Substrate processing system, load port and method

Abstract

The present disclosure relates to substrate processing systems, load ports, and methods. A system includes at least one sensor and at least one controller. The at least one sensor is configured to generate a first weight signal corresponding to a first weight of a first batch of substrates and a second weight signal corresponding to a second weight of a second batch of substrates. The at least one controller is coupled to the at least one sensor to receive the first weight signal and the second weight signal. The at least one controller is configured to convert a weight difference between the first weight and the second weight to a number of substrates each having a predetermined weight. The at least one controller is further configured to control a processing apparatus to simultaneously spin the first batch of substrates and the second batch of substrates based on the converted number of substrates.

Description

Technical Field

[0001] This disclosure relates to substrate processing systems, loading ports, and methods. Background Technology

[0002] Integrated circuits (ICs) are used in various electronic devices, such as computers, cameras, cell phones, and tablets. ICs are typically manufactured on wafers through a series of processing steps, such as material deposition, patterning, etching, cleaning, drying, and monolithization. In some applications, IC manufacturing steps include wet cleaning, which involves immersing the wafer to be cleaned in a liquid to remove contaminants. After wet cleaning, the cleaned wafer is mounted in a spin dryer, where it is rotated at high speed to remove any remaining liquid from the cleaned wafer through centrifugal force. During this high-speed rotation, the rotational balance of the spin dryer and / or the wafer mounted therein is a consideration in the IC manufacturing process and / or equipment. Summary of the Invention

[0003] According to one embodiment of this disclosure, a system for wafer processing is provided, comprising: at least one sensor configured to generate: a first weight signal corresponding to a first weight of a first batch of substrates, and a second weight signal corresponding to a second weight of a second batch of substrates; at least one controller coupled to the at least one sensor to receive the first weight signal and the second weight signal, the at least one controller being configured to: convert the weight difference between the first weight and the second weight into a number of substrates each having a predetermined weight, and based on the converted number of substrates, control a processing device to simultaneously rotate the first batch of substrates and the second batch of substrates.

[0004] According to another embodiment of this disclosure, a loading port for a wafer processing system is provided, the loading port comprising: a first box support configured to support a first box containing a first batch of wafers thereon; at least one first sensor coupled to the first box support and configured to generate a first weight signal corresponding to a first total weight of the first box and the first batch of wafers; a second box support configured to support a second box containing a second batch of wafers thereon; at least one second sensor coupled to the second box support and configured to generate a second weight signal corresponding to a second total weight of the second box and the second batch of wafers; and a microcontroller (MCU) coupled to the at least one first sensor and the at least one second sensor to receive the first weight signal and the second weight signal, respectively, the MCU being configured to: convert the weight difference between the first total weight and the second total weight into the number of wafers each having a predetermined weight; generate an indicator indicating whether the first batch of wafers is heavier or lighter than the second batch of wafers; and output the indicator and the converted wafer number to a controller of a processing device of the wafer processing system, such that the controller can control the processing device to simultaneously balance the rotation of the first batch of wafers and the second batch of wafers.

[0005] According to another embodiment of this disclosure, a method for wafer processing is provided, comprising: obtaining a weight difference between a first weight of a first batch of substrates and a second weight of a second batch of substrates; converting the weight difference into a number of substrates each having a predetermined weight; generating an indicator indicating whether the first weight is heavier or lighter than the second weight; and controlling a processing device to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates based on the converted number of substrates and the indicator. Attached Figure Description

[0006] The various aspects of this disclosure can be best understood by reading in conjunction with the accompanying drawings and the following detailed description. Note that, in accordance with standard industry practice, the features are not drawn to scale. In fact, for clarity, the dimensions of the features may be arbitrarily increased or decreased.

[0007] Figure 1 This is a schematic diagram of a wafer processing system according to some embodiments.

[0008] Figure 2 This is a schematic diagram of a substrate processing system according to some embodiments.

[0009] Figure 3A This is a schematic side view of a cassette support according to some embodiments.

[0010] Figure 3B According to some embodiments Figure 3A A schematic partial top view of the box support component.

[0011] Figure 3C This is a schematic diagram of the sensor arrangement and corresponding controller on the box support according to some embodiments.

[0012] Figure 4 This is a flowchart of a method according to some embodiments.

[0013] Figure 5 This is a block diagram of a controller according to some embodiments.

[0014] Figure 6 This is a block diagram of an IC manufacturing system and its associated IC manufacturing process according to some embodiments. Detailed Implementation

[0015] The following disclosure provides numerous different embodiments or examples for implementing various features of the provided subject matter. Specific examples of components, values, steps, operations, materials, and arrangements are described below to simplify this disclosure. These are merely examples and are not intended to be limiting. Other components, values, steps, operations, materials, and arrangements are contemplated. For example, in the following description, forming a first feature above or on a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature is formed between the first and second features such that the first and second features do not need to be in direct contact. Additionally, reference numerals and / or letters may be repeated in various examples. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0016] Furthermore, for ease of description, spatial relative terms such as "below," "under," "below," "above," "above," etc., may be used herein to describe the relationship between one element or feature and another element (or feature) or feature (or feature) as shown in the figures. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0017] In some embodiments, at least one sensor is used to detect the weight difference between different lots of wafers to be installed in a rotary dryer. The weight difference is converted into the number of wafers, each with a predetermined wafer weight. The converted wafer number is input into the controller of the rotary dryer. The controller uses the input wafer number to control the balancing mechanism of the rotary dryer to achieve rotational balance when different lots of wafers are rotated simultaneously or in the rotary dryer. Because the wafer number input to the controller of the rotary dryer is converted based on the weight difference between the lots of wafers to be rotated, it accurately reflects the weight distribution inside the rotary dryer, thereby improving rotational balance during the rotational operation of the rotary dryer in at least one embodiment. In other methods, one or more wafer numbers input to the controller of the rotary dryer reflect the difference in the number of wafers in the different lots of wafers to be rotated, rather than the weight difference. As a result, when the lots of wafers to be rotated include wafers with different wafer weights, the wafer numbers input to the controller of the rotary dryer in these other methods may not accurately reflect the weight distribution inside the rotary dryer, leading to the risk of rotational imbalance, alarms, or manufacturing process stoppage. At least one embodiment described herein makes it possible to avoid this drawback of other methods.

[0018] Figure 1 This is a schematic diagram of a wafer processing system 100 according to some embodiments. The wafer processing system 100 includes a loading port 120, a robot 130, a plurality of processing devices 140, 141, and a controller 150. In some embodiments, the wafer processing system 100 is a wet cleaning station tool.

[0019] Load port 120 is configured to load or transfer a wafer into wafer processing system 100 for processing by one or more processing devices 140, 141. Figure 1 In the example configuration, load port 120 is also configured to unload or transfer wafers from wafer processing system 100 after they have been processed by one or more processing devices 140, 141. In another example, wafer processing system 100 also includes a separate unload port (not shown) for unloading processed wafers. In at least one embodiment, a batch or stack of wafers is contained in a cassette that is loaded into load port 120.

[0020] The robotic arm 130 is configured to transfer loaded wafers from the loading port 120 to one or more processing devices 140, 141 and sequentially through one or more processing devices 140, 141. In at least one embodiment, the wafer processing system 100 includes more than one robotic arm 130 and / or more than one loading port 120.

[0021] Processing apparatuses 140 and 141 are configured to perform one or more processes or treatments on transported wafers, such as plasma processing, chemical vapor deposition (CVD), atomic layer deposition (ALD), physical vapor deposition (PVD), annealing, etching, degassing, pre-cleaning, cleaning, post-cleaning, drying, etc. Processing apparatuses 140 and 141 include a rotary dryer 141 configured to remove liquids or other contaminants from the wafer by rotating it, as described herein. Figure 1 In the example configuration, processing devices 140 and 141 are arranged along a straight line. Other configurations are within the scope of various embodiments.

[0022] The controller 150 is coupled to the loading port 120, the robot arm 130, and the processing devices 140, 141, and is configured to control the loading, transfer, processing, and unloading of wafers. Figure 1 A controller 150 is shown. In at least one embodiment, one or more other controllers (not shown) are included in the wafer processing system 100. Each such other controller is dedicated to cooperating with or under the control of controller 150 to control the loading port 120, the robot arm 130, or the processing devices 140, 141. For example, each of the loading port 120 and the rotary dryer 141 has a dedicated controller, as described herein. In one or more embodiments, the controller of the wafer processing system 100 includes a hardware platform, such as a processor or chip coupled to memory, which can be programmed by software and / or firmware to perform one or more functions, operations, or processes described herein. In some embodiments, the controller of the wafer processing system 100 includes dedicated hardware circuitry, for example, hardwired in the form of an application-specific integrated circuit (ASIC) to perform one or more functions, operations, or processes described herein. (Refer to...) Figure 5 Another example hardware configuration of the controller for the wafer processing system 100 is described.

[0023] Figure 2This is a schematic diagram of a substrate processing system 200 according to some embodiments. The substrate processing system 200 includes: a loading section 220 for receiving a substrate, a processing apparatus 240 for rotating or turning the substrate, and a controller 250 for controlling at least one of the loading section 220 or the processing apparatus 240. In some embodiments, the substrate to be processed or fabricated by the substrate processing system 200 is a wafer. For example, the substrate processing system 200 corresponds to a wafer processing system 100, the loading section 220 corresponds to a loading port 120, the processing apparatus 240 corresponds to a rotary dryer 141, and the controller 250 corresponds to one or more controllers of the wafer processing system 100. However, in various embodiments, the substrate processing system 200 is configured to process or fabricate substrates other than wafers. For simplicity, in some embodiments described below, unless otherwise stated, the substrate to be processed or fabricated by the substrate processing system 200 is a wafer.

[0024] The loading section 220 is configured to accommodate a first batch of wafers 221 and a second batch of wafers 222. The first batch of wafers 221 is contained in a first box 223, and the second batch of wafers 222 is contained in a second box 224. Although in Figure 2 For illustrative purposes, the first batch of wafers 221 is shown outside the first box 223, but when the first batch of wafers 221 is transferred to the loading section 220, the first batch of wafers 221 is contained within the first box 223 and along a path perpendicular to... Figure 2 The wafers are arranged along the plane axis. Similarly, when the second batch of wafers 222 is transferred to the loading section 220, the second batch of wafers 222 is contained in the second box 224 and arranged along the plane axis. Figure 2 The axial arrangement of the plane.

[0025] The loading unit 220 includes a first housing support 225, a second housing support 226, a plurality of first rods 227, a plurality of second rods 228, a platform 229, a plurality of first sensors 231 corresponding to the first rods 227, a plurality of second sensors 232 corresponding to the second rods 228, a plurality of sensor supports 233, and another platform 234. The first housing support 225 is configured to support a first housing 223 containing the first batch of wafers 221. The second housing support 226 is configured to support a second housing 224 containing a second batch of wafers 222.

[0026] Each first rod 227 extends downward from the bottom of the first housing support 225 through the platform 229 to rest on the end of a corresponding first sensor 231. The opposite ends of the corresponding first sensors 231 are supported from below by a corresponding sensor support 233 on another platform 234. The first rod 227 is configured to transfer a first load corresponding to a first total weight of the first housing 223 and the first batch of wafers 221 to the first sensor 231. The first load applied from the first rod 227 causes the first sensor 231 to deform and generate a first weight signal S1 corresponding to the first total weight.

[0027] Each second rod 228 extends downward from the bottom of the second housing support 226 through the platform 229 to rest on the end of the corresponding second sensor 232. The opposite ends of the corresponding second sensors 232 are supported from below by a corresponding sensor support 233 on another platform 234. The second rods 228 are configured to transfer a second load corresponding to the second total weight of the second housing 224 and the second batch of wafers 222 to the second sensor 232. The second load applied from the second rods 228 causes the second sensor 232 to deform and generate a second weight signal S2 corresponding to the second total weight. Examples of the first sensor 231 and / or the second sensor 232 include, but are not limited to, pressure sensors, weight sensors, force sensors, strain gauges, dynamometers, piezoelectric sensors, fiber optic sensors, capacitive sensors, etc.

[0028] The extensions of the first rod 227 and the second rod 228 through the platform 229 ensure stable movement of the first rod 227 and the second rod 228, and / or reliable load transfer to the first sensor 231 and the second sensor 232. However, other arrangements for transferring load to the first sensor 231 and / or the second sensor 232 are within the scope of various embodiments. Furthermore, the described arrangement of the first rod 227 and the second rod 228 on one side and the sensor support 233 on the opposite side for deforming the first sensor 231 and the second sensor 232 is an example, and other arrangements for deforming the first sensor 231 and / or the second sensor 232 are within the scope of various embodiments.

[0029] In at least one embodiment, it is sufficient for the loading unit 220 to include a single first sensor 231 for generating a first weight signal S1 and / or a single second sensor 232 for generating a second weight signal S2. In some embodiments, it is sufficient for the loading unit 220 to include a single cassette support, such as a first cassette support 225 having one or more corresponding first sensors 231 for generating both the first weight signal S1 and the second weight signal S2. For example, a first cassette 223 containing a first batch of wafers 221 is first placed on the first cassette support 225 to generate the first weight signal S1 by one or more first sensors 231, then the first cassette 223 is removed from the first cassette support 225, and a second cassette 224 containing a second batch of wafers 222 is placed on the first cassette support 225 to generate the second weight signal S2 by one or more first sensors 231.

[0030] In at least one embodiment, the loading unit 220 further includes a wafer counter 235 for counting the number of wafers in the first batch of wafers 221 and / or the second batch of wafers 222. For example, as Figure 2 As shown by the dashed lines, before or after the first batch of wafers 221 and the first cassette 223 are weighed by the first sensor 231, the first cassette 223 containing the first batch of wafers 221 is supported on a support 236 on a platform 229. A wafer counter 235 rises upward through an opening 237 in the platform 229 to approach the wafers in the first batch of wafers 221, which are exposed through an opening 238 on the bottom of the first cassette 223. The wafer counter 235 is positioned along the axis (i.e., perpendicular to) the wafers in the first batch of wafers 221. Figure 2 The wafer counter 235 moves along the plane to count the number of wafers in the first batch of wafers 221. After counting, the wafer counter 235 retracts downwards. An example configuration of the wafer counter 235 includes a light source and a light sensor. The wafers are counted whenever light generated by the light source is blocked by a wafer and becomes undetectable by the light sensor. Although the number of wafers counted by the wafer counter 235 is not used to control or achieve rotational balance in the processing apparatus 240 according to at least one embodiment, the counted number of wafers can be used in other processing apparatuses of the substrate processing system 200. In at least one embodiment, the wafer counter 235 is omitted.

[0031] As described above, in at least one embodiment, the loading section 220 corresponds to the loading port 120, and the components described in the loading section 220 are included in the loading port 120. In at least one embodiment, the loading section 220 is included in a processing device other than the loading port 120. In at least one embodiment, the loading section 220 is included in a processing device 240 or a rotary dryer 141. In at least one embodiment, the loading section 220 is configured in a separate device that is neither a loading port of a wafer processing system nor a processing device of a wafer processing system.

[0032] Processing apparatus 240 is configured to simultaneously rotate or spin the first batch of wafers 221 and the second batch of wafers 222 when multiple batches of wafers are mounted in processing apparatus 240. In at least one embodiment, processing apparatus 240 is a rotary dryer such as rotary dryer 141. However, applications of processing apparatus 240 other than drying wafers are also within the scope of various embodiments. For example, in at least one embodiment, processing apparatus 240 is configured for any application involving the simultaneous rotation of multiple batches of substrates while achieving rotational balance of such rotation. For simplicity, in some embodiments described below, processing apparatus 240 is referred to as rotary dryer 240.

[0033] The rotary dryer 240 includes a frame (or turntable) 241, a motor 242 configured to rotate the frame 241 about a rotation axis 243, and a balancing mechanism 244. The frame 241 is configured to support and hold the wafers to be rotated. For example, after the weighing operation at the loading section 220, a robot, such as a robotic arm 130, removes the first batch of wafers 221 from the first bin 223 and transfers the first batch of wafers 221 to a corresponding position on the frame 241 (indicated by the number "1"). Similarly, the robotic arm removes a second batch of wafers 222 from the second bin 224 and transfers the second batch of wafers 222 to a corresponding position on the frame 241 (indicated by the number "2"). The first batch of wafers 221 and the second batch of wafers 222 are held to the frame 241 and will rotate simultaneously with the frame 241 via the motor 242. However, if one of the first batch of wafers 221 and the second batch of wafers 222 is heavier than the other, the rotation of the frame 241, on which multiple batches of wafers are mounted, becomes unbalanced. This unbalanced rotation can potentially cause vibration, excessive wear, or even malfunction of the frame 241 and / or other components of the rotary dryer 240. To avoid or reduce such problems by achieving rotational balance of the frame 241 during rotational operation, a balancing mechanism 244 is provided.

[0034] The balancing mechanism 244 includes an elongated support 245, counterweights 246 and 247, and an actuator 248. The elongated support 245 extends across the frame 241, via a rotation axis 243, between and equidistant from positions "1" and "2" where the first batch of wafers 221 and the second batch of wafers 222 are to be mounted. The counterweights 246 and 247 are mounted on the elongated support 245 to be movable in a direction perpendicular to the length of the elongated support 245, such as... Figure 2 As indicated by the double-ended arrows in the diagram. Actuator 248 is configured to move counterweights 246, 247 under the control of a controller (e.g., controller 250). Examples of actuator 248 include, but are not limited to, servo motors, cylinders, etc. When one batch of wafers mounted on frame 241 is heavier than another batch, controller 250 controls actuator 248 to move counterweights 246, 247 toward the lighter batch to achieve equal or substantially equal weight distribution on opposite sides of elongated support 245. As a result, the rotation of frame 241, on which multiple batches of wafers are mounted, is balanced. Further details of the operation of rotary dryer 240 according to some embodiments are described below. The configuration of the described balancing mechanism 244 is exemplary. Other configurations are within the scope of various embodiments. For example, in some embodiments, the balancing mechanism includes a single counterweight or more than one counterweight. In a further embodiment, rotational balance is achieved by moving the mounting position of at least one of the first batch of wafers 221 or the second batch of wafers 222 toward or away from the rotation axis 243, in addition to or in place of the counterweights 246 and 247.

[0035] The controller 250 includes a microcontroller (MCU) 252 and a programmable logic controller (PLC) 254. In at least one embodiment, the MCU 252 is a controller dedicated to the loading unit 220, and the PLC 254 is a controller dedicated to controlling the rotary dryer 240. In some embodiments, the PLC 254 is not configured to directly accept measurement signals from sensors, and the MCU 252 is configured to serve as an interface between the first sensor 231 and the second sensor 232 located on one side and the PLC 254 located on the other side. Figure 2 The configuration of controller 250 including two controllers (i.e., MCU 252 and PLC 254) is an example. Other configurations are within the scope of various embodiments. For example, in at least one embodiment, MCU 252 and PLC 254 are integrated in a single controller, or controller 250 includes more than two controllers.

[0036] MCU 252 is coupled to a first sensor 231 and a second sensor 232 to receive a first weight signal S1 and a second weight signal S2. MCU 252 includes an analog-to-digital converter (ADC) 256 and processing circuitry 258. In at least one embodiment, each of the ADC 256 and processing circuitry 258 includes one or more circuits, logic elements, drivers, input / output (I / O) ports, etc. In at least one embodiment, MCU 252 is configured on a single chip.

[0037] ADC 256 is configured to convert the first weight signal S1 into first weight data corresponding to a first total weight W1 corresponding to the weight Wc1 of the first box 223 and the weight Ww1 of the first batch of wafers 221. In other words, W1 = Wc1 + Ww1. ADC 256 is also configured to convert the second weight signal S2 into second weight data corresponding to a second total weight W2 corresponding to the weight Wc2 of the second box 224 and the weight Ww2 of the second batch of wafers 222. In other words, W2 = Wc2 + Ww2.

[0038] Processing circuitry 258 is coupled to ADC 256 to receive a first total weight W1 and a second total weight W2. Processing circuitry 258 is configured to determine ΔW = |W1 - W2|. In some embodiments, assuming the first box 223 and the second box 224 are similarly configured and have approximately the same weight, i.e., Wc1 = Wc2, then ΔW = |W1 - W2| = |Ww1 - Ww2|, and ΔW corresponds to the weight difference between the weight Ww1 of the first batch of wafers 221 and the weight Ww2 of the second batch of wafers 222. As described herein, the weight difference ΔW can be used to control and balance the rotation of the first batch of wafers 221 and the second batch of wafers 222 in the rotary dryer 240.

[0039] Specifically, processing circuit 258 is configured to convert the weight difference ΔW between the first batch of wafers 221 and the second batch of wafers 222 into the number of substrates each having a predetermined weight Wn. For example, processing circuit 258 is configured to determine ΔN = ΔW / Wn, where ΔN is the number of substrates converted from ΔW. In some embodiments, the predetermined weight Wn is the nominal wafer weight of a single wafer, and rotary dryer 240 is configured to rotate wafers each having a nominal wafer weight. For example, in some applications, the predetermined weight Wn is 53g. In some cases, the predetermined weight Wn differs from the actual weight of the wafers in the first batch of wafers 221 or the second batch of wafers 222, and / or the actual weight of the wafers in the first batch of wafers 221 differs from the actual weight of the wafers in the second batch of wafers 222. In this case, although the converted wafer number ΔN reflects the weight difference ΔW, it does not necessarily reflect the difference in the number of wafers between the first batch of wafers 221 and the second batch of wafers 222. In some embodiments, the converted wafer quantity ΔN is used as a means of inputting the weight difference ΔW into the controller (e.g., PLC 254) of the rotary dryer 240 for controlling and achieving rotational balance of the rotary dryer 240 during its rotational operation.

[0040] In at least one embodiment, the processing circuit 258 is further configured to round the result of the division ΔW / Wn up or down to the nearest integer to obtain the converted wafer count ΔN. The processing circuit 258 is also configured to output the converted wafer count ΔN in the form of a plurality of first bits. Figure 2 In the exemplary configuration, the five first digits X1-X5 are used to represent ΔN, for example, as shown in the table below, where “0” and a blank represent logical “0” and “1” represents logical “1”.

[0041]

[0042]

[0043] In some applications, the maximum value of ΔN = 25 in the table above corresponds to the maximum number of wafers that can be contained in a cassette. Other arrangements, including other bit values ​​and / or other maximum values ​​of ΔN, are within the scope of various embodiments.

[0044] The processing circuit 258 is also configured to output an indicator showing whether the weight of the first batch of wafers 221 is heavier or lighter than the weight of the second batch of wafers 222. Figure 2In the example configuration, the second bit X6 is used as such an indicator. A first logic state of X6 (e.g., logic "1") indicates that the first batch of wafers 221 is heavier than the second batch of wafers 222. The opposite second logic state of X6 (e.g., logic "0") indicates that the first batch of wafers 221 is lighter than the second batch of wafers 222. In the example, the logic state of X6 is generated by the processing circuit 258 comparing W1 with W2, or based on the sign of the result of subtracting W1-W2. In at least one embodiment, logic "0" of X1-X6 corresponds to a zero ground voltage at the corresponding output pin of MCU 252, and logic "1" of X1-X6 corresponds to a 5V voltage at the corresponding output pin of MCU 252. Other voltages are arranged within the range of various embodiments.

[0045] PLC 254 is coupled to MCU 252 to receive, for example, the converted wafer quantity N and an indicator regarding which batch of wafers is heavier, via a plurality of first bits X1-X5 and second bits X6. PLC 254 is configured to control rotary dryer 240 to simultaneously balance the rotation of the first batch of wafers 221 and the second batch of wafers 222 based on the received converted wafer quantity ΔN and the indicator regarding which batch of wafers is heavier. In at least one embodiment, PLC 254 is configured to control actuator 248 to move weights 246, 247 toward the lighter batch of wafers in the first batch of wafers 221 and the second batch of wafers 222. For example, when an indicator (e.g., second bit X6) indicates that the first batch of wafers 221 at position "1" on frame 241 is heavier than the second batch of wafers 222 at position "2", PLC 254 is configured to control actuator 248 to move weights 246, 247 toward the second batch of wafers 222. When the indicator indicates that the first batch of wafers 221 at position "1" on frame 241 is lighter than the second batch of wafers 222 at position "2", PLC 254 is configured to control actuator 248 to move counterweights 246, 247 toward the first batch of wafers 221.

[0046] The distance by which counterweights 246 and 247 move from the elongated support 245 toward the lighter batch depends on the number ΔN of converted wafers received via the first X1-X5. Specifically, ΔN is derived from the weight difference ΔW between the first batch of wafers 221 and the second batch of wafers 222, and ΔN corresponds to the weight difference ΔW between the first batch of wafers 221 and the second batch of wafers 222. At a higher ΔN, meaning a higher weight difference ΔW, PLC 254 is configured to control actuator 248 to move counterweights 246 and 247 further away from the elongated support 245, i.e., closer to the lighter batch of wafers. At a lower ΔN, meaning a lower weight difference ΔW, PLC 254 is configured to control actuator 248 to move counterweights 246 and 247 closer to the elongated support 245. In at least one embodiment, various values ​​of ΔN and various corresponding movements of the counterweights 246, 247 are predetermined, for example, through experimentation or simulation, and stored as a lookup table on the PLC 254 or a computer-readable storage medium accessible by the PLC 254. As a result, equal or substantially equal weight distributions are achieved on opposite sides of the elongated support 245, thereby producing rotational balance of the rotary dryer 240 during rotational operation.

[0047] Other methods attempt to achieve rotational balancing of the rotary dryer by counting the number of wafers in different batches to be rotated together and inputting the counted number of wafers into the rotary dryer's controller. The rotary dryer's controller treats the difference in the number of counted wafers as a weight difference between batches and controls the rotary dryer's balancing mechanism accordingly. When the individual wafers in the different batches to be rotated have the same predetermined weight or nominal wafer weight Wn, other methods operate as expected. However, when the individual wafers in different batches have different wafer weights, there is a risk of unbalanced rotation. In the example, the two batches of wafers to be rotated each have 25 wafers, but each individual wafer in one batch is heavier than each individual wafer in the other batch. The rotary dryer's controller receives the same counted number of wafers (i.e., 25) in both batches and considers the two batches to be equal in weight, and does not activate the balancing mechanism. As a result, even though one batch of wafers is heavier than the other, the rotary dryer operates without balancing, leading to unbalanced rotation and potentially causing alarms, equipment damage, and / or process shutdowns.

[0048] At least one embodiment described herein allows for the avoidance of the disadvantages of other methods. Specifically, the converted wafer quantity ΔN input to PLC 254 corresponds to the weight difference ΔW between the first batch of wafers 221 and the second batch of wafers 222. Therefore, even when the first batch of wafers 221 and the second batch of wafers 222 have the same number of wafers but different weights, PLC 254 can still activate balancing mechanism 244 to achieve rotational balancing based on the weight difference ΔW (represented by the converted wafer quantity ΔN), instead of disabling the balancing mechanism due to the same number of wafers in each batch as in other methods. As a result, in some embodiments, one or more advantages can be achieved, including but not limited to: ensuring rotational balancing of individual wafers in each batch to be rotated together under various wafer weights, reducing equipment tearing and wear and / or equipment failure, reducing alarms, downtime or interruptions, increasing tool availability, reducing the impact of tools on the products being manufactured (e.g., ICs), etc.

[0049] In some cases, due to rounding up or down ΔW / Wn to obtain ΔN, there is an error of up to approximately half of Wn or the nominal wafer weight of a single wafer. However, the balancing mechanism 244 according to some embodiments is configured with an acceptable tolerance of up to one Wn, within which rotational balancing can still be achieved. Therefore, one or more embodiments can achieve rotational balancing in a variety of situations. At least one embodiment is suitable for a rotary dryer for rotating and achieving rotational balancing of wafers manufactured according to different technology generations.

[0050] Figure 3A This is a schematic side view of a box support 325 according to some embodiments. Figure 3B According to some embodiments Figure 3A A schematic partial top view of the cassette support 325. In some embodiments, the cassette support 325 corresponds to a first cassette support 225 or a second cassette support 226 in the substrate processing system 200. In some embodiments, the cassette support 325 is included in a loading port, such as loading port 120 in the wafer processing system 100.

[0051] like Figure 3B As shown, the housing support 325 includes a top surface 331 configured to support a housing containing a wafer thereon; and a plurality of sidewalls 332 extending around the top surface 331. Figure 3AAs shown, the sidewall 332 extends upward and obliquely from the top surface 331. On the bottom surface 333 opposite the top surface 331, the box support 325 includes a plurality of hollow hubs 334, 335 with downwardly oriented openings. A rod 336 has an upper end 337 received in a corresponding hub 334 to couple the rod 336 to the box support 325. Similarly, a rod 338 has an upper end 339 received in a corresponding hub 335 to couple the rod 338 to the box support 325. Figure 3A In the diagram, rod 338 is shown in a state where its upper end 339 is not yet coupled or accommodated in the corresponding hub 335. In at least one embodiment, rods 336, 338 correspond to the first rod 227 or the second rod 228, and have a resting position as described above. Figure 2 The corresponding sensor (in) Figure 3A (Not shown in the image) The lower end of the [something] above. For example... Figure 3B As shown, holes 344 and 345 are formed at the corners of the box support 325 from the top surface 331 to the bottom surface 333. Fasteners (not shown) are placed in the holes 344 and 345 to secure the hollow hubs 334 and 335 to the box support 325, respectively. Figure 3A and Figure 3B The number and / or arrangement of the hollow hubs 334, 335 and the corresponding rods 336, 338 are examples. Other configurations are within the scope of various embodiments. For example, in at least one embodiment, the box support 325 has a single hollow hub on its bottom surface 333 for coupling to a single rod that transfers the load of the box placed on the box support 325 to a single sensor.

[0052] Figure 3C This is a schematic diagram of the sensor arrangement and corresponding controller on the box supports 365, 366 according to some embodiments. In at least one embodiment, the box supports 365, 366 correspond to the box supports 225, 226. Each box support 365, 366 has four sensors arranged at its corners. For example, sensors 371-374 of the box support 365 are arranged at the corners of the box support 365, such as... Figure 3C The numbers 1, 2, 3, and 4 are shown in the diagram. Sensors 381-384 of the box support 366 are arranged at the corners of the box support 366, as shown in the diagram. Figure 3C The numbers 5, 6, 7, and 8 are shown in the diagram. In at least one embodiment, sensors 371-374 correspond to the numbers shown in the diagram. Figure 2 The sensor 231, and / or coupled to receive loads from the box support 365 via a plurality of hollow hubs and rods, as per [reference to...]. Figures 3A-3B The sensors 381-384 correspond to the information described above. Figure 2The sensor 232, and / or coupled to accommodate loads from the housing support 366 via a plurality of hollow hubs and rods, as per [reference to...] Figures 3A-3B The sensor arrangement described herein is an example. Other sensor arrangements are within the scope of various embodiments.

[0053] Figure 4 This is a flowchart of method 400 according to some embodiments. In at least one embodiment, method 400 is performed in wafer processing system 100 or substrate processing system 200, and / or by controller 150 or controller 250.

[0054] In operation 405, the weight difference between the first weight of the first batch of substrates and the second weight of the second batch of substrates is obtained. For example, the weight difference ΔW between the first weight of the first batch of wafers 221 and the second weight of the second batch of wafers 222 is obtained as ΔW = |W1 - W2|, as per [the relevant information]. Figure 2 As described.

[0055] In operation 415, the weight difference is converted into the number of substrates, each with a predetermined weight. For example, the converted number of substrates ΔN is obtained by dividing the weight difference ΔW by the predetermined weight Wn, as per [reference to...]. Figure 2 As described. In at least one embodiment, the converted substrate number ΔN is output as a plurality of first bits, such as X1-X5.

[0056] In operation 425, an indicator is generated to show whether the first weight is heavier or lighter than the second weight. For example, as regarding... Figure 2 As described, an indicator indicating whether the first batch of wafers 221 is heavier or lighter than the second batch of wafers 222 is output as a logic state of the second bit (e.g., X6). In at least one embodiment, the logic state of X6 is generated by comparing W1 with W2 or based on the sign of the result of subtracting W1-W2.

[0057] In operation 435, based on the converted substrate quantity and indicator, the processing equipment is controlled to simultaneously balance the rotation of the first and second batches of substrates. For example, as per [reference to...] Figure 2 As described, PLC254 receives the first bit X1-X5 representing the number of substrates ΔN after conversion and the second bit X6 representing an indicator, and uses the received information to control actuator 248 to adjust the position of counterweights 246, 247 relative to the first batch of wafers 221 and the second batch of wafers 222 mounted on frame 241, thereby achieving rotational balance during the rotational operation of rotary dryer 240.

[0058] The described methods include example operations, but they do not necessarily need to be performed in the order shown. Operations may be appropriately added, substituted, rearranged, and / or eliminated according to the spirit and scope of embodiments of this disclosure. Embodiments combining different features and / or different embodiments are within the scope of this disclosure and will be apparent to those skilled in the art upon review of this disclosure.

[0059] Figure 5 This is a block diagram of a controller 500 according to some embodiments. In at least one embodiment, the controller 500 corresponds to... Figure 1-2 Describe one or more controllers, MCUs, or PLCs.

[0060] In some embodiments, the controller 500 is a general-purpose computing device including a hardware processor 502 and a non-transitory computer-readable storage medium 504. Among other things, the storage medium 504 is encoded with (i.e. stores) computer program code 506, which is an executable instruction set. Execution of the instructions 506 by the hardware processor 502 implements some or all of the methods and / or operations described herein, for example, according to one or more embodiments.

[0061] Processor 502 is electrically coupled to computer-readable storage medium 504 via bus 508. Processor 502 is also electrically coupled to I / O interface 510 via bus 508. Network interface 512 is also electrically coupled to processor 502 via bus 508. Network interface 512 is connected to network 514, enabling processor 502 and computer-readable storage medium 504 to be connected to external components via network 514. Processor 502 is configured to execute computer program code 506 encoded in computer-readable storage medium 504 to cause controller 500 to perform part or all of the processing and / or methods. In one or more embodiments, processor 502 is a central processing unit (CPU), a multiprocessor, a distributed processing system, an application-specific integrated circuit (ASIC), and / or a suitable processing unit.

[0062] In one or more embodiments, the computer-readable storage medium 504 is an electrical, magnetic, optical, electromagnetic, infrared, and / or semiconductor system (or apparatus or device). For example, the computer-readable storage medium 504 includes semiconductor or solid-state memory, magnetic tape, removable computer disk, random access memory (RAM), read-only memory (ROM), rigid disk, and / or optical disk. In one or more embodiments using optical disk, the computer-readable storage medium 504 includes optical disc read-only memory (CD-ROM), optical disc read / write (CD-R / W), and / or digital video disc (DVD).

[0063] The controller 500 includes an I / O interface 510. The I / O interface 510 is coupled to external circuitry. In one or more embodiments, the I / O interface 510 includes a keyboard, keypad, mouse, trackball, trackpad, touchscreen, and / or cursor arrow keys for transmitting information and commands to the processor 502.

[0064] The controller 500 also includes a network interface 512 coupled to the processor 502. The network interface 512 allows the controller 500 to communicate with a network 514, to which one or more other computer systems are connected. The network interface 512 includes a wireless network interface, such as Bluetooth, WiFi, WiMAX, GPRS, or WCDMA; or a wired network interface such as Ethernet, USB, or IEEE-1364.

[0065] Controller 500 is configured to receive information via I / O interface 510. The information received via I / O interface 510 includes one or more of the following: instructions, data, design rules, standard cell libraries, and / or other parameters processed by processor 502. This information is transmitted to processor 502 via bus 508. Controller 500 is also configured to receive UI-related information via I / O interface 510. This information is stored in computer-readable medium 504 as a user interface (UI) 542.

[0066] Figure 6 This is a block diagram of an integrated circuit (IC) manufacturing system 600 and its associated IC manufacturing process according to some embodiments. In some embodiments, based on a layout diagram, the manufacturing system 600 is used to manufacture at least one of (A) one or more semiconductor masks or (B) at least one component of a layer of a semiconductor integrated circuit.

[0067] exist Figure 6 In this IC manufacturing system 600, entities such as design studio 620, mask room 630, and IC manufacturer / fab (“fab”) 650 interact with each other in the design, development, and manufacturing cycles and / or services related to manufacturing IC devices 660. The entities in system 600 are connected via a communication network. In some embodiments, the communication network is a single network. In some embodiments, the communication network is a variety of different networks, such as an intranet and the Internet. The communication network includes wired and / or wireless communication channels. Each entity interacts with one or more other entities and provides services to and / or receives services from one or more other entities. In some embodiments, two or more of the design studio 620, mask room 630, and IC manufacturer / fab 650 are owned by a single larger company. In some embodiments, two or more of the design studio 620, mask room 630, and IC manufacturer / fab 650 coexist in a shared facility and use shared resources.

[0068] Design studio (or design team) 620 generates IC design layout 622. IC design layout 622 includes various geometric patterns designed for IC device 660. These geometric patterns correspond to patterns of metal, oxide, or semiconductor layers that constitute various components of the IC device 660 to be manufactured. Various layers are combined to form various IC features. For example, a portion of IC design layout 622 includes various IC features to be formed on a semiconductor substrate (e.g., a silicon wafer) and various material layers disposed on the semiconductor substrate, such as active regions, gate electrodes, source and drain electrodes, metal lines or vias for interlayer interconnects, and openings for bonding pads. Design studio 620 implements appropriate design processes to form IC design layout 622. These design processes include one or more of logic design, physical design, or placement and routing. IC design layout 622 is presented in one or more data files containing information about the geometric patterns. For example, IC design layout 622 may be expressed in GDSII or DFII file format.

[0069] Mask chamber 630 includes data preparation 632 and mask fabrication 644. Mask chamber 630 uses an IC design layout 622 to fabricate one or more masks 645 for fabricating various layers of an IC device 660 according to the IC design layout 622. Mask chamber 630 performs mask data preparation 632, in which the IC design layout 622 is converted into a representative data file (“RDF”). Mask data preparation 632 provides the RDF to mask fabrication 644. Mask fabrication 644 includes a mask writer. The mask writer converts the RDF into an image on a substrate, such as a mask (intermediate mask) 645 or a semiconductor wafer 653. The design layout 622 is manipulated by mask data preparation 632 to conform to the specific characteristics of the mask writer and / or the requirements of the IC manufacturer / manufacturer 650. Figure 6 In this embodiment, mask data preparation 632 and mask manufacturing 644 are shown as separate elements. In some embodiments, mask data preparation 632 and mask manufacturing 644 may be collectively referred to as mask data preparation.

[0070] In some embodiments, mask data preparation 632 includes optical proximity correction (OPC), which uses lithographic enhancement techniques to compensate for image errors, such as those caused by diffraction, interference, other processing effects, etc. OPC adjusts the IC design layout diagram 622. In some embodiments, mask data preparation 632 includes further resolution enhancement techniques (RET), such as off-axis illumination, sub-resolution auxiliary features, phase-shift masks, other suitable techniques, or combinations thereof. In some embodiments, inverse lithography (ILT) is also used, treating OPC as an inverse imaging problem.

[0071] In some embodiments, mask data preparation 632 includes a mask rule checker (MRC) that uses a set of mask creation rules to check the IC design layout 622, which has undergone processing in the OPC, to ensure sufficient margin to account for variability in semiconductor manufacturing processes, etc. In some embodiments, the MRC modifies the IC design layout 622 to compensate for constraints during mask fabrication 644, which can undo some of the modifications performed by the OPC to satisfy the mask creation rules.

[0072] In some embodiments, mask data preparation 632 includes a lithography process check (LPC), which simulates the process performed by the IC manufacturer / manufacturer 650 to manufacture an IC device 660. The LPC simulates this process based on an IC design layout 622 to create a simulated manufactured device, such as IC device 660. Process parameters in the LPC simulation may include parameters associated with various processes in the IC manufacturing cycle, parameters associated with the tools used to manufacture the IC, and / or other aspects of the manufacturing process. The LPC considers various factors, such as spatial image contrast, depth of focus (“DOF”), mask error enhancement factor (“MEEF”), other suitable factors, and combinations thereof. In some embodiments, after a simulated manufactured device has been created via LPC, if the simulated device is not close enough in shape to meet design rules, OPC and / or MRC are repeated to further refine the IC design layout 622.

[0073] It should be understood that the description of mask data preparation 632 above has been simplified for clarity. In some embodiments, data preparation 632 includes additional features (e.g., logic operations (LOPs)) to modify the IC design layout 622 according to manufacturing rules. Furthermore, the processes applied to the IC design layout 622 during data preparation 632 can be performed in various different sequences.

[0074] Following mask data preparation 632 and during mask fabrication 644, a mask 645 or a set of masks 645 is fabricated based on a modified IC design layout 622. In some embodiments, mask fabrication 644 includes performing one or more photolithographic exposures based on the IC design layout 622. In some embodiments, a pattern is formed on the mask (photomask or intermediate mask) 645 using an electron beam (e-beam) or a combination of e-beams based on the modified IC design layout 622. The mask 645 can be formed using various techniques. In some embodiments, the mask 645 is formed using a binary technique. In some embodiments, the mask pattern includes opaque regions and transparent regions. A radiation beam (e.g., an ultraviolet (UV) beam) used to expose an image-sensitive material layer (e.g., a photoresist) coated on the wafer is blocked by the opaque regions and passes through the transparent regions. In one example, a binary mask version of the mask 645 includes a transparent substrate (e.g., fused silica) and an opaque material (e.g., chromium) coated in the opaque regions of the binary mask. In another example, a phase-shifting technique is used to form mask 645. In the phase-shifting mask (PSM) version of mask 645, various features in the pattern formed on the phase-shifting mask are configured to have appropriate phase differences to enhance resolution and imaging quality. In various examples, the phase-shifting mask can be attenuated PSM or alternating PSM. The mask(s) generated by mask fabrication 644 are used in various processes. For example, such masks(s) are used in ion implantation processes to form various doped regions in semiconductor wafer 653, in etching processes to form various etched regions in semiconductor wafer 653, and / or in other suitable processes.

[0075] IC manufacturer / manufacturer 650 is an IC manufacturing enterprise that includes one or more manufacturing facilities for manufacturing various different IC products. In some embodiments, IC manufacturer / manufacturer 650 is a semiconductor foundry. For example, there may be a manufacturing facility for front-end manufacturing (front-end production line (FEOL) manufacturing) of multiple IC products, while a second manufacturing facility may provide back-end manufacturing (back-end production line (BEOL) manufacturing) for interconnection and packaging of IC products, and a third manufacturing facility may provide additional services for foundry business.

[0076] IC manufacturer / manufacturer 650 includes manufacturing tools 652 configured to perform various manufacturing operations on a semiconductor wafer 653 to manufacture an IC device 660 according to a mask (e.g., mask 645). In various embodiments, manufacturing tools 652 include one or more wafer steppers, ion implanters, photoresist coaters, processing chambers (e.g., CVD chambers or LPCVD furnaces), CMP systems, plasma etching systems, wafer cleaning systems, or other manufacturing equipment capable of performing one or more suitable manufacturing processes as discussed herein.

[0077] IC manufacturer / manufacturer 650 manufactures IC device 660 using one or more masks 645 manufactured by mask chamber 630. Therefore, IC manufacturer / manufacturer 650 manufactures IC device 660 at least indirectly using IC design layout 622. In some embodiments, semiconductor wafer 653 is manufactured by IC manufacturer / manufacturer 650 using one or more masks 645 to form IC device 660. In some embodiments, IC manufacturing includes one or more photolithographic exposures based at least indirectly on IC design layout 622. Semiconductor wafer 653 includes a silicon substrate or other suitable substrate on which material layers are formed. Semiconductor wafer 653 also includes one or more various doped regions, dielectric features, multilayer interconnects, etc. (formed in subsequent manufacturing steps).

[0078] Regarding integrated circuit (IC) manufacturing systems (e.g., Figure 6 For details of the System 600 and its associated IC manufacturing process, see, for example, U.S. Patent No. 9,256,709, granted February 9, 2016; U.S. Pre-Grant Publication No. 20150278429, published October 1, 2015; U.S. Pre-Grant Publication No. 20140040838, published February 6, 2014; and U.S. Patent No. 7,260,442, granted August 21, 2007, the entire contents of which are incorporated herein by reference.

[0079] In some embodiments, a system includes at least one sensor and at least one controller. The at least one sensor is configured to generate a first weight signal corresponding to a first weight of a first batch of substrates and a second weight signal corresponding to a second weight of a second batch of substrates. The at least one controller is coupled to the at least one sensor to receive the first weight signal and the second weight signal. The at least one controller is configured to convert the weight difference between the first weight and the second weight into a number of substrates, each having a predetermined weight. The at least one controller is also configured to control a processing device to simultaneously rotate the first batch of substrates and the second batch of substrates based on the converted number of substrates.

[0080] In some embodiments, a loading port for a wafer processing system includes a first box support and a second box support, at least one first sensor, at least one second sensor, and a microcontroller (MCU). The first box support is configured to support a first box containing a first batch of wafers. At least one first sensor is coupled to the first box support and configured to generate a first weight signal corresponding to a first total weight of the first box and the first batch of wafers. The second box support is configured to support a second box containing a second batch of wafers. At least one second sensor is coupled to the second box support and configured to generate a second weight signal corresponding to a second total weight of the second box and the second batch of wafers. The MCU is coupled to at least one first sensor and at least one second sensor to receive the first weight signal and the second weight signal, respectively. The MCU is configured to convert the weight difference between the first total weight and the second total weight into the number of wafers each having a predetermined weight, generate an indicator indicating whether the first batch of wafers is heavier or lighter than the second batch of wafers, and output the indicator and the converted wafer count to a controller of the processing device of the wafer processing system, enabling the controller to control the processing device to simultaneously balance the rotation of the first batch of wafers and the second batch of wafers.

[0081] In a method according to some embodiments, the weight difference between a first weight of a first batch of substrates and a second weight of a second batch of substrates is obtained. This weight difference is converted into the number of substrates, each having a predetermined weight. An indicator is generated indicating whether the first weight is heavier or lighter than the second weight. Based on the converted number of substrates and the indicator, the processing equipment is controlled to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates.

[0082] The foregoing has outlined features of several embodiments, enabling those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art will understand that they can readily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or advantages as the embodiments described herein. Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of this disclosure.

[0083] Example 1. A system for wafer processing, comprising: at least one sensor configured to generate: a first weight signal corresponding to a first weight of a first batch of substrates, and a second weight signal corresponding to a second weight of a second batch of substrates; at least one controller coupled to the at least one sensor to receive the first weight signal and the second weight signal, the at least one controller being configured to: convert the weight difference between the first weight and the second weight into a number of substrates each having a predetermined weight, and based on the converted number of substrates, control a processing apparatus to simultaneously rotate the first batch of substrates and the second batch of substrates.

[0084] Example 2. The system according to Example 1, wherein: the at least one controller is further configured to: generate an indicator indicating whether the first weight is heavier or lighter than the second weight, and control the processing device to simultaneously rotate the first batch of substrates and the second batch of substrates based on the indicator and the number of the converted substrates.

[0085] Example 3. The system according to Example 2 further includes: the processing device, wherein: the processing device includes a balancing mechanism, and the at least one controller is configured to: control the balancing mechanism to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates based on the indicator and the number of the converted substrates.

[0086] Example 4. The system according to Example 3, wherein: the balancing mechanism includes at least one counterweight, and the at least one controller is configured to: control the balancing mechanism to move the at least one counterweight relative to at least one of the first batch of substrates or the second batch of substrates based on the indicator and the number of converted substrates, so as to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates.

[0087] Example 5. The system according to Example 1 further includes: a first box support configured to support a first box containing the first batch of substrates thereon, wherein the at least one sensor includes at least one first sensor coupled to the first box support and configured to generate a first weight signal corresponding to a first total weight of the first box and the first batch of substrates.

[0088] Example 6. The system according to Example 5 further includes: a second box support configured to support a second box containing the second batch of substrates thereon, wherein the at least one sensor further includes at least one second sensor coupled to the second box support and configured to generate a second weight signal corresponding to a second total weight of the second box and the second batch of substrates.

[0089] Example 7. The system according to Example 6, wherein: the at least one first sensor includes a plurality of first sensors, the at least one second sensor includes a plurality of second sensors, and the system further includes: a plurality of first rods, each first rod extending downward from the bottom of the first box support to a corresponding first sensor among the plurality of first sensors, the plurality of first rods being configured to transmit a first load corresponding to the first total weight to the plurality of first sensors; and a plurality of second rods, each second rod extending downward from the bottom of the second box support to a corresponding second sensor among the plurality of second sensors, the plurality of second rods being configured to transmit a second load corresponding to the second total weight to the plurality of second sensors.

[0090] Example 8. The system according to Example 6, wherein the system is a wafer processing system, comprising: a plurality of processing devices, including a processing device serving as a rotary dryer; a housing housing the plurality of processing devices; and a loading port configured to load the first batch of substrates and the second batch of substrates into the housing for processing by one or more of the plurality of processing devices, wherein the loading port includes a first box support, a second box support, the at least one first sensor, and the at least one second sensor.

[0091] Example 9. The system according to Example 6, wherein the at least one controller includes: an analog-to-digital converter (ADC) configured to: convert the first weight signal into first weight data corresponding to the first weight, and convert the second weight signal into second weight data corresponding to the second weight; and processing circuitry coupled to the ADC to receive the first weight data and the second weight data, the processing circuitry being configured to: generate a plurality of first bits corresponding to the number of the converted substrates, and generate second bits, wherein a first logic state of the second bits indicates that the first weight is heavier than the second weight, and an opposite second logic state of the second bits indicates that the first weight is lighter than the second weight.

[0092] Example 10. The system according to Example 9, wherein the at least one controller comprises: a microcontroller (MCU) including the ADC and the processing circuitry; and a programmable logic controller (PLC) coupled to the MCU to receive the plurality of first and second bits, the PLC being configured to: control the processing device to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates based on the plurality of first and second bits.

[0093] Example 11. A loading port for a wafer processing system, the loading port comprising: a first box support configured to support a first box containing a first batch of wafers thereon; at least one first sensor coupled to the first box support and configured to generate a first weight signal corresponding to a first total weight of the first box and the first batch of wafers; a second box support configured to support a second box containing a second batch of wafers thereon; at least one second sensor coupled to the second box support and configured to generate a second weight signal corresponding to a second total weight of the second box and the second batch of wafers; and a microcontroller (MCU) coupled to the at least one first sensor and the at least one second sensor to receive the first weight signal and the second weight signal, respectively, the MCU being configured to: convert the weight difference between the first total weight and the second total weight into the number of wafers each having a predetermined weight; generate an indicator indicating whether the first batch of wafers is heavier or lighter than the second batch of wafers; and output the indicator and the converted number of wafers to a controller of a processing device of the wafer processing system, such that the controller can control the processing device to simultaneously balance the rotation of the first batch of wafers and the second batch of wafers.

[0094] Example 12. The loading port according to Example 11 further includes: at least one first rod extending downward from the bottom of the first box support to the at least one first sensor, the at least one first rod being configured to transfer a first load corresponding to the first total weight to the at least one first sensor; and at least one second rod extending downward from the bottom of the second box support to the at least one second sensor, the at least one second rod being configured to transfer a second load corresponding to the second total weight to the at least one second sensor.

[0095] Example 13. The loading port according to Example 12, wherein: the first box support includes at least one first hollow hub on its bottom, the upper end of the at least one first rod is received in the at least one first hollow hub to couple the at least one first rod to the first box support, and the second box support includes at least one second hollow hub on its bottom, the upper end of the at least one second rod is received in the at least one second hollow hub to couple the at least one second rod to the second box support.

[0096] Example 14. The loading port according to Example 12 further includes: a platform, wherein the first box support and the second box support are arranged above the platform, wherein the at least one first rod and the at least one second rod extend through the platform from the bottom of the first box support and the second box support downward to the at least one first sensor and the at least one second sensor, respectively.

[0097] Example 15. The loading port according to Example 11, wherein the MCU includes: an analog-to-digital converter (ADC) configured to: convert the first weight signal into first weight data corresponding to the first total weight, and convert the second weight signal into second weight data corresponding to the second total weight; and processing circuitry coupled to the ADC to receive the first weight data and the second weight data, the processing circuitry being configured to: generate a plurality of first bits corresponding to the converted number of wafers, and generate a second bit, wherein a first logic state of the second bit indicates that the first batch of wafers is heavier than the second batch of wafers, and an opposite second logic state of the second bit indicates that the first batch of wafers is lighter than the second batch of wafers.

[0098] Example 16. A method for wafer processing, comprising: obtaining a weight difference between a first weight of a first batch of substrates and a second weight of a second batch of substrates; converting the weight difference into a number of substrates each having a predetermined weight; generating an indicator indicating whether the first weight is heavier or lighter than the second weight; and controlling a processing apparatus to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates based on the converted number of substrates and the indicator.

[0099] Example 17. The method according to Example 16, wherein: the control includes: moving at least one counterweight of the balancing mechanism of the processing device toward the first batch of substrates mounted in the processing device in response to the indicator indicating that the first weight is lighter than the second weight, and moving at least one counterweight of the balancing mechanism of the processing device toward the second batch of substrates mounted in the processing device in response to the indicator indicating that the first weight is heavier than the second weight, wherein, as a result of the movement, the at least one counterweight is moved a distance corresponding to the number of the converted substrates.

[0100] Example 18. The method according to Example 16, wherein: the actual weight of the first substrate in the first batch of substrates is different from at least one of the following: the predetermined weight, or the actual weight of the second substrate in the second batch of substrates.

[0101] Example 19. The method according to Example 16, wherein obtaining the weight difference comprises: detecting a first total weight of a first box containing the first batch of substrates and the first weight of the first batch of substrates by at least one first sensor; detecting a second total weight of a second box containing the second batch of substrates and the second weight of the second batch of substrates by at least one second sensor; and subtracting the first total weight from the second total weight, and using the result of this subtraction as the weight difference between the first weight of the first batch of substrates and the second weight of the second batch of substrates.

[0102] Example 20. The method according to Example 16, wherein: the conversion includes: dividing the weight difference by the predetermined weight, regardless of whether the predetermined weight is the actual weight of any substrate in the first batch or the second batch of substrates, and rounding the result of the division to obtain the number of substrates after conversion, the method further includes: inputting the following into the controller of the processing device, a plurality of first bits corresponding to the number of substrates after conversion, and a second bit, wherein a first logic state of the second bit indicates that the first weight is heavier than the second weight, and an opposite second logic state of the second bit indicates that the first weight is lighter than the second weight.

Claims

1. A system for wafer processing, comprising: At least one sensor is configured to generate: The first weight signal corresponds to the first weight of the first batch of substrates, and The second weight signal corresponds to the second weight of the second batch of substrates. At least one controller, coupled to the at least one sensor to receive the first weight signal and the second weight signal, is configured to: The weight difference between the first weight and the second weight is converted into the number of substrates each having a predetermined weight. Generate an indicator that indicates whether the first weight is heavier or lighter than the second weight, and Based on the indicator and the number of converted substrates, the processing device is controlled to simultaneously rotate the first batch of substrates and the second batch of substrates.

2. The system according to claim 1, further comprising: The processing equipment, in: The processing equipment includes a balancing mechanism, and The at least one controller is configured to control the balancing mechanism to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates based on the indicator and the number of the converted substrates.

3. The system according to claim 2, wherein: The balancing mechanism includes at least one counterweight, and The at least one controller is configured to control the balancing mechanism to move the at least one counterweight relative to at least one of the first batch of substrates or the second batch of substrates, based on the indicator and the number of the converted substrates, so as to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates.

4. The system according to claim 1, further comprising: The first support box is configured to support the first box containing the first batch of substrates. The at least one sensor includes at least one first sensor, which is coupled to the first housing support and configured to generate a first weight signal corresponding to a first total weight of the first housing and the first batch of substrates.

5. The system according to claim 4, further comprising: The second support is configured to support a second box containing the second batch of substrates. The at least one sensor further includes at least one second sensor, which is coupled to the second housing support and configured to generate a second weight signal corresponding to the second total weight of the second housing and the second batch of substrates.

6. The system according to claim 5, wherein: The at least one first sensor includes a plurality of first sensors. The at least one second sensor includes a plurality of second sensors. The system also includes: A plurality of first rods, each extending downward from the bottom of the first box support to a corresponding first sensor among the plurality of first sensors, the plurality of first rods being configured to transfer a first load corresponding to the first total weight to the plurality of first sensors; and A plurality of second rods, each extending downward from the bottom of the second box support to a corresponding second sensor among the plurality of second sensors, the plurality of second rods being configured to transfer a second load corresponding to the second total weight to the plurality of second sensors.

7. The system according to claim 5, wherein, The system is a wafer processing system, including: Multiple processing devices, including processing devices that function as rotary dryers; Housing, accommodating the plurality of processing devices; and A loading port is configured to load the first batch and the second batch of substrates into the housing for processing by one or more of the plurality of processing devices. The loading port includes a first box support, a second box support, at least one first sensor, and at least one second sensor.

8. The system according to claim 5, wherein, The at least one controller includes: The analog-to-digital converter (ADC) is configured as follows: The first weight signal is converted into first weight data corresponding to the first weight, and Convert the second weight signal into second weight data corresponding to the second weight; and A processing circuit, coupled to the ADC to receive the first weight data and the second weight data, is configured to: Generate a plurality of first digits corresponding to the number of the converted substrates, and Generate a second bit, wherein a first logic state of the second bit indicates that the first weight is heavier than the second weight, and the opposite second logic state of the second bit indicates that the first weight is lighter than the second weight.

9. The system according to claim 8, wherein, The at least one controller includes: Microcontroller (MCU), including the ADC and the processing circuitry; and A programmable logic controller (PLC) coupled to the MCU to receive the plurality of first and second bits, the PLC being configured to control the processing device to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates based on the plurality of first and second bits.

10. A loading port for a wafer processing system, the loading port comprising: The first support box is configured to support the first box containing the first batch of wafers; At least one first sensor is coupled to the first housing support and configured to generate a first weight signal corresponding to a first total weight of the first housing and the first batch of wafers; The second support box is configured to support a second box containing the second batch of wafers. At least one second sensor is coupled to the second housing support and configured to generate a second weight signal corresponding to a second total weight of the second housing and the second batch of wafers; as well as A microcontroller (MCU) is coupled to the at least one first sensor and the at least one second sensor to receive the first weight signal and the second weight signal, respectively, and the MCU is configured to: The weight difference between the first total weight and the second total weight is converted into the number of wafers with a predetermined weight. Generate an indicator indicating whether the first batch of wafers is heavier or lighter than the second batch of wafers, and The indicator and the converted wafer quantity are output to the controller of the processing equipment of the wafer processing system, so that the controller can control the processing equipment to simultaneously balance the rotation of the first batch of wafers and the second batch of wafers.

11. The loading port according to claim 10, further comprising: At least one first rod extends downward from the bottom of the first box support to the at least one first sensor, the at least one first rod being configured to transfer a first load corresponding to the first total weight to the at least one first sensor; as well as At least one second rod extends downward from the bottom of the second box support to the at least one second sensor, the at least one second rod being configured to transfer a second load corresponding to the second total weight to the at least one second sensor.

12. The loading port according to claim 11, wherein: The first box support includes at least one first hollow hub on its bottom, and the upper end of the at least one first rod is received in the at least one first hollow hub to couple the at least one first rod to the first box support. The second box support includes at least one second hollow hub on its bottom, and the upper end of the at least one second rod is accommodated in the at least one second hollow hub to couple the at least one second rod to the second box support.

13. The loading port according to claim 11, further comprising: The platform, wherein the first and second support boxes are arranged above the platform, Wherein, the at least one first rod and the at least one second rod extend through the platform from the bottom of the first box support and the second box support respectively to the at least one first sensor and the at least one second sensor.

14. The loading port according to claim 10, wherein, The MCU includes: The analog-to-digital converter (ADC) is configured as follows: The first weight signal is converted into first weight data corresponding to the first total weight, and Convert the second weight signal into second weight data corresponding to the second total weight; and A processing circuit, coupled to the ADC to receive the first weight data and the second weight data, is configured to: Generate a plurality of first digits corresponding to the number of the converted wafers, and A second bit is generated, wherein a first logic state of the second bit indicates that the first batch of wafers is heavier than the second batch of wafers, and a converse second logic state of the second bit indicates that the first batch of wafers is lighter than the second batch of wafers.

15. A method for wafer processing, comprising: Obtain the weight difference between the first weight of the first batch of substrates and the second weight of the second batch of substrates; The weight difference is converted into the number of substrates, each with a predetermined weight. Generate an indicator that shows whether the first weight is heavier or lighter than the second weight; as well as Based on the number of converted substrates and the indicator, the processing device is controlled to simultaneously balance the rotation of the first batch of substrates and the second batch of substrates.

16. The method of claim 15, wherein: The control includes: In response to the indicator indicating that the first weight is lighter than the second weight, at least one counterweight of the balancing mechanism of the processing device is moved toward the first batch of substrates mounted in the processing device, and In response to the indicator indicating that the first weight is heavier than the second weight, at least one counterweight of the balancing mechanism of the processing equipment is moved toward the second batch of substrates mounted in the processing equipment. As a result of the movement, the at least one counterweight was moved a distance corresponding to the number of the converted substrates.

17. The method of claim 15, wherein: The actual weight of the first substrate in the first batch of substrates differs from at least one of the following: The predetermined weight, or The actual weight of the second substrate in the second batch of substrates.

18. The method according to claim 15, wherein, The process of obtaining the weight difference includes: The first total weight, comprising the first box containing the first batch of substrates and the first weight of the first batch of substrates, is detected by at least one first sensor; The second total weight, comprising the second box containing the second batch of substrates and the second weight of the second batch of substrates, is detected by at least one second sensor; and The first total weight is subtracted from the second total weight, and the result of this subtraction is used as the weight difference between the first weight of the first batch of substrates and the second weight of the second batch of substrates.

19. The method of claim 15, wherein: The conversion includes: Divide the weight difference by the predetermined weight, regardless of whether the predetermined weight is the actual weight of any substrate in the first batch or the second batch. The result of dividing the weight difference by the predetermined weight is rounded to obtain the number of the converted substrates. The method further includes: Enter the following items into the controller of the processing device. A plurality of first digits corresponding to the number of the converted substrates, and The second bit, wherein the first logic state of the second bit indicates that the first weight is heavier than the second weight, and the opposite second logic state of the second bit indicates that the first weight is lighter than the second weight.

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