Antenna package and image display device

Abstract

An antenna package and an image display device are provided. The antenna package includes an antenna device having a dielectric layer and an antenna unit disposed on the dielectric layer, and a circuit board. The antenna unit includes a radiator and a transmission line extending from the radiator. The circuit board includes a core layer and a signal wiring disposed on the core layer and electrically connected to the antenna unit. The circuit board has a bonding area adhered to the antenna device, a signal transmission area including the signal wiring, and a connection area including a connector connected to an end portion of the signal wiring. The length of the transmission line of the antenna unit is greater than or equal to the length of the signal transmission area of ​​the circuit board.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2020-0173089 filed on December 11, 2020 with the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a circuit board and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are combined with image display devices such as smartphones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] With the development of mobile communication technology, an antenna capable of realizing, for example, high frequency band or ultra-high frequency band communication is required in a display device.

[0006] A circuit board for feeding and controlling signal transmission may be connected to the antenna for radiation drive of the antenna. The circuit board may be bent so as to be connected to a driver integrated circuit chip, for example. In this case, the circuit wiring may be damaged and the connection with the antenna may fail due to bending stress. In addition, the circuit board may cause power loss and signal loss of the antenna, and signal noise may also be generated due to the circuit board.

[0007] In addition, as the thickness of the image display device coupled with the antenna is recently reduced, the bending degree of the circuit board may also increase. In this case, the above-mentioned bending defect may be further aggravated. Therefore, there is a need for an antenna packaging structure that achieves the bending reliability of the circuit board while maintaining or improving the radiation characteristics of the antenna.

[0008] For example, Korean Patent Application Publication No. 2013-0095451 discloses an antenna integrated into a display panel, but does not propose an effective circuit connection as described above. Summary of the invention

[0009] According to one aspect of the present invention, an antenna package having improved electrical and mechanical reliability is provided.

[0010] According to an aspect of the present invention, there is provided an image display device including an antenna package having improved electrical and mechanical reliability.

[0011] (1) An antenna package comprising: an antenna device comprising a dielectric layer and an antenna unit disposed on the dielectric layer, the antenna unit comprising a radiator and a transmission line extending from the radiator; and a circuit board comprising a core layer and a signal wiring disposed on the core layer and electrically connected to the antenna unit, wherein the circuit board has a bonding area adhered to the antenna device, a signal transmission area including the signal wiring, and a connection area including a connector connected to an end portion of the signal wiring, and the length of the transmission line of the antenna unit is greater than or equal to the length of the signal transmission area of ​​the circuit board.

[0012] (2) An antenna package according to (1) above, wherein the antenna device has a radiation area provided with a radiator and a transmission area provided with a transmission line, and the length of the transmission area of ​​the antenna device is equal to or greater than the length of the signal transmission area of ​​the circuit board.

[0013] (3) The antenna package according to (2) above, wherein the transmission region of the antenna device includes a bending region.

[0014] (4) The antenna package according to (3) above, wherein the antenna device further includes an antenna ground layer that faces the transmission line with a dielectric layer interposed therebetween in the fold region.

[0015] (5) An antenna package according to (1) above, wherein the area of ​​the signal transmission region in a plan view is 50% to 65% of the area of ​​the circuit board, and the area of ​​the connection region in a plan view is 30% to 40% of the area of ​​the circuit board.

[0016] (6) The antenna package according to (1) above, wherein the length of the transmission line of the antenna device is equal to or greater than the length of the signal wiring of the circuit board.

[0017] (7) The antenna package according to (6) above, wherein the antenna unit includes a plurality of antenna units arranged in a width direction, and the signal wiring of the circuit board is individually connected to the transmission line included in each of the plurality of antenna units.

[0018] (8) The antenna package according to (1) above, wherein the antenna unit further includes: a signal pad electrically connected to an end of the transmission line in the bonding area; and a ground pad disposed around the signal pad and spaced apart from the transmission line and the signal pad.

[0019] (9) The antenna package according to (8) above, wherein the circuit board further includes a bonding pad which is provided around the signal wiring in the bonding area and is electrically connected to the ground pad.

[0020] (10) The antenna package according to (9) above, wherein the circuit board further includes a ground layer that faces the signal wiring with the core layer interposed therebetween in the thickness direction.

[0021] (11) The antenna package according to the above (10), further comprising a via structure penetrating the core layer to electrically connect the bonding pad and the ground layer to each other.

[0022] (12) The antenna package according to (1) above further includes a driver integrated circuit chip electrically connected to the antenna unit via a connector.

[0023] (13) The antenna package according to (12) above, further comprising a chip mounting board on which the driving integrated circuit chip is mounted, the chip mounting board including a chip connector coupled to the connector.

[0024] (14) An image display device includes: a display panel; and the antenna package according to the above embodiment provided on the display panel.

[0025] (15) The image display device according to (14) above, wherein the radiator of the antenna device is provided on the front of the display panel, and a portion of the antenna device provided with the transmission line is bent toward the rear of the display panel.

[0026] (16) The image display device according to (15) above, wherein the circuit board and the antenna device are joined to each other at the rear of the display panel.

[0027] According to an embodiment of the present invention, the length of the transmission line included in the antenna device can be formed to be greater than or equal to the length of the signal wiring included in the circuit board. Therefore, the length or area of ​​the circuit board having a relatively thick or multi-layer structure can be reduced, thereby improving the productivity of the antenna package.

[0028] In some embodiments, the length of the transmission region of the antenna device can be increased so that the antenna device can be bent through the transmission region to electrically connect the driver integrated circuit chip and the antenna unit to each other. Therefore, the bending stability and bonding stability in the bent portion can be improved.

[0029] In some embodiments, the circuit board may include a connection area with a connector installed. The length of the signal wiring of the circuit board can be reduced, so that a sufficient area of ​​the connection area can be obtained. Therefore, the stability and reliability of the connection with the driver integrated circuit chip can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 and Figure 2 1 and 2 are a schematic top plan view and a schematic cross-sectional view, respectively, showing an antenna package according to an exemplary embodiment.

[0031] Figure 3 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0032] Figure 4 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0033] Figure 5 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0034] Figure 6 is a schematic top plan view showing an image display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0035] According to an exemplary embodiment of the present invention, there is provided an antenna package including a combination of a circuit board and an antenna device having an antenna unit. According to an exemplary embodiment of the present invention, there is also provided an image display device including the antenna package.

[0036] However, those skilled in the art will appreciate that the embodiments described with reference to the accompanying drawings are provided to further understand the spirit of the present invention and are not intended to limit the subject matter disclosed in the detailed description and the appended claims.

[0037] The terms “first”, “second”, “upper”, “lower”, “top”, “bottom”, etc. used in the text do not indicate absolute positions, but are used relatively to distinguish different elements or different positions.

[0038] Reference Figure 1 , the antenna package may include an antenna device 100 and a circuit board 200. The circuit board 200 may include a core layer 210 and a circuit wiring layer 220 formed on the core layer 210. The circuit wiring layer 220 and the antenna unit 120 included in the antenna device 100 may be electrically connected to each other.

[0039] The antenna device 100 may include an antenna dielectric layer 110 and an antenna unit 120 disposed on the antenna dielectric layer 110 .

[0040] The antenna dielectric layer 110 may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, cycloolefin or polyolefin having a norbornene structure and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyether sulfone resins; sulfone resins; polyether ether ketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. These may be used alone or in combination of two or more.

[0041] For example, the antenna dielectric layer 110 may include cyclic olefin polymer (COP).

[0042] In some embodiments, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be included in the antenna dielectric layer 110. In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0043] In some embodiments, the dielectric constant of the antenna dielectric layer 110 may be adjusted to be within a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, thereby possibly failing to achieve a desired high frequency band or ultra-high frequency band driving.

[0044] The antenna unit 120 may be formed on the top surface of the antenna dielectric layer 110. For example, a plurality of antenna units 120 may be arranged in an array along a width direction of the antenna dielectric layer 110 or the antenna package to form an antenna pattern row.

[0045] The antenna unit 120 may include a radiator 122 and a transmission line 124. The radiator 122 may have a shape of, for example, a polygonal flat plate, and the transmission line 124 may extend from a side of the radiator 122. The transmission line 124 may be formed as a single member substantially integral with the radiator 122.

[0046] The antenna unit 120 may further include a signal pad 126. The signal pad 126 may be connected to one end of the transmission line 124. In one embodiment, the signal pad 126 may be formed as a substantially integral member with the transmission line 126, and an end portion of the transmission line 124 may serve as the signal pad 126.

[0047] In some embodiments, the ground pad 128 may be disposed around the signal pad 126. For example, a pair of ground pads 128 may be disposed to face each other with the signal pad 126 interposed therebetween.

[0048] For example, the ground pad 128 may be electrically and physically separated from the transmission line 124 and the signal pad 126 .

[0049] In an exemplary embodiment, the antenna unit or radiator 122 may be designed to have a resonant frequency corresponding to a high frequency band or an ultra-high frequency band (e.g., a 3G, 4G, 5G or higher frequency band). In a non-limiting example, the resonant frequency of the antenna unit may be above about 10 GHz, or from about 20 GHz to 40 GHz (e.g., about 28 GHz or about 38 GHz).

[0050] The antenna unit 120 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. They may be used alone or in combination.

[0051] In one embodiment, the antenna unit may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (eg, copper-calcium (CuCa)) to achieve low resistance and fine line width patterns.

[0052] In some embodiments, the antenna unit 120 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), and the like.

[0053] In some embodiments, the antenna unit 120 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna unit may include a double-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the flexibility may be improved by the metal layer, and the signal transmission speed may be improved by the low resistance of the metal layer. The corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

[0054] In some embodiments, the radiator 122 and the transmission line 124 may have a mesh structure to improve light transmittance. In this case, a dummy mesh pattern (not shown) may be formed around the radiator 122 and the transmission line 124.

[0055] The signal pad 126 and the ground pad 128 may be solid patterns formed of the above metals or alloys in consideration of reduction of feeding resistance, noise absorption efficiency, etc. In one implementation, at least a portion of the transmission line 124 may include a solid structure.

[0056] The antenna unit 120 may include a blackened portion so that reflectivity at the surface of the antenna unit 120 may be reduced to suppress visual recognition of the antenna unit due to light reflection.

[0057] In one embodiment, the surface of the metal layer included in the antenna unit 120 may be converted into a metal oxide or a metal sulfide to form a black layer. In one embodiment, a black layer, such as a black material coating or plating, may be formed on the antenna unit 120 or the metal layer. The black material or plating may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or an oxide, sulfide, or alloy containing at least one thereof.

[0058] The composition and thickness of the blackened layer may be adjusted in consideration of the reflection reduction effect and antenna radiation characteristics.

[0059] The circuit board 200 may include a core layer 210 and a circuit wiring layer 220 formed on a surface of the core layer 210. The circuit board 200 may be made of, for example, a flexible printed circuit board (FPCB).

[0060] The core layer 210 may include a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc. In one embodiment, the core layer 210 may be formed of an LCP in consideration of dielectric loss in the core layer 210 or the circuit board. The core layer 210 may include an inner insulating layer included in the circuit board 200.

[0061] For example, the circuit wiring layer 220 may be formed on the top surface of the core layer 210. For example, the circuit board 200 may further include a cover film formed on the top surface of the core layer 210 and covering the circuit wiring layer 220. In one embodiment, the cover film may be formed on the top surface of the core layer 210 through an adhesive layer.

[0062] The circuit wiring layer 220 may include a signal wiring 225. The signal wiring 225 may be used as, for example, an antenna feed wiring or a drive signal wiring. For example, one end of the signal wiring 225 may be exposed by partially removing a cover film of the circuit board 200. The exposed end of the signal wiring 225 may be bonded to the signal pad 126.

[0063] For example, a conductive intermediate structure 150 such as an anisotropic conductive film (ACF) may be commonly attached on the signal pad 126 and the ground pad 128, and a bonding region BR of the circuit board 200 where one end of the signal wiring 225 is positioned may be provided on the conductive intermediate structure 150. Thereafter, the bonding region BR of the circuit board 200 may be attached to the antenna device 100 by a heat treatment / pressurization process so that the signal wiring 225 may be electrically connected to each signal pad 126.

[0064] Noise from the signal pad 126 may be shielded or absorbed by the ground pad 128. In addition, the ground pad 128 may be disposed around the signal pad 126, so that adhesion to an anisotropic conductive film (ACF) may be increased and bonding stability may be improved.

[0065] like Figure 1 As shown, each signal wiring 225 can be individually and independently connected to the antenna unit 120. Therefore, feeding / driving control can be performed independently for each of the plurality of antenna units 120. For example, different phase signals can be applied to the antenna unit 120 through the signal wiring 225 connected to each of the plurality of antenna units 120.

[0066] like Figure 1 As shown, the antenna device 100 or the antenna dielectric layer 110 may include a radiation region RR, a transmission region TR, and a bonding region BR. The circuit board 200 may include a bonding region BR, a signal transmission region SR, and a connection region CR.

[0067] The radiation region RR of the antenna device 100 may be a region where the radiator 122 is disposed. For example, the radiation region RR may cover a length from one side of the antenna dielectric layer 110 to a boundary between the radiator 122 and the transmission line 124.

[0068] The transmission region TR of the antenna device 100 may be a region where the transmission line 124 extends. In some embodiments, the transmission region TR may cover a length from a boundary between the radiator 122 and the transmission line 124 to one side of the signal pad 126. In one embodiment, the length of the transmission line 124 may be substantially the same as the length of the transmission region TR.

[0069] The bonding region BR may be a region where the signal pad 126 and the ground pad 128 are disposed. Figure 1 As shown, the antenna device 100 and the circuit board 200 may share the bonding region BR. The signal pad 126 and the signal wiring 225 may be electrically connected to each other through the bonding region BR.

[0070] The bonding region BR of the circuit board 200 may include one end portion of the circuit board 200 adjacent to the antenna device 100 .

[0071] The signal transmission region SR of the circuit board 200 may be a region where the signal wiring 225 is provided. The connection region CR may be a region where the connector 250 for electrical connection with the driving integrated circuit chip 310 is provided. For example, the connection region CR may be a region from a boundary between the signal wiring 225 and the connector 250 to the other end of the circuit board 200.

[0072] In an exemplary embodiment, the transmission region TR of the antenna device 100 may be greater than or equal to the length of the signal transmission region SR of the circuit board 200. Preferably, the transmission region TR of the antenna device 100 may be greater than the length of the signal transmission region SR of the circuit board 200.

[0073] Therefore, the length of the transmission line 124 of the antenna unit 120 may be greater than or equal to the length of the signal wiring 225 of the circuit board 200. Preferably, the length of the transmission line 124 of the antenna unit 120 may be greater than the length of the signal wiring 225 of the circuit board 200.

[0074] like Figure 1 As shown, when the signal wiring 225 may have a meandering shape, the length of the signal wiring 225 used in the present application may be the length in the longitudinal direction of the circuit board 200 (or in the extending direction of the transmission line 124). In one embodiment, the signal wiring 225 may have a straight shape in the longitudinal direction.

[0075] The size and circuit design of the antenna package may also vary according to the size and design of the image display device to which the antenna package is applied. For example, when the length or size of the circuit board 200 increases, additional circuit board manufacturing costs are required, and the circuit board 200 including a multilayer structure may reduce overall productivity.

[0076] However, according to the above exemplary embodiment, the length of the transmission line 124 of the antenna device 100 may be relatively increased. Therefore, the size of the circuit board 200 may be modified to have a reduced signal transmission area SR. Therefore, the overall productivity of the antenna package may be improved.

[0077] In one embodiment, the circuit board 200 may be fixed to a predetermined size, and the length of the transmission line 124 or the antenna device 100 may be changed according to the design of the display device to increase the design freedom of the antenna package.

[0078] like Figure 2 As shown, the antenna device 100 can be bent using the increased length of the transmission line 124. For example, the portion of the antenna device 100 located in the transmission region TR can be bent to set the bonding region BR below the display panel 450 (eg, toward the rear side of the display panel 450).

[0079] Therefore, the circuit board 200 may not be bent and may be electrically connected to the antenna unit 120 through the bonding region BR of the antenna device 100 under the display panel 450 .

[0080] When the circuit board 200 having a relatively thick or multi-layered structure is bent under the display panel 450, bonding stability with the antenna device 100 may be reduced. In addition, mechanical stability of insulating and conductive structures included in the circuit board 200 may also be reduced.

[0081] However, according to an exemplary embodiment, the antenna device 100 may be bent by using the transmission region TR having an increased length. Therefore, the bending characteristics may be improved without reducing the bonding stability and mechanical stability of the circuit board 200.

[0082] In addition, the length of the circuit board 200 can be relatively reduced, so that it is possible to reduce or prevent the intermediate power loss or dielectric loss occurring in the circuit board 200. Therefore, the radiation reliability and efficiency of the antenna device 100 can be improved.

[0083] The connection with the driving integrated circuit chip 310 may be achieved through a connector 250 mounted on the circuit board 200 at the rear side of the display panel 450 .

[0084] In some embodiments, the driving integrated circuit chip 310 may be mounted on the chip mounting board 300 . A chip connector 320 may be provided on the chip mounting board 300 , and the driving integrated circuit chip 310 and the chip connector 320 may be electrically connected through a connection wiring 330 .

[0085] The connector 250 mounted on the circuit board 200 may be coupled to the chip connector 320 mounted on the chip mounting board 300. Thus, electrical connection between the antenna unit 120 and the driving integrated circuit chip 310 may be achieved, and feeding and control signal transmission for the antenna unit 120 may be performed through the driving integrated circuit chip 310.

[0086] In some exemplary embodiments, the area (or length) of the connection region CR in the plan view of the circuit board 200 may be about 30% to 40%, and the area (or length) of the signal transmission region SR may be about 50% to 65%. As described above, the length of the signal transmission region SR may be relatively reduced, so that the connection region CR having a sufficient area may be obtained. Therefore, the connection resistance with the chip connector 320 may be reduced and the overall signal transmission efficiency may be improved.

[0087] In one embodiment, the area of ​​the bonding region BR may be about 5% to 10% of the area of ​​the circuit board 200 in a plan view.

[0088] In some embodiments, the antenna device 100 may include an antenna ground layer 130 , and the circuit board 200 may include a circuit ground layer 230 .

[0089] The antenna ground layer 130 may be disposed on a bottom surface of the antenna dielectric layer 110 so as to face the transmission line 124 with the antenna dielectric layer 110 interposed therebetween.

[0090] For example, the antenna ground layer 130 may be bent together with the transmission region TR or the transmission line 124 .

[0091] In some embodiments, a conductive member of a display device to which the antenna device is applied may be used as a ground layer of the radiator 122 .

[0092] For example, the conductive member may include a gate electrode of a thin film transistor (TFT), various wirings such as a scan line or a data line, or various electrodes such as a pixel electrode and a common electrode.

[0093] In one embodiment, various structures including, for example, a conductive material disposed under the display panel 450 may be used as a ground layer for the radiator 122. For example, a metal plate (e.g., a stainless steel plate such as a SUS plate), a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, a digitizer, etc. may be used as the antenna ground layer 130.

[0094] The circuit ground layer 230 may be disposed on the bottom surface of the core layer 210 so as to overlap the signal wiring 220 in a plan view. The circuit ground layer 230 may face the signal wiring 220 with the core layer 210 interposed therebetween, thereby facilitating the formation of an electric field around the signal wiring 220, absorbing noise, and improving feeding efficiency.

[0095] Figure 3 is a schematic top plan view showing an antenna package according to some exemplary embodiments. Figure 1 and Figure 2 Detailed description of elements and structures described that are substantially the same or similar.

[0096] Reference Figure 3 , the transmission line 124 may include a narrowed portion 124a having a reduced width. For example, an end portion of the transmission line 124 adjacent to the signal pad 126 may be narrowed to serve as the narrowed portion 124a.

[0097] The transmission line 124 may have a variable width, so that the flexibility and bending characteristics in the transmission region TR may be further improved.

[0098] Figure 4is a schematic top plan view showing an antenna package according to some exemplary embodiments. Figure 1 and Figure 2 Detailed description of elements and structures described that are substantially the same or similar.

[0099] Reference Figure 4 , more than two radiators 122 may be coupled via a transmission line 124. For example, two radiators 122 may be coupled to each other via a transmission line 124 to form a radiation group. One radiation group may be connected to a signal wiring 225 via a signal pad 126.

[0100] As described above, the length of the transmission line 124 (the length in the longitudinal direction of the antenna device or the antenna package) may be greater than or equal to the length of the signal wiring 225 .

[0101] Figure 5 is a schematic top plan view showing an antenna package according to some exemplary embodiments. For the convenience of description, Figure 5 The circuit ground layer 230 is omitted in the figure (see Figure 2 ).

[0102] Reference Figure 5 The circuit board 200 or the circuit wiring layer 220 may further include a bonding pad 227 formed around the signal wiring 220 .

[0103] The bonding pad 227 may be formed on the top surface of the core layer 210. For example, a pair of bonding pads 227 may be provided with one signal wiring 225 interposed therebetween.

[0104] The bonding pad 227 can be electrically and physically separated from the signal wiring 225 and can be connected to the signal wiring 225 via the conductive intermediate structure 150 (see Figure 2 ) is bonded to the ground pad 128 included in the antenna device 100. The bonding pad 227 may be included in the bonding region BR of the circuit board 200, so that the bonding stability between the circuit board 200 and the antenna device 100 may be further improved.

[0105] In some embodiments, the bonding pad 227 may be electrically connected to the circuit ground layer 230 through a via structure 240 penetrating the core layer 210. Therefore, the grounding efficiency through the bonding pad 227 and the circuit ground layer 230 may be improved.

[0106] Figure 6 is a schematic top plan view showing an image display device according to an exemplary embodiment.

[0107] Reference Figure 6 , the image display device 400 may be made in the form of a smart phone, for example, and Figure 6The front or window surface of the image display device 400 is shown. The front of the image display device 400 may include a display area 410 and a peripheral area 420. The peripheral area 420 may correspond to, for example, a light shielding area or a frame area of ​​the image display device.

[0108] The antenna device 100 included in the above-described antenna package may be disposed toward the front of the image display device 400. For example, the antenna device 100 may be disposed on the display panel 450. In one embodiment, the radiator 122 may be at least partially disposed in the display region 410 in a plan view.

[0109] In this case, the radiator 122 may include a mesh pattern structure and may prevent a reduction in transmittance due to the radiator 122. The driving integrated circuit chip 310 included in the antenna package may be disposed in the peripheral area 420 to prevent image quality in the display area 410 from being deteriorated.

[0110] Although not in Figure 6 As shown in Figure 2 As described, the transmission region of the antenna device 100 including the transmission line 124 and the bonding region including the pads 126 and 128 may be bent to the rear of the display panel.

[0111] In some embodiments, the antenna package may be bent along the peripheral region 420 using the transmission region TR of the antenna device having an increased length. Thus, the circuit board 200 and the driving integrated circuit chip 310 may be electrically connected at the rear of the image display device 400.

[0112] Hereinafter, preferred embodiments are proposed to more specifically describe the present invention. However, the following examples are provided only to illustrate the present invention, and it will be apparent to those skilled in the art that various substitutions and modifications can be realized within the scope and spirit of the present invention. These substitutions and modifications are appropriately included in the appended claims.

[0113] Example

[0114] The antenna element is formed using APC alloy on the COP dielectric layer.

[0115] Specifically, the size of the radiator is 2.8 mm×2.8 mm, the size of the transmission line is 1.0 mm (width)×10 mm (length), and two antenna elements are provided on the dielectric layer.

[0116] A flexible printed circuit board (FPCB) including circuit wiring on an LCP core layer (total thickness: 500 μm) was prepared. The length of the bonding area of ​​the FPCB was adjusted to 1 mm, the length of the signal transmission area to 8 mm, and the length of the connection area to 5 mm.

[0117] The FPCB is connected to the transmission line of the antenna unit through a bonding area of ​​the FPCB, and a portion of the COP dielectric layer portion where the transmission line is disposed is bent downward to connect a connector included in the FPCB to the main board.

[0118] Comparative Example

[0119] The antenna package is manufactured in the same method as the embodiment except that the length of the transmission line of the antenna unit pattern is changed to 5 mm, the length of the signal transmission area of ​​the FPCB is changed to 15 mm, and the signal transmission area of ​​the FPCB is bent and connected to the main board.

[0120] Experimental example

[0121] The antenna unit included in each antenna package of the embodiment and the comparative example was fed, and the S parameter (S11) and the antenna gain were measured at 28 GHz using a network analyzer and a millimeter wave meter (C&G Microwave).

[0122] The evaluation results are shown in Table 1 below.

[0123] Table 1

[0124] S11(dB) Antenna gain (dBi) Example -8.1 4.6 Comparative Example -8.2 4.0

[0125] Referring to Table 1, in the embodiment in which the length of the transmission region of the antenna device is increased and the transmission region is bent for feeding and connecting with the driving integrated circuit chip, improved antenna radiation characteristics are achieved.

Claims

1. An antenna package, characterized in that: It includes: An antenna device comprising a dielectric layer and an antenna unit disposed on the dielectric layer, the antenna unit comprising a radiator and a transmission line extending from the radiator; as well as A circuit board comprising a core layer and a signal wiring arranged on the core layer and electrically connected to the antenna unit, wherein the circuit board has a bonding area adhered to the antenna device, a signal transmission area including the signal wiring, and a connection area including a connector connected to an end portion of the signal wiring, and The length of the transmission line of the antenna unit is greater than or equal to the length of the signal transmission area of ​​the circuit board.

2. The antenna package according to claim 1, characterized in that: The antenna device has a radiation area where the radiator is provided and a transmission area where the transmission line is provided, and The length of the transmission area of ​​the antenna device is equal to or greater than the length of the signal transmission area of ​​the circuit board.

3. The antenna package according to claim 2, characterized in that: The transmission region of the antenna device includes a bending region.

4. The antenna package according to claim 3, characterized in that: The antenna device further includes an antenna ground layer that faces the transmission line with the dielectric layer interposed therebetween in the bending region.

5. The antenna package according to claim 1, characterized in that: An area of ​​the signal transmission region in a plan view is 50% to 65% of an area of ​​the circuit board, and an area of ​​the connection region in a plan view is 30% to 40% of an area of ​​the circuit board.

6. The antenna package according to claim 1, characterized in that: The transmission line of the antenna device has a length equal to or greater than a length of the signal wiring of the circuit board.

7. The antenna package according to claim 6, characterized in that: The antenna unit includes a plurality of antenna units arranged in a width direction, and The signal wiring of the circuit board is individually connected to the transmission line included in each of the plurality of antenna units.

8. The antenna package according to claim 1, characterized in that: The antenna unit further includes: a signal pad electrically connected to an end of the transmission line in the bonding area; and a ground pad disposed around the signal pad and spaced apart from the transmission line and the signal pad.

9. The antenna package according to claim 8, characterized in that: The circuit board further includes a bonding pad disposed around the signal wiring in the bonding area and electrically connected to the ground pad.

10. The antenna package according to claim 9, characterized in that: The circuit board further includes a ground layer that faces the signal wiring with the core layer interposed therebetween in a thickness direction.

11. The antenna package according to claim 10, characterized in that: It also includes a via structure penetrating the core layer to electrically connect the bonding pad and the ground layer to each other.

12. The antenna package according to claim 1, characterized in that: It also includes a driving integrated circuit chip electrically connected to the antenna unit through the connector.

13. The antenna package according to claim 12, characterized in that: It also includes a chip mounting board on which the driving integrated circuit chip is mounted, and the chip mounting board includes a chip connector coupled with the connector.

14. An image display device, characterized in that: It includes: Display panel; as well as The antenna package according to claim 1 is disposed on the display panel.

15. The image display device according to claim 14, characterized in that: The radiator of the antenna device is disposed on the front of the display panel, and A portion of the antenna device where the transmission line is disposed is bent toward the rear of the display panel.

16. The image display device according to claim 15, characterized in that: The circuit board and the antenna device are joined to each other at the rear of the display panel.

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