Highly integrated intelligent power module, electric control assembly and air conditioner

Abstract

The application discloses a high-integration intelligent power module, an electric control assembly and an air conditioner. The high-integration intelligent power module comprises a mounting substrate, a compressor IPM module and a fan IPM module which are respectively installed in corresponding mounting positions, and a compressor low-voltage reference pin, a compressor current detection pin, a fan low-voltage reference pin, a fan current detection pin and a single-point grounding pin. The compressor low-voltage reference pin is connected with an output end of the compressor IPM module, and the compressor low-voltage reference pin is also used for being connected with the single-point grounding pin through an external compressor current detection resistor. The compressor current detection pin is electrically connected with the compressor low-voltage reference pin. The fan low-voltage reference pin is connected with an output end of the fan IPM module, and the fan low-voltage reference pin is also used for being connected with the single-point grounding pin through an external fan current detection resistor. The fan current detection pin is electrically connected with the fan low-voltage reference pin. The application is favorable for improving the reliability of the high-integration intelligent power module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic circuit, in particular to a high-integration intelligent power module, an electric control assembly and an air conditioner. BACKGROUND

[0002] In the high-integration intelligent power module, only one ground pin of the driving chip is usually arranged, and is usually located at the low-voltage side, while the ground end of the power switch tube is usually located at the high-voltage side. In the high-integration intelligent power module, the emitter of the power switch tube, such as IGBT, is arranged at the high-voltage side, so that the ground pins of the low-voltage side and the high-voltage side are far apart when single-point grounding is achieved. In addition, in the high-integration intelligent power module provided with a current detection pin, the current detection pin is arranged at the low-voltage side, and needs to be connected to the emitter of the IGBT through an external lead, which results in too long wiring and increased parasitic inductance, and even causes false triggering. SUMMARY

[0003] The main purpose of the present application is to provide a high-integration intelligent power module, an electric control assembly and an air conditioner, which aims to improve the reliability of the high-integration intelligent power module.

[0004] To achieve the above-mentioned purpose, the present application provides a high-integration intelligent power module, which comprises:

[0005] A mounting substrate, which has a strong-electricity pin mounting side and a weak-electricity pin mounting side arranged oppositely on both sides along the length direction of the mounting substrate; a surface of the mounting substrate is provided with a plurality of mounting positions;

[0006] A compressor IPM module and a fan IPM module are respectively mounted in the corresponding mounting positions, and

[0007] A compressor low-voltage reference pin, a compressor current detection pin, a fan low-voltage reference pin, a fan current detection pin and a single-point grounding pin are arranged on the strong-electricity pin mounting side; wherein

[0008] The compressor low-voltage reference pin is connected to the output end of the compressor IPM module, and is also used to be connected to the single-point grounding pin through an external compressor current detection resistor; the compressor current detection pin is electrically connected to the compressor low-voltage reference pin;

[0009] The fan low-voltage reference pin is connected to the output end of the fan IPM module, and is also used to be connected to the single-point grounding pin through an external fan current detection resistor; the fan current detection pin is electrically connected to the fan low-voltage reference pin.

[0010] Optionally, the compressor low-voltage reference pin, the compressor current detection pin, the single-point grounding pin, the fan low-voltage reference pin, and the fan current detection pin are arranged adjacently on the strong-current pin mounting side.

[0011] Optionally, the compressor IPM module comprises:

[0012] The compressor inverter power module and the compressor drive chip are mounted on the corresponding mounting positions and electrically connected.

[0013] The fan IPM module comprises:

[0014] The fan inverter power module and the fan drive chip are mounted on the corresponding mounting positions and electrically connected.

[0015] Optionally, the weak-current pin mounting side is provided with a first low-voltage power supply positive pin, a second low-voltage power supply positive pin, a first low-voltage power supply negative pin, and a second low-voltage power supply negative pin.

[0016] The power supply end of the compressor drive chip is electrically connected to the first low-voltage power supply positive pin.

[0017] The power supply end of the fan drive chip is electrically connected to the second low-voltage power supply positive pin.

[0018] The grounding end of the compressor drive chip is electrically connected to the first low-voltage power supply negative pin.

[0019] The grounding end of the fan drive chip is electrically connected to the second low-voltage power supply negative pin.

[0020] Optionally, the single-point grounding pin is connected to the grounding end of the compressor drive chip and the grounding end of the fan drive chip, respectively.

[0021] Optionally, the high-integration intelligent power module further comprises:

[0022] The PFC inductor connection negative end is connected to the PFC power supply negative end.

[0023] The PFC inductor connection positive end is interconnected with the PFC power supply positive end and one end of an external inductor.

[0024] The PFC inductor connection end is connected to the other end of the external inductor.

[0025] The bus capacitor connection end is connected to an external bus capacitor.

[0026] The PFC power module comprises a PFC power switch tube and a PFC diode, the input end of the PFC power switch tube is connected with the PFC inductor connection end and the anode of the PFC diode, and the output end of the PFC power switch tube is connected with the PFC inductor connection negative end.

[0027] Optionally, the output end of the PFC power switch tube is electrically connected with the single-point grounding pin.

[0028] And / or, the output end of the PFC power switch tube is electrically connected with the grounding end of the compressor driving chip.

[0029] Optionally, the high-integration intelligent power module further comprises:

[0030] A rectifier bridge, the output end of the rectifier bridge is connected with the PFC inductor.

[0031] The application further provides an electric control assembly comprising a low-voltage power supply, a high-voltage power supply, a compressor current detection resistor, a fan current detection resistor and the high-integration intelligent power module, wherein,

[0032] One end of the compressor current detection resistor is connected with the compressor low-voltage reference pin and the compressor current detection pin of the high-integration intelligent power module, and the other end of the compressor current detection resistor is connected with the single-point grounding pin of the high-integration intelligent power module.

[0033] The compressor low-voltage reference pin is further connected with the negative end of the high-voltage power supply through the compressor current detection resistor.

[0034] One end of the fan current detection resistor is connected with the fan low-voltage reference pin and the fan current detection pin of the high-integration intelligent power module, and the other end of the fan current detection resistor is connected with the single-point grounding pin of the high-integration intelligent power module.

[0035] The fan low-voltage reference pin is further connected with the negative end of the high-voltage power supply through the fan current detection resistor.

[0036] The application further provides an air conditioner comprising the high-integration intelligent power module.

[0037] Or, comprising the electric control assembly.

[0038] The technical scheme of the present application sets the low-voltage reference foot of the compressor, the low-voltage reference foot of the fan, the compressor current detection foot, the fan current detection foot and the single-point grounding foot on the strong current foot mounting side, the compressor current detection foot is electrically connected with the current feedback end of the compressor driving chip through the wiring and binding wire on the internal circuit wiring layer of the high-integration intelligent power module, and two grounding ends are set on the compressor driving chip to electrically connect the single-point grounding foot on the strong current side with the weak current grounding foot on the weak current side. The present application can shorten the wiring when the strong current ground and the weak current ground realize single-point grounding, the grounding end of the inverter power module on the strong current mounting side does not need to be connected with the weak current grounding foot on the weak current mounting side, and the connection point on the electric control board does not need to be found, thus the wiring safety requirement of the wiring can be considered, the wiring of the peripheral electric control of the high-integration intelligent power module can be facilitated, the wiring difficulty of the electric control board of the electric appliance is reduced, and the reliability of the high-integration intelligent power module is improved. The present application solves the problem that the over-current protection of the high-integration intelligent power module is easily mis-triggered, and the reliability of the high-integration intelligent power module is poor. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from the structures shown in the drawings without any creative effort.

[0040] Figure 1 The figure is a functional module schematic diagram of an embodiment of the high-integration intelligent power module of the present application.

[0041] Figure 2 The figure is an internal circuit structure schematic diagram of an embodiment of the high-integration intelligent power module of the present application.

[0042] Figure 3 The figure is a circuit structure schematic diagram of an embodiment of the application of the high-integration intelligent power module to the electric control assembly.

[0043] Figure 4 The figure is a structure schematic diagram of another embodiment of the electric control assembly of the present application.

[0044] Explanation of the drawings:

[0045] Reference Name Reference Name 10 Compressor IPM module UVW- Compressor low voltage reference leg 20 Fan IPM module ITRIP Compressor current sense leg 30 PFC power module FUVW- Fan low voltage reference leg 40 Rectifier bridge FITRIP Fan current sense leg C1-C6 Compressor filter capacitor VSS3 Single point ground leg CF1-CF3 Fan filter capacitor

[0046] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the drawings. DETAILED DESCRIPTION

[0047] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0048] The present application provides a high-integration intelligent power module.

[0049] With reference to Figures 1-4 In an embodiment of the present application, the high-integration intelligent power module comprises:

[0050] The mounting substrate has a strong-electricity pin mounting side and a weak-electricity pin mounting side arranged oppositely on two sides along the length direction of the mounting substrate; and a plurality of mounting positions are arranged on the surface of the mounting substrate.

[0051] The compressor IPM module and the fan IPM module are respectively mounted on the corresponding mounting positions, and

[0052] The compressor low-voltage reference pin, the compressor current detection pin, the fan low-voltage reference pin, the fan current detection pin and the single-point grounding pin are arranged on the strong-electricity pin mounting side; wherein

[0053] The compressor low-voltage reference pin is connected with the output end of the compressor IPM module, and the compressor low-voltage reference pin is further connected with the single-point grounding pin through an external compressor current detection resistor; and the compressor current detection pin is electrically connected with the compressor low-voltage reference pin.

[0054] The fan low-voltage reference pin is connected with the output end of the fan IPM module, and the fan low-voltage reference pin is further connected with the single-point grounding pin through an external fan current detection resistor; and the fan current detection pin is electrically connected with the fan low-voltage reference pin.

[0055] In the embodiment, the mounting substrate can be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate or a copper alloy substrate. The mounting substrate is a mounting carrier of the power switch tube and the driving device, and the shape of the mounting substrate can be determined according to the specific position, quantity and size of the power switch tube, and the mounting substrate can be a square, but is not limited to a square. The mounting substrate is provided with a circuit wiring layer, and the circuit wiring layer forms corresponding lines and mounting positions, i.e. pads, for mounting each electronic element in the power switch tube on the mounting substrate according to the circuit design of the high-integration intelligent power module.

[0056] When the mounting substrate is implemented by using an aluminum nitride ceramic mounting substrate, the aluminum nitride ceramic mounting substrate comprises an insulating heat dissipation layer and a circuit wiring layer formed on the insulating heat dissipation layer. When the mounting substrate is implemented by using a mounting substrate made of metal material, the mounting substrate comprises a heat dissipation layer, an insulating layer laid on the heat dissipation layer, and a circuit wiring layer formed on the insulating layer. In the embodiment, the mounting substrate can be a single-sided wiring board. The insulating layer is arranged between the circuit wiring layer and the metal mounting substrate. The insulating layer is used to realize electrical isolation and electromagnetic shielding between the circuit wiring layer and the metal mounting substrate, and to reflect external electromagnetic interference, so as to avoid external electromagnetic radiation from interfering with the normal work of the power switch tube and reducing the interference of electromagnetic radiation in the surrounding environment on the electronic components in the high-integration intelligent power module. The insulating layer can be made of thermoplastic glue or thermosetting glue, so as to realize fixed connection and insulation between the mounting substrate and the circuit wiring layer. The insulating layer can be a high-thermal-conductivity insulating layer made of one or more materials such as epoxy resin, aluminum oxide, and high-thermal-conductivity filling material. In the process of manufacturing the mounting substrate, the copper foil can be laid on the insulating layer after the insulating layer is arranged on the mounting substrate, and the copper foil is etched according to the preset circuit design, so as to form the circuit wiring layer.

[0057] The components in the high-integration intelligent power module can be patch-type electronic components, or can be bare die wafers. The circuit wiring layer is provided with a plurality of mounting areas according to the functional setting requirements, and a plurality of mounting positions are formed in each mounting area. Specifically, the circuit wiring layer comprises circuit wiring forming a current loop, and pads formed from the circuit wiring. The components of the high-integration intelligent power module are arranged on the corresponding pads, and the compressor IPM module 10 and the fan IPM module 20 can be electrically connected by the circuit wiring and metal wires. It can be understood that when the electronic components are mounted on the mounting substrate 100, the overall circuit of the mounting substrate 100 can also be copper-plated to meet the standard of the interference voltage and the anti-interference ability.

[0058] The compressor IPM module 10 is used to drive the compressor to work, and the fan IPM module 20 is used to drive the fan to work. The compressor IPM module 10 comprises:

[0059] The compressor inverter power module 11 and the compressor drive chip IC1 are mounted on the corresponding mounting positions and are electrically connected.

[0060] The fan IPM module 20 comprises:

[0061] The fan inverter power module 21 and the fan drive chip IC2 are mounted on the corresponding mounting positions and are electrically connected.

[0062] In this embodiment, the compressor IPM module 10 is also provided with a compressor drive chip IC1, and the number of the compressor drive chip IC1 can be one, for example, a HVIC drive chip. The compressor drive chip IC1 is an integrated chip, in which a drive circuit of four, six or seven drive power switches is integrated, and the number of the integrated drive circuit can be set according to the number of the drive power switches. The number of the compressor drive chip IC1 can also correspond to the number of the power switches, that is, each compressor drive chip IC1 corresponds to drive one power switch. When the intelligent power module works, the compressor drive chip IC1 outputs a corresponding control signal to control the power switches in the PFC power module 3030 and the compressor inverter power module 11 to be turned on, so as to output drive power to drive the motor and other loads to work.

[0063] The compressor inverter power module 11 is provided with a plurality of power switches, which can be gallium nitride (GaN) power switches, Si-based power switches or SiC-based power switches. In actual application, the number of the power switches can be four or a multiple of four, or six or a multiple of six. The six power switches (T1-T6) form an inverter circuit to drive the compressor to work.

[0064] In the compressor drive chip IC1, a high-voltage side drive unit and a low-voltage side drive circuit are included. The input end of the compressor drive chip IC1 is connected with a main controller, that is, an MCU. The MCU is integrated with a logic controller, a memory, a data processor and the like, as well as a software program and / or a module stored on the memory and executable on the data processor. The MCU outputs a corresponding control signal to the compressor drive chip IC1 by running or executing the software program and / or the module stored in the memory and calling the data stored in the memory, so as to drive the power switches in the compressor inverter power module 11 to be turned on / off according to the control signal of the main controller, thereby driving the compressor to work.

[0065] The fan IPM module 20 is also provided with a fan drive chip IC2, and the number of the fan drive chip IC2 can be one, for example, a HVIC drive chip. The fan drive chip IC2 is an integrated chip, in which a drive circuit of four, six or seven drive power switches is integrated, and the number of the integrated drive circuit can be set according to the number of the drive power switches. The number of the fan drive chip IC2 can also correspond to the number of the power switches, that is, each fan drive chip IC2 corresponds to drive one power switch. When the intelligent power module works, the fan drive chip IC2 outputs a corresponding control signal to control the power switches in the fan inverter power module 21 to be turned on, so as to output drive power to drive the motor and other loads to work.

[0066] The fan inverter power module 21 is provided with a plurality of power switch tubes, which can be gallium nitride (GaN) power switch tubes, Si-based power switch tubes or SiC-based power switch tubes. In actual application, the number of power switch tubes can be four or a multiple of four, or six or a multiple of six. Six power switch tubes (TF1-TF6) form an inverter circuit to drive the fan to work.

[0067] The fan drive chip IC2 includes a high-voltage side drive unit and a low-voltage side drive circuit. The input end of the fan drive chip IC2 is connected with the main controller, i.e. MCU. The MCU is integrated with a logic controller, a memory, a data processor and the like, as well as a software program and / or a module stored on the memory and executable on the data processor. The MCU outputs corresponding control signals to the fan drive chip IC2 by running or executing the software program and / or the module stored in the memory and calling the data stored in the memory, so as to drive the power switch tubes in the fan inverter power module 21 to turn on / off according to the control signals of the main controller, thereby driving the fan to work.

[0068] The main controller can be independent of the smart power module 100. In actual application, the main controller and the high-integration smart power module are arranged on an electric control board and are electrically connected through circuit wiring or wires. Of course, in other embodiments, the main controller can be highly integrated in the smart power module 100 to improve the integration of the smart power module.

[0069] Reference Figure 2In the embodiment, the power switch tubes in the compressor inverter power module 11 all adopt IGBT, and the driving chip 101 adopts a HVIC chip as an example for description. The VCC end of the HVIC tube IC1 is used as the low-voltage area power supply positive end VDD of the high-integration intelligent power module, and the VDD is generally 15V; the HIN1 end of the HVIC tube IC1 is used as the U-phase upper bridge arm input end HIN1 of the high-integration intelligent power module; the HIN2 end of the HVIC tube IC1 is used as the V-phase upper bridge arm input end HIN2 of the high-integration intelligent power module; the HIN3 end of the HVIC tube IC1 is used as the W-phase upper bridge arm input end HIN3 of the high-integration intelligent power module; the LIN1 end of the HVIC tube IC1 is used as the U-phase lower bridge arm input end LIN1 of the high-integration intelligent power module; the LIN2 end of the HVIC tube IC1 is used as the V-phase lower bridge arm input end VLIN of the high-integration intelligent power module; the LIN3 end of the HVIC tube IC1 is used as the W-phase lower bridge arm input end LIN3 of the high-integration intelligent power module; here, the six-way input of the U, V and W three-phase of the high-integration intelligent power module receives an input signal of 0-5V; the VSS end of the HVIC tube IC1 is used as the low-voltage area power supply negative end VSS1, VSS3 of the high-integration intelligent power module, wherein the VSS1 pin is at the logic end and adjacent to the VDD and other low-voltage pins, and the VSS3 pin is at the high-voltage side and adjacent to the UVW- and ITRIP pins; the ITRIP end of the HVIC tube IC1 is used as the over-current protection detection end VSS3 of the high-integration intelligent power module; the VB1 end of the HVIC tube IC1 is used as the U-phase high-voltage area power supply positive end UVB of the high-integration intelligent power module; the HO1 end of the HVIC tube IC1 is connected with the gate of the U-phase upper bridge arm IGBT tube T1; the VS1 end of the HVIC tube IC1 is connected with the anode of the FRD tube D1, the emitter of the IGBT tube T1, the collector of the U-phase lower bridge arm IGBT tube T4 and the cathode of the FRD tube D5, and is used as the U-phase high-voltage area power supply negative end UVS of the high-integration intelligent power module; the VB2 end of the HVIC tube IC1 is used as the U-phase high-voltage area power supply positive end VVB of the high-integration intelligent power module; the HO3 end of the HVIC tube IC1 is connected with the gate of the V-phase upper bridge arm IGBT tube T3; the VS2 end of the HVIC tube IC1 is connected with the anode of the FRD tube D2, the emitter of the IGBT tube T2, the collector of the V-phase lower bridge arm IGBT tube T5 and the cathode of the FRD tube D5, and is used as the W-phase high-voltage area power supply negative end VVS of the high-integration intelligent power module; the VB3 end of the HVIC tube IC1 is used as the W-phase high-voltage area power supply positive end WVB of the high-integration intelligent power module; and the HO3 end of the HVIC tube IC1 is connected with the gate of the W-phase upper bridge arm IGBT tube T3.The VS3 end of the HVIC tube IC1 is connected with the emitter of the IGBT tube T3, the anode of the FRD tube D3, the collector of the W-phase lower bridge arm IGBT tube T6, and the cathode of the FRD tube T6, and serves as a W-phase high-voltage area power supply negative end WVS of the high-integration intelligent power module; the LO1 end of the HVIC tube IC1 is connected with the gate of the IGBT tube T4; the LO2 end of the HVIC tube IC1 is connected with the gate of the IGBT tube T5; the LO3 end of the HVIC tube IC1 is connected with the gate of the IGBT tube T6; the LO3 end of the HVIC tube IC1 is connected with the gate of the IGBT tube 126; the emitter of the IGBT tube T4 is connected with the anode of the FRD tube T4, and serves as a three-phase low-voltage reference foot UVW- of the high-integration intelligent power module; the emitter of the IGBT tube T5 is connected with the anode of the FRD tube D5, and serves as a three-phase low-voltage reference foot UVW- of the high-integration intelligent power module; the emitter of the IGBT tube T6 is connected with the anode of the FRD tube T6, and serves as a three-phase low-voltage reference foot UVW- of the high-integration intelligent power module; the collector of the IGBT tube T1, the cathode of the FRD tube D1, the collector of the IGBT tube T2, the cathode of the FRD tube D2, the collector of the IGBT tube T3, and the cathode of the FRD tube D3 are connected, and serve as a high-voltage input end P of the high-integration intelligent power module, which is generally connected with 300V. The HVIC tube IC1 functions to transmit the 0-5V logic signals of the input ends HIN1, HIN2, HIN3 and LIN1, FLIN2, FLIN3 to the output ends FHO1, FHO2, FHO3 and FLO1, FLO2, FLO3 respectively, wherein FHO1, FHO2, FHO3 are VS-VS+15V logic signals, and FLO1, FLO2, FLO3 are 0-15V logic signals. The current output by UVW- is detected by ITRIP to realize overcurrent protection.

[0070] In the above embodiment, an RC filter circuit is further arranged between each input end of the compressor IPM module 10 and the MCU, and each RC filter circuit is provided with a capacitor R1 and a resistor R3. A current-limiting resistor and a pull-up resistor are further arranged between the temperature feedback foot TH of the compressor IPM module 10 and the MCU. A current-limiting resistor and a pull-up resistor are also arranged between the fault feedback foot and the MCU. A filter capacitor is arranged between the power supply end and the ground end of the compressor driving chip IC1 to filter out electromagnetic interference between the external power supply and the power supply end of the compressor driving chip IC1.

[0071] In the embodiment, the power switch tubes in the fan inverter power module 21 all adopt IGBT, and the fan driving chip IC2 adopts FHVIC chip as an example for description. The VCC end of the fan HVIC tube IC2 is used as the low-voltage area power supply positive end FVDD of the high-integration intelligent power module, and the FVDD is generally 15V; the HIN1 end of the HVIC tube IC2 is used as the U-phase upper bridge arm input end FHIN1 of the high-integration intelligent power module; the HIN2 end of the fan HVIC tube IC2 is used as the V-phase upper bridge arm input end VFHIN of the high-integration intelligent power module; the HIN3 end of the fan HVIC tube IC2 is used as the W-phase upper bridge arm input end HIN2 of the high-integration intelligent power module; the LIN1 end of the fan HVIC tube IC2 is used as the U-phase lower bridge arm input end FLIN1 of the high-integration intelligent power module; the LIN2 end of the fan HVIC tube IC2 is used as the V-phase lower bridge arm input end FLIN2 of the high-integration intelligent power module; the LIN3 end of the fan HVIC tube IC2 is used as the W-phase lower bridge arm input end FLIN3 of the high-integration intelligent power module; here, the six-way input of the U, V and W three-phase of the high-integration intelligent power module receives 0-5V input signal; the GND end of the fan HVIC tube IC2 is used as the low-voltage area power supply negative end VSS2 of the high-integration intelligent power module, wherein the VSS2 pin is at the logic end and adjacent to the FVDD and other low-voltage pins, and the VSS3 pin is at the high-voltage side and adjacent to the UVW- and ITRIP pins; the ITRIP end of the fan HVIC tube IC2 is used as the over-current protection detection end FITRIP of the high-integration intelligent power module; the VB1 end of the HVIC tube IC1 is used as the U-phase high-voltage area power supply positive end UVB of the high-integration intelligent power module; the HO1 end of the HVIC2 is connected with the gate of the U-phase upper bridge arm IGBT tube FT1; the VS1 end of the HVIC2 is connected with the anode of the IGBT tube FT1, the anode of the FRD tube D1, the collector of the U-phase lower bridge arm IGBT tube FT4 and the cathode of the FRD tube FT4, and is used as the U-phase high-voltage area power supply negative end UVS of the high-integration intelligent power module; the VB2 end of the fan HVIC tube IC2 is used as the U-phase high-voltage area power supply positive end VVB of the high-integration intelligent power module; the HO3 end of the fan HVIC tube IC2 is connected with the gate of the V-phase upper bridge arm IGBT tube FT3; the VS2 end of the HVIC2 is connected with the anode of the IGBT tube FT2, the anode of the FRD tube, the collector of the V-phase lower bridge arm IGBT tube FT5 and the cathode of the FRD tube, and is used as the W-phase high-voltage area power supply negative end VVS of the high-integration intelligent power module; the VB3 end of the fan HVIC tube IC2 is used as the W-phase high-voltage area power supply positive end WVB of the high-integration intelligent power module; the HO3 end of the fan HVIC tube IC2 is connected with the gate of the W-phase upper bridge arm IGBT tube FT3.The VS3 end of the fan HVIC tube IC2 is connected with the emitter of the IGBT tube FT3, the anode of the FRD tube, the collector of the W-phase lower bridge arm IGBT tube FT6, and the cathode of the FRD tube FT6, and serves as a W-phase high-voltage area power supply negative terminal WVS of the high-integration intelligent power module. The LO1 end of the fan HVIC tube IC2 is connected with the gate of the IGBT tube FT4. The LO2 end of the fan HVIC tube IC2 is connected with the gate of the IGBT tube FT5. The LO3 end of the fan HVIC tube IC2 is connected with the gate of the IGBT tube FT6. The emitter of the IGBT tube FT4 is connected with the anode of the FRD tube FT4, and serves as a three-phase low-voltage reference foot UVW- of the high-integration intelligent power module. The emitter of the IGBT tube FT5 is connected with the anode of the FRD tube, and serves as a three-phase low-voltage reference foot UVW- of the high-integration intelligent power module. The emitter of the IGBT tube FT6 is connected with the anode of the FRD tube FT6, and serves as a three-phase low-voltage reference foot UVW- of the high-integration intelligent power module. The collector of the IGBT tube FT1, the cathode of the FRD tube, the collector of the IGBT tube FT2, the cathode of the FRD tube, the collector of the IGBT tube FT3, and the cathode of the FRD tube are connected, and serve as a high-voltage input terminal P of the high-integration intelligent power module, which is generally connected with 300V. The fan HVIC tube IC2 functions to transmit 0-5V logic signals of input terminals FHIN1, FHIN2, FHIN3 and FLIN1, FLIN2, FLIN3 to output terminals HO1, HO2, HO3 and LO1, LO2, LO3 respectively, wherein HO1, HO2, HO3 are VS-VS+15V logic signals, and LO1, LO2, LO3 are 0-15V logic signals. The current output by UVW- is detected by ITRIP to realize overcurrent protection.

[0072] In the above embodiment, an RC filter circuit is further arranged between each input terminal of the fan IPM module 20 and the MCU, and each RC filter circuit is provided with a capacitor R1 and a resistor R3. A current-limiting resistor and a pull-up resistor are further arranged between the temperature feedback foot TH of the fan IPM module 20 and the MCU. A current-limiting resistor and a pull-up resistor are also arranged between the fault feedback foot and the MCU. A filter capacitor is arranged between the power supply end and the ground end of the fan drive chip IC2 to filter electromagnetic interference between the external power supply and the power supply end of the fan drive chip IC2. A filter capacitor is arranged between the power supply end and the ground end of the fan drive chip IC2 to filter electromagnetic interference between the external power supply and the power supply end of the fan drive chip IC2.

[0073] The pin of the high-integration intelligent power module can be realized by gull wing pin or straight pin, and the embodiment is preferably the straight pin. The pin corresponds to the pad position on the mounting position, and is electrically connected with the compressor driving chip IC1 and the fan driving chip IC2 through the metal wire.

[0074] With reference to Figure 2 Or Figure 3It should be noted that, in order to avoid damage to the motor and the high-integration intelligent power module when the motor overflows, an overcurrent protection function is integrated in the high-integration intelligent power module. Specifically, a compressor overcurrent detection pin (ITRIP) and a fan overcurrent detection pin FITRIP are respectively arranged on the mounting substrate of the high-integration intelligent power module for the compressor and the fan, so as to detect the voltage drop on the external current detection resistor 201. When the voltage drop exceeds a certain threshold, the level on the compressor overcurrent detection pin and the fan overcurrent detection pin FITRIP is reversed, for example, from high level to low level, or from low level to high level, so as to trigger the protection function of the internal IC of the IPM, and the module stops working, thereby playing a protection role. In addition, when the high-integration intelligent power module is applied to electric appliances such as air conditioners, refrigerators, washing machines, or applied to frequency converters, the high-integration intelligent power module and the external sampling resistor are mounted on the electric control board (such as a PCB board). Considering the application environment of microelectronics, the area of the mounting substrate should not be set too large, that is, the compressor IPM module 10 and the fan IPM module 20 are arranged on the mounting substrate within a limited area. It is necessary to consider the signal interference between the compressor IPM module 10 and the fan IPM module 20, the avoidance between circuit wiring, the strong and weak electric isolation between the drive IC in the compressor IPM module 10 and the fan IPM module 20 and the power switch tube in the inverter module, and the isolation between the heat source of the high-power device and the non-heat source such as the drive IC. Therefore, in the wiring of the electric control board PCB, single-point grounding is required as much as possible, especially the strong electric ground (the lower bridge IGBT emitter output) and the weak electric ground (the VSS or COM pin of the IPM, and the ground end of the MCU) should be connected through a single point, which is usually a grounding point arranged on the electric control board. In actual wiring, the line will introduce parasitic inductance, which will have a great influence on detection in current detection. However, the lower bridge emitter pin of the compressor IPM and the fan IPM module 20 is generally arranged together with the high-voltage pin, so that the wiring of high-voltage and high-current is shorter; the compressor current detection pin ITRIP and the logic ground pin are generally arranged together with other low-voltage logic pins, so as to shorten the distance between other logic pins and the logic ground. In addition, the lower bridge emitter pins between the compressor IPM and the fan IPM module 20 are usually arranged far apart, and no grounding pin is usually arranged on the high-voltage side. Therefore, the arrangement of pins of the high-integration intelligent power module and the wiring on the electric control board PCB will increase the wiring and wiring distance between the high-integration intelligent power module and external devices, which is easy to increase parasitic inductance, resulting in inaccurate overcurrent protection or the logic ground being easily affected by the high-voltage ground.

[0075] To this end, the compressor low voltage reference foot UVW-UVW-, the fan low voltage reference foot FUVW-UVW-, the compressor current detection foot ITRIP, the fan current detection foot FITRIP and the single-point grounding foot VSS3 are arranged on the strong current foot mounting side, the compressor current detection foot ITRIP is electrically connected with the current feedback end of the compressor drive chip IC1 through the wiring and binding on the internal circuit wiring layer of the high-integration intelligent power module. And two grounding ends VSS are arranged on the compressor drive chip IC1, and the single-point grounding foot on the strong current side is electrically connected with the weak current grounding foot VSS1 on the weak current side through the internal circuit wiring layer of the compressor drive chip IC1. In this way, the single-point grounding foot VSS3 can be electrically connected with the low voltage power supply of the compressor drive chip IC1 through the wiring and binding on the internal circuit wiring layer of the high-integration intelligent power module. When the external power supply supplies power to the compressor drive chip IC1, the single-point grounding foot VSS3 can be electrically connected with the low voltage power supply 302 arranged on the weak current foot mounting side. When the compressor low voltage reference foot UVW-UVW- is electrically connected with the high voltage power supply 301 of the external power supply through the external current detection resistor 201, the single-point grounding foot VSS3 can also be electrically connected with the external current detection resistor 201. Similarly, the fan current detection foot FITRIP is electrically connected with the current feedback end of the fan drive chip IC2 IC1 through the wiring and binding on the internal circuit wiring layer of the high-integration intelligent power module. And two grounding ends VSS are arranged on the fan drive chip IC2, and the single-point grounding foot on the strong current side is electrically connected with the weak current grounding foot VSS2 on the weak current side through the internal circuit wiring layer of the fan drive chip IC2. In this way, the single-point grounding foot VSS3 can be electrically connected with the low voltage power supply of the fan drive chip IC2 through the wiring and binding on the internal circuit wiring layer of the high-integration intelligent power module. When the external power supply supplies power to the fan drive chip IC2, the single-point grounding foot VSS3 can be electrically connected with the low voltage power supply 302 arranged on the weak current foot mounting side. When the fan low voltage reference foot FUVW-UVW- is electrically connected with the high voltage power supply 301 of the external power supply through the external current detection resistor 201, the single-point grounding foot VSS3 can also be electrically connected with the external current detection resistor 201. That is, the strong current ground (the emitter output of the lower bridge IGBT) and the weak current ground (the COM foot) of the external power supply are single-point grounded on the single-point grounding foot VSS3 of the high-integration intelligent power module, and there is no need to separately arrange a single-point grounding point on the electric control board, so that the wiring distance between the strong current ground and the weak current ground can be shortened.And, when the electric control board PCB wiring is carried out, the external current detection resistance 201 is arranged in the periphery of the high-integration intelligent power module high-voltage pin mounting side, and the compressor current detection pin ITRIP is also arranged in the high-voltage pin mounting side, so that the wiring distance between the compressor current detection pin ITRIP, the fan current detection pin FITRIP and the external current detection resistance 201 can be shortened, thereby reducing the parasitic inductance on the wiring, and the problem of the high-integration intelligent power module false triggering can be solved due to the reduction of the parasitic inductance.

[0076] It can be understood that the drive current of the compressor inverter power module 11 flows from the drive end of the compressor drive chip IC1 to the compressor low-voltage reference pin UVW-, and then reaches the single-point grounding pin VSS3 outside the intelligent power module from the compressor low-voltage reference pin UVW-, and then returns to the gate from the single-point grounding pin of the high-voltage side of the compressor drive chip IC1, thereby forming a drive loop. Similarly, the drive current of the fan inverter power module 21 flows from the drive end of the fan drive chip IC2 to the fan low-voltage reference pin FUVW-, and then reaches the single-point grounding pin VSS3 outside the intelligent power module from the fan low-voltage reference pin FUVW-, and then returns to the gate from the single-point grounding pin of the high-voltage side of the fan drive chip IC2, thereby forming a drive loop. In this way, the distance between the two is small on the high-voltage pin mounting side, and the current loop can be shortened.

[0077] The application can also shorten the wiring of the drive current loop, thereby reducing the parasitic inductance on the wiring, improving the switching speed of the switching tube in the power module 20, and solving the problem of the intelligent power module false triggering due to the reduction of the parasitic inductance. In addition, in the embodiment, the grounding end of the power module 20 on the high-voltage mounting side does not need to pass through external wiring, but is directly arranged inside the high-integration intelligent power module (specifically, the compressor drive chip IC1 can be connected with the compressor low-voltage grounding pin VSS1 on the low-voltage mounting side, or the fan drive chip IC2 can be connected with the fan low-voltage grounding pin VSS2 on the low-voltage mounting side), and the wiring safety requirement does not need to be considered, so that the wiring of the intelligent power module peripheral electric control can be facilitated, thereby reducing the wiring difficulty of the electric appliance control board.

[0078] Referring to Figure 2 Or Figure 3 In an embodiment, the compressor low-voltage reference pin UVW-, the compressor current detection pin ITRIP, the single-point grounding pin VSS3, the fan low-voltage reference pin FUVW- and the fan current detection pin FITRIP are arranged adjacent to each other on the high-voltage pin mounting side.

[0079] It should be noted that, referring to Figure 4, the lines Ls1~Ls4 represent equivalent parasitic inductance in the lines, when the connection between the compressor current detection pin ITRIP and the external compressor current detection resistor 201 and the compressor low voltage reference pin UVW-(lower bridge emitter pin) is connected at point A (close to the lower bridge emitter pin), the voltage of the compressor current detection pin ITRIP will be affected by Ls1 above the wiring resistance. Similarly, when the connection between the fan current detection pin FITRIP and the external fan current detection resistor 201 and the fan low voltage reference pin FUVW-(lower bridge emitter pin) is connected at point A (close to the lower bridge emitter pin), the voltage of the fan current detection pin FITRIP will be affected by Ls1 above the wiring resistance. The resistance of the above wiring makes the jump level drop, because it is equivalent to adding a series resistance to the shunt resistance (current detection resistor 201). Ls1 will generate a voltage spike when reverse recovery current flows, which is easy to cause false triggering, so the connection point needs to be set at point B in the figure, that is, close to the external current detection resistor 201, at this time Ls1 is equivalent to a filter with a large time constant, which can filter out the voltage spike, and the wiring of the compressor current detection pin ITRIP minimizes the noise effect of Ls1. Therefore, in the embodiment, the compressor lower bridge emitter pin (UVW-), the compressor current detection pin ITRIP (Itrip or ITRIP), the fan low voltage reference pin FUVW-, the fan current detection pin FITRIP, and the single-point ground pin VSS3 are arranged as close as possible, so that the wiring distance on the external control wiring of the IPM can be minimized, that is, when the external control wiring is performed, the wiring distance from the compressor lower bridge emitter pin UVW-(fan lower bridge emitter pin FUVW-) to the sampling resistor, from the external sampling resistor to the compressor current detection pin ITRIP (fan current detection pin FITRIP), from the compressor current detection pin ITRIP (fan current detection pin FITRIP) to the ground, and from the external current detection resistor 201 to the ground is minimized. Ls2~Ls4 are minimized to reduce the influence of parasitic inductance on current detection and ensure that current detection is not disturbed to obtain reliable current protection and measurement performance. At the same time, by reducing the single-point ground, the compressor low voltage reference pin UVW-, the compressor current detection pin ITRIP, and the fan low voltage reference pin FUVW-, the fan current detection pin FITRIP are arranged as close as possible, so that the internal wiring distance can also be reduced. Since the low voltage reference pin UVW-, the compressor current detection pin ITRIP, and the single-point ground pin VSS3 are adjacent, the wiring distance from the low voltage reference pin UVW- to the external current detection resistor 201, from the external current detection resistor 201 to the compressor current detection pin ITRIP, from the compressor current detection pin ITRIP to the single-point ground pin VSS3, and from the external current detection resistor 201 to the single-point ground pin can be minimized, the influence of parasitic inductance can be reduced, and current detection can be ensured not to be disturbed.

[0080] Referring to Figure 2 Or Figure 3 In an embodiment, the low-voltage pin mounting side is provided with a first low-voltage power supply positive pin VDD, a second low-voltage power supply positive pin FVDD, a first low-voltage power supply negative pin VSS1, and a second low-voltage power supply negative pin VSS2.

[0081] The power supply end of the compressor driving chip IC1 is electrically connected to the first low-voltage power supply positive pin VDD.

[0082] The power supply end of the fan driving chip IC2 is electrically connected to the second low-voltage power supply positive pin FVDD.

[0083] The ground end of the compressor driving chip IC1 is electrically connected to the first low-voltage power supply negative pin VSS1.

[0084] The ground end of the fan driving chip IC2 is electrically connected to the second low-voltage power supply negative pin VSS2.

[0085] It can be understood that the driving voltages of the two driving chips can be the same or different. In the embodiment, two groups of low-voltage power supply positive pins and low-voltage power supply negative pins are provided on the low-voltage pin mounting side, that is, the compressor driving chip IC1 and the fan driving chip IC2 are respectively connected to different power supply pins and the same low-voltage ground pin. In this way, the distance between the two driving chips and the low-voltage power supply positive pin and the low-voltage power supply negative pin can be shortened, the lead length can be shortened, and the complexity of external circuit wiring can be reduced. By connecting the low-voltage power supply through two low-voltage ground pins, the low-voltage power supply and the high-voltage power supply are single-point grounded, which can reduce the complexity of circuit wiring of the high-integration intelligent power module,

[0086] Further, in the above embodiment, the single-point ground pin VSS3 is connected to the ground end of the compressor driving chip IC1 and the fan driving chip IC2.

[0087] In the embodiment, the single-point grounding pin VSS3 and the first low-voltage power supply negative terminal pin (compressor weak current grounding pin) VSS1 are connected with the grounding end of the compressor driving chip IC1, and the single-point grounding pin VSS3 and the second low-voltage power supply negative terminal pin (fan weak current grounding pin) VSS2 can be electrically connected through the fan driving chip IC2. The common point for realizing single-point grounding is arranged on the high-integration intelligent power module, the high-voltage side ground passes through the single-point grounding pin VSS3, passes through the inside of the module (which can be the inside of the driving chip specifically) to the low-voltage side ground compressor weak current grounding pin VSS1 and fan weak current grounding pin VSS2, to form convenient single-point grounding and reduce the length of the ground wire. In this way, the wiring between the strong current ground and the weak current ground for realizing single-point grounding can be shortened, and the grounding end of the strong current installation side and the compressor weak current grounding pin VSS1 and the fan weak current grounding pin VSS2 of the weak current installation side can be electrically connected on the high-integration intelligent power module, so that there is no need to set a grounding point on the electric control board for connection, and there is no need to consider the wiring safety requirement, which can facilitate the wiring of the peripheral electric control of the high-integration intelligent power module, thereby reducing the wiring difficulty of the electric control board of the electric appliance and being beneficial to improving the reliability of the high-integration intelligent power module. The application solves the problem of easy false triggering of the overcurrent protection of the high-integration intelligent power module, which leads to poor reliability of the high-integration intelligent power module.

[0088] Referring to Figure 2 Or Figure 3 In an embodiment, the high-integration intelligent power module further comprises:

[0089] The PFC inductance connection end PFC+ is connected with one end of an external inductance.

[0090] The bus capacitor connection end P is connected with an external bus capacitor.

[0091] The PFC power module 30 comprises a PFC power switch tube and a PFC diode, the input end of the PFC power switch tube is interconnected with the PFC inductance connection end and the anode of the PFC diode, the output end of the PFC power switch tube is connected with the PFC inductance connection negative end, and the cathode of the PFC diode is connected with the bus capacitor connection end.

[0092] In the embodiment, one end of the external inductor is connected with the positive output end DC+ of the rectifier bridge 10, and the other end of the external inductor is connected with the negative output end DC- of the rectifier bridge 10 through the PFC power switch tube T7. The external inductor, the bus capacitor, the rectifier bridge 10, the PFC diode D8 and the PFC power switch tube T7 form a complete PFC circuit. The PFC circuit can be a boost PFC circuit, or a buck PFC circuit, or a buck-boost PFC circuit. The embodiment can be a boost PFC circuit, that is, the PFC diode D8 is a boost diode. In the PFC power switch module 30, only the PFC power switch tube T7 and the PFC diode D8 can be integrated in the intelligent power module, or the PFC circuit composed of the bus capacitor, the inductor and other components can be integrated in the intelligent power module. The embodiment is not integrated in the intelligent power module due to factors such as size. The PFC circuit adjusts the power factor of the direct current, and outputs the adjusted direct current to the power input end of the inverter bridge circuit 10, so as to drive the corresponding load to work. The adjusted direct current can also generate a working voltage of 5V and the like for driving a chip, so as to provide a working voltage for the circuit module of the main controller.

[0093] In the working process of the PFC power module 30, there are two working processes of boosting and energy storage. When boosting, the PFC power switch tube T7 is cut off, the external inductor outputs the electrical energy output by the rectifier bridge 10 and the stored electrical energy to the compressor inverter power module 11 and the fan inverter power module 21 through the PFC diode D8, releases the electrical energy, charges the bus capacitor, and realizes boosting. When the PFC power switch tube T7 is turned on, the external inductor is connected with the negative output end of the rectifier bridge 10 through the PFC power switch tube T7, and energy storage is performed.

[0094] In the above embodiment, the PFC power switch tube T7 is arranged close to the rectifier bridge 10, and the PFC diode D8 is arranged close to the IPM module 30. In this way, the length of the lead line between the PFC power switch tube T7 and the rectifier bridge 10 can be shortened, and the length of the lead line between the PFC diode D8 and the compressor inverter power module 11 can be shortened. At the same time, the electromagnetic interference of the PFC power switch tube T7 on the compressor inverter power module 11 can also be avoided.

[0095] Referring to Figure 2 Or Figure 3 In an embodiment, the output end of the PFC power switch tube is electrically connected with the single-point grounding pin VSS3.

[0096] And / or, the output end of the PFC power switch tube is electrically connected with the grounding end of the compressor drive chip IC1.

[0097] In the embodiment, the output terminal pin of the PFC power switch tube, i.e., the emitter of the PFC IGBT (T7) is arranged at the strong electric pin mounting side. The output terminal of the PFC power switch tube can be electrically connected with the single-point grounding pin VSS3 through internal wiring. The output terminal of the PFC power switch tube can also be directly electrically connected with the grounding terminal VSS1 of the compressor driving chip IC1 through internal wiring. The wiring distance between the PFC power switch tube and the weak electric grounding pin of the compressor driving chip IC1 can be shortened, thereby reducing the parasitic inductance on the wiring. Due to the reduction of the parasitic inductance, the problem of false triggering of the high-integration intelligent power module can be solved. At the same time, the driving loop of the driving circuit from the HVIC to the IGBT gate to the emitter to the HVIC ground terminal can be the shortest, thereby improving the switching speed of the PFC power switch tube.

[0098] With reference to Figure 2 Or Figure 3 In an embodiment, the high-integration intelligent power module further comprises:

[0099] The rectifier bridge 40 has an output terminal connected to the PFC inductor.

[0100] In the embodiment, the rectifier bridge 40 comprises a first diode D9, a second diode D10, a third diode D11 and a fourth diode D12. The first diode D9 and the second diode D10 are arranged on one sub-mounting position. The third diode D11 and the fourth diode D12 are arranged on two different mounting positions. The anode of the first diode D9 is electrically connected with the cathode of the third diode D11. The cathode of the first diode D9 is electrically connected with the cathode of the second diode D10. The anode of the second diode D10 is electrically connected with the cathode of the fourth diode D12. In the embodiment, the first diode D9 and the second diode D10 are two diodes with common cathodes. The third diode D12 and the fourth diode D12 are two diodes with common anodes. The two diodes with common anodes are arranged on one sub-mounting position and are electrically connected through the mounting position. The two diodes with common cathodes are respectively arranged on two different sub-mounting positions and are electrically connected through another mounting position. In this way, the number of mounting positions can be reduced, thereby reducing the area of the rectifier bridge 40 arranged on the mounting substrate 100, making the high-integration intelligent power module compact and reducing the overall area. At the same time, the steps of wiring and soldering can also be reduced.

[0101] It can be understood that when the intelligent power module is applied to a refrigeration device such as an air conditioner, a refrigerator or the like, the IPM module 30 can be used to drive components such as a fan, a compressor and the like to work, that is, the rectifier bridge 40, the compressor IPM module 10 and the PFC power module 30 are integrated into one body in the embodiment to form a three-in-one compressor intelligent power module. Alternatively, the rectifier bridge 40, the fan IPM module 20 and the PFC power module 30 are integrated into one body to form a three-in-one fan intelligent power module. Of course, in other embodiments, the rectifier bridge 40, the PFC power module 30, the compressor IPM module 10 and the fan IPM module 20 can be integrated into one body to form a four-in-one high-integration intelligent power module. A surge current protection circuit is further arranged between the output end of the rectifier bridge 40 and the PFC power module 30 to absorb the surge current between the output of the rectifier bridge 40 to the PFC power module 30, so as to avoid damaging the PFC diode in the PFC power module 30.

[0102] It should be noted that as a kind of microelectronic device, considering the application environment of microelectronic, the area of mounting substrate should not be set too large, that is, in the limited area, the compressor IPM module 10 and the fan IPM module 20 are arranged on the mounting substrate, the circuit wiring is numerous, the signal interference between the compressor IPM module 10 and the fan IPM module 20 needs to be considered, the avoidance between the circuit wiring, the strong and weak electric isolation between the driving IC in the compressor IPM module 10 and the power switch tube in the inverter module, and the isolation between the heat source of the high-power device and the non-heat source such as driving IC. Therefore, when manufacturing the high-integration intelligent power module, the size of the high-integration intelligent power module needs to be considered, the isolation between the strong and weak electricity between the devices, the isolation between the heat source and the non-heat source, and the line distance and line width between the lines need to meet the safety specification requirements. Because the lines are dense, and there is a long distance between the devices and the pins, the lines will necessarily have more turns to avoid other parts, further increasing the distance, and it is easy to form parasitic inductance on the lead wire, and it is easy to form parasitic capacitance between the dense lines.

[0103] The compressor driving chip IC1 and the fan driving chip IC2 in the intelligent power module mostly use single power supply, the low-voltage side directly uses DC power supply, and the high-voltage side is in a floating state, so the high-voltage side driving circuit is mostly powered by a floating power supply, and the commonly used floating power supply has two modes of bootstrap capacitor type power supply and charge pump type power supply. The bootstrap capacitor type is powered by a bootstrap circuit composed of diodes, resistors and capacitors and the like to improve the utilization rate of the power supply.

[0104] For example, when the lower bridge arm power tube of the half-bridge structure in the power inversion module is turned on, the upper bridge arm power tube is turned off, the high-side floating power supply decreases with the decrease of the high-side floating ground voltage, when the high-side floating power supply decreases below the DC power supply voltage and the pressure difference between the two exceeds the conduction pressure drop of the bootstrap diode, the DC power supply charges the bootstrap capacitor through the bootstrap diode. When the upper bridge arm power tube is turned on and the lower bridge arm power tube is turned off, the high-side floating power supply increases with the increase of the high-side floating ground voltage, the high-side floating power supply voltage far exceeds the DC power supply voltage, the bootstrap diode is cut off, and the bootstrap capacitor supplies power to the high-voltage side circuit. The bootstrap floating power supply pin VB is used to supply power to the upper bridge IGBT gate, and if it is disturbed, it is easy to cause IGBT false triggering, and in severe cases, it will burn out the high-integration intelligent power module. Moreover, in the high-integration intelligent power module, due to the increase of power density and the increase of circuit wiring, electromagnetic interference is intensified, and VB is particularly susceptible to interference.

[0105] To this end, at least one filter capacitor is placed between the three-phase compressor floating power supply pins and the three-phase compressor output pins of the compressor inverter power module 11 to filter out the interference introduced from the peripheral circuit through the respective phase compressor floating power supply pins, so as to avoid the interference affecting the potential of the respective phase compressor floating power supply pins to the respective phase compressor output pins. The filter capacitor can also filter out the electromagnetic interference generated by the internal lead of the high-integration intelligent power module to avoid the electromagnetic interference coupling between adjacent wires to the phase compressor floating power supply pins affecting the potential of the respective phase compressor floating power supply pins to the respective phase compressor output pins.

[0106] Referring to Figure 2 or Figure 3 In order to further improve the filtering capacity, in the above embodiment, the number of filter capacitors connected in series between the compressor floating power supply pins and the compressor output pins of each phase is two, the two filter capacitors are respectively a first filter capacitor and a second filter capacitor, and the first filter capacitor C1, C2, C3 and the second filter capacitor C4, C5, C6 are connected in parallel.

[0107] Among them, the first filter capacitor C1, C2, C3 is arranged close to the fan floating power supply pin and the fan output pin on the mounting substrate;

[0108] In the embodiment, one of the two filter capacitors connected in series between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pins U, V, W of each phase is arranged close to the fan floating power supply pin VB1, VB2, VB3 and the fan output pin U, V, W, and the other of the two filter capacitors connected in series between the compressor floating power supply pins VB1, VB2, VB3 and the compressor output pins U, V, W of each phase is arranged close to the compressor drive chip IC1.

[0109] The first filter capacitor is placed close to the pin, and the distance between the compressor floating power supply pin and the compressor output pin is less than 5 mm; the second filter capacitor is placed close to the compressor driving chip IC1, and the distance between the second filter capacitor and the compressor driving chip IC1 is less than 10 mm. The filter capacitor placed close to the pin is used to filter the interference from the peripheral circuit, so as to avoid the interference affecting the potential of the compressor floating power supply pin to the compressor output pin, or affecting the adjacent wiring; since there is a long wiring distance from the compressor floating power supply pin and the compressor output pin to the compressor driving chip IC1, the wiring is likely to be affected by the electromagnetic interference of the surrounding wiring, resulting in unstable voltage, and therefore the filter capacitor placed close to the compressor driving chip IC1 is used to filter the interference, so as to ensure that the compressor driving chip IC1 can work normally. The second filter capacitors C4, C5 and C6 are arranged close to the compressor driving chip IC1 on the mounting substrate. Specifically, the filter capacitors C1 and C4 are arranged in series between the U-phase compressor floating power supply pin VB1 and the U-phase compressor output pin U, the first filter capacitor C1 is arranged close to the U-phase compressor floating power supply pin VB1 and the U-phase compressor output pin, and the second filter capacitor C4 is arranged close to the compressor driving chip IC1; the filter capacitors C2 and C5 are arranged in series between the V-phase compressor floating power supply pin VB1 and the V-phase compressor output pin V, the second filter capacitor C2 is arranged close to the V-phase compressor floating power supply pin VB2 and the V-phase compressor output pin, and the second filter capacitor C5 is arranged close to the compressor driving chip IC1; the filter capacitors C3 and C6 are arranged in series between the W-phase compressor floating power supply pin VB3 and the W-phase compressor output pin V, the first filter capacitor C3 is arranged close to the W-phase compressor floating power supply pin VB3 and the W-phase compressor output pin, and the second filter capacitor C4 is arranged close to the compressor driving chip IC1.

[0110] Referring to Figure 2 Or Figure 3 In an embodiment, the filter capacitors CF1, CF2 and CF3 arranged in series between the floating power supply pins FVB1, FVB2 and FVB3 and the output pins FU, FV and FW of each phase are arranged close to the floating power supply pins FVB1, FVB2 and FVB3 and the output pins U, FV and FW; and / or, arranged close to the fan driving chip IC2. That is, the filter capacitor CF1 is arranged in series between the U-phase floating power supply pin FVB1 and the U-phase output pin U; the filter capacitor CF2 is arranged in series between the V-phase floating power supply pin FVB2 and the V-phase output pin U; and the filter capacitor CF3 is arranged in series between the W-phase floating power supply pin FVB3 and the W-phase output pin W.

[0111] In this embodiment, it can be understood that the power of the compressor motor is greater than that of the fan motor, so when driving the compressor and the fan to work, the power of the power device in the compressor IPM module 10 is greater than that of the power device in the fan IPM module 20, and compared with the compressor inverter power module 11, the drive current of the fan inverter power module 21 is also smaller, that is, the working current is smaller, so the interference generated is relatively small, so only one set of filter capacitors can be provided. The set of filter capacitors can be arranged beside the pin to filter out the interference from the peripheral circuit transmitted from the pin, so as to avoid the interference affecting the potential of the fan output pin of the fan floating power supply pin or the adjacent wiring; since there is a long wiring distance from the fan floating power supply pin and the fan output pin to the fan drive chip IC2, the wiring may be affected by the electromagnetic interference of the surrounding wiring, resulting in unstable voltage, and the filter capacitor can also be arranged on the fan drive chip IC2 to filter out the interference and ensure that the compressor drive chip IC1 works normally.

[0112] The application further provides an electric control assembly, which comprises a low-voltage power supply (not shown in the figure), a high-voltage power supply (not shown in the figure), a compressor current detection resistor SR1, a fan current detection resistor SR2 and the high-integration intelligent power module as described above, wherein,

[0113] One end of the compressor current detection resistor SR1 is connected with the compressor low-voltage reference pin and the compressor current detection pin of the high-integration intelligent power module, and the other end of the compressor current detection resistor SR1 is connected with the single-point grounding pin of the high-integration intelligent power module;

[0114] The compressor low-voltage reference pin is further connected with the negative end of the high-voltage power supply through the compressor current detection resistor SR1;

[0115] One end of the fan current detection resistor SR2 is connected with the fan low-voltage reference pin and the fan current detection pin of the high-integration intelligent power module, and the other end of the fan current detection resistor SR2 is connected with the single-point grounding pin of the high-integration intelligent power module;

[0116] The fan low-voltage reference pin is further connected with the negative end of the high-voltage power supply through the fan current detection resistor SR2.

[0117] In the embodiment, the compressor current detection resistor SR1 is connected in series between the compressor low voltage reference foot UVW- and the single-point grounding pin VSS3, can detect the current flowing through the three-phase lower bridge arm switch tube of the compressor, and convert the current into a voltage signal, thereby realizing current detection of the motor. The fan current detection resistor SR2 is connected in series between the fan low voltage reference foot UVW- and the single-point grounding pin VSS3, can detect the current flowing through the three-phase lower bridge arm switch tube of the compressor, and convert the current into a voltage signal, thereby realizing current detection of the motor.

[0118] Referring to Figure 2 or Figure 3 In some embodiments, the electric control assembly further comprises:

[0119] The electric control board (not shown in the figure) is provided with a circuit wiring layer, the current detection resistor 201 and the high-integration intelligent power module are mounted on the electric control board, and the current detection resistor 201 and the high-integration intelligent power module are electrically connected through corresponding lead wires on the circuit wiring layer.

[0120] In the embodiment, the rectifier bridge stack, the PFC circuit, the direct current bus capacitor and the pad of the high-integration intelligent power module can be formed on the electric control board, and the rectifier bridge stack, the PFC circuit, the direct current bus capacitor and the high-integration intelligent power module are electrically connected through the lead wires on the circuit wiring layer. Among them, the current detection resistor 201 is arranged on the same side as the high-integration intelligent power module high-voltage pin mounting side, so that when the low voltage reference foot UVW- is connected with the single-point grounding foot through the external current detection resistor 201 in the high-integration intelligent power module, the distance between them can be shortened, and the compressor current detection foot ITRIP is also arranged on the high-voltage pin mounting side, so that the distance between the low voltage reference foot UVW- and the compressor current detection foot ITRIP can be shortened.

[0121] The application further provides an air conditioner comprising the high-integration intelligent power module.

[0122] The detailed structure of the high-integration intelligent power module can refer to the above-mentioned embodiments, which will not be described here again. It can be understood that, since the above-mentioned high-integration intelligent power module is used in the air conditioner of the application, the embodiments of the air conditioner of the application include all the technical solutions of all the embodiments of the above-mentioned high-integration intelligent power module, and the technical effects achieved are also completely the same, which will not be described here again.

[0123] The above-mentioned is only the optional embodiment of the application, and does not limit the patent scope of the application, and any equivalent structural transformation made according to the content of the specification and the drawings of the application, or direct / indirect application in other related technical fields under the inventive concept of the application is included in the patent protection scope of the application.

Claims

1. A highly integrated intelligent power module, characterized in that, The highly integrated intelligent power module includes: The mounting substrate has a high-voltage pin mounting side and a low-voltage pin mounting side arranged opposite to each other on both sides along the length direction of the mounting substrate; the surface of the mounting substrate is provided with a plurality of mounting positions. The compressor IPM module and the fan IPM module are respectively installed in the corresponding mounting positions, and, The compressor low-voltage reference pin, compressor current detection pin, fan low-voltage reference pin, fan current detection pin, and single-point grounding pin are located on the mounting side of the high-voltage pins; wherein... The compressor low-voltage reference pin is connected to the output terminal of the compressor IPM module. The compressor low-voltage reference pin is also used to connect to the single-point grounding pin via an external compressor current detection resistor. The compressor current detection pin is electrically connected to the compressor low-voltage reference pin. The low-voltage reference pin of the fan is connected to the output terminal of the fan IPM module. The low-voltage reference pin of the fan is also used to connect to the single-point grounding pin through an external fan current detection resistor. The fan current detection pin is electrically connected to the low-voltage reference pin of the fan. The mounting substrate is a single-sided wiring board.

2. The highly integrated intelligent power module as described in claim 1, characterized in that, The compressor low voltage reference pin, compressor current detection pin, single-point grounding pin, and fan low voltage reference pin and fan current detection pin are arranged adjacent to each other on the high-voltage pin mounting side.

3. The highly integrated intelligent power module as described in claim 1, characterized in that, The compressor IPM module includes: The compressor inverter power module and the compressor drive chip are installed in the corresponding mounting positions, and the compressor inverter power module is electrically connected to the compressor drive chip; The wind turbine IPM module includes: The fan inverter power module and the fan drive chip are installed in the corresponding mounting positions, and the compressor inverter power module is electrically connected to the fan drive chip.

4. The highly integrated intelligent power module as described in claim 3, characterized in that, The low-voltage pin mounting side is provided with a first low-voltage power supply positive terminal pin, a second low-voltage power supply positive terminal pin, a first low-voltage power supply negative terminal pin, and a second low-voltage power supply negative terminal pin. The power supply terminal of the compressor drive chip is electrically connected to the positive terminal pin of the first low-voltage power supply. The power supply terminal of the fan drive chip is electrically connected to the positive terminal pin of the second low-voltage power supply. The ground terminal of the compressor drive chip is electrically connected to the first low-voltage power supply negative terminal pin; The ground terminal of the fan drive chip is electrically connected to the negative terminal pin of the second low-voltage power supply.

5. The highly integrated intelligent power module as described in claim 4, characterized in that, The single-point grounding pin is connected to the grounding terminals of the compressor drive chip and the fan drive chip, respectively.

6. The highly integrated intelligent power module as described in claim 3, characterized in that, The highly integrated intelligent power module also includes: The negative terminal of the PFC inductor is connected to the negative terminal of the PFC power supply. The PFC inductor is connected to the positive terminal, which is interconnected with the positive terminal of the PFC power supply and one end of an external inductor. The PFC inductor connection terminal is connected to the other end of the external inductor; The bus capacitor connection terminal is connected to the external bus capacitor. The PFC power module includes a PFC power switch and a PFC diode. The input terminal of the PFC power switch is interconnected with the PFC inductor and the anode of the PFC diode. The output terminal of the PFC power switch is connected to the negative terminal of the PFC inductor. The cathode of the PFC diode is connected to the bus capacitor.

7. The highly integrated intelligent power module as described in claim 6, characterized in that, The output terminal of the PFC power switch is electrically connected to the single-point grounding pin. And / or, the output terminal of the PFC power switch is electrically connected to the ground terminal of the compressor drive chip.

8. The highly integrated intelligent power module as described in any one of claims 1 to 7, characterized in that, The highly integrated intelligent power module also includes: A rectifier bridge, the output of which is connected to a PFC inductor.

9. An electronic control component, characterized in that, Includes a low-voltage power supply, a high-voltage power supply, a compressor current sensing resistor, a fan current sensing resistor, and a highly integrated intelligent power module as described in any one of claims 1 to 8, wherein, One end of the compressor current sensing resistor is interconnected with the compressor low voltage reference pin and compressor current sensing pin of the highly integrated intelligent power module, and the other end of the compressor current sensing resistor is connected to the single-point grounding pin of the highly integrated intelligent power module. The compressor low-voltage reference pin is also connected to the negative terminal of the high-voltage power supply via the compressor current detection resistor; One end of the fan current sensing resistor is interconnected with the fan low voltage reference pin and the fan current sensing pin of the highly integrated intelligent power module, and the other end of the fan current sensing resistor is connected to the single-point grounding pin of the highly integrated intelligent power module. The low-voltage reference pin of the fan is also connected to the negative terminal of the high-voltage power supply via the fan current detection resistor.

10. An air conditioner, characterized in that, Includes the highly integrated smart power module as described in any one of claims 1 to 8; Alternatively, it may include the electronic control components as described in claim 9.

Images