Transfer apparatus capable of aligning a pattern, method of manufacturing a pattern substrate, and recording medium

Abstract

A transfer device capable of aligning a pattern, a method of manufacturing a pattern substrate, and a recording medium. The transfer device capable of aligning a pattern includes a first pressing unit that supports a mold in which a pattern is formed; a second pressing unit that supports a substrate in which a resin is formed; a mold jig that is partially open to expose a central portion of the mold toward the substrate and supports an edge portion of the mold; and a clamp that supports both side edges of the mold jig to fix the mold jig to the first pressing unit side, the clamp being formed with a lower side sliding member that supports the mold jig on the lower side and an upper side sliding member that supports the supported mold jig on the upper side. Either one of the first pressing unit and the second pressing unit is movable toward the other, so that the mold and the substrate are pressed against each other to pressurize each other to transfer the pattern formed in the mold to the resin formed in the substrate. The mold jig is slidably inserted between the upper side sliding member and the lower side sliding member to be supported by the clamp.

Description

[0001] This application is a divisional application of a patent application with the application date of May 27, 2021, the application number of 202110584900.5, and the invention name of "Transfer apparatus capable of aligning pattern, method of manufacturing pattern substrate, and recording medium". TECHNICAL FIELD

[0002] The present invention relates to a transfer apparatus capable of aligning a pattern. BACKGROUND

[0003] Recently, in a display process and a semiconductor process, in order to form a pattern (for example, a structured molding pattern and a mask pattern for etching or evaporation) on a surface of a substrate (for example, a display panel and a wafer, etc.), a nano imprint lithography process is used.

[0004] The nano imprint lithography process is a technology capable of economically and effectively manufacturing a nano-structure since it can replace an existing photo lithography process. Specifically, the nano imprint lithography process is a process of transferring a pattern to a resin by pressing a mold formed with a nano-scale pattern and a substrate formed with the resin to each other. Thus, the transfer apparatus used in the nano imprint lithography process performs a process of separating the mold from the substrate after pressing the mold to the substrate.

[0005] In transferring the pattern of the mold to the resin of the substrate, it is necessary to press the mold and the substrate to each other while being located at a predetermined right position. However, in a process of disposing the mold or the substrate to the transfer apparatus or moving the mold and the substrate to each other, the mold and the substrate can not be located at the right position due to various factors. Thus, if the mold and the substrate are pressed to each other while not being located at the right position, the pattern can not be transferred to the predetermined right position of the resin, and a pattern substrate having a poor performance can be manufactured.

[0006] Therefore, there is a need for an apparatus capable of aligning a horizontal position to locate the mold and the substrate at a right position before transferring the pattern of the mold to the resin of the substrate. SUMMARY

[0007] Embodiments of the present invention are invented in view of the above-described background, and an object thereof is to provide an apparatus capable of aligning a horizontal position to locate a mold and a substrate at a predetermined right position before transferring a pattern of the mold to a resin of the substrate.

[0008] Further, an object is to provide a device capable of transferring a pattern to a predetermined fixed position of a resin.

[0009] According to an aspect of the present application, a device capable of aligning a pattern can be provided, including: a first pressing unit supporting a mold in which a pattern and a positioning mark are formed; a second pressing unit supporting a substrate in which a resin and a positioning key are formed; and a photographing section recognizing the positioning mark and the positioning key, either of the first pressing unit and the second pressing unit moving toward the other, one or more of the first pressing unit and the second pressing unit moving and aligning a horizontal position of the mold and the substrate based on the positioning mark and the positioning key recognized by the photographing section, and causing the mold and the substrate aligned in the horizontal position to press each other, thereby pressing each other to transfer the pattern to the resin.

[0010] Further, a device capable of aligning a pattern can be provided, further including: a UV irradiation section disposed apart from the photographing section along a horizontal direction and for irradiating UV to the resin; and a driving section moving the photographing section and the UV irradiation section along the horizontal direction, the UV irradiation section configured to be movable along the horizontal direction between an irradiation position for irradiating UV to the resin and a non-irradiation position not irradiating UV, the photographing section configured to be movable along the horizontal direction between a photographing position for recognizing the positioning mark and the positioning key and a non-photographing position not recognizing the positioning mark and the positioning key, the driving section moving the photographing section between the photographing position and the non-photographing position and moving the UV irradiation section between the irradiation position and the non-irradiation position.

[0011] Further, a device capable of aligning a pattern can be provided, the driving section including: a support body supporting the photographing section and the UV irradiation section; and an actuator moving the support body along the horizontal direction to move the photographing section and the UV irradiation section together along the horizontal direction, the support body and the actuator moving the photographing section and the UV irradiation section such that the UV irradiation section is in the non-irradiation position when the photographing section is in the photographing position and the UV irradiation section is in the irradiation position when the photographing section is in the non-photographing position.

[0012] Further, a device capable of aligning a pattern can be provided, the actuator including a ball screw motor.

[0013] Further, a device capable of aligning a pattern can be provided, the photographing section configured to adjust one or more of a horizontal position, a vertical position, and an angle to direct a field of view toward a position in which the positioning mark and the positioning key are formed.

[0014] Further, a transfer device capable of aligning a pattern can be provided, the photographing section having a first focal length for recognizing the positioning mark and a second focal length for recognizing the positioning key, and being configured to change the focal length to the first focal length or the second focal length.

[0015] Further, a transfer device capable of aligning a pattern can be provided, the positioning mark including a first positioning mark and a second positioning mark, the positioning key including a first positioning key corresponding to the first positioning mark and a second positioning key corresponding to the second positioning mark, and the photographing section including a first photographing section for recognizing the first positioning mark and the first positioning key, and a second photographing section for recognizing the second positioning mark and the second positioning key.

[0016] Further, a transfer device capable of aligning a pattern can be provided, the second pressing unit including a substrate placing section for placing the substrate, and a position adjusting section for adjusting a horizontal position of the substrate placing section.

[0017] Further, a transfer device capable of aligning a pattern can be provided, the second pressing unit further including a lifting section for lifting the position adjusting section.

[0018] Further, a transfer device capable of aligning a pattern can be provided, the position adjusting section including one or more of a first adjusting section for moving the substrate placing section in a front-rear direction in order to adjust the horizontal position of the substrate placing section, a second adjusting section for moving the substrate placing section in a left-right direction, and a rotating section for rotating the substrate placing section.

[0019] Further, a transfer device capable of aligning a pattern can be provided, the first pressing unit further including a mold support member for supporting the mold, and a support member moving section for moving the center position of the mold by moving the mold support member in a horizontal direction.

[0020] Further, a transfer device capable of aligning a pattern can be provided, including: a first pressing unit supporting a mold in which a pattern is formed; a second pressing unit supporting a substrate in which a resin is formed; a mold jig partially opened to expose a central portion of the mold toward the substrate and supporting an edge portion of the mold; and a clamp supporting both side edges of the mold jig to fix the mold jig to the first pressing unit side, the clamp being formed with a lower side sliding member supporting the mold jig at a lower side and an upper side sliding member supporting the mold jig supported at an upper side, either one of the first pressing unit and the second pressing unit being movable toward the other to press the mold and the substrate against each other to pressurize each other to transfer a pattern formed in the mold to a resin formed in the substrate, the mold jig being slidably inserted between the upper side sliding member and the lower side sliding member to be supported by the clamp.

[0021] Further, a transfer device capable of aligning a pattern can be provided, including: a first pressing unit supporting a mold in which a pattern is formed; and a second pressing unit supporting a substrate in which a resin is formed, either one of the first pressing unit and the second pressing unit being movable toward the other to press the mold and the substrate against each other to pressurize each other to transfer a pattern formed in the mold to a resin formed in the substrate, the first pressing unit including: a UV transmission window supporting the mold and allowing UV to be transmitted; a sealing portion protruding in a ring shape and contacting the mold jig at a lower side to seal a space around the UV transmission window from the outside; and a first exhaust portion for exhausting gas remaining in a space sealed inside the sealing portion to the outside when the sealing portion seals the space around the UV transmission window from the outside.

[0022] Further, a transfer device capable of aligning a pattern can be provided, the second pressing unit including: a bellows extending and contracting toward the first pressing unit when the mold and the substrate are pressed to seal a space around the substrate from the outside; and a second exhaust portion for exhausting gas remaining in a space sealed inside the bellows to the outside when the bellows seals the space around the substrate from the outside, the first exhaust portion and the second exhaust portion performing work to prevent a difference between a gas pressure inside the sealing portion and a gas pressure inside the bellows from exceeding a predetermined range.

[0023] Further, a pattern alignable transfer device can be provided, the pattern alignable transfer device further comprising a mold jig that exposes a center portion of the mold and supports an edge portion of the mold, and a clamp that supports an edge of the mold jig to fix the mold jig to the first pressing unit side.

[0024] Further, a pattern alignable transfer device can be provided, the first pressing unit comprising a sealing member between the sealed portion and the mold jig to shut off gas flow between the sealed portion and the mold jig.

[0025] Further, a pattern alignable transfer device can be provided, the second pressing unit comprising a substrate placement portion to place the substrate, and a position adjustment portion to adjust a horizontal position of the substrate placement portion on which the substrate is placed, the pattern alignable transfer device further comprising a control portion to perform control for operations of the first pressing unit, the second pressing unit, the photographing portion, and the position adjustment portion.

[0026] Further, a pattern alignable transfer device can be provided, the control portion controls either of the first pressing unit and the second pressing unit to move toward the other, controls the photographing portion to recognize the positioning mark and the positioning key, and controls the position adjustment portion to adjust the horizontal position of the substrate placement portion.

[0027] Further, a pattern alignable transfer device can be provided, comprising a UV irradiation portion disposed apart from the photographing portion along a horizontal direction and to irradiate UV to the resin, and a drive portion to move the photographing portion and the UV irradiation portion along the horizontal direction, the UV irradiation portion configured to be movable along the horizontal direction between an irradiation position to irradiate UV to the resin and a non-irradiation position not to irradiate UV, the photographing portion configured to be movable along the horizontal direction between a photographing position to recognize the positioning mark and the positioning key and a non-photographing position not to recognize the positioning mark and the positioning key, the drive portion moves the photographing portion between the photographing position and the non-photographing position and moves the UV irradiation portion between the irradiation position and the non-irradiation position, and the control portion controls the drive portion such that the UV irradiation portion is at the irradiation position to irradiate UV to the resin and controls the drive portion such that the photographing portion is at the photographing position to recognize the positioning mark and the positioning key.

[0028] Further, a transfer device capable of aligning a pattern can be provided, the adjustment section includes one or more of a first adjustment section that moves the substrate placement section in a front-rear direction in order to adjust a horizontal position of the substrate placement section, a second adjustment section that moves the substrate placement section in a left-right direction, and a rotation section that rotates the substrate placement section, and the control section controls one or more of the first adjustment section, the second adjustment section, and the rotation section in order to adjust the horizontal position of the substrate.

[0029] Further, a transfer device capable of aligning a pattern can be provided, the second pressing unit includes a lifting section that lifts the adjustment section, and the control section controls the lifting section, the adjustment section, and the photographing section so that the photographing section recognizes the positioning mark and the positioning key when the substrate is lifted by a predetermined distance by the lifting section, the adjustment section adjusts the horizontal position of the substrate placement section, and the photographing section re-recognizes the positioning mark and the positioning key when the substrate is lifted by more than the predetermined distance by the lifting section, and the adjustment section re-adjusts the horizontal position of the substrate placement section.

[0030] Further, a method of manufacturing a pattern substrate can be provided, a mold on which a pattern and a positioning mark are formed is pressed against a substrate on which a resin and a positioning key are formed to manufacture a pattern substrate, and the method of manufacturing a pattern substrate includes a photographing step in which a photographing section photographs the positioning mark formed on the mold and the positioning key formed on the substrate, an adjustment step in which an adjustment section adjusts a horizontal position of the substrate, a substrate pressing step in which the mold is pressed against the substrate, and a substrate separation step in which the mold is separated from the substrate.

[0031] Further, a method of manufacturing a pattern substrate can be provided, and the method further includes a lifting step in which a lifting section lifts the adjustment section, the lifting step, the photographing step, and the adjustment step are performed a plurality of times, the photographing step and the adjustment step are performed when the substrate is lifted by a predetermined distance by the lifting step, and the photographing step and the adjustment step are performed again when the substrate is lifted by more than the predetermined distance by the lifting step.

[0032] Further, a method of manufacturing a pattern substrate can be provided, and the method further includes a mold horizontal movement step in which a center position of a mold support member that supports the mold is moved in a horizontal direction before the photographing step.

[0033] Further, there can be provided a method of manufacturing a pattern substrate, further comprising: a UV irradiation step of irradiating UV to the resin; a camera moving step of moving the camera to a photographing position for recognizing the positioning mark and the positioning key before the photographing step; and a UV irradiation unit moving step of moving the UV irradiation unit to an irradiation position for irradiating UV to the resin after the substrate pressing step.

[0034] Further, there can be provided a method of manufacturing a pattern substrate, further comprising: a sealing step of sealing a space around the substrate with respect to the outside and discharging gas remaining in the space around the substrate to the outside before the substrate pressing step and after the positioning step; and a sealing release step of releasing the space around the substrate with respect to the outside by flowing gas into the space around the substrate after the substrate pressing step.

[0035] Further, there can be provided a method of manufacturing a pattern substrate, further comprising: a clamp fixing step of fixing a mold clamp in which the mold is installed to the first pressing unit side with a clamp before the photographing step; and a clamp release step of releasing the clamp fixing the mold clamp in which the mold is installed after the substrate pressing step and the substrate separating step.

[0036] Further, there can be provided a computer-readable recording medium storing a computer program for executing a method of pressing a mold in which a pattern and a positioning mark are formed and a substrate in which a resin and a positioning key are formed to manufacture a pattern substrate, wherein the computer program is programmed to execute: a storing step of storing image information of the positioning mark and the positioning key photographed by a camera in the computer-readable recording medium; a calculating step of calculating position information of the positioning mark and the positioning key based on the image information stored in the computer-readable recording medium; and an outputting step of outputting a command for adjusting a position of the mold or the substrate based on the calculated position information.

[0037] Further, there can be provided a computer-readable recording medium, wherein the outputting step is executed to first determine whether the mold and the substrate are positioned at a predetermined fixed position based on the calculated position information for the positioning mark and the calculated position information for the positioning key.

[0038] According to an embodiment of the present invention, there is an effect that the mold and the substrate can be positioned at a predetermined fixed position by aligning a horizontal position before transferring a pattern of the mold to a resin of the substrate.

[0039] Further, there is an effect that a pattern can be transferred to a predetermined fixed position of a resin. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 is a perspective view of a transfer device capable of aligning a pattern according to an embodiment of the present application.

[0041] Figure 2 is a plan view of a mold of Figure 1

[0042] Figure 3 is a plan view of a substrate of Figure 1

[0043] Figure 4 is a view showing a positioning mark and a positioning key when a mold and a substrate are not positioned at a fixed position.

[0044] Figure 5 is a view showing a positioning mark and a positioning key when a mold and a substrate are positioned at a fixed position.

[0045] Figure 6 is a sectional view taken along A-A' of Figure 1

[0046] Figure 7 is a sectional view taken along A-A' of Figure 1

[0047] Figure 8 is an enlarged view of B of Figure 6

[0048] Figure 9 is a perspective view of a photographing portion of Figure 1

[0049] Figure 10 is a view showing a pattern of a mold sequentially transferred to a substrate partially in order. In addition, (a) is a view showing a pattern before a mold support moves, and (b) is a view showing a pattern in which a pattern is transferred to a substrate after the mold support moves in a direction of movement of the mold support.

[0050] Figure 11 is a view showing a pattern of a mold sequentially transferred to a plurality of substrates one by one. In addition, (a) is a view showing a pattern before a mold support moves, and (b) is a view showing a pattern in which a pattern is transferred to a substrate after the mold support moves in a direction of movement of the mold support.

[0051] Figure 12 is an exploded perspective view of Figure 1

[0052] Figure 13 is a lower exploded perspective view of Figure 2 ​​​​​​​​

[0053] Figure 14 is Figure 1 a front view.

[0054] Figure 15 is a flowchart schematically showing a method of manufacturing a pattern substrate according to an embodiment of the present application.

[0055] (Explanation of Reference Numerals)

[0056] 1: transfer device capable of aligning a pattern 10: mold

[0057] 11: positioning mark 11a: first positioning mark

[0058] 11b: second positioning mark 20: substrate

[0059] 21: positioning key 21a: first positioning key

[0060] 21b: second positioning key 100: first pressing unit

[0061] 111: mold clamp 112: clamp

[0062] 120: UV-transmitting window 130: closed portion

[0063] 140: first exhaust portion 150: sealing member

[0064] 200: second pressing unit 210: substrate placement portion

[0065] 220: adjustment portion 221: first adjustment portion

[0066] 222: second adjustment portion 223: rotation portion

[0067] 230: elevation portion 240: bellows

[0068] 250: second exhaust portion 300: imaging portion

[0069] 310: first imaging portion 320: second imaging portion

[0070] 400: UV irradiation portion 500: drive portion

[0071] 510: support body 520: actuator

[0072] 600: control portion DETAILED DESCRIPTION

[0073] Hereinafter, specific embodiments for implementing the technical idea of the present application will be described in detail with reference to the accompanying drawings.

[0074] Also, in explaining the present application, when it is judged that specific explanation about a related known structure or function can cause the gist of the present application to be obscure, detailed explanation thereof is omitted.

[0075] Also, when referring to a certain constituent element being "supported", "flowed into", "discharged", "fixed" by another constituent element, it can be directly supported, flowed into, discharged, fixed by the other constituent element, but it is understood that another constituent element can exist in the middle.

[0076] The terms used in the present specification are only used to explain specific embodiments, and are not intended to limit the present application. The singular expression includes the plural expression, unless it is clearly different in the context.

[0077] Also, the terms including ordinal numbers such as first, second, etc. can be used in the explanation of various constituent elements, but the corresponding constituent elements are not limited to such terms. The terms are used only for the purpose of distinguishing one constituent element from other constituent elements.

[0078] The meaning of "include" used in the specification is to specify a certain characteristic, area, integer, step, action, factor, and / or component, and does not exclude the presence or addition of other specific characteristics, areas, integers, steps, actions, factors, components, and / or groups.

[0079] Also, it is previously clear that, in the present specification, the expressions of upper side, lower side, lower surface, etc. are explained based on the illustration in the drawings, and can be differently expressed if the direction of the corresponding object is changed. On the other hand, in the present specification, the left-right direction can be the x-axis direction (x1 is the right side, and x2 is the left side) of Figure 1 and Figure 14 the y-axis direction (y1 is the front side, and y2 is the rear side). Also, the up-down direction can be the z-axis direction (z1 is the upper side, and z2 is the lower side) of Figure 1 , Figure 6 and Figure 7 the y-axis direction (y1 is the front side, and y2 is the rear side). Also, the up-down direction can be the z-axis direction (z1 is the upper side, and z2 is the lower side) of Figure 1 , Figure 6 , Figure 7 and Figure 14 the y-axis direction (y1 is the front side, and y2 is the rear side). Also, the up-down direction can be the z-axis direction (z1 is the upper side, and z2 is the lower side) of Figure 1 the z-axis direction as the center axis. Also, the horizontal direction can be one or a combination of the x-axis direction and the y-axis direction. Also, the horizontal position can be a position on the virtual upper surface of the x-axis direction and the y-axis direction. Also, the vertical direction can be the z-axis direction. Also, the vertical position can be a position on the virtual straight line of the z-axis direction.

[0080] Hereinafter, referring to the drawings, the detailed structure of a transfer device 1 capable of aligning a pattern according to an embodiment of the present application will be explained.

[0081] Hereinafter, referring to Figure 1 The transfer device 1 capable of aligning a pattern according to an embodiment of the present application can press the mold 10 and the substrate 20 against each other, thereby pressing each other to transfer the pattern formed in the mold 10 to the resin formed in the substrate 20.

[0082] Referring to Figure 2 A pattern (not shown) to be transferred to the resin of the substrate 20 can be formed on one side of the mold 10. In addition, a positioning mark 11 to be a reference for alignment so that the mold 10 and the substrate 20 are positioned at a predetermined fixed position can be formed in the mold 10. In addition, when the mold 10 is configured so that the pattern faces the lower side, the positioning mark 11 can be formed at the upper side than the pattern. In addition, the mold 10 can be a transparent hard material. For example, it can be any one of quartz, glass, and sapphire. As such, the mold 10 is provided to be transparent, so that the positioning key 21 can be recognized by the photographing part 300 to be described later through the mold 10. As such, the positioning mark 11 can be provided in a plurality in the mold 10.

[0083] Referring to Figure 3 The resin to be transferred to the pattern can be formed on one side of the substrate 20. As such, the resin can be formed by coating on the surface of the substrate 20. In addition, in the substrate 20, a positioning key 21 to be a reference for alignment so that the substrate 20 and the mold 10 are positioned at a predetermined fixed position can be formed at a position corresponding to a position where the positioning mark 11 is formed. In addition, when the substrate 20 is configured so that the resin faces the upper side, the positioning key 21 can be formed at the lower side than the resin. In addition, the resin can be transparent at least before ultraviolet rays (UV) are irradiated. As such, by providing the resin to be transparent, the positioning key 21 can be recognized by the photographing part 300 to be described later through the resin. As such, the positioning key 21 can be provided in a plurality in the substrate 20.

[0084] Referring to Figure 4 The positioning mark 11 and the positioning key 21 can be formed in a pattern corresponding to each other. For example, the positioning mark 11 can be formed in a shape of a cross. In addition, when viewed from the upper side, the positioning key 21 can be formed in a shape in which a plurality of quadrilaterals are arranged to form a space in which the positioning mark 11 can be positioned inside.

[0085] The positioning mark 11 and the positioning key 21 can be a reference for whether the mold 10 and the substrate 20 are positioned at a fixed position. For example, if at least a part of the positioning mark 11 overlaps the positioning key 21, or is not adjacent to the positioning key 21, the mold 10 and the substrate 20 can not be in the fixed position (refer to Figure 4). As another example, when the positioning marks 11 are positioned in matching relation between the positioning keys 21, the mold 10 and the substrate 20 can be in a fixed position (refer to Figure 5 ).

[0086] On the other hand, the meaning of transferring the mold 10 to the substrate 20 can be the meaning of transferring the pattern formed in the mold 10 to the resin formed in the substrate 20. In addition, the meaning of transferring the pattern to the resin can be the meaning of transferring the pattern formed in the mold 10 to the resin formed in the substrate 20.

[0087] Referring again to Figure 1 , the pattern alignable transfer device 1 can support the mold 10 and the substrate 20. In addition, the pattern alignable transfer device 1 can press the mold 10 and the substrate 20 against each other, thereby pressing each other to transfer the pattern to the resin. In addition, the pattern alignable transfer device 1 can align the horizontal position to locate the mold 10 and the substrate 20 in a fixed position before transferring the pattern to the resin. That is, the pattern alignable transfer device 1 can align the horizontal position to accurately transfer the pattern to the fixed position of the resin. Here, the fixed position can mean the horizontal position of the mold 10 and the substrate 20 in a state where the positioning marks 11 are configured to match between the positioning keys 21 when the mold 10 and the substrate 20 are viewed from the upper side.

[0088] As such, the pattern alignable transfer device 1 has an effect of being able to align the horizontal position to locate the mold 10 and the substrate 20 in a predetermined fixed position before transferring the pattern of the mold 10 to the resin of the substrate 20. In addition, it has an effect of being able to accurately transfer the pattern to the predetermined fixed position of the resin.

[0089] Referring to Figure 1 , Figure 6 and Figure 7 , the pattern alignable transfer device 1 can include a first pressing unit 100, a second pressing unit 200, a photographing part 300, a UV irradiation part 400, and a driving part 500.

[0090] The first pressing unit 100 can support the mold 10.

[0091] The second pressing unit 200 can support the substrate 20.

[0092] Either one of the first pressing unit 100 and the second pressing unit 200 can move toward the other. That is, either one of the first pressing unit 100 and the second pressing unit 200 can move in a vertical direction. Also, one or more of the first pressing unit 100 and the second pressing unit 200 can align a horizontal position based on the positioning mark 11 and the positioning key 21 moving along a horizontal direction so that the mold 10 and the substrate 20 are located at a fixed position. Also, one or more of the first pressing unit 100 and the second pressing unit 200 can be raised and lowered so that the mold 10 and the substrate 20 aligned at the horizontal position are pressed against each other, thereby being pressed against each other to accurately transfer a pattern to the resin at the fixed position.

[0093] The photographing part 300 can recognize the positioning mark 11 of the mold 10 and the positioning key 21 of the substrate 20. For example, the photographing part 300 can be a camera photographing the positioning mark 11 and the positioning key 21. Also, the photographing part 300 can recognize the positioning key 21 through the resin of the mold 10 and the substrate 20. Also, the photographing part 300 can recognize the positioning mark 11 and the positioning key 21 at the same time, or recognize either one of the positioning mark 11 and the positioning key 21 first and recognize the other based on this. Thus, the error for the fixed position between the positioning mark 11 and the positioning key 21 can be confirmed by recognizing the positions of the positioning mark 11 and the positioning key 21 through the photographing part 300. As such, the photographing part 300 can move along a horizontal direction between a photographing position and a non-photographing position in order to recognize the positioning mark 11 and the positioning key 21. For example, the photographing part 300 can move to the photographing position for recognizing the positioning mark 11 and the positioning key 21. Here, as shown in FIG. 2A, the photographing position can mean that the photographing part 300 is disposed at a predetermined position on the upper side of the mold 10 and the substrate 20 in order to recognize the positioning mark 11 and the positioning key 21. Figure 6 As another example, the photographing part 300 can move to the non-photographing position not recognizing the positioning mark 11 and the positioning key 21. Here, as shown in FIG. 2B, the non-photographing position can mean that the photographing part 300 is disposed at a predetermined position on the upper side of the mold 10 and the substrate 20 along the horizontal direction in order not to recognize the positioning mark 11 and the positioning key 21. That is, the non-photographing position can mean that it is disposed apart from the photographing position along the horizontal direction. Figure 7 As another example, the photographing part 300 can move to the non-photographing position not recognizing the positioning mark 11 and the positioning key 21. Here, as shown in FIG. 2B, the non-photographing position can mean that the photographing part 300 is disposed at a predetermined position on the upper side of the mold 10 and the substrate 20 along the horizontal direction in order not to recognize the positioning mark 11 and the positioning key 21. That is, the non-photographing position can mean that it is disposed apart from the photographing position along the horizontal direction.

[0094] The UV irradiation part 400 can irradiate UV to the resin in order to harden the resin formed on the substrate 20. As such, the UV irradiation part 400 can move along a horizontal direction between an irradiation position and a non-irradiation position in order to irradiate UV to the resin. For example, the UV irradiation part 400 can move to the irradiation position for irradiating UV to the resin. Here, as shown in FIG. 3A, the irradiation position can mean that the UV irradiation part 400 is disposed at a predetermined position on the upper side of the mold 10 and the substrate 20 in order to irradiate UV to the resin. Figure 7As shown, the irradiation position can mean that the UV irradiation section 400 is disposed at a predetermined position on the upper side of the mold 10 and the substrate 20 in order to irradiate UV to the resin. At this time, the second pressing unit 200 can be in a state of rising toward the first pressing unit 100. As another example, the UV irradiation section 400 can be moved to a non-irradiation position for not irradiating UV. Here, as shown in FIG. 2B, the non-irradiation position can mean that the UV irradiation section 400 is disposed by being moved in the horizontal direction from the irradiation position, that is, the predetermined position on the upper side of the mold 10 and the substrate 20, in order not to irradiate UV to the resin. That is, the non-irradiation position can mean being disposed apart in the horizontal direction from the irradiation position. Figure 6 As shown, the non-irradiation position can mean that the UV irradiation section 400 is disposed by being moved in the horizontal direction from the irradiation position, that is, the predetermined position on the upper side of the mold 10 and the substrate 20, in order not to irradiate UV to the resin. That is, the non-irradiation position can mean being disposed apart in the horizontal direction from the irradiation position.

[0095] The photographing section 300 and the UV irradiation section 400 can be disposed apart in the horizontal direction. In addition, the photographing section 300 and the UV irradiation section 400 can be located on the upper side of the first pressing unit 100.

[0096] Referring to FIGS. 1A and 1B, Figure 6 and Figure 7 The driving section 500 can move the photographing section 300 in the horizontal direction between the photographing position and the non-photographing position. In addition, the driving section 500 can move the UV irradiation section 400 in the horizontal direction between the irradiation position and the non-irradiation position.

[0097] The driving section 500 can include a support body 510 and an actuator 520.

[0098] The support body 510 can support the photographing section 300 and the UV irradiation section 400. Thus, the support body 510 can be configured such that, if the support body 510 moves in the horizontal direction, the photographing section 300 and the UV irradiation section 400 move together in the horizontal direction.

[0099] The actuator 520 can move the photographing section 300 and the UV irradiation section 400 together in the horizontal direction by moving the support body 510 in the horizontal direction. For example, the support body 510 and the actuator 520 can move the photographing section 300 to the photographing position to allow the photographing section 300 to recognize the positioning mark 11 and the positioning key 21. At this time, the support body 510 and the actuator 520 can move the UV irradiation section 400 to the non-irradiation position. As another example, the support body 510 and the actuator 520 can move the UV irradiation section 400 to the irradiation position to allow the UV irradiation section 400 to irradiate UV to the resin. At this time, the support body 510 and the actuator 520 can move the photographing section 300 to the non-photographing position.

[0100] The actuator 520 can include a ball screw motor, and the support body 510 can move in the horizontal direction by driving of the ball screw motor.

[0101] In order for the photographing section 300 and the UV irradiation section 400 to operate smoothly, it is necessary to arrange the photographing section 300 and the UV irradiation section 400 at predetermined positions on the upper side of the mold 10 and the substrate 20. However, due to the areas occupied by the photographing section 300 and the UV irradiation section 400, there is a problem in that the photographing section 300 and the UV irradiation section 400 cannot be arranged at the predetermined positions on the upper side of the mold 10 and the substrate 20 at the same time. Therefore, the driving section 500 selectively moves the photographing section 300 to a photographing position or moves the UV irradiation section 400 to an irradiation position, and can operate in a state of being arranged at the predetermined positions on the upper side of the mold 10 and the substrate 20, respectively.

[0102] Thus, the driving section 500 selectively moves the photographing section 300 to a photographing position or moves the UV irradiation section 400 to an irradiation position, and can operate in a state of being arranged at the predetermined positions on the upper side of the mold 10 and the substrate 20, respectively, without interfering with each other.

[0103] Reference Figure 9 The photographing section 300 can be configured to recognize the positioning mark 11 and the positioning key 21 at the photographing position, and can adjust the photographing position. Such a photographing section 300 can be configured to adjust one or more of a horizontal position, a vertical position, and an angle so that the positions at which the positioning mark 11 and the positioning key 21 are formed belong to a field of view angle. In addition, the distance between the first photographing section 310 and the second photographing section 320 described later can be configured to be shorter than the distance between the first positioning mark 11a and the second positioning mark 11b.

[0104] The photographing section 300 can have a focal length for recognizing the positioning mark 11 of the mold 10 or the positioning key 21 of the substrate 20. Thus, the focal length can include a first focal length for recognizing the positioning mark 11 and a second focal length for recognizing the positioning key 21. In addition, the focal length of the photographing section 300 can be configured to be changeable from one of the first focal length and the second focal length to the other. For example, the focal length of the photographing section 300 can be configured to be changed from the first focal length to the second focal length after recognizing the positioning mark 11 in order to recognize the positioning key 21.

[0105] Referring again to Figure 2 and Figure 3 The positioning mark 11 can include a first positioning mark 11a and a second positioning mark 11b disposed apart from the first positioning mark 11a. In addition, the positioning key 21 can include a first positioning key 21a corresponding to the first positioning mark 11a and a second positioning key 21b corresponding to the second positioning mark 11b.

[0106] Thus, the photographing section 300 can include a first photographing section 310 and a second photographing section 320 to correspond to a plurality of positioning marks 11 and positioning keys 21.

[0107] The first photographing unit 310 can recognize the first positioning mark 11a and the first positioning key 21a.

[0108] The second photographing unit 320 can recognize the second positioning mark 11b and the second positioning key 21b.

[0109] In this way, the first photographing unit 310 and the second photographing unit 320 recognize the relative positions between the first positioning mark 11a and the first positioning key 21a and between the second positioning mark 11b and the second positioning key 21b, respectively, thereby having an effect that the first photographing unit 310 and the second photographing unit 320 complementarily recognize the positions and can more accurately recognize whether the mold 10 and the substrate 20 are positioned at the fixed positions.

[0110] Referring to Figure 6 , the second pressing unit 200 can include a substrate placing portion 210, a positioning portion 220, and a lifting portion 230.

[0111] The substrate placing portion 210 can provide a portion for placing the substrate 20.

[0112] Referring to Figure 6 and Figure 7 , the lifting portion 230 can lift the substrate placing portion 210. That is, the lifting portion 230 can move the substrate placing portion 210 in the vertical direction. In this way, the lifting portion 230 can move the substrate 20 toward or away from the first pressing unit 100 by lifting the substrate placing portion 210. In this way, the lifting portion 230 can press the substrate 20 against the mold 10 by moving the substrate 20 toward the first pressing unit 100.

[0113] The positioning portion 220 can adjust the horizontal position of the substrate placing portion 210. For example, the positioning portion 220 can move the substrate placing portion 210 in the front-rear and left-right directions (horizontal directions) and can rotate the substrate placing portion 210. In this way, the positioning portion 220 can align the mold 10 and the substrate 20 to be positioned at the fixed positions by adjusting the position of the substrate placing portion 210. In addition, the positioning portion 220 can be positioned at the upper side of the lifting portion 230 and be lifted by the lifting portion 230. In this way, the positioning portion 220 can include a first adjustment portion 221, a second adjustment portion 222, and a rotating portion 223.

[0114] The first adjustment portion 221 can move the substrate placing portion 210 in the front-rear direction (y-axis direction) in order to adjust the horizontal position of the substrate placing portion 210. In other words, the first adjustment portion 221 can move the substrate 20 in the front-rear direction by moving the substrate placing portion 210 in the front-rear direction.

[0115] The second adjustment section 222 can move the substrate placement section 210 in the left-right direction (x-axis direction) in order to adjust the horizontal position of the substrate placement section 210. In other words, the second adjustment section 222 can move the substrate 20 in the left-right direction by moving the substrate placement section 210 in the left-right direction. In this way, the second adjustment section 222 can be provided above the first adjustment section 221 to move the first adjustment section 221 in the left-right direction in order to move the substrate placement section 210 in the left-right direction.

[0116] The rotation section 223 can rotate the substrate placement section 210 in order to adjust the relative angle of the substrate 20 and the mold 10. In other words, the rotation section 223 can adjust the angle of the substrate 20 with respect to the mold 10 by rotating the substrate placement section 210.

[0117] In this way, the positioning section 220 can be an alignment stage. For example, the positioning section 220 can be an xyθ stage that forms movement work in the x-axis direction, y-axis direction, and θ-axis direction by independent work of a plurality of modules (i.e., movement work in the x-axis direction, y-axis direction, and θ-axis direction is formed by independent work of each module that moves in the x-axis direction, y-axis direction, and θ-axis direction). As another example, the positioning section 220 can be an uvw stage that forms movement work in the x direction, Y direction, and θ direction by cooperative work of a plurality of modules (i.e., movement work in the x direction, Y direction, and θ direction is formed by work combination of each module that moves in the u-axis, v-axis, and w-axis).

[0118] In this way, the positioning section 220 is able to have an effect of aligning the mold 10 and the substrate 20 to be located at fixed positions based on the positioning mark 11 and the positioning key 21 adjusting the horizontal position of the substrate placement section 210.

[0119] On the other hand, the first pressing unit 100 can include a mold support (not shown) and a support movement section (not shown).

[0120] The mold support can be provided in order to support the mold 10.

[0121] The support movement section can move the mold support in the horizontal direction so that the center position of the mold 10 is moved in the horizontal direction. For example, when the substrate 20 has a relatively larger area than the mold 10, the support movement section can move the mold support to move the mold 10 from one point to another point on the upper side of the substrate 20 to sequentially transfer the pattern of the mold 10 to the substrate 20 having a larger area than the mold 10 in part (see FIG. 1). Figure 10 As another example, when a plurality of substrates 20 are placed in the substrate placement section 210, the support movement section can move the mold support to move the mold 10 from the upper side of any one of the plurality of substrates 20 to the upper side of another one to sequentially transfer the pattern of the mold 10 to the plurality of substrates 20 one by one (see FIG. 1).Figure 11 ).

[0122] Referring to Figure 12 and Figure 13 , the transfer device 1 capable of aligning the pattern can include a mold clamp 111 and a clamp 112.

[0123] The mold clamp 111 can support the mold 10. Also, the mold clamp 111 can be partially open to expose a central portion of the mold 10 toward the substrate 20. At this time, the central portion of the mold 10 exposed by the mold clamp 111 can mean a portion of the mold 10 in which the pattern is formed or a portion of the mold 10 supported by the UV transmission window 120 described later. Also, the mold clamp 111 can support an edge portion of the mold 10. Accordingly, the mold clamp 111 can fix and support the mold 10 by exposing the central portion of the mold 10 and supporting the edge of the mold 10. Such a mold clamp 111 can be supported by the clamp 112 by being slidably inserted between the upper and lower slide members described later.

[0124] The clamp 112 can support the edge of the mold clamp 111 and fix the mold clamp 111 to the first pressing unit 100 side. Also, the clamp 112 can include a lower slide member supporting the mold clamp 111 below and an upper slide member supporting the mold clamp 111 to be supported above. The mold clamp 111 can be inserted between such a lower and upper slide member.

[0125] On the other hand, there is a problem that the mold 10 is bent if either of the upper and lower pressures applied to the mold 10 becomes higher than a predetermined range.

[0126] Referring to Figure 6 to Figure 8 , the first pressing unit 100 can include a UV transmission window 120, a sealing portion 130, a first exhaust portion 140, and a sealing member 150.

[0127] Referring to Figure 7 , the UV transmission window 120 can be configured to transmit UV irradiated from the UV irradiation portion 400. Thus, the lower surface of the UV transmission window 120 can support the mold 10. Also, the UV transmission window 120 can be surrounded by the sealing portion 130 to be cut off from the outside.

[0128] Referring to Figure 8The sealing portion 130 can seal the space around the UV transmission window 120 with respect to the outside. In other words, the sealing portion 130 is provided to surround the UV transmission window 120, so that the UV transmission window 120 can be cut off from the outside. As such, the lower portion of the sealing portion 130 can be in contact with the mold clamp 111. For example, the sealing portion 130 can be a ring shape protruding to be in contact with the mold clamp 111. In addition, the sealing portion 130 can be provided to be spaced apart from the UV transmission window 120 by a portion of the sealing portion 130. In other words, a predetermined spaced apart space S can be formed between the sealing portion 130 and the UV transmission window 120. As such, the spaced apart space S can be in communication with the first exhaust portion 140. In addition, the gas remaining in the inside of the spaced apart space S can be exhausted to the outside through the first exhaust portion 140. Accordingly, the spaced apart space S can be in a vacuum state.

[0129] The first exhaust portion 140 can exhaust the gas between the UV transmission window 120 and the sealing portion 130 to the outside. In other words, when the sealing portion 130 seals the space around the UV transmission window 120 with respect to the outside, the first exhaust portion 140 can exhaust the gas remaining in the inside of the spaced apart space S to the outside. As such, the first exhaust portion 140 can include a nozzle exposed to the inner circumferential surface of the sealing portion 130.

[0130] Referring to Figure 8 The lower end of the sealing portion 130 is in contact with the mold clamp 111 to seal the spaced apart space S. At this time, the sealing member 150 can cut off the inflow of the gas between the mold clamp 111 and the sealing portion 130. As such, the sealing member 150 can be positioned between the mold clamp 111 and the sealing portion 130. For example, the sealing member 150 can include an elastic ring inserted into a groove formed in the lower portion of the sealing portion 130.

[0131] Referring to Figure 12 to Figure 14 The second pressing unit 200 can include a bellows 240 and a second exhaust portion 250.

[0132] The bellows 240 can be configured to seal the space around the substrate 20 with respect to the outside. In other words, the bellows 240 can seal the space around the substrate 20 with respect to the outside by elongation. In addition, the bellows 240 can have a plurality of folding portions in order to be expanded and contracted toward the first pressing unit 100 when pressing the mold 10 and the substrate 20. As such, the bellows 240 can be provided such that one end portion is supported by the substrate seating portion 210 and the other end portion can be expanded and contracted toward the first pressing unit 100. For example, the bellows 240 can be elongated toward the first pressing unit 100, and at this time, the end portion of the bellows 240 can be in contact with the first pressing unit 100. As such, the bellows 240 is in contact with the first pressing unit 100, so that the substrate 20 can be cut off from the outside. In addition, the bellows 240 is contracted toward the substrate 20, so that the substrate 20 can be exposed to the outside.

[0133] When the bellows 240 seals the space around the substrate 20 with respect to the outside, the second exhaust part 250 can exhaust the gas remaining in the space sealed inside the bellows 240 to the outside. Thus, the second exhaust part 250 exhausts the gas remaining in the space sealed inside the bellows 240 to the outside, thereby the space around the substrate 20 can be maintained in a vacuum state. Thus, the second exhaust part 250 can include a nozzle exposed inside the bellows 240.

[0134] Thus, the first exhaust part 140 and the second exhaust part 250 can perform a work of preventing the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 from exceeding a predetermined range.

[0135] In addition, it can be that the gas pressure inside the sealing part 130 affects the pressure applied to the upper side of the mold 10, and the gas pressure inside the bellows 240 affects the pressure applied to the lower side of the mold 10.

[0136] Therefore, if the first exhaust part 140 and the second exhaust part 250 prevent the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 from exceeding a predetermined range, the difference between the pressures applied to the upper side and the lower side of the mold 10 can be prevented from exceeding a predetermined range.

[0137] Thus, preventing the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 from exceeding a predetermined range prevents the difference between the pressures applied to the upper side and the lower side of the mold 10 from exceeding a predetermined range, and thus finally has an effect of preventing the mold 10 from being bent.

[0138] Referring to Figure 6 , the alignment pattern transfer device 1 can further include a control part 600.

[0139] The control part 600 can perform control for the work of the first pressing unit 100, the second pressing unit 200, the photographing part 300, the adjustment part 220, the UV irradiation part 400, the driving part 500, and the adjustment part 220.

[0140] The control part 600 can perform control so that any one of the first pressing unit 100 and the second pressing unit 200 moves toward the other. At this time, the control part 600 can control the lifting part 230 in order to lift and lower the substrate 20.

[0141] The control part 600 can control the photographing part 300 to recognize the positioning mark 11 and the positioning key 21.

[0142] The control unit 600 can control the positioning unit 220 to adjust the horizontal position of the substrate placing unit 210. At this time, the control unit 600 can control one or more of the first adjustment unit 221, the second adjustment unit 222, and the rotation unit 223 in order to adjust the horizontal position of the substrate 20.

[0143] The control unit 600 can control the driving unit 500 so that the UV irradiation unit 400 is located at the irradiation position in order to irradiate UV to the resin. At this time, the control unit 600 can control the driving unit 500 so that the photographing unit 300 is moved to the non-photographing position. In addition, the control unit 600 can control the driving unit 500 so that the photographing unit 300 is located at the photographing position in order for the photographing unit 300 to recognize the positioning mark 11 and the positioning key 21. At this time, the control unit 600 can control the driving unit 500 so that the UV irradiation unit 400 is moved to the non-irradiation position.

[0144] The control unit 600 can control the lifting unit 230, the photographing unit 300, and the positioning unit 220 so that, when the substrate 20 is lifted by a predetermined distance by the lifting unit 230, the photographing unit 300 recognizes the positioning mark 11 and the positioning key 21, and the positioning unit 220 adjusts the horizontal position of the substrate placing unit 210. In addition, the control unit 600 can control the positioning unit 220, the lifting unit 230, and the photographing unit 300 so that, when the substrate 20 is lifted by more than the predetermined distance by the lifting unit 230, the photographing unit 300 re-recognizes the positioning mark 11 and the positioning key 21, and the positioning unit 220 re-adjusts the horizontal position of the substrate placing unit 210.

[0145] The control unit 600 can control the driving unit 500 so that, if the mold 10 and the substrate 20 are pressed, the UV irradiation unit 400 is located at the irradiation position. In addition, the control unit 600 can control the UV irradiation unit 400 so that, in order to harden the resin of the substrate 20, the UV irradiation unit 400 irradiates UV to the resin.

[0146] Hereinafter, with reference to the accompanying drawings, a method of manufacturing a pattern substrate by pressing a mold 10 on which a pattern and a positioning mark 11 are formed and a substrate 20 on which a resin and a positioning key 21 are formed according to an embodiment of the present application (S10) will be described. Figure 15 Hereinafter, with reference to the accompanying drawings, a method of manufacturing a pattern substrate by pressing a mold 10 on which a pattern and a positioning mark 11 are formed and a substrate 20 on which a resin and a positioning key 21 are formed according to an embodiment of the present application (S10) will be described.

[0147] The method of manufacturing a pattern substrate (S10) can produce a substrate 20 on which a pattern is transferred. Thus, in the method of manufacturing a pattern substrate (S10), the mold 10 on which the pattern and the positioning mark 11 are formed can be pressed against the substrate 20 on which the resin and the positioning key 21 are formed to transfer the pattern to the resin. The method of manufacturing a pattern substrate (S10) can include a clamp fixing step (S100), a moving step (S200), a lifting step (S300), a photographing step (S400), a positioning step (S500), a sealing step (S600), a substrate pressing step (S700), a hardening step (S800), a sealing release step (S900), a substrate separation step (S1000), and a clamp release step (S1100).

[0148] In the clamp fixing step (S100), the mold clamp 111 can be fixed to the first pressing unit 100 side by the clamp 112. At this time, the mold clamp 111 can be supported between the clamps 112, and the mold 10 can be installed in the mold clamp 111. Thus, the clamp fixing step (S100) can be performed before the photographing step (S400).

[0149] In the moving step (S200), the mold 10 can be moved in the horizontal direction, and the photographing portion 300 can be moved in the horizontal direction. Thus, the moving step (S200) can include a mold horizontal moving step (S210) and a photographing portion moving step (S220).

[0150] In the mold horizontal moving step (S210), the center position of a mold support for supporting the mold 10 can be moved in the horizontal direction. In other words, in the mold horizontal moving step (S210), the mold 10 can be moved by moving the mold support in the horizontal direction to dispose the mold 10 at a predetermined position on the upper side of the substrate 20. Thus, the mold horizontal moving step (S210) can be performed before the photographing step (S400).

[0151] In the photographing portion moving step (S220), the photographing portion 300 can be moved to a photographing position for recognizing the positioning mark 11 and the positioning key 21. Thus, in the photographing portion moving step (S220), the photographing portion 300 can be moved in the horizontal direction by the driving portion 500. In addition, the photographing portion moving step (S220) can be performed before the photographing step (S400), and can be performed simultaneously with or separately from the mold horizontal moving step (S210).

[0152] In the lifting step (S300), the positioning portion 220 can be lifted by the lifting portion 230 to allow the substrate 20 to approach the first pressing unit 100.

[0153] In the photographing step (S400), the photographing section 300 can photograph the positioning marks 11 formed in the mold 10 and the positioning keys 21 formed in the substrate 20. In addition, in the photographing step (S400), the photographing section 300 can recognize the positioning marks 11 and the positioning keys 21, and can recognize whether the mold 10 and the substrate 20 are positioned at fixed positions.

[0154] In the positioning step (S500), the positioning section 220 can adjust the horizontal position of the substrate 20. Thus, in the positioning step (S500), the horizontal position of the substrate 20 can be adjusted based on the positions of the positioning marks 11 and the positioning keys 21 recognized in the photographing step (S400) so that the positioning marks 11 are positioned between the positioning keys 21.

[0155] Thus, the photographing step (S400) and the positioning step (S500) can be performed when the substrate 20 is raised by a predetermined distance in the lifting step (S300). In addition, the photographing step (S400) and the positioning step (S500) can be performed again when the substrate 20 is raised by more than the predetermined distance by the lifting step (S300). Thus, the lifting step (S300), the photographing step (S400), and the positioning step (S500) can be performed multiple times during the raising of the substrate 20.

[0156] In the sealing step (S600), the space around the substrate 20 can be sealed with respect to the outside by the bellows 240, and the gas remaining in the space around the substrate 20 can be exhausted to the outside by the second exhaust section 250. In addition, the space around the UV-transmitting window 120 can be sealed with respect to the outside by the sealing section 130, and the gas remaining in the space around the UV-transmitting window 120 can be exhausted to the outside by the first exhaust section 140. Thus, the sealing step (S600) can be performed after the positioning step (S500) and before the substrate pressing step (S700).

[0157] In the substrate pressing step (S700), the positioning section 220 can be raised by the lifting section 230, and thus the mold 10 and the substrate 20 can be pressed. At this time, the pattern formed in the mold 10 can be transferred to the resin formed in the substrate 20.

[0158] In the hardening step (S800), the resin of the substrate 20 can be hardened by irradiating UV. Thus, the hardening step (S800) can include a UV irradiation section moving step (S810) and a UV irradiation step (S820).

[0159] In the UV irradiation section moving step (S810), the UV irradiation section 400 can be moved to an irradiation position for irradiating UV to the resin. Thus, the UV irradiation section moving step (S810) can be performed after the substrate pressing step (S700).

[0160] In the UV irradiation step (S820), the UV irradiation section 400 can irradiate the resin with UV. Thus, in the UV irradiation step (S820), the resin can be hardened by irradiating the resin with UV.

[0161] In the seal release step (S900), a gas can be caused to flow into the space around the substrate 20, and the space around the substrate 20 can be opened to the outside. At this time, the bellows 240 can contract. In addition, a gas can be caused to flow into the space around the UV-transmitting window 120. Thus, the seal release step (S900) can be executed after the substrate pressing step (S700).

[0162] In the substrate separation step (S1000), the positioning section 220 can be lowered by the lifting section 230, and thus the mold 10 can be separated from the substrate 20.

[0163] In the gripper release step (S1100), the gripper 112 can be released from the first pressing unit 100 side. At this time, the mold gripper 111, in which the mold 10 is installed, can be fixed in the gripper 112. Thus, the gripper release step (S1100) can be executed after the substrate pressing step (S700).

[0164] On the other hand, the method of manufacturing a pattern substrate (S10) according to an embodiment of the present application can be implemented in the form of a computer program executed by a computer and stored in a computer-readable recording medium. The computer-readable recording medium can include program commands, data files, data structures, etc. alone or in combination. The program commands recorded in the computer-readable recording medium can be designed and configured specifically for the embodiment, or can be known and used by a computer software technician. Examples of the computer-readable recording medium include magnetic media such as a hard disk, a floppy disk, and a magnetic tape, optical media such as a CD-ROM and a DVD, magneto-optical media such as a floptical disk, and hardware devices specifically configured to store program commands and execute them, such as a read-only memory (ROM), a random access memory (RAM), and a flash memory.

[0165] For example, the computer program stored in the computer-readable recording medium can be programmed to perform the storing step, the calculating step, and the outputting step.

[0166] In the storing step, the image information of the positioning mark 11 and the positioning key 21 photographed by the photographing section 300 can be stored in the computer-readable recording medium.

[0167] In the operation step, the position information of the positioning mark 11 and the positioning key 21 can be calculated based on the image information stored in the computer-readable recording medium. For example, the calculated position information can be an error value related to the fixed position between the positioning mark 11 and the positioning key 21.

[0168] In the output step, the operation command for adjusting the position of the mold 10 or the substrate 20 can be output based on the calculated position information. In addition, it can be determined in advance whether the mold 10 and the substrate 20 are positioned at the fixed position based on the position information calculated before the operation command is output, and it can be determined whether to output the operation command for adjusting the position of the mold 10 or the substrate 20 based on the determined information. Here, the determination of whether to be positioned at the fixed position can be determined in various ways. For example, if the positioning mark 11 overlaps at least a part of the positioning key 21, or the positioning mark 11 is not adjacent to the positioning key 21, as shown in FIG. 6, it can be determined that the mold 10 and the substrate 20 are not positioned at the fixed position. As another example, when the positioning mark 11 is positioned to match between the positioning keys 21, as shown in FIG. 7, it can be determined that the mold 10 and the substrate 20 are positioned at the fixed position. Figure 4 Figure 5

[0169] The above-described embodiments of the present application are merely illustrative, and the present application is not limited thereto, and should be construed as having the broadest scope based on the technical concept disclosed in the specification. Those skilled in the art can combine / replace the disclosed embodiments to implement a pattern of shapes not mentioned, but it still does not exceed the scope of the present application. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on the specification, and thus, the change or modification is obviously within the scope of the present application.​​

Claims

1. A transfer device capable of aligning a pattern, comprising: a first pressing unit that supports a mold in which a pattern is formed; a second pressing unit that supports a substrate in which a resin is formed; a mold jig that supports an edge portion of the mold so that a center portion of the mold is exposed; and a clamp having a lower side sliding member that supports the mold jig from below and an upper side sliding member that supports the mold jig from above, either of the first pressing unit and the second pressing unit is movable toward the other, so that the mold and the substrate are pressed against each other, thereby pressing the pattern formed in the mold against the resin formed in the substrate, the first pressing unit includes: a UV transmission window that supports the mold and transmits UV; a sealing portion that is annularly projected and contacts the mold jig from below so as to seal a space around the UV transmission window from the outside; and a first exhaust portion that exhausts gas remaining in a space sealed inside the sealing portion to the outside when the sealing portion seals the space around the UV transmission window from the outside, the mold jig is slidably inserted between the upper side sliding member and the lower side sliding member and is supported by the clamp.

2. The transfer device capable of aligning a pattern according to claim 1, wherein the second pressing unit includes: a bellows that is expanded and contracted toward the first pressing unit when the mold and the substrate are pressed, thereby sealing a space around the substrate from the outside; and a second exhaust portion that exhausts gas remaining in a space sealed inside the bellows to the outside when the bellows seals the space around the substrate from the outside, the first exhaust portion and the second exhaust portion perform a work of preventing a difference between a gas pressure inside the sealing portion and a gas pressure inside the bellows from exceeding a predetermined range. the transfer device capable of aligning a pattern further includes:

3. The apparatus of claim 1, wherein the alignment pattern is a plurality of alignment marks. a clamp that supports an edge of the mold jig and fixes the mold jig to the first pressing unit side.

4. The transfer device capable of aligning a pattern according to claim 3, wherein the first pressing unit includes: a sealing member that is located between the sealing portion and the mold jig in order to cut off inflow of gas between the sealing portion and the mold jig.

5. The transfer device capable of aligning a pattern according to claim 4, wherein the sealing member is a packing that is annularly projected and contacts the mold jig from below so as to seal a space around the UV transmission window from the outside.

Images