Heater assembly and bonding head having the same
By using a porous block structure in the heater assembly, the cooling gas flow rate and pressure distribution are optimized, and the problem of uneven cooling of the heater is solved, achieving uniform cooling and extended service life of the heater.
Patent Information
- Application Number
- CN202111359554.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-11-30
- Filing Date
- 2021-11-17
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2041-11-17
AI Technical Summary
The existing heater assembly cannot evenly cool the overall area of the heater during cooling, resulting in temperature deviations, which may lead to thermal deformation of the heater and shorten the life of the heater.
The porous block structure is adopted, by adjusting the porosity, thickness and position of the porous block, the flow rate and pressure distribution of the cooling gas are optimized according to the temperature characteristics of different areas of the heater to achieve uniform cooling of the heater.
The overall area of the heater is uniformly cooled, preventing temperature deviation, avoiding thermal deformation and shortening of life.
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Figure CN114582750B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a bonding head for mounting a die on a substrate and a heater assembly provided in the bonding head. Background Art
[0002] Generally, in a die bonding process for mounting dies singulated by a sawing process on a substrate such as a printed circuit board or a lead frame, a bonding head is used to pick up the dies on a wafer and place them on the substrate.
[0003] The bonding head includes a collet for picking up a die using vacuum pressure and a main body on which the collet is mounted.
[0004] In order to mount a die on a substrate, the die needs to be heated, and for this purpose, a bonding head includes a heater assembly including a heater.
[0005] The heater assembly also includes a cooling module configured to cool the heater. The cooling module is configured to eject air toward the heater to cool the heater. The cooling module includes: a plurality of air inlets for air to flow in; a plurality of cooling channels communicating with the air inlets; and a plurality of air outlets communicating with the cooling channels. The plurality of air outlets are disposed adjacent to the heater.
[0006] In this conventional heater assembly, air flowing into the multiple air inlets flows along the multiple cooling flow paths and is then discharged to the outside through the multiple air outlets. Furthermore, the air ejected from the multiple air outlets collides with the heater, thereby cooling the heater.
[0007] However, in conventional heater assemblies, the lengths of the cooling channels, that is, the distances between the air inlets and the air outlets, vary. Consequently, the pressure and flow rate of air discharged from the outlets vary, resulting in an inability to uniformly cool the entire heater area.
[0008] In this way, if the entire area of the heater cannot be cooled uniformly, temperature deviations will occur in multiple areas of the heater. Moreover, due to the temperature deviations, the heater may be thermally deformed and damaged, and the life of the heater may be shortened.
[0009] Patent Document 1: Korean Patent Publication No. 10-2015-0141361 (December 18, 2015) Summary of the Invention
[0010] An object of the present invention is to provide a heater assembly capable of uniformly cooling the entire area of a heater and a bonding head including the same.
[0011] According to an embodiment of the present invention, a heater assembly can be provided, which includes: a shell having a storage space inside and a cooling gas inlet connected to the storage space; a heater combined with the shell; and a porous block arranged in the storage space of the shell.
[0012] The heater may include a plurality of heat generating regions that generate heat at different temperatures, and the porous block may be configured so that a flow rate of the cooling gas is changed according to the plurality of heat generating regions.
[0013] It may be that the heater includes a first region that generates heat at a first temperature and a second region that generates heat at a second temperature lower than the first temperature, the porous block includes a first porous component having a first porosity and a second porous component having a second porosity smaller than the first porosity, the first porous component is configured to correspond to the first region, and the second porous component is configured to correspond to the second region.
[0014] The first porous member may have a larger number of pores per unit volume than the second porous member.
[0015] The first porous member may have pores with a larger volume than those of the second porous member.
[0016] It may be that the heater includes a first region that generates heat at a first temperature and a second region that generates heat at a second temperature lower than the first temperature, the porous block includes a first porous component having a first thickness and a second porous component having a second thickness greater than the first thickness, the first porous component is configured to correspond to the first region, and the second porous component is configured to correspond to the second region.
[0017] It may be that the first porous member is spaced apart from the heater.
[0018] It may be that the heater includes a first region that generates heat at a first temperature and a second region that generates heat at a second temperature lower than the first temperature, and the porous block includes a first porous component configured to correspond to the first region and a second porous component configured to correspond to the second region, the first porous component is separated from the first region, and the second porous component is in contact with the second region.
[0019] The heater may include a first region that generates heat at a first temperature and a second region that generates heat at a second temperature lower than the first temperature, and the porous block may be arranged only in the second region.
[0020] The heater may include a first region that generates heat at a first temperature and a second region that generates heat at a second temperature lower than the first temperature, and the porous block may be formed to cover only the second region.
[0021] The heater assembly according to the embodiment of the present invention may further include a partition plate provided between the cooling gas inlet and the porous block.
[0022] It can be that the heater assembly according to an embodiment of the present invention includes: a shell, which has a storage space inside and has a cooling gas inlet and a cooling gas exhaust port connected to the storage space; a heater, which is combined with the shell; a first porous block, which is arranged in the storage space and connected to the cooling gas inlet; and a second porous block, which is arranged in the storage space and connected to the cooling gas exhaust port.
[0023] The first porous block may be separated from the heater, and a flow space for the cooling gas to flow is formed between the first porous block and the heater.
[0024] Alternatively, the housing includes a base component, the accommodation space is formed by the base component and the second porous block, and the heater and the second porous block are combined to form a sealed accommodation space.
[0025] The cooling gas exhaust port may be formed by the base member and the heater being spaced apart from each other.
[0026] The second porous block may be configured to support the first porous block, the base member, and the heater.
[0027] The shell may include a base component and a side wall configured to surround the base component, the accommodation space is formed by the base component and the side wall, and the heater and the side wall are combined to form a closed accommodation space.
[0028] The cooling gas inlet may be formed in at least one of the base member and the side wall. That is, the cooling gas inlet may be formed in either the base member or the side wall, or in both. The cooling gas outlet may be formed in at least one of the base member and the side wall. That is, the cooling gas outlet may be formed in either the base member or the side wall, or in both.
[0029] According to an embodiment of the present invention, a bonding head is provided, configured to pick up a die and place it on a substrate. The bonding head includes: a chuck configured to hold the die; and the aforementioned heater assembly disposed adjacent to the chuck.
[0030] The bonding head according to the embodiment of the present invention may further include a heat insulating block for insulating heat emitted from the heater assembly, and the heater assembly may be disposed between the clamp and the heat insulating block.
[0031] According to the embodiment of the present invention, the entire area of the heater can be uniformly cooled, thereby preventing temperature deviations in multiple areas of the heater, thereby preventing the heater from being thermally deformed and damaged or shortening its life due to temperature deviations. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1This is a diagram schematically showing a bonding head including a heater assembly according to a first embodiment of the present invention.
[0033] Figure 2 This is a diagram schematically showing an example of a heater assembly according to the first embodiment of the present invention.
[0034] Figure 3 This is a diagram schematically showing another example of the heater assembly according to the first embodiment of the present invention.
[0035] Figure 4 This is a diagram schematically showing still another example of the heater assembly according to the first embodiment of the present invention.
[0036] Figure 5 This is a diagram schematically showing an example of a heater assembly according to a second embodiment of the present invention.
[0037] Figure 6 This is a diagram schematically showing another example of the heater assembly according to the second embodiment of the present invention.
[0038] Figure 7 This is a diagram schematically showing still another example of the heater assembly according to the second embodiment of the present invention.
[0039] Figure 8 This is a diagram schematically showing still another example of the heater assembly according to the second embodiment of the present invention.
[0040] Figure 9 This is a diagram schematically showing an example of a heater assembly according to a third embodiment of the present invention.
[0041] Figure 10 This is a diagram schematically showing another example of the heater assembly according to the third embodiment of the present invention.
[0042] Figure 11 This is a diagram schematically showing still another example of the heater assembly according to the third embodiment of the present invention.
[0043] Figure 12 This is a diagram schematically showing still another example of the heater assembly according to the third embodiment of the present invention.
[0044] (Explanation of Reference Numerals)
[0045] 10: Fixed block
[0046] 20: Insulation block
[0047] 30: Heater assembly
[0048] 40: Clamp body
[0049] 50: porous block
[0050] 60: Negative pressure source
[0051] 70: Cooling gas supply source
[0052] 80: Grain
[0053] 90: Wafer DETAILED DESCRIPTION
[0054] Hereinafter, a bonding head and a heater assembly provided in the bonding head according to embodiments of the present invention will be described with reference to the accompanying drawings.
[0055] like Figure 1 As shown, the bonding head according to the first embodiment of the present invention is configured to pick up a die 80 from a wafer 90 including the die 80 singulated by a dicing process. The bonding head is used to mount the die on a substrate such as a printed circuit board or a lead frame.
[0056] The bonding head includes a fixing block 10 , a heat insulating block 20 , a heater assembly 30 and a clamping body 40 .
[0057] The fixing block 10 may be connected to a driving unit (not shown) that moves the bonding head horizontally and vertically.
[0058] The heat insulating block 20 prevents heat generated in the heater assembly 30 from being conducted to the fixing block 10 .
[0059] The chuck 40 may be configured to use negative pressure to attract the die 80. To this end, a negative pressure source 60 is connected to the chuck 40. For example, the chuck 40 may be formed of a ceramic material.
[0060] Below, refer to Figures 2 to 4 , a heater assembly 30 according to a first embodiment of the present invention is described.
[0061] The heater assembly 30 is disposed between the heat insulating block 20 and the chuck 40. The heater assembly 30 heats the die 80 picked up by the chuck 40. The die 80 heated by the heat generated by the heater assembly 30 can be thermocompression bonded to the substrate.
[0062] like Figure 1 as well as Figure 2 As shown, the heater assembly 30 includes a housing 31 , a heater 32 and a porous block 50 .
[0063] For example, the housing 31 may be formed of a thermally insulating material. The housing 31 has an internal storage space 311. The housing 31 has a cooling gas inlet 312 and a cooling gas outlet 313 communicating with the storage space 311. The cooling gas inlet 312 is connected to a cooling gas supply source 70 that supplies cooling gas.
[0064] The cooling gas supplied from the cooling gas supply source 70 may be air or an inert gas. As another example, the cooling gas may be a refrigerant. The cooling gas supply source 70 may supply cooling gas at a temperature below room temperature.
[0065] The housing 31 may be formed in a shape with one side open. The heater 32 may be provided on the open side of the housing 31. The housing 31 may include a base member 314 and a side wall 315.
[0066] The base member 314 may be formed in a plate shape, and the side wall 315 may be disposed to surround the base member 314 .
[0067] The accommodation space 311 may be formed by a base member 314 and a side wall 315 .
[0068] The cooling gas inlet 312 may be formed in the base member 314. However, the present invention is not limited thereto and may also be applied to a structure in which the cooling gas inlet 312 is formed in the side wall 315. The housing 31 may include one or more cooling gas inlets 312. When multiple cooling gas inlets 312 are included, the multiple cooling gas inlets 312 may be arranged at regular intervals.
[0069] The cooling gas outlet 313 may be formed in the side wall 315. However, the present invention is not limited thereto and may also be applied to a structure in which the cooling gas outlet 313 is formed in the base member 314. The housing 31 may have one or more cooling gas outlets 313. When multiple cooling gas outlets 313 are provided, the multiple cooling gas outlets 313 may be arranged at regular intervals.
[0070] The heater 32 may be formed in a plate shape and may be combined with the housing 31 to form a sealed accommodation space 311 . For example, the heater 32 may be combined with a side wall 315 of the housing 31 .
[0071] The porous block 50 is disposed within the housing space 311 of the housing 31. The porous block 50 may include a plurality of pores through which cooling gas can pass. The porous block 50 may have a predetermined porosity. The porosity may be the ratio of the sum of the volumes of the plurality of pores to a unit volume. A high porosity may increase the flow rate of cooling gas passing through the porous block 50. Conversely, a low porosity may reduce the flow rate of cooling gas passing through the porous block 50.
[0072] As the cooling gas passes through the porous block 50 , the pressure and flow rate of the cooling gas may become uniform overall.
[0073] like Figure 2As shown, the porous block 50 may be spaced apart from the heater 32. Thus, a flow space 316 may be formed between the porous block 50 and the heater 32. Therefore, the cooling gas may pass through the porous block 50, flow in the flow space 316, and then contact and cool the heater 32.
[0074] As another example, Figure 3 As shown, the porous block 50 may be in contact with the heater 32. Therefore, the cooling gas may directly contact the heater 32 after passing through the porous block 50 and cool the heater 32.
[0075] As another example, Figure 4 As shown, a partition 317 may be further provided between the cooling gas inlet 312 and the porous block 50. The partition 317 may be formed as a mesh having a predetermined grid. As the cooling gas flowing from the cooling gas inlet 312 toward the porous block 50 passes through the partition 317, the pressure and flow rate of the cooling gas can be uniformed overall. As a result, the entire area of the heater 32 can be cooled more evenly.
[0076] According to the heater assembly 30 according to the first embodiment of the present invention, as the cooling gas passes through the porous block 50, the pressure and flow rate of the cooling gas can be uniformed throughout the heater 32. Consequently, the cooling gas can be uniformly distributed throughout the entire area of the heater 32. Consequently, since the entire area of the heater 32 can be uniformly cooled, temperature variations can be prevented from occurring in various areas of the heater 32. Consequently, thermal deformation and damage to the heater 32, or shortening of the heater 32's life due to temperature variations, can be prevented.
[0077] On the other hand, the first embodiment of the present invention proposes a structure in which the heater 32 is combined with the shell 31, but the present invention is not limited thereto. As another embodiment, the heater 32 can be configured to be separated from the shell 31. In this case, the open side of the shell 31 can serve as a cooling gas exhaust port, and a separate cooling gas exhaust port 313 may not be provided on the base part 314 or the side wall 315 of the shell 31. According to such a structure, the cooling gas flowing into the interior of the shell 31 through the cooling gas inlet 312 can pass through the porous block 50 and be ejected toward the heater 32, and the cooling gas ejected from the porous block 50 can collide with the heater 32 and cool the heater 32.
[0078] Below, refer to Figures 5 to 8 A heater assembly 30 according to a second embodiment of the present invention will be described. Components identical to those described in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0079] The heater 32 of the heater assembly 30 according to the second embodiment of the present invention can include multiple heating regions R1 and R2 that generate heat at different temperatures. While the second embodiment of the present invention provides a configuration in which the heater 32 has two heating regions R1 and R2, the present invention is not limited thereto. As another example, a configuration in which the heater 32 has three or more heating regions is also applicable to the present invention.
[0080] The porous block 50 may be configured so that the flow rate of the cooling gas is changed according to the plurality of heat generating regions R1 and R2.
[0081] For example, the plurality of heating regions R1 and R2 may include a first region R1 that generates heat at a first temperature and a second region R2 that generates heat at a second temperature that is lower than the first temperature.
[0082] like Figure 5 As shown, the porous block 50 includes a first porous component 501 having a first porosity and a second porous component 502 having a second porosity smaller than the first porosity, so that the flow rate of the cooling gas is changed according to the multiple heat-generating regions R1 and R2. Moreover, the first porous component 501 is configured to correspond to the first region R1, and the second porous component 502 is configured to correspond to the second region R2.
[0083] The first porous member 501 and the second porous member 502 may be formed independently of each other, or may be integrally formed.
[0084] As one example, the first porous member 501 may have a greater number of pores per unit volume than the second porous member 502. As another example, the first porous member 501 may have pores with a larger volume than the second porous member 502.
[0085] In this way, due to the difference in porosity between the first porous member 501 and the second porous member 502, the cooling gas can pass through the first porous member 501 at a relatively large flow rate and can pass through the second porous member 502 at a relatively small flow rate. Therefore, the cooling gas can be transmitted to the first region R1 at a relatively large flow rate and can be transmitted to the second region R2 at a relatively small flow rate. Therefore, the degree of cooling of the first region R1 can be greater than the degree of cooling of the second region R2. Therefore, the first region R1 and the second region R2 can be cooled at the same or almost similar cooling rate and cooling temperature. The entire area of the heater 32 can be cooled uniformly.
[0086] As another example, Figure 6As shown, the porous block 50 includes a first porous component 501 having a first thickness and a second porous component 502 having a second thickness greater than the first thickness, so that the flow rate of the cooling gas is changed according to the multiple heat-generating regions R1 and R2. Moreover, the first porous component 501 is configured to correspond to the first region R1, and the second porous component 502 is configured to correspond to the second region R2.
[0087] The first porous member 501 and the second porous member 502 may be formed independently of each other, or may be formed integrally.
[0088] On the other hand, in order to make the thickness difference between the first porous member 501 and the second porous member 502 larger, the first porous member 501 can be separated from the heater 32. However, the present invention is not limited to such a structure, and the present invention can also be applied to a structure in which the first porous member 501 contacts the heater 32, a structure in which the second porous member 502 contacts the heater 32, a structure in which both the first porous member 501 and the second porous member 502 contact the heater 32, a structure in which the first porous member 501 is separated from the heater 32, a structure in which the second porous member 502 is separated from the heater 32, or a structure in which both the first porous member 501 and the second porous member 502 are separated from the heater 32.
[0089] In this way, due to the difference in thickness between the first porous member 501 and the second porous member 502, the cooling gas can pass through the first porous member 501 at a relatively large flow rate and can pass through the second porous member 502 at a relatively small flow rate. Therefore, the cooling gas can be transmitted to the first region R1 at a relatively large flow rate and can be transmitted to the second region R2 at a relatively small flow rate. Therefore, the degree of cooling of the first region R1 can be greater than the degree of cooling of the second region R2. Therefore, the first region R1 and the second region R2 can be cooled at the same or nearly similar cooling rate and cooling temperature. The entire area of the heater 32 can be cooled uniformly.
[0090] As another example, Figure 7 As shown, the porous block 50 includes a first porous component 501 configured to correspond to the first region R1 and a second porous component 502 configured to correspond to the second region R2, so that the flow rate of the cooling gas is changed according to the multiple heat-generating regions R1 and R2. In addition, the first porous component 501 is separated from the first region R1, and the second porous component 502 is in contact with the second region R2.
[0091] The first porous member 501 and the second porous member 502 may be formed independently of each other, or may be formed integrally.
[0092] The first porous member 501 is separated from the first region R1 , thereby forming a flow space 316 for the cooling gas to flow between the first porous member 501 and the first region R1 .
[0093] Therefore, the space occupied by the first porous member 501 reduces the volume occupied by the flow space 316. Therefore, the flow rate of the cooling gas passing through the first porous member 501 and the flow space 316 and flowing toward the heater 32 can be greater than the flow rate of the cooling gas passing through the second porous member 502 and flowing toward the heater 32.
[0094] In this way, due to the positional difference between the first porous member 501 and the second porous member 502, the cooling gas can pass through the first porous member 501 at a relatively large flow rate and can pass through the second porous member 502 at a relatively small flow rate. Therefore, the cooling gas can be transmitted to the first region R1 at a relatively large flow rate and can be transmitted to the second region R2 at a relatively small flow rate. Therefore, the degree of cooling of the first region R1 can be greater than the degree of cooling of the second region R2. Therefore, the first region R1 and the second region R2 can be cooled at the same or nearly similar cooling rate and cooling temperature. The entire area of the heater 32 can be cooled uniformly.
[0095] As another example, Figure 8 As shown, the porous block 50 is only disposed in the second region R2 so that the flow rate of the cooling gas is changed according to the plurality of heat generating regions R1 and R2. As another example, the porous block 50 may be formed to cover only the second region R2.
[0096] The flow rate of the cooling gas that passes through the space where the porous block 50 is not provided and flows toward the heater 32 may be greater than the flow rate of the cooling gas that passes through the space where the porous block 50 is provided and flows toward the heater 32 .
[0097] In this manner, depending on whether or not the porous block 50 is provided, the cooling gas can be delivered to the first region R1 at a relatively high flow rate, and to the second region R2 at a relatively low flow rate. Consequently, the first region R1 can be cooled to a greater extent than the second region R2. Consequently, the first region R1 and the second region R2 can be cooled at the same or nearly similar cooling rates and temperatures, allowing the entire area of the heater 32 to be uniformly cooled.
[0098] According to the heater assembly 30 of the second embodiment of the present invention, the flow rate of cooling gas is varied according to the multiple heating regions R1 and R2 generating heat at different temperatures. This allows for uniform cooling of the entire heater 32. This prevents temperature variations in the multiple regions of the heater 32. Consequently, it is possible to prevent thermal deformation and damage to the heater 32, or shorten the life of the heater 32, due to temperature variations.
[0099] Below, refer to Figures 9 to 12 A heater assembly 30 according to a third embodiment of the present invention will be described. Components identical to those described in the first and second embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0100] The heater assembly 30 according to the third embodiment of the present invention includes a housing 31 , a heater 32 , a first porous block 51 , and a second porous block 52 .
[0101] like Figure 9 As shown, the housing 31 has an internal storage space 311 . The housing 31 includes a cooling gas inlet 312 and a cooling gas outlet 313 that communicate with the storage space 311 .
[0102] The heater 32 is coupled to the housing 31 .
[0103] The first porous block 51 is disposed in the accommodation space 311. The first porous block 51 communicates with the cooling gas inlet 312. The first porous block 51 functions as a flow path for the cooling gas flowing into the housing 31 through the cooling gas inlet 312.
[0104] The second porous block 52 is disposed in the accommodation space 311 and communicates with the cooling gas outlet 313. The second porous block 52 serves as a flow path for the cooling gas discharged to the outside of the housing 31 through the cooling gas outlet 313.
[0105] The first porous block 51 is separated from the heater 32 , and a flow space 316 for cooling gas to flow may be formed between the first porous block 51 and the heater 32 .
[0106] On the other hand, the housing 31 includes a base member 314 and a sidewall 315 disposed around the base member 314. The accommodating space 311 is formed by the base member 314 and the sidewall 315. The heater 32 can be combined with the sidewall 315 to form a sealed accommodating space 311. The heater 32 can also be supported by the second porous block 52.
[0107] The second porous block 52 can be in close contact with the base member 314 and the heater 32 .
[0108] While the third embodiment of the present invention proposes a structure in which the cooling gas inlet 312 and the cooling gas outlet 313 are formed in the base member 314, the present invention is not limited to this structure. For example, the cooling gas inlet 312 may be formed in the base member 314, the side wall 315, or both the base member 314 and the side wall 315, and the cooling gas outlet 313 may be formed in the base member 314, the side wall 315, or both the base member 314 and the side wall 315.
[0109] As an example, Figure 10 As shown, the first porous block 51 and the second porous block 52 may be formed in a straight line and arranged parallel to each other. In addition, the first porous block 51 may be supported by the second porous block 52.
[0110] As another example, Figure 11 As shown, the first porous block 51 may be disposed within the second porous block 52. That is, the second porous block 52 may be disposed to surround the first porous block 51. Furthermore, the first porous block 51 may be supported by the second porous block 52.
[0111] On the other hand, as another example, Figure 12 As shown, the housing 31 may include a base member 314, and the accommodation space 311 may be formed by the second porous block 52. Furthermore, the heater 32 may be combined with the second porous block 52 to form a sealed accommodation space 311.
[0112] According to such a structure, the housing 31 does not need to include the side wall 315. That is, the cooling gas exhaust port can be formed by separating the base member 314 and the heater 32 from each other.
[0113] According to the third embodiment of the present invention, the first porous block 51, the base member 314, and the heater 32 are supported by the second porous block 52. Thus, the second porous block 52, through which cooling gas can pass, can be provided as a component for supporting the first porous block 51, the base member 314, and the heater 32. Consequently, the structure of the heater assembly 30 can be simplified compared to a case where a support structure for supporting the first porous block 51, the base member 314, and the heater 32 and an exhaust flow path structure for exhausting cooling gas are separately provided.
[0114] Furthermore, according to the third embodiment of the present invention, as the cooling gas passes through the first porous block 51, the pressure and flow rate of the cooling gas can be uniformed across the entire area of the heater 32. Therefore, the cooling gas can be uniformly delivered to the entire area of the heater 32. Consequently, since the entire area of the heater 32 can be uniformly cooled, temperature variations can be prevented across various areas of the heater 32. Consequently, thermal deformation and damage to the heater 32 or shortening of the heater 32's life due to temperature variations can be prevented.
[0115] Although preferred embodiments of the present invention have been described and illustrated, the scope of the present invention is not limited to such specific embodiments, and appropriate changes can be made within the scope of the claims.
Claims
1. A heater assembly, comprising: a housing having an accommodation space therein and a cooling gas inlet communicating with the accommodation space; a heater, coupled to the housing; as well as A porous block is disposed in the accommodation space. A flow space is formed between the porous block and the heater.
2. The heater assembly according to claim 1, wherein: The heater includes a plurality of heating areas that generate heat at different temperatures. The porous block is configured so that a flow rate of the cooling gas is changed according to the plurality of heat generating regions.
3. The heater assembly according to claim 1, wherein: The heater includes a first region generating heat at a first temperature and a second region generating heat at a second temperature lower than the first temperature. The porous block includes a first porous member having a first porosity and a second porous member having a second porosity smaller than the first porosity, The first porous member is configured to correspond to the first region, The second porous member is configured to correspond to the second region.
4. The heater assembly according to claim 3, wherein: The first porous member has a larger number of pores per unit volume than the second porous member.
5. The heater assembly according to claim 3, wherein: The first porous component has pores with larger volumes than those of the second porous component.
6. The heater assembly according to claim 1, wherein: The heater includes a first region generating heat at a first temperature and a second region generating heat at a second temperature lower than the first temperature. The porous block includes a first porous member having a first thickness and a second porous member having a second thickness greater than the first thickness, The first porous member is configured to correspond to the first region, The second porous member is configured to correspond to the second region.
7. The heater assembly according to claim 6, wherein: The first porous member is spaced apart from the heater.
8. The heater assembly according to claim 1, wherein: The heater includes a first region generating heat at a first temperature and a second region generating heat at a second temperature lower than the first temperature. The porous block includes a first porous component configured to correspond to the first region and a second porous component configured to correspond to the second region. The first porous member is spaced apart from the first region, and the second porous member is in contact with the second region.
9. The heater assembly according to claim 1, wherein: The heater assembly further includes a partition disposed between the cooling gas inlet and the porous block.
10. A heater assembly comprising: a housing having an accommodation space therein and a cooling gas inlet and a cooling gas outlet communicated with the accommodation space; a heater, coupled to the housing; a first porous block disposed in the accommodation space and communicating with the cooling gas inlet; and A second porous block is disposed in the accommodation space and communicated with the cooling gas outlet, forming a flow space between the first porous block and the heater.
11. The heater assembly according to claim 10, wherein: The housing includes a base member, The accommodating space is formed by the base component and the second porous block. The heater is combined with the second porous block to seal the accommodation space.
12. The heater assembly according to claim 11, wherein: The cooling gas exhaust port is formed by the base member and the heater being spaced apart from each other.
13. The heater assembly according to claim 11, wherein The second porous block is configured to support the first porous block, the base member, and the heater.
14. The heater assembly according to claim 10, wherein: The housing includes a base member and a side wall configured to surround the base member. The accommodating space is formed by the base component and the side wall. The heater is combined with the side wall to seal the accommodation space.
15. The heater assembly according to claim 14, wherein: The cooling gas inlet is formed in the base member, the side wall, or the base member and the side wall. The cooling gas exhaust port is formed in the base member, the side wall, or the base member and the side wall.
16. A bonding head configured to pick up a die and place it on a substrate, wherein: The bonding head comprises: a collet configured to hold the die; and The heater assembly according to claim 1 or 10 is arranged adjacent to the clamping body.
17. The bonding head according to claim 16, wherein: The bonding head further includes a heat insulating block for insulating heat emitted from the heater assembly. The heater assembly is disposed between the clamp and the thermal insulation block.
Citation Information
Patent Citations
Bonding head and die bonding apparatus having the same
KR1020150141361A
Thermocompression bonding device for work
JP2000013005A