A detection device and method for the corrosion performance of a heat-shrinkable solder on copper

Abstract

The present invention discloses a detection device and method for the corrosion performance of heat-shrinkable solder on copper, belonging to the technical field of copper corrosion detection. The detection device includes a container, a heating device and a detection component; the detection component includes a test component; the test component includes a first copper mirror and a first receiving tube; the first copper mirror is suspended in the first receiving tube, and there is a first distance between the bottom end of the first copper mirror and the bottom end of the first receiving tube; the top of the first receiving tube is in a closed state; the container is used to contain a heat-conducting medium and submerge the lower part of the first receiving tube with the heat-conducting medium during the test; the heating device is used to heat the heat-conducting medium; the heat-shrinkable solder to be tested is placed in the area of the first receiving tube submerged by the heat-conducting medium during the test. The device has a simple structure and is easy to operate. Through the corrosion area on the surface of the copper mirror, the corrosion intensity of the heat-shrinkable solder ring or the heat-shrinkable shielding solder ring on copper can be intuitively reflected, and it has great application prospects for the quality and reliability evaluation of wire connections.

Description

Technical Field

[0001] The present invention relates to the technical field of copper corrosion detection, and more specifically, to a detection device and method for the corrosion performance of heat-shrinkable solder on copper. Background Art

[0002] Wires are an essential part in the process of equipment connection. With the continuous update and iteration of electronic information equipment, the safety requirements for wires are getting higher and higher. During the use of wires, it is often necessary to connect two wires together. A common connection method is to strip the sheath and insulation layer at one end of the two wires, twist the wire cores together, and then use a heat-shrinkable ring or a heat-shrinkable solder ring to cover the connection of the wire cores.

[0003] The heat-shrinkable solder ring is composed of a low-melting alloy and a heat-shrinkable tube. While connecting two wires together, it can also protect the joint from oxidation by air and other corrosive gases, and is widely used in fields such as railways, ships, avionics, electric power, and electronics.

[0004] Since the heat-shrinkable solder ring is in direct contact with the wire core, if the heat-shrinkable solder ring contains corrosive substances, it will corrode the wire core (especially the copper wire core), resulting in corrosion failure of the wire during use, and in severe cases, causing the wire or equipment to burn out.

[0005] Currently, there is no simple and reliable method to evaluate the corrosiveness of heat-shrinkable solder rings to copper.

[0006] In view of this, the present invention is specifically proposed. Summary of the Invention

[0007] One of the objectives of the present invention is to provide a detection device for the corrosion performance of heat-shrinkable solder on copper to solve the above technical problems.

[0008] Another objective of the present invention is to provide a detection method that cooperates with the above detection device.

[0009] The present application can be implemented as follows:

[0010] In a first aspect, the present application provides a detection device for the corrosion performance of heat-shrinkable solder on copper, including a container, a heating device, and a detection component;

[0011] The detection component includes a test component;

[0012] The test component includes a first copper mirror and a first receiving tube;

[0013] During the test, the first copper mirror is suspended in the first receiving tube, and there is a first distance between the bottom end of the first copper mirror and the bottom end of the first receiving tube; the top of the first receiving tube is in a closed state during the test;

[0014] A container is used to hold a heat-conducting medium and submerge the lower part of the first receiving tube with the heat-conducting medium during the test; a heating device is used to heat the heat-conducting medium in the container; the heat-shrinkable solder object to be tested is placed in the area of the first receiving tube submerged by the heat-conducting medium during the test.

[0015] In an alternative embodiment, the detection device further includes a blank component;

[0016] The blank component includes a second copper mirror identical to the first copper mirror and a second receiving tube identical to the first receiving tube;

[0017] The second copper mirror is suspended in the second receiving tube during the test, and there is a second distance between the bottom end of the second copper mirror and the bottom end of the second receiving tube, and the first distance is equal to the second distance; the top of the second receiving tube is in a closed state during the test;

[0018] The lower part of the second receiving tube is submerged in the heat-conducting medium at the same depth as the first receiving tube during the test.

[0019] In an alternative embodiment, the number of test components is at least 2 groups.

[0020] In an alternative embodiment, the detection device further includes a thermometer. Each receiving tube is correspondingly provided with 1 thermometer, and the measuring end of each thermometer extends into the corresponding receiving tube, and the measuring head of the thermometer is flush with the lower end of the copper mirror in the corresponding receiving tube.

[0021] In an alternative embodiment, the detection device further includes copper wires. Each copper mirror is correspondingly connected with a copper wire for suspending the copper mirror in the receiving tube.

[0022] In an alternative embodiment, the length of each copper mirror is 25.4 mm, the width is 6.35 mm, and the thickness is The transmittance of the incident light is 5-15%;

[0023] and / or, the diameter of each test tube is 12.7 mm and the length is 304.8 mm;

[0024] and / or, the diameter of each copper wire is 0.1-0.25 mm.

[0025] In an alternative embodiment, the first distance is 15.24-17.78 cm;

[0026] and / or, the depth of the first receiving tube immersed in the heat-conducting medium is 50.8 mm.

[0027] In a second aspect, the present application provides a method for detecting the copper corrosion performance of a heat-shrinkable solder object, and the detection device according to any one of the foregoing embodiments is used to determine the copper corrosion performance of the heat-shrinkable solder object to be tested.

[0028] In an alternative embodiment, the heat-shrinkable solder object to be tested includes a heat-shrinkable solder ring or a heat-shrinkable shielded solder ring.

[0029] In an alternative embodiment, the following steps are included: placing the heat-shrinkable solder object to be tested at the inner bottom of the first receiving tube, turning on the heating device to heat the heat-conducting medium in the container and volatilize the volatile substances in the heat-shrinkable solder object to be tested, so as to corrode the copper mirror in the first receiving tube above the heat-shrinkable solder object to be tested, and judging the copper corrosion performance of the heat-shrinkable solder object to be tested according to the corrosion area on the surface of the copper mirror within the detection time.

[0030] In an alternative embodiment, during the test, the temperature at the bottom of the copper mirror is not higher than 60 °C.

[0031] In an alternative embodiment, the test time is 15.5 - 16.5 h.

[0032] In an alternative embodiment, the criteria for judging the copper corrosion performance of the heat-shrinkable solder object to be tested are as follows:

[0033] If the corrosion area of the copper mirror is greater than 10% of the area of the copper mirror, it is determined as unqualified; otherwise, it is qualified.

[0034] In an alternative embodiment, the corrosion area on the surface of the copper mirror is calculated according to the percentage of the area where the color changes on the surface of the copper mirror in the total surface area of the entire copper mirror.

[0035] The beneficial effects of the present application include:

[0036] The detection device for the copper corrosion performance of the heat-shrinkable solder object provided by the present application has a simple structure. By using this detection device to measure the copper corrosion performance of the heat-shrinkable solder object to be tested, the volatile substances in the heat-shrinkable solder object to be tested can be volatilized to corrode the copper mirror in the first receiving tube above the heat-shrinkable solder object to be tested, and then the copper corrosion performance of the heat-shrinkable solder object to be tested can be judged according to the corrosion area on the surface of the copper mirror. While meeting the test requirements of ASTM D2671, this method can intuitively and accurately reflect the corrosion intensity (corrosiveness) of the heat-shrinkable solder ring or the heat-shrinkable shielded solder ring to copper, and has great application prospects for the quality assessment and reliability assessment of wire connections. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0038] Figure 1Schematic structural diagram of the detection device for the corrosion performance of the heat-shrinkable solder on copper provided by this application;

[0039] Figure 2 Schematic diagram of the first copper mirror before corrosion provided by this application.

[0040] Icon: 1 - Container; 2 - Heating device; 31 - First copper mirror; 32 - First receiving tube; 4 - Heat-conducting medium; 51 - Second copper mirror; 52 - Second receiving tube; 6 - Thermometer; 7 - Copper wire; 8 - Plug. Detailed implementation manners

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. For those not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. For reagents or instruments not specified for the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0042] The detection device and method for the corrosion performance of the heat-shrinkable solder on copper provided by this application will be specifically described below.

[0043] This application proposes a detection device for the corrosion performance of the heat-shrinkable solder on copper, as Figure 1 shown, which includes a container 1, a heating device 2, and a detection component;

[0044] The detection component includes a test component;

[0045] The test component includes a first copper mirror 31 and a first receiving tube 32;

[0046] The first copper mirror 31 is suspended in the first receiving tube 32 during the test, and there is a first distance between the bottom end of the first copper mirror 31 and the bottom end of the first receiving tube 32; the top of the first receiving tube 32 is in a closed state during the test;

[0047] The container 1 is used to hold the heat-conducting medium 4 and submerge the lower part of the first receiving tube 32 with the heat-conducting medium 4 during the test; the heating device 2 is used to heat the heat-conducting medium 4 in the container 1; the heat-shrinkable solder to be tested (not shown in the figure) is placed in the area of the first receiving tube 32 submerged by the heat-conducting medium 4 during the test.

[0048] In some preferred implementation manners, the container 1 and the heating device 2 are an integrated device. Exemplarily, it can be a heat-collecting type constant temperature heating magnetic stirrer, and its accuracy is preferably greater than ±0.5 °C. In other implementation manners, the container 1 and the heating device 2 can be two separate structures. Among them, the container 1 is placed in the heating area of the heating device 2. Specifically, the container 1 can be a beaker or other utensils with a containing function, and the heating device 2 is an induction cooker or an electric furnace, etc.

[0049] In this application, the number of test components can be only 1 group, preferably at least 2 groups, such as 2 groups, 3 groups, 4 groups or more. When the number of test components is 2 groups or more, multiple groups of test data can be obtained, and taking the average result of the multiple groups of test data as the final result can improve the accuracy of the test results. It should be emphasized that the structures, dimensions and other conditions of each group of test components are the same.

[0050] The first copper mirror 31 (as Figure 2 shown) can be prepared by vacuum copper plating, and the thickness is set to The transmittance of the incident light is set to 5-15% (i.e., 10±5%). The length of the copper mirror is set to 25.4 mm and the width is set to 6.35 mm.

[0051] The first receiving tube 32 can be exemplarily a test tube (such as a round-bottom test tube). The diameter of the test tube is set to 12.7 mm and the length is set to 304.8 mm.

[0052] The first spacing can be 15.24-17.78 cm, such as 15.24 cm, 15.5 cm, 16 cm, 16.5 cm, 17 cm, 17.5 cm or 17.78 cm, etc., or any other arbitrary value within the range of 15.24-17.78 cm. It should be noted that during the test, if the temperature of the thermometer 6 is higher than 60 °C, the distance between the bottom of the first copper mirror 31 and the bottom of the first receiving tube 32 needs to be adjusted within the above first spacing range so that the temperature at the position where the copper mirror is located is lower than or equal to 60 °C.

[0053] The first receiving tube 32 can be in a closed state during the test by setting a plug 8 (wooden plug) at its upper open end, etc. By closing the upper end, the volatile substances volatilized from the heat-shrinkable solder to be tested can always act on the copper mirror in the first receiving tube 32.

[0054] Preferably, before use, the wooden plug is wrapped with copper foil to prevent volatile substances from entering the pores of the wooden plug and affecting the measurement results.

[0055] The heat-conducting medium 4 contained in the container 1 can be exemplarily silicone oil, which has a high heat transfer efficiency and high stability. In other embodiments, other common heat-conducting oils can also be used, which will not be limited here too much.

[0056] During the test, the depth of the first receiving tube 32 immersed in the heat-conducting medium 4 is 50.8 mm.

[0057] It should be emphasized that the depth of immersion of the first receiving tube 32 in the heat-conducting medium 4, the first spacing, and the diameter of the first receiving tube 32 in this application are set in cooperation with each other. Set according to the relevant ranges provided in this application. On the one hand, it can ensure that the first receiving tube 32 has a more appropriate heating area, so that the volatile substances volatilized from the heat-shrinkable solder to be measured when heated in the test tube can smoothly volatilize upward and corrode the copper mirror through the first spacing. (If the depth of immersion of the first receiving tube 32 in the heat-conducting medium 4 is too short, it is easy for the volatilized substances to re-accumulate downward at the bottom of the first receiving tube 32 before completely passing through the first spacing; if the first spacing is too long, it will also cause the volatile substances to be unable to effectively corrode the copper mirror). If any of the above parameters change, it will cause changes in the heating effect and the diffusion volume of the volatile substances in the first receiving tube 32, resulting in inaccurate measurement results.

[0058] Furthermore, the detection device provided in this application may further include a blank component.

[0059] In some preferred embodiments, the detection device includes 2 test components and 1 blank component.

[0060] The blank component includes a second copper mirror 51 identical to the first copper mirror 31 and a second receiving tube 52 identical to the first receiving tube 32;

[0061] The second copper mirror 51 is suspended in the second receiving tube 52 during the test. There is a second spacing between the bottom end of the second copper mirror 51 and the bottom end of the second receiving tube 52, and the first spacing is equal to the second spacing; the top of the second receiving tube 52 is in a closed state during the test;

[0062] The lower part of the second receiving tube 52 is immersed in the heat-conducting medium 4 at the same depth as the first receiving tube 32 during the test.

[0063] That is to say, it can be understood that the only difference between the blank component and the test component is that there is no heat-shrinkable solder to be measured in the second receiving tube 52 of the blank component, and the other conditions are the same as those of the test component.

[0064] Furthermore, the detection device provided in this application may further include a thermometer 6. Each receiving tube is correspondingly provided with 1 thermometer 6. The measuring end of each thermometer 6 extends into the corresponding receiving tube, and the measuring head of the thermometer 6 is flush with the lower end of the copper mirror in the corresponding receiving tube to monitor and control the temperature change at the lower end of the copper mirror during the detection process.

[0065] The measuring range of the above thermometer 6 can be 0 - 100 °C.

[0066] In some embodiments, it can be to open a through hole in the wooden plug, and the non-measuring end of the thermometer 6 passes through the through hole and is fixed. Referably, an interference fit can be provided between the non-measuring end of the thermometer 6 and the wooden plug.

[0067] In an alternative embodiment, the above detection device further includes a copper wire 7, and each copper mirror is correspondingly connected to a copper wire 7 for hanging the copper mirror in the receiving tube. Specifically, the copper wire 7 is wound around the surface of each copper mirror, and the hanging end of the copper wire 7 can be clamped by a cork to fix the copper mirror.

[0068] For reference, the diameter of each copper wire 7 can be 0.1 - 0.25 mm, such as 0.1 mm, 0.15 mm, 0.2 mm or 0.25 mm, etc., or any other arbitrary value within the range of 0.1 - 0.25 mm.

[0069] It should be noted that if the diameter of the copper wire 7 is too thin, it is prone to breakage and cannot effectively fix the copper mirror; if the diameter of the copper wire 7 is too thick, the volatile substances volatilized from the heat - shrinkable solder object to be tested will react with the copper wire 7, thus reducing the accuracy of the final detection result.

[0070] The above overall structure can be supported and fixed by an iron stand and support clips, etc.

[0071] Correspondingly, the present application also provides a method for detecting the copper corrosion performance of a heat - shrinkable solder object, using the above detection device to measure the copper corrosion performance of the heat - shrinkable solder object to be tested.

[0072] For reference, the heat - shrinkable solder object to be tested includes a heat - shrinkable solder ring or a heat - shrinkable shielded solder ring.

[0073] For reference, the detection may include the following steps: Place the heat - shrinkable solder object to be tested at the inner bottom of the first receiving tube 32, turn on the heating device 2 to heat the heat - conducting medium 4 in the container 1 and volatilize the volatile substances in the heat - shrinkable solder object to be tested, so as to corrode the copper mirror above the heat - shrinkable solder object to be tested in the first receiving tube 32, and judge the copper corrosion performance of the heat - shrinkable solder object to be tested according to the corrosion area on the surface of the copper mirror within the detection time.

[0074] During the test, the temperature at the bottom of the copper mirror is not higher than 60 °C, and this temperature is the temperature requirement in the relevant detection standard (ASTM D2671 test requirement). The test time can be set to 15.5 - 16.5 h (preferably 16 h).

[0075] Taking the number of test components as 2 groups and the number of blank components as 1 group as an example, the detection can refer to the following steps:

[0076] S1: Preparation of copper mirror and setup of test device: Prepare 3 copper mirrors with a length of 25.40 mm and a width of 6.35 mm, and use 3 round - bottom test tubes, 1 collecting - type constant - temperature heating magnetic stirrer, test tube clamps, thermometer 6, and iron stand to set up the test device. The test device is shown in Figure 1 ;

[0077] Among them, the bronze mirror is prepared by vacuum copper plating, with a thickness equivalent to 5000 Å, and the transmittance of normally incident light is (10 ± 5)%; the diameter of the round-bottom test tube is 12.70 mm, and the length of the test tube is 304.80 mm; the range of the thermometer 6 is (0 - 100) °C; the temperature control accuracy of the heating magnetic stirrer with heat collection and constant temperature should be greater than ±0.5 °C.

[0078] S2: Put the heat-shrinkable solder ring or heat-shrinkable shielding solder ring into two of the test tubes, and the other test tube contains a blank sample. Fix the bronze mirror with the fine copper wire 7 and hang it at a position 15.24 - 17.78 cm away from the bottom of the test tube. Wrap and install the wooden test tube stopper with the thermometer 6 on the test tube, and adjust the distance of the thermometer 6 so that the bottom end of the thermometer 6 is flush with the bottom of the bronze mirror;

[0079] Among them, the diameter of the fine copper wire 7 is 0.1 - 0.25 mm. Before using the wooden test tube stopper with the thermometer 6, the wooden stopper should be completely wrapped with copper foil. The bottom end of the thermometer 6 is flush with the bottom end of the bronze mirror, and the distance from the bottom of the test tube is 15.24 - 17.78 cm. The temperature at the position of the bronze mirror should be controlled below 60 °C. When the temperature of the thermometer 6 is higher than 60 °C, adjust the distance between the bronze mirror and the thermometer 6 and the bottom of the test tube within the range of 15.24 cm to 17.78 cm from the bottom of the test tube so that the temperature at the position of the bronze mirror is lower than or equal to 60 °C.

[0080] S3: Put the test tube into the heating magnetic stirrer with heat collection and constant temperature filled with silicone oil, so that the immersion depth of the test tube is 50.80 mm. Turn on the heating magnetic stirrer with heat collection and constant temperature to make the temperature in the oil bath reach the specified temperature (not exceeding 60 °C) of the heat-shrinkable solder ring and heat-shrinkable shielding solder ring, and maintain it at this temperature for 15.5 - 16.5 h (such as 16 h).

[0081] For reference, the criteria for judging the copper corrosion performance of the heat-shrinkable solder object to be tested are as follows:

[0082] If the corrosion area of the bronze mirror is greater than 10% of the area of the bronze mirror, it is judged as unqualified; otherwise, it is qualified.

[0083] In an alternative embodiment, the corrosion area on the surface of the bronze mirror is calculated based on the percentage of the area where the color change occurs on the surface of the bronze mirror to the entire surface area of the bronze mirror.

[0084] The detection of color change can be referred to: Take out the bronze mirror, place the bronze mirror on a pure white background in an environment with good light, take an external photo of the surface of the bronze mirror with a camera, use software to calculate the corrosion area on the surface of the bronze mirror, and judge whether the heat-shrinkable solder ring and heat-shrinkable shielding solder ring are qualified according to the corrosion area.

[0085] In the above process, a Leica camera can be used for taking pictures by way of example. The software for calculating the corrosion of the bronze mirror is software that can identify color differences, such as Image pro plus or Photoshop (PS). The specific steps are as follows: Place the bronze mirror after the test on a pure white background, maintain good lighting, and use a Leica camera to take a picture of the bronze mirror after the test (keep the camera parallel to the surface of the bronze mirror). Import the photo into Image pro plus or Photoshop (PS), calculate the corrosion area on the surface of the bronze mirror according to the color difference on the surface of the bronze mirror, and divide the corrosion area by the area of the bronze mirror to obtain the corrosion area ratio.

[0086] Continuing from the above, the detection method and device provided in this application can, while meeting the test requirements of ASTM D2671, intuitively and accurately reflect the corrosion strength (corrosiveness) of the heat-shrinkable solder ring or heat-shrinkable shielded solder ring on copper through the corrosion area on the surface of the bronze mirror, and have great application prospects for the quality assessment and reliability assessment of wire connections.

[0087] The features and performance of the present invention will be further described in detail below in conjunction with embodiments.

[0088] Embodiment 1

[0089] This embodiment provides a detection device and method for the corrosion performance of a heat-shrinkable solder ring on copper, specifically as follows:

[0090] Preparation of the bronze mirror and setup of the test device: Prepare 3 bronze mirrors with a length of 25.40 mm and a width of 6.35 mm. Use test tube clamps to fix three test tubes on an iron stand, make the test tubes parallel to the horizontal plane, pass a thermometer 6 through the middle of a cork, and wrap the cork with copper foil;

[0091] Put the heat-shrinkable solder rings known to be of qualified quality into two of the test tubes, and leave the other test tube blank. Fix the bronze mirror with a fine copper wire 7 with a diameter of 0.15 mm and hang it at a position 15.24 cm from the bottom of the test tube. Install the wooden test tube stopper wrapped with copper foil and equipped with the thermometer 6 onto the test tube, and adjust the distance of the thermometer 6 so that the bottom end of the thermometer 6 is flush with the bottom of the bronze mirror;

[0092] Put the 3 test tubes into a heat-collecting constant-temperature heating magnetic stirrer filled with silicone oil. The immersion depth of the test tubes is 50.80 mm. Turn on the heat-collecting constant-temperature heating magnetic stirrer (turn on the heating switch and the stirring switch at the same time) to make the temperature in the oil bath reach 121 °C specified for the heat-shrinkable solder ring. Observe the temperature of the thermometer 6. The temperature of the thermometer 6 is 38 °C, which meets the test requirements. Keep it at this temperature for 16 h;

[0093] Take out the bronze mirror, place it against a pure white background, maintain good lighting, take a photo of the bronze mirror after the test using a camera, import the photo into the Image pro plus software, click "measure", select "select color" in "count / size", use the pipette in color cube based to select the area to be calculated, check the preview mode, click "count" to obtain the area of the corresponding region, divide the area of the corroded region by the area of the bronze mirror, and the corrosion area on the surface of the bronze mirror is 1.5%;

[0094] Since the corrosion area on the surface of the bronze mirror is less than 10%, it is determined that the heat-shrinkable solder ring is qualified, which is consistent with the known qualified result of the sample to be tested, indicating that the method provided by this application is accurate and feasible.

[0095] Example 2

[0096] This example provides a detection device and method for the corrosion performance of a heat-shrinkable shielding solder ring on copper, specifically as follows:

[0097] Prepare a bronze mirror and set up the test device. Prepare 3 bronze mirrors with a length of 25.40 mm and a width of 6.35 mm. Use a test tube clamp to fix three test tubes on an iron stand, making the test tubes parallel to the horizontal plane. Pass a thermometer 6 through the middle of a cork and wrap the cork with copper foil;

[0098] Put the known qualified heat-shrinkable solder rings into two of the test tubes, and leave the other test tube blank. Fix the bronze mirror with a fine copper wire 7 with a diameter of 0.15 mm and hang it at a position 17.78 cm from the bottom of the test tube. Install the wooden test tube stopper with the copper foil-wrapped thermometer 6 onto the test tube, and adjust the distance of the thermometer 6 so that the bottom end of the thermometer 6 is flush with the bottom of the bronze mirror;

[0099] Put the 3 test tubes into a heat-collecting constant-temperature heating magnetic stirrer filled with silicone oil. The immersion depth of the test tubes is 50.80 mm. Turn on the heat-collecting constant-temperature heating magnetic stirrer (turn on the heating switch and the stirring switch simultaneously) to make the temperature in the oil bath reach 200 °C specified for the heat-shrinkable solder ring. Observe the temperature of the thermometer 6, and the temperature of the thermometer 6 is 52 °C, which meets the test requirements. Maintain this temperature for 16 h;

[0100] Take out the bronze mirror, place the bronze mirror against a pure white background, maintain good lighting, take a photo of the bronze mirror after the test using a camera, import the photo into the Image pro plus software, click "measure", select "count / size", then "select color", use the pipette in color cube based to select the area to be calculated, check the preview mode, click "count", obtain the area of the corresponding region, divide the area of the corrosion region by the area of the bronze mirror, and the corrosion area on the surface of the bronze mirror is 2.8%;

[0101] Since the corrosion area on the surface of the bronze mirror is less than 10%, it is determined that the heat-shrinkable shielding solder ring is qualified, which is consistent with the known qualified result of the sample to be tested, indicating that the method provided by this application is accurate and feasible.

[0102] Comparative Example 1

[0103] The difference between this comparative example and Example 2 is as follows: Turn on the heat-collecting type constant temperature heating magnetic stirrer (turn on the heating switch and the stirring switch simultaneously), so that the temperature in the oil bath pot reaches 200°C specified for the heat-shrinkable solder ring, observe the temperature of thermometer 6, the temperature of thermometer 6 is 68°C (the temperature exceeds the required temperature), and maintain it at this temperature for 16 hours.

[0104] Correspondingly, the calculated corrosion area on the surface of the bronze mirror is 15%, and it is determined that the heat-shrinkable shielding solder ring is unqualified, which is inconsistent with the known qualified result of the sample to be tested, indicating that changing the temperature at the lower end of the bronze mirror will make the test result inaccurate.

[0105] Comparative Example 2

[0106] The difference between this comparative example and Example 2 is as follows: Place the test tube into the heat-collecting type constant temperature heating magnetic stirrer filled with silicone oil, the immersion depth of the test tube is 80 mm (the immersion depth exceeds 50.80 mm), turn on the heat-collecting type constant temperature heating magnetic stirrer (turn on the heating switch and the stirring switch simultaneously), so that the temperature in the oil bath pot reaches 200°C specified for the heat-shrinkable solder ring, observe the temperature of thermometer 6, the temperature of thermometer 6 is 89°C (the temperature exceeds the required temperature), and maintain it at this temperature for 16 hours.

[0107] Correspondingly, the calculated corrosion area on the surface of the bronze mirror is 37%, and it is determined that the heat-shrinkable shielding solder ring is unqualified, which is inconsistent with the known qualified result of the sample to be tested, indicating that changing the immersion depth of the test tube will make the test result inaccurate.

[0108] In summary, the detection method and device provided by this application can, while meeting the requirements of ASTM D2671 test, intuitively and accurately reflect the corrosion intensity (corrosiveness) of the heat-shrinkable solder ring or heat-shrinkable shielding solder ring on copper through the corrosion area on the surface of the bronze mirror, and have great application prospects for the quality assessment and reliability assessment of wire connections.

[0109] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, various modifications and variations can be made to the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for detecting the corrosion performance of a heat-shrinkable solder on copper, characterized in that, Use a detection device to determine the copper corrosion performance of the heat-shrinkable soldering object to be tested; The detection device includes a container, a heating device, and a detection component; the detection component includes a test component; the test component includes a first copper mirror and a first receiving tube; the first copper mirror is suspended in the first receiving tube during the test, and there is a first distance between the bottom end of the first copper mirror and the bottom end of the first receiving tube; the top of the first receiving tube is in a closed state during the test; the container is used to hold a heat-conducting medium and submerge the lower part of the first receiving tube with the heat-conducting medium during the test; the heating device is used to heat the heat-conducting medium in the container; the heat-shrinkable soldering object to be tested is placed in the area of the first receiving tube submerged by the heat-conducting medium during the test; The detection device further includes copper wires, and each copper mirror is correspondingly connected with a copper wire for suspending the copper mirror in the receiving tube; the diameter of each copper wire is 0.1 - 0.25 mm; the first distance is 15.24 - 17.78 cm; the depth of the first receiving tube immersed in the heat-conducting medium is 50.8 mm; The determination includes the following steps: Place the heat-shrinkable soldering object to be tested at the inner bottom of the first receiving tube, turn on the heating device to heat the heat-conducting medium in the container and volatilize the volatile substances in the heat-shrinkable soldering object to be tested, so as to corrode the copper mirror above the heat-shrinkable soldering object in the first receiving tube, and judge the copper corrosion performance of the heat-shrinkable soldering object to be tested according to the corrosion area on the surface of the copper mirror within the detection time; During the test, the temperature at the bottom of the copper mirror is not higher than 60 °C; the test time is 15.5 - 16.5 h.

2. The detection method according to claim 1, wherein The detection device further includes a blank component; The blank component includes a second copper mirror identical to the first copper mirror and a second receiving tube identical to the first receiving tube; The second copper mirror is suspended in the second receiving tube during the test, there is a second distance between the bottom end of the second copper mirror and the bottom end of the second receiving tube, and the first distance is equal to the second distance; the top of the second receiving tube is in a closed state during the test; The lower part of the second receiving tube is submerged in the heat-conducting medium at the same depth as the first receiving tube during the test.

3. The detection method according to claim 2, wherein The number of the test components is at least 2 groups.

4. The detection method according to claim 1, wherein The detection device further includes a thermometer, and each receiving tube is correspondingly provided with 1 thermometer, and the measuring end of each thermometer extends into the corresponding receiving tube, and the measuring head of the thermometer is flush with the lower end of the copper mirror in the corresponding receiving tube.

5. The detection method according to claim 1, characterized in that, Each bronze mirror has a length of 25.4 mm, a width of 6.35 mm, and a thickness of The transmittance of the incident light is 5-15%; And / or, the diameter of each test tube is 12.7 mm and the length is 304.8 mm.

6. The detection method according to claim 1, characterized in that, The heat-shrinkable soldering object to be tested includes a heat-shrinkable solder ring or a heat-shrinkable shielded solder ring.

7. The detection method according to claim 1, wherein The criteria for judging the copper corrosion performance of the heat-shrinkable soldering object to be tested are as follows: If the corrosion area of the copper mirror is greater than 10% of the area of the copper mirror, it is judged as unqualified; otherwise, it is qualified.

8. The detection method according to claim 7, wherein The corrosion area on the surface of the copper mirror is calculated according to the percentage of the area where the color changes on the surface of the copper mirror in the total surface area of the entire copper mirror.

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