Infrared touch device and ultra-thin interactive device
By using flexible substrates and MiniLED infrared lamps in infrared touch control devices, combined with the fixed design of adhesive materials, the problems of installation deviation and the heavy machine are solved, achieving a better touch experience and a thinner frame structure.
Patent Information
- Application Number
- CN202210274772.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-03-18
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2042-03-18
AI Technical Summary
Existing infrared touch devices are prone to bias when installed, resulting in poor infrared light transmission and reception, and the frame profile design requires 5 mm of space, resulting in heavy overall machine, unsightly appearance, and affecting the touch experience.
Using a flexible substrate and a MiniLED infrared lamp, the flexible substrate is fixed on the infrared filter strip through the first predetermined adhesive material, which eliminates the slot design, reduces the thickness of the frame structure, and pastes the infrared filter strip on the frame structure through the second predetermined adhesive material, further reducing the width and thickness of the frame structure.
It solves the problem of infrared light blocking caused by installation deviation, reduces the thickness of the entire machine, improves the touch experience, and saves design space.
Smart Images

Figure CN114610181B_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of touch control, and in particular to an infrared touch control device and an ultra-thin interactive device. Background Art
[0002] At present, the mainstream touch solutions for large-size products such as educational machines and conference machines in the market mainly use infrared touch devices. The traditional infrared touch method is to design a fixed card slot in the frame profile of the whole machine (also called the frame structure), such as Figure 1 , which is a schematic diagram of the installation cross-section of the touch frame (i.e., the PCB substrate including the infrared lamp) and the frame profile.
[0003] In order to facilitate the installation of the inserted touch frame, the card slots designed by the frame profile have a certain tolerance. Generally, 1±0.3mm is reserved for the card slots. If the tolerance exceeds the limit and causes the touch frame to be installed offset, combined with the warping tolerance of the profile, it will often cause the infrared emission or reception light to be blocked and unable to come out, thereby affecting the touch experience. In addition, the PCB substrate of the existing infrared touch device is thicker. When designing the whole machine, at least 5mm of space needs to be reserved for the touch frame when designing the frame profile. This design scheme will make the whole machine look heavier and unsightly, and the floating touch height is higher, which will also affect the touch experience. Summary of the invention
[0004] In view of this, the embodiments of the present disclosure propose an infrared touch device and an ultra-thin interactive device to solve the following problems in the prior art: there is a card slot in the design of the infrared touch device, which causes poor infrared light reception and transmission if the touch frame is misaligned during installation, and at least 5 mm of space needs to be reserved for the touch frame when designing the frame profile, and the floating touch height is relatively high, resulting in a poor touch experience.
[0005] On the one hand, an embodiment of the present disclosure proposes an infrared touch device, which at least includes: a frame structure, in which at least an infrared filter strip, an infrared lamp, and a flexible substrate are arranged; the infrared lamp is arranged on the flexible substrate; a side of the flexible substrate provided with the infrared lamp is connected to the infrared filter strip by a first predetermined adhesive material to fix the position of the flexible substrate.
[0006] In some embodiments, the material of the flexible substrate includes at least one of the following: polyethylene terephthalate, polyethylene phthalate.
[0007] In some embodiments, the thickness of the flexible substrate ranges from 0.075 mm to 0.175 mm.
[0008] In some embodiments, the infrared lamp is a MiniLED.
[0009] In some embodiments, it also includes: a driving chip, which is arranged on the other side of the flexible substrate where the infrared lamp is not arranged, and the driving chip is used to control the turning on and off of the infrared lamp; the electrode wiring of the infrared lamp is connected to a preset binding area, and the electrode wiring is connected to the driving chip corresponding to the infrared lamp through the preset binding area.
[0010] In some embodiments, it also includes: a driving chip, which is arranged on the other side of the flexible substrate where the infrared lamp is not arranged, and the driving chip is used to control the turning on and off of the infrared lamp; the electrode routing of the infrared lamp is connected to the driving chip corresponding to the infrared lamp through the through hole on the flexible substrate, wherein the through hole is filled with a conductive material.
[0011] In some embodiments, one driving chip is connected to a plurality of the infrared lamps.
[0012] In some embodiments, the MiniLED is a MiniLED with a built-in driver chip.
[0013] In some embodiments, the infrared filter strip is connected to the frame structure via a second predetermined adhesive material.
[0014] In some embodiments, the first predetermined adhesive material and / or the second predetermined adhesive material is a double-sided tape.
[0015] In some embodiments, the height of the first predetermined viscous material is greater than or equal to the height of the infrared lamp, and the angle formed by a line connecting a midpoint of a connection between the first predetermined viscous material and the infrared filter strip and a center point of the infrared lamp on the flexible substrate relative to a line connecting a midpoint of a connection between the first predetermined viscous material and the flexible substrate and a center point of the infrared lamp on the flexible substrate is less than or equal to 30 degrees.
[0016] In some embodiments, a side of the infrared filter strip close to the infrared lamp has a convex structure for focusing light.
[0017] In some embodiments, an adhesive step is provided at an extension position of the convex structure, and the adhesive step is used to connect with the first predetermined adhesive material.
[0018] In some embodiments, the pasting step and the convex structure have the same height.
[0019] In some embodiments, the receiving infrared lamps and the transmitting infrared lamps are periodically arranged on the flexible substrate according to a predetermined distribution rule.
[0020] In some embodiments, it also includes: a glass cover plate connected to the outer frame structure portion, a liquid crystal display panel and a backlight assembly arranged under the glass cover plate.
[0021] On the other hand, an embodiment of the present disclosure provides an ultra-thin interactive device, which at least includes: the infrared touch device described in any embodiment of the present disclosure.
[0022] The infrared touch device of the disclosed embodiment adopts a flexible substrate, which directly reduces the thickness of the substrate, and is connected to the infrared filter strip by a first predetermined adhesive material to achieve position fixation, eliminating the tolerance that must be retained in the design of the card slot and the risk of displacement of the plug-in assembly, so that the positions of the infrared filter strip and the flexible substrate are closer, the utilization rate of infrared light is improved, the design space is further saved, the thickness of the frame structure in the infrared touch device is thinned as a whole, the problem of high floating touch height and poor touch experience is solved, and the product performance and user experience are improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0024] Figure 1 The prior art provides a schematic diagram of the installation section of the touch frame and the frame profile;
[0025] Figure 2 A possible overall structural diagram of an infrared touch device provided by the prior art;
[0026] Figure 3 A schematic cross-sectional structure diagram of an infrared touch device provided in the first embodiment of the present disclosure;
[0027] Figure 4 A schematic cross-sectional structure diagram of an infrared touch device provided in a second embodiment of the present disclosure;
[0028] Figure 5 A schematic diagram of the cross-sectional structure of the infrared filter strip provided in the fifth embodiment of the present disclosure Figure 1 ;
[0029] Figure 6 A schematic diagram of the cross-sectional structure of the infrared filter strip provided in the fifth embodiment of the present disclosure Figure 2 ;
[0030] Figure 7 A schematic cross-sectional structure diagram of an infrared touch device provided in an embodiment of the present disclosure;
[0031] Figure 8 This is a top view of the touch frame when looking down from the infrared filter strip provided in an embodiment of the present disclosure.
[0032] Reference numerals:
[0033] 1-frame structure, 2-display structure, 3-infrared filter strip, 4-infrared lamp, 5-flexible substrate, 6-first predetermined viscous material, 7-second predetermined viscous material, 8-glass cover plate, 9-liquid crystal display panel, 31-convex structure, 32-adhesive step. DETAILED DESCRIPTION
[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0035] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0036] In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of well-known functions and well-known components.
[0037] like Figure 2 As shown, it is a possible overall structural diagram of an existing infrared touch device, which consists of a frame structure 1 and a display structure 2. The display structure is only used to display content and cannot realize touch operation, so the touch function is realized by the frame structure.
[0038] The frame structure includes an infrared filter strip and a touch frame (also called an infrared touch frame). The infrared filter strip is used to reflect and filter infrared light, and the touch frame is actually used to realize the touch function when the user touches the display structure.
[0039] The touch frame is composed of an infrared lamp and a PCB substrate. The infrared lamp includes an infrared transmitting lamp and an infrared receiving lamp. The touch frame is set in each frame edge of the frame structure. The infrared lamps in the two opposite frame edges can be used to send infrared light and receive infrared light respectively, thereby forming infrared light that crosses in the horizontal and vertical directions. When the user's finger (or other alternative device) falls on the display structure, the infrared receiving lamp's reception of infrared light (both horizontal and vertical directions) will change, thereby determining the corresponding touch position of the user on the display structure to achieve touch operation.
[0040] However, existing PCB substrates are all hard boards, and the general frame structure design reserves at least 5mm of space for the touch frame. This design solution makes the frame of the entire machine look thick and unsightly, and the floating touch height is high, affecting the touch experience.
[0041] Embodiment 1
[0042] The first embodiment of the present disclosure provides an infrared touch device, the cross-sectional structure of which is shown as follows: Figure 3 As shown, including at least:
[0043] A frame structure 1, in which at least an infrared filter strip 3, an infrared lamp 4, and a flexible substrate 5 are arranged; the infrared lamp is arranged on the flexible substrate; a side of the flexible substrate provided with the infrared lamp is connected to the infrared filter strip through a first predetermined adhesive material 6 to fix the position of the flexible substrate.
[0044] The preferred material of the flexible substrate in the disclosed embodiment is PET (polyethylene terephthalate) or PEN (polyethylene phthalate). The selection of PET or PEN as the flexible substrate material for the infrared touch device is based on many considerations. Although both are flexible materials, compared with other existing flexible materials, the following issues need to be considered in order to become a flexible substrate for the infrared touch device: infrared touch devices are usually aimed at large-sized products such as educational machines and conference machines. The external packaging of such products is not as precise as that of small smart devices. They are prone to aging problems due to the different environments they are in. The working environment of large-sized products such as educational machines and conference machines is usually long-term work, which will generate more heat, causing the substrate to work in a high-temperature environment for a long time, further accelerating the aging problem, which is very easy to cause.
[0045] Since the existing PCB substrate is a hard board, the above-mentioned aging problem does not exist at all, so the technicians in this field will naturally not consider the aging problem. However, the material of the flexible material is completely different from that of the PCB substrate, and aging is a problem that needs to be considered.
[0046] For flexible materials, those skilled in the art may select polyimide (PI), polytetrafluoroethylene (PTFE), aramid, etc. However, due to the inherent characteristics of these flexible materials, they cannot solve the problem of rapid aging in a working environment with high temperature and poor sealing conditions for a long time. Therefore, after discovering the above problems, the embodiments of the present disclosure consider using PET or PEN as the material of the flexible substrate. PET and PEN have similar performances, and PET is used as an example for explanation below.
[0047] PET has excellent high and low temperature resistance. It can be used for a long time within the temperature range of 120℃. It can withstand high temperatures of 150℃ and low temperatures of -70℃ for short-term use. High and low temperatures have little effect on its mechanical properties. Therefore, it can work in relatively harsh working environments for a long time. It can adapt to any environment in which large-size products work. It is also resistant to oil and most solvents, which can fundamentally slow down the aging speed. PET has good mechanical properties. Even if it is made thinner, that is, between 0.075mm-0.175mm, it can still meet the bearing function of the substrate that needs to bear infrared lamps and motor wiring. The above advantages are unmatched by other flexible materials.
[0048] In a specific implementation, the thickness of the flexible substrate is in the range of 0.075 mm to 0.175 mm, preferably 0.125 mm.
[0049] In the disclosed embodiment, the flexible substrate of the infrared touch device is made of flexible material, and the flexible substrate can greatly reduce the thickness of the substrate from 1 mm to 0.125 mm. In the disclosed embodiment, the position of the flexible substrate is fixed by a first predetermined adhesive material, and a slot is no longer required for position limitation. There will be no installation deviation due to assembly, and there will be no warping tolerance between the frame structure and the frame structure due to installation, so that there is no obstruction to the infrared emission light or the infrared reception light, thereby avoiding the problem of light blocking caused by installation deviation.
[0050] The infrared touch device of the disclosed embodiment adopts a flexible substrate, which directly reduces the thickness of the substrate, and is connected to the infrared filter strip by a first predetermined adhesive material to achieve position fixation, eliminating the tolerance that must be retained in the design of the card slot, so that the positions of the infrared filter strip and the flexible substrate are closer, further saving design space, and thinning the thickness of the frame structure in the infrared touch device as a whole, solving the problems of high floating touch height and poor touch experience, and improving product performance and user experience.
[0051] Embodiment 2
[0052] The second embodiment of the present disclosure provides an infrared touch device. Compared with the first embodiment, the structure related to the infrared filter strip is further improved. The cross-sectional structure is shown as follows: Figure 4As shown, including at least:
[0053] A frame structure 1, wherein at least an infrared filter strip 3, an infrared lamp 4, and a flexible substrate 5 are arranged in the frame structure; the infrared lamp is arranged on the flexible substrate; a side of the flexible substrate provided with the infrared lamp is connected to the infrared filter strip through a first predetermined adhesive material 6 to fix the position of the flexible substrate; the infrared filter strip is connected to the frame structure through a second predetermined adhesive material 7.
[0054] exist Figure 4 It can be seen that the sides of the infrared filter strip are adhered to the left and right frame structures by the second predetermined adhesive material, and there is no card slot on the frame structure, which further reduces the width and thickness of the frame structure.
[0055] In specific settings, the first predetermined viscous material and the second predetermined viscous material can be the same kind of viscous material, for example, the first predetermined viscous material and the second predetermined viscous material are both double-sided tapes. Of course, the first predetermined viscous material and the second predetermined viscous material can also be different kinds of viscous materials, as long as they can achieve the effect of adhesive connection.
[0056] The preferred material of the flexible substrate in the disclosed embodiment is PET (polyethylene terephthalate) or PEN (polyethylene phthalate). The selection of PET or PEN as the flexible substrate material for the infrared touch device is based on many considerations. Although both are flexible materials, compared with other existing flexible materials, the following issues need to be considered in order to become a flexible substrate for the infrared touch device: infrared touch devices are usually aimed at large-sized products such as educational machines and conference machines. The external packaging of such products is not as precise as that of small smart devices. They are prone to aging problems due to the different environments they are in. The working environment of large-sized products such as educational machines and conference machines is usually long-term work, which will generate more heat, causing the substrate to work in a high-temperature environment for a long time, further accelerating the aging problem, which is very easy to cause.
[0057] Since the existing PCB substrate is a hard board, the above-mentioned aging problem does not exist at all, so the technicians in this field will naturally not consider the aging problem. However, the material of the flexible material is completely different from that of the PCB substrate, and aging is a problem that needs to be considered.
[0058] For flexible materials, those skilled in the art may select polyimide (PI), polytetrafluoroethylene (PTFE), aramid, etc. However, due to the inherent characteristics of these flexible materials, they cannot solve the problem of rapid aging in a working environment with high temperature and poor sealing conditions for a long time. Therefore, after discovering the above problems, the embodiments of the present disclosure consider using PET or PEN as the material of the flexible substrate. PET and PEN have similar performances, and PET is used as an example for explanation below.
[0059] PET has excellent high and low temperature resistance. It can be used for a long time within the temperature range of 120℃. It can withstand high temperatures of 150℃ and low temperatures of -70℃ for short-term use. High and low temperatures have little effect on its mechanical properties. Therefore, it can work in relatively harsh working environments for a long time. It can adapt to any environment in which large-size products work. It is also resistant to oil and most solvents, which can fundamentally slow down the aging speed. PET has good mechanical properties. Even if it is made thinner, that is, between 0.075mm-0.175mm, it can still meet the bearing function of the substrate that needs to bear infrared lamps and motor wiring. The above advantages are unmatched by other flexible materials.
[0060] In a specific implementation, the thickness of the flexible substrate is in the range of 0.075 mm to 0.175 mm, preferably 0.125 mm.
[0061] The embodiment of the present disclosure adopts a flexible substrate for the infrared touch device, which can greatly reduce the thickness of the substrate from 1mm to 0.125mm; the embodiment of the present disclosure fixes the position of the flexible substrate by a first predetermined viscous material, and no longer needs a slot to limit the position, and no installation deviation will occur due to assembly, and no warping tolerance will be caused between the frame structure due to installation, so that there is no obstruction to infrared emission light or infrared reception light, and the problem of light blocking caused by installation deviation and the like is avoided; the embodiment of the present disclosure adheres the infrared filter strip to the frame structure by a second predetermined viscous material, saving the slot that should be designed for the infrared filter strip on the frame structure, and no longer needs a slot to limit the position, eliminating the width required for designing the slot, and no longer needs to reserve tolerance for the slot, further reducing the width and thickness of the frame structure. Since the frame structure has multiple frame edges, the width of the frame structure can be significantly changed, and it is directly narrowed intuitively.
[0062] The infrared touch device of the disclosed embodiment adopts a flexible substrate, which directly reduces the thickness of the substrate, and is connected to the infrared filter strip by a first predetermined adhesive material to achieve position fixation, and is connected to the frame structure by a second predetermined adhesive material, thereby eliminating the width required for designing the card slot and the tolerance that must be retained, so that the positions of the infrared filter strip and the flexible substrate are closer, further saving design space, and thinning the thickness of the frame structure in the infrared touch device as a whole, solving the problems of high floating touch height and poor touch experience, and improving product performance and user experience.
[0063] Embodiment 3
[0064] The third embodiment of the present disclosure provides an infrared touch device. Compared with the first embodiment, the infrared lamp is further improved, and at least includes:
[0065] A frame structure 1, in which at least an infrared filter strip 3, an infrared lamp 4, and a flexible substrate 5 are arranged; the infrared lamp is arranged on the flexible substrate, and the infrared lamp is a MiniLED; a side of the flexible substrate provided with the infrared lamp is connected to the infrared filter strip through a first predetermined adhesive material 6 to fix the position of the flexible substrate.
[0066] The preferred material of the flexible substrate in the disclosed embodiment is PET (polyethylene terephthalate) or PEN (polyethylene phthalate). The selection of PET or PEN as the flexible substrate material for the infrared touch device is based on many considerations. Although both are flexible materials, compared with other existing flexible materials, the following issues need to be considered in order to become a flexible substrate for the infrared touch device: infrared touch devices are usually aimed at large-sized products such as educational machines and conference machines. The external packaging of such products is not as precise as that of small smart devices. They are prone to aging problems due to the different environments they are in. The working environment of large-sized products such as educational machines and conference machines is usually long-term work, which will generate more heat, causing the substrate to work in a high-temperature environment for a long time, further accelerating the aging problem, which is very easy to cause.
[0067] Since the existing PCB substrate is a hard board, the above-mentioned aging problem does not exist at all, so the technicians in this field will naturally not consider the aging problem. However, the material of the flexible material is completely different from that of the PCB substrate, and aging is a problem that needs to be considered.
[0068] For flexible materials, those skilled in the art may select polyimide (PI), polytetrafluoroethylene (PTFE), aramid, etc. However, due to the inherent characteristics of these flexible materials, they cannot solve the problem of rapid aging in a working environment with high temperature and poor sealing conditions for a long time. Therefore, after discovering the above problems, the embodiments of the present disclosure consider using PET or PEN as the material of the flexible substrate. PET and PEN have similar performances, and PET is used as an example for explanation below.
[0069] PET has excellent high and low temperature resistance. It can be used for a long time within the temperature range of 120℃. It can withstand high temperatures of 150℃ and low temperatures of -70℃ for short-term use. High and low temperatures have little effect on its mechanical properties. Therefore, it can work in relatively harsh working environments for a long time. It can adapt to any environment in which large-size products work. It is also resistant to oil and most solvents, and can fundamentally slow down the aging speed. PET has good mechanical properties. Even if it is made thinner, that is, between 0.075mm-0.175mm, it can still meet the bearing function of the substrate that needs to bear infrared lamps and motor wiring. The above advantages are unmatched by other flexible materials.
[0070] In a specific implementation, the thickness of the flexible substrate is in the range of 0.075 mm to 0.175 mm, preferably 0.125 mm.
[0071] The embodiment of the present disclosure adopts a flexible substrate for the infrared touch device, which can greatly reduce the thickness of the substrate from 1mm to 0.125mm; the embodiment of the present disclosure fixes the position of the flexible substrate by a first predetermined viscous material, and no longer requires a slot for position limitation, and will not cause installation deviation due to assembly, nor will it cause warping tolerance between the frame structure due to installation, so that there is no obstruction to infrared emission light or infrared reception light, avoiding the problem of light blocking caused by installation deviation, etc.; due to the deformation of the entire structure and light intensity, traditional infrared touch devices often use 3mm-3.5mm patch-type infrared light-emitting diodes for infrared emission and infrared reception. The embodiment of the present disclosure replaces them with MiniLEDs, which are significantly reduced in size, and directly further reduce the distance between the flexible substrate and the infrared filter strip, so that the thickness is further reduced.
[0072] The infrared touch device of the disclosed embodiment adopts a flexible substrate, which directly reduces the thickness of the substrate, and is connected to the infrared filter strip by a first predetermined adhesive material to achieve position fixation, eliminating the tolerance that must be retained in the design of the card slot, and the infrared lamp is designed as a MiniLED, so that the positions of the infrared filter strip and the flexible substrate are closer, further saving design space, and thinning the thickness of the frame structure in the infrared touch device as a whole, solving the problems of high floating touch height and poor touch experience, and improving product performance and user experience.
[0073] The above-mentioned MiniLED may be a MiniLED with a built-in driver chip. With this design structure, the thickness thereof is reduced by at least 50% of the height.
[0074] Of course, if all MiniLEDs with built-in driver chips are used, the cost of the infrared touch device may be more expensive. Therefore, it is also possible not to use MiniLEDs with built-in driver chips, but only use ordinary MiniLEDs. Since their appearance is much smaller than that of ordinary infrared lamps, the thinning effect on the frame structure still exists, but for ordinary MiniLEDs, their corresponding driver chips can be set on the back of the flexible substrate, that is, the driver chip is set on the other side of the flexible substrate where the infrared lamp is not set, and the driver chip is used to control the turning on and off of the infrared lamp; the electrode wiring of the infrared lamp is connected (that is, both the positive and negative electrode wirings are connected) to the preset binding area, and the electrode wiring is connected to the driver chip corresponding to the infrared lamp through the preset binding area.
[0075] The driver chip of the embodiment of the present disclosure is arranged on the other side of the flexible substrate where the infrared lamp is not arranged. The driver chip is used to control the turning on and off of the infrared lamp. The material selected for the flexible substrate of the present disclosure is PET or PEN, which has excellent mechanical properties. Therefore, a through hole can be arranged on the flexible substrate, and the through hole is filled with a conductive material, and then the electrode traces of the infrared lamp are connected to the driver chip corresponding to the infrared lamp through the through hole on the flexible substrate to realize the connection between the electrode traces and the driver chip; this method can save the connection to the redundant electrode traces in the preset binding area, so that the flexible substrate has a simpler electrode trace layout method, and since the connection between the electrode traces and the driver chip is built-in on the flexible substrate, a certain thickness can also be reduced.
[0076] The disclosed embodiment can also connect multiple infrared lamps to one driver chip, that is, connect the electrode wiring to the driver chip corresponding to the infrared lamp through a preset binding area, so as to save the cost of the infrared touch device by adopting a time-sharing drive control method for the infrared lamp.
[0077] Embodiment 4
[0078] The fourth embodiment of the present disclosure provides an infrared touch device. Compared with the third embodiment, the structure related to the infrared filter strip is further improved, and at least includes:
[0079] A frame structure 1, wherein at least an infrared filter strip 3, an infrared lamp 4, and a flexible substrate 5 are arranged in the frame structure; the infrared lamp is arranged on the flexible substrate, and the infrared lamp is a MiniLED; a side of the flexible substrate provided with the infrared lamp is connected to the infrared filter strip through a first predetermined adhesive material 6 to fix the position of the flexible substrate; the infrared filter strip is connected to the frame structure through a second predetermined adhesive material 7.
[0080] The sides of the infrared filter strip are adhered to the frame structures on the left and right sides by a second predetermined adhesive material. There are no card slots on the frame structure, which further reduces the width and thickness of the frame structure.
[0081] In specific settings, the first predetermined viscous material and the second predetermined viscous material can be the same kind of viscous material, for example, the first predetermined viscous material and the second predetermined viscous material are both double-sided tapes. Of course, the first predetermined viscous material and the second predetermined viscous material can also be different kinds of viscous materials, as long as they can achieve the effect of adhesive connection.
[0082] The preferred material of the flexible substrate in the disclosed embodiment is PET (polyethylene terephthalate) or PEN (polyethylene phthalate). The selection of PET or PEN as the flexible substrate material for the infrared touch device is based on many considerations. Although both are flexible materials, compared with other existing flexible materials, the following issues need to be considered in order to become a flexible substrate for the infrared touch device: infrared touch devices are usually aimed at large-sized products such as educational machines and conference machines. The external packaging of such products is not as precise as that of small smart devices. They are prone to aging problems due to the different environments they are in. The working environment of large-sized products such as educational machines and conference machines is usually long-term work, which will generate more heat, causing the substrate to work in a high-temperature environment for a long time, further accelerating the aging problem, which is very easy to cause.
[0083] Since the existing PCB substrate is a hard board, the above-mentioned aging problem does not exist at all, so the technicians in this field will naturally not consider the aging problem. However, the material of the flexible material is completely different from that of the PCB substrate, and aging is a problem that needs to be considered.
[0084] For flexible materials, those skilled in the art may select polyimide (PI), polytetrafluoroethylene (PTFE), aramid, etc. However, due to the inherent characteristics of these flexible materials, they cannot solve the problem of rapid aging in a working environment with high temperature and poor sealing conditions for a long time. Therefore, after discovering the above problems, the embodiments of the present disclosure consider using PET or PEN as the material of the flexible substrate. PET and PEN have similar performances, and PET is used as an example for explanation below.
[0085] PET has excellent high and low temperature resistance. It can be used for a long time within the temperature range of 120℃. It can withstand high temperatures of 150℃ and low temperatures of -70℃ for short-term use. High and low temperatures have little effect on its mechanical properties. Therefore, it can work in relatively harsh working environments for a long time. It can adapt to any environment in which large-size products work. It is also resistant to oil and most solvents, which can fundamentally slow down the aging speed. PET has good mechanical properties. Even if it is made thinner, that is, between 0.075mm-0.175mm, it can still meet the bearing function of the substrate that needs to bear infrared lamps and motor wiring. The above advantages are unmatched by other flexible materials.
[0086] In a specific implementation, the thickness of the flexible substrate is in the range of 0.075 mm to 0.175 mm, preferably 0.125 mm.
[0087] The disclosed embodiment adopts a flexible substrate for the infrared touch device, which can greatly reduce the thickness of the substrate from 1mm to 0.125mm. In specific implementation, the flexible material can be transparent flexible PET (polyethylene terephthalate); the disclosed embodiment fixes the position of the flexible substrate by a first predetermined viscous material, and no longer requires a card slot for position limitation, and will not cause installation deviation due to assembly, nor will it cause warping tolerance between the frame structure due to installation, so that there is no obstruction to the infrared emission light or infrared reception light, avoiding the problem of light blocking caused by installation deviation. The traditional infrared touch device is often subjected to the deformation of the whole structure and the light intensity. The external receiving lamps are all 3mm-3.5mm chip-type infrared light-emitting diodes. The embodiments of the present disclosure replace them with MiniLEDs, which are significantly reduced in size. The distance between the flexible substrate and the infrared filter strip is further reduced, so that the thickness is further reduced. The embodiments of the present disclosure stick the infrared filter strip to the frame structure through a second predetermined adhesive material, which saves the card slot on the frame structure that should be designed for the infrared filter strip. The card slot is no longer needed for position limitation, the width required for designing the card slot is eliminated, and there is no need to reserve tolerance for the card slot, which further reduces the width and thickness of the frame structure. Since the frame structure has multiple frame edges, the width of the frame structure can be significantly changed, and it is directly narrowed intuitively.
[0088] The infrared touch device of the disclosed embodiment adopts a flexible substrate, which directly reduces the thickness of the substrate, and is connected to the infrared filter strip by a first predetermined adhesive material to achieve position fixation, and is connected to the frame structure by a second predetermined adhesive material, thereby eliminating the width required for designing the card slot and the tolerance that must be retained, and the infrared lamp is designed as a MiniLED, so that the positions of the infrared filter strip and the flexible substrate are closer, further saving design space, and thinning the thickness of the frame structure in the infrared touch device as a whole, solving the problems of high floating touch height and poor touch experience, and improving product performance and user experience.
[0089] The above-mentioned MiniLED may be a MiniLED with a built-in driver chip. By adopting the above-mentioned design structure, the thickness thereof is reduced by at least 50% of the height.
[0090] Of course, if all MiniLEDs with built-in driver chips are used, the cost of the infrared touch device may be more expensive. Therefore, it is also possible not to use MiniLEDs with built-in driver chips, but only use ordinary MiniLEDs. Since their appearance is much smaller than that of ordinary infrared lamps, the thinning effect on the frame structure still exists. However, for ordinary MiniLEDs, their corresponding driver chips can be set on the back of the flexible substrate, that is, the driver chip is set on the other side of the flexible substrate where the infrared lamp is not set, and the driver chip is used to control the turning on and off of the infrared lamp; the electrode wiring of the infrared lamp is connected to the preset binding area, and the electrode wiring is connected to the driver chip corresponding to the infrared lamp through the preset binding area.
[0091] The disclosed embodiment can also connect multiple infrared lamps to one driver chip, that is, connect the electrode wiring to the driver chip corresponding to the infrared lamp through a preset binding area, so as to save the cost of the infrared touch device by adopting a time-sharing drive control method for the infrared lamp.
[0092] Embodiment 5
[0093] The fifth embodiment of the present disclosure provides an infrared touch device. Compared with the fourth embodiment, the structure related to the infrared filter strip is further improved, which at least includes:
[0094] A frame structure 1, wherein at least an infrared filter strip 3, an infrared lamp 4, and a flexible substrate 5 are arranged in the frame structure; the infrared lamp is arranged on the flexible substrate, and the infrared lamp is a MiniLED; a side of the flexible substrate provided with the infrared lamp is connected to the infrared filter strip through a first predetermined adhesive material 6 to fix the position of the flexible substrate; the infrared filter strip is connected to the frame structure through a second predetermined adhesive material 7, and a side of the infrared filter strip close to the infrared lamp has a convex structure 31 for focusing light.
[0095] The cross-sectional structure of the infrared filter strip can be shown as follows: Figure 5 shown.
[0096] The embodiment of the present disclosure takes into account the problem of insufficient light intensity when using a small MiniLed for a large-size device. Therefore, a convex structure is added to the side of the infrared filter strip close to the flexible substrate to improve the light intensity. Of course, other focusing methods can also be used, which are not limited here.
[0097] In a specific implementation, a sticking step 32 may be provided at the extension position of the convex structure, and the sticking step is used to connect with the first predetermined adhesive material, and its cross-sectional structure may be as follows: Figure 6 As shown, it is preferred that the sticking step and the convex structure are set to have the same height to facilitate the processing and manufacturing of the infrared filter strip.
[0098] The sides of the infrared filter strip are adhered to the frame structures on the left and right sides by a second predetermined adhesive material. There are no card slots on the frame structure, which further reduces the width and thickness of the frame structure.
[0099] In specific settings, the first predetermined viscous material and the second predetermined viscous material can be the same kind of viscous material, for example, the first predetermined viscous material and the second predetermined viscous material are both double-sided tapes. Of course, the first predetermined viscous material and the second predetermined viscous material can also be different kinds of viscous materials, as long as they can achieve the effect of adhesive connection.
[0100] The preferred material of the flexible substrate in the disclosed embodiment is PET (polyethylene terephthalate) or PEN (polyethylene phthalate). The selection of PET or PEN as the flexible substrate material for the infrared touch device is based on many considerations. Although both are flexible materials, compared with other existing flexible materials, the following issues need to be considered in order to become a flexible substrate for the infrared touch device: infrared touch devices are usually aimed at large-sized products such as educational machines and conference machines. The external packaging of such products is not as precise as that of small smart devices. They are prone to aging problems due to the different environments they are in. The working environment of large-sized products such as educational machines and conference machines is usually long-term work, which will generate more heat, causing the substrate to work in a high-temperature environment for a long time, further accelerating the aging problem, which is very easy to cause.
[0101] Since the existing PCB substrate is a hard board, the above-mentioned aging problem does not exist at all, so the technicians in this field will naturally not consider the aging problem. However, the material of the flexible material is completely different from that of the PCB substrate, and aging is a problem that needs to be considered.
[0102] For flexible materials, those skilled in the art may select polyimide (PI), polytetrafluoroethylene (PTFE), aramid, etc. However, due to the inherent characteristics of these flexible materials, they cannot solve the problem of rapid aging in a working environment with high temperature and poor sealing conditions for a long time. Therefore, after discovering the above problems, the embodiments of the present disclosure consider using PET or PEN as the material of the flexible substrate. PET and PEN have similar performances, and PET is used as an example for explanation below.
[0103] PET has excellent high and low temperature resistance. It can be used for a long time within the temperature range of 120℃. It can withstand high temperatures of 150℃ and low temperatures of -70℃ for short-term use. High and low temperatures have little effect on its mechanical properties. Therefore, it can work in relatively harsh working environments for a long time. It can adapt to any environment in which large-size products work. It is also resistant to oil and most solvents, and can fundamentally slow down the aging speed. PET has good mechanical properties. Even if it is made thinner, that is, between 0.075mm-0.175mm, it can still meet the bearing function of the substrate that needs to bear infrared lamps and motor wiring. The above advantages are unmatched by other flexible materials.
[0104] In a specific implementation, the thickness of the flexible substrate is in the range of 0.075 mm to 0.175 mm, preferably 0.125 mm.
[0105] The disclosed embodiment adopts a flexible substrate for the infrared touch device, which can greatly reduce the thickness of the substrate from 1mm to 0.125mm. In specific implementation, the flexible material can be transparent flexible PET (polyethylene terephthalate); the disclosed embodiment fixes the position of the flexible substrate by a first predetermined viscous material, and no longer requires a card slot for position limitation, and will not cause installation deviation due to assembly, nor will it cause warping tolerance between the frame structure due to installation, so that there is no obstruction to the infrared emission light or infrared reception light, avoiding the problem of light blocking caused by installation deviation. The traditional infrared touch device is often subjected to the deformation of the whole structure and the light intensity. The external receiving lamps are all 3mm-3.5mm chip-type infrared light-emitting diodes. The embodiments of the present disclosure replace them with MiniLEDs, which are significantly reduced in size. The distance between the flexible substrate and the infrared filter strip is further reduced, so that the thickness is further reduced. The embodiments of the present disclosure stick the infrared filter strip to the frame structure through a second predetermined adhesive material, which saves the card slot on the frame structure that should be designed for the infrared filter strip. The card slot is no longer needed for position limitation, the width required for designing the card slot is eliminated, and there is no need to reserve tolerance for the card slot, which further reduces the width and thickness of the frame structure. Since the frame structure has multiple frame edges, the width of the frame structure can be significantly changed, and it is directly narrowed intuitively.
[0106] The infrared touch device of the disclosed embodiment adopts a flexible substrate, which directly reduces the thickness of the substrate, and is connected to the infrared filter strip by a first predetermined adhesive material to achieve position fixation, and is connected to the frame structure by a second predetermined adhesive material, thereby eliminating the width required for designing the card slot and the tolerance that must be retained, and the infrared lamp is designed as a MiniLED, so that the positions of the infrared filter strip and the flexible substrate are closer, further saving design space, and thinning the thickness of the frame structure in the infrared touch device as a whole, solving the problems of high floating touch height and poor touch experience, and improving product performance and user experience.
[0107] The above-mentioned MiniLED may be a MiniLED with a built-in driver chip. By adopting the above-mentioned design structure, the thickness thereof is reduced by at least 50% of the height.
[0108] Of course, if all MiniLEDs with built-in driver chips are used, the cost of the infrared touch device may be more expensive. Therefore, it is also possible not to use MiniLEDs with built-in driver chips, but only use ordinary MiniLEDs. Since their appearance is much smaller than that of ordinary infrared lamps, the thinning effect on the frame structure still exists. However, for ordinary MiniLEDs, their corresponding driver chips can be set on the back of the flexible substrate, that is, the driver chip is set on the other side of the flexible substrate where the infrared lamp is not set, and the driver chip is used to control the turning on and off of the infrared lamp; the electrode wiring of the infrared lamp is connected to the preset binding area, and the electrode wiring is connected to the driver chip corresponding to the infrared lamp through the preset binding area.
[0109] The disclosed embodiment can also connect multiple infrared lamps to one driver chip, that is, connect the electrode wiring to the driver chip corresponding to the infrared lamp through a preset binding area, so as to save the cost of the infrared touch device by adopting a time-sharing drive control method for the infrared lamp.
[0110] In order to further ensure the light emitting effect of MiniLED, the height of the first predetermined viscous material can be set to be greater than or equal to the height of the infrared lamp, and the angle formed by the midpoint of the connection between the first predetermined viscous material and the infrared filter strip and the center point of the infrared lamp on the flexible substrate relative to the midpoint of the connection between the first predetermined viscous material and the flexible substrate and the center point of the infrared lamp on the flexible substrate is less than or equal to 30 degrees, that is, to ensure that the infrared light emitted by MiniLED to the infrared filter strip is not blocked. In specific implementation, the angle can be determined according to the height and setting position of the first predetermined viscous material, and is no longer limited here.
[0111] The receiving infrared lamp and the transmitting infrared lamp can be set on the flexible substrate of each frame edge in the above-mentioned frame structure according to needs. For example, the receiving infrared lamp and the transmitting infrared lamp are set on the flexible substrate according to a predetermined distribution regular period, that is, the receiving infrared lamp and the transmitting infrared lamp can be alternately set at a predetermined number of intervals.
[0112] The display structure of the infrared touch device may further include a glass cover plate 8 connected to the outer frame structure, a liquid crystal display panel 9 arranged under the glass cover plate, and other devices. For example, it may also include a backlight assembly. Since it does not involve the improvement of the embodiment of the present disclosure, it will not be described one by one here.
[0113] The above embodiments of the present disclosure are exemplarily described below with reference to the accompanying drawings and specific data.
[0114] The existing traditional infrared touch device is designed with a fixed card slot in the frame profile of the whole machine, which is used to install the infrared touch frame of the printed circuit board PCB. However, due to the offset installation of the touch frame or the large tolerance of the card slot, the infrared emission / reception light is blocked and cannot come out, which directly affects the touch experience; at the same time, the infrared lamp of the traditional infrared touch device uses a 3-5mm surface-mount infrared light-emitting diode, and the thickness of the overall touch frame reaches 5-6mm.
[0115] The disclosed embodiment provides a novel infrared touch device, which optimizes the material of the touch frame and the packaging method of the infrared lamp based on the existing infrared touch display device, and adopts a novel reflective bonding process to bond the touch frame to the light-incoming surface of the infrared filter strip. Compared with the existing infrared touch device, the following three optimizations are made: first, the PCB printed circuit board is replaced with a transparent flexible PET substrate, which can greatly reduce the thickness of the substrate from 1mm to 0.125m; second, the infrared transceiver diode is replaced with a MiniLed, and the MiniLed can also be packaged with a built-in driver IC chip. This design can greatly reduce the height of the touch frame by at least 50%; third, double-sided tape or a sticky soft adhesive layer with vertical strips / hollowed-out infrared lamps is attached to both sides of the infrared lamp surface on the transparent flexible substrate. When assembling the touch frame, the double-sided tape surface can be attached to the light-incoming surface of the infrared filter strip, which can avoid the problem of light being blocked due to installation deviation.
[0116] The specific implementation scheme is to optimize the structure of the arrangement mode of the existing projected infrared touch frame on the flexible substrate to use transparent flexible PET as the substrate, and attach a small packaged infrared light-emitting diode or a lamp tube packaging structure with a built-in driver IC chip to the front. Vertical strips of double-sided tape are attached to both sides of the long side of the transparent flexible PET substrate, which can be adhered to the light-incoming side of the infrared filter strip. The assembly method adopts a new reflective infrared touch solution. The filter strip is located on the side parallel to the glass surface, and the emitted light is reflected by the filter strip to the upper surface of the LCD liquid crystal glass (i.e., the liquid crystal display panel).
[0117] The prior art uses a flexible substrate with a thickness of 1 mm, and selects a vertical patch infrared transceiver lamp with a packaging height of 3 to 5 mm (such as 3.3 mm in height, 4.46 mm in length, and 2.8 mm in width); a card slot is set on the existing frame structure for embedding the flexible substrate, and the infrared transceiver lamp is located on the flexible substrate. During assembly, the flexible substrate with the infrared transceiver lamp is slowly inserted from one end into the frame structure along the card slot until the other end of the frame side of the frame structure, and the four-side touch frames are connected through the flexible substrate.
[0118] like Figure 7 The figure is a schematic diagram of the cross-sectional structure of the infrared touch device of the embodiment of the present disclosure, which includes a glass cover, LCD liquid crystal glass, a transparent flexible PET substrate, an infrared transceiver MiniLed, an infrared filter strip, and a double-sided adhesive tape. The optimized new infrared touch frame is composed of a transparent flexible PET substrate, an infrared transceiver MiniLed, an infrared filter strip, and a double-sided adhesive tape. If necessary, a convex filter strip or other focusing fixture can be added as a part of the new infrared touch frame.
[0119] Figure 8 This is a top view of the touch frame when looking down from the infrared filter strip when there is no built-in driver chip MiniLed. MiniLed is arranged in an intermittent arrangement of transmission and reception, and adopts a time-sharing drive method, which can save a part of the circuit. The remaining circuit can be made on the other side of a separate flexible substrate. The connection between the two sides of the touch frame (or between substrates) can be made by B2B connector or lead-out binding area, crimping flexible circuit board (FPC) and then B2B connection; if some switch control circuits must be distributed close to the lamp, the transparent electrode leads made on the flexible substrate can be brought out to the nearby binding area and bound with a flexible circuit board to make the two layers of the flexible substrate circuit mutually conductive. Among them, MiniLed adopts MiniLed packaging, and adopts the existing Mental mesh or nanosilver solution similar to capacitive touch to design the transparent electrode layer and conductive contacts, and the positive and negative poles of MiniLed are respectively connected to the reserved conductive contacts.
[0120] After completing the arrangement of the peripheral device circuit and the infrared transceiver lamp based on the above, the softness of the transparent flexible PET substrate can be used to stick double-sided tape or other sticky materials with a height similar to that of the infrared transceiver lamp on both sides of the flexible substrate of the touch frame. The selected double-sided tape width and height do not affect the light emission within the emission angle of the infrared emitting lamp (the conventional reflection angle is perpendicular to the infrared lamp and 60° on both sides). The function of the double-sided tape is to stick to the light-incoming surface of the infrared filter strip, which can not only save the card slot specially set for the flexible substrate of the frame structure and shorten the profile width, but also can be inserted into the frame structure without a little bit to prevent the insertion deviation. At the same time, it can also be assembled before the incoming materials, saving the assembly step in the factory, and only the boards need to be connected.
[0121] The traditional infrared transceiver lamps used in existing oversized devices cannot be reduced in size due to various reasons, such as the weakening of light intensity after the lamp is reduced and the high requirements for the deformation degree of structural parts. However, the optimized MiniLed solution can not only meet the requirements of reducing the lamp size, but also ensure that the light intensity still meets the requirements. A convex infrared filter strip is added to concentrate and enhance the light intensity.
[0122] The convex structure designs the light-incoming surface of the filter strip to be similar to a plano-convex lens shape. According to the selection of infrared lamps, a convex infrared filter strip with specific focal length, thickness and other parameters is made. The convex lens focusing principle is adopted to converge the light within the emission range of the infrared lamp at a specific angle and enter the oblique reflective surface of the filter strip to be reflected onto the cover glass. At the same time, due to the smaller package size of MiniLed, the infrared MiniLed can be arranged more densely to improve the touch accuracy.
[0123] The infrared touch device of the disclosed embodiment can reduce the original 6mm thick infrared touch frame (including the height of the PCB board and the infrared lamp) to less than 2mm, presenting an extremely narrow frame. The touch frame using a transparent flexible PET substrate can also be bonded before the filter strip is shipped, eliminating the step of installing the incoming materials, and there is no need to consider the impact of misalignment caused by improper assembly. In addition, if the intensity of the infrared light of a small Mini Led is not enough for a large size, the light intensity can be increased by adding a convex filter strip or other focusing methods.
[0124] The embodiments of the present disclosure also provide an ultra-thin interactive device, which at least includes the infrared touch device in the above embodiments of the present disclosure. The specific structure of the infrared touch device will not be repeated here. The ultra-thin interactive device can be used as a conference machine or an educational machine to achieve different functions. When configuring the ultra-thin interactive device, it is only necessary to configure different interactive programs according to the different functions to be achieved. Since the interactive program does not belong to the content protected by the embodiments of the present disclosure, the interactive program will not be further described here.
[0125] The above drawings of the present disclosure are all for better displaying the structure of the embodiments of the present disclosure. Therefore, the proportions on the drawings do not completely correspond to the actual proportions, but they do not constitute a limitation to the embodiments of the present disclosure.
[0126] In addition, although exemplary embodiments have been described herein, the scope includes any and all embodiments based on the present disclosure with equivalent elements, modifications, omissions, combinations (e.g., various embodiments intersecting schemes), adaptations or changes. The elements in the claims will be interpreted broadly based on the language adopted in the claims, and are not limited to the examples described in this specification or during the implementation of this application, and the examples will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered as examples only, and the true scope and spirit are indicated by the following claims and the full scope of their equivalents.
[0127] The above description is intended to be illustrative rather than restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. For example, a person of ordinary skill in the art can use other embodiments when reading the above description. In addition, in the above-mentioned specific embodiments, various features can be grouped together to simplify the present disclosure. This should not be interpreted as an intention that a disclosed feature that is not required to be protected is necessary for any claim. On the contrary, the subject matter of the present disclosure may be less than all the features of a specific disclosed embodiment. Thus, the following claims are incorporated into the specific embodiments as examples or embodiments, wherein each claim is independently used as a separate embodiment, and it is considered that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present disclosure should be determined with reference to the attached claims and the full scope of equivalent forms granted by these claims.
[0128] Multiple embodiments of the present disclosure are described in detail above, but the present disclosure is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications to the embodiments based on the concepts of the present disclosure, and these variations and modifications should all fall within the scope of protection required by the present disclosure.
Claims
1. An infrared touch device, characterized in that: At least: A frame structure, wherein at least an infrared filter strip, an infrared lamp, and a flexible substrate are arranged in the frame structure; The infrared lamp is arranged on the flexible substrate; The side of the flexible substrate provided with the infrared lamp is connected to the infrared filter strip via a first predetermined adhesive material to fix the position of the flexible substrate; The height of the first predetermined viscous material is greater than or equal to the height of the infrared lamp, and the angle formed by a line connecting a midpoint of a connection between the first predetermined viscous material and the infrared filter strip and a center point of the infrared lamp on the flexible substrate relative to a line connecting a midpoint of a connection between the first predetermined viscous material and the flexible substrate and a center point of the infrared lamp on the flexible substrate is less than or equal to 30 degrees.
2. The infrared touch device according to claim 1, characterized in that: The material of the flexible substrate includes at least one of the following: polyethylene terephthalate and polyethylene phthalate.
3. The infrared touch device according to claim 1, characterized in that: The thickness of the flexible substrate ranges from 0.075 mm to 0.175 mm.
4. The infrared touch device according to claim 1, characterized in that: The infrared lamp is MiniLED.
5. The infrared touch device according to claim 4, characterized in that: Also includes: A driving chip is arranged on the other side of the flexible substrate where the infrared lamp is not arranged, and the driving chip is used to control the turning on and off of the infrared lamp; The electrode wiring of the infrared lamp is connected to a preset binding area, and the electrode wiring is connected to a driving chip corresponding to the infrared lamp through the preset binding area.
6. The infrared touch device according to claim 4, characterized in that: Also includes: A driving chip is arranged on the other side of the flexible substrate where the infrared lamp is not arranged, and the driving chip is used to control the turning on and off of the infrared lamp; The electrode wiring of the infrared lamp is connected to the driving chip corresponding to the infrared lamp through the through hole on the flexible substrate, wherein the through hole is filled with a conductive material.
7. The infrared touch device according to claim 6, characterized in that: One driving chip is connected to a plurality of infrared lamps.
8. The infrared touch device according to claim 4, characterized in that: The MiniLED is a MiniLED with a built-in driver chip.
9. The infrared touch device according to claim 1, wherein: The infrared filter strip is connected to the frame structure through a second predetermined adhesive material.
10. The infrared touch device according to claim 9, characterized in that: The first predetermined adhesive material and / or the second predetermined adhesive material is a double-sided adhesive.
11. The infrared touch device according to any one of claims 1 to 10, characterized in that: The side of the infrared filter strip close to the infrared lamp has a convex structure for focusing light.
12. The infrared touch device according to claim 11, characterized in that: An adhesive step is provided at an extension position of the convex structure, and the adhesive step is used to connect with the first predetermined adhesive material.
13. The infrared touch device according to claim 12, characterized in that: The sticking step has the same height as the convex structure.
14. The infrared touch device according to claim 1, wherein: The receiving infrared lamp and the transmitting infrared lamp are arranged on the flexible substrate according to a predetermined distribution regular period.
15. The infrared touch device according to claim 1, characterized in that: Also includes: A glass cover plate connected to the frame structure portion, a liquid crystal display panel and a backlight assembly arranged under the glass cover plate.
16. An ultra-thin interactive device, characterized in that: At least: The infrared touch device according to any one of claims 1 to 15.
Citation Information
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