As an example, the reference position calculation unit 213 calculates the positions of the suction unit 131 in the vertical and horizontal directions in a plane parallel to the bonding surface 93. It should be noted that the position of the suction unit 131 can be the position of any part of the suction unit 131. For example, the position of the suction unit 131 is the center position of the suction nozzle 134.

[0048] The second imaging control unit 214 causes the second imaging unit 180 to acquire an image of the electronic component W in a state where the pick-up target electronic component W is located between the suction area A1 and the wafer adhesive sheet 91. For example, the second imaging control unit 214 causes the second imaging unit 180 to acquire an image of the suction area A1 via the window unit 139 at a timing when the window unit 139 is located between the cavity unit 141 and the suction area A1. Thus, an image of the pick-up target electronic component W is acquired by the second imaging unit 180 via the suction area A1.

[0049] The component position calculation unit 215 calculates the position of the electronic component W based on the image of the electronic component W obtained by the second imaging control unit 214 causing the second imaging unit 180 to acquire. For example, the component position calculation unit 215 calculates the positions of the electronic component W in two directions along the bonding surface 93. As an example, the component position calculation unit 215 calculates the positions of the electronic component W in the vertical and horizontal directions in the bonding surface 93. It should be noted that the position of the electronic component W can be the position of any part of the electronic component W. For example, the position of the electronic component W is the center position of the electronic component W.

[0050] The third imaging control unit 216 causes the second imaging unit 180 to acquire an image of the ejector unit 150 via the suction area A1 in a state where the wafer adhesive sheet 91 is not located between the second imaging unit 180 and the ejector unit 150.

[0051] The ejection position calculation unit 217 calculates the position of the ejection unit 150 based on the image of the ejection unit 150 acquired by the second imaging unit 180 under the control of the third imaging control unit 216. For example, the ejection position calculation unit 217 calculates the position of the ejection unit 150 in two directions along the bonding surface 93 (along a plane parallel to the bonding surface 93). As an example, the ejection position calculation unit 217 calculates the position of the ejection unit 150 in the vertical and horizontal directions in a plane parallel to the bonding surface 93. It should be noted that the position of the ejection unit 150 can be the position of any part of the ejection unit 150. For example, the position of the ejection unit 150 is the center position of the ejection pin 151.

[0052] The position information storage unit 218 stores the position calculated by the reference position calculation unit 213 and the position calculated by the ejection position calculation unit 217 for each suction unit 131.

[0053] The fourth imaging control unit 219 causes the first imaging unit 170 to acquire an image of the electronic component W in the first imaging area A3 in a state where any one of the plurality of suction units 131 holds the electronic component W and is located in the first imaging area A3. The image captured by the fourth imaging control unit 219 is used for appearance inspection of the main surface Wa of the electronic component W and the like.

[0054] Whenever any one of the suction units 131 is arranged in the suction area A1, the alignment control unit 221 controls the sheet position adjustment unit 120 so that the position of the pick-up target electronic component W is aligned with the position of the suction unit 131, and controls the ejection position adjustment unit 160 so that the position of the ejection unit 150 is aligned with the position of the suction unit 131. For example, the alignment control unit 221 controls the sheet position adjustment unit 120 so that the center position of the pick-up target electronic component W is aligned with the center position of the suction nozzle 134 in the direction along the bonding surface 93 based on the position calculated by the reference position calculation unit 213 and the position calculated by the component position calculation unit 215. In addition, the alignment control unit 221 controls the ejection position adjustment unit 160 so that the center position of the ejection pin 151 is aligned with the center position of the suction nozzle 134 in the direction along the bonding surface 93 based on the position calculated by the reference position calculation unit 213 and the position calculated by the ejection position calculation unit 217.

[0055] The adsorption control unit 222 controls the ejecting unit 150 in such a way that the ejecting pin 151 ejects the electronic component W to the adsorption area A1 in a state where the position of the electronic component W to be picked up and the position of the ejecting unit 150 are aligned with the position of the adsorption unit 131 in the adsorption area A1, and controls the rotary picker 130 in such a way that the adsorption unit 131 in the adsorption area A1 adsorbs the electronic component W. Moreover, the adsorption control unit 222 controls the ejecting unit 150 in such a way that the ejecting pin 151 retracts in a state where the electronic component W to be picked up is adsorbed by the adsorption unit 131. Thereby, the electronic component W is left in the adsorption area A1 and the wafer adhesive sheet 91 returns to its original position.

[0056] The transfer control unit 223 controls the rotary picker 130 in such a way that the electronic component W held by any one of the plurality of adsorption units 131 is released in a state where the electronic component W is located in the transfer area A2, and controls the conveying device 10 in such a way that the electronic component W in the transfer area A2 is acquired.

[0057] For example, the transfer control unit 223 lowers the holding unit 12 to contact the electronic component W in the transfer area A2 through the lifting drive unit 18 at the transfer stop position SP1, adsorbs the electronic component W through the holding unit 12, and raises the holding unit 12 to the height before lowering through the lifting drive unit 18. In addition, the transfer control unit 223 releases the adsorption of the electronic component W by the adsorption unit 131 in the transfer area A2 before the holding unit 12 that has adsorbed the electronic component W in the transfer area A2 starts to rise.

[0058] The conveyance control unit 224 controls the conveyance device 10 to convey the electronic component W acquired in the transfer area A2 along the circular orbit CR1. For example, after the holding unit 12 that has adsorbed the electronic component W in the transfer area A2 finishes rising, the conveyance control unit 224 rotates the turntable 11 through the rotation drive unit 13.

[0059] Figure 6 is a block diagram exemplarily showing the hardware structure of the controller 200. As Figure 6As shown, the controller 200 has a circuit 290. The circuit 290 includes: one or more processors 291, a memory 292, a storage device 293, and input / output ports 294. The storage device 293 has a computer-readable storage medium such as a hard disk or a non-volatile semiconductor memory. The storage device 293 stores a program for causing the controller 200 to perform the following: intermittently rotating the rotating unit 132 so that the plurality of suction units 131 are sequentially arranged in the suction area A1 by the rotation driving unit 133; and whenever any one of the plurality of suction units 131 is arranged in the suction area A1, controlling the sheet position adjustment unit 120 so that the position of the electronic component W is aligned with the position of the suction unit 131, and controlling the ejection position adjustment unit 160 so that the position of the ejection unit 150 is aligned with the position of the suction unit 131. For example, the storage device 293 stores a program for causing the controller 200 to constitute the above-mentioned respective functional modules.

[0060] The memory 292 temporarily stores the program loaded from the storage device 293 and the operation results of the processor 291. The processor 291 executes the above program in cooperation with the memory 292 to cause the controller 200 to constitute respective functional modules. The input / output ports 294 perform input / output of electrical signals between the rotation driving unit 133, the sheet position adjustment unit 120, the ejection position adjustment unit 160, the ejection unit 150, the suction unit 131, the holding unit 12, the lifting driving unit 18, and the rotation driving unit 13, etc. according to instructions from the processor 291. It should be noted that the circuit 290 is not necessarily limited to constituting each function by a program. For example, the circuit 290 can constitute at least part of the functions by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating a dedicated logic circuit.

[0061] 〔Control flow of the processing device〕

[0062] Next, as an example of the processing method of the electronic component, the control flow executed by the controller 200 is divided into a calibration process, a pickup process, a handover process, and a photographing process of the electronic component for explanation.

[0063] (Calibration process)

[0064] The calibration process is a control process for acquiring and storing the position information of each suction unit 131 and the position information of the ejection unit 150 in the suction area A1 before the pickup unit 100 picks up the electronic component W. For example, as Figure 7As shown, the controller 200 first executes steps S01, S02, S03, S04, and S05. In step S01, the rotation control unit 211 causes the rotation drive unit 133 to start rotating the rotating unit 132. In step S02, the first shooting control unit 212 waits for the suction unit 131 that does not hold the electronic component W to be arranged in the first shooting area A3. In step S03, the first shooting control unit 212 causes the first shooting unit 170 to acquire an image of the suction unit 131 in the first shooting area A3. In step S04, the reference position calculation unit 213 calculates the position of the suction unit 131 when it is arranged in the suction area A1 based on the image of the suction unit 131 acquired by the first shooting control unit 212 causing the first shooting unit 170, and records it in the position information storage unit 218. In step S05, the first shooting control unit 212 confirms whether the positions when arranged in the suction area A1 have been calculated and recorded for all the suction units 131.

[0065] In step S05, when it is determined that there remains a suction unit 131 for which the position calculation is not completed, the controller 200 returns the process to step S02, and performs shooting and position calculation and recording for the next suction unit 131.

[0066] In step S05, when it is determined that the position calculations and recordings for all the suction units 131 have been completed, the controller 200 executes steps S06, S07, S08, and S09. In step S06, the third shooting control unit 216 waits for the second shooting unit 180 to be able to shoot the ejecting unit 150. For example, the third shooting control unit 216 waits for the window unit 139 to be arranged between the cavity unit 141 and the suction area A1. In step S07, the third shooting control unit 216 causes the second shooting unit 180 to acquire an image of the ejecting unit 150. In step S08, the ejecting position calculation unit 217 calculates the position of the ejecting unit 150 based on the image of the ejecting unit 150 acquired by the third shooting control unit 216 causing the second shooting unit 180, and records it in the position information storage unit 218. In step S09, the rotation control unit 211 causes the rotation drive unit 133 to stop rotating the rotating unit 132. Thus, the calibration process is completed.

[0067] (Pick-up process)

[0068] The pick-up process is a control process that causes the pick-up unit 100 to sequentially perform the pick-up of the electronic component W from the wafer adhesive sheet 91. For example, as Figure 8As shown, the controller 200 first executes steps S11, S12, S13, S14, and S15. In step S11, the rotation control unit 211 causes the rotation drive unit 133 to start rotating the rotating unit 132. In step S12, the alignment control unit 221 moves the sheet holding unit 110 through the sheet position adjustment unit 120 in such a manner that the pick-up target electronic component W is arranged between the adsorption area A1 and the wafer adhesive sheet 91. In step S13, the second shooting control unit 214 waits until the second shooting unit 180 can shoot the pick-up target electronic component W. For example, the second shooting control unit 214 waits until the window unit 139 is arranged between the cavity unit 141 and the adsorption area A1. In step S14, the second shooting control unit 214 causes the second shooting unit 180 to acquire an image of the pick-up target electronic component W. In step S15, the component position calculation unit 215 calculates the position of the electronic component W based on the image of the electronic component W acquired by the second shooting unit 180 when the second shooting control unit 214 causes the second shooting unit 180 to acquire the image.

[0069] Next, the controller 200 executes steps S16, S17, and S18. In step S16, the alignment control unit 221 starts to control the sheet position adjustment unit 120 in such a manner that the position of the pick-up target electronic component W is aligned with the position when the next adsorption unit 131 is arranged in the adsorption area A1 (hereinafter referred to as the "position of the next adsorption unit 131"); and controls the ejection position adjustment unit 160 in such a manner that the position of the ejection unit 150 is aligned with the position of the next adsorption unit 131. For example, the alignment control unit 221 reads the position of the next adsorption unit 131 and the position of the ejection unit 150 from the position information storage unit 218. The alignment control unit 221 controls the sheet position adjustment unit 120 in such a manner that the position of the electronic component W is aligned with the position of the next adsorption unit 131 based on the position of the next adsorption unit 131 read from the position information storage unit 218 and the position of the electronic component W calculated by the component position calculation unit 215. In addition, the alignment control unit 221 controls the ejection position adjustment unit 160 in such a manner that the position of the ejection unit 150 is aligned with the position of the next adsorption unit 131 based on the position of the next adsorption unit 131 read from the position information storage unit 218 and the position of the ejection unit 150 read from the position information storage unit 218.

[0070] In step S17, the adsorption control unit 222 waits until the next adsorption unit 131 is arranged in the adsorption area A1. In step S18, the adsorption control unit 222 waits until the position of the pick-up target electronic component W and the position of the ejection unit 150 are aligned with the position of the next adsorption unit 131.

[0071] Next, the controller 200 executes steps S21, S22, and S23. In step S21, the adsorption control unit 222 controls the ejector unit 150 to eject the electronic component W to the adsorption area A1 by means of the ejector pin 151. In step S22, the adsorption control unit 222 causes the adsorption unit 131 in the adsorption area A1 to adsorb the electronic component W ejected to the adsorption area A1. In step S23, the adsorption control unit 222 retracts the ejector pin 151. As a result, the electronic component W is left in the adsorption area A1 and the wafer adhesive sheet 91 returns to its original position. Thereafter, the controller 200 returns the process to step S12. After that, by repeating steps S12 to S23, the pick-up unit 100 sequentially picks up a plurality of electronic components W on the wafer adhesive sheet 91.

[0072] (Handover process)

[0073] The handover process is a control process that causes the conveying device 10 and the pick-up unit 100 to perform the handover of the electronic component W in the handover area A2. For example, as Figure 9 shown, the controller 200 executes steps S31, S32, S33, S34, and S35. In step S31, the handover control unit 223 waits for the adsorption unit 131 that has adsorbed the electronic component W to be arranged in the handover area A2. In step S32, the handover control unit 223 causes the holding unit 12 to descend to contact the electronic component W in the handover area A2 at the handover stop position SP1 through the lifting drive unit 18. In step S33, the handover control unit 223 causes the holding unit 12 to adsorb the electronic component W in the handover area A2 and releases the adsorption of the electronic component W by the adsorption unit 131 in the handover area A2. In step S34, the handover control unit 223 causes the holding unit 12 that has adsorbed the electronic component W in the handover area A2 to rise to the height before descent through the lifting drive unit 18. In step S35, the conveyance control unit 224 causes the turntable 11 to rotate by one pitch through the rotation drive unit 13. As a result, the electronic component W adsorbed by the holding unit 12 in the handover area A2 is conveyed, and the next holding unit 12 is arranged at the handover stop position SP1. Thereafter, the controller 200 returns the process to step S31. After that, the handover of the electronic component W in the handover area A2 is repeated.

[0074] (Photographing process of electronic components)

[0075] The photographing process of electronic components is a control process that causes the first photographing unit 170 to sequentially photograph the images of the electronic components W in the first photographing area A3. For example, as Figure 10As shown, the controller 200 executes steps S41 and S42. In step S41, the fourth shooting control unit 219 waits for the adsorption unit 131 that has adsorbed the electronic component W to be arranged in the first shooting area A3. In step S42, the fourth shooting control unit 219 causes the first shooting unit 170 to acquire an image of the electronic component W in the first shooting area A3. Thereafter, the controller 200 returns the process to step S41. After that, the shooting of the electronic component W in the first shooting area A3 is repeated. As described above, the image of the electronic component W is used for the appearance inspection of the main surface Wa of the electronic component W and the like.

[0076] As described above, the processing device 1 includes: a sheet holding unit 110 that holds a wafer adhesive sheet 91 having an adhesive surface 93 to which an electronic component W is adhered; a plurality of adsorption units 131 arranged along a circular orbit CR2 passing through an adsorption area A1 that sandwiches the electronic component W between the wafer adhesive sheet 91; a rotating unit 132 that holds the plurality of adsorption units 131; a rotation driving unit 133 that causes the rotating unit 132 to rotate around a rotation axis Ax2 fixed along the central axis of the circular orbit CR2; an ejecting unit 150 arranged to sandwich the wafer adhesive sheet 91 between the ejecting unit 150 and the electronic component W and to eject the wafer adhesive sheet 91 toward the adsorption area A1 side; a sheet position adjusting unit 120 that changes the position of the sheet holding unit 110 in the direction along the adhesive surface 93; and an ejecting position adjusting unit 160 that changes the position of the ejecting unit 150 in the direction along the adhesive surface 93.

[0077] According to the processing device 1, the positions of the electronic component W and the ejecting unit 150 can be changed according to the individual differences in the positions of each adsorption unit 131, and the positions of the adsorption unit 131, the electronic component W, and the ejecting unit 150 can be aligned. Thereby, it is possible to suppress pickup failures caused by position deviations between the adsorption unit 131, the electronic component W, and the ejecting unit 150. Here, when changing the position of the adsorption unit 131 in order to align the positions of the three, in addition to changing the structure of the adsorption unit 131 in the adsorption area A1 (the rotating unit 132 and the rotation driving unit 133), it is also necessary to change the structure for changing the position of the adsorption unit 131 in the adsorption area A1, and the device structure becomes complicated. In contrast, the processing device 1 that changes the positions of the electronic component W and the ejecting unit 150 is effective for simplifying the structure for aligning the positions of the three.

[0078] The processing device 1 may further include a first shooting unit 170 arranged to shoot a first shooting area A3 that is arranged side by side with the adsorption area A1 along the circular orbit CR2 from the outer peripheral side of the circular orbit CR2. In this case, the first shooting unit 170 can be shared for grasping the appearance of the electronic component W held by the adsorption unit 131 and grasping the position of the adsorption unit 131. Therefore, it is more effective for simplifying the device structure.

[0079] The processing device 1 may further include a second imaging unit 180 that images the adsorption area A1 from the inner circumferential side of the circular orbit CR2. In this case, alignment can be performed based on the position of the electronic component W observed (imaged) from the adsorption unit 131 side, which serves as a reference for aligning the positions of the three components. Therefore, it is effective for higher-precision alignment.

[0080] The processing device 1 may further include: a rotation control unit 211 that intermittently rotates the rotating unit 132 by the rotation drive unit 133 so as to sequentially arrange the plurality of adsorption units 131 in the adsorption area A1; and an alignment control unit 221 that controls the sheet position adjustment unit 120 so as to align the position of the electronic component W with the position of the adsorption unit 131 and controls the ejection position adjustment unit 160 so as to align the position of the ejection unit 150 with the position of the adsorption unit 131 whenever any one of the plurality of adsorption units 131 is arranged in the adsorption area A1. In this case, the positions of the three components can be automatically aligned according to the individual differences in the positions of each adsorption unit 131.

[0081] It may be that the processing device 1 further includes a transfer device 10 that acquires the electronic component W from any one of the plurality of adsorption units 131 in a transfer area A2 arranged side by side with the adsorption area A1 along the circular orbit CR2 and transfers the electronic component W. The plurality of adsorption units 131 are arranged such that when any one of the adsorption units 131 is located in the adsorption area A1, another adsorption unit 131 is located in the transfer area A2. In this case, a structure that can align the positions of the three components without displacing the adsorption unit 131 is used to at least partially simultaneously perform the adsorption of the electronic component W in the adsorption area A1 and the transfer of the electronic component W in the transfer area A2, and the processing time can be shortened.

[0082] The above describes the embodiments, but the present invention is not necessarily limited to the above embodiments, and various modifications can be made without departing from the gist thereof.

[0083] According to the present disclosure, there is provided a simplified and effective device for aligning the position of an electronic component, the position of an adsorption unit that picks up the electronic component, and the position of an ejection unit that ejects the electronic component toward the adsorption unit side.

[0084] It should be noted that this application is based on a Japanese patent application filed on October 11, 2019 (Japanese Patent Application No. 2019-187451), the content of which is incorporated herein by reference.

[0085] Explanation of reference numerals:

[0086] 1: Processing device; W: Electronic component; 10: Conveyor device; 110: Sheet holding part; 120: Sheet position adjustment part; 150: Ejection part; 160: Ejection position adjustment part; 91: Wafer adhesive sheet; 93: Adhesive surface; 131: Adsorption part; 132: Rotating part; 133: Rotation drive part; A1: Adsorption area; CR2: Circular orbit; A2: Handover area; Ax2: Rotation axis; 170: First imaging part; A3: First imaging area; 180: Second imaging part; 139: Window part; 141: Cavity part; 211: Rotation control part; 221: Alignment control part.

Claims

1. A processing apparatus for electronic components, comprising: a sheet holding unit that holds a sheet having a sticking surface on which an electronic component is stuck; a plurality of suction units arranged along a circular orbit passing through a suction area; a rotating unit that holds the plurality of suction units; a rotation driving unit that causes the rotating unit to rotate about a rotation axis fixed along the central axis of the circular orbit; an ejecting unit that ejects the sheet toward the suction area side; a sheet position adjusting unit that changes the position of the sheet holding unit in a direction along the sticking surface; and an ejection position adjusting unit that changes the position of the ejecting unit in a direction along the sticking surface, wherein the suction area is arranged such that the electronic component is located between the suction area and the sheet, the ejecting unit is arranged such that the sheet is located between the ejecting unit and the electronic component, the processing apparatus for electronic components further comprises a first imaging unit, the first imaging unit is configured to image a first imaging area from the outer peripheral side of the circular orbit, the first imaging area is arranged side by side with the suction area along the circular orbit, the first imaging unit performs imaging of each of the plurality of suction units when the suction unit to be imaged is located in the first imaging area in a state where the suction unit does not hold the electronic component.

2. The processing apparatus for electronic components according to claim 1, further comprising a second imaging unit, the second imaging unit is configured to image the suction area from the inner peripheral side of the circular orbit.

3. The processing apparatus for electronic components according to claim 1 or 2, further comprising: a rotation control unit that intermittently rotates the rotating unit by the rotation driving unit so as to sequentially arrange the plurality of suction units in the suction area; and a positioning control unit that, whenever any one of the plurality of suction units is arranged in the suction area, controls the sheet position adjusting unit so as to align the position of the electronic component with the position of the suction unit, and controls the ejection position adjusting unit so as to align the position of the ejecting unit with the position of the suction unit.

4. The processing apparatus for electronic components according to claim 1 or 2, further comprising: a conveying device that, in a transfer area arranged side by side with the suction area along the circular orbit, acquires the electronic component from any one of the plurality of suction units and conveys the electronic component, the plurality of suction units are arranged such that when any one of the suction units is located in the suction area, another suction unit is located in the transfer area.

Images