Isolation Antenna Array Assemblies

Abstract

A communication device includes two antennas operating within a first frequency range in the communication device. An integrated isolation antenna array assembly is located between the two antennas in the communication device to reduce radio frequency coupling between the two antennas. The integrated isolation antenna array assembly includes an interconnect substrate and an antenna array adjacent to the interconnect substrate and including one or more radiating elements. The antenna array is configured to drive the one or more radiating elements within a second frequency range in the communication device. The second frequency range is higher than the first frequency range. The integrated isolation antenna array assembly also includes an isolator fixed to the interconnect substrate and configured to be connected to an electrical ground. The isolator is configured to reduce radio frequency coupling between the two antennas within the first frequency range.

Description

Background Art

[0001] Under pressure from industrial design and other considerations, the volume available for antennas in communications devices continues to decrease. As the available volume decreases, the distance separating two antennas in a similar frequency range (2.4GHz) also decreases, which increases the risk of coupling between the two antennas and therefore degrades antenna performance. Isolators can be used to reduce coupling between the two antennas, but isolators also take up valuable volume within the communications device. Summary of the invention

[0002] The described technology provides a communication device that includes two antennas operating within a first frequency range in the communication device. An integrated isolation antenna array assembly is located between the two antennas in the communication device to reduce radio frequency coupling between the two antennas. The integrated isolation antenna array assembly includes an interconnect substrate and an antenna array adjacent to the interconnect substrate and including one or more radiating elements. The antenna array is configured to drive the one or more radiating elements within a second frequency range in the communication device. The second frequency range is higher than the first frequency range. The integrated isolation antenna array assembly also includes an isolator attached to the interconnect substrate and configured to be connected to electrical ground. The isolator is configured to reduce radio frequency coupling between the two antennas within the first frequency range.

[0003] This Summary is provided to introduce some concepts in a simplified form that are further described in the Detailed Description below. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0004] Other implementations are described and listed herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 An example communication device including two antennas and an isolated antenna array assembly is shown.

[0006] Figure 2 A perspective view of an example isolated antenna array assembly with an isolator spaced apart from the antenna array is shown.

[0007] Figure 3 A cross-sectional view of an example isolated antenna array assembly with an isolator spaced apart from the antenna array is shown.

[0008] Figure 4 A cross-sectional view of an example isolated antenna array assembly having an isolator separating two different antenna arrays is shown.

[0009] Figure 5 A perspective view of an example isolated antenna array assembly having an antenna array formed in an isolator is shown.

[0010] Figure 6 A cross-sectional view of an example isolated antenna array assembly having an antenna array formed in an isolator is shown.

[0011] Figure 7 Example operations for reducing coupling between two antennas using an isolation antenna array assembly are shown.

[0012] Figure 8 An example communication device is shown for implementing the features and operations of the described techniques. DETAILED DESCRIPTION

[0013] Figure 1 An example communication device 100 is shown that includes two antennas 102 and 104 and an isolated antenna array assembly 106. The antennas 102 and 104 and the isolated antenna array assembly 106 are located in a bezel area of ​​the communication device 100 between a display 108 and an edge of the communication device 100. In many implementations, the bezel area design and overall size of such communication devices continues to shrink in light of industrial design and other considerations.

[0014] Antenna 102 and antenna 104 are each driven to radiate within a first radio frequency (RF) range (eg, 1700 MHz-5 GHz). In contrast, isolated antenna array assembly 106 is driven to radiate within a second RF range (eg, >6 GHz).

[0015] The size of the communication device 100 and the operating characteristics of the first frequency range may introduce coupling between the antennas 102 and 104. Therefore, the isolation antenna array assembly 106 includes an isolator structure integrated into the isolation antenna array assembly 106 such that the geometry and arrangement of the isolator reduces coupling between the two antennas within the operating frequency range of the antennas 102 and 104 (by moving the RF null of one antenna to coincide with the location of the other antenna and / or by eliminating fringe currents along the ground plane between the two antennas). As shown, the isolator of the isolation antenna array assembly 106 is electrically grounded.

[0016] Figure 2A perspective view of an example isolated antenna array assembly 200 with an isolator 202 separated from an antenna array 204 is shown. Antenna array 204 includes multiple radiating elements 206, 208, 210, and 212, the type, size, number, and arrangement of which may vary depending on design goals. In at least one implementation, the antenna array may include only a single radiating element. In various implementations, the individual antenna elements may be various combinations of dipole antennas, patch antennas, and slot antennas, although other antenna types may also be used. Isolator 202 includes a highly conductive material (shown in dashed lines) and is configured to be connected to an electrical ground (e.g., isolator 202 may include a ground connection or terminal).

[0017] Multiple radiating elements 206, 208, 210, and 212 are driven by transceiver circuitry 215 via conductive interconnects 214, 216, 218, and 220 (e.g., antenna feeds) routed through an interconnect substrate 222. In at least one implementation, the transceiver circuitry may drive only a single radiating element (such as via a single conductive interconnect). In various implementations, the radiating elements 206, 208, 210, and 212 may be driven via a direct feed connection or via capacitive coupling (e.g., parasitic feed). In the illustrated implementation, the interconnect substrate 222 is positioned adjacent to the isolator 202 and the antenna array 204, wherein the interconnect substrate 222 may include, for example, a multi-layer interconnect structure and an intermediate layer between the isolator 202 and / or the antenna array 204.

[0018] In one implementation, the transceiver circuit 215 is embedded in the interconnect substrate 222 and includes a transceiver element for each radiating element. Example transceiver elements may include phase shifters, a transmit channel (e.g., including a transmit amplifier and a transmit mixer), and a receive channel (e.g., including a receive amplifier and a receive mixer), but other configurations are also contemplated. The carrier signal conveyed by the plurality of radiating elements 206, 208, 210, and 212 is received at an intermediate frequency (IF) in the transmit channel and is increased to a high frequency (e.g., 20 GHz-100 GHz) to drive the antenna array 204 to radiate (e.g., in a millimeter wave radio solution). The transceiver circuit 215 may be connected to ground, power, and digital control logic via the connector 224, but in other implementations, the transceiver circuit 215 may be connected to electrical ground via the ground isolator 202.

[0019] Figure 3A cross-sectional view of an example isolated antenna array assembly 300 with an isolator 302 separated from an antenna array 304 is shown. Antenna array 304 includes multiple radiating elements 306, 308, 310, and 312, the type, size, number, and arrangement of which may vary depending on design goals. In at least one implementation, the antenna array may include only a single radiating element. In various implementations, the individual antenna elements may be various combinations of dipole antennas, patch antennas, and slot antennas, but other antenna types may also be used. Isolator 302 includes a highly conductive material and is configured to be connected to an electrical ground (e.g., isolator 302 may include a ground connection or terminal)++.

[0020] Multiple radiating elements 306, 308, 310, and 312 are driven by transceiver circuitry 315 via conductive interconnects 314, 316, 318, and 320 (e.g., antenna feeds) routed through an interconnect substrate 322. In at least one implementation, the transceiver circuitry may drive only a single radiating element (such as via a single conductive interconnect). In various implementations, radiating elements 306, 308, 310, and 312 may be driven via a direct feed connection or via capacitive coupling (e.g., parasitic feed). In the illustrated implementation, the interconnect substrate 322 is positioned adjacent to the isolator 302 and the antenna array 304, wherein the interconnect substrate 322 may include, for example, a multi-layer interconnect structure and an intermediate layer between the isolator 302 and / or the antenna array 304.

[0021] In one implementation, interconnect substrate 322 is formed as a multi-layer substrate, such as a multi-layer low temperature co-fired ceramic substrate or a multi-layer RF substrate, but other interconnect substrates may also be employed. Each conductive interconnect 314, 316, 318, and 320 is connected or coupled to a transceiver circuit 315 for a corresponding radiating element of antenna array 304.

[0022] In one implementation, the transceiver circuit 315 is embedded in the interconnect substrate 322 and includes a transceiver element for each radiating element. Example transceiver elements may include phase shifters, a transmit channel (e.g., including a transmit amplifier and a transmit mixer), and a receive channel (e.g., including a receive amplifier and a receive mixer), but other configurations are also contemplated. The carrier signal conveyed by the plurality of radiating elements 306, 308, 310, and 312 is received at an intermediate frequency (IF) in the transmit channel and is increased to a high frequency (e.g., 25 GHz-100 GHz) to drive the antenna array 304 to radiate (e.g., in a millimeter wave radio solution). The transceiver circuit 315 may be connected to ground, power, and digital control logic via the connector 324, but in other implementations, the transceiver circuit 315 may be connected to electrical ground via the ground isolator 302.

[0023] Figure 4A cross-sectional view of an example isolated antenna array assembly 400 having an isolator 402 separated from two different antenna arrays 404 and 426 is shown. Antenna array 404 includes multiple radiating elements 406, 408, 410, and 412, the type, size, number, and arrangement of which can vary depending on design goals. In at least one implementation, the antenna array can include only a single radiating element. In various implementations, the individual antenna elements can be various combinations of dipole antennas, patch antennas, and slot antennas, but other antenna types can also be used. Isolator 402 includes a highly conductive material and is configured to be connected to an electrical ground (e.g., isolator 402 can include a ground connection or terminal).

[0024] Multiple radiating elements 406, 408, 410, and 412 are driven by transceiver circuitry 415 via conductive interconnects 414, 416, 418, and 420 (e.g., antenna feeds) routed through an interconnect substrate 422. In at least one implementation, the transceiver circuitry may drive only a single radiating element (such as via a single conductive interconnect). In various implementations, radiating elements 406, 408, 410, and 412 may be driven via a direct feed connection or via capacitive coupling (e.g., parasitic feed). In the illustrated implementation, the interconnect substrate 422 is positioned adjacent to the isolator 402 and the antenna array 404, wherein the interconnect substrate 422 may include, for example, a multi-layer interconnect structure and an intermediate layer between the isolator 402 and / or the antenna array 404.

[0025] In one implementation, interconnect substrate 422 is formed as a multi-layer substrate, such as a multi-layer low temperature co-fired ceramic substrate or a multi-layer RF substrate, but other interconnect substrates may also be employed. Each conductive interconnect 414, 416, 418, and 420 is connected to a transceiver circuit for a corresponding radiating element of antenna array 404.

[0026] In one implementation, the transceiver circuit 415 is embedded in the interconnect substrate 422 and includes a transceiver element for each radiating element. Example transceiver elements may include phase shifters, a transmit channel (e.g., including a transmit amplifier and a transmit mixer), and a receive channel (e.g., including a receive amplifier and a receive mixer), but other configurations are also contemplated. The carrier signal conveyed by the plurality of radiating elements 406, 408, 410, and 412 is received at an intermediate frequency (IF) in the transmit channel and is increased to a high frequency (e.g., 25 GHz-100 GHz) to drive the antenna array 404 to radiate (e.g., in a millimeter wave radio solution). The transceiver circuit 415 may be connected to ground, power, and digital control logic via the connector 424, but in other implementations, the transceiver circuit 415 may be connected to electrical ground via the ground isolator 402.

[0027] Another antenna array 426 is located on the opposite side of the isolator 402 relative to the antenna array 404. Another antenna array 426 includes a plurality of radiating elements 428, 430, 432, and 434, which are connected to another transceiver circuit 436 via conductive interconnects 438, 440, 442, and 444 (e.g., antenna feeds) through another interconnect substrate 435. In at least one implementation, the antenna array may include only a single radiating element. In various implementations, the radiating elements 428, 430, 432, and 434 may be driven via a direct feed connection or via capacitive coupling (e.g., parasitic feed). In the illustrated implementation, the interconnect substrate 435 is positioned adjacent to the isolator 402 and the antenna array 426, wherein the interconnect substrate 435 may include, for example, an intermediate layer between a multi-layer interconnect structure and the isolator 402 and / or the antenna array 426.

[0028] The transceiver circuit 436 is embedded in the interconnect substrate 435 and can be connected to ground, power, and digital control logic through the connector 446, but in other implementations, the transceiver circuit 436 can be connected to electrical ground through the ground isolator 402. In one implementation, the transceiver circuit 436 includes a transceiver element for each radiating element. Example transceiver elements may include a phase shifter, a transmit channel (e.g., including a transmit amplifier and a transmit mixer), and a receive channel (e.g., including a receive amplifier and a receive mixer), but other configurations are also contemplated.

[0029] Figure 5 A perspective view of an example isolated antenna array assembly 500 having an antenna array 504 formed in an isolator 502 is shown. The antenna array 504 includes four slot antennas (e.g., radiating elements 506, 508, 510, and 512) formed as holes in the isolator 502, although the number, arrangement, size, and shape of the holes may vary depending on design goals. In at least one implementation, the antenna array may include only a single radiating element. The isolator 502 includes a highly conductive material (shown in dashed lines) and is configured to connect to an electrical ground (e.g., the isolator 502 may include a ground connection or terminal).

[0030] Multiple radiating elements 506, 508, 510, and 512 are driven by transceiver circuitry 515 via conductive interconnects (e.g., antenna feeds—not shown) routed through interconnect substrate 222. In at least one implementation, the transceiver circuitry may drive only a single radiating element (such as via a single conductive interconnect). In the illustrated implementation, interconnect substrate 522 is positioned adjacent to isolator 502 and antenna array 504, wherein interconnect substrate 522 may include, for example, a multi-layer interconnect structure and an intermediate layer between isolator 502 and / or antenna array 504.

[0031] In one implementation, the transceiver circuit 515 is embedded in the interconnect substrate 522 and includes a transceiver element for each radiating element. Example transceiver elements may include a phase shifter, a transmit channel (e.g., including a transmit amplifier and a transmit mixer), and a receive channel (e.g., including a receive amplifier and a receive mixer), but other configurations are also contemplated. In one implementation, each conductive interconnect couples a phase shifter, a transmit channel, and a receive channel to its corresponding radiating element (e.g., driving a slot antenna via capacitive coupling).

[0032] The carrier signal conveyed by the plurality of radiating elements 506, 508, 510, and 512 is received at an intermediate frequency (IF) in the transmit channel and boosted to a high frequency (e.g., 25 GHz-100 GHz) to drive the antenna array 504 to radiate (e.g., in a millimeter wave radio solution). The transceiver circuit 515 can be connected to ground, power, and digital control logic via connector 524, but in other implementations, the transceiver circuit 515 can be connected to electrical ground via ground isolator 502.

[0033] Figure 6 A cross-sectional view of an example isolated antenna array assembly 600 having an antenna array 604 formed in an isolator 602 is shown. Antenna array 604 includes four slot antennas (e.g., radiating elements 606, 608, 610, and 612) formed as holes in isolator 602, although the number, arrangement, size, and shape of the holes may vary depending on design goals. In at least one implementation, the antenna array may include only a single radiating element. Isolator 602 includes a highly conductive material (shown in dashed lines) and is configured to connect to an electrical ground (e.g., isolator 602 may include a ground connection or terminal).

[0034] Multiple radiating elements 606, 608, 610, and 612 are driven by transceiver circuitry 615 via conductive interconnects 614, 616, 618, and 620 (e.g., antenna feeds) routed through an interconnect substrate 622. In at least one implementation, the transceiver circuitry may drive only a single radiating element (such as via a single conductive interconnect). In the illustrated implementation, the interconnect substrate 622 is positioned adjacent to the isolator 602 and the antenna array 604, wherein the interconnect substrate 622 may include, for example, a multi-layer interconnect structure and an intermediate layer between the isolator 602 and / or the antenna array 604.

[0035] In one implementation, the interconnect substrate 622 is formed as a multi-layer substrate, such as a multi-layer low temperature co-fired ceramic substrate or a multi-layer RF substrate, but other interconnect substrates may also be used. Each conductive interconnect 614, 616, 618 and 620 is connected or coupled to the transceiver circuit 615 for the corresponding radiating element of the antenna array 604.

[0036] In one implementation, the transceiver circuit 615 is embedded in the interconnect substrate 622 and includes a transceiver element for each radiating element. Example transceiver elements may include a phase shifter, a transmit channel (e.g., including a transmit amplifier and a transmit mixer), and a receive channel (e.g., including a receive amplifier and a receive mixer), but other configurations are also contemplated. In one implementation, each conductive interconnect couples a phase shifter, a transmit channel, and a receive channel to its corresponding radiating element (e.g., driving a slot antenna via capacitive coupling).

[0037] The carrier signal conveyed by the plurality of radiating elements 606, 608, 610, and 612 is received at an intermediate frequency (IF) in the transmit channel and boosted to a high frequency (e.g., 25 GHz-100 GHz) to drive the antenna array 604 to radiate (e.g., in a millimeter wave radio solution). The transceiver circuit 615 can be connected to ground, power, and digital control logic via connector 624, but in other implementations, the transceiver circuit 615 can be connected to ground via ground isolator 602.

[0038] Figure 7 An example operation 700 for reducing coupling between two antennas using an isolated antenna array assembly is shown. A driving operation 702 drives two antennas to radiate within a first frequency range (e.g., 2.4 GHz) in a communication device (such as from a transceiver circuit via a conductive interconnect). While driving the two antennas, an isolation operation 704 uses an isolator fixed to an interconnect substrate of an integrated isolated antenna array assembly in the communication device to reduce RF coupling between the two driven antennas within the first frequency range (e.g., by moving the RF null of one antenna to coincide with the position of the other antenna and / or by eliminating fringe currents along a ground plane between the two antennas). Another driving operation 706 drives multiple radiating elements on an antenna array of the integrated isolated antenna array assembly to radiate within a second RF range (e.g., 25 GHz-100 GHz) in the communication device, where the second RF range is higher than the first frequency range. In at least one implementation, the antenna array may include only a single radiating element. In at least one implementation, the transceiver circuit may drive only a single radiating element (such as via a single conductive interconnect).

[0039] Example isolated antenna array assemblies operable by the example methods are disclosed and presented herein.

[0040] Figure 8An example communication device 800 for implementing the features and operations of the described techniques is shown. The communication device 800 is an example charging receiver device and can be a client device such as a laptop, mobile device, desktop, tablet; server / cloud device; IoT device; electronic accessory; or other rechargeable electronic device. The communication device 800 includes one or more processors 802 and memory 804. The memory 804 generally includes both volatile memory (e.g., RAM) and non-volatile memory (e.g., flash memory). An operating system 810 resides in the memory 804 and is executed by the processor(s) 802.

[0041] In the example communication device 800, as Figure 8 As shown, one or more modules or segments, such as communication software 850, application modules, and other modules, are loaded onto an operating system 810 on memory 804 and / or storage 820 and executed by processor 802. Storage 820 may store communication parameters and other data and may be local to communication device 800, or may be remote and communicatively connected to communication device 800.

[0042] The communication device 800 includes a power supply 816 that is powered by one or more batteries or other power sources and that provides power to other components of the communication device 800. The power supply 816 may also be connected to an external power source that overrides or recharges the internal batteries or other power sources.

[0043] The communication device 800 may include one or more communication transceivers 830, which may be connected to one or more antennas 832 to provide network connectivity (e.g., mobile phone networks, ). The communication device 800 may further include a network adapter 836, which is a type of communication device. The communication device 800 may use the adapter and any other type of communication device to establish a connection on a wide area network (WAN) or a local area network (LAN). It should be understood that the network connections shown are exemplary and other communication devices and means for establishing a communication link between the communication device 800 and other devices may be used.

[0044] The communication device 800 may include one or more input devices 834 (e.g., a keyboard or mouse) so that a user can enter commands and information. These and other input devices may be coupled to a server via one or more interfaces 838 such as a serial port interface, a parallel port, a universal serial bus (USB), etc. The communication device 800 may further include a display 822, such as a touch screen display.

[0045] The communication device 800 may include a variety of tangible processor-readable storage media and intangible processor-readable communication signals. Tangible processor-readable storage may be embodied by any available medium that can be accessed by the communication device 800, and includes both volatile and non-volatile storage media, removable and non-removable storage media. Tangible processor-readable storage media do not include intangible communication signals, but rather include volatile and non-volatile, removable and non-removable storage media implemented in any method or technology for storing information such as processor-readable instructions, data structures, program modules or other data. Tangible processor-readable storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other tangible medium that can be used to store the desired information and can be accessed by the communication device 800. In contrast to tangible processor-readable storage media, intangible processor-readable communication signals may embody processor-readable instructions, data structures, program modules or other data using modulated data signals such as carrier waves or other signal transmission mechanisms. The term "modulated data signal" means a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, intangible communication signals include signals propagated through wired media (such as a wired network or direct-wired connection) and wireless media (such as acoustic, RF, infrared and other wireless media).

[0046] Although this specification contains many specific implementation details, these should not be interpreted as limitations on the scope of any invention or possible claimed content, but rather as descriptions of features specific to a particular embodiment of a particular description technology. In this specification, certain features described in the context of separate embodiments may also be implemented in combination in a single embodiment. Conversely, the individual features described in the context of a single embodiment may also be implemented separately in multiple embodiments or in any appropriate sub-combination. In addition, although features may be described above as acting in certain combinations and even initially claimed, one or more features from the claimed combination may be removed from the combination in some cases, and the claimed combination may be directed to a sub-combination, or a variant of a sub-combination.

[0047] Similarly, although the operations are depicted in a particular order in the accompanying drawings, this should not be understood as requiring that the operations be performed in the particular order shown or in a sequential order, or that all operations illustrated be performed to achieve the desired result. In some cases, multitasking and parallel processing may be advantageous. In addition, the separation of the various system components in the above-described embodiments should not be understood as requiring such separation in all embodiments, but it should be understood that the described program components and systems can generally be integrated in a single software product or packaged into multiple software products.

[0048] Thus, particular embodiments of the subject matter have been described. Other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve the desired results. Additionally, the processes described in the accompanying drawings do not necessarily require the particular order or sequence shown to achieve the desired results. In some implementations, multitasking and parallel processing may be advantageous.

[0049] An example integrated isolated antenna array assembly for use in a communication device is provided, the communication device having two antennas operating within a first frequency range in the communication device. The integrated isolated antenna array assembly includes an interconnect substrate and an antenna array adjacent to the interconnect substrate and including one or more radiating elements. The antenna array is configured to drive the one or more radiating elements within a second frequency range in the communication device. The second frequency range is higher than the first frequency range. The integrated isolated antenna array assembly further includes an isolator attached to the interconnect substrate and configured to be connected to electrical ground. The isolator is configured to reduce radio frequency coupling between the two antennas within the first frequency range.

[0050] Another example of any of the foregoing assemblies is an integrated isolated antenna array assembly further comprising a transceiver circuit comprising one or more transceiver elements embedded in the interconnect substrate. Each transceiver element comprises an antenna feed connected through the interconnect substrate to drive a corresponding radiating element of the antenna array.

[0051] Another example integrated isolated antenna array assembly of any of the foregoing assemblies is provided, wherein transceiver circuitry and an interconnect substrate are located between the isolator and the antenna array.

[0052] Another example integrated isolated antenna array assembly of any of the foregoing assemblies is provided, wherein the interconnect substrate is a first interconnect substrate, the antenna array is a first antenna array, and the transceiver circuit is a first transceiver circuit. The example integrated isolated antenna array assembly further includes a second interconnect substrate, a second antenna array including one or more radiating elements, and a second transceiver circuit including one or more transceiver elements embedded in the interconnect substrate, wherein the second interconnect substrate, the second antenna array, and the second transceiver circuit are located on a side of the isolator opposite to the first interconnect substrate, the first antenna array, and the first transceiver circuit.

[0053] Another example integrated isolated antenna array assembly of any of the foregoing assemblies is provided, wherein the interconnect substrate is a first interconnect substrate and the antenna array is a first antenna array. The example integrated isolated antenna array assembly further includes a second interconnect substrate and a second antenna array including one or more radiating elements, wherein the second interconnect substrate and the second antenna array are located on a side of the isolator opposite to the first interconnect substrate and the first antenna array.

[0054] Another example integrated isolated antenna array assembly of any of the foregoing assemblies is provided, wherein radiating elements of the antenna array are formed as slot antennas in the isolator.

[0055] Another example integrated isolated antenna array assembly of any of the foregoing assemblies is provided, wherein the radiating elements of the antenna array include dipole antennas.

[0056] Another example integrated isolated antenna array assembly of any of the foregoing assemblies is provided, wherein the radiating elements of the antenna array include slot antennas.

[0057] Another example integrated isolated antenna array assembly of any of the foregoing assemblies is provided, wherein the radiating elements of the antenna array include patch antennas.

[0058] An example communication device includes two antennas operating within a first frequency range in the communication device and an integrated isolation antenna array assembly located between the two antennas in the communication device to reduce radio frequency coupling between the two antennas. The integrated isolation antenna array assembly includes an interconnect substrate and an antenna array adjacent to the interconnect substrate and including one or more radiating elements. The antenna array is configured to drive the one or more radiating elements within a second frequency range in the communication device. The second frequency range is higher than the first frequency range. The integrated isolation antenna array assembly further includes an isolator fixed to the interconnect substrate and configured to be connected to electrical ground. The isolator is configured to reduce radio frequency coupling between the two antennas within the first frequency range.

[0059] Another example communication device of any of the foregoing communication devices further comprises a transceiver circuit comprising one or more transceiver elements embedded in the interconnect substrate. Each transceiver element comprises an antenna feed connected through the interconnect substrate to drive a corresponding radiating element of the antenna array.

[0060] Another example communication device of any of the foregoing communication devices is provided, wherein the transceiver circuitry and the interconnect substrate are located between the isolator and the antenna array.

[0061] Another example communication device of any of the foregoing communication devices is provided, wherein the interconnect substrate is a first interconnect substrate, the antenna array is a first antenna array, and the transceiver circuit is a first transceiver circuit. The example communication device further includes a second interconnect substrate, a second antenna array including one or more radiating elements, and a second transceiver circuit including one or more transceiver elements embedded in the interconnect substrate, wherein the second interconnect substrate, the second antenna array, and the second transceiver circuit are located on a side of the isolator opposite to the first interconnect substrate, the first antenna array, and the first transceiver circuit.

[0062] Another example communication device of any of the aforementioned communication devices is provided, wherein the interconnect substrate is a first interconnect substrate and the antenna array is a first antenna array. The example communication device further includes a second interconnect substrate and a second antenna array including one or more radiating elements, wherein the second interconnect substrate and the second antenna array are located on a side of the isolator opposite to the first interconnect substrate and the first antenna array.

[0063] A further example communication device of any preceding communication device is provided, wherein the radiating elements of the antenna array are formed as slot antennas in the isolator.

[0064] A further example communication device of any preceding communication device is provided, wherein the radiating elements of the antenna array comprise dipole antennas.

[0065] A further example communication device of any preceding communication device is provided, wherein the radiating elements of the antenna array comprise slot antennas.

[0066] A further example communication device of any preceding communication device is provided, wherein the radiating elements of the antenna array comprise patch antennas.

[0067] An example method includes driving two antennas to radiate within a first frequency range in a communication device, reducing radio frequency coupling between the two driven antennas within the first frequency range using an isolator secured to an interconnect substrate of an integrated isolated antenna array assembly and connected to an electrical ground of the communication device, and driving one or more radiating elements of an antenna array of the integrated isolated antenna array assembly to radiate within a second frequency range in the communication device. The second frequency range is higher than the first frequency range.

[0068] Another example method of any of the foregoing methods is provided, wherein one or more radiating elements of the antenna array are formed as slot antennas in the isolator.

[0069] An example system includes means for driving two antennas to radiate within a first frequency range in a communication device, means for reducing radio frequency coupling between the two driven antennas within the first frequency range using an isolator secured to an interconnect substrate of an integrated isolated antenna array assembly and connected to an electrical ground of the communication device, and means for driving one or more radiating elements of an antenna array of the integrated isolated antenna array assembly to radiate within a second frequency range in the communication device. The second frequency range is higher than the first frequency range.

[0070] Another example system of any of the foregoing systems is provided, wherein one or more radiating elements of the antenna array are formed as slot antennas for use in a reduced device.

[0071] Several implementations of the described technology have been described. However, it should be understood that various modifications can be made without departing from the spirit and scope of the appended claims.

Claims

1. An integrated isolated antenna array assembly for use in a communication device, the communication device having a first antenna and a second antenna operating within a first frequency range in the communication device, the first antenna and the second antenna both being located near an edge of the communication device, the first antenna being located at one end of the communication device and the second antenna being located at another end of the communication device, the integrated isolated antenna array assembly being located between the first antenna and the second antenna and comprising: Interconnect substrate; an antenna array adjacent to the interconnect substrate and comprising one or more radiating elements; a transceiver circuit configured to drive the one or more radiating elements within a second frequency range, the second frequency range being higher than the first frequency range; as well as an isolator secured to the interconnect substrate and configured to be connected to electrical ground, the isolator configured to reduce radio frequency coupling between the first antenna and the second antenna within the first frequency range; The transceiver circuit is located in the interconnect substrate between the antenna array and the isolator, and the transceiver circuit is capacitively coupled or directly fed to the one or more radiating elements in the interconnect substrate.

2. The integrated isolation antenna array assembly of claim 1, further comprising: A transceiver circuit includes one or more transceiver elements embedded in the interconnect substrate, each transceiver element including an antenna feed connected through the interconnect substrate to drive a corresponding radiating element of the antenna array.

3. The integrated isolated antenna array assembly of claim 2, wherein the transceiver circuit and the interconnect substrate are located between the isolator and the antenna array.

4. The integrated isolated antenna array assembly of claim 2, wherein the interconnect substrate is a first interconnect substrate, the antenna array is a first antenna array, and the transceiver circuit is a first transceiver circuit, and the integrated isolated antenna array assembly further comprises: a second interconnect substrate; a second antenna array comprising one or more radiating elements; as well as A second transceiver circuit comprising one or more transceiver elements embedded in the interconnect substrate, wherein the second interconnect substrate, the second antenna array, and the second transceiver circuit are located on a side of the isolator opposite to the first interconnect substrate, the first antenna array, and the first transceiver circuit.

5. The integrated isolated antenna array assembly of claim 1, wherein the interconnect substrate is a first interconnect substrate and the antenna array is a first antenna array, and the integrated isolated antenna array assembly further comprises: a second interconnect substrate; as well as A second antenna array including one or more radiating elements, wherein the second interconnect substrate and the second antenna array are located on an opposite side of the isolator from the first interconnect substrate and the first antenna array.

6. The integrated isolated antenna array assembly of claim 1, wherein at least one of the one or more radiating elements of the antenna array is formed as a slot antenna in the isolator.

7. The integrated isolated antenna array assembly of claim 1, wherein at least one of the one or more radiating elements of the antenna array comprises a dipole antenna.

8. The integrated isolated antenna array assembly of claim 1, wherein at least one of the one or more radiating elements of the antenna array comprises a slot antenna.

9. The integrated isolated antenna array assembly of claim 1, wherein at least one of the one or more radiating elements of the antenna array comprises a patch antenna.

10. A communication device, comprising: a first antenna and a second antenna both located near an edge of the communication device, the first antenna being located at one end of the communication device and the second antenna being located at another end of the communication device, the first antenna and the second antenna operating within a first frequency range in the communication device; as well as An integrated isolation antenna array component, which is located between the first antenna and the second antenna in the communication device to reduce radio frequency coupling between the first antenna and the second antenna, the integrated isolation antenna array component comprising: Interconnect substrate; an antenna array adjacent to the interconnect substrate and comprising one or more radiating elements; a transceiver circuit configured to drive the one or more radiating elements within a second frequency range, the second frequency range being higher than the first frequency range; and an isolator secured to the interconnect substrate and configured to be connected to electrical ground, the isolator configured to reduce radio frequency coupling between the first antenna and the second antenna within the first frequency range; The transceiver circuit is located in the interconnect substrate between the antenna array and the isolator, and the transceiver circuit is capacitively coupled or directly fed to the one or more radiating elements in the interconnect substrate.

11. The communication device of claim 10, further comprising: A transceiver circuit includes one or more transceiver elements embedded in the interconnect substrate, each transceiver element including an antenna feed connected through the interconnect substrate to drive a corresponding radiating element of the antenna array.

12. The communication device of claim 11, wherein the transceiver circuitry and the interconnect substrate are located between the isolator and the antenna array.

13. The communication device of claim 11, wherein the interconnect substrate is a first interconnect substrate, the antenna array is a first antenna array, and the transceiver circuit is a first transceiver circuit, and the communication device further comprises: a second interconnect substrate; a second antenna array comprising one or more radiating elements; as well as A second transceiver circuit comprising one or more transceiver elements embedded in the interconnect substrate, wherein the second interconnect substrate, the second antenna array, and the second transceiver circuit are located on a side of the isolator opposite to the first interconnect substrate, the first antenna array, and the first transceiver circuit.

14. The communication device of claim 10, wherein the interconnect substrate is a first interconnect substrate and the antenna array is a first antenna array, and the communication device further comprises: a second interconnect substrate; as well as A second antenna array including one or more radiating elements, wherein the second interconnect substrate and the second antenna array are located on an opposite side of the isolator from the first interconnect substrate and the first antenna array.

15. The communication device of claim 10, wherein at least one of the one or more radiating elements of the antenna array is formed as a slot antenna in the isolator.

16. The communication device of claim 10, wherein at least one of the one or more radiating elements of the antenna array comprises a dipole antenna.

17. The communication device of claim 10, wherein at least one of the one or more radiating elements of the antenna array comprises a slot antenna.

18. The communication device of claim 10, wherein at least one of the one or more radiating elements of the antenna array comprises a patch antenna.

19. A method for a communication device, comprising: driving a first antenna and a second antenna both located near an edge of the communication device to radiate within a first frequency range in the communication device, wherein the first antenna is located at one end of the communication device and the second antenna is located at another end of the communication device; reducing radio frequency coupling between the driven first and second antennas within the first frequency range using an isolator secured to an interconnect substrate of an integrated isolated antenna array assembly between the first and second antennas and connected to an electrical ground of the communication device; as well as One or more radiating elements of the antenna array of the integrated isolated antenna array assembly are driven by a transceiver circuit in the interconnect substrate between the antenna array and the isolator, and the transceiver circuit is capacitively coupled or directly fed to the one or more radiating elements in the interconnect substrate.

20. The method of claim 19, wherein the one or more radiating elements of the antenna array are formed as slot antennas in the isolator.

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