Ultra-thin temperature balancing plate sealing structure and sealing method

Abstract

The present invention relates to the field of heat dissipation technology. The purpose is to provide an ultra-thin temperature-averaging plate sealing structure, including a temperature-averaging plate body, the body including a flexible upper cover plate and a flexible lower cover plate whose edges are interconnected, the flexible upper cover plate and the flexible lower cover plate are supported by a supporting mechanism, and a working chamber is formed between the two; a flexible sealing frame is arranged between the edges of the flexible upper cover plate and the flexible lower cover plate, the flexible upper cover plate and the flexible lower cover plate are respectively connected to the flexible sealing frame; the thickness of the flexible sealing frame gradually becomes thicker from the outside to the inside, and a sealing edge portion with a triangular cross-section is formed on the inside. The present invention ensures the stability of the connection between the flexible upper cover plate and the flexible lower cover plate during the composite connection process by adding a flexible sealing frame, thereby preventing the leakage of the heat dissipation evaporation medium inside the working chamber, and ensuring the service life of the temperature-averaging plate.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to an ultra-thin temperature homogenizing plate sealing structure. Background Art

[0002] A vapor chamber is a vacuum cavity with a microstructured inner wall, usually made of copper. When heat is transferred from the heat source to the evaporation zone, the coolant in the cavity begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gas phase cooling medium quickly fills the entire cavity. When the gas phase medium contacts a relatively cold area, condensation occurs. The heat accumulated during evaporation is released through condensation, and the condensed coolant returns to the evaporation heat source through the microstructured capillary channels. This operation will be repeated in the cavity. At present, vapor chamber technology has become relatively mature and widely used in processor chip cooling and graphics card cooling of various smart devices.

[0003] In recent years, with the rapid development of electronic information technology related industries, breakthrough products of various smart devices have been frequently launched. On this basis, the heat dissipation requirements for the core electronic devices of the corresponding products are also getting higher and higher. Flexible folding screen display devices are a product that has been extremely popular in recent years. Its characteristics are that the screen has flexible and foldable characteristics. It is now more common in high-end models of various brands of smartphones. Since the traditional heat spreader is a rigid structure with a hard texture, in order to avoid affecting the folding, in general, the heat spreaders of these flexible folding display devices will be designed in the non-folding area of ​​the device, but this will undoubtedly occupy more layout space for other circuits and electronic devices, and reduce the overall design margin of the device. For this reason, if a flexible heat spreader that can adapt to the folding needs of the device can be developed, it will be able to greatly broaden the design margin of the flexible folding display device, reduce the design difficulty of such equipment, and give it a broader market prospect. In the design and use of flexible foldable heat spreaders, the following major technical difficulties need to be considered in particular.

[0004] 1. The problem of heat conduction rate between the flexible heat spreader and the heat source and the heat dissipation backplane: At present, the traditional heat spreader is made of copper-based materials, which has reliable heat conduction performance and can stably and quickly realize heat conduction between the heat spreader and the heat source, and between the heat spreader and the heat dissipation backplane (generally the backplane of the device housing). When the heat spreader is designed to be flexible, although flexible thermally conductive silicone sheets can be used as the upper and lower covers of the heat spreader, due to the limitations of material properties, its thermal conductivity is still lower than that of copper-based materials. Therefore, in order to ensure the reliability of heat dissipation, the requirements for the heat conduction nodes (contact surfaces) between the heat source and the heat spreader, and between the heat spreader and the heat dissipation backplane are higher. If the traditional single-surface combination method is used for heat conduction, the overall heat dissipation efficiency of the heat spreader will be reduced due to the limited heat conduction area.

[0005] 2. Since the flexible heat spreader needs to be made of flexible materials, in order to meet the needs of folding, it is not suitable to use a rigid support structure between the upper cover and the lower cover. Therefore, it is generally selected to use a flexible corrugated plate with holes sandwiched between the upper and lower cover plates, or elastic convex columns formed on the upper / lower cover plates as the support structure to ensure that there is sufficient space for the working fluid to evaporate between the upper and lower cover plates; but during the application of these types of support structures, their support mainly comes from the elasticity of the material itself; during the repeated folding and use of the equipment, as the elastic fatigue of the material intensifies, its support will be significantly reduced, which will lead to the collapse of the inner cavity of the heat spreader, affecting the circulation of the working fluid in the heat spreader, and ultimately affecting the heat dissipation efficiency.

[0006] 3. The upper and lower covers of traditional heat spreaders are made of copper-based materials. When sealing, the edges of the upper and lower covers are directly welded together to form an inner cavity, and then the water injection ports reserved on the upper and lower covers are used for subsequent vacuuming, fluid injection, and hole sealing. However, the flexible and foldable heat spreader uses thermally conductive silicone sheets as the upper and lower covers, and it is impossible to use the traditional copper-based material welding process to seal the upper and lower covers; therefore, how to ensure the stable combination of the upper and lower covers of the flexible and foldable heat spreader to avoid fluid leakage is also an extremely critical issue. Summary of the invention

[0007] The object of the present invention is to provide an ultra-thin temperature equalizing plate sealing structure which can effectively prevent leakage of working fluid.

[0008] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an ultra-thin temperature-vaporizing plate sealing structure, comprising a temperature-vaporizing plate body, the body comprising a flexible upper cover plate and a flexible lower cover plate whose edges are connected to each other, the flexible upper cover plate and the flexible lower cover plate are supported by a supporting mechanism, and a working cavity is formed between the two; a capillary wick is arranged on the inner surface of the flexible lower cover plate, and the working cavity is filled with a liquid heat dissipation evaporation medium;

[0009] A flexible sealing frame is arranged between the edges of the flexible upper cover plate and the flexible lower cover plate, and the flexible upper cover plate and the flexible lower cover plate are respectively connected to the flexible sealing frame; the thickness of the flexible sealing frame gradually becomes thicker from the outside to the inside, and a sealing edge portion with a triangular cross-section is formed on the inner side.

[0010] Preferably, four corners of the flexible upper cover plate, the flexible lower cover plate and the flexible sealing frame are all provided with 45° straight chamfers.

[0011] Preferably, it also includes a liquid injection port, and the liquid injection port is arranged at the straight chamfer.

[0012] Preferably, an L-shaped flange is provided on an edge of the flexible sealing frame close to the outer side, and the flexible upper cover plate and the flexible lower cover plate are clamped between the flange and the flexible sealing frame.

[0013] Preferably, the flexible upper cover plate and the flexible lower cover plate are connected to the flexible sealing frame and the flange by gluing.

[0014] Preferably, a plurality of floating points are arranged on the surface of the flexible sealing frame.

[0015] Preferably, the supporting mechanism includes a plurality of flexible, hollow supporting bosses arranged on the inner surfaces of the flexible upper cover plate and the flexible lower cover plate, the supporting bosses are distributed in a matrix shape on the flexible upper cover plate and the flexible lower cover plate, and a liquid supporting evaporating working fluid is arranged in the inner cavity of the supporting bosses. After the supporting evaporating working fluid in the supporting bosses evaporates due to heat, the supporting bosses can expand to form a shape; and the working cavity is supported by the supporting bosses.

[0016] Preferably, the supporting bosses on the flexible upper cover plate and the flexible lower cover plate are arranged in pairs, and can both extend to positions abutting against each other after expansion.

[0017] Preferably, the flexible upper cover plate and the flexible lower cover plate are both composed of a composite of a lining film and a closing film, the lining film is located on the inner surface of the flexible upper cover plate and the flexible lower cover plate, and the closing film is located on the outer surface of the flexible upper cover plate and the flexible lower cover plate; the lining film is provided with a plurality of inwardly protruding concave areas, and the supporting boss is formed by closing the concave areas on the lining film with the closing film.

[0018] Preferably, the sealing method comprises the following steps:

[0019] A. Complete the connection of the flexible upper cover plate, the flexible lower cover plate and the flexible sealing frame under a vacuum environment;

[0020] B. Heating the heat spreader by means of thermal radiation to evaporate the supporting evaporation medium in the supporting boss, so as to expand the supporting boss and complete the shaping of the supporting boss to support the working chamber;

[0021] C. Inject the heat dissipation evaporation medium into the working chamber of the heat spreader from the liquid injection port, and complete the sealing of the liquid injection port and the removal of the excess part.

[0022] The beneficial effects of the present invention are mainly reflected in: by adding a flexible sealing frame, the connection stability of the flexible upper cover plate and the flexible lower cover plate can be ensured during the composite connection process, thereby preventing the leakage of the heat dissipation evaporation medium inside the working chamber, and ensuring the service life of the heat spreader. Specifically, the flexible sealing frame of the present invention adopts a thick inner and thin outer form. When the heat dissipation evaporation medium evaporates and expands, it actually converts a part of the tearing force on the composite connection position into a squeezing force on the inner side of the flexible sealing frame, so that part of the stress is evenly transmitted to the entire connection position through the flexible connection frame, which can avoid stress concentration to a certain extent, thereby reducing the risk of connection damage, avoiding the leakage of the heat dissipation evaporation medium caused by this, extending the service life of the heat spreader, and improving the adaptability of the flexible heat spreader to high temperature and high pressure working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the installation of the heat source, the heat spreader, and the heat dissipation backplane in the present invention;

[0024] Figure 2 Schematic diagram of the structure of the thermal conductive copper sheet;

[0025] Figure 3 is a schematic diagram of the installation of the first contact thin wing and the second contact thin wing;

[0026] Figure 4 Schematic diagram of the structure of the heat sink;

[0027] Figure 5 for Figure 4 AA view of the structure shown in;

[0028] Figure 6 is a schematic diagram of the structure of the inner surface of the flexible upper cover plate;

[0029] Figure 7 for Figure 5 Enlarged view of middle part B;

[0030] Figure 8 for Figure 7 Schematic diagram of the structure of the middle support boss in a non-expanded state;

[0031] Fig. 9 It is a structural schematic diagram of a flexible sealing frame;

[0032] Fig.10 for Figure 5 Enlarged view of middle C;

[0033] Fig.11 for Fig.10 The structure shown in FIG. 1 is a schematic diagram of a preferred embodiment of the structure. DETAILED DESCRIPTION

[0034] like Figure 1-11 The heat spreader shown is mainly used in mobile phones, tablet computers, laptop computers and other devices with flexible and foldable screens to dissipate heat and cool down core electronic devices with high heat density, and is particularly suitable for use in flexible screens. The present invention includes a heat spreader body 0, which is in contact with a heat source 6 and a flexible heat dissipation back plate 5 respectively, and the heat generated by the heat source 6 is conducted from the flexible heat dissipation back plate 5.

[0035] Compared with the traditional heat spreader body 0, the present invention is similar in that the body 0 includes a flexible upper cover plate 1 and a flexible lower cover plate 2 whose edges are connected to each other, and the flexible upper cover plate 1 and the flexible lower cover plate 2 are supported by a supporting mechanism, and a working chamber is formed between the two. A capillary wick 3 is provided on the inner surface of the flexible lower cover plate 2, and the working chamber is filled with liquid heat dissipation evaporation medium. During operation, the flexible lower cover plate 2 in contact with the heat source 6 absorbs the heat of the heat source 6, so that the heat dissipation evaporation medium is evaporated and vaporized, taking away a large amount of heat; the gaseous heat dissipation evaporation medium flows to the condensation section of the heat spreader body 0, and after condensation, it is brought back to the evaporation zone 4 by the capillary wick 3, forming a heat dissipation cycle.

[0036] Compared with the traditional heat spreader body 0, the present invention is improved mainly in the following aspects, so that the heat spreader can be more efficiently and stably used in a foldable flexible screen device.

[0037] First, if Figure 4 As shown in the figure, the outer surface of the flexible lower cover plate 2 of the present invention is provided with an evaporation area 4, and the evaporation area 4 is in contact with the heat source 6 to form heat conduction. The outer surface of the flexible upper cover plate 1 is in contact with the flexible heat dissipation back plate 5 to form heat conduction. In other words, the upper and lower surfaces of the body 0 are respectively used to contact the heat source 6 and the flexible heat dissipation back plate 5 for heat dissipation.

[0038] In the process of contacting with the heat source 6, the evaporation area 4 is in contact with the heat source 6 through the heat conductive copper sheet 7. The heat source 6 is attached to one side of the heat conductive copper sheet 7 to achieve stable fixed installation. Of course, in order to further improve the stability of the heat source 6, a positioning groove can be provided on the side of the heat conductive copper sheet 7 corresponding to the heat source 6. The positioning groove is adapted to the heat source 6, and the heat source 6 is arranged in the positioning groove. The other side of the heat conductive copper sheet 7 is evenly provided with a plurality of Figure 2As shown in the figure, the contact ridge 8 extends along the width direction of the heat-conducting copper sheet 7, and the area of ​​the flexible lower cover plate 2 opposite to the heat-conducting copper sheet 7 is provided with a contact groove matched with the contact ridge 8, and the contact ridge 8 is embedded in the contact groove. The shape and size of the contact groove are designed according to the contact ridge 8. Since its structure itself is relatively simple, it is not shown in the present invention. Figure 2 The contact edge 8 shown in FIG. has a similar structure. The contact edge 8 of the present invention has many shapes, for example: Figure 2 As shown in FIG. 1 , the cross section thereof is a semicircular shape protruding toward the flexible upper cover plate 1 . Of course, the cross section may also be a square, a triangle, etc.

[0039] The present invention uses the thermally conductive copper sheet 7 as the installation basis for the heat source 6, thereby improving the installation stability of the heat source 6 on the flexible lower cover plate 2 of the heat spreader body 0 and reducing the risk of deformation of the position of the heat source 6; at the same time, a contact edge 8 is provided on the thermally conductive copper sheet 7, and the contact edge 8 is embedded in the contact groove of the flexible lower cover plate 2 of the heat spreader body 0, which, on the one hand, makes the connection between the thermally conductive copper sheet 7 and the heat spreader body 0 more stable, and on the other hand, increases the contact area between the thermally conductive copper sheet 7 and the heat spreader body 0, thereby ensuring the stability of heat conduction between the two; an installation basis is provided for the connection between the flexible, foldable heat spreader body 0 and the heat source 6, thereby ensuring the normal operation of the heat spreader body 0.

[0040] On this basis, in order to further improve the thermal conductivity, during the contact between the body 0 and the flexible heat dissipation back plate 5, as shown in FIG. Figure 3 As shown in, the surfaces where the flexible upper cover plate 1 and the flexible heat dissipation back plate 5 contact each other are respectively provided with a plurality of first contact thin fins 9 and second contact thin fins 10, and the first contact thin fins 9 and the second contact thin fins 10 are respectively integrated with the flexible upper cover plate 1 and the flexible heat dissipation back plate 5. When the flexible upper cover plate 1 and the flexible heat dissipation back plate 5 are pressed together, the first contact thin fins 9 and the second contact thin fins 10 overlap each other. In theory, the more the number of the first contact thin fins 9 and the second contact thin fins 10 and the thinner the thickness, the better the thermal conductivity performance. However, in the actual design and production process, the staff can make a specific design according to the heat dissipation design parameters. In addition, in order to further ensure the contact yield of the first contact thin fins 9 and the second contact thin fins 10 and reduce the contact gap, the contact gap of the first contact thin fins 9 and the second contact thin fins 10 is also filled with thermal grease, which is usually pre-coated on the first contact thin fins 9 and the second contact thin fins 10. After pressing together, the excess thermal grease can be squeezed out naturally. Of course, the contact gap between the contact edge 8 and the contact groove may also be filled with thermal grease.

[0041] Secondly, the present invention improves the supporting structure of the flexible upper cover plate 1 and the flexible lower cover plate 2 to ensure the stability of the working chamber. Figure 4-8 As shown in , the support mechanism includes a plurality of flexible, hollow support bosses 11 arranged on the inner surfaces of the flexible upper cover plate 1 and the flexible lower cover plate 2, and the support bosses 11 are used as support columns in the middle area of ​​the flexible upper cover plate 1 and the flexible lower cover plate 2. The support bosses 11 must ensure their own flexibility so that the body 0 has good foldability, and must also support the working cavity and ensure the working performance of the body 0 when the device is running at high power. Figure 6 and 7 As shown in FIG, the support bosses 11 are distributed in a matrix shape on the flexible upper cover plate 1 and the flexible lower cover plate 2. Figure 6 In the figure, 15 support bosses 11 are provided on the flexible upper cover plate 1. Of course, more or less can be provided according to the size of the body 0 and actual needs. A liquid support evaporation medium 12 is provided in the inner cavity of the support boss 11. The support evaporation medium 12 is a liquid working medium that can support the inner cavity of the support boss 11 after evaporation. After the support evaporation medium 12 in the support boss 11 evaporates due to heat, it can expand the support boss 11 to form a shape. And the working cavity is supported by the support boss 11.

[0042] The present invention adopts a flexible upper cover plate 1 and a flexible lower cover plate 2, and the flexible upper cover plate 1 and the flexible lower cover plate 2 are supported by a flexible, hollow support boss 11. In a low heat density working state, such as a low-power standby state, the support boss 11 itself is also flexible, so it does not affect the normal folding of the main body 0, so that the heat spreader as a whole has excellent deformability and foldability; but in a high heat density working state, along with the increase in the overall temperature of the heat spreader, the supporting evaporation medium 12 in the support boss 11 vaporizes and expands, realizing the "hardening" and shape shaping of the support boss 11, so that the support of the support boss 11 is greatly improved, meeting the support requirements of the working chamber inside the heat spreader, and ensuring that the heat spreader can work normally. Figure 7 The diagram shown in the figure is a schematic diagram of the structure in the "hardened" state. Figure 8 All shown in the figure are schematic diagrams of the structure in the "non-expanded" state. In order to prevent the support boss 11 from interfering with the capillary wick 3, a clearance hole is provided at the position where the capillary wick 3 and the support boss 11 are opposite.

[0043] Of course, this variable support is mainly used to solve the problem that the elasticity of the traditional flexible heat spreader is reduced due to repeated folding, and the support is insufficient even after resetting. When the heat spreader body 0 is in a folded state with a large angle, even if the present invention is adopted, it cannot fully achieve support, but mobile phones, tablets and other devices are basically in a low-power operating state when folded, and their relative heat dissipation requirements are not high, which can already meet basic usage requirements.

[0044] The support bosses 11 described in the present invention can be respectively arranged on the flexible upper cover plate 1 and the flexible lower cover plate 2, and the top of the bosses can be directly used to support the flexible upper cover plate 1 or the flexible lower cover plate 2. However, this method has a certain adverse effect on the foldability of the heat spreader body 0 due to the long length of the support bosses 11 themselves and their limited compressibility. To this end, the support bosses 11 on the flexible upper cover plate 1 and the flexible lower cover plate 2 described in the present invention are arranged in pairs, and can extend to abut against each other after expansion, and the abutting position is preferably located at the center of the working cavity, that is, the support bosses 11 on the flexible upper cover plate 1 and the flexible lower cover plate 2 are respectively half the thickness of the working cavity. The support bosses 11 can have many shapes, such as cylindrical, truncated cone, etc.

[0045] The support boss 11 of the present invention adopts a hollow design, so as to facilitate processing. Figure 7 and 8 As shown in , the flexible upper cover plate 1 and the flexible lower cover plate 2 are both composed of a lining film 13 and a closing film 14, the lining film 13 is located on the inner surface of the flexible upper cover plate 1 and the flexible lower cover plate 2, and the closing film 14 is located on the outer surface of the flexible upper cover plate 1 and the flexible lower cover plate 2. The lining film 13 is provided with a plurality of inwardly protruding concave areas, and the supporting boss 11 is formed by sealing the concave areas on the lining film 13 by the closing film 14. Generally, the lining film 13 and the closing film 14 are compounded by gluing. Of course, in some applications with higher requirements for heat conduction, the inner surfaces of the closing films 14 on the flexible upper cover plate 1 and the flexible lower cover plate 2 are provided with a thermally conductive copper foil layer 16. By adding the thermally conductive copper foil layer 16, the thermal conductivity efficiency of the flexible upper cover plate 1 and the flexible lower cover plate 2 themselves can be further improved, thereby ensuring the heat dissipation effect of the heat spreader body 0.

[0046] On this basis, in order to enable the condensed heat dissipation evaporation medium to quickly flow and converge along the flexible upper cover plate 1 , the inner surface of the lining film 13 of the flexible upper cover plate 1 is further provided with a plurality of fine edges 15 extending along the length direction of the flexible upper cover plate 1 .

[0047] Finally, since the flexible upper cover plate 1 and the flexible lower cover plate 2 of the present invention are both made of flexible materials, they are not suitable for sealing by traditional metal welding. To this end, the present invention also proposes a new sealing structure and sealing method, wherein a flexible sealing frame 17 is provided between the edges of the flexible upper cover plate 1 and the flexible lower cover plate 2, and the flexible upper cover plate 1 and the flexible lower cover plate 2 are respectively connected to the flexible sealing frame 17. The thickness of the flexible sealing frame 17 gradually increases from the outside to the inside, and a sealing edge portion 18 with a triangular cross section is formed on the inside.

[0048] After the flexible sealing frame 17 of the present invention is thick inside and thin outside, when the heat dissipation evaporation medium evaporates and expands, a part of the tearing force on the connection composite position is actually converted into a squeezing force on the inner side of the flexible sealing frame 17, so that part of the stress is evenly transmitted to the entire connection position through the flexible connection frame 17, which can avoid stress concentration to a certain extent, thereby reducing the risk of connection damage, avoiding the resulting leakage of the heat dissipation evaporation medium, extending the service life of the heat spreader, and improving the adaptability of the flexible heat spreader to high temperature and high pressure working conditions. Of course, in order to further improve the stress concentration condition at the corners, the four corners of the flexible upper cover plate 1, the flexible lower cover plate 2 and the flexible sealing frame 17 are all provided with a 45° straight chamfer 30. In order to facilitate the injection of the heat dissipation evaporation medium into the heat spreader body 0, the present invention, such as Fig. 9 As shown in , it also includes a liquid injection port 19, and the liquid injection port 19 is arranged at the straight chamfer 30.

[0049] Combination Fig.10 and 11 As shown in , in order to further improve the tightness of the combination of the flexible sealing frame 17 and the upper and lower cover plates, the flexible sealing frame 17 is provided with an L-shaped flange 20 near the outer edge, the flexible upper cover plate 1 and the flexible lower cover plate 2 are clamped between the flange 20 and the flexible sealing frame 17, and the flexible upper cover plate 1 and the flexible lower cover plate 2 are connected to the flexible sealing frame 17 and the flange 20 by gluing. In order to further improve the strength of the gluing, the surface of the flexible sealing frame 17 is provided with a plurality of floating points, which can increase the roughness of the surface of the flexible sealing frame 17 and thereby improve the gluing strength.

[0050] The sealing method of the vapor chamber body 0 of the present invention comprises the following steps:

[0051] A. Complete the connection between the flexible upper cover plate 1, the flexible lower cover plate 2 and the flexible sealing frame 17 under a vacuum environment.

[0052] B. The heat spreader is heated by thermal radiation to evaporate the supporting evaporation medium 12 in the supporting boss 11, so as to expand the supporting boss 11 and complete the shaping of the supporting boss 11 to support the working chamber.

[0053] C. Inject the heat dissipation evaporation medium into the working chamber of the heat spreader from the liquid injection port 19, and complete the sealing of the liquid injection port 19 and the removal of the excess part.

Claims

1. An ultra-thin temperature vapor chamber sealing structure, comprising a temperature vapor chamber body (0), the body (0) comprising a flexible upper cover plate (1) and a flexible lower cover plate (2) whose edges are connected to each other, the flexible upper cover plate (1) and the flexible lower cover plate (2) are supported by a supporting mechanism, and a working cavity is formed between the two; a capillary wick (3) is provided on the inner surface of the flexible lower cover plate (2), and the working cavity is filled with a liquid heat dissipation evaporation medium; Features: A flexible sealing frame (17) is provided between the edges of the flexible upper cover plate (1) and the flexible lower cover plate (2); the flexible upper cover plate (1) and the flexible lower cover plate (2) are respectively connected to the flexible sealing frame (17); the thickness of the flexible sealing frame (17) gradually increases from the outside to the inside, and a sealing edge portion (18) having a triangular cross-section is formed on the inside.

2. The ultra-thin temperature equalizing plate sealing structure according to claim 1, characterized in that: The four corners of the flexible upper cover plate (1), the flexible lower cover plate (2) and the flexible sealing frame (17) are all provided with 45° straight chamfers (30).

3. The ultra-thin temperature equalizing plate sealing structure according to claim 2, characterized in that: It also comprises a liquid injection port (19), wherein the liquid injection port (19) is arranged at the straight chamfer (30).

4. The ultra-thin temperature equalizing plate sealing structure according to claim 3, characterized in that: The flexible sealing frame (17) is provided with an L-shaped flange (20) at an edge close to the outer side, and the flexible upper cover plate (1) and the flexible lower cover plate (2) are clamped between the flange (20) and the flexible sealing frame (17).

5. The ultra-thin temperature equalizing plate sealing structure according to claim 4, characterized in that: The flexible upper cover plate (1) and the flexible lower cover plate (2) are connected to the flexible sealing frame (17) and the flange (20) by gluing.

6. The ultra-thin temperature equalizing plate sealing structure according to claim 5, characterized in that: The surface of the flexible sealing frame (17) is provided with a plurality of floating points.

7. The ultra-thin temperature equalizing plate sealing structure according to claim 6, characterized in that: The support mechanism comprises a plurality of flexible, hollow support bosses (11) arranged on the inner surfaces of the flexible upper cover plate (1) and the flexible lower cover plate (2); the support bosses (11) are distributed in a matrix shape on the flexible upper cover plate (1) and the flexible lower cover plate (2); a liquid support evaporation medium (12) is arranged in the inner cavity of the support bosses (11); after the support evaporation medium (12) in the support bosses (11) evaporates under heat, the support bosses (11) can expand to form a shape; and the working cavity is supported by the support bosses (11).

8. The ultra-thin temperature equalizing plate sealing structure according to claim 7, characterized in that: The supporting bosses (11) on the flexible upper cover plate (1) and the flexible lower cover plate (2) are arranged in pairs, and can both extend to positions abutting against each other after expansion.

9. The ultra-thin temperature equalizing plate sealing structure according to claim 8, characterized in that: The flexible upper cover plate (1) and the flexible lower cover plate (2) are both composed of a lining film (13) and a closing film (14); the lining film (13) is located on the inner surface of the flexible upper cover plate (1) and the flexible lower cover plate (2); the closing film (14) is located on the outer surface of the flexible upper cover plate (1) and the flexible lower cover plate (2); the lining film (13) is provided with a plurality of inwardly protruding concave areas; the supporting boss (11) is formed by the closing film (14) closing the concave areas on the lining film (13).

10. The sealing method of the ultra-thin temperature homogenizing plate sealing structure according to claim 9, characterized in that: The following steps are involved: A. Complete the connection of the flexible upper cover plate (1), the flexible lower cover plate (2) and the flexible sealing frame (17) under a vacuum environment; B. heating the heat spreader by means of thermal radiation to evaporate the supporting evaporation medium (12) in the supporting boss (11), thereby expanding the supporting boss (11) and completing the shaping of the supporting boss (11), thereby supporting the working chamber; C. Inject the heat dissipation evaporation medium into the working chamber of the heat spreader from the liquid injection port (19), and complete the sealing of the liquid injection port (19) and the removal of the excess part.

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