Substrate processing equipment and loading components disposed in substrate processing equipment

Abstract

This invention provides a substrate processing apparatus and a loading member disposed in the substrate processing apparatus. The apparatus includes a container having a sealed processing space formed therein, in which a substrate is housed; a supply port disposed inside the wall of the container for supplying processing fluid to the processing space; a discharge port disposed inside the wall of the container and spaced apart from the supply port; and a buffer member disposed in the processing space, which, in plan view, is positioned overlapping the supply port and the discharge port. The buffer member includes a sidewall portion located outside the supply port and the discharge port and capable of contacting the wall of the container; and an upper wall portion having a through-hole formed therein corresponding to the center of the substrate, the through-hole forming a straight flow path in an upward / downward direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0172077, filed with the Korean Intellectual Property Office on December 10, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments described in this invention relate to a substrate processing apparatus and a loading member disposed therein. Background Technology

[0004] Generally, semiconductor components are made from substrates such as wafers. Specifically, semiconductor components are manufactured by forming microcircuit patterns on the upper surface of the substrate through processes such as deposition, photolithography, and etching. During the process, foreign matter may be generated on the upper surface of the substrate where the circuit patterns are formed, and these foreign matter can be removed by a cleaning process.

[0005] Today, supercritical fluids are used in cleaning or developing processes. For example, the upper surface of a substrate can be wetted with a learning prevention liquid such as isopropyl alcohol (IPA), and the remaining learning prevention liquid on the substrate can then be removed by supplying supercritical carbon dioxide (CO2) to the upper surface of the substrate.

[0006] In processes using supercritical fluids, a container with a processing space is used to maintain the processing fluid in a supercritical state at high temperature and high pressure. When a substrate is processed with a processing fluid (e.g., carbon dioxide) in a supercritical state, the processing space of the container needs to maintain the processing fluid above its critical temperature and critical pressure. To maintain the pressure in the processing space above the critical pressure, the processing fluid needs to be supplied into the processing space. In this process, due to the flow of the processing fluid supplied at a temperature different from the temperature in the processing space, the temperature distribution in each region of the substrate may be uneven. Summary of the Invention

[0007] Embodiments of the present invention provide a substrate processing apparatus for efficiently processing substrates.

[0008] The present invention provides a substrate processing apparatus that can make the temperature distribution uniform in each region of the substrate even through the flow of processing fluid supplied to the processing space.

[0009] An embodiment of the present invention provides a substrate processing apparatus for supplying a uniformly flowing processing fluid to a processing space and guiding it to a substrate.

[0010] The technical problems to be solved by the present invention are not limited to those described above, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0011] According to an embodiment, the apparatus for processing a substrate includes a container having a sealed processing space formed therein to accommodate the substrate; a supply port disposed inside the wall of the container to supply processing fluid into the processing space; a discharge port disposed inside the wall of the container and spaced apart from the supply port; and a buffer member disposed in the processing space, which, in a top view, is positioned overlapping the supply port and the discharge port. The buffer member includes a side wall portion located outside the supply port and the discharge port and in contact with the wall of the container; and an upper wall portion having a through-hole formed therein corresponding to the center of the substrate, the through-hole forming a straight flow path in an upward / downward direction.

[0012] In the implementation, the through-hole can be aligned with the discharge port.

[0013] In the implementation plan, when viewed from above, the supply port can be located at a position where there is no through-hole forming the upper wall.

[0014] In the implementation scheme, the flow path formed by the through hole may have a length greater than or equal to 30% of the total height of the buffer member and less than the total height of the buffer member.

[0015] In the implementation, the buffer member may further include an inner wall portion extending downward from the upper wall portion to increase the length of the flow path of the through hole, and a buffer space may be formed by the side wall portion, the upper wall portion and the inner wall portion.

[0016] In an embodiment, the device may further include a plate member located above the buffer member and, when viewed from above, positioned to overlap with the through-hole, with the plate member spaced apart from the buffer member.

[0017] In the implementation scheme, the plate component may include an upper surface, a lower surface, and a side surface. The area of ​​the upper surface may be larger than the area of ​​the lower surface, and the upper and lower surfaces may be arranged side by side so that the upper and lower surfaces face each other. The side surface may connect the upper and lower surfaces and may be formed to be inclined upward towards the top.

[0018] In one embodiment, a first bottom surface defining a processing space can be formed within the container. A groove of predetermined depth can be formed on the first bottom surface, and a second bottom surface can be formed through the groove. A supply port and a discharge port can be located in the area of ​​the second bottom surface.

[0019] In the implementation scheme, the buffer member can be placed on the second bottom surface, and the upper surface of the buffer member placed on the second bottom surface can be positioned parallel to the first bottom surface.

[0020] In the implementation scheme, the buffer member may have a circular shape when viewed from above.

[0021] In the implementation scheme, the processing fluid can be heated to a temperature above room temperature and supplied to the processing space.

[0022] In the implementation scheme, the processing fluid may be a supercritical fluid.

[0023] According to an embodiment, a filling member for filling a portion of the processing space in a substrate processing apparatus includes a plate member disposed below the substrate and having a predetermined thickness; and a buffer member disposed below and spaced apart from the plate member. The substrate processing apparatus includes a container providing a sealed processing space; a supply port for supplying processing fluid to the processing space; and an exhaust port for discharging atmosphere from the processing space. The buffer member includes a sidewall portion located outside the supply port and the exhaust port and in contact with the wall of the container; and an upper wall portion having a through-hole formed in the upper wall portion corresponding to the center of the plate member, the through-hole forming a straight flow path in an upward / downward direction.

[0024] In the implementation, the through-hole can be aligned with the discharge port.

[0025] In the implementation plan, when viewed from above, the through-hole in the upper wall can be located in a position that does not overlap with the supply port.

[0026] In the implementation scheme, the flow path formed by the through hole may have a length greater than or equal to 30% of the total height of the buffer member and less than the total height of the buffer member.

[0027] In an embodiment, the buffer member may further include an inner wall portion that extends downward from the upper wall portion to increase the length of the flow path of the through hole, and a buffer space may be formed by the side wall portion, the upper wall portion, and the inner wall portion.

[0028] In the implementation scheme, the plate component may include an upper surface, a lower surface and a side surface. The area of ​​the upper surface may be larger than the area of ​​the lower surface, and the upper surface and the lower surface may be arranged side by side facing the lower surface. The side surface may be connected to the upper surface and the lower surface and may be formed to be inclined upward towards the top.

[0029] In the implementation scheme, the buffer member may have a circular shape when viewed from above, and the plate member may have a circular shape when viewed from above.

[0030] According to an embodiment, an apparatus for processing a substrate includes a container having a sealed processing space formed therein, in which the substrate is housed; a supply port disposed inside the wall of the container for supplying processing fluid to the processing space; a discharge port disposed inside the wall of the container and spaced apart from the supply port; and a filling member that fills a portion of the volume of the processing space in the substrate processing apparatus. A first bottom surface defining the processing space is formed in the container. A cylindrical groove of a predetermined depth is formed on the first bottom surface, and a second bottom surface is defined by the groove. The supply port and the discharge port are disposed in the region of the second bottom surface. The filling member includes a plate member disposed below the substrate and having a predetermined thickness; and a buffer member disposed below and spaced apart from the plate member, wherein, in plan view, the buffer member is positioned overlapping the supply port and the discharge port. The buffer member includes a sidewall portion placed on the second bottom surface and located outside the supply port and discharge port, and capable of contacting the wall of the container; an upper wall portion having a through hole formed therein corresponding to the center of the substrate, the through hole forming a straight flow path in the upward / downward direction, and the upper surface of the upper wall portion being disposed in a position parallel to the first bottom surface; and an inner wall portion extending downward from the upper wall portion to increase the length of the flow path of the through hole. Attached Figure Description

[0031] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals in the various figures refer to the same parts.

[0032] Figure 1 This is a schematic plan view illustrating a substrate processing system according to an embodiment of the present invention.

[0033] Figure 2 This is a schematic diagram illustrating one embodiment of a liquid processing apparatus provided in a substrate processing system according to an embodiment of the present invention.

[0034] Figure 3 This is a schematic diagram illustrating a first embodiment of a supercritical processing apparatus provided in a substrate processing system according to an embodiment of the present invention.

[0035] Figure 4 This is a perspective view showing a first embodiment of a loading member provided in a supercritical processing apparatus according to a first embodiment.

[0036] Figure 5 This illustrates the flow of the processing fluid when the processing fluid is supplied to the supercritical processing apparatus according to the first embodiment.

[0037] Figure 6This illustrates the flow of the processing fluid when the processing fluid is released from the supercritical processing apparatus according to the first embodiment.

[0038] Figure 7 The results are simulations of the temperature distribution of the substrate processed by the supercritical processing equipment according to the first embodiment.

[0039] Figure 8 The results are based on the simulation of the temperature distribution of the substrate in the comparative example.

[0040] Figure 9 This illustrates a supercritical processing apparatus including a loading member according to a second embodiment of the concept of the present invention.

[0041] Figure 10 This illustrates a supercritical processing apparatus including a loading member, according to a third embodiment of the concept of the present invention.

[0042] Figure 11 It is a graph, according to an embodiment of the present invention, describing how pressure changes in the processing space depend on the supply and release of the processing fluid.

[0043] Symbol Explanation

[0044] 10: Index Module

[0045] 12: Loading Port

[0046] 14: Index box

[0047] 20: Processing Module

[0048] 80: Carrier

[0049] 92: First Direction

[0050] 94: Second Direction

[0051] 96: Third-party

[0052] 120: Index Robot

[0053] 122: Robot Arm

[0054] 140: Guide rail

[0055] 200: Buffer unit

[0056] 220: Buffer

[0057] 300: Conveying equipment

[0058] 320: Teleportation Robot

[0059] 322: Robot Arm

[0060] 340: Guide rail

[0061] 400: Liquid handling equipment

[0062] 410: Casing

[0063] 422: First Recycling Bowl

[0064] 424: Second recycling bowl

[0065] 426: Third Recycling Bowl

[0066] 422a: First entrance

[0067] 424a: Second entrance

[0068] 426a: Third entrance

[0069] 440: Support unit

[0070] 442a: Support pin

[0071] 442b: Chuck pin

[0072] 446: Actuator

[0073] 460: Liquid Dispensing Unit

[0074] 461: Arm

[0075] 462: First nozzle

[0076] 464: Second nozzle

[0077] 466: Third nozzle

[0078] 480: Lifting Unit

[0079] 500, 500a, 500b: Supercritical treatment equipment

[0080] 502: Processing space

[0081] 520: Container

[0082] 522: Upper Container

[0083] 524: Lower container

[0084] 524a: Inclined surface

[0085] 524b: First base

[0086] 524c: Second bottom surface

[0087] 540: Supporting component

[0088] 542: Fixed rod

[0089] 544: Support component

[0090] 550: Discharge line

[0091] 550a: Emission port

[0092] 564: Upper branch pipeline

[0093] 564a: Second supply port

[0094] 566: Downstream branch pipeline

[0095] 566a: First supply port

[0096] 570: Heater

[0097] 580, 1580, 2580: Filling components

[0098] 581: Plate Components

[0099] 583: Second support rod

[0100] 584: First support rod

[0101] 585, 1585, 2585: Buffer components

[0102] 585a, 1585a, 2585a: Inner wall portion

[0103] 585b, 1585b, 2585b: Upper wall portion

[0104] 585c, 1585c, 2585c: Side wall portion

[0105] 587, 1587, 2587: Through holes

[0106] 590: Driving component

[0107] W: substrate

[0108] d: diameter

[0109] h1, h2: Height

[0110] t1~t4: Time

[0111] P0: Atmospheric pressure Detailed Implementation

[0112] In the following, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement the inventive concept. However, the inventive concept can be implemented in various different forms and is not limited to the embodiments described herein. Furthermore, in describing embodiments of the inventive concept, detailed descriptions related to well-known functions or configurations will be omitted where such descriptions might unnecessarily obscure the subject matter of the inventive concept. Additionally, in all figures, components performing similar functions and operations have the same reference numerals.

[0113] The terms “include” and “comprise” used in this specification are open-ended expressions, indicating only the presence of the stated components, and do not exclude but may include additional components unless specifically described to the contrary. Specifically, it should be understood that the terms “include,” “comprise,” and “have” as used herein specify the presence of the stated features, integrals, steps, operations, components, and / or parts, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, components, parts, and / or combinations thereof.

[0114] Unless otherwise stated, singular terms may include plural forms. Furthermore, in the accompanying drawings, the shape and size of components may be exaggerated for clarity.

[0115] The term "and / or" includes each of the mentioned items and all combinations thereof. When a component is described as "connected" to another component, it can mean not only that the component is "connected" directly, but also that the component is "connected" indirectly via a third component.

[0116] The concept of this invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided to make the concept of the invention thorough and complete, and to fully convey the concept of the invention to those skilled in the art. In the figures, the dimensions of the components are exaggerated for clarity.

[0117] Figure 1 This is a schematic plan view illustrating a substrate processing system according to an embodiment of the present invention.

[0118] Reference Figure 1The substrate processing system includes an indexing module 10, a processing module 20, and a controller 30. According to the embodiment, the indexing module 10 and the processing module 20 are arranged in the same direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged is referred to as the first direction 92, the direction perpendicular to the first direction 92 when viewed from above is referred to as the second direction 94, and the direction perpendicular to both the first direction 92 and the second direction 94 is referred to as the third direction 96.

[0119] The indexing module 10 transfers the substrate W from the carrier 80, where it is received, to the processing module 20, and places the fully processed substrate W in the carrier 80. The indexing module 10 is configured such that its length direction is parallel to the second direction 94. The indexing module 10 has a loading port 12 and an index frame 14. The loading port 12 is located on the opposite side of the processing module 20 relative to the index frame 14. The carrier 80, in which the substrate W is received, is placed on the loading port 12. Multiple loading ports 12 can be provided. These multiple loading ports 12 can be arranged along the second direction 94.

[0120] An airtight carrier, such as a front-open unified pod (POUP), can be used as carrier 80. Carrier 80 can be placed onto loading port 12 by a transfer unit (not shown) or by an operator. Transfer units include overhead transfer, overhead conveyor, or non-automatic guided vehicle.

[0121] An indexing robot 120 is disposed within an indexing frame 14. A guide rail 140 is disposed within the indexing frame 14, with its length direction parallel to a second direction 94. The indexing robot 120 is movable on the guide rail 140. The indexing robot 120 includes a robotic arm 122 for placing a substrate W. The robotic arm 122 is movable forward and backward, rotatable about an axis facing a third third direction 96, and movable along the third third direction 96. Multiple robotic arms 122 may be disposed. The multiple robotic arms 122 may be spaced apart from each other in the up / down direction and may move forward and backward independently.

[0122] Processing module 20 includes a buffer unit 200, a conveying device 300, a liquid processing device 400, and a supercritical processing device 500. The buffer unit 200 has a space in which substrates W loaded into processing module 20 and substrates W to be removed from processing module 20 are temporarily placed. Each liquid processing device 400 performs a liquid processing process on substrate W by distributing liquid onto the substrate W. Each supercritical processing device 500 performs a drying process to remove liquid residue from the substrate W. The conveying device 300 conveys substrate W between the buffer unit 200, the liquid processing device 400, and the supercritical processing device 500.

[0123] The conveying device 300 can be configured such that its length direction is parallel to the first direction 92. The buffer unit 200 can be disposed between the index module 10 and the conveying device 300. The liquid processing device 400 and the supercritical processing device 500 can be disposed on opposite sides of the conveying device 300. The liquid processing device 400 and the conveying device 300 can be disposed along the second direction 94. The supercritical processing device 500 and the conveying device 300 can be disposed along the second direction 94. The buffer unit 200 can be located at one end of the conveying device 300.

[0124] According to the implementation scheme, the liquid processing device 400 may be disposed on the opposite side of the conveying device 300. The supercritical processing device 500 may be disposed on the opposite side of the conveying device 300. The liquid processing device 400 may be disposed adjacent to the buffer unit 200 more than the supercritical processing device 500. On one side of the conveying device 300, the liquid processing device 400 may be arranged in an A×B array along a first direction 92 and a third direction 96 (A and B are natural numbers 1 or greater). Moreover, on one side of the conveying device 300, the supercritical processing device 500 may be arranged in a C×D array along the first direction 92 and the third direction 96 (C and D are natural numbers 1 or greater). Alternatively, only the liquid processing device 400 may be disposed on one side of the conveying device 300, and only the supercritical processing device 500 may be disposed on the opposite side of the conveying device 300.

[0125] The conveying device 300 includes a conveying robot 320. A guide rail 340 can be provided in the conveying device 300, the length direction of which is parallel to a first direction 92, and the conveying robot 320 is movable on the guide rail 340. The conveying robot 320 includes a robotic arm 322 for placing a substrate W. The robotic arm 322 is movable forward and backward, rotatable about an axis facing a third third direction 96, and movable along the third third direction 96. Multiple robotic arms 322 can be provided. The multiple robotic arms 322 can be spaced apart from each other in the upward / downward direction and can move forward and backward independently.

[0126] The buffer unit 200 includes a plurality of buffers 220, in which the substrate W is placed. The plurality of buffers 220 are spaced apart from each other along a third direction 96. The front and back of the buffer unit 200 are open. The front faces the indexing module 10, and the back faces the conveying device 300. The indexing robot 120 can enter the buffer unit 200 through the front, and the conveying robot 320 can enter the buffer unit 200 through the back.

[0127] Figure 2 It is shown Figure 1 A schematic diagram of one embodiment of the liquid handling apparatus 400. (Refer to...) Figure 2 The liquid handling device 400 includes a housing 410, a cup 420, a support unit 440, a liquid dispensing unit 460, and a lifting unit 480. The housing 410 has a shape that is substantially rectangular parallelepiped. The cup 420, the support unit 440, and the liquid dispensing unit 460 are disposed within the housing 410.

[0128] The cup 420 has a processing space that is open at the top, and a substrate W is processed with liquid within the processing space. A support unit 440 supports the substrate W within the processing space. A liquid dispensing unit 460 dispenses liquid onto the substrate W supported on the support unit 440. The liquid may include various types of liquid and may be dispensed onto the substrate W sequentially. A lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0129] According to the embodiment, the cup 420 has a plurality of recovery bowls (first recovery bowl 422, second recovery bowl 424, and third recovery bowl 426). The first recovery bowl 422, second recovery bowl 424, and third recovery bowl 426 have recovery spaces for recovering liquid used to process the substrate W. The first recovery bowl 422, second recovery bowl 424, and third recovery bowl 426 have an annular shape surrounding the support unit 440. During the liquid processing process, processing liquid spilled due to the rotation of the substrate W can be introduced into the recovery spaces through the first inlet 422a, second inlet 424a, and third inlet 426a of the first recovery bowl 422, second recovery bowl 424, and third recovery bowl 426. According to the embodiment, the cup 420 has a first recovery bowl 422, second recovery bowl 424, and third recovery bowl 426. The first recovery bowl 422 is arranged around the support unit 440, the second recovery bowl 424 is arranged around the first recovery bowl 422, and the third recovery bowl 426 is arranged around the second recovery bowl 424. The second inlet 424a through which liquid is introduced into the second recycling bowl 424 may be located at a higher position than the first inlet 422a through which liquid is introduced into the first recycling bowl 422, and the third inlet 426a through which liquid is introduced into the third recycling bowl 426 may be located at a higher position than the second inlet 424a.

[0130] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 may have a substantially circular shape and may have a diameter larger than that of the substrate W. A support pin 442a is disposed on the center portion of the support plate 442 to support the lower surface of the substrate W. The support pin 442a protrudes upward from the support plate 442 to space the substrate W from the support plate 442 by a predetermined distance. A chuck pin 442b is disposed on the outer side portion of the support plate 442. The chuck pin 442b protrudes upward from the support plate 442 and supports the side portion of the substrate W to prevent the substrate W from detaching from the support unit 440 during rotation. The drive shaft 444 is driven by an actuator 446. The drive shaft 444 is connected to the center of the lower surface of the support plate 442 and rotates the support plate 442 about its central axis.

[0131] According to an embodiment, the liquid dispensing unit 460 includes a first nozzle 462, a second nozzle 464, and a third nozzle 466. The first nozzle 462 dispenses a first liquid onto the substrate W. The first liquid may be a liquid used to remove residual film or foreign matter from the substrate W. The second nozzle 464 dispenses a second liquid onto the substrate W. The second liquid may be a liquid that dissolves well in a third liquid. For example, the second liquid may be a liquid that dissolves better in a third liquid than in a first liquid. The second liquid may be a liquid used to neutralize the first liquid dispensed onto the substrate W. Furthermore, the second liquid may be a liquid that neutralizes the first liquid, and the second liquid dissolves better in a third liquid than in a first liquid. According to an embodiment, the second liquid may be water. The third nozzle 466 dispenses a third liquid onto the substrate W. The third liquid may be a liquid that dissolves well in a supercritical fluid used in the supercritical processing apparatus 500. For example, the third liquid may be a liquid that dissolves better in a supercritical fluid used in the supercritical processing apparatus 500 than in a second liquid. According to an embodiment, the third liquid may be an organic solvent. The organic solvent may be isopropanol (IPA). In addition to isopropanol, the organic solvents include ethylene glycol, 1-propanol, tetrahydric franc, 4-hydroxyl, 4-methyl, 2-pantanone, 1-butanol, 2-butanol, methanol, ethanol, n-propyl alcohol, dimethyl ether, or similar substances. According to an embodiment, the supercritical fluid may be carbon dioxide. The first nozzle 462, the second nozzle 464, and the third nozzle 466 may be supported on different arms 461. These arms 461 can move independently. Alternatively, the first nozzle 462, the second nozzle 464, and the third nozzle 466 may be mounted on the same arm and can move simultaneously.

[0132] The lifting unit 480 moves the cup 420 in an upward / downward direction. The height of the cup 420 relative to the substrate W changes due to this upward / downward movement. Therefore, the first recovery bowl 422, the second recovery bowl 424, and the third recovery bowl 426 for recovering the liquid can be varied depending on the type of liquid dispensed onto the substrate W, thus allowing the liquid to be recovered individually. Optionally, the cup 420 can be fixedly mounted, and the lifting unit 480 can move the support unit 440 in an upward / downward direction.

[0133] Figure 3 It is shown Figure 1A schematic diagram of one embodiment of the supercritical processing apparatus 500. The supercritical processing apparatus 500 processes a substrate W that has undergone liquid treatment with a supercritical fluid. According to one embodiment, the supercritical processing apparatus 500 uses a supercritical fluid to dry the substrate W. Carbon dioxide (CO2) in a supercritical state can be used as the supercritical fluid. Carbon dioxide exhibits supercriticality at 30°C and 7.4 MPa or higher. Hereinafter, supercritical carbon dioxide will be used as an example of the processing fluid.

[0134] According to the implementation scheme, the supercritical processing apparatus 500 uses supercritical fluid to remove liquid from the substrate W. The supercritical processing apparatus 500 includes a container 520, a support member 540, a fluid supply unit 560, and a filling member 580.

[0135] Container 520 provides a processing space 502 in which supercritical processes are performed. Container 520 is formed of a material capable of withstanding the critical temperature and critical pressure of a supercritical fluid. Container 520 includes an upper container 522 and a lower container 524.

[0136] The upper container 522 has an open space formed therein at its bottom. The upper wall of the upper container 522 serves as the upper wall of the container 520. The side walls of the upper container 522 serve as side walls of a portion of the container 520. The lower container 524 is located below the upper container 522. The lower container 524 has an open space formed therein at its top. The top opening of the lower container 524 faces the bottom opening of the upper container 522. The lower wall of the lower container 524 serves as the lower wall of the container 520. The side walls of the lower container 524 serve as side walls of a portion of the container 520. The upper container 522 and the lower container 524 are joined together to form a processing space 502.

[0137] The upper container 522 and the lower container 524 are movable relative to each other to open or close the processing space 502. A drive member 590 moves at least one of the upper container 522 or the lower container 524 in an upward / downward direction. The drive member 590 can be implemented using a hydraulic press. According to an embodiment, the upper container 522 can be fixed in place, and the lower container 524 can be raised or lowered by the drive member 590, such as a cylinder. When the lower container 524 is spaced apart from the upper container, the processing space 502 is opened. At this time, the substrate W is conveyed into or out of the processing space 502. During supercritical processing, the lower container 524 is in close contact with the upper container 522, sealing the processing space from the outside.

[0138] The supercritical processing apparatus 500 includes a heater 570. According to one embodiment, the heater 570 is located inside the wall of the container 520. In another embodiment, the heater 570 may be disposed inside at least one of the upper container 522 or the lower container 524 constituting the container 520. The heater 570 heats the processing space 502 of the container 520 to maintain the fluid supplied to the processing space 502 of the container 520 in a supercritical state. An atmosphere formed by the supercritical fluid exists in the processing space 502.

[0139] Container 520 has a groove formed on its bottom. The groove is formed to a predetermined depth. The groove may be formed in a cylindrical shape. Due to the groove, container 520 has bottom surfaces with different heights. Specifically, a groove of predetermined depth is formed on a first bottom surface 524b of container 520, and a second bottom surface 524c is formed through the groove. The second bottom surface 524c is located at a lower position than the first bottom surface 524b.

[0140] The inner surface of container 520 has an inclined surface 524a. The inclined surface 524a connects the first bottom surface 524b and the side surface of container 520. The inclined surface 524a extends from the first bottom surface 524b of container 520 and slopes upward to have a height that gradually increases toward the side surface of container 520. The inclined surface 524a may have an inclination angle of 10 degrees to 45 degrees.

[0141] A support member 540 supports a substrate W within the processing space 502 of a container 520. The support member 540 includes a fixing rod 542 and a support member 544. The fixing rod 542 is fixedly mounted to an upper container 522 and protrudes downward from the bottom surface of the upper container 522. The fixing rod 542 may be configured such that its length direction is parallel to the upward / downward direction. The fixing rods 542 may be spaced apart from each other. The fixing rods 542 are configured such that the substrate W does not interfere with the fixing rods 542 when being transported into or out of the space surrounded by the fixing rods 542. The support member 544 is coupled to the lower end of each fixing rod 542. The support member 544 extends from the lower end of the fixing rod 542 in a direction parallel to the ground. In an embodiment, the support member 544 extends in a shape capable of supporting the lower edge of the substrate W.

[0142] The first supply port 566a and the second supply port 564a supply supercritical fluid to the container 520.

[0143] A first supply port 566a is located in the central region of the bottom surface of the container 520. In one embodiment, the first supply port 566a is located at a predetermined distance offset from the center of the bottom surface of the container 520. In another embodiment, the center of the bottom surface of the container 520 may vertically correspond to the center of the substrate W supported on the support member 540. In another embodiment, the outlet of the first supply port 566a is located in the region formed by a recess in the container 520. In another embodiment, the outlet of the first supply port 566a is formed in an upward / downward direction via a second bottom surface 524c. The first supply port 566a supplies supercritical fluid to the space below the substrate W in the processing space 502 of the container 520.

[0144] The second supply port 564a is located in the central region of the upper wall of the container 520. The second supply port 564a supplies supercritical fluid to the space above the substrate W in the processing space 502 of the container 520. The supercritical fluid supplied through the second supply port 564a is distributed onto the upper surface of the substrate W.

[0145] Discharge port 550a releases residual fluid within container 520 to the outside. Discharge port 550a is located within the lower wall of container 520. Discharge port 550a may be located adjacent to the first supply port 566a. Discharge port 550a is located at the center of the bottom surface of container 520. In an embodiment, discharge port 550a is located at the center of the bottom surface of container 520. The inlet of discharge port 550a is located in the area formed by a recess in container 520. In an embodiment, the inlet of discharge port 550a is located at the center of a second bottom surface 524c. In an embodiment, the inlet of discharge port 550a is formed through the second bottom surface 524c in an upward / downward direction. In an embodiment, discharge port 550a has a diameter smaller than that of the first supply port 566a. The fluid released through discharge port 550a includes a supercritical fluid in which an organic solvent is dissolved. The fluid released through discharge port 550a may be conveyed to a regeneration device (not shown). In the regeneration device, the fluid is separated into supercritical fluid and organic solvent. Alternatively, the fluid released through the discharge port 550a can be discharged into the atmosphere through the discharge line 550.

[0146] Fluid supply unit 560 supplies processing fluid to the processing space 502 of container 520. According to an embodiment, the processing fluid may be supplied to the processing space 502 in a supercritical state. Alternatively, the processing fluid may be supplied to the processing space 502 in a gaseous state and may undergo a phase change to become supercritical within the processing space 502. According to an embodiment, fluid supply unit 560 may have a main supply line 562, an upper branch line 564, and a lower branch line 566. The upper branch line 564 and the lower branch line 566 branch from the main supply line 562. The upper branch line 564 is coupled to a second supply port 564a and supplies processing fluid from above the substrate W placed on the support member 540. The lower branch line 566 is coupled to a first supply port 566a and supplies processing fluid from below the substrate W placed on the support member 540. A discharge line 550 is coupled to a discharge port 550a. The processing fluid in the processing space 502 of container 520 is released externally through the discharge line 550.

[0147] The filling member 580 is located below the support member 540. The filling member 580 includes a plate member 581 and a buffer member 585. Figure 4 This is a perspective view showing a first embodiment of a supercritical processing apparatus according to the first embodiment, in which a loading component is installed. The following will refer to... Figure 3 and Figure 4 The filling component 580 is described.

[0148] The plate member 581 has a plate-like shape with a predetermined thickness. The plate member 581 can be solid or hollow. The plate member 581 has an upper surface, a lower surface, and side surfaces. The upper and lower surfaces are opposite each other and arranged parallel to each other. The upper surface has a larger area than the lower surface. A predetermined gap can be maintained between the upper surface of the plate member 581 and the lower surface of the substrate W to seal the interior and exterior of the container 520. For example, a gap of 0.2 cm to 1.0 cm can be maintained between the upper surface of the plate member 581 and the lower surface of the substrate W. The lower surface is configured to face the first bottom surface 524b of the container 520. The lower surface is spaced apart from the first bottom surface 524b of the container 520 by a predetermined gap. According to an embodiment, the lower surface of the plate member 581 can be spaced apart from the first bottom surface 524b of the container 520 by a gap of 0.1 cm to 2 cm. The side surfaces of the plate member 581 connect the upper and lower surfaces of the plate member 581. The side surface of the plate member 581 extends from the lower surface and is formed to slope upwards, so that the plate member 581 has a cross-sectional area that gradually increases towards the top. The side surface of the plate member 581 may be arranged side-by-side with the inclined surface 524a. The side surface of the plate member 581 may be arranged such that a portion of its area faces the inclined surface 524a. The side surface of the plate member 581 is spaced apart from the inclined surface 524a by a predetermined gap. According to an embodiment, the side surface of the member 581 may be spaced apart from the inclined surface 524a by a gap of 0.1 cm to 2 cm.

[0149] The space between the lower surface of the plate member 581 and the first bottom surface 524b of the container 520, and the space between the side surface of the plate member 581 and the inclined surface 524a of the container 520, are interconnected and provide a path for the supercritical fluid supplied through the first supply port 566a to move.

[0150] The first support rod 584 supports the lower surface of the plate member 581. The first support rods 584 are spaced apart from each other. The upper end of the first support rod 584 is coupled to the plate member 581, and the lower end of the first support rod 584 rests on the first bottom surface 524b of the container 520.

[0151] A buffer member 585 is disposed below the plate member 581. The upper surface of the buffer member 585 and the lower surface of the plate member 581 are spaced apart from each other by a predetermined gap. The separation gap between the upper surface of the buffer member 585 and the lower surface of the plate member 581 is equal to or similar to the separation gap between the lower surface of the plate member 581 and the first bottom surface 524b of the container 520. According to an embodiment, the upper surface of the buffer member 585 and the lower surface of the plate member 581 may be spaced apart from each other by a gap of 0.1 cm to 2 cm. The upper surface of the buffer member 585 and the lower surface of the plate member 581 may be spaced apart from each other by a second support rod 583. The second support rod 583 is spaced apart from each other. The upper end of the second support rod 583 is coupled to the plate member 581, and the lower end of the second support rod 583 rests on the upper surface of the buffer member 585.

[0152] According to this embodiment, the buffer member 585 is located in a groove formed on the first bottom surface 524b of the container 520. The buffer member 585 includes a sidewall portion 585c and an upper wall portion 585b. The sidewall portion 585c is supported on the second bottom surface 524c. The sidewall portion 585c is located outside the first supply port 566a and the discharge port 550a. The inner diameter of the sidewall portion 585c is larger than the distance between the first supply port 566a and the discharge port 550a, so that the first supply port 566a and the discharge port 550a are located inside the sidewall portion 585c. The sidewall portion 585c contacts the second bottom surface 524c and prevents the supercritical fluid supplied through the first supply port 566a from passing under the sidewall portion 585c. Preferably, the lower surface of the sidewall portion 585c is in complete and tight contact with the second bottom surface 524c.

[0153] The upper surface of the upper wall portion 585b is located at the same height or a similar height to the plane formed with the first bottom surface 524b of the container 520. In top view, the upper wall portion 585b overlaps with the first supply port 566a. A through hole 587 is formed at the center of the upper wall portion 585b. The through hole 587 is located at a position corresponding to the center of the substrate W supported on the support member 540. Furthermore, the through hole 587 is located at a position corresponding to the center of the plate member 581. The through hole 587 is formed perpendicular to the upper wall portion 585b in the upward / downward direction. In this embodiment, the buffer member 585 further includes an inner wall portion 585a. The inner wall portion 585a extends vertically from the upper wall portion 585b along the length direction of the through hole 587 and surrounds the through hole 587. The extension length h2 of the inner wall portion 585a is less than the total height of the buffer member 585. When the length of the through-hole 587 is extended such that the extension length h2 of the inner wall portion 585a is greater than or equal to 30% of the height h1 of the buffer member 585, the supercritical fluid supplied unevenly to the substrate W through the off-center first supply port 566a can be controlled to flow in a vertical direction relative to the center of the substrate W. Simultaneously, the inventors realized that having a small-diameter, rather than a large-diameter, through-hole 587 can effectively control the flow of the supercritical fluid in a vertical direction relative to the center of the substrate W. Preferably, the diameter d of the through-hole 587 is appropriately designed to a degree that does not undergo a phase change along the movement path of the supercritical fluid. Furthermore, in an embodiment, the diameter of the through-hole 587 may be greater than or equal to the diameter of the discharge port 550a to promote exhaust flow.

[0154] The through-hole 587 and the discharge port 550a can be positioned in a straight line. When the atmosphere in the processing space 502 is a vacuum, this helps to form a uniform exhaust flow over the entire area of ​​the substrate W. Furthermore, the filling member 580 prevents the supercritical fluid supplied through the first supply port 566a from being directly distributed onto the lower surface of the substrate W. Additionally, the volume of the processing space 502 can be reduced by the filling member 580. Therefore, the filling member 580 can reduce the amount of supercritical fluid used for the drying process and the processing time while maintaining processing performance.

[0155] In this embodiment, the buffer space is defined by the side wall portion 585c, the upper wall portion 585b, the inner wall portion 585a, and the second bottom surface 524c of the buffer member 585. Figure 5 This illustrates the flow of the processing fluid when it is supplied to the supercritical processing apparatus according to the first embodiment. (See also...) Figure 3 and Figure 5 The buffer space of the loading member 580 according to the first embodiment is described.

[0156] When supercritical fluid is introduced into container 520 through first supply port 566a, the inertia in the buffer space, dependent on the supply direction, is counteracted, and the flow rate is reduced. Eddies in the supercritical fluid flow can form in the buffer space. The kinetic energy of the supercritical fluid supplied through first supply port 566a is reduced in the buffer space, and the supercritical fluid with reduced kinetic energy is supplied through through-hole 587. Therefore, the flow of supercritical fluid generated around substrate W can be uniformly controlled, and the temperature of substrate W can be controlled.

[0157] Figure 6 This illustrates the flow of the processing fluid as it is released from the supercritical processing apparatus according to the first embodiment, and will be referred to in [reference]. Figure 3 and Figure 6 The exhaust flow according to an embodiment of the concept of the present invention is described.

[0158] The supercritical fluid supplied to the processing space 502 of container 520 for processing substrate W, as well as the solvent dissolved in the supercritical fluid, is discharged outside container 520 through discharge port 550a. The fluid is discharged outside container 520 along discharge line 550 connected to discharge port 550a. Because through hole 587 and discharge port 550a are in a straight line, fluid flow can be uniformly formed over the entire area of ​​substrate W.

[0159] Figure 7 These are simulation results of the temperature distribution of a substrate processed by a supercritical processing apparatus according to a first embodiment of the present invention. In this simulation result, the red portion has the highest temperature. Figure 7 As shown, when a substrate is processed by a supercritical processing apparatus according to an embodiment of the present invention, the temperature in the central region of the substrate is uniform, and the temperature in the outer edge region of the substrate is also uniform. In other words, it can be seen that the temperature distribution in each region is uniform.

[0160] Figure 8 The results are simulations of the temperature distribution of the substrate in the comparative example. In these simulations, the red areas have the highest temperatures. In the comparative example, it can be seen that, unlike the embodiment of the present invention, when the inertia of the supercritical fluid flow is not counteracted, the temperature distribution in each region is non-uniform due to the flow of the supercritical fluid.

[0161] Figure 9 This illustrates a second embodiment of a supercritical processing apparatus 500a including a loading member, based on the concept of the present invention. (See also...) Figure 9 The loading member 1580 according to the second embodiment will be described. In the description of the components of the loading member 1580 according to the second embodiment, components that are the same as those in the loading member 580 according to the first embodiment will be omitted.

[0162] According to the embodiment, the buffer member 1585 is located in a groove formed in the first bottom surface 524b of the container 520. The buffer member 1585 includes a sidewall portion 1585c, an upper wall portion 1585b, and an inner wall portion 1585a. The sidewall portion 1585c is supported on the second bottom surface 524c. The sidewall portion 1585c is located outside the first supply port 566a and the discharge port 550a. The inner diameter of the sidewall portion 1585c is larger than the distance between the first supply port 566a and the discharge port 550a, so that the first supply port 566a and the discharge port 550a are located inside the sidewall portion 1585c. The sidewall portion 1585c contacts the second bottom surface 524c and prevents supercritical fluid supplied through the first supply port 566a from passing under the sidewall portion 1585c. The lower surface of the sidewall portion 1585c is preferably in complete and tight contact with the second bottom surface 524c. At least one of the connection between the side wall portion 1585c and the upper wall portion 1585b, or the connection between the upper wall portion 1585b and the inner wall portion 1585a, may be formed as curved. In an embodiment of the present invention, the inner side of the connection between the side wall portion 1585c and the upper wall portion 1585b is formed as curved. Furthermore, the inner side of the connection between the upper wall portion 1585b and the inner wall portion 1585a is formed as curved. When the wall forming the buffer space is formed as curved, the flow of the supercritical fluid through the through-hole 1587 can be controlled by reducing the kinetic energy of the supercritical fluid and controlling the flow direction of the supercritical fluid.

[0163] Figure 10 This illustrates a third embodiment of a supercritical processing apparatus 500b comprising a loading member, according to the present invention. (See also...) Figure 10 The loading member 2580 according to the third embodiment will be described. In the description of the components of the loading member 2580 according to the second embodiment, components that are the same as those of the loading member 580 according to the first embodiment will be omitted.

[0164] According to the embodiment, the buffer member 2585 is located in a groove formed in the first bottom surface 524b of the container 520. The buffer member 2585 includes a sidewall portion 2585c, an upper wall portion 2585b, and an inner wall portion 2585a. The sidewall portion 2585c is supported on the second bottom surface 524c. The sidewall portion 2585c is located outside the first supply port 566a and the discharge port 550a. The inner diameter of the sidewall portion 2585c is larger than the distance between the first supply port 566a and the discharge port 550a, so that the first supply port 566a and the discharge port 550a are located inside the sidewall portion 2585c. The sidewall portion 2585c contacts the second bottom surface 524c and prevents the supercritical fluid supplied through the first supply port 566a from passing under the sidewall portion 2585c. The lower surface of the sidewall portion 2585c is preferably in complete and tight contact with the second bottom surface 524c.

[0165] The upper surface of the upper wall portion 2585b is located at the same or similar height as the plane formed with the first bottom surface 524b of the container 520. In top view, the upper wall portion 2585b overlaps with the first supply port 566a. A through-hole 2587 is formed at the center of the upper wall portion 2585b. The through-hole 2587 is formed perpendicular to the upper wall portion 585b in the upward / downward direction. The upper wall portion 2585b has a thickness to allow the through-hole 2587 to have an appropriate flow length. The thickness of the upper wall portion 2585b is not greater than the total height of the buffer member 2585. The upper wall portion 2585b and the second bottom surface 524c are spaced apart from each other by a predetermined gap. The length of the through-hole 2587 multiplied by the thickness of the upper wall portion 2585b is greater than or equal to 30% of the height of the buffer member 2585. When the length of the through-hole 2587 is extended, the supercritical fluid supplied non-uniformly to the substrate W via the off-center first supply port 566a can be controlled to flow in a direction perpendicular to the center of the substrate W. Simultaneously, the inventors realized that having a small diameter, rather than a large diameter, through-hole 2587 can effectively control the flow of the supercritical fluid in the vertical direction relative to the center of the substrate W. Preferably, the diameter d of the through-hole 2587 is appropriately designed to a degree that does not undergo a phase change along the movement path of the supercritical fluid.

[0166] Figure 11 It is a graph, according to an embodiment of the present invention, depicting pressure changes in the processing space depending on the supply and release of the processing fluid. Figure 11 In the pressure versus time graph, the rising portion corresponds to the process of supplying the processing fluid to the processing space 502, and the falling portion corresponds to the process of releasing the processing fluid from the processing space 502. By supplying the processing fluid to the processing space 502 until time t1, the pressure in the processing space 502 is raised above the critical pressure of the processing fluid, and the processing efficiency is improved by repeating the supply and release steps from time t1 to time t4. When the substrate processing is complete, the pressure in the processing space 502 is reduced to atmospheric pressure P0 by venting the atmosphere from the processing space 502. According to the embodiments of the present invention, the temperature deviation occurring during the supply and release of the supercritical fluid can be reduced, and the temperature distribution in each region can be uniform.

[0167] The quantitative values ​​of the effects obtained by the filling member 580 according to the first embodiment, the filling member 1580 according to the second embodiment, and the filling member 2580 according to the third embodiment may differ from each other. However, according to the embodiments conceived in the present invention, by reducing the kinetic energy of the supercritical fluid and supplying the supercritical fluid vertically to the central region of the substrate, the temperature distribution in each region of the substrate can be made uniform.

[0168] As described above, according to the embodiments of the present invention, the substrate processing apparatus can efficiently process substrates.

[0169] According to embodiments of the present invention, even through the flow of processing fluid supplied to the processing space, the temperature distribution in each region of the substrate can be made uniform.

[0170] According to embodiments of the present invention, the substrate processing apparatus can achieve uniform flow of processing fluid supplied to the processing space and directed to the substrate.

[0171] The effects of this invention are not limited to those described above, and any other effects not mentioned herein will be clearly understood by those skilled in the art from the specification and drawings.

[0172] The above description illustrates the inventive concept by example. Furthermore, while the foregoing describes exemplary embodiments of the inventive concept, it can be applied in various other combinations, modifications, and environments. That is, variations or modifications can be made to the inventive concept without departing from the scope of the inventive concept disclosed in the specification, the equivalents of the written disclosure, and / or the technical or knowledgeable level of those skilled in the art. Therefore, the detailed description of the inventive concept is not intended to limit it to the disclosed embodiments. Moreover, it should be understood that the appended claims include other embodiments. These modifications and changes should not be construed as departing from the technical spirit or prospects of the inventive concept.

[0173] While the inventive concept has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: A container having a sealed processing space formed therein, wherein the substrate is housed in the processing space; A supply port is disposed inside the wall of the container and configured to supply processing fluid to the processing space; A discharge port is disposed inside the wall of the container and spaced apart from the supply port; as well as A buffer component is disposed within the processing space, and when viewed from above, the buffer component is positioned to overlap with the supply port and the discharge port. The buffer component includes: A sidewall portion, located outside the supply port and the discharge port, and configured to contact the wall of the container; and The upper wall portion has a through hole formed therein to correspond to the center of the substrate, wherein the through hole forms a straight flow path in the upward / downward direction; The buffer member further includes an inner wall portion extending downward from the upper wall portion to increase the length of the flow path of the through hole, and The buffer space is formed by the side wall portion, the upper wall portion, and the inner wall portion.

2. The device according to claim 1, wherein, The through hole is aligned with the discharge port.

3. The device according to claim 1, wherein, When viewed from above, the supply port is located at the position where the through hole does not form the upper wall portion.

4. The device according to claim 1, wherein, The length of the flow path formed through the through hole is greater than or equal to 30% of the total height of the buffer member and less than the total height of the buffer member.

5. The device according to claim 1, wherein the device further comprises: A plate member is located above the buffer member and, when viewed from above, is positioned to overlap with the through hole, and the plate member is spaced apart from the buffer member.

6. The device according to claim 5, wherein, The plate component includes an upper surface, a lower surface, and side surfaces. The area of ​​the upper surface is larger than the area of ​​the lower surface, and the upper surface and the lower surface are arranged side by side to face the lower surface. The side surface connects the upper surface and the lower surface and is sloping upward towards the top.

7. The device according to claim 1, wherein, A first bottom surface is formed in the container, the first bottom surface being configured to define the processing space. A groove of predetermined depth is formed on the first bottom surface, and a second bottom surface is formed through the groove. The supply port and the discharge port are located in the area of ​​the second bottom surface.

8. The device according to claim 7, wherein, The buffer component is placed on the second bottom surface, and The upper surface of the buffer member placed on the second bottom surface is parallel to the first bottom surface.

9. The device according to claim 1, wherein, When viewed from above, the buffer member has a circular shape.

10. The device according to claim 1, wherein, The processing fluid is heated to a temperature above room temperature and supplied to the processing space.

11. The device according to claim 1, wherein, The fluid being processed is a supercritical fluid.

12. A filling member for filling a portion of the volume of a processing space in a substrate processing apparatus, the substrate processing apparatus including a container configured to provide a sealed processing space, a supply port configured to supply processing fluid to the processing space, and an exhaust port configured to discharge atmosphere from the processing space, the filling member comprising: A plate member disposed below a substrate, the plate member having a predetermined thickness; as well as A buffer member is disposed below the plate member and spaced apart from the plate member. The buffer component includes: A sidewall portion, located outside the supply port and the discharge port, and configured to contact the wall of the container; and The upper wall portion has a through hole formed therein, corresponding to the center of the plate member, wherein the through hole forms a straight flow path in the upward / downward direction. The buffer member further includes an inner wall portion extending downward from the upper wall portion to increase the length of the flow path of the through hole, and The buffer space is formed by the side wall portion, the upper wall portion, and the inner wall portion.

13. The loading member according to claim 12, wherein, The through hole is aligned with the discharge port.

14. The loading member according to claim 12, wherein, When viewed from above, the through-hole in the upper wall is positioned in a location that does not overlap with the supply port.

15. The filling member according to claim 12, wherein, The length of the flow path formed through the through hole is greater than or equal to 30% of the total height of the buffer member and less than the total height of the buffer member.

16. The loading member according to claim 12, wherein, The plate component includes an upper surface, a lower surface, and side surfaces. The area of ​​the upper surface is larger than the area of ​​the lower surface, and the upper surface and the lower surface are arranged side by side to face the lower surface. The side surface connects the upper surface and the lower surface and is sloping upward towards the top.

17. The loading member according to claim 12, wherein, Viewed from above, the buffer member has a circular shape, and When viewed from above, the plate component has a circular shape.

18. An apparatus for processing a substrate, the apparatus comprising: A container having a sealed processing space formed therein, wherein the substrate is housed in the processing space; A supply port is disposed inside the wall of the container and configured to supply processing fluid to the processing space; A discharge port is disposed inside the wall of the container and spaced apart from the supply port; as well as A filling member configured to fill a portion of the volume of the processing space. A first bottom surface is formed within the container, and the first bottom surface is configured to define the processing space. A cylindrical groove of predetermined depth is formed on the first bottom surface, and the second bottom surface is defined by the groove. The supply port and the discharge port are located in the area of ​​the second bottom surface. The filling component includes: A plate member disposed below the substrate, the plate member having a predetermined thickness; and A buffer member is disposed below and spaced apart from the plate member. In a top view, the buffer member is positioned to overlap with both the supply port and the discharge port. The buffer component includes: A sidewall portion, which is placed on the second bottom surface and located outside the supply port and the discharge port, is configured to contact the wall of the container; An upper wall portion having a through-hole formed therein corresponding to the center of the substrate, wherein the through-hole forms a straight flow path in an upward / downward direction, and the upper surface of the upper wall portion is positioned parallel to the first bottom surface; and An inner wall portion that extends downward from the upper wall portion to increase the length of the flow path in the through-hole. The sidewall portion, the upper wall portion, and the inner wall portion form a buffer space configured to retain the processed fluid.

Images